JP2004277815A - Substrate plating method, fixture for substrate plating, and substrate plating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate plating method where plating can simultaneously be applied to both the faces of the substrate to be plated, the plating process can remarkably be reduced, and also, a metal plating film can be formed even in a through hole or a hole pattern, to provide a fixture for substrate plating, and to provide a substrate plating device. <P>SOLUTION: The fixture 10 for substrate plating is used for holding the substrate to be plated, and dipping the same into a plating liquid of a plating tank in the plating device. A substrate holding mechanism is provided with first and second holding members 11 and 12 capable of opening and closing via a hinge mechanism 13. The first and second holding members 11 and 12 are respectively provided with holes 11a and 12a to form into openings for exposing the prescribed regions in the substrate to be substrate, and are further provided with sealing members arranged around the holes 11a and 12a, and, on the holding of the substrate to be plated with both the holding members 11 and 12, made close to the surface of the substrate to be plated, and sealing the prescribed regions in the peripheral parts so as to be sealed spaces. The insides of the sealed spaces are provided with electrode contacts to be contacted with double-sided electroconductive films in the substrate to be plated. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, a metal plating film of Cu or the like is formed on the surface of an electronic device substrate such as a semiconductor device or a liquid crystal device, and wiring pattern grooves, through holes, and hole patterns formed on the surface are embedded with the metal plating film. The present invention relates to a substrate plating method, a substrate plating jig, and a substrate plating apparatus which are suitable for the present invention.
[0002]
[Prior art]
Conventionally, as this kind of substrate plating jig, there is one described in Patent Document 1. As shown in FIG. 24, the jig 110 for substrate plating includes a plate-shaped first holding member 111 and a second holding member 112 provided with an annular seal packing 113. The semiconductor wafer 116 is sandwiched and held between the seal packing 111 and the seal packing 113, and an opening 112 a is formed in the inner peripheral portion of the seal packing 113 so that the surface of the semiconductor wafer 116 is exposed, and is held by the first holding member 111. A first energizing member 117 electrically connected to an external electrode is provided on an outer peripheral portion of the semiconductor wafer 116, and a second energizing member 112 is exposed on the surface of the semiconductor wafer 116 held by the first energizing member 117 of the first holding member 111. A second energizing portion 118 is provided which is in contact with both of the conductive films and is sealed by the seal packing 113.
[0003]
To perform plating using the substrate plating jig having the above configuration, the semiconductor wafer held by the substrate plating jig is immersed in the plating solution in a plating tank containing a plating solution, and the semiconductor An anode electrode plate is arranged facing the exposed surface of the wafer, and a plating power is applied between the semiconductor wafer and the anode electrode plate to form a metal plating film on the exposed surface of the semiconductor wafer.
[0004]
In the plating apparatus using the substrate plating jig of the above-described conventional configuration, plating can be performed only on one side of a semiconductor wafer which is a substrate to be plated, and there are the following problems.
{Circle around (1)} When the plating is to be performed on both surfaces of the substrate to be plated, twice the operation time is required.
(2) The in-plane uniformity of the plating film thickness of the substrate to be plated is affected.
{Circle around (3)} A metal plating film cannot be formed on a through hole or a hole pattern of a substrate to be plated.
[0005]
[Patent Document 1]
JP-A-11-172492
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and provides a substrate plating method capable of simultaneously plating both surfaces of a substrate to be plated, greatly reducing a plating process, and forming a metal plating film even in a through hole or a hole pattern. It is an object to provide a jig for substrate plating and a substrate plating apparatus.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, an invention according to claim 1 is a substrate plating method for forming a metal plating film on a substrate to be plated for an electronic element, wherein the substrate to be plated is immersed in a plating solution and arranged. A plating voltage is applied between both surfaces and the anode electrode, and a metal plating film is simultaneously formed on both surfaces of the substrate to be plated.
[0008]
The invention according to claim 2 is a substrate plating method for forming a metal plating film on a substrate to be plated, wherein the substrate to be plated is arranged in a plating solution by exposing predetermined regions on both surfaces thereof, and A plating voltage is applied between the both exposed surfaces and an anode electrode facing each other, and a metal plating film is simultaneously formed on both exposed surfaces of the substrate to be plated.
[0009]
According to a third aspect of the present invention, in the substrate plating method according to the first or second aspect, a through-hole is formed on the substrate to be plated, and a wiring groove pattern and a hole pattern are formed on both surfaces. Are plated simultaneously from both sides, and the through holes, wiring groove patterns, and hole patterns are buried with a metal film.
[0010]
By simultaneously forming metal plating films on both surfaces of the substrate to be plated as described above, for example, through-holes, wiring groove patterns, and hole patterns formed on a semiconductor wafer surface in a manufacturing process of a semiconductor device having a multilayer structure are formed. The plating process for filling with the metal plating film is facilitated, and the plating process can be significantly shortened.
[0011]
According to a fourth aspect of the present invention, in the substrate plating method according to the first or second aspect, a current value supplied to a plating surface of a substrate to be plated is controlled.
[0012]
As described above, the thickness of the plating film formed on each surface can be easily adjusted by controlling the current value applied to the plating surface of the substrate to be plated.
[0013]
An invention according to claim 5 is a substrate plating jig for immersing and holding a substrate to be plated in a plating solution in a plating tank of a plating apparatus, wherein the jig holds the upper edge of the substrate to be plated. And an electrode contact that is in contact with the conductive film on the surface of the substrate to be plated sandwiched between the substrate sandwiching portions.
[0014]
As described above, since the substrate plating jig includes the substrate holding portion and the electrode contacts, the upper edge portion of the substrate to be plated is held by the substrate holding portion, and a predetermined lower portion from the held portion of the substrate to be plated is provided. By immersing the portion in a plating solution and applying a plating power between both surfaces of the immersed substrate and the anode, metal plating films can be simultaneously formed on both surfaces of the substrate. Since the sandwiched portion of the substrate to be plated is on the plating solution surface, the electrode contacts do not come into contact with the plating solution, so it is necessary to seal the electrode contact portions from the plating solution. Absent.
[0015]
According to a sixth aspect of the present invention, there is provided a plating tank containing a plating solution, and a substrate to be plated held by the substrate plating jig according to the fifth aspect in the plating solution of the plating tank. A substrate plating apparatus is characterized in that a predetermined portion below a portion sandwiched by the above is immersed, and anode electrodes are arranged opposite to both surfaces of the portion of the substrate to be plated immersed in the plating solution.
[0016]
As described above, the substrate plating apparatus has a structure in which the anode electrodes are disposed opposite to both surfaces of the portion of the substrate to be plated held by the substrate plating jig according to claim 5 and which is immersed in the plating solution. With such a configuration, it is possible to simultaneously form plating films on both surfaces of the substrate to be plated.
[0017]
An invention according to claim 7 is a substrate plating jig for immersing and holding a substrate to be plated in a plating solution of a plating tank of a plating apparatus, wherein the substrate to be plated is sealed at a predetermined region of a peripheral portion thereof. And a substrate holding mechanism for exposing and holding a predetermined area on both surfaces of the substrate to be plated, and an electrode contact arranged in the closed area and in contact with the conductive film on the surface of the substrate to be plated. .
[0018]
By configuring the jig for substrate plating as described above, when the substrate to be plated is held by the substrate holding mechanism and immersed in the plating solution in the plating tank, predetermined areas on both sides of the substrate to be plated come into contact with the plating solution. Since the electrodes are in contact with the conductive film in the sealed area and the electricity can be supplied to the conductive area in the closed area, it is possible to perform plating capable of simultaneously forming a metal plating film on predetermined areas on both surfaces of the substrate to be plated.
[0019]
The invention according to claim 8 is the jig for substrate plating according to claim 7, wherein the substrate holding mechanism includes first and second holding members that can be opened and closed via a hinge mechanism. An opening for exposing a predetermined area of the substrate to be plated is provided in each of the holding members of No. 2 and the surface of the substrate to be plated is arranged when both holding members are disposed around the opening and the holding members are sandwiched by the holding members. A sealing member that seals a predetermined region of a peripheral edge portion so as to form a sealed space, and an electrode contact that is in contact with the conductive film on the surface of the substrate to be plated is provided in the sealed space.
[0020]
By configuring the jig for substrate plating as described above, the substrate to be plated is sandwiched and held by the first holding member and the second holding member of the substrate holding mechanism, and immersed in the plating solution in the plating tank. In this case, the predetermined regions on both sides of the substrate to be plated are in contact with the plating solution through the openings of the holding members, and the conductive contacts in the sealed region sealed by the sealing member are in contact with the electrode contacts so that current can flow therethrough. Plating that can simultaneously form a metal plating film on predetermined regions on both surfaces of the substrate can be performed.
[0021]
According to a ninth aspect of the present invention, in the jig for plating a substrate according to the eighth aspect, the first and second holding members hold both sides of the holding member with the substrate to be plated held therebetween. It is characterized by comprising a clamp mechanism having a clamp member.
[0022]
As described above, both sides of both holding members are held in a state where the substrate to be plated is sandwiched by the clamp members of the clamp mechanism. Therefore, the holding state of the substrate to be plated can be reliably maintained with a simple configuration.
[0023]
According to a tenth aspect of the present invention, in the jig for substrate plating according to the eighth or ninth aspect, a hanger is integrally attached to an upper portion of the first holding member, and the electrode terminal that is electrically connected to the electrode contact is connected to the hanger portion. Is provided.
[0024]
Since the hanger is integrally attached to the upper part of the first holding member as described above, the substrate to be plated sandwiched between the first holding member and the second holding member is immersed in the plating solution in the plating tank via the hanger. In this case, since the upper end of the hanger is located above the level of the plating solution, it is possible to easily conduct electricity to the conductive film of the substrate to be plated through the electrode terminals provided at the upper end.
[0025]
According to an eleventh aspect of the present invention, there is provided a plating tank containing a plating solution, and the substrate held by the substrate plating jig according to any one of claims 7 to 10 in the plating solution of the plating tank. A substrate plating apparatus is characterized in that a plating substrate is immersed, and an anode electrode is arranged opposite both exposed surfaces of the substrate to be plated.
[0026]
A substrate to be plated, which is held by the substrate plating apparatus according to any one of claims 7 to 10 as described above, is immersed in a plating solution to face both exposed surfaces of the substrate to be plated. With the configuration in which the anode electrode is disposed, the metal plating films can be simultaneously formed on both exposed surfaces of the substrate to be plated.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 12 are views showing a configuration example of a jig for substrate plating according to the present invention. FIG. 1 is a front view, FIG. 2 is a plan view, FIG. 3 is a bottom view, and FIG. 4 is KK of FIG. 5, FIG. 5 is a view from arrow A in FIG. 4, FIG. 6 is a view from arrow B in FIG. 4, FIG. 7 is a view from arrow C in FIG. 4, and FIG. 8 is a view from arrow DD in FIG. FIG. 9, FIG. 9 is a sectional view taken along the line EE of FIG. 5, FIG. 10 is a sectional view taken along the line FF of FIG. 1, FIG. 11 is a sectional view taken along the line GG of FIG. It is an HH sectional arrow view.
[0028]
The substrate plating jig 10 includes a first holding member 11 and a second holding member 12 in the form of a plate, and both holding members 11 and 12 are connected at their lower ends by a hinge mechanism 13 so as to be openable and closable. The hinge mechanism 13 includes two hooks 13-1, 13-1 made of a resin material (for example, HTPVC) fixed to the second holding member 12, and the hooks 13-1, 13-1 are made of stainless steel. The lower end of the first holding member 11 is rotatably supported by a hook pin 13-2 made of, for example, SUS303. The first holding member 11 is made of a resin material (for example, HTPVC), has a substantially pentagonal shape, is provided with a hole 11a as an opening in the center, and has a hanger 14 made of a T-shaped resin material (for example, HTPVC) on its upper part. Are integrally mounted. The second holding member 12 is made of a resin material (for example, HTPVC), has a substantially pentagonal shape, and has a hole 12a as an opening in the center.
[0029]
The first holding member 11 and the second holding member 12 are held by the right and left clamps 15 and 16 in a closed state (overlaid state) via the hinge mechanism 13. The left and right clamps 15, 16 are made of a resin material (for example, HTPVC), and have grooves 15a, 16a into which both sides are inserted when the first holding member 11 and the second holding member 12 are overlapped. The lower end is rotatably supported at the lower end on both sides of the first holding member 11 by pins 17 and 18.
[0030]
As shown in FIG. 5, a seal ring (ring-shaped seal member) 19 is attached to the outer peripheral side of the hole 11 a on the surface of the first holding member 11 facing the second holding member 12. As shown in FIG. 7, a seal ring 20 is attached to the outer peripheral side of the hole 12a on the surface facing the holding member 11. The seal rings 19 and 20 are made of a rubber material (for example, silicon rubber). An O-ring 29 is attached to the surface of the second holding member 12 facing the first holding member 11 outside the seal ring 20.
[0031]
Each of the seal rings 19 and 20 has a rectangular cross section and is provided with protrusions 19a and 20a on the inner peripheral side thereof. The seal rings 19 and 20 are overlapped with the substrate to be plated interposed between the first holding member 11 and the second holding member 12. In the aligned state, the projections 19a and 20a press the surface of the substrate to be plated, come into close contact with each other, and are surrounded by the projections 19a, the projections 20a and the O-ring 29 located on the outer peripheral side of the holes 11a and 12a. Is a watertight area where the plating solution is not immersed. As shown in FIGS. 5 and 8, a seal ring 19 protrudes from a surface of the first holding member 11 facing the second holding member 12, and a substrate guide pin 21 for positioning a substrate W to be plated such as a semiconductor wafer. Are provided on the outer peripheral side of the hole 11a.
[0032]
As shown in FIGS. 5, 9, and 10, a total of six conductive plates 22 are provided on the outer surface of the hole 11a on the surface of the first holding member 11 facing the second holding member 12. Three of the six conductive plates 22 are electrically connected to the conductive film (not shown) on one surface (for example, the surface) of the substrate to be plated W via the conductive pins 23 as shown in FIG. I have. The other three remaining portions in the conductive plate 22 are electrically connected to the conductive film (not shown) on one surface (for example, the back surface) of the substrate W through the conductive pins 23 as shown in FIG. .
[0033]
Of the six conductive plates 22, the conductive plate 22 that is electrically connected to the conductive film on one surface (for example, the surface) of the substrate W to be plated is connected to one of the hangers 14 via the insulating coating wire 26 that passes through the wiring groove 25. The conductive plate 22, which is connected to the electrode terminals 27 a, 27 b, and 27 c (see FIG. 2) provided on the terminal plate 27 and conducts to the conductive portion on the other surface (for example, the back surface) of the substrate W, has an insulating coating in the wiring groove 25. The wires 26 are connected to electrode terminals 28 a, 28 b, 28 c (see FIG. 2) provided on one terminal plate 28 of the hanger 14. 5 and 11, reference numeral 30 denotes a wiring holder made of a resin material (for example, PVC).
[0034]
In the jig for plating a substrate having the above configuration, the first holding member 11 and the second holding member 12 are surrounded by eight board guide pins 21 erected on the first holding member 11 with the first holding member 11 and the second holding member 12 opened. By placing the substrate to be plated W in the region, the substrate to be plated W is positioned at a predetermined position of the first holding member 11. Then, the first holding member 11 and the second holding member 12 are closed via the hinge mechanism 13, and the left and right clamps 15 and 16 are further rotated, respectively, to clamp both sides of the first holding member 11 and the second holding member 12. 15 and 16 are inserted into the grooves 15a and 16a. Thereby, the substrate W to be plated is held in a state where it is positioned at a predetermined position of the first holding member 11.
[0035]
Further, by this, the region surrounded by the projections 19a, 20a of the seal rings 19, 20 and the O-ring 29 is sealed in a water-tight state in which the plating solution is not immersed, and at the same time, from the projections 19a, 20a The outside is located in this sealed space, and portions corresponding to the holes 11a of the first holding member 11 and the holes 12a of the second holding member 12 on both surfaces of the substrate W to be plated are exposed to the holes 11a, 12a. Of the six conductive plates 22, the conductive plate 22 that is electrically connected to the conductive portion on one surface of the substrate W is connected to the electrode terminals 27 a, 27 b, and 27 c of one terminal plate 27 of the hanger 14, and The conductive plate 22, which is electrically connected to the conductive portion on the other surface, is connected to electrode terminals 28a, 28b, 28c provided on one terminal plate 28 of the hanger 14.
[0036]
FIG. 13 is a view showing a configuration example of a substrate plating apparatus using the jig 10 for substrate plating. As shown in the figure, the substrate plating apparatus 50 includes a plating tank 51, and a jig 10 for substrate plating holding a substrate W to be plated such as a semiconductor wafer is suspended in a plating solution Q in the plating tank 51. Are arranged. In this way, the liquid level L of the plating solution Q becomes L level in FIG. 1 in a state where the substrate plating jig 10 is immersed in the plating solution Q. Anode electrodes 52, 52 are held by electrode holding members 58, 58 so as to face both exposed surfaces of the substrate W to be plated held by the substrate plating jig 10. As shown in FIG. 14, the anode electrodes 52, 52 are plate-shaped and have a circular shape and a substantially same size corresponding to the holes 11 a of the first holding member 11 and the holes 12 a of the second holding member 12, respectively. It is attached to the electrode holding members 58, 58.
[0037]
Adjustment plates 60, 60 made of an insulating material are arranged between the substrate W to be plated and the anode electrodes 52, 52. As shown in FIG. 15, a circular hole 60a having a similar shape to the hole 11a of the first holding member 11 and the hole 12a of the second holding member 12 is formed in the center of the adjusting plates 60, 60. The anodes of plating power supplies (DC power supplies) 53, 53 are connected to the anode electrodes 52, 52 via plating current controllers 59, 59, respectively, and both surfaces of the substrate W to be plated held by the substrate plating jig 10. The conductive films are connected to the cathodes of power supplies (DC power supplies) 53, 53 via the electrode terminals 27a, 27b, 27c of the terminal plate 27 and the electrode terminals 28a, 28b, 28c of the terminal plate 28, and the respective plating power supplies 53, 53 By passing the plating current adjusted by the plating current controllers 59, 59, a metal (for example, Cu) plating film can be simultaneously formed on both exposed surfaces of the substrate W to be plated.
[0038]
At this time, the thickness of the metal plating film can be adjusted by adjusting the value of the plating current flowing on each plating surface of the substrate W to be plated by each of the current regulators 59 and 59. Further, by adjusting the size of the holes 60a, 60a of the adjusting plates 60, 60, the potential distribution in the plating tank 51 is adjusted to adjust the film thickness distribution of the metal plating film formed on the surface of the substrate W to be plated. Can be adjusted.
[0039]
Outside the plating tank 51, an outer tank 57 for containing the plating solution Q overflowing from the plating tank 51 is provided. The plating solution Q overflowing from the plating tank 51 and flowing into the outer tank 57 is supplied from the lower part of the plating tank 51 into the tank through a constant temperature unit 55 and a filter 56 by a plating solution circulation pump 54, and the plating solution Q circulates.
[0040]
By plating simultaneously on both surfaces of the substrate to be plated using the plating apparatus 50 as described above, for example, as shown in FIG. 16A, a through hole 61 and a wiring groove pattern or a hole pattern 62 on both surfaces are formed. Plating is simultaneously applied to both surfaces of the substrate W on which the barrier layer 63 and the seed layer (conductive film layer made of metal (for example, Cu)) 64 are formed, as shown in FIG. 3.) A plating layer 65 is formed, and the through-hole 61, the wiring groove pattern and the hole pattern 62 can be embedded in the metal plating layer 65. After that, the excess metal plating layer 65 and the seed layer 64 are removed by polishing or the like, so that the through hole 61, the wiring groove pattern and the hole pattern 62 are buried with the metal plating layer 65 as shown in FIG. Obtain a substrate to be plated.
[0041]
As described above, the through-hole 61, the wiring groove pattern or the hole pattern 62 as shown in FIG. 16C is previously formed by the metal plating layer 65 by the plating method of simultaneously applying a metal plating film to both surfaces of the substrate W to be plated. By manufacturing a plurality of substrates W (here, W1 to W6) having different patterns embedded therein and laminating the substrates W1 to W6 as shown in FIG. 17, an electronic component such as an IC can be easily manufactured. Can be.
[0042]
18 to 21 are diagrams showing another example of the configuration of the jig for plating a substrate according to the present invention. FIG. 18 is a diagram showing a state in which a substrate to be plated is held by the jig for plating a substrate. FIG. 20 is a view showing a configuration of a first holding member and a hanger portion of the jig for substrate plating, and FIG. 21 is a view showing a configuration of a second holding member of the jig for substrate plating. is there. As shown in the figure, the substrate plating jig 70 includes a first holding member 71 and a second holding member 72, and the two holding members 71, 72 are configured to be freely opened and closed by a hinge mechanism 85. The upper edge of the substrate W is sandwiched between the first holding member 71 and the second holding member 72, and the thumb screw 73 attached to the second holding member 72 is screwed into the screw hole 74 formed in the first holding member 71. Thus, the substrate W to be plated is sandwiched between the first holding member 71 and the second holding member 72.
[0043]
The first holding member 71 and the second holding member 72 are each made of a resin material (for example, HTPVC), and electrode contacts 75 and 76 that are in contact with a conductive film formed on the surface of the substrate W to be plated are formed on surfaces facing each other. A plurality (three in the figure) is provided. A hanger 77 is provided integrally with the first holding member 71, and terminal plates 78 and 79 for energization are provided at upper ends of both ends of the hanger 77. The electrode contact 75 of the first holding member 71 is connected to an electrode terminal (not shown) of the terminal plate 79 by an electric wire 80. The first holding member 71 is provided with an energizing contact 81, and the second holding member 72 is provided with an energizing spring contact 82 that contacts the energizing contact 81. The energizing contact 81 is connected to an electrode terminal (not shown) of a terminal plate 78 by an electric wire 83, and the energizing spring contact 82 is connected to an electrode contact 76 by an electric wire 84. Therefore, when the first holding member 71 and the second holding member 72 are closed, the plurality of electrode contacts 76 are connected to the electrode terminals of the terminal plate 78 via the electric wire 84, the energizing spring contact 82, the energizing contact 81, and the electric wire 83. Connected.
[0044]
FIG. 22 is a diagram showing a configuration example of a plating apparatus using the jig 70 for substrate plating. As shown in the figure, the plating apparatus 50 includes a plating tank 51, and a plating solution Q in the plating tank 51 contains a substrate W to be plated held at an upper edge thereof by a substrate plating jig 70. Are located. As described above, the liquid level L of the plating solution Q becomes L level in FIG. 18 in a state where the substrate W to be plated sandwiched between the substrate plating jigs 70 is immersed in the plating solution Q. Anode electrodes 52 and 52 are arranged so as to face both exposed surfaces of substrate P to be plated held by substrate plating jig 70. The anode electrodes 52, 52 are plate-shaped and have a shape corresponding to the shape of the plating surface of the substrate W to be plated, and have substantially the same size as the plating surface.
[0045]
Adjustment plates 60, 60 made of an insulating material are arranged between the substrate W to be plated and the anode electrodes 52, 52. Although not shown, holes having a shape similar to the shape of the plating surface of the substrate W to be plated are formed in the central portions of the adjusting plates 60, 60. The anodes of plating power supplies (DC power supplies) 53, 53 are connected to the respective anode electrodes 52, 52 via plating current regulators 59, 59, respectively. The cathodes of plating power supplies (DC power supplies) 53, 53 were connected to the conductive film via the electrode terminals of the terminal plate 78 and the terminal plate 79, and adjusted by the plating current controllers 59, 59 from the respective plating power supplies 53, 53. By applying a plating current value, a metal (for example, Cu) plating film can be simultaneously formed on both exposed surfaces of the substrate W to be plated.
[0046]
At this time, the thickness of the plating film can be adjusted by adjusting the plating current flowing through the respective plating surfaces of the substrate W to be plated by the current controllers 59 and 59. Further, by adjusting the size of the holes of the adjusting plates 60, 60, the potential distribution in the plating tank 51 is adjusted to adjust the thickness distribution of the metal plating film formed on the surface of the substrate W to be plated. be able to.
[0047]
Outside the plating tank 51, an outer tank 57 for containing the plating solution Q overflowing from the plating tank 51 is provided. The plating solution Q overflowing from the plating bath 51 and flowing into the outer bath 57 is supplied from the lower part of the plating bath 51 into the bath through the constant temperature unit 55 and the filter 56 by the plating solution circulation pump 54, and the plating solution Q circulates. 13 is the same as the substrate plating apparatus shown in FIG.
[0048]
The jig 70 for substrate plating is configured so that the first holding member 71 and the second holding member 72 can be opened and closed via a hinge mechanism 85. However, the jig 70 for substrate plating for holding the upper edge portion of the substrate is provided. The jig is not limited to such a configuration. In short, a jig for holding the upper edge portion of the substrate to be plated W and a conductive film on the surface of the substrate for plating W held between the holding portions for the substrate Any configuration may be used as long as the configuration includes an electrode contact for contacting the electrode.
[0049]
Further, as described above, the substrate W to be plated held by the substrate plating jig supported on the surface of the plating solution Q is limited to a rigid plate-like substrate to be plated. Instead, for example, as shown in FIG. 23, a thin film-shaped substrate W to be plated may be attached to the frame 91, and the upper edge of the frame 91 may be used as the upper edge of the substrate W to be plated. The substrate to be plated is immersed in the plating solution of the plating tank 51 of the substrate plating apparatus 50 having the structure shown in FIG. A metal film may be formed on both sides of the substrate to be plated. In this case, the substrate plating jig 90 is provided with electrode contacts (not shown) for supplying electricity to the conductive films formed on both surfaces of the substrate W to be plated. 23A is a front view, and FIG. 23B is a cross-sectional view taken along the line AA of FIG.
[0050]
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications may be made within the scope of the claims and the technical idea described in the specification and the drawings. It is possible. It should be noted that any shape, structure, or material that is not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and effects of the present invention are exhibited.
[0051]
【The invention's effect】
As described above, according to the invention described in each claim, the following excellent effects can be obtained.
[0052]
According to the first to third aspects of the present invention, by forming a metal plating film on both surfaces of a substrate to be plated simultaneously, for example, a through-hole formed on a semiconductor wafer surface in a manufacturing process of a semiconductor device having a multilayer structure. The plating process for filling the hole, the wiring groove pattern, and the hole pattern with the metal plating film becomes easy, and the plating process can be greatly shortened.
[0053]
According to the fourth aspect of the present invention, the thickness of the plating film formed on each surface can be easily adjusted by controlling the current value applied to the plating surface of the substrate to be plated.
[0054]
According to the invention as set forth in claim 5, the jig for substrate plating includes the substrate holding portion for holding the upper edge portion of the substrate to be plated and the electrode contacts, so that the upper edge portion of the substrate to be plated is held by the substrate holding portion. A predetermined portion below the sandwiched portion of the substrate to be plated is immersed in a plating solution, and a plating power is applied between both surfaces of the immersed substrate and the anode to simultaneously perform metal plating on both surfaces of the substrate. A film can be formed. Further, since the sandwiched portion of the substrate is on the plating solution surface, there is no need to provide a seal for isolating the electrode contact portion from the plating solution, so that the substrate plating jig can have a simple configuration.
[0055]
According to the sixth aspect of the present invention, the anode electrodes are arranged so as to oppose both surfaces of the portion of the substrate to be plated held by the substrate plating jig according to the fifth aspect, which is immersed in the plating solution. With this configuration, it is possible to provide a substrate plating apparatus capable of simultaneously forming plating films on both surfaces of a substrate to be plated with a simple configuration.
[0056]
According to the invention as set forth in claim 7, the substrate to be plated is held by the substrate holding mechanism, and when immersed in the plating solution in the plating bath, both surfaces of the substrate to be plated come into contact with the plating solution, Since the electrode contacts can be brought into contact with the conductive film in the sealed area and can be energized, the metal plating film can be simultaneously formed in the predetermined areas on both surfaces of the substrate to be plated.
[0057]
According to the invention as set forth in claim 8, when the substrate to be plated is sandwiched and held between the first holding member and the second holding member of the substrate holding mechanism and immersed in a plating solution in a plating tank, the substrate is not immersed. The predetermined areas on both sides of the plating substrate are in contact with the plating solution through the openings of both holding members, and the conductive contacts in the sealed area sealed by the sealing member can be brought into contact with the electrode contacts so that electricity can be supplied. A metal plating film can be simultaneously formed in a predetermined area.
[0058]
According to the ninth aspect of the present invention, since both sides of both holding members are held in a state where the substrate to be plated is sandwiched by the clamp members of the clamp mechanism, the holding state of the substrate to be plated can be reliably achieved with a simple configuration. Can be maintained.
[0059]
According to the tenth aspect of the present invention, since the hanger is integrally attached to the upper portion of the first holding member, the substrate to be plated sandwiched between the first holding member and the second holding member is plated via the hanger. When immersed in the plating solution in the tank, the upper end of the hanger is located above the level of the plating solution, so it is possible to easily conduct electricity to the conductive film on the substrate to be plated through the electrode terminals provided on the upper end. It becomes.
[0060]
According to the eleventh aspect of the present invention, the substrate to be plated, which is held by the substrate plating apparatus with the jig for substrate plating according to any one of the seventh to tenth aspects, is immersed in a plating solution, and With the configuration in which the anode electrodes are arranged so as to face both the exposed surfaces, a substrate plating apparatus capable of simultaneously forming a metal plating film on both exposed surfaces of the substrate to be plated can be provided.
[Brief description of the drawings]
FIG. 1 is a front view showing a configuration example of a substrate plating jig according to the present invention.
FIG. 2 is a plan view showing a configuration example of a jig for plating a substrate according to the present invention.
FIG. 3 is a bottom view showing a configuration example of a jig for plating a substrate according to the present invention.
FIG. 4 is a sectional view taken along arrow KK of FIG. 1;
FIG. 5 is a view taken in the direction of arrow A in FIG. 4;
6 is a view as viewed in the direction of arrow B in FIG. 4;
FIG. 7 is a view taken in the direction of the arrow C in FIG. 4;
FIG. 8 is a sectional view taken along the line DD in FIG. 5;
FIG. 9 is a sectional view taken along the line EE in FIG. 5;
10 is a sectional view taken along the line FF in FIG. 1;
11 is a sectional view taken along the line GG in FIG.
FIG. 12 is a sectional view taken along the line HH in FIG. 6;
FIG. 13 is a view showing a configuration of a substrate plating apparatus according to the present invention.
FIG. 14 is a diagram showing shapes of an anode electrode and an electrode holding member of the substrate plating apparatus of FIG.
FIG. 15 is a view showing a shape of an adjustment plate of the substrate plating apparatus of FIG.
FIG. 16 is a view showing a plating step of a plating method according to the present invention.
FIG. 17 is a diagram showing a configuration example of an electronic component using a substrate manufactured by the plating method according to the present invention.
FIG. 18 is a front view showing a configuration example of a jig for plating a substrate according to the present invention.
19 is a sectional view taken along line AA of FIG.
FIG. 20 is a view showing a configuration of a first holding member and a hanger part of the jig for plating a substrate of FIG. 18;
FIG. 21 is a view showing a configuration of a second holding member of the jig for plating a substrate of FIG. 18;
FIG. 22 is a diagram showing a configuration of a substrate plating apparatus according to the present invention.
FIG. 23 is a view showing a configuration example of a substrate to be plated by the substrate plating apparatus according to the present invention.
FIG. 24 is a front view showing the configuration of a conventional substrate plating jig.
[Explanation of symbols]
10 Jig for plating on board
11 First holding member
12 Second holding member
13 Hinge mechanism
14 Hanger
15 Clamp
16 Clamp
17 pin
18 pin
19 Seal ring
20 Seal ring
21 Board Guide Pin
22 Conductive plate
23 Conductive pins
25 Wiring groove
26 Insulated wire
27 Terminal board
28 Terminal board
29 O-ring
30 Wiring presser
50 Plating equipment
51 Plating tank
52 Anode electrode
53 Plating power supply
54 Plating solution circulation pump
55 constant temperature unit
56 filters
57 Outer tank
58 Electrode holding member
59 Current controller
60 Adjustment plate
61 Through Hole
62 Wiring groove pattern and hole pattern
63 barrier layer
64 seed layer
65 Metal plating layer
70 Jig for Plating Board
71 First holding member
72 Second holding member
73 Thumbscrew
74 screw hole
75 electrode contacts
76 electrode contacts
77 Hanger
78 terminal board
79 Terminal board
80 electric wires
81 Current-carrying contact
82 Current-carrying spring contact
83 electric wire
84 electric wires
85 Hinge mechanism
90 Jig for substrate plating
91 frame

Claims (11)

In a substrate plating method for forming a metal plating film on a substrate to be plated for an electronic element,
The substrate to be plated is immersed in a plating solution and arranged, and a plating voltage is applied between both surfaces of the substrate and an anode electrode to form a metal plating film on both surfaces of the substrate to be plated simultaneously. Substrate plating method. In a substrate plating method of forming a metal plating film on a substrate to be plated,
The substrate to be plated is disposed in a plating solution by exposing predetermined regions on both surfaces thereof, and a plating voltage is applied between the both exposed surfaces and the anode electrodes respectively opposed to the both exposed surfaces. A method of plating a substrate, wherein the metal plating films are simultaneously formed on both exposed surfaces of the substrate. The substrate plating method according to claim 1 or 2,
The substrate to be plated has a through hole, a wiring groove pattern and a hole pattern formed on both surfaces. The through hole and the hole pattern are simultaneously plated from both surfaces, and the through hole, the wiring groove pattern, and the hole pattern are formed of a metal film. A substrate plating method characterized by being embedded. The substrate plating method according to claim 1 or 2,
A substrate plating method, wherein a current value supplied to a plating surface of the substrate to be plated is controlled. A jig for plating a substrate for dipping and holding a substrate to be plated in a plating solution in a plating tank of a plating apparatus,
A jig for substrate plating, comprising: a substrate holding portion for holding an upper edge portion of the substrate to be plated; and an electrode contact contacting a conductive film on a surface of the substrate to be plated held by the substrate holding portion. . A plating tank containing a plating solution is provided, and a substrate to be plated held by the substrate plating jig according to claim 5 in the plating solution of the plating tank is positioned downward from a portion held by the substrate holding portion. A substrate plating apparatus, characterized in that a predetermined portion is immersed, and anode electrodes are arranged opposite to both surfaces of the portion of the substrate to be plated, which is immersed in the plating solution. A jig for plating a substrate for dipping and holding a substrate to be plated in a plating solution in a plating tank of a plating apparatus,
A substrate holding mechanism for sealing the substrate to be plated by sealing a predetermined region of a peripheral portion thereof and exposing and holding predetermined regions on both surfaces of the substrate to be plated; A jig for plating a substrate, wherein an electrode contact for contacting the film is provided. The jig for plating a substrate according to claim 7,
The substrate holding mechanism includes first and second holding members that can be opened and closed via a hinge mechanism,
The first and second holding members are each provided with an opening for exposing the predetermined region of the substrate to be plated, and the substrate to be plated is sandwiched between both holding members disposed around the opening. At this time, a sealing member that is in close contact with the surface of the substrate to be plated and seals a predetermined region of the peripheral portion to form a sealed space is provided, and an electrode contact that contacts a conductive film on the surface of the substrate to be plated is provided in the sealed space. A jig for plating a substrate. The jig for plating a substrate according to claim 8,
A jig for plating a substrate, comprising: a clamp mechanism having a clamp member for holding both sides of the holding member with the substrate to be plated sandwiched between the first and second holding members. The jig for plating a substrate according to claim 8 or 9,
A jig for plating a substrate, wherein a hanger is integrally mounted on an upper portion of the first holding member, and an electrode terminal for conducting to the electrode contact is provided on the hanger portion. A plating tank containing a plating solution is provided, and a substrate to be plated held by the substrate plating jig according to any one of claims 7 to 10 is immersed in the plating solution in the plating tank, and the plating is performed. A substrate plating apparatus, wherein an anode electrode is arranged facing both exposed surfaces of a substrate.

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