JP2004268949A - Carrier tape for storing chip-shaped electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier tape for chip-shaped electronic components which is not wrinkled or crimped in a surface even when the tape is formed of a cardboard of sufficient thickness. <P>SOLUTION: The cardboard-made carrier tape has punched holes for storing chip-shaped electric components, and also has discontinuous parts substantially orthogonal to the flow direction. The discontinuous parts of the carrier tape are cut parts, embossed recessed parts or the like which are formed by cutting from the surface of one side. The cardboard is preferably a laminated paper sheet obtained by laminating two or more paper sheets to each other with adhesive, and discontinuous parts may be formed by intermittently laminating cut cardboard to each other during the laminating operation. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a carrier tape paper used for obtaining a taping package of a chip-shaped electronic component such as an IC or an LSI.
[0002]
[Prior art]
In order to achieve automatic production of various electronic devices, chip-type electronic components have been automatically mounted on circuit boards.
[0003]
In order to facilitate the handling of the electronic components in the process of automatic mounting of the chip-shaped electronic components, a taping package in which the individual chip-shaped electronic components are packaged in a tape-shaped carrier is used. 2. Description of the Related Art Automatic mounting is performed in which chip-shaped electronic components sequentially sent out in a body form are automatically mounted on a predetermined circuit board.
[0004]
The taping package used for automatic mounting of chip-shaped electronic components has plastic carrier tapes with recesses for accommodating chip-shaped electronic components at regular intervals and perforations for accommodating chip-like electronic components at regular intervals. After a predetermined chip-shaped electronic component is stored in the carrier tape paper thus obtained, the upper part thereof is covered with a surface film.
[0005]
The taping package containing the chip-shaped electronic components is transported in a reel shape, and in the process of using the electronic components, the surface film is continuously peeled off by an automatic machine, and the electronic components are automatically mounted in a predetermined place. Is done.
[0006]
As described above, there are two types of carrier tapes for chip-like electronic components: plastic tapes and paper tapes. Manufacturing costs, ease of handling due to the weight of the tape, ease of disposal after use, and charging In terms of prevention and the like, a paper carrier tape, that is, a carrier tape paper is superior.
[0007]
The carrier tape made of paper has a perforation for accommodating chip-shaped electronic components formed in a tape-shaped paperboard and accommodates chip-shaped electronic components in the perforations. Cannot be stored.
[0008]
In the case of a plastic carrier tape, if the depth of the recess for accommodating chip-shaped electronic components is set to 1 mm or more (molded deeper than the thickness of the raw tape), when the carrier tape is wound up, However, there are drawbacks such as the concave portion being crushed by the winding pressure, making it difficult to take out the chip-shaped electronic components from the carrier tape, but the material is expensive and the carrier tape is made using a large amount of material. Are manufactured.
In fact, thicker chip components are in some way transported in a separate manner so as to be fixed to a sheet or case.
[0009]
As described above, it is desirable that a paper tape can be used from various viewpoints, but paper having a thickness of 1.1 mm or more must be dried at a reduced speed in order to form a paper, resulting in poor productivity. It cannot be denied that it has the drawback.
For this reason, a method of bonding two sheets of paper has been proposed as a method for producing a thick paperboard with high productivity (see Patent Document 1).
[0010]
[Patent Document 1]
Japanese Patent No. 2904019.
[0011]
[Problems to be solved by the invention]
By the way, regardless of whether the paperboard is made as a single sheet or the bonded paperboard, the thicker the carrier tape paper, the more easily wrinkles are generated on the front and back surfaces of the paper when it is wound up. Likely to happen. When wrinkles and irregularities occur, the front film and the back film of the taping package tend to peel off, and the thickness of the carrier tape made of paperboard is stable at a maximum of about 1.1 mm. There was a limit.
Therefore, an object of the present invention is to provide a carrier tape for a chip-shaped electronic component that does not have wrinkles or irregularities on its surface even with a paperboard having a sufficient thickness.
[0012]
[Means for Solving the Problems]
In order to solve the above problems, the present invention employs the following configurations (1) to (10).
(1) A carrier tape made of paperboard having perforations for accommodating chip-shaped electronic components, wherein the carrier tape has discontinuous portions running in a direction substantially perpendicular to the flow direction. .
(2) The carrier tape for storing chip-shaped electronic components according to the invention (1), wherein the paperboard is a laminated paper obtained by laminating two or more papers with an adhesive.
(3) In the invention of the above (1) or (2), the discontinuous portion is a cut portion formed by inserting a blade from one surface to an intermediate portion in a thickness direction, and the chip-shaped electronic component housing is provided. For carrier tape.
(4) The carrier tape for accommodating a chip-shaped electronic component according to the invention (1) or (2), wherein the discontinuous portion is a concave portion formed by embossing a die from one surface.
(5) In the invention of the above (2), the discontinuous portion is formed by intermittently laminating a piece of paper cut to a certain length on one continuous piece of paper. Carrier tape for storing electronic components.
(6) The carrier tape for accommodating a chip-shaped electronic component according to the invention (5), wherein the adhesive for bonding is a heat-fusible resin.
(7) The carrier tape for accommodating a chip-shaped electronic component according to the invention (6), wherein the heat-meltable resin is a resin selected from polyethylene, ionomer, and modified polyethylene resin.
(8) In the above-mentioned invention (6) or (7), the bonding is performed by means selected from the group consisting of heat sealing, impulse sealing, and ultrasonic sealing. tape.
(9) A method of manufacturing the carrier tape according to the above (8), wherein the punching head adsorbs the punched paper and makes contact with the surface of the facing base paper facing the same time as the ultrasonic wave from the back side of the bonding base paper. A method for producing a carrier tape for accommodating a chip-shaped electronic component, characterized in that a head is transmitted and sealed, and one or more sheets of base paper are partially bonded and then perforated.
(10) A method of manufacturing the carrier tape according to the above (2) or (3), wherein the discontinuous portion is formed simultaneously with the formation of the perforations. Manufacturing method.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
<Material of paperboard>
The pulp constituting the carrier paperboard of the present invention is not particularly limited, and for example, chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, synthetic pulp and the like can be used. These pulps may be used alone or in combination of two or more.
The pulp may contain various additives as required, for example, sizing agents such as rosin, styrene / maleic acid, alkenyl succinic anhydride, and alkyl ketene dimer, polyacrylamides, oxidized starch, cationized starch, and urea phosphorus. Starches such as acid-esterified starch, paper strength agents such as polyvinyl alcohol and guar gum, drainage retention improvers such as polyamide, water-resistant agents such as polyamide polyamine epichlorohydrin, defoamers, fillers such as talc, dyes, etc. May be added.
[0014]
The basis weight of the paperboard used in the present invention is about 500 to 2000 g / m ² , and the thickness is about 0.7 to 2.8 mm. This is a case where the thickness is 1 mm or more. In order to produce the above-mentioned paperboard, it is general to use a multilayer papermaking of two or more layers as a papermaking method.
When thick paperboard is manufactured by ordinary multilayer papermaking, the speed of papermaking is significantly reduced. Therefore, as shown below, a method in which two papers that are separately manufactured are bonded with an adhesive is preferable.
[0015]
The method of bonding the two paperboards does not need to be particularly limited. For example, an adhesive may be applied, and after bonding, pressure bonding may be performed while heating and drying. As the adhesive, an adhesive used for ordinary paper bonding, such as a water-soluble polymer solution such as starch and polyvinyl alcohol, and an aqueous dispersion such as polyvinyl acetate and polyacrylate, can be used.
Also, a so-called extrusion lamination method in which a molten resin is supplied from an extrusion die between two sheets of paper may be used.
[0016]
In the case of laminating, the base paper of each layer can be selected from 0.5 mm to 1.5 mm as necessary, and by selecting the number of sheets of paper, it is equivalent to the plastic carrier tape or the chip storage part of the tape, or equivalent or more The thickness can be made, and the storage portion has strong rigidity in the paper and does not collapse. Therefore, unlike plastic, the storage portion such as a chip is not crushed by the winding pressure and the chip is not damaged.
<Discontinuous part formation>
[0017]
With the discontinuous portion of the present invention, when the paperboard is wound, the outer surface extends, and the inner surface is compressed, so as to prevent wrinkles and irregularities from occurring on the inner surface, from one side of the paperboard. It can be formed by forming a slit-shaped cut portion with a knife blade to half or more in the thickness direction.
Alternatively, it is preferable that the cutting blade is designed in a V-shape and the cross section after the cutting is a V-shaped cut portion. When this portion is wound around a small-diameter paper tube, it becomes a bending allowance. (See Fig. 1)
Alternatively, it may be formed by embossing with a linear convex. In the case of embossing in the present invention, the receiving side is a flat metal roll or a flat metal plate, and the paperboard surface on which the discontinuous portion is not formed must not impair the smoothness.
The embossing is also preferably carried out so that the mold penetrates to half or more of the thickness of the paper.
In both cases of the slit and the emboss, the thickness of the remaining portion of the paper below the discontinuous portion is preferably less than 1 mm, more preferably about 0.1 mm to 0.5 mm.
[0018]
The discontinuous portion may be formed on a wide paperboard before being slit in the width direction to form a tape. Alternatively, a discontinuous portion may be formed after slitting in a tape shape. The simplest and most rational method is to form a discontinuous portion at the same time as drilling. Further, the slits in the width direction may be simultaneously formed at that time.
[0019]
Another means for forming a discontinuous portion will be described.
The discontinuous portion may be formed by intermittently laminating paper cut to a certain length on one continuous paper. In this case, it is possible to perform intermittent bonding with wide paper and then slit in the width direction. However, for the following reasons, intermittent bonding after slitting to a narrow width (for example, 8 mm). It is preferred to do so.
That is, it is difficult to perform intermittent bonding with a liquid adhesive, and it is reasonable to bond two sheets of paper while heating and melting the hot-melt resin. Means such as heat sealing with a head or the like, impulse sealing, ultrasonic sealing, and the like are possible. In particular, the ultrasonic seal is preferable because the device is small in size. In an ultrasonic seal, it is necessary to concentrate energy on a narrow portion, and it is more reasonable to bond a strip of paperboard slit in the width direction than bonding in a wide state.
[0020]
As an example of intermittent bonding after slitting, two paperboard tapes of the same width are fed out, one of which is used as a base material (adhered side base paper) which is continuous paper, and the other is punched into a strip shape to a fixed length. And a method of bonding to the substrate. At that time, the punching head adsorbs the punched paper, and at the same time it comes into contact with the surface of the facing side of the base paper to be bonded, applies an ultrasonic head from the back side of the base side of the bonding side to transmit, seal, and intermittently bond. The method is preferred.
[0021]
In the intermittent bonding described above, it is necessary that a heat-fusible synthetic resin is previously laminated on one sheet of paper, and such a resin is preferably polyethylene, ionomer, modified polyethylene, or the like. The ionomer is a salt of ethylene and an unsaturated carboxylic acid, and the modified polyethylene is a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and acrylic acid or an acrylate, or the like.
[0022]
The discontinuous portions are preferably present at intervals of 10 to 100 mm in the paperboard flow direction (winding traveling direction). For example, the discontinuous portions may be formed between all adjacent chip storage holes. A discontinuous portion may be formed for every two to several tens of holes. In some cases, even in the hole itself, it is possible to form a discontinuous portion in the thickness direction from the bottom tape side.
[0023]
<How to use>
When mounting a chip-shaped electronic component on a base or the like, it is necessary to stably peel off the cover tape film of the taping package. Carrier tape paper for chip-shaped electronic components The peel strength varies in a hunting state, so that chips may pop out. In particular, as in the present invention, when the cut or embossed portion becomes a concave portion and is not substantially sealed, and only the surface of the carrier tape around the chip storing portion is sealed, when the peeled-off portion, the sealed portion and the non-sealed portion are intermittent. May be repeated, resulting in hunting-like peeling variation. However, since the chip used for the carrier tape of the present invention is relatively large and has little protrusion due to hunting, the following measures can be taken.
That is, the surface on which the discontinuous portion is formed seals the bottom tape. Since this bottom tape is generally very thin, about 0.03 to 0.1 mm, the bottom tape hangs on the cut v-shaped groove or the embossed groove side. Further, when cutting between the perforations, it is possible to design the cutting blade into a v-shape so that the cut end is slightly pushed in, and so on. After sealing the bottom tape, the IC chip is filled in the hole, and then the cover tape is sealed on the opposite side having a continuous flat surface. In this state, the sealing strength is stable even when the cover tape is peeled off by the IC chip mounting machine, so that the peeling strength does not become hunting. In any case, it is natural that the cover tape seal strength must be set lower than the seal strength of the slip sheet portion between the base papers.
[0024]
【Example】
Hereinafter, a specific configuration of the carrier tape paper of the chip-shaped electronic component of the present invention will be described based on examples.
[0025]
<Example 1>
A paperboard having a basis weight of 490 g / m ² (thickness: 0.6 mm) was selected on the base base paper side (back side), and was placed on an unreel stand of the interleaving, cutting and perforating in-line processing machine of the present invention. On the other hand, a processed paper obtained by melt-extruding and laminating an ionomer resin (thickness: 20 μm) on a paperboard having a basis weight of 730 g / m ² (thickness: 0.95 mm) is selected on the mating paper side (front side). It was hung on one unreel stand of the machine facing the base paper. While feeding these, the resin surface was heated with an infrared heater and cooled immediately after pressing, and the paper was interleaved.Then, without winding it up, it was guided to the perforated part, and the hole was punched with the convex blade for perforation. With a v-shaped cutting blade installed between the protruding blades, a base paper having a basis weight of 730 g / m ² (thickness 0.95 mm) between the perforated portions (portion not perforated) is cut at right angles to the flow direction, A v-shaped valley was formed simultaneously with the cutting, and a base paper having a basis weight of 490 g / m ² (thickness: 0.6 mm) was left as a continuous base paper without cutting. The slit to a predetermined width (10 mm) in the width direction was executed in the machine by additionally installing a cutting blade during the main cutting in the flow direction. As a result, a carrier tape of a chip-shaped electronic component having a thickness (perforated portion depth) of 1.57 mm was wound in a traverse shape on a 3.0-inch paper tube by inward winding.
This tape is hung on an IC microchip filling device so that IC chips can be inserted from the back side, the surface film is attached (bottom tape), the IC microchip is stored from the opening (perforation) on the back surface, and the back film is attached (cover tape) While forming a taping package through each of the steps (1) and (2), the taping package was wound around a 3-inch paper tube. The mounting on the board was performed while peeling off the cover tape (back film), but the cover tape sealing surface was sealed to a continuous smooth surface, so there was no hunting etc. at the time of peeling, and it could be executed without any problem .
[0026]
<Example 2>
A carrier tape was obtained in the same manner as in Example 1 except that the cutting blade was changed to a metal for embossing. The emboss depth was about 0.8 mm (the residual thickness of the embossed portion was about 0.7 mm). Similarly, practicality was not a problem at all.
[0027]
<Example 3>
A paperboard having a basis weight of 490 g / m ² (thickness: 0.6 mm) was selected as the (back side), and was placed on an unreel stand of a punching & interleaving and perforating in-line processing machine of the present invention. On the other hand, a processed paper obtained by melt-extruding and laminating an ionomer resin (thickness: 20 μm) on a paperboard having a basis weight of 730 g / m ² (thickness: 0.95 mm) is selected on the mating paper side (front side). It was hung on one unreel stand of the machine facing the base paper. While feeding them out, the processed paper on the side of the paper to be bonded was punched out by a length of 10 mm in the flow direction and sucked to prevent it from falling, and was pressed onto the base base paper. Immediately, one side of the base base paper was sealed with an ultrasonic sealer, and only the necessary portion was interleaved, and the interleaved portion was perforated. The interleaving was performed at intervals of 5 mm. Simultaneously with the perforation, slitting to a predetermined width (10 mm) in the width direction was performed in the machine by additionally installing a cutting blade in the flow direction. As a result, the carrier tape of the chip-shaped electronic component in which only the IC chip insertion portion had a thickness (depth) of 1.57 mm was traversely wound around a 3-inch paper tube. The processed paper (base weight: 730 g / m ² (thickness: 0.95 mm)) on the mating paper side was used in 2/3, saving about 30% and at the same time achieving cost reduction.
The tape is inserted into the IC microchip filling device so that the IC chip can be inserted from the back side of the tape, and the tape is passed through the steps of attaching the surface film (bottom tape), storing the IC microchip, and attaching the back film (cover tape). While forming the package, the taping package was wound around a 3-inch paper tube. Mounting to the board was performed while peeling off the backing film (cover tape), but it was feasible without any problems.
[0028]
【The invention's effect】
In the carrier tape of the chip-shaped electronic component of the present invention having the above configuration, when the tape is wound on a paper tube, the tape behaves like a thin paper with respect to expansion and contraction of the paper. There is no occurrence of emi, and there is no trouble of peeling off the surface film or the back surface film of the taping package after the chip is stored in the next step, and the chip-shaped electronic component falling off.
In other words, even when a shear stress is applied to the cut portion and the embossed portion between the layers of the bonded paper, the paper thickness of the cut residual portion and the embossed residual portion is already as thin as 1 mm or less. No wrinkles are formed on the inner paper layer which is close to the winding core when wound on the tube, and the perforations of the carrier tape are not uneven. That is, in the conventional thickened carrier tape paper, a non-uniform punched surface and a mistake in taking out the chip-shaped electronic component occurred, but in the carrier tape paper of the chip-shaped electronic component of the present invention having the above-described configuration, such a problem is caused. There is no uneven punching surface.
[0029]
Conventionally, when carrier tape paper with a thickness of more than 1.0 mm is traversed, the twisting force of the base paper acts at the reversal part of the traverse end, and when the base paper is stretched, a gentle curl occurs in the flow direction. There was a problem in practical use. However, in the present invention, the residual cutting portion and the residual embossed portion were already thin, having a thickness of 1 mm or less, and no such twisting trouble was observed.
25 to 50 m / min. By a paper machine with high fixed cost. When compared to the production of cardboard that makes paper at such a low speed, the total cost of bonded paper is much more advantageous. In addition, the "interleaf, cutting, and perforating in-line processing machine" that does not use an off-line interleaf laminating machine, and the "punching, interleaving, and perforating in-line processing machine" shorten one process, resulting in significant cost reduction. At the same time, it is possible to manufacture a paper carrier tape having a thickness equal to or more than that of a plastic carrier tape, which has been considered to be impossible in the past, and to accommodate a larger IC microchip (thickness of 1.5 mm or more), and The paper could be taken out smoothly and the range of use of the paper was greatly expanded.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view illustrating an embodiment of the present invention.

Claims (10)

A carrier tape for accommodating chip-shaped electronic components, wherein the carrier tape is made of paperboard and has perforations for accommodating chip-shaped electronic components, the discontinuous portions running in a direction substantially perpendicular to a flow direction. The carrier tape according to claim 1, wherein the paperboard is a laminated paper obtained by laminating two or more papers with an adhesive. The carrier tape for accommodating a chip-shaped electronic component according to claim 1, wherein the discontinuous portion is a cut portion formed by inserting a blade from one surface to an intermediate portion in a thickness direction. The carrier tape for accommodating a chip-shaped electronic component according to claim 1, wherein the discontinuous portion is a concave portion formed from one surface by an embossing die. 3. The carrier for accommodating a chip-shaped electronic component according to claim 2, wherein the discontinuous portion is formed by intermittently bonding a piece of paper cut to a predetermined length to one continuous piece of paper. tape. 6. The carrier tape for accommodating a chip-shaped electronic component according to claim 5, wherein the bonding adhesive is a resin that can be melted by heat. 7. The carrier tape according to claim 6, wherein the heat-fusible resin is a resin selected from polyethylene, ionomer, and modified polyethylene resin. 8. The carrier tape for accommodating chip-shaped electronic components according to claim 6, wherein the bonding is performed by a means selected from the group consisting of a heat seal, an impulse seal, and an ultrasonic seal. The punching head adsorbs the punched paper and contacts the surface of the base paper to be adhered to at the same time, and simultaneously applies an ultrasonic head from the back side of the base paper to be bonded to transmit and seal, and partially adheres one or more base papers. The method for producing a carrier tape for accommodating a chip-shaped electronic component according to claim 8, wherein the carrier tape is combined and then perforated. 4. The method according to claim 2, wherein the discontinuous portion is formed simultaneously with the formation of the perforations.

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