CN110379740B - Press mounting device and method for high-power semiconductor device module - Google Patents
Press mounting device and method for high-power semiconductor device module Download PDFInfo
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- CN110379740B CN110379740B CN201910657471.2A CN201910657471A CN110379740B CN 110379740 B CN110379740 B CN 110379740B CN 201910657471 A CN201910657471 A CN 201910657471A CN 110379740 B CN110379740 B CN 110379740B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/02—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same
- B25B27/026—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same fluid driven
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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Abstract
The invention relates to a press mounting device and a press mounting method for a high-power semiconductor device module, wherein the press mounting device comprises a fixing component, a supporting component and a cylindrical sliding rod, the fixing component comprises a fixing bottom plate, and the center of the fixing bottom plate is provided with an operation hole; the supporting assembly comprises a supporting base plate, a mounting groove is formed in the side face, facing the fixed base plate, of the supporting base plate, a positioning block capable of moving up and down is arranged in the mounting groove, and a hydraulic ram, facing the operation hole, of a piston is movably mounted on the positioning block; one end of the cylindrical sliding rod is connected with the fixed base plate, and the supporting base plate is sleeved on the cylindrical sliding rod and can be adjusted towards or away from the direction of the fixed base plate. The press mounting device provided by the invention has the advantages of compact structure, small volume, convenience in carrying and convenience in construction operation on products; the press mounting method is simple to implement, can quickly realize the pressurization or pressure relief of the high-power semiconductor device module, and has high efficiency.
Description
Technical Field
The invention belongs to the technical field of assembly of high-power semiconductor device modules, and particularly relates to a press-fitting device and method for a high-power semiconductor device module.
Background
Crimping type high power semiconductor device (IGBT, diode, thyristor) technology was proposed by ABB corporation in 1992 and is now one of the most prominent applications in the power electronics industry. In order to ensure good electrical and thermal contact, different types of devices need to provide different crimping forces of 0.2-110 KN.
In large-scale power electronic equipment, such as converter valves, direct current circuit breakers and other devices, most of the devices such as IGBTs, diodes, thyristors and the like are connected in series or in parallel in a stacking manner and are pressed in a specific pressing plate to form a module. Along with the improvement of the electrical grade of equipment, the module has a large volume, a large-scale device or a large-scale assembly platform is required to be relied on for ensuring the array property, the consistency and the uniformity during assembly, and when the maintenance and replacement requirements exist, the pressure relief and the pressurization of the crimping type high-power semiconductor device module on a product cannot be met by the mode.
Disclosure of Invention
The invention aims to provide a press-fitting device and a press-fitting method for a high-power semiconductor device module, which aim to solve the problem that the traditional press-fitting device cannot meet the pressure relief and pressurization of a press-fitting type high-power semiconductor device module on a product.
The press mounting device for the high-power semiconductor device module is realized by the following steps:
a press-fitting device for a high-power semiconductor device module includes
The fixing assembly comprises a fixing bottom plate, and the center of the fixing bottom plate is provided with an operation hole;
the supporting assembly comprises a supporting bottom plate which is arranged opposite to the fixed bottom plate, a mounting groove is formed in the side surface, facing the fixed bottom plate, of the supporting bottom plate, a positioning block capable of moving up and down is arranged in the mounting groove, and a hydraulic ram of which the piston faces the operation hole is movably mounted on the positioning block;
the cylinder slide bar, the one end and the PMKD of cylinder slide bar are connected, the supporting baseplate cover is in the cylinder slide bar just can move towards or keep away from PMKD's direction is adjusted.
Furthermore, the fixed bottom plate is provided with a mounting hole.
Furthermore, a vertical guide groove is formed in the side wall of the mounting groove, and the side face of the positioning block is in sliding fit with the guide groove.
Furthermore, the bottom of mounting groove is provided with the adjusting base plate, threaded connection has the foot screw rod of pushing away on the adjusting base plate, the top of pushing away the foot screw rod passes the adjusting base plate and links to each other with the locating piece.
Furthermore, the positioning block is of a V-shaped structure.
Furthermore, sleeving holes are respectively formed in the two sides of the mounting groove in pairs up and down, and the cylindrical sliding rod correspondingly penetrates into the sleeving holes.
Furthermore, through holes which penetrate through the mounting groove up and down are respectively formed in the two sides of the mounting groove, the through holes are communicated with the sleeving holes which are located on the same side of the through holes, and T-shaped quick lock catches which are used for connecting the cylindrical sliding rods and the supporting bottom plate are mounted in the through holes.
Furthermore, a plurality of cylindrical holes are formed in the cylindrical sliding rod at equal intervals, and the T-shaped quick lock catch penetrates through the cylindrical holes.
Furthermore, the T-shaped quick lock catch comprises a lock rod and a T-shaped handle arranged at the bottom of the lock rod, and lock beads which can be retracted into the lock rod are distributed on the annular surface at the upper end of the lock rod in an annular mode.
In addition, the invention also provides a press mounting method of the press mounting device for the high-power semiconductor device module, which comprises the following steps,
the method comprises the following steps: powering off the high-power semiconductor device module, standing for discharging, and ensuring that the high-power semiconductor device module does not carry charges;
step two: mounting a fixed bottom plate with a cylindrical sliding rod on a press-mounting surface of a high-power semiconductor device module;
step three: sleeving a supporting bottom plate on the cylindrical sliding rod, and determining the position of the supporting bottom plate according to the stroke of the hydraulic jack;
step four: the hydraulic jack is arranged on the positioning block from the opening direction of the positioning block, and the height of the hydraulic jack is adjusted by using the positioning block, so that a piston rod of the hydraulic jack is ensured to be opposite to the operation hole;
step five: and starting a hydraulic pump connected with the hydraulic jack, extending out a piston rod of the hydraulic jack and pressurizing or releasing the high-power semiconductor device module.
After the technical scheme is adopted, the invention has the beneficial effects that:
(1) the press mounting device provided by the invention has the advantages of compact structure, small volume, convenience in carrying and convenience in construction operation on products;
(2) the press mounting device provided by the invention has the advantages that the positions of the supporting bottom plate and the positioning are adjustable, so that the position of the hydraulic ram is adjusted, the universality is good, the positioning is accurate, the operation is flexible, and the press mounting device is suitable for hydraulic rams with different strokes and sizes;
(3) the press mounting method provided by the invention is simple to implement, can quickly realize the pressurization or pressure relief of the high-power semiconductor device module, and has high efficiency.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a structural view of a press-fitting apparatus for a high power semiconductor device module according to a preferred embodiment of the present invention;
fig. 2 is a structural view of a fixing assembly and a cylindrical slide bar of the press-fitting apparatus for high-power semiconductor device modules according to the preferred embodiment of the present invention;
fig. 3 is a structural view of a support assembly of the press-fitting apparatus for high-power semiconductor device modules according to the preferred embodiment of the present invention;
fig. 4 is a structural view of a support assembly of a press-fitting apparatus for high-power semiconductor device modules according to a preferred embodiment of the present invention without T-shaped snap fasteners;
FIG. 5 is a structural view of a T-shaped snap fastener of the press-fitting device for high-power semiconductor device modules in accordance with the preferred embodiment of the present invention;
fig. 6 is a structural view showing a press-fitting state of the press-fitting apparatus for high-power semiconductor device modules according to the preferred embodiment of the present invention;
fig. 7 is a front view showing a press-fitting state of the press-fitting apparatus for a high-power semiconductor device module according to the preferred embodiment of the present invention;
in the figure: a fixed component 1, a fixed bottom plate 11, a working hole 12, a mounting hole 13, a mounting lug 14,
the device comprises a supporting component 2, a supporting bottom plate 21, a mounting groove 22, a positioning block 23, a guide groove 24, a foot pushing screw rod 25, a sleeving hole 26, a through hole 27, a T-shaped quick lock catch 28, a lock rod 281, a T-shaped handle 282, a lock bead 283, an adjusting bottom plate 29, a cylindrical sliding rod 3, a cylindrical hole 31, a hydraulic jack 4, a high-power semiconductor device module 5, a press-fitting surface 51, a push rod 52, a disc spring 53 and a locking nut 54.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1-5, a press mounting device for a high-power semiconductor device module comprises a fixing component 1, a supporting component 2 and a cylindrical sliding rod 3, wherein the fixing component 1 comprises a fixing bottom plate 11, and a working hole 12 is formed in the center of the fixing bottom plate 11; the supporting assembly 2 comprises a supporting bottom plate 21 arranged opposite to the fixed bottom plate 11, a mounting groove 22 is formed in the side face, facing the fixed bottom plate 11, of the supporting bottom plate 21, a positioning block 23 capable of moving up and down is arranged in the mounting groove 22, and a hydraulic ram 4 with a piston facing the operation hole is movably mounted on the positioning block 23; one end of the cylindrical sliding rod 3 is connected with the fixed bottom plate 11, and the supporting bottom plate 21 is sleeved on the cylindrical sliding rod 3 and can be adjusted towards or away from the fixed bottom plate 11.
Referring to fig. 2, when the power semiconductor device module 5 is press-fitted, the whole press-fitting apparatus is required to be mounted therewith, and thus the fixing base plate 11 is provided with the mounting holes 13.
Preferably, the fixing base plate 11 is uniformly provided with mounting lugs 14 on the periphery, and the mounting holes 13 are formed on the mounting lugs 14.
Accordingly, the press-fitting surface 51 of the power semiconductor device module 5 is provided with bolt holes corresponding to the mounting holes 13, and the fixing base plate 11 is connected to the press-fitting surface 51 of the power semiconductor device module 5 by screws.
Referring to fig. 3-4, during the press-fitting process, the piston rod of the hydraulic ram 4 is required to be opposite to the operation hole 12 and the press-fitting hole at the center of the press-fitting surface 51 of the power semiconductor device module 5, so that the height of the hydraulic ram 4 is required to be adjusted when the hydraulic ram 4 is installed, and the alignment effect is achieved, and in order to ensure the smoothness of the up-and-down movement of the installation groove 22, the vertical guide groove 24 is provided on the side wall of the installation groove 22, and the side surface of the positioning block 23 is in sliding fit with the guide groove 24.
Specifically, the upper end of the mounting groove 22 is open, so that the hydraulic ram 4 is conveniently mounted, and the lower end of the mounting groove penetrates through the bottom of the supporting bottom plate 21, so that the adjusting range of the positioning block 23 can be properly increased.
Preferably, at least two parallel guide grooves 24 are formed on each side wall of the mounting groove 22, thereby preventing the offset of the up-and-down movement of the positioning block 23.
In order to provide driving for the up-and-down movement of the positioning block 23, an adjusting bottom plate 29 is arranged at the bottom of the mounting groove 22, a push pin screw 25 is connected to the adjusting bottom plate 29 in a threaded manner, and the top end of the push pin screw 25 passes through the adjusting bottom plate 29 to be connected with the positioning block 23.
Preferably, the adjusting bottom plate 29 spans the bottom of the mounting groove 22 and is mounted at the bottom of the supporting bottom plate 21 by screws, so that the adjusting bottom plate 29 is convenient to assemble and disassemble.
When the height of the positioning block 23 is adjusted, the foot pushing screw rod 25 is rotated, the foot pushing screw rod 25 is in threaded connection with the adjusting bottom plate 29, the positioning block 23 is pushed to move upwards or the positioning block 23 is driven to move downwards, so that the position of the hydraulic jack 4 is adjusted, and the operation is convenient and fast.
Because the bottom of hydraulic ram 4 is the arc structure, in order to realize its accurate location, locating piece 23 is V type structure.
One end of the cylindrical sliding rod 3 is fixedly installed on the fixing base plate 11 through a screw, in order to conveniently sleeve the supporting base plate 21 on the cylindrical sliding rod 3, sleeving holes 26 are respectively formed in the two sides of the installation groove 22 in pairs up and down, and the cylindrical sliding rod 3 correspondingly penetrates into the sleeving holes 26.
The supporting base plate 21 can move on the cylindrical sliding rod 3 towards or away from the fixing base plate 11, and in order to fix the position of the supporting base plate, through holes 27 which penetrate up and down are respectively arranged at two sides of the mounting groove 22, the through holes 27 are communicated with the sleeving holes 26 which are positioned at the same side of the through holes 27, and T-shaped quick lock catches 28 which are used for connecting the cylindrical sliding rod 3 and the supporting base plate 21 are arranged in the through holes 27.
Preferably, in order to prevent the support base plate 21 from shifting during the movement, four cylindrical sliding rods 3 are provided, which are respectively opposite to four corners of the support base plate 21, and the sleeving holes 26 are provided at four corners of the support base plate 21, so that the parallelism between the support base plate 21 and the fixed base plate 11 during the adjustment process can be ensured, and the press-fitting precision can be ensured.
In order to realize the locking of the T-shaped quick lock 28 and the cylindrical slide rod 3, a plurality of cylindrical holes 31 are equidistantly arranged on the cylindrical slide rod 3, and the T-shaped quick lock 28 passes through the cylindrical holes 31.
Preferably, the cylindrical holes 31 are vertically arranged, and after the position of the support base plate 21 is determined, the T-shaped quick lock 28 is inserted into the bottom of the through hole 27 upwards, and passes through the cylindrical hole 31 of the cylindrical slide rod 3 when passing through the sleeving hole 26 until passing through the top of the through hole 27, so as to fix the position of the support base plate 21.
Referring to fig. 5, in order to prevent the T-shaped quick lock 28 from falling off the through hole 27, the T-shaped quick lock 28 includes a lock lever 281 and a T-shaped handle 282 installed at the bottom of the lock lever 281, and lock beads 283 capable of being retracted into the lock lever are annularly distributed on an annular surface at the upper end of the lock lever 281.
Preferably, a spring is linked inside the locking bead 283, so that when it is pressed, the locking bead 283 can be retracted into the locking lever 281, and when the pressing is removed, the locking bead 283 can be extended from the locking lever 281.
When the top of the locking lever 281 of the T-shaped quick lock 28 is passed out from the top of the through hole 27, the locking bead 283 protrudes from the locking lever 281, thereby being supported on the top of the through hole 27 to prevent it from falling out from the through hole 27.
Wherein, the setting of T type handle 282 is then for the installation of convenient T type quick hasp 28, and whole T type quick hasp 28 sets up easy dismounting, can realize the high efficiency of supporting baseplate 21 adjustment and location.
Preferably, the T-shaped quick lock catch 28 is made of high-strength steel, and the surface of the T-shaped quick lock catch and the surface of the cylindrical slide bar 3 are both subjected to chrome plating, so that the strength of the T-shaped quick lock catch and the cylindrical slide bar can be increased, the reliability is improved, and the service life is prolonged.
In addition, referring to fig. 6-7, the present invention also provides a press-fitting method for a press-fitting apparatus of a high-power semiconductor device module, comprising the following steps,
the method comprises the following steps: powering off the high-power semiconductor device module 5, standing for discharging and ensuring that the high-power semiconductor device module does not have electric charges;
preferably, a multimeter is used for measurement, so that the high-power semiconductor device module 5 is operated after being completely uncharged, and the safety of operators is ensured.
Step two: mounting the fixed bottom plate 11 with the cylindrical sliding rod 3 on a press-mounting surface 51 of the high-power semiconductor device module 5;
the fixing bottom plate 11 and the press-fitting surface 51 of the high-power semiconductor device module 5 are correspondingly installed by bolts, and the assembly and disassembly are convenient.
Step three: sleeving the supporting bottom plate 21 on the cylindrical slide rod 3, and determining the position of the supporting bottom plate 21 according to the stroke of the hydraulic ram 4;
the specific position of the supporting bottom plate 21 is determined according to the stroke of the high-power semiconductor device module 5 to be pressurized and the stroke of the adopted hydraulic ram 4, after the supporting bottom plate 21 is sleeved on the cylindrical slide rod 3, when the set position is reached, the T-shaped quick lock catch 28 penetrates out of the bottom of the through hole 27, the supporting bottom plate 21 and the cylindrical slide rod 3 are fixed together, and the distance between the supporting bottom plate 21 and the fixed bottom plate 11 is fixed.
Step four: the hydraulic jack 4 is arranged on the positioning block 23 from the opening direction of the positioning block 23, and the height of the hydraulic jack is adjusted by using the positioning block 23, so that the piston rod of the hydraulic jack 4 is ensured to be opposite to the operation hole 12;
preferably, in order to ensure the stability of the hydraulic ram 4, the positioning block 23 is of an open-top structure.
After the hydraulic jack 4 is installed, if a deviation occurs when the piston rod of the hydraulic jack 4 is aligned with the operation hole 12, the push-foot screw 25 is rotated to adjust the positions of the positioning block 23 and the hydraulic jack 4, so that the alignment of the piston rod of the hydraulic jack 4 with the operation hole 12 is ensured, and the press-fitting precision is ensured.
Step five: and starting a hydraulic pump connected with the hydraulic jack 4, extending a piston rod of the hydraulic jack 4, and pressurizing or releasing the high-power semiconductor device module 5.
When pressurization is needed, the piston rod of the hydraulic ram 4 extends out to push the ejector rod 52 at the end of the high-power semiconductor device module 5, the disc spring 53 on the ejector rod 52 is compressed, when a set pressure value is reached, the locking nut 54 on the ejector rod 52 is rotated towards the direction of the press-mounting surface 51 to be locked, and the piston rod of the hydraulic ram 4 retracts, so that the pressurization process can be realized.
When pressure relief is needed, the piston rod of the hydraulic ram 4 extends out to push the ejector rod 52 at the end of the high-power semiconductor device module 5, so that the ejector rod 52 moves towards the direction of the disc spring 53, the disc spring 53 is compressed, then the locking nut 54 on the ejector rod 52 rotates on the ejector rod 52 towards the direction of the disc spring 53 to be locked, and the piston rod of the hydraulic ram 4 retracts, so that the pressure relief process can be realized.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A press-fitting device for a high-power semiconductor device module is characterized by comprising
The fixing component (1) comprises a fixing bottom plate (11), and a working hole (12) is formed in the center of the fixing bottom plate (11);
the supporting component (2) comprises a supporting bottom plate (21) which is arranged opposite to the fixed bottom plate (11), a mounting groove (22) is formed in the side face, facing the fixed bottom plate (11), of the supporting bottom plate (21), a positioning block (23) capable of moving up and down is arranged in the mounting groove (22), and a hydraulic ram (4) with a piston facing the operation hole (12) is movably mounted on the positioning block (23);
one end of the cylindrical sliding rod (3) is connected with a fixed bottom plate (11), and the supporting bottom plate (21) is sleeved on the cylindrical sliding rod (3) and can be adjusted towards or away from the fixed bottom plate (11);
the piston rod of the hydraulic jack (4) is opposite to the operation hole (12) and a press-fitting hole in the center of a press-fitting surface (51) of the high-power semiconductor device module.
2. A press-fitting apparatus for high power semiconductor device module as claimed in claim 1, wherein said fixing base plate (11) is provided with mounting holes (13).
3. A press-fitting apparatus for high power semiconductor device module as claimed in claim 1, wherein the side wall of the mounting groove (22) is provided with a vertical guide groove (24), and the side surface of the positioning block (23) is slidably fitted with the guide groove (24).
4. A press-fitting apparatus for high power semiconductor device module according to claim 3, wherein the bottom of the mounting groove (22) is provided with an adjusting bottom plate (29), the adjusting bottom plate (29) is connected with a foot-pushing screw rod (25) in a threaded manner, and the top end of the foot-pushing screw rod (25) passes through the adjusting bottom plate (29) to be connected with the positioning block (23).
5. A press-fitting apparatus for high power semiconductor device module according to claim 3, wherein said positioning block (23) has a V-shaped configuration.
6. A press-fitting apparatus for high power semiconductor device module according to claim 1, wherein said mounting groove (22) is provided with a pair of upper and lower fitting holes (26) on both sides thereof, and said cylindrical sliding rod (3) is correspondingly inserted into said fitting holes (26).
7. A press-fitting device for high-power semiconductor device modules as claimed in claim 6, wherein through holes (27) are respectively formed in two sides of the mounting groove (22) and penetrate up and down, the through holes (27) are communicated with sleeving holes (26) located on the same side of the through holes, and T-shaped quick latches (28) for connecting the cylindrical sliding rods (3) and the supporting base plate (21) are mounted in the through holes (27).
8. A press-fitting device for high-power semiconductor device modules as claimed in claim 7, wherein said cylindrical slide bar (3) is provided with a plurality of cylindrical holes (31) at equal intervals, and said T-shaped quick lock catch (28) passes through said cylindrical holes (31).
9. The press-fitting device for high-power semiconductor device modules as claimed in claim 8, wherein said T-shaped snap lock (28) comprises a lock bar (281) and a T-shaped handle (282) mounted at the bottom of the lock bar (281), and lock beads (283) capable of retracting into the lock bar (281) are annularly distributed on the annular surface of the upper end of the lock bar (281).
10. A press-fitting method using the press-fitting apparatus for a high power semiconductor device module according to claim 1, comprising the steps of,
the method comprises the following steps: powering off the high-power semiconductor device module (5), standing for discharging, and ensuring that the high-power semiconductor device module does not carry charges;
step two: mounting a fixed bottom plate (11) with a cylindrical sliding rod (3) on a press-mounting surface (51) of a high-power semiconductor device module (5);
step three: sleeving a supporting bottom plate (21) on the cylindrical sliding rod (3), and determining the position of the supporting bottom plate (21) according to the stroke of the hydraulic ram (4);
step four: the hydraulic ram (4) is arranged on the positioning block (23) from the opening direction of the positioning block (23), and the height of the hydraulic ram is adjusted by using the positioning block (23) to ensure that a piston rod of the hydraulic ram (4) is opposite to the operation hole (12);
step five: and starting a hydraulic pump connected with the hydraulic jack (4), extending a piston rod of the hydraulic jack (4) out, and pressurizing or releasing the high-power semiconductor device module (5).
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| CN201910657471.2A CN110379740B (en) | 2019-07-19 | 2019-07-19 | Press mounting device and method for high-power semiconductor device module |
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| CN201910657471.2A CN110379740B (en) | 2019-07-19 | 2019-07-19 | Press mounting device and method for high-power semiconductor device module |
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| CN111070141B (en) * | 2020-01-03 | 2021-05-11 | 大连理工大学 | Automatic assembling clamp for micro parts and automatic locking method |
| CN114871731A (en) * | 2022-05-31 | 2022-08-09 | 陈子宇 | Anti-shake servo motor spare part rigging equipment |
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| CN110379740A (en) | 2019-10-25 |
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