JP2004253817A5 - - Google Patents

Download PDF

Info

Publication number
JP2004253817A5
JP2004253817A5 JP2004139815A JP2004139815A JP2004253817A5 JP 2004253817 A5 JP2004253817 A5 JP 2004253817A5 JP 2004139815 A JP2004139815 A JP 2004139815A JP 2004139815 A JP2004139815 A JP 2004139815A JP 2004253817 A5 JP2004253817 A5 JP 2004253817A5
Authority
JP
Japan
Prior art keywords
nitride semiconductor
laser element
substrate
semiconductor laser
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004139815A
Other languages
Japanese (ja)
Other versions
JP4637503B2 (en
JP2004253817A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2004139815A priority Critical patent/JP4637503B2/en
Priority claimed from JP2004139815A external-priority patent/JP4637503B2/en
Publication of JP2004253817A publication Critical patent/JP2004253817A/en
Publication of JP2004253817A5 publication Critical patent/JP2004253817A5/ja
Application granted granted Critical
Publication of JP4637503B2 publication Critical patent/JP4637503B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (5)

窒化物半導体基板と、
前記窒化物半導体基板上に形成された、リッジストライプを有するレーザ素子構造と、
前記窒化物半導体基板の裏面に形成された電極と、
前記レーザ素子構造の共振面に形成された誘電体膜とを有する窒化物半導体レーザ素子であって、
前記窒化物半導体基板は、異種基板上を横方向に成長しながら形成された窒化物半導体層を有し、該窒化物半導体層の(11−00)面が前記共振面とされたことを特徴とする窒化物半導体レーザ素子。
A nitride semiconductor substrate;
A laser element structure having a ridge stripe formed on the nitride semiconductor substrate;
An electrode formed on the back surface of the nitride semiconductor substrate;
A nitride semiconductor laser element having a dielectric film formed on a resonance surface of the laser element structure,
The nitride semiconductor substrate has a nitride semiconductor layer formed while growing on a heterogeneous substrate in a lateral direction, and a (11-00) plane of the nitride semiconductor layer is the resonance plane. Nitride semiconductor laser device.
前記窒化物半導体層にn型不純物がドープされたことを特徴とする請求項1に記載の窒化物半導体レーザ素子 The nitride semiconductor laser device according to claim 1, wherein the nitride semiconductor layer is doped with an n-type impurity . 前記n型不純物がSiであることを特徴とする請求項2に記載の窒化物半導体レーザ素子。 The nitride semiconductor laser element according to claim 2, wherein the n-type impurity is Si . 前記異種基板はオフアングルした主面を有することを特徴とする請求項1乃至3のいずれかに記載の窒化物半導体レーザ素子。4. The nitride semiconductor laser element according to claim 1, wherein the different substrate has an off-angle main surface. 前記窒化物半導体層の結晶欠陥密度が10個/cm以下であることを特徴とする請求項1乃至4のいずれかに記載の窒化物半導体レーザ素子。

The nitride semiconductor laser device according to any one of claims 1 to 4, wherein the crystal defect density of the nitride semiconductor layer is 10 6 / cm 2 or less.

JP2004139815A 1997-04-11 2004-05-10 Manufacturing method of nitride semiconductor laser device Expired - Fee Related JP4637503B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004139815A JP4637503B2 (en) 1997-04-11 2004-05-10 Manufacturing method of nitride semiconductor laser device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP9331597 1997-04-11
JP18107197 1997-07-07
JP20147797 1997-07-28
JP29009797 1997-10-22
JP29009597 1997-10-22
JP2004139815A JP4637503B2 (en) 1997-04-11 2004-05-10 Manufacturing method of nitride semiconductor laser device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7724598A Division JPH11191657A (en) 1997-04-11 1998-03-25 Growing method of nitride semiconductor and nitride semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007219841A Division JP2008034862A (en) 1997-04-11 2007-08-27 Growing method for nitride semiconductor

Publications (3)

Publication Number Publication Date
JP2004253817A JP2004253817A (en) 2004-09-09
JP2004253817A5 true JP2004253817A5 (en) 2005-07-21
JP4637503B2 JP4637503B2 (en) 2011-02-23

Family

ID=33033354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004139815A Expired - Fee Related JP4637503B2 (en) 1997-04-11 2004-05-10 Manufacturing method of nitride semiconductor laser device

Country Status (1)

Country Link
JP (1) JP4637503B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408264B (en) * 2005-12-15 2013-09-11 Saint Gobain Cristaux & Detecteurs New process for growth of low dislocation density gan
JP4807081B2 (en) * 2006-01-16 2011-11-02 ソニー株式会社 Method for forming underlayer made of GaN-based compound semiconductor, and method for manufacturing GaN-based semiconductor light-emitting device
JP5095653B2 (en) * 2009-03-23 2012-12-12 日本電信電話株式会社 Nitride semiconductor structure
JP5451796B2 (en) * 2012-03-06 2014-03-26 日本電信電話株式会社 Nitride semiconductor structure
JP6321455B2 (en) * 2014-05-21 2018-05-09 東京応化工業株式会社 Method for producing gallium nitride

Similar Documents

Publication Publication Date Title
TWI364839B (en) Pixel structure of active matrix organic light emitting display and fabrication method thereof
JP2006525677A5 (en)
JP2011040445A5 (en)
JP2010506735A (en) Encapsulation and transfer method for low-dimensional structures
TW200620537A (en) Silicon-on-insulator semiconductor device with silicon layers having different crystal orientations and method of forming the silicon-on-insulator semiconductor device
JP2009158936A5 (en)
JP2003347543A5 (en)
JP2001036092A5 (en)
JP2009135482A5 (en)
JP2008182226A5 (en)
JP2006352139A5 (en)
JP2010008874A5 (en)
WO2009055572A4 (en) Semiconductor structure and method of manufacture
JP2007500952A5 (en)
JP2007529112A5 (en)
JP2011009689A5 (en) Thin film transistor
KR20110085317A (en) A manufacturing method for flexible device and flexible device, solar cell, led manufactured by the same
US8673693B2 (en) Methods for forming materials using micro-heaters and electronic devices including such materials
US9161135B2 (en) Thermoacoustic chip
JP2004253817A5 (en)
TW589704B (en) Semiconductor device and manufacturing method for the same
JP2008205171A5 (en)
JP2008210992A5 (en)
JP2002359376A5 (en)
JP2004040075A (en) Capacitor structure in low temperature polysilicon display