JP2004265992A - Manufacturing apparatus for composite structure object - Google Patents
Manufacturing apparatus for composite structure object Download PDFInfo
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- JP2004265992A JP2004265992A JP2003052866A JP2003052866A JP2004265992A JP 2004265992 A JP2004265992 A JP 2004265992A JP 2003052866 A JP2003052866 A JP 2003052866A JP 2003052866 A JP2003052866 A JP 2003052866A JP 2004265992 A JP2004265992 A JP 2004265992A
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【0001】
【発明の属する技術分野】
本発明は、微粒子を含むエアロゾルを基板に吹き付け、構造物を基板上に形成させることによって基板と構造物からなる複合構造物を製作するときに使用する複合物作製装置に関する。
【0002】
【従来の技術】
エアロゾルでポジション装置は、チャンバーなどの容器の中に基材、ノズル、粉体回収装置を配置した構造となっており、多くの場合真空ポンプなどを利用してチャンバー内を減圧環境とし、粉体をガス中に分散させたエアロゾルを発生させ、ノズルから高速で基板に衝突させ基材表面に構造物を生成する方法が提案されている。(例えば、特許文献1)
【0003】
【特許文献1】
特開2000−212766号公報
【0004】
【本発明が解決しようとする課題】
しかしながら上記構成では大型のチャンバーを必要とし、それに付属する高排気性能を有する大型真空ポンプなどの排気系装置を配置する必要がある。さらには基材が大型化した場合、チャンバーも基材にあわせ大型化する必要がある。また、バッチ処理を行なうため基板を頻繁にチャンバーから出し入れする場合は、生産性の向上に制限があるなどの問題点があげらる。
【0005】
本発明はエアロゾルデポジション法による複合構造物の作製を従来のような大型のチャンバーや大型の排気系を必要としないで可能とし、且つ生産性のスループットを大幅に向上させ、基板サイズを選ばずに製膜可能な複合構造物作製装置を提供することを目的とする。
【0006】
【課題を解決するための手段及び作用・効果】
本発明は上記課題を解決すべく、微粒子をガス中に分散させたエアロゾルを基板に衝突させ、前記基材表面に前記微粒子の構造材からなる構造物を形成させる複合構造物作製装置であって、その装置構成は前記基材表面と当接して閉じた空間を形成するパッドと、このパッドに固定され、エアロゾル発生装置によって発生した前記エアロゾルを前記基板へ導出するノズルと、前記パッドに設けられた開口と連通し、前記基板から跳ね返ったもしくは散逸した微粒子を吸引する微粒子回収機構とから構成される。
【0007】
このように本発明では基材とパッドで閉じた空間を構成するため、大型のチャンバーとが不要となりそれにあわせて微粒子回収機構の排気系の能力を落とせるため装置の大幅な小型化と簡略化が可能となる。また、製膜空間自体が小さいためガスの流れがみだれることなく回収機構に粉体を効率よく回収することができ、散逸する粉体の量を最小限に抑え粉体の使用効率を高めることが可能となる。さらには大型の基材を製膜する場合それには見合ったチャンバーが必要であったがそれが不要となり、大型の基材についても従来の装置構成と比較して小規な装置構成で製膜可能となる。
【0008】
また、閉じた空間内は微粒子回収機構により排気され、大気圧に対して常に負圧の状態を保っており、基材とパッドは差圧により密着することが可能である。その密着効果を高めるため、パッドと基材の接する部分には密着のための真空シールを設けることが望ましい。なお、パッドを凹凸面、半円面、球面、などの曲面に吸着可能な形状とし、ノズルを曲面駆動アクチュエータなどで駆動することにより基材が曲面であっても容易に製膜することが可能である。
【0009】
更に、真空にする空間が十分に小型化されているため製膜時のチャンバーの真空引きや製膜体の取り出し、メンテナンスなど、段取り時間が大幅に削減でき生産効率を大幅に高めることが可能である。しかも、基材を交換する際、基材をパッドに対し上下、もしくはパッドを基材に対し上下させて基材を容易に交換することが可能である。つまり、従来のようなチャンバーを大気開放して基材を取り出すなどの煩わしい工程無しに、基材を交換することが可能になる。基材を取り付ける際も同様の効果がある。これにより単層膜、多層膜に限らず、製膜の、スループットを高めることが可能である。
なお、閉ざされた空間内が負圧に引かれたとき、大気圧との圧力差でパッドがつぶれるのを防ぐよう、空間内部に補強を施した構成とすることで、パッドがつぶれない構造を採用すると良い。
【0010】
また、本発明は、前記パッドに固定されたノズルが、基材に対して移動することより基材表面に一定の面積で製膜、もしくはパターニング製膜可能とすることもできる。
【0011】
例えばパッドが基材に対し真空を保ったまま移動可能な場合には、パッドにアクチュエータなどを取り付け、基材に対してパッドを移動可能な構成とする。そして、パッドをノズルごと動かすことで、基板へは一定面積の製膜もしくはパターニング製膜可能がである。
なお、パッドを動かすことに代えて、若しくは、パッドを動かすことに加えて、基材を動かすようにしてもよい。
【0012】
また本発明は、基材に固定されたパッドに対しノズルが動く機構を備え、基材表面に一定の面積で製膜、もしくはパターニング製膜可能とすることもできる。
【0013】
以上のように、ノズルがパッドに対して移動できる構成とすることで、パッドの接触部もしくはシール部が基材に対して相対的に動かない場合でも一定面積の製膜もしくはパターニング製膜可能がとなる。
具体的な構成として、パッドに真空導入軸受けなどでノズルをパッド内に外部からとりこみ真空軸受けを介してノズルを動かす。例えば真空導入軸受けとして磁気カップリングなどを使用しても良い。
【0014】
また本発明は、パッド自体が変形することにより、パッドに固定されたノズルと基材が相対的に動く機構を備え、基材表面に一定の面積で製膜、もしくはパターニング製膜可能とすることもできる。
【0015】
このように、パッド自体が変形することで、パッドの接触部もしくはシール部が基材に対して相対的に動かない場合でも一定面積の製膜もしくはパターニング製膜可能がとなる。
具体的な構成として、パッドと基材の接触部もしくはシール部が相対的に動かない状態でパッドが変形することにより、パッドに固定されたノズルが基板に対して移動できるよう、パッドをウレタンゴムやその他柔らかいもので構成する。もしくは、パッドが機械的に変形するよう、パッドを真空対応のベローズなどで構成しリンク機構などで変形させパッドに固定されたノズルを動かし製膜するなどの方法がある。なお、この場合ノズルとパッドの接触部は固定されており、更にパッドにアクチュエータを固定する、もしくはノズルをパッド外部のアクチュエータなどに固定する構成であれば、手動もしくは自動で制御してノズルを動かすことで、基材表面に製膜する膜形状の自由度を向上させることも可能である。
【0016】
【発明の実施の形態】
以下、本発明の実施の形態を図面により詳細に説明する。図1は複合構造物作製装置のコンパクト製膜パッド複合構造物作製装置図である。装置は基材3、パッド2、ノズル1、微粒子回収機構8で構成される。パッドは開口部をもち、その開口部に基材を密着させることにより閉じた空間9を構成する。ノズル1の前段にはエアロゾルを供給するエアロゾル発生装置7が接続され、微粒子回収機構8内には真空ポンプなどの排気系が設置されている。
パッド2と基板3は接触部で気体の漏れが無いように真空対応のOリング、磁性流体シールもしくはその他のシール機構6で構成されており、微粒子回収機構8内の真空ポンプで排気を行なうことによりパッド2と基材3が密着する構造となっている。
【0017】
パッドとパッドの開口部の形状は製膜する基材の大きさや形状に合わせて製作することで多種多様な基材に対応できる。例えば12インチシリコンウエーハに製膜をする場合、φ300mmの開口部を持つパッドを用いることで前面に製膜が可能となる。液晶ディスプレイ用のガラスなど基材が大きい場合はパッドを大型化、もしくは複数個並べることにより対応可能である。本発明においては100×100mm程度の基材が生産効率上適切であり装置小型化の効果も大きい。
【0018】
本実施例の微粉体回収機構8内の真空ポンプにより空間9を減圧状態とし、次にエアロゾル発生装置7により、微粒子をガス中に分散させたエアロゾルを発生させる。発生したエアロゾルは管を通りノズル1に供給される。供給されたエアロゾルはノズル1内を通過しノズル先端よりエアロゾルビーム10として基材3とパッド2、ノズル1、微粉体回収機構8で構成された閉じた空間9に噴出される。噴射されたエアロゾルは基板3もしくは製膜体4に衝突し一部は製膜体4となる。製膜されず、跳ね返ったエアロゾルは再び空間9内を経由して開口5より取り込まれ微粉体回収機構8へと導かれ回収される。微粉体回収機構8内に吸引されたエアロゾルはサイクロン式やフィルター式などの粉体分離機構で回収することが望ましい。
【0019】
本発明でいうエアロゾルとは酸化アルミニウム、PZT、酸化亜鉛、酸化チタンなどの酸化物や、窒化珪素、窒化アルミ二ウムなどの窒化物やダイヤモンド、炭化珪素、炭化チタンなどの炭化物あるいはこれらの混合物や多元素の固溶体、チタン酸鉛、チタン酸ストロンチュウムなどの圧電性、焦電性セラミックスや半金属物質、半導体化合物などの脆性材料を窒素やヘリウム、アルゴンなどのガス中に分散させたものをいう。エアロゾルビームとはこれらのエアロゾルをガスと共に前記ノズル1より100〜400m/secの高速で噴出させたものをいう。
【0020】
次に図2に示すようにノズル21をアクチュエータ30に固定し、基板23とパッド22を相対的に動かすことにより一定面積の製膜や、パターニング製膜が可能となる。ノズルのパッドへの導入部は0リングなどにより真空シールされている。シール材としては真空対応のOリングや磁性流体シールなどを用いることができる。
この時パッド22が真空を保ったまま基材23に対して外力により無理なく移動もしくは摺動可能な場合、ノズル21、もしくはパッド22をアクチュエータ30などに固定し基材23に対し移動させることで一定面積の製膜もしくはパターニング製膜を行なうことができる。アクチュエータとしてはリニヤモータもしくは回転モータとボールネジの組み合わせなどの機構で動かしても良い。また、ノズルの位置決め精度や移動時の真直度を必要とする場合はTHK社製のLMガイドやクロスローラガイドなどを案内として使用しても良い。
【0021】
更には、シール部26を静圧軸受けとし、圧縮空気の流量を調整しパッド22が基材23に対して静圧効果により浮上することにより、パッド22と基材23が非接触で移動可能な機構とすることもできる。この場合の効果はパッド22と基材23が非接触で動かせるため、接触抵抗がほとんど無い。このため基材に対してパッドとノズルをスムーズ動かすことが可能となり、アクチュエータを小型化できる。さらには基材へのスクラッチなどダメージ無しで製膜可能となる。
【0022】
パッドを基板に対し移動もしくは摺動させるのが困難な場合、図2で示す様にパッド22が変形することで、ノズル21が基材に対して移動できる。この場合、パッド22をウレタンゴムやその他柔らかい材質で構成する。また、空間内29が負圧に引かれたとき、大気圧との圧力差でパッド22がつぶれるのを防ぐよう一定の方向には補強を施した構造を採用すると良い。補強の構造は金属などの支柱31を使い、リンク機構などでパッドが変形してノズルが動くようにすることが可能である。補強材はパッド内部もしくは外部に設定してもかまわない。
【0023】
もしくは機械的にパッドが変形できるよう、機構自体を工夫することもできる。つまり、パッドに機械的に可動する機構を付加しノズルと基材を相対的に動かす。例えば図3のように、真空対応のベローズ51などで可動部分を構成し、パッド42を変形させるなどの方法がある。真空対応のベローズ51は円筒型もしくは角型とし基材面に沿って前後左右に動ける構造をとることができる。真空ベローズの種類としてはなるべく動きが滑らかで大きなストロークの取れるものが望ましい。空間内49が負圧に引かれたとき、大気圧との圧力差でパッド42がつぶれるのを防ぐよう一定の方向には補強を施した構造を採用すると良い。補強材は金属などの支柱52を使い、リンク機構などでパッド42が変形してノズルを動くようにすることが可能である。補強材はパッド内部でも外部でもかまわない。
【0024】
また、ノズルと基材を相対的に動かすためにアクチュエータ50をノズル41もしくはパッド42に固定する。アクチュエータとしてリニヤモータもしくは回転モータとボールネジの組み合わせなどの機構で動かしても良い。または、入江工研株式会社製のベローズ式直線導入機や磁気結合導入機などを用い、ノズルを外部より動かすことも可能である。さらに、位置決め精度や真直度を必要とする場合はTHK社製のLMガイドやクロスローラガイドなどを案内として使用しても良い。この機構により、アクチュエータを手動もしくは自動で制御して、基材に製膜することが可能である。
【0025】
更に本実施例では基材をパッドに対し上下させる、もしくは基材に対しパッドを上下させてやることにより、基材の交換を容易にすばやく行なうことが可能である。多層膜を製膜する場合など基材の段取り時間を短縮し、スループットを早めることが可能である。
また、本発明では真空とする製膜空間も小型化されているため、微粒子回収機構内の真空ポンプ等排気系も小型のもので高いスループットが対応可能であり、更には装置コストを抑え、装置全体の小型化が可能である。
【0026】
本発明において、パッドやノズル、微粉体回収機構を加熱したり、静電気除去装置を設けることにより、粉体の付着を防ぎ、粉体の回収効率をさらに高めることもできる。
【0027】
【発明の効果】
上記のように、本発明によるコンパクト製膜パッド複合構造物作製装置を用いることにより、大型のチャンバーや排気系を必要とせず、基板サイズを選ばずに複合構造物の作製が可能となる。
【図面の簡単な説明】
【図1】本発明の1実施例のコンパクトパッドの構成図。
【図2】本発明の1実施例のコンパクトパッドゴムなどの材質の構想図。
【図3】本発明の1実施例のコンパクトパッドベローズタイプの構造図。
【符号の説明】
1,21,41…ノズル
2,22,42…パッド
3,23,43…基材
4,24,44…製膜体
5,25,45…開口
6,26,46…シール機構
7,27,47…エアロゾル発生装置
8,28,48…微粒子回収機構
30,50…アクチュエータ
31…支柱
51…ベローズ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a composite manufacturing apparatus used when a composite structure including a substrate and a structure is manufactured by spraying an aerosol containing fine particles onto a substrate and forming the structure on the substrate.
[0002]
[Prior art]
The aerosol position device has a structure in which a substrate, a nozzle, and a powder recovery device are placed in a container such as a chamber. A method has been proposed in which an aerosol in which is dispersed in a gas is generated, and a nozzle is made to collide with a substrate at a high speed to form a structure on the surface of the substrate. (For example, Patent Document 1)
[0003]
[Patent Document 1]
JP 2000-21766 A
[Problems to be solved by the present invention]
However, the above-described configuration requires a large-sized chamber, and it is necessary to arrange an exhaust system such as a large-sized vacuum pump having high exhaust performance attached thereto. Further, when the size of the substrate is increased, the size of the chamber needs to be increased according to the size of the substrate. In addition, when a substrate is frequently taken in and out of a chamber for performing a batch process, there is a problem in that improvement of productivity is limited.
[0005]
The present invention enables the production of a composite structure by the aerosol deposition method without requiring a large-sized chamber or a large-sized exhaust system as in the past, and greatly improves the throughput of productivity, regardless of the substrate size. It is an object of the present invention to provide a composite structure manufacturing apparatus capable of forming a film.
[0006]
[Means for Solving the Problems and Functions / Effects]
The present invention provides a composite structure manufacturing apparatus that solves the above-described problems by causing an aerosol in which fine particles are dispersed in a gas to collide with a substrate to form a structure including the fine particles on the substrate surface. The device configuration is provided on the pad, which is in contact with the surface of the base material to form a closed space, a nozzle fixed to the pad, and which guides the aerosol generated by an aerosol generating device to the substrate, and the pad. A fine particle collection mechanism that communicates with the opening and sucks fine particles that bounce off or dissipate from the substrate.
[0007]
As described above, in the present invention, since a space closed by the base material and the pad is configured, a large chamber is not required, and the capacity of the exhaust system of the fine particle collection mechanism can be reduced accordingly, thus significantly reducing the size and simplification of the apparatus. It becomes possible. In addition, since the film-forming space itself is small, the powder can be efficiently collected by the collection mechanism without losing gas flow, and the amount of powder that is dissipated can be minimized to increase the powder usage efficiency. It becomes possible. Furthermore, when forming a large base material, a chamber corresponding to that was necessary, but it was not necessary, and it is possible to form a large base material with a small equipment configuration compared to the conventional equipment configuration It becomes.
[0008]
Further, the inside of the closed space is evacuated by the particulate collection mechanism, and is always kept at a negative pressure with respect to the atmospheric pressure, so that the base material and the pad can be brought into close contact with each other by a differential pressure. In order to enhance the adhesion effect, it is desirable to provide a vacuum seal for adhesion at a portion where the pad and the substrate are in contact. In addition, it is possible to easily form a film even if the base material has a curved surface by driving the nozzle with a curved surface driving actuator etc. by making the pad a shape that can be attracted to a curved surface such as an uneven surface, a semicircular surface, a spherical surface, etc. It is.
[0009]
Furthermore, since the space to be evacuated is sufficiently small, setup time for evacuation of the chamber during film formation, removal of the film-forming body, maintenance, etc. can be greatly reduced, and production efficiency can be greatly increased. is there. Moreover, when exchanging the substrate, the substrate can be easily exchanged by moving the substrate up and down with respect to the pad or the pad with respect to the substrate. That is, the substrate can be replaced without a troublesome process such as taking out the substrate by opening the chamber to the atmosphere as in the related art. The same effect can be obtained when a base material is attached. This makes it possible to increase not only the single-layer film and the multilayer film but also the throughput of the film formation.
In addition, when a negative pressure is applied to the enclosed space, the pad is reinforced to prevent the pad from being crushed due to the pressure difference from the atmospheric pressure. Good to adopt.
[0010]
Further, according to the present invention, a nozzle fixed to the pad moves with respect to the base material so that a film can be formed on the surface of the base material with a certain area or a pattern can be formed.
[0011]
For example, when the pad can be moved with respect to the base material while maintaining a vacuum, an actuator or the like is attached to the pad, and the pad can be moved with respect to the base material. Then, by moving the pad together with the nozzle, it is possible to form a film of a fixed area on the substrate or pattern formation.
In addition, you may make it move a base material instead of moving a pad, or in addition to moving a pad.
[0012]
Further, the present invention may include a mechanism in which a nozzle moves with respect to a pad fixed to the base material, so that a film can be formed on a surface of the base material with a certain area or a pattern can be formed.
[0013]
As described above, the nozzle can move with respect to the pad, so that even when the contact portion or the seal portion of the pad does not move relative to the base material, it is possible to form a film of a fixed area or patterning. It becomes.
As a specific configuration, a nozzle is taken into the pad from the outside with a vacuum introduction bearing or the like, and the nozzle is moved via the vacuum bearing. For example, a magnetic coupling or the like may be used as the vacuum introduction bearing.
[0014]
Further, the present invention provides a mechanism in which the nozzle fixed to the pad and the substrate move relative to each other by deforming the pad itself, so that a film can be formed on the surface of the substrate with a fixed area or a pattern can be formed. You can also.
[0015]
In this way, by deforming the pad itself, it is possible to form a film with a fixed area or patterning even when the contact portion or the seal portion of the pad does not move relative to the base material.
As a specific configuration, urethane rubber is used so that the nozzle fixed to the pad can move with respect to the substrate by deforming the pad in a state where the contact portion or the seal portion between the pad and the base material does not relatively move. And other soft materials. Alternatively, in order to mechanically deform the pad, there is a method of forming the film by moving the nozzle fixed to the pad by deforming the pad with a bellows or the like corresponding to vacuum and moving the nozzle fixed to the pad. In this case, the contact portion between the nozzle and the pad is fixed, and if the actuator is further fixed to the pad, or if the nozzle is fixed to an actuator or the like outside the pad, the nozzle is moved by manual or automatic control. This makes it possible to improve the degree of freedom of the shape of the film formed on the substrate surface.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram of a compact film forming pad composite structure manufacturing apparatus of the composite structure manufacturing apparatus. The apparatus includes a
The
[0017]
The shape of the pad and the opening of the pad can be adapted to a wide variety of base materials by manufacturing according to the size and shape of the base material to be formed. For example, when a film is formed on a 12-inch silicon wafer, the film can be formed on the front surface by using a pad having an opening of φ300 mm. If the substrate is large, such as glass for a liquid crystal display, it can be dealt with by increasing the size of the pad or arranging a plurality of pads. In the present invention, a substrate having a size of about 100 × 100 mm is appropriate in terms of production efficiency and has a large effect of reducing the size of the apparatus.
[0018]
The space 9 is evacuated by the vacuum pump in the fine powder recovery mechanism 8 of the present embodiment, and then the aerosol generator 7 generates an aerosol in which fine particles are dispersed in a gas. The generated aerosol is supplied to the
[0019]
The aerosol referred to in the present invention is an oxide such as aluminum oxide, PZT, zinc oxide or titanium oxide, a nitride such as silicon nitride or aluminum nitride, a carbide such as diamond, silicon carbide or titanium carbide, or a mixture thereof. Dispersion of brittle materials, such as multi-element solid solutions, piezoelectric, pyroelectric ceramics, semi-metallic substances, and semiconductor compounds such as lead titanate and strontium titanate, in gases such as nitrogen, helium, and argon Say. The aerosol beam is obtained by ejecting these aerosols together with gas from the
[0020]
Next, as shown in FIG. 2, the
At this time, when the pad 22 can be moved or slid easily by the external force with respect to the base material 23 while maintaining the vacuum, the
[0021]
Furthermore, the pad 22 and the base material 23 can move in a non-contact manner by adjusting the flow rate of the compressed air and floating the pad 22 with respect to the base material 23 by using a static pressure bearing as the
[0022]
When it is difficult to move or slide the pad with respect to the substrate, the nozzle 22 can move with respect to the base material by deforming the pad 22 as shown in FIG. In this case, the pad 22 is made of urethane rubber or another soft material. Further, it is preferable to adopt a structure in which the pad 22 is reinforced in a certain direction so as to prevent the pad 22 from being crushed due to a pressure difference from the atmospheric pressure when the space 29 is pulled to a negative pressure. The reinforcing structure uses a pillar 31 made of metal or the like, and the pad can be deformed by a link mechanism or the like so that the nozzle can move. The reinforcing material may be set inside or outside the pad.
[0023]
Alternatively, the mechanism itself can be devised so that the pad can be mechanically deformed. That is, a mechanically movable mechanism is added to the pad to relatively move the nozzle and the substrate. For example, as shown in FIG. 3, there is a method of forming a movable portion with a bellows 51 compatible with vacuum and deforming the pad 42. The bellows 51 corresponding to the vacuum can be of a cylindrical type or a square type, and can have a structure that can move back and forth and right and left along the substrate surface. As a type of the vacuum bellows, it is desirable to use a vacuum bellows that can move smoothly and can take a large stroke. It is preferable to adopt a structure in which the pad 42 is reinforced in a certain direction to prevent the pad 42 from being crushed by a pressure difference from the atmospheric pressure when the
[0024]
Further, the
[0025]
Further, in this embodiment, the base material can be easily and quickly exchanged by moving the base material up and down with respect to the pad or moving the pad up and down with respect to the base material. For example, in the case of forming a multilayer film, the setup time of the base material can be shortened, and the throughput can be increased.
Further, in the present invention, since the film-forming space for forming a vacuum is also miniaturized, the exhaust system such as a vacuum pump in the particle collection mechanism is also small, and high throughput can be supported. Overall miniaturization is possible.
[0026]
In the present invention, by adhering a pad, a nozzle, or a fine powder collecting mechanism, or by providing a static electricity removing device, it is possible to prevent powder from adhering and further increase the powder collecting efficiency.
[0027]
【The invention's effect】
As described above, by using the apparatus for manufacturing a composite film-forming pad composite structure according to the present invention, a composite structure can be manufactured regardless of the substrate size without requiring a large-sized chamber or an exhaust system.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a compact pad according to one embodiment of the present invention.
FIG. 2 is a conceptual diagram of a material such as a compact pad rubber according to one embodiment of the present invention.
FIG. 3 is a structural view of a compact pad bellows type according to one embodiment of the present invention.
[Explanation of symbols]
1, 21, 41 ...
Claims (4)
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JP2003052866A JP4035659B2 (en) | 2003-02-28 | 2003-02-28 | Composite structure manufacturing equipment |
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JP2003052866A JP4035659B2 (en) | 2003-02-28 | 2003-02-28 | Composite structure manufacturing equipment |
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JP2004265992A true JP2004265992A (en) | 2004-09-24 |
JP4035659B2 JP4035659B2 (en) | 2008-01-23 |
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