JP2004277802A - Apparatus for producing structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To more precisely measure an aiming electrostatic capacity value or ohmic value, or from a different viewpoint, a stack height, by measuring the electrostatic capacity value or the ohmic value of a structure produced with a gas deposition method. <P>SOLUTION: The apparatus for producing a structure comprises an aerosol generator, a nozzle for spouting the aerosol particles, and a means for measuring the electrostatic capacity value or the ohmic value of the produced structure. The apparatus produces the structure by colliding particles in an aerosol having particles dispersed in a gas to a substrate at a high speed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure manufacturing apparatus using a gas deposition method in which a structure is manufactured by causing aerosol particles to collide with a substrate at high speed.
[0002]
[Prior art]
The gas deposition method has been proposed as a method of fabricating brittle material structures on various substrates using brittle material fine particles such as ceramic fine particles.Aerosol obtained by dispersing brittle material fine particles in a gas is proposed. A method in which fine particles collide with the surface of the substrate material by being sprayed toward the substrate material, and the collision energy causes the fine particle material to be crushed, deformed, and recombined, thereby forming a structure of a brittle material on the substrate surface without firing. This is a suitable means for producing an insulating film such as a ceramic (for example, Patent Document 1).
Conventionally, as one means for controlling the deposition height of a structure produced by a gas deposition method, as disclosed in Patent Document 2, a sensor for measuring weight is provided at a powder storage portion, and a ceramic structure production apparatus is operated. Then, the change in weight of the ceramic fine particle storage site is measured. By measuring the amount of change, it is possible to determine the amount of ceramic fine particles that have been aerosolized and conveyed. In this case, since the amount of the ceramic fine particles remaining in the ceramic fine particle transport path until the powder collides with the substrate is also included, the amount of the ceramic fine particles colliding with the substrate is not accurate. Therefore, a powder collector is provided in the substrate installation part, and the ceramic fine particles immediately before colliding with the substrate are collected and the weight thereof is measured. By doing so, a means for measuring the amount of ceramic fine particles colliding with the substrate and a photoelectric sensor so that the space between the tip of the nozzle and the substrate is a measurement site are provided, and the amount of ceramic fine particles colliding with the substrate is measured. Means have been proposed.
[0003]
[Patent Document 1]
Japanese Patent No. 3348154 [Patent Document 2]
JP-A-2001-348659
[Problems to be solved by the invention]
However, the means described in Patent Literature 2 is a means for indirectly estimating the deposition height of a structure by measuring the amount of ceramic particles ejected from a nozzle. That is, there is a high possibility that the measurement value includes a considerable amount of error.
The present invention measures a capacitance value and / or a resistance value of a structure manufactured by a gas deposition method to thereby set a target capacitance value and / or a resistance value. Another object of the present invention is to provide a structure manufacturing apparatus capable of more accurately measuring.
The relationship between the capacitance value and the deposition height is as follows: the capacitance value of the structure is C, the deposition height of the structure is d, the area of the electrode is S, the relative permittivity of the structure is ε, and the permittivity of vacuum is Is ε0, the relational expression of C = ε · ε0 · S / d holds. When this equation is converted, d = ε · ε0 · S / C, the dielectric constant of vacuum is ε0 and the relative permittivity ε of the structure is a known value, and the area S of the electrode is determined to an arbitrary value. If the capacitance value C of the structure can be measured according to the present invention, the deposition height d of the structure can be easily obtained.
Further, the relationship between the resistance value and the deposition height of the structure is as follows: R is the resistance value of the structure, d is the deposition height of the structure, S is the area of the electrode, and ρ is the deposition resistivity of the structure. The relational expression of R = ρ · d / S holds. When this equation is converted, d = R · S / ρ, the deposition resistivity ρ of the structure is a known value, the area S of the electrode is determined to an arbitrary value, and the resistance R of the structure is determined according to the present invention. Is measured, the deposition height d of the structure can be easily obtained.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a first aspect of the present invention relates to a structure manufacturing apparatus for manufacturing a structure by causing aerosol particles in which fine particles are dispersed in a gas to collide with a substrate at a high speed, wherein an aerosol generator and an aerosol particle are jetted. A structure manufacturing apparatus, comprising: a nozzle to be formed; and an electrode that comes into contact with the structure to be manufactured and measures a capacitance value and / or a resistance value of the structure.
In the present invention, since a means for measuring the capacitance value and / or the resistance value of the structure to be manufactured is provided, the capacitance value and / or the resistance value of the structure can be measured and managed as needed.
[0006]
In order to achieve the above object, a structure according to claim 2, wherein the electrode used for measuring the capacitance value and / or the resistance value has a powder adhesion preventing mechanism for preventing adhesion of fine particles. It is a manufacturing device.
In the present invention, it is possible to prevent fine particles that have not contributed to film formation from adhering to an electrode used for measuring a capacitance value and / or a resistance value and deteriorating an electrode function.
[0007]
In order to achieve the above object, a third aspect of the present invention relates to a structure manufacturing apparatus, wherein the electrodes used for measuring the capacitance value and / or the resistance value are divided into two or more electrodes. is there.
In the present invention, it is possible to evaluate not only the average value of the capacitance value and / or the resistance value of the structure over the entire surface but also the variation at an arbitrary position.
[0008]
According to a fourth aspect of the present invention, there is provided a structure manufacturing apparatus, wherein an electrode used for measuring a capacitance value and / or a resistance value of the structure is a conductive rubber.
In the present invention, an electrode that covers the surface of the structure is required. As the electrode material, a metal plate, a metal plate, a conductive resin, and the like can be considered.However, in order to improve the measurement accuracy of the capacitance value and / or the resistance value of the structure, a structure having a certain amount of undulation is required. It is preferable that the material adheres to the surface so as to be familiar. As a representative thereof, a conductive rubber in which carbon or silver is dispersed in silicone or rubber is most preferable.
[0009]
In order to achieve the above object, claim 5 is characterized in that the measurement of the capacitance value and / or the resistance value is performed in a state where aerosol particles ejected from the nozzle do not collide with a structure to be manufactured. This is a structure manufacturing apparatus.
In the present invention, it is possible to prevent fine particles that have not contributed to film formation from adhering to an electrode used for measuring a capacitance value and / or a resistance value and deteriorating an electrode function.
[0010]
In order to achieve the above object, according to a sixth aspect of the present invention, there is provided a structure manufacturing apparatus characterized in that, when used for measuring the capacitance value and / or the resistance value, the injection of the aerosol particles from the nozzle is interrupted. .
In the present invention, it is possible to prevent fine particles that have not contributed to film formation from adhering to an electrode used for measuring a capacitance value and / or a resistance value and deteriorating an electrode function.
[0011]
In order to achieve the above object, according to a seventh aspect of the present invention, there is provided a method for manufacturing a structure, wherein an electrode used for measurement is moved from a standby position to a measurement position when used for measuring the capacitance value and / or the resistance value. Device.
In the present invention, at the time of normal structure production, the electrodes used for measuring the capacitance value and / or the resistance value are located at a standby position that does not hinder the structure production, and the capacitance value and / or It means that it moves to the vicinity of the structure, which is the measurement position, when measuring the resistance value.
[0012]
In order to achieve the above-mentioned object, the present invention relates to a structure in which the capacitance value and / or the resistance value is fed back to a control unit of a structure manufacturing apparatus, and the amount of fine particles supplied to the aerosol generator is adjusted. A structure manufacturing apparatus characterized by controlling a capacitance value and / or a resistance value of an object.
[0013]
In order to achieve the above object, according to the ninth aspect, the capacitance value and / or the resistance value are fed back to a control unit of a structure manufacturing apparatus, and the amount of air jetted from the nozzle is adjusted. Which controls the capacitance value and / or the resistance value.
[0014]
In order to achieve the above object, claim 10 is to feed back the measured capacitance value and / or resistance value to a control unit of a structure manufacturing apparatus, and to adjust a scan speed of the nozzle and / or the substrate. And a structure manufacturing apparatus characterized by controlling a capacitance value and / or a resistance value of the structure.
[0015]
In order to achieve the above object, a structure according to claim 11, wherein the capacitance value and / or the resistance value is fed back to a control unit of a structure manufacturing apparatus, and the number of scans of the nozzle and / or the substrate is adjusted. Which controls the capacitance value and / or the resistance value.
[0016]
In order to achieve the above object, claim 12 is to feed back the capacitance value and / or resistance value to a control unit of a structure manufacturing apparatus, and when the capacitance value and / or resistance value becomes a predetermined value. The structure manufacturing apparatus according to claim 1, wherein the manufacturing of the structure is terminated.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a means for measuring the capacitance value of a structure to be manufactured according to the present invention, and a feedback of the measured capacitance value, and the capacitance value of the structure, in other words, deposition. 1 is an overall schematic diagram of a structure manufacturing apparatus using a gas deposition method including a control system for adjusting a height. The gas cylinder 8 is connected via a transport pipe to an aerosol generator 7 containing alumina ceramic fine particles, and a nozzle 5 for jetting aerosol particles 6 is installed in the vacuum chamber 1 through the transport pipe. A substrate 12 on a flat plate made of metallic aluminum is mounted on a substrate holder 11 that can be braked to XY by the XY stage 3. The vacuum chamber 1 is connected to a vacuum pump 2.
[0018]
Further, in the vacuum chamber 1, there is provided a mechanism 16 for bringing a conductive rubber 14 into close contact with the surface of the structure 13 in order to measure a capacitance value of the structure 13 formed on the substrate 12. In order to prevent powder from adhering to the rubber 14, a shutter 15 for preventing powder adhesion is provided. The capacitance value is measured by connecting the LCR meter 9 to each of the metallic aluminum plate-shaped substrate 12 and the conductive rubber 14.
[0019]
The flow of actually measuring the capacitance value will be described with reference to FIGS.
FIG. 2 shows a state in which the aerosol particles 6 ejected from the nozzle 5 collide with the substrate 12 to produce the structure 3. At this time, the conductive rubber 14 is applied to the surface of the structure 13. The mechanism 16 for bringing the conductive rubber 14 into close contact with the conductive rubber 14 is located at a standby position which does not hinder the production of the structure 3. 14 surface.
[0020]
FIG. 3 shows a state in which the aerosol particles 6 ejected from the nozzle 5 are located at a position away from the substrate 12 and the structure 13 has not been produced. The powder adhesion prevention shutter 15 for preventing the body from adhering moves upward in the drawing, that is, in the direction of the arrow.
[0021]
FIG. 4 shows that the aerosol particles 6 ejected from the nozzle 5 are located away from the substrate 12, the structure 3 is not manufactured, and the powder is prevented from adhering to the conductive rubber 14. In this state, the powder adhesion prevention shutter 15 has moved upward in the figure, that is, in the direction of the arrow, and at this time, the mechanism 16 for bringing the conductive rubber 14 into close contact with the surface of the structure 13 is Then, the conductive rubber 14 is brought into close contact with the surface of the structure 3. That is, it is in the measurement state and measures the capacitance value.
[0022]
Next, an example in which the measurement result of the capacitance value is fed back to the main controller 10 to control the deposition height of the structure 13 to a target value will be described.
When a predetermined time has elapsed from the start of manufacturing the structure and the capacitance is measured in a state where the aerosol particles 6 ejected from the nozzle 5 do not collide with the structure 13 as described above, the main control device 10 has measured the capacitance. When the result of comparing and measuring the capacitance value with the target capacitance value matches (substantially matches) the target value, it is determined that the fabrication of the structure 13 is completed at that time.
[0023]
On the other hand, when the difference between the capacitance value and the target capacitance value is large, the driving amount of the driving unit (not shown) of the aerosol generator 7 is increased to increase the concentration of the aerosol ejected from the nozzle 5 and to increase the density per unit time. The deposition height is increased, and if the difference from the target capacitance value is small, the aerosol concentration is controlled to be low to prevent the deposition height from exceeding the target, and the aerosol particles 6 Then, the state is returned to the state of collision with 13, and the production of the structure is restarted.
[0024]
After a lapse of a predetermined time from the restart, the capacitance is measured again without the aerosol particles 6 colliding with the structure 13, and the main controller 10 compares the measured capacitance value with the target capacitance value. The process is repeated until the target value is reached.
In order to prevent the aerosol particles 6 ejected from the nozzle 5 from colliding with the structure 13, instead of driving the XY stage 3 to move the structure 13 as described above, the gas cylinder 8 It is also possible to stop the gas transport to the aerosol generator 7.
[0025]
In addition, instead of changing the concentration of the aerosol ejected from the nozzle 5 by increasing the driving amount of the driving unit of the aerosol generator 7, the amount of gas conveyed from the gas cylinder 8 is changed to change the aerosol generator 7. The deposition height of the structure may be controlled by changing the aerosol concentration to be generated, or by changing the operation speed of the XY stage 3 or the number of times of movement thereof. Alternatively, only the completion of the fabrication of the structure 13 may be determined without changing the operation described above.
[0026]
FIG. 5 is an embodiment in which the conductive rubbers 14 are arranged in a grid pattern, and FIG. 6 is a view of the conductive rubbers 14 as viewed from A, that is, a plan view. As shown in the figure, the conductive rubbers 14 are arranged in a grid pattern, and the capacitance value is measured while switching the LCR meter to individual conductive rubbers, so that the in-plane distribution of the capacitance value of the structure 13 is obtained. That is, the variation can be evaluated.
[0027]
The measurement result of the capacitance value is sent as an electric signal to the main control device 10 shown in FIG. 1 to control the gas cylinder 8, the aerosol generator 7, and the XY stage controller 4.
[0028]
The measurement and control of the resistance value can be performed in the same manner as the measurement and control of the capacitance value.
[0029]
DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIG. 7 shows the relationship between the capacitance value of the alumina ceramic structure 13 formed on the aluminum base material 12 based on the present embodiment and the deposition height of the structure 13 measured by the surface roughness meter, that is, the film thickness. Show. Normally, in measuring the capacitance value of the structure 13, silver paste is generally used as an electrode, so that it was added as comparison data. The electrode area is φ4mm. The film thickness was controlled by the number of nozzle scans.
In this embodiment, 4817N manufactured by DuPont was used as the silver paste, S51 manufactured by Kinugawa Rubber Co., Ltd. was used as the conductive rubber, 3030 manufactured by DEKTAK was used as the surface roughness meter, and 4194A manufactured by Hewlett-Packard was used as the LCR meter.
[0030]
As can be seen from FIG. 7, the value was about 68% when the conductive rubber 14 was used as the electrode, as compared with the case where the silver paste was used as the electrode. This is considered to be due to the dispersion state of carbon, which is a conductive substance, dispersed near the surface of the conductive rubber 14. As shown in FIG. 8, when the capacitance value measured by the conductive rubber 14 is divided by 0.68 and corrected, the result is almost the same as the capacitance value measured by the silver paste.
[0031]
FIG. 9 shows the relationship between the film thickness measured by the surface roughness meter and the film thickness calculated from the measured capacitance value, and the film calculated from the capacitance value measured using silver paste as an electrode. It can be seen that the thickness has a one-to-one proportional relationship with the thickness measured by the surface roughness meter.
[0032]
FIG. 10 shows the result of calculating the film thickness after correcting the capacitance value measured with the conductive rubber 14 by 0.68 similarly to FIG. 8, and using the conductive rubber 14 as an electrode. It can be seen that the result obtained is almost the same as the result obtained when the silver paste is used as the electrode.
[0033]
【The invention's effect】
According to the present invention, it is possible to measure the capacitance value and / or the resistance value of a structure manufactured by the gas deposition method, so that the target capacitance value and / or the resistance value can be measured from another viewpoint. The deposition height can be controlled more accurately.
[Brief description of the drawings]
FIG. 1 is an overall schematic diagram of a structure manufacturing apparatus according to the present invention. FIG. 2 is a schematic diagram of a capacitance value measuring mechanism according to the present invention.
FIG. 3 is a schematic diagram of a capacitance value measuring mechanism according to the present invention;
FIG. 4 is a schematic diagram of a capacitance value measuring mechanism according to the present invention;
FIG. 5 is a schematic view of a capacitance value measuring mechanism according to the present invention, FIG.
FIG. 6 is a plan view of a conductive rubber electrode according to the present invention. FIG. 7 is a result 1 of an example according to the present invention.
FIG. 8 shows the result 2 of the example according to the present invention.
FIG. 9 shows a result 3 of the embodiment according to the present invention.
FIG. 10 shows the result 4 of the example according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Vacuum chamber 2 ... Vacuum pump 3 ... XY stage 4 ... XY stage controller 5 ... Nozzle 6 ... Aerosol particle 7 ... Aerosol generator 8 ... Gas cylinder 9 ... LCR meter 10 ... Main controller 11 ... Substrate holder 12 ... Substrate 13 ... Structure 14: conductive rubber 15: shutter for preventing powder adhesion 16: mechanism

Claims (12)

In a structure producing apparatus for producing a structure by causing aerosol particles in which fine particles are dispersed in a gas to collide with a substrate at a high speed, an aerosol generator, a nozzle for ejecting aerosol particles, and a contact with the structure to be produced. And an electrode for measuring a capacitance value and / or a resistance value of the structure. The structure manufacturing apparatus according to claim 1, wherein the electrode used for measuring the capacitance value and / or the resistance value includes a powder adhesion preventing mechanism for preventing adhesion of fine particles. The structure manufacturing apparatus according to claim 1, wherein the electrodes used for measuring the capacitance value and / or the resistance value are divided into two or more electrodes. The structure manufacturing apparatus according to any one of claims 1 to 3, wherein an electrode used for measuring the capacitance value and / or the resistance value is a conductive rubber. The measurement of the capacitance value and / or the resistance value is performed in a state where the aerosol particles ejected from the nozzle do not collide with a structure to be manufactured, The method according to any one of claims 1 to 4, wherein Structure manufacturing equipment. The structure producing apparatus according to claim 5, wherein when measuring the capacitance value and / or the resistance value, the injection of the aerosol particles from the nozzle is interrupted. The structure manufacturing apparatus according to any one of claims 1 to 6, wherein when measuring the capacitance value and / or the resistance value, an electrode used for measurement moves from a standby position to a measurement position. . 8. The apparatus according to claim 1, wherein the capacitance value and / or the resistance value are fed back to a control unit of a structure manufacturing apparatus, and an amount of fine particles supplied to the aerosol generator is adjusted. 9. The structure manufacturing apparatus according to the above. The said capacitance value and / or resistance value are fed back to the control part of a structure manufacturing apparatus, and the amount of the air injected from the said nozzle is adjusted, The Claim 1 characterized by the above-mentioned. Structure manufacturing equipment. 8. The apparatus according to claim 1, wherein the measured capacitance value and / or resistance value is fed back to a control unit of a structure manufacturing apparatus to adjust a scan speed of the nozzle and / or the substrate. 3. The structure manufacturing apparatus according to item 1. The said capacitance value and / or resistance value are fed back to the control part of a structure manufacturing apparatus, and the number of scans of the said nozzle and / or the said board | substrate is adjusted, The Claim 1 characterized by the above-mentioned. Structure manufacturing equipment. The capacitance value and / or the resistance value are fed back to the control unit of the structure producing apparatus, and the production of the structure is terminated when the capacitance value and / or the resistance value reaches a predetermined value. The structure manufacturing apparatus according to claim 1.

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