JP2004273155A - Rotary electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rotary electrical component in which the sliding lifetime of a slider can be prolonged at a low cost. <P>SOLUTION: The conductive part 3 of a fixed contact side is crystalline Ni-plated, and its surface is further Ag-plated. The surface of a sliding part 5a of a movable contact side is amorphous Ni-P-plated or Ni-B-plated, and its surface is further amorphous Pd-P-plated. Since the amorphous Pd-P-plating of the movable contact side is harder in hardness than the Ag-plating of the fixed contact side, the sliding lifetime of the slider 5a can be prolonged. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【００３９】
表１は、上記回転型電気部品１の前記筐体２の底部２ｃの直径φをφ＝２０ｍｍとして回転体４を回転させた場合に、前記摺動子５ａ，５ｂ，５ｃの摩耗の程度から見た摺動寿命を回転体４の周回数で示したものである。
【００４０】
表１では、摺動子の摺動寿命が１０万回以下のものを×印（不可）、１０万回を超えて４０万回以下のものを△印（可）、４０万回を超えて８０万回以下のものを○印（良）、８０万回を超えるものを◎印（優）として判定している。なお、表１には摺動子の下地メッキ（第２の下地層５Ｂ）にＮｉメッキを膜厚１．０〜２．０μｍで施し、これに表層メッキ（第２の表面層５Ｃ）として非晶質のＰｄ−ＰメッキまたはＡｇメッキを施したものを比較例として掲載してある。
【００４１】
表１に示すように、摺動子５ａ，５ｂ，５ｃの下地メッキ（第２の下地層５Ｂ）が膜厚（メッキ厚）１．０μｍ以上３．０μｍ以下のＮｉ−Ｂメッキとした場合には、表層メッキ（第２の表面層５Ｃ）としてＰｄ−ＰメッキおよびＡｇメッキのいずれを使用した場合であっても摺動子の摺動寿命を６０万回以上と長くできることがわかる。また下地メッキ（第２の下地層５Ｂ）を膜厚１．０μｍ以上３．０μｍ以下のＮｉ−Ｐメッキとした場合であっても、Ｎｉ−Ｂメッキほどではないが、摺動寿命を３０万回以上とすることができる。
【００４２】
これらのことは、非晶質Ｎｉ−Ｂの硬度は、ビッカース硬度が８００ＨＶと非晶質Ｎｉ−Ｐの硬度（ビッカース硬度５００〜５５０ＨＶ）よりも高いため、非晶質Ｎｉ−Ｂを使用した方が摺動寿命をさらに延ばすことが可能であることを示している。また摺動寿命は、直接導電部３と接触する第２の表面層５Ｃの材質にも影響を与えられるが、これを支える第２の下地層５Ｂの影響が大きいことがわかる。
【００４３】
そして、固定接点側である導電部３の第１の表面層３Ｃを比較的安価で柔らかいＡｇメッキで形成し、この表面を摺動する可動接点側の摺動子５ａ，５ｂ，５ｃの表層メッキ（第２の表面層５Ｃ）をそれよりも硬度の硬い非晶質Ｐｄ−Ｐメッキで形成することにより、低コストで長寿命化を図ることが可能となっている。すなわち、回転体４を回転させることに伴なって、常時接していない固定接点側の導電部３ａ，３ｂ，３ｃを比較的柔らかくい材料で形成し、常時摺動する可動接点側の摺動子５ａ，５ｂ，５ｃの方を、上記実施の形態に示すように硬い材料で形成しているので、両者の削れを抑えることができ、衝動寿命を向上させることができる。
【００４４】
また可動接点側の摺動子５ａ，５ｂ，５ｃの表層メッキ（第２の表面層５Ｃ）を非晶質Ｐｄ−Ｐメッキとした場合には、前記固定接点側の導電部３の第１の表面層３Ｃを形成するＡｇメッキとは金属の材質を異ならせることができるため、両者の間に凝着が生じるのを防止できる。
【００４５】
なお、摺動子５ａ，５ｂ，５ｃの表層メッキ（第２の表面層５Ｃ）をＡｇメッキで形成すると、導電部３の第１の表面層３Ｃと同種の金属となるため、摺動子５ａ，５ｂ，５ｃと導電部３との間に凝着が生じやすくなる。しかし、その場合であっても摺動子５ａ，５ｂ，５ｃの下地メッキ（第２の下地層５Ｂ）を非晶質Ｎｉ−Ｂメッキまたは非晶質Ｎｉ−Ｐメッキで形成しておくと、摺動子５ａ，５ｂ，５ｃの摺動寿命を延ばすことが可能である。
【００４６】
さらに、非晶質Ｐｄ−Ｐは酸化しにくいため、摺動時の接触抵抗を低くできる。
【００４７】
上記においては、非晶質Ｎｉ−ＢメッキのＢの含有率を０．１〜１．０ｗｔ％としたが、０．１ｗｔ％以上とした場合には下地メッキが柔らかくなるのを防止できるため、この下地メッキとともに表層メッキが削れて摺動寿命が短くなるのを回避できる。また１．０ｗｔ％以下としたため、摺動子５ａ，５ｂ，５ｃの導電抵抗を低下させることが可能である。
【００４８】
また上記実施の形態では、非晶質Ｐｄ−ＰメッキのＰの含有率を２．０ｗｔ％以上としたため、Ｐｄ−Ｐメッキの硬度を確保することができる。また５．０ｗｔ％以下としたため、Ｐｄ−Ｐメッキの導電性も確保できる。
【００４９】
しかも、この実施の形態では、可動接点側の表層メッキ（第２の表面層５Ｃ）の下に下地メッキ（第２の下地層５Ｂ）としてＮｉ−ＰメッキまたはＮｉ―Ｂメッキを介在させた構成としたため、表層メッキであるＰｄ−ＰメッキまたはＡｇメッキの膜厚を必要以上に厚く形成する必要がない。よって、材料費として値段の高いＰｄやＡｇの使用量を抑えることができるため、製造コストを低減することが可能となる。
【００５０】
また、この様に第１，第２の下地層３Ｂ，５Ｂを設けて、それをＮｉ系の材料で形成しているので、第１，第２の導電体３Ａ，５Ａがリン青銅、洋白、ベリリウム銅等の銅合金であっても、銅酸化物がＡｇあるいはＰｄ−Ｐの表面にまで至ることはなく、よって接触の信頼性を向上させることができる。
【００５１】
【発明の効果】
以上のように本発明では、摺動子の電気的・機械的な摺動寿命を延ばすことが可能な回転型電気部品を低コストで提供できる。
【００５２】
また摺動子と被摺動体との間の接触抵抗や導電抵抗を低減することも可能となる。
【図面の簡単な説明】
【図１】本発明の実施の形態として回転型電気部品の主要部の分解斜視図、
【図２】回転型電気部品の筺体と回転体とを示す図１のＡ−Ａ線における断面図、
【図３】図１のＢ方向からの矢視平面図、
【図４】本発明の主要部を示し、可動接点である摺動子と固定接点である導体部との拡大断面図、
【符号の説明】
１ 回転型電子部品
２ 筐体
２ｃ 底部
３，３ａ，３ｂ，３ｃ 導電部（固定接点）
３ａ１，３ｂ１，３ｃ１ 端子部
３Ａ 導電性金属板（第１の導電体）
３Ｂ 第１の下地層
３Ｃ 第１の表面層
４ 回転体
５ 板バネ
５Ａ 導電性金属（第２の導電体）
５Ｂ 第２の下地層（下地メッキ）
５Ｃ 第２の表面層（表層メッキ）
５ａ，５ｂ，５ｃ 摺動子（可動接点）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a rotary electrical component in which a movable contact slides on a fixed contact, and more particularly to a rotary electrical component capable of extending the electrical and mechanical sliding life at low cost.
[0002]
[Prior art]
As a related art related to this kind of invention, there is one described in Patent Document 1, for example.
[0003]
In Patent Document 1, by forming an amorphous plating layer in which the surfaces of a sliding body and a sliding body are made of an amorphous film containing 15 to 25 atomic% of phosphorus of a Ni-P alloy, An invention relating to an electric component for automobiles in which abrasion resistance and corrosion resistance of a slidable body are improved and electric and mechanical sliding life is extended is described.
[0004]
Patent Document 1 describes that an amorphous plating layer is formed on the sliding body side. When an amorphous plating layer is formed on the sliding body side, the amorphous plating layer is formed on the brush itself. It is stated that it should be done.
[0005]
[Patent Document 1]
Japanese Patent Publication No. 6-14482
[Problems to be solved by the invention]
However, if the surfaces of the sliding body and the sliding body are made of the same type of amorphous plating, there is a problem that the two are likely to be falsely attached. Moreover, although the amorphous Ni-P plating itself is hard, when the same kind of metal slides with each other, the strength cannot be sufficiently exhibited. There is a problem that the sliding life is likely to be short.
[0007]
Further, since the surface of the plating layer containing Ni is easily oxidized, there is a problem that the contact resistance is likely to increase.
[0008]
Furthermore, the method described in Patent Document 1 has a problem that the conductive resistance is high because the phosphorus content is as high as 15 atomic% or more, that is, 8.5 wt% or more.
[0009]
The present invention has been made to solve the above-mentioned conventional problems, and is intended for a rotary electric component in which a slider (movable contact) slides on the surface of a body to be slid (fixed contact). It is an object of the present invention to provide a rotary electric component capable of improving the sliding property and extending the sliding life at low cost.
[0010]
[Means for Solving the Problems]
The present invention provides a fixed contact having a first protective layer formed on a surface of a first conductor, a second protective layer on a surface of a second conductor, and a surface of the first protective layer. And a movable contact that slides
The first protective layer is formed of a first underlayer made of crystalline Ni, and a first surface layer having a surface of the first underlayer plated with Ag; The second protection layer is formed of a second underlayer made of amorphous plating containing Ni and a conductive second surface layer provided on the surface of the second underlayer. It is a feature.
[0011]
In the above, it is preferable that the amorphous plating of the second underlayer is formed by Ni-P plating or Ni-B plating, and the second surface layer is formed by amorphous Pd-P plating. Alternatively, those formed by Ag plating are preferable.
[0012]
Further, it is preferable that the first underlayer is formed of Ni plating or a Ni clad material.
[0013]
The second conductor is formed of any one of phosphor bronze, nickel silver, and beryllium copper.
[0014]
Further, as described above, the Ni-P plating preferably has a P content of 8 wt% to 10 wt% and a film thickness of 1.0 μm to 3.0 μm. The Ni-B plating preferably has a B content of 0.1 wt% or more and 1.0 wt% or less, and a film thickness of 0.1 µm or more and 3.0 µm or less, particularly preferably 1.0 µm or more and 3 µm or less. 0.0 μm or less is more preferable.
[0015]
Further, the Pd-P plating preferably has a P content of 2.0 wt% or more and 5.0 wt% or less and a film thickness of 0.5 μm or more and 1.0 μm or less.
[0016]
Alternatively, the thickness of the Ag plating forming the second surface layer is 1.0 μm or more and 2.0 μm or less.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is an exploded perspective view of a main part of a rotary electric component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 showing a housing and a rotary body of the rotary electric component. 1 is a plan view taken in the direction of arrow B in FIG. 1. FIG. 4 is an enlarged cross-sectional view showing a main part of the present invention, showing a slider as a movable contact and a conductor as a fixed contact.
[0018]
A rotary electric component 1 shown in FIG. 1 is a rotary encoder, and has a housing 2 made of a synthetic resin molded product as an insulating material and a rotating body 4 made of a synthetic resin molded product.
[0019]
At the center of the housing 2, there is provided a cylindrical tubular portion 2b having a hollow portion 2a penetrating vertically in the figure. Further, a bottom 2c extending radially outward from the base of the cylindrical portion 2b is provided, and a square side 2d extending upward from the outer periphery of the bottom 2c is integrally formed. The bottom portion 2c forms a ring-shaped storage portion including a concave portion formed between the side portion 2d and the cylindrical portion 2b.
[0020]
As shown in FIGS. 2 and 3, a conductive portion (fixed contact) 3 (individually indicated by 3 a, 3 b, 3 c) is provided in a bottom portion 2 c of the housing 2 in a buried state. The conductive portion 3a has an arc shape, and a part of the conductive portion 3a protrudes outward from the side portion 2d and forms a terminal portion 3a1 bent downward. In FIG. 3, the conductive portion 3b is formed from four islands formed intermittently at predetermined intervals in the circumferential direction in the bottom portion 2c. The individual conductive portions 3b are electrically connected at portions buried in the bottom portion 2c and are all set to the same potential. A part of the conductive portion 3b forms a terminal portion 3b1 which is projected outward from the side portion 2d and bent downward at a position adjacent to the left of the terminal portion 3a1. Similarly, the conductive portion 3c is also formed of four islands electrically connected to the inside of the bottom portion 2c, and a part thereof is located on the right side of the terminal portion 3a1 and outside the side portion 2d. A protruding terminal portion 3c1 is formed.
[0021]
On the other hand, as shown in FIGS. 1 and 2, a cylindrical shaft 4a is provided at the center of the rotating body 4, and a ring-shaped flange 4b is formed around the base of the shaft 4a. I have. An uneven portion 4c is formed on the surface of the flange portion 4b, and a plurality of convex portions 4d projecting downward in the drawing are formed on the bottom surface of the flange portion 4b as shown in FIG.
[0022]
As shown in FIG. 2, a metal leaf spring 5 formed in a ring shape is provided below the flange portion 4b. The leaf spring 5 is integrally attached to the bottom surface of the rotating body 4 by, for example, thermally caulking the tips of the plurality of projections 4d. On the lower surface of the leaf spring 5, three sliders (movable contacts) 5a, 5b, and 5c (5c are not shown) that protrude downward in the figure are formed by press working or the like. The three sliders 5a, 5b, 5c are formed on the bottom surface of the ring-shaped leaf spring 5 at a predetermined center angle.
[0023]
In the rotating body 4 provided with the leaf spring 5, the cylindrical portion 2b of the housing 2 is inserted into the shaft portion 4a, and the flange portion 4b and the leaf spring 5 are housed in the bottom portion 2c. On the other hand, it can be freely rotated. The sliders 5a, 5b, and 5c press the bottom 2c by the elastic force of the leaf spring 5.
[0024]
At this time, any one of the sliders 5a, 5b, and 5c contacts the conductive portion 3a, and one of the remaining two sliders is any one of the conductive portions 3b or 3c. The other slider comes into contact with the island and the bottom 2c between the islands forming the conductive portion 3b or 3c.
[0025]
For example, when the slider 5a is in contact with the conductive portion 3a and the slider 5b is in contact with any island of the conductive portion 3b, the remaining sliders 5c are connected to the islands forming the conductive portion 3c. Are located at the bottom 2c, which is a non-conductive portion between them. When the rotating body 4 is slightly rotated, for example, clockwise, the contact state between the slider 5a and the conductive portion 3a is maintained, but one of the sliders 5b is connected to the island forming the conductive portion 3b. It reaches the bottom 2c between the islands, and the other slider 5c comes into contact with one of the islands forming the conductive portion 3c. Then, when the rotating body 4 is further rotated clockwise and the slider 5a tries to come off from the conductive portion 3a, the slider 5c comes into contact with the conductive portion 3a, and the conductive portion 3a Is kept in contact with any one of the sliders 5a, 5b, and 5c, and the other two sliders maintain the above relationship.
[0026]
That is, when the rotating body 4 is rotated clockwise or counterclockwise, any one of the sliders contacting the conductive part 3b and one of the sliders contacting the conductive part 3c are rotated. A phase difference is generated between the child and the child.
[0027]
Therefore, when the terminal 3a1 is grounded to a ground potential as a common electrode and a predetermined voltage is applied to the remaining terminals 3b1 and 3c1, the rotating body 4 is moved clockwise or counterclockwise. When rotated, pulse signals having different phases are output from the terminal portions 3b1 and 3c1. Then, from the pulse signal output from the terminal 3b1 and the pulse signal output from the terminal 3c1, the rotation direction and the rotation speed of the rotating body 4 can be detected.
[0028]
Next, the relationship between the slider (movable contact) and the conductive portion (fixed contact) will be described. As shown in FIG. 4, the conductive portion 3 (conductive portion 3a, 3b, 3c), which is a fixed contact, is formed from a conductive metal plate (first conductor) 3A such as phosphor bronze, nickel silver or the like. . A first underlayer 3B is formed on the surface of the conductive metal plate 3A, and a first surface layer 3C is formed on the surface. The first underlayer 3B and the first surface layer 3C function as a first protective layer for protecting the surface of the conductive metal plate 3A.
[0029]
The first underlayer 3B is intended to prevent oxidation or sulfidation or intergranular corrosion of the conductive metal plate 3A. For example, Ni is electrochemically deposited on the surface of the conductive metal plate 3A. This is crystalline Ni plating formed by an electroplating method (electrodeposition). Alternatively, it may be formed of a Ni clad material formed by laminating a thin Ni flat plate by pressure bonding or rolling. The first surface layer 3C is intended to prevent oxidation of the surface of Ni forming the first underlayer 3B, and is, for example, Ag plating formed by an electroplating method.
[0030]
On the other hand, the sliders 5a, 5b, 5c (only the slider 5a in FIG. 4), which are movable contacts, include at least copper and a metal having a spring property, for example, phosphor bronze, nickel silver, beryllium copper or the like. It is formed from a conductive metal (second conductor) 5A. A second base layer (base plating) 5B is formed on the surface of the conductive metal 5A, and a second surface layer (surface plating) 5C is formed on the surface. The second underlayer 5B and the second surface layer 5C function as a second protective layer for protecting the surface of the conductive metal 5A.
[0031]
The second underlayer 5B on the movable contact (slider) side is obtained by subjecting the surface of the conductive metal 5A to amorphous Ni-P plating or Ni-B plating in an electroless plating bath described below. It is.
[0032]
That is, the electroless plating bath for performing the Ni-P plating is an aqueous solution containing nickel sulfate (30 g / liter), sodium phosphinate (10 g / liter), sodium acetate (10 g / liter), and a pH adjuster (appropriate amount). (PH = 4 to 6, 90 ° C.), and an amorphous coating of a Ni—P alloy containing phosphorus (P) in a range of 8 wt% or more and 10 wt% or less is formed on the surface of the conductive metal 5A by a predetermined amount. It was deposited with a film thickness (see Table 1).
[0033]
The electroless plating bath for Ni-B plating includes nickel sulfate (30 g / liter), sodium malonate (34 g / liter), boric acid (30 g / liter), ammonium chloride (30 g / liter), dimethylamine borane. (3.4 g / liter) and an aqueous solution (pH = 5-7, 60 ° C.) containing a pH adjuster (suitable amount), and 0.1 wt% or more and 1.0 wt% or less on the surface of the conductive metal 5A. An amorphous film of a Ni-B alloy containing boron (B) in a range is deposited at a predetermined thickness (see Table 1).
[0034]
On the other hand, the second surface layer 5C on the movable contact (slider) side is formed by applying amorphous Pd-P plating to the surface of the second underlayer 5B (underlayer plating) using an electroless plating bath described below. It is formed or plated with Ag.
[0035]
That is, the electroless plating bath for applying amorphous Pd-P plating is composed of palladium chloride (0.01 mol / l), ethylenediamine (0.08 mol / l), and sodium phosphinate (0.06 mol / l). And an aqueous solution (pH = 6-8, 50 ° C.) containing thiodiglycolic acid (0.03 g / liter) and a pH adjuster (appropriate amount), and the surface of the second underlayer 5B is 2 wt% to 5 wt%. % Of an amorphous coating of a Pd-P alloy containing phosphorus (P) in a range of not more than 0.5 μm and not more than 1.0 μm.
[0036]
When the second surface layer 5C is made of Ag plating, a direct current or a pulse current is applied to an electrolyte containing silver ions or silver complex ions (electroplating method), and the surface of the second underlayer 5B serving as a cathode is formed. In this case, crystalline metallic silver is deposited in a range of 1.0 μm to 2.0 μm in thickness.
[0037]
Table 1 shows the results of the wear resistance test of the movable contact and the fixed contact generated by the above method.
[0038]
[Table 1]

[0039]
Table 1 shows the degree of wear of the sliders 5a, 5b, and 5c when the rotating body 4 is rotated when the diameter φ of the bottom 2c of the housing 2 of the rotary electric component 1 is φ = 20 mm. The observed sliding life is shown by the number of rotations of the rotating body 4.
[0040]
In Table 1, those with a sliding life of 100,000 times or less are marked with a cross (impossible), those with a sliding life of more than 100,000 times and less than 400,000 times are marked with a △ mark (acceptable), and those with a sliding life of more than 400,000 times. A sample of 800,000 times or less was judged as 印 (good), and a sample exceeding 800,000 times was judged as ◎ (excellent). In Table 1, Ni plating is applied to the base plate (second base layer 5B) of the slider with a film thickness of 1.0 to 2.0 μm, and non-plated as a surface layer (second surface layer 5C). Those subjected to crystalline Pd-P plating or Ag plating are described as comparative examples.
[0041]
As shown in Table 1, when the base plating (second base layer 5B) of the sliders 5a, 5b, and 5c is Ni-B plating having a thickness (plating thickness) of 1.0 μm or more and 3.0 μm or less. Indicates that the sliding life of the slider can be extended to 600,000 times or more regardless of whether Pd-P plating or Ag plating is used as the surface layer plating (second surface layer 5C). Further, even when the undercoating (second underlayer 5B) is Ni-P plating having a film thickness of 1.0 μm or more and 3.0 μm or less, the sliding life is 300,000, although not as much as Ni-B plating. More than once.
[0042]
These facts indicate that amorphous Ni-B has a Vickers hardness of 800 HV, which is higher than the hardness of amorphous Ni-P (Vickers hardness of 500 to 550 HV). Indicate that the sliding life can be further extended. The sliding life is also affected by the material of the second surface layer 5C which is in direct contact with the conductive portion 3, but it can be seen that the effect of the second underlayer 5B supporting this is large.
[0043]
Then, the first surface layer 3C of the conductive portion 3 on the fixed contact side is formed by relatively inexpensive and soft Ag plating, and the surface plating of the sliders 5a, 5b, 5c on the movable contact side sliding on the surface. By forming the (second surface layer 5C) by amorphous Pd-P plating having a higher hardness, long life can be achieved at low cost. That is, as the rotating body 4 is rotated, the conductive portions 3a, 3b, 3c on the fixed contact side, which are not always in contact, are formed of a relatively soft material, and the slider on the movable contact side that always slides. Since 5a, 5b, and 5c are formed of a hard material as described in the above embodiment, the scraping of both can be suppressed, and the impulse life can be improved.
[0044]
When the surface plating (second surface layer 5C) of the sliders 5a, 5b, 5c on the movable contact side is made of amorphous Pd-P plating, the first conductive portion 3 on the fixed contact side is used. Since the material of the metal can be different from that of the Ag plating forming the surface layer 3C, it is possible to prevent adhesion between the two.
[0045]
If the surface plating (second surface layer 5C) of the sliders 5a, 5b, 5c is formed by Ag plating, the same kind of metal as the first surface layer 3C of the conductive portion 3 is used. , 5b, 5c and the conductive portion 3 are likely to adhere. However, even in this case, if the base plating (second base layer 5B) of the sliders 5a, 5b, 5c is formed by amorphous Ni-B plating or amorphous Ni-P plating, The sliding life of the sliders 5a, 5b, 5c can be extended.
[0046]
Further, since amorphous Pd-P hardly oxidizes, the contact resistance during sliding can be reduced.
[0047]
In the above description, the content of B in the amorphous Ni-B plating is set to 0.1 to 1.0 wt%. However, when the content is set to 0.1 wt% or more, the base plating can be prevented from becoming soft. It can be avoided that the surface plating is scraped together with the base plating to shorten the sliding life. Further, since the content is set to 1.0 wt% or less, the conductive resistance of the sliders 5a, 5b, 5c can be reduced.
[0048]
In the above embodiment, the P content of the amorphous Pd-P plating is set to 2.0 wt% or more, so that the hardness of the Pd-P plating can be secured. Also, since the content is 5.0 wt% or less, the conductivity of Pd-P plating can be secured.
[0049]
In addition, in this embodiment, a structure in which Ni-P plating or Ni-B plating is interposed as base plating (second base layer 5B) under surface plating (second surface layer 5C) on the movable contact side. Therefore, it is not necessary to form the Pd-P plating or the Ag plating, which is the surface layer plating, thicker than necessary. Therefore, the amount of Pd or Ag, which is expensive as a material cost, can be suppressed, and the manufacturing cost can be reduced.
[0050]
Further, since the first and second underlayers 3B and 5B are provided and formed of a Ni-based material in this manner, the first and second conductors 3A and 5A are made of phosphor bronze or nickel silver. Even when using a copper alloy such as beryllium copper, the copper oxide does not reach the surface of Ag or Pd-P, so that the reliability of contact can be improved.
[0051]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a low cost rotary electric component capable of extending the electrical and mechanical sliding life of the slider.
[0052]
In addition, it is possible to reduce the contact resistance and the conductive resistance between the slider and the object to be slid.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a main part of a rotary electric component according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, showing a housing and a rotating body of the rotary electric component;
FIG. 3 is a plan view as viewed from a direction B in FIG. 1;
FIG. 4 is an enlarged cross-sectional view showing a main part of the present invention, showing a slider as a movable contact and a conductor as a fixed contact;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Rotary electronic component 2 Housing 2c Bottom part 3, 3a, 3b, 3c Conductive part (fixed contact)
3a1, 3b1, 3c1 Terminal portion 3A Conductive metal plate (first conductor)
3B First base layer 3C First surface layer 4 Rotating body 5 Leaf spring 5A Conductive metal (second conductor)
5B Second underlayer (underlayer plating)
5C Second surface layer (surface plating)
5a, 5b, 5c Slider (movable contact)

Claims (9)

A fixed contact having a first protective layer formed on a surface of a first conductor, and a second protective layer on a surface of a second conductor, and sliding on the surface of the first protective layer; A movable electrical contact, comprising:
The first protective layer is formed of a first underlayer made of crystalline Ni, and a first surface layer having a surface of the first underlayer plated with Ag; The second protection layer is formed of a second underlayer made of amorphous plating containing Ni and a conductive second surface layer provided on the surface of the second underlayer. Characterized rotary electric parts. The rotary electric component according to claim 1, wherein the amorphous plating of the second underlayer is formed by Ni-P plating or Ni-B plating. The rotary electric component according to claim 1, wherein the second surface layer is formed by amorphous Pd—P plating or Ag plating. 4. The rotary electric component according to claim 1, wherein said first underlayer is formed of Ni plating or Ni clad material. The rotary electric component according to any one of claims 1 to 4, wherein the second conductor is formed of any one of phosphor bronze, nickel silver, and beryllium copper. The rotary electric component according to claim 2, wherein the Ni-P plating has a P content of 8 wt% or more and 10 wt% or less and a film thickness of 1.0 µm or more and 3.0 µm or less. The rotary electric component according to claim 2, wherein the Ni-B plating has a B content of 0.1 wt% to 1.0 wt% and a film thickness of 0.1 µm to 3.0 µm. 4. The rotary electric component according to claim 3, wherein the Pd-P plating has a P content of 2.0 wt% or more and 5.0 wt% or less, and a film thickness of 0.5 μm or more and 1.0 μm or less. 5. 4. The rotary electric component according to claim 3, wherein the thickness of the Ag plating forming the second surface layer is 1.0 μm or more and 2.0 μm or less.

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