CN115474348A - Method for electroplating hard gold on circuit board - Google Patents
Method for electroplating hard gold on circuit board Download PDFInfo
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- CN115474348A CN115474348A CN202211033918.7A CN202211033918A CN115474348A CN 115474348 A CN115474348 A CN 115474348A CN 202211033918 A CN202211033918 A CN 202211033918A CN 115474348 A CN115474348 A CN 115474348A
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- commutator
- gold
- electroplating
- nickel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for electroplating hard gold on a circuit board, which comprises the following steps: the upper plate is used for uploading the commutator to an electroplating device; removing oil, namely removing rust-proof oil on the commutator; microetching, namely performing microetching on the whole current to clearly separate each metal layer; acid washing, namely, carrying out acid washing on the surface of the rectifier; electroplating nickel, namely electroplating a layer of nickel and nickel alloy on the surface of the commutator, wherein the current density control range is 16-20 amperes per square foot; performing gold activation, namely performing gold activation treatment on the surface of the commutator; plating thick gold, and performing gold plating treatment on the surface of the rectifier, wherein the current density control range is 6-10 amperes/square foot, and the gold plating amount is set to be 1-2.5g/L; a lower plate. By the arrangement, the wear resistance of the gold surface of the commutator segment is improved by controlling the current density range during nickel electroplating, the current density range during thick gold plating and the control of gold plating amount, so that the wear resistance requirement of the commutator segment of the mobile phone motor for vibrating for more than 10 ten thousand times can be met.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for electroplating hard gold on a circuit board.
Background
The mobile phone becomes an indispensable tool for modern mass life with unique lightness, convenience, rapidness and multiple functions, and is one of electronic products with the fastest popularization rate. The development and popularization of the 5G technology accelerate the coming pace of the smart phone era, and promote intellectualization to gradually move to the aspects of daily life of people. The vibration mode is a basic function of the mobile phone, and vibration reminding of incoming calls, information prompts, alarms, touch screens and the like under a mute condition is realized. The vibration function of the mobile phone is realized by a micro vibration motor. The mobile phone vibration motor comprises a shell and a rotating shaft arranged in the shell, wherein the rotating shaft is provided with a bearing and a bearing sleeve, and the shell is also internally provided with motor components such as magnetic steel, a coil, a commutator bar, a carbon brush table and the like. The commutator segments are part of the commutator, namely the commutator segments, a circle with 6 gaps is formed after copper sheets on a circuit board are etched, the motor is electrified to start the electric brushes to run, and the electric brushes are in contact with the commutator segments and rotate among the 6 commutator segments to realize vibration and sound with stable frequency and amplitude. The electric brush is made of alloy metal, and the Vickers hardness is 190 +/-30 HV. In order to realize the durability of the mobile phone, higher requirements are put forward on the quality of the vibration motor, the abrasion resistance of the gold surface of the commutator segment is most important, and if the hardness of the gold surface of the commutator segment does not reach the hardness of the electric brush, the metal layer of the commutator segment is worn out in a short time, so that the motor fails to work and stops vibration.
In the current circuit board manufacturing industry, the plated thick gold and the plated hard gold can only meet the wear resistance of about ten thousand times of abrasion brushing, and are far from the requirement of over ten thousand times of wear resistance required by a vibration motor of a mobile phone.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a method for electroplating hard gold on a circuit board, which meets the requirement of the abrasion resistance of a commutator bar of a mobile phone motor for vibrating for more than 10 ten thousand times.
The method for electroplating the hard gold on the circuit board comprises the following steps:
the upper plate is used for uploading the commutator to an electroplating device;
removing oil, namely removing rust preventive oil on the commutator by using an oil removing agent;
microetching, namely performing microetching on the commutator by using sodium persulfate and concentrated sulfuric acid to clearly separate metal layers;
pickling, wherein the surface of the rectifier is pickled by sulfamic acid;
the electronic nickel, electroplate a layer of nickel and nickel alloy on the surface of the said commutator, its current density control range is 16-20 ampere/square foot;
performing gold activation, namely performing gold activation treatment on the surface of the commutator through concentrated sulfuric acid;
plating thick gold, and performing gold plating treatment on the surface of the rectifier after the nickel layer is plated, wherein the current density control range is 6-10 amperes per square foot, and the gold plating amount is set to be 1-2.5g/L;
a lower plate.
The method for electroplating the hard gold on the circuit board, provided by the embodiment of the invention, has at least the following beneficial effects: the wear resistance of the gold surface of the commutator segment is improved by controlling the current density range during nickel plating, the current density range during thick gold plating and the control of gold plating amount, so that the wear resistance requirement of the commutator segment of the mobile phone motor for vibrating for more than 10 ten thousand times can be met.
According to some embodiments of the present invention, in the step of "putting on plate", the commutator includes 6 independent segments, a ring is formed at the center of the 6 segments after assembly, metal pieces are disposed on one side of the ring of the segments, and a gap between two adjacent metal pieces is 0.15mm.
According to some embodiments of the invention, 6 of the metal sheets are arranged in a circumferential array along the ring.
According to some embodiments of the invention, each of the commutator segments is provided with a wire, and the commutator segments are electrically connected with the gold leads through the wire.
According to some embodiments of the present invention, a pure water washing step is disposed between every two adjacent steps to remove the chemical remaining on the commutator.
According to some embodiments of the invention, the step of "mounting" further comprises the steps of:
and (3) cleaning, namely performing high-current cylinder dragging on the nickel cylinder for 2 hours.
According to some embodiments of the invention, the thickness of the nickel layer in the "electronickelling" step is 3 μm or more.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a commutator according to an embodiment of the present invention;
fig. 2 is a top view of the commutator shown in fig. 1.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If there is a description of first and second for the purpose of distinguishing technical features only, this is not to be understood as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 and 2, a method for electroplating hard gold on a circuit board according to an embodiment of the invention comprises the following steps:
the upper plate is used for uploading the commutator to an electroplating device;
removing oil, namely removing the anti-rust oil on the commutator 100 by using an oil removing agent, so as to avoid the influence of the anti-rust oil on a subsequent process;
microetching, namely performing microetching on the commutator 100 by using sodium persulfate and concentrated sulfuric acid to clearly separate metal layers;
pickling, namely pickling the surface of the commutator 100 by sulfamic acid;
electroplating nickel, namely electroplating a layer of nickel and nickel alloy on the surface of the commutator 100, controlling the current density within the range of 16-20 amperes per square foot, controlling the deposition rate of the nickel and carrying out production within the parameters so as to ensure that the nickel plating effect is optimal;
performing gold activation, namely performing gold activation treatment on the surface of the commutator 100 through concentrated sulfuric acid;
plating thick gold, performing gold plating treatment on the surface of the commutator 100 plated with the nickel layer, wherein the current density control range is 6-10 amperes per square foot, the gold plating amount is set to be 1-2.5g/L, and meanwhile, the deposition rate is controlled, and production is performed within the parameters so that the gold plating effect is optimal;
a lower plate.
It should be noted that, in the above-mentioned degreasing step, concentrated sulfuric acid is used, the dosage of degreasing agent and concentrated sulfuric acid is controlled at 40-60ml/L, in the microetching step, the microetching quantity is controlled at 0.5-1.2 μm, in the electronickelling step, besides the dosage parameters of nickel metal and nickel chloride, the dosage of boric acid and pH value are also controlled, in the thick gold plating step, the dosage of cobalt, pH value, specific gravity and dosage of light agent are also controlled, both the degreasing step and the microetching step are controlled at 25-32 ℃, the pickling step and the gold activation step are carried out at room temperature, the electronickelling step is controlled at 50-60 ℃, and the thick gold plating step is controlled at 33-37 ℃.
The method for electroplating the hard gold on the circuit board, provided by the embodiment of the invention, has at least the following beneficial effects: the wear resistance of the gold surface of the commutator segment is improved by controlling the current density range during nickel plating, the current density range during thick gold plating and the control of gold plating amount, so that the wear resistance requirement of the commutator segment of the mobile phone motor for vibrating for more than 10 ten thousand times can be met.
According to some embodiments of the present invention, referring to fig. 1 and 2, in the "plate up" step, the commutator includes 6 independent segments, a ring is formed at the center of the assembled 6 segments, a metal piece 110 is disposed on one side of the ring, and a gap between two adjacent metal pieces 110 is 0.15mm.
According to some embodiments of the present invention, referring to fig. 1 and 2,6 metal sheets 110 are arranged in a circumferential array along a circular ring.
According to some embodiments of the invention, each commutator segment is provided with a conducting wire, and the commutator segments are electrically connected with the gold lead wires through the conducting wires, so that each commutator segment obtains the same current when nickel and gold are plated, and the consistency of the gold surface hardness of each commutator segment is ensured.
According to some embodiments of the present invention, a pure water washing step is disposed between every two adjacent steps to remove the chemical remaining on the commutator.
According to some embodiments of the invention, the step of "putting on the plate" further comprises the steps of:
and a cleaning step, namely, carrying out large-current cylinder dragging on the nickel cylinder for 2 hours, so that the activity of the nickel cylinder of the electrolytic nickel can be ensured.
According to some embodiments of the invention, in the step of 'electrically nickel', the thickness of the nickel layer is more than or equal to 3 μm, the nickel layer is a carrier under the gold layer, the hardness of nickel is far greater than that of gold, and the wear resistance of the commutator segment is ensured by controlling the thickness of the nickel layer to be more than 3 μm.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (7)
1. A method for electroplating hard gold on a circuit board is characterized by comprising the following steps:
the upper plate is used for uploading the commutator to an electroplating device;
removing oil, namely removing the rust preventive oil on the commutator by using an oil removing agent;
microetching, namely performing microetching on the commutator by using sodium persulfate and concentrated sulfuric acid to clearly separate metal layers;
pickling, wherein the surface of the rectifier is pickled by sulfamic acid;
electroplating a layer of nickel and nickel alloy on the surface of the commutator, wherein the current density is controlled within the range of 16-20 amperes per square foot;
performing gold activation, namely performing gold activation treatment on the surface of the commutator through concentrated sulfuric acid;
plating thick gold, and performing gold plating treatment on the surface of the rectifier after the nickel layer is plated, wherein the current density control range is 6-10 amperes per square foot, and the gold plating amount is set to be 1-2.5g/L;
a lower plate.
2. The method for electroplating hard gold on the circuit board according to claim 1, wherein in the step of "mounting", the commutator comprises 6 independent commutator segments, a circular ring is formed at the center of the assembled 6 commutator segments, metal sheets are arranged on one side of the circular ring of the commutator segments, and the gap between every two adjacent metal sheets is 0.15mm.
3. A method as claimed in claim 2, wherein 6 of said metal sheets are arranged in a circumferential array along said circular ring.
4. A method for electroplating hard gold on a circuit board according to claim 3, wherein each commutator segment is provided with a lead wire, and the commutator segment is electrically connected with an electrogold lead wire through the lead wire.
5. A method for electroplating hard gold on a circuit board according to any one of claims 1 to 3, wherein a pure water washing step is provided between every two adjacent steps to remove the chemical solution remained on the commutator.
6. The method for electroplating hard gold on a circuit board according to claim 5, wherein the step of "mounting a board" further comprises the following steps:
and a cleaning step, namely carrying out large-current cylinder dragging on the nickel cylinder for 2 hours.
7. The method for electroplating hard gold on the circuit board as recited in claim 5, wherein in the step of "electroplating nickel", the thickness of the nickel layer is not less than 3 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211033918.7A CN115474348A (en) | 2022-08-26 | 2022-08-26 | Method for electroplating hard gold on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211033918.7A CN115474348A (en) | 2022-08-26 | 2022-08-26 | Method for electroplating hard gold on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115474348A true CN115474348A (en) | 2022-12-13 |
Family
ID=84369486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211033918.7A Pending CN115474348A (en) | 2022-08-26 | 2022-08-26 | Method for electroplating hard gold on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115474348A (en) |
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2022
- 2022-08-26 CN CN202211033918.7A patent/CN115474348A/en active Pending
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