JP2004253482A - Method of manufacturing functional element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a functional element which includes a processing step of processing the substrate of a functional element by fixing the substrate on a base material and, in addition, by which the substrate can be fixed stably and peeled easily during the course of the processing step. <P>SOLUTION: The method of manufacturing the functional element includes a self-releasable base material preparing step of preparing a self-releasable base material having a base material, a layer containing a photocatalyst formed on the base material, and a self-releasable adhesive layer containing a layer made to have a self-releasable property by the action of the photocatalyst when energy is projected upon the layer; an adhering step of adhering the substrate of the functional element to the self-releasable adhesive layer; and a processing step of processing the substrate of the functional element. The method also includes an energy projecting step of projecting energy upon the self-releasable adhesive layer, and a peeling step of peeling the substrate of the functional element from the self-releasable base material. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０１５５】
粘着力に関しては、ＵＶ照射前後の強度を測定した。照射前の粘着力に関しては、ガラス基板や、ポリカ基板を貼り合わせずに作製したサンプルの強度（粘着剤／フィルム状ディスプレイフィルター間）の強度を測定した。
【０１５６】
また、粘着力の測定に関しては、温度２３℃，湿度６０％の環境下にて、万能式引っ張り試験機にて剥離角度：９０°剥離，剥離速度：３００ｍｍ／ｍｉｎ，の条件にて強度の測定を実施した。
【０１５７】
上記実施例１から実施例５までのいずれのフィルム状ディスプレイフィルターにおいても、蒸着の際にカールのない基材上で均一な膜厚に蒸着処理が行われ、処理後の平坦性を維持した状態では蒸着膜の割れ，クラック等の発生等がなく、ディスプレイフィルター基材としての性能を維持したものを得る事ができた。
【０１５８】
＜特性変化接着剤層：分解除去型接着剤＞
（実施例６）
１．支持用基板形成工程
テトラメトキシシラン（ＧＥ東芝シリコーン（株）製 ＴＳＬ８１１４）５ｇと０．０５規定塩酸２．５ｇとを混合し、２４時間攪拌した。この溶液０．１ｇと光触媒無機コーティング剤（石原産業（株）製 ＳＴ−Ｋ０３）５０ｇとを混合し、１時間常温で撹拌した。これをイソプロピルアルコールにより２倍に希釈し光触媒処理層用組成物とした。
【０１５９】
次に、厚み１ｍｍのガラス基板上に、前記光触媒処理層用組成物をスピンコーターにより塗布し、その後、１５０℃で１０分間の乾燥処理を行うことにより、厚さ０．１５μｍの光触媒処理層を厚み１．５ｍｍのガラス基板上に形成し支持基板を得た。
【０１６０】
２．接着剤積層体の形成
［第１工程］
紫外線硬化型のアクリル系２液の粘着剤である、綜研化学製粘着剤 主剤：ＳＫダイン ＳＷ−１１Ａと硬化剤Ｌ−４５を重量比率１００：３の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分１０％になるように調合した。次に調合された混合物を、第一給紙より繰り出した２５μｍの離型ＰＥＴ東洋紡Ｅ７００７の離型フィルム面に、グラビアコーターにて乾燥時０．５μｍとなるようにコーティングし、ラインスピード毎分２０ｍの速度にて温度設定１００℃の１０ｍ以上の長さを有する乾燥フードにて乾燥し、第２給紙より、予め、両面にコロナ処理を施した透明樹脂基板の５０μｍ ＰＥＴ基材 東レルミラーＴ−５０を貼り合わせて、巻き上げ１層目の紫外線硬化型粘着剤のコーティングを終えた。
【０１６１】
［第２工程］
次に、綜研化学製粘着剤 主剤：ＳＫダイン ＳＷ−１１Ａと硬化剤Ｌ−４５を重量比率１００：２の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分２０％になるように調合した。第一給紙より、東洋紡Ｅ７００７を繰り出しコンマコーターにて乾燥時２５μｍとなるように、ラインスピード毎分２０ｍの速度にて温度設定１００℃の１０ｍ以上の長さを有する乾燥フードにて乾燥し、第２給紙より第１工程にて作製した、貼り合わせフィルムのＰＥＴ面に貼り合わせ、両面に紫外線硬化型粘着剤を有するＰＥＴフィルムの作製を終えた。
【０１６２】
３．機能性素子（フィルム状ディスプレイフィルター）貼付工程
上記支持用基板の光触媒処理層に、上記接着用積層体の形成における第２工程にて作製したフィルムの片面の離型フィルムを剥し、ゴムローラーにて気泡が入らないように貼り合わせを行った。次に、もう片方の離型フィルムを剥し、フィルム状ディスプレイフィルター基材の１００μｍＰＥＴフィルム東洋紡Ａ４３００の片面側をゴムローラーにて気泡が入らないように貼り合わせを行った。
【０１６３】
４．フィルム状ディスプレイフィルター加工方法
次に、上記支持用基板にフィルム状ディスプレイフィルター基材を貼り合わせて、枚葉方式による蒸着処理を行った。蒸着時には、銀とＩＴＯ（酸化インジウム錫）を交互に蒸着処理を行ない、完了後蒸着面にキズ防止の保護フィルムを貼り合わせた。
【０１６４】
５．エネルギー照射工程
次に、上記保護フィルムを貼り合わせたフィルム状ディスプレイフィルター基材をバキュームチャックにて保護フィルム面から固定し、ガラス面から、ＵＶ光を８０Ｗ／ｃｍの出力にて１５ｃｍの距離から３分間照射を行った。これにより、紫外線硬化型粘着剤の粘着力低下が起き、その後長時間に及ぶ光触媒による高分子分解作用により、上記紫外線硬化型粘着材層を分解除去し剥離させた。
【０１６５】
次に、紫外線にて硬化された粘着剤を両面に有するＰＥＴフィルムをゆっくりと剥し、発塵等もなくフィルム状ディスプレイフィルターを得ることができた。
【０１６６】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１６７】
（実施例７）
透明樹脂基板を５０μｍＰＥタマポリ（株）製ＧＦ−２を用いた以外は、実施例６と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１６８】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１６９】
（実施例８）
支持用基板にポリカーボネートを用いた以外は、実施例６と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１７０】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１７１】
（実施例９）
実施例６における第１工程において用いられた紫外線硬化型粘着材を、紫外線硬化型のアクリル系２液の粘着剤である、綜研化学製粘着剤 主剤：ＳＫダインＡＧ−７９０と硬化剤Ｌ−４５を重量比率１００：６の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分２０％になるように調合したものとした以外は、実施例６と同様に、フィルム状ディスプレイフィルター基材を形成した。
【０１７２】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１７３】
（実施例１０）
実施例６における第２工程において用いられた紫外線硬化型粘着材を、紫外線硬化型のアクリル系２液の粘着剤である、綜研化学製粘着剤 主剤：ＳＫダインＡＧ−７９０と硬化剤Ｌ−４５を重量比率１００：４．５の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分２０％になるように調合したものを用いた以外は、実施例６と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１７４】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１７５】
（比較例３）
光触媒処理層を形成しなかったこと以外は、実施例６と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１７６】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１７７】
（比較例４）
光触媒処理層を形成せず、実施例６における第１工程において用いられた紫外線硬化型粘着材を、熱剥離型のアクリル系２液の粘着剤である、綜研化学製粘着剤 主剤：ＳＫダイン ＳＫ−１７９５と硬化剤Ｌ−４５とを重量比率１００：３の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分２０％になるように調合したものとした以外は、実施例６と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１７８】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表２に示す。
【０１７９】
【表２】

【０１８０】
粘着力に関しては、ＵＶ照射前後の強度を測定した。照射前の粘着力に関しては、ガラス基板や、ポリカ基板を貼り合わせずに作製したサンプルの強度（粘着剤／フィルム状ディスプレイフィルター間）の強度を測定した。
【０１８１】
また、粘着力の測定に関しては、温度２３℃，湿度６０％の環境下にて、万能式引っ張り試験機にて剥離角度：９０°剥離，剥離速度：３００ｍｍ／ｍｉｎ，の条件にて強度の測定を実施した。
【０１８２】
上記実施例６から実施例１０までのいずれのフィルム状ディスプレイフィルターにおいても、蒸着の際にカールのない基材上で均一な膜厚に蒸着処理が行われ、処理後の平坦性を維持した状態では蒸着膜の割れ，クラック等の発生がなく、ディスプレイフィルター基材としての性能を維持したものを得る事ができた。
【０１８３】
＜特性変化接着剤層：光触媒含有接着剤＞
（実施例１１）
１．支持用基板
支持用基板としては、厚み１．５ｍｍのガラス基板上を支持基板とした。
【０１８４】
２．光触媒溶液の調合
テトラメトキシシラン（ＧＥ東芝シリコーン（株）製 ＴＳＬ８１１４）と０．０５規定塩酸とを２：１の比率で配合した溶液を２４時間攪拌した。この溶液と、光触媒無機コーティング剤（石原産業（株）製 ＳＴ−Ｋ０３）とを０．１：５０の配合比率で混合した溶剤を１時間常温で撹拌した。これをイソプロピルアルコールにより２倍に希釈し、光触媒溶液を調合した。
【０１８５】
３．接着剤積層体の形成
［第１工程］
紫外線硬化型のアクリル系２液の粘着剤である、綜研化学製粘着剤 主剤：ＳＫダイン ＳＷ−１１Ａと硬化剤Ｌ−４５を重量比率１００：３の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分１０％になるように調合した。更にその粘着材層と、上記で調合した光触媒処理層用溶液を、乾燥状態の比率として１０：１の比率で混合した光触媒含有接着剤層を、第一給紙より繰り出した２５μｍの離型ＰＥＴ東洋紡Ｅ７００７の離型フィルム面に、グラビアコーターにて乾燥時２５μｍとなるようにコーティングし、ラインスピード毎分２０ｍの速度にて温度設定１００℃の１０ｍ以上の長さを有する乾燥フードにて乾燥し、第２給紙より、予め、両面にコロナ処理を施した透明樹脂基板の５０μｍＰＥＴ基材 東レルミラー Ｔ−５０を貼り合わせて、巻き上げ１層目の紫外線硬化型粘着剤のコーティングを終えた。
【０１８６】
［第２工程］
次に、綜研化学製粘着剤 主剤：ＳＫダイン ＳＷ−１１Ａと硬化剤Ｌ−４５を重量比率１００：２の配合比率にて混ぜ合わせ、トルエン・酢酸エチルを使用して、固形分２０％になるように調合した。第一給紙より、東洋紡Ｅ７００７を繰り出しコンマコーターにて乾燥時２５μｍとなるように、ラインスピード毎分２０ｍの速度にて温度設定１００℃の１０ｍ以上の長さを有する乾燥フードにて乾燥し、第２給紙より第１工程にて作製した、貼り合わせフィルムのＰＥＴ面に貼り合わせ、両面に紫外線硬化型粘着剤を有するＰＥＴフィルムの作製を終えた。
【０１８７】
４．機能性素子（フィルム状ディスプレイフィルター）貼付工程
上記支持用基板の光触媒処理層に、上記接着用積層体の形成における第２工程にて作製したフィルムの片面の離型フィルムを剥し、ゴムローラーにて気泡が入らないように貼り合わせを行った。次に、もう片方の離型フィルムを剥し、フィルム状ディスプレイフィルター基材の１００μｍＰＥＴフィルム東洋紡Ａ４３００の片面側をゴムローラーにて気泡が入らないように貼り合わせを行った。
【０１８８】
４．フィルム状ディスプレイフィルター加工方法
次に、上記支持用基板にフィルム状ディスプレイフィルター基材を貼り合わせて、枚葉方式による蒸着処理を行った。蒸着時には、銀とＩＴＯ（酸化インジウム錫）を交互に蒸着処理を行ない、完了後蒸着面にキズ防止の保護フィルムを貼り合わせた。
【０１８９】
５．エネルギー照射工程
次に、上記保護フィルムを貼り合わせたフィルム状ディスプレイフィルター基材をバキュームチャックにて保護フィルム面から固定し、ガラス面から、ＵＶ光を８０Ｗ／ｃｍの出力にて１５ｃｍの距離から３分間照射を行った。これにより、光触媒による高分子分解作用と紫外線硬化型粘着剤の粘着力低下の相乗効果によって、光触媒含有接着剤層および支持用基板間を剥離させた。
【０１９０】
次に、紫外線にて硬化された粘着剤を両面に有するＰＥＴフィルムをゆっくりと剥し、発塵等もなくフィルム状ディスプレイフィルターを得た。
【０１９１】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表３に示す。
【０１９２】
（実施例１２）
透明樹脂基板を５０μｍＰＥタマポリ（株）製ＧＦ−２を用いた以外は、実施例１１と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１９３】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表３に示す。
【０１９４】
（実施例１３）
支持用基板にポリカーボネートを用いた以外は、実施例１１と同様にフィルム状ディスプレイフィルター基材を形成した。
【０１９５】
エネルギー照射前における紫外線硬化型粘着材の粘着力と、照射後における紫外線硬化型粘着材との粘着力について測定した結果を表３に示す。
【０１９６】
【表３】

【０１９７】
なお、表３に示した比較例については、上述した比較例１および比較例２と同様である。
【０１９８】
粘着力に関しては、ＵＶ照射前後の強度を測定した。照射前の粘着力に関しては、ガラス基板や、ポリカ基板を貼り合わせずに作製したサンプルの強度（粘着剤／フィルム状ディスプレイフィルター間）の強度を測定した。
【０１９９】
また、粘着力の測定に関しては、温度２３℃，湿度６０％の環境下にて、万能式引っ張り試験機にて剥離角度：９０°剥離，剥離速度：３００ｍｍ／ｍｉｎ，の条件にて強度の測定を実施した。
【０２００】
上記実施例１１から実施例１３までのいずれのフィルム状ディスプレイフィルターにおいても、蒸着の際にカールのない基材上で均一な膜厚に蒸着処理が行われ、処理後の平坦性を維持した状態では蒸着膜の割れ，クラック等の発生がなく、ディスプレイフィルター基材としての性能を維持したものを得る事ができた。
【０２０１】
【発明の効果】
本発明によれば、自己剥離型接着剤層に光触媒を含有する層およびこの光触媒の作用により自己剥離性を有する層を含むものであるので、機能性素子基板を加工後に基材上から剥離する際に、エネルギーを照射することにより自己剥離型接着剤層の接着力が大幅に低下することから、極めて容易に基材上から機能性素子基板を剥離することが可能となる。したがって、加工時には機能性素子基板を基材上に安定的に固定することが可能であり、かつ加工後剥離する場合には容易に剥離することができるという利点を有するものである。
【図面の簡単な説明】
【図１】本発明の機能性素子の製造方法の一例を示す工程図である。
【図２】本発明の自己剥離基材の一例を示す概略断面図である。
【符号の説明】
１ … 基材
２ … 光触媒処理層
３ … 分解除去型接着剤層
４ … 自己剥離型接着剤層
５ … 機能性素子基板
６ … エネルギー
７ … 接着性低下型接着剤層
８ … 高分子樹脂基材
９ … 再剥離性接着剤層[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for producing a functional element which needs to be fixed on a substrate and processed during production.
[0002]
[Prior art]
When manufacturing a functional element, a step of fixing a functional element substrate on some kind of supporting base material and processing the functional element substrate may be required.
[0003]
For example, when thinning a semiconductor wafer having a circuit formed on the surface, the circuit surface of the semiconductor wafer is fixed on a substrate having a flat surface such as a glass substrate, and then the surface opposite to the circuit surface is fixed. A grinding step is required (see Patent Document 1).
[0004]
Further, for example, when various functional elements are formed on a film-like base material, for example, when a polymer film is used as a base material and an organic EL element is formed on this surface, the film becomes flexible. In some cases, it is difficult to form a functional element using a conventional single-wafer manufacturing apparatus. In such a case, if the method of fixing the film on a substrate having a predetermined rigidity and forming a functional element in this state is used, a conventional single-wafer manufacturing apparatus can be used as it is. Due to the advantages, such methods are being considered.
[0005]
However, when processing by fixing a functional element on such a supporting substrate, various problems have been pointed out.
[0006]
For example, when fixing by vacuum, the surface of the functional element is flexible when the functional element has flexibility, for example, because it is necessary to form a hole for suction on the supporting base material. There is a problem that it is difficult to secure the property. Further, when the functional element substrate is fixed on the supporting base material using an adhesive, peeling becomes difficult if the stability of the fixing is prioritized, and the stability of the fixing is impaired when the peeling property is considered. Problems arise.
[0007]
[Patent Document 1]
JP-A-2002-75937
[0008]
[Problems to be solved by the invention]
Therefore, the present invention provides a method for manufacturing a functional element having a step of fixing a functional element substrate on a base material and performing processing, and in the processing step, the functional element substrate can be stably fixed in the processing step. Provided is a method for manufacturing a functional element that can be easily peeled off.
[0009]
[Means for Solving the Problems]
According to the present invention, there is provided a self-contained film including a substrate, a layer containing a photocatalyst formed on the substrate, and a layer having a self-peeling property by the action of the photocatalyst accompanying energy irradiation. A self-peeling base material preparing step of preparing a self-peeling base material having a peelable adhesive layer, an adhesive step of bonding a functional element substrate to the self-peeling adhesive layer, and processing the functional element substrate. A functional element, comprising: a processing step to be applied; an energy irradiation step of irradiating energy to the self-peeling adhesive layer; and a peeling step of peeling a functional element substrate from the self-peeling substrate. And a method for producing the same.
[0010]
According to the present invention, since the self-peelable adhesive layer includes a layer containing a photocatalyst and a layer having a self-peeling property by the action of the photocatalyst, the functional element substrate is peeled off from the substrate after processing. In addition, since the adhesive force of the self-peelable adhesive layer having a self-peeling property is greatly reduced by irradiating energy, it is possible to very easily peel the functional element substrate from the base material. Become. Therefore, there is an advantage that the functional element substrate can be stably fixed on the base material at the time of processing, and that when the functional element substrate is separated after the processing, the functional element substrate can be easily separated.
[0011]
In the invention described in claim 1, as described in claim 2, the self-peelable adhesive layer includes a photocatalyst treatment layer as a layer containing the photocatalyst formed on the base material. And a layer having a property-change adhesive layer as the layer having the self-peeling property formed on the photocatalyst treatment layer. By forming the characteristic-change adhesive layer on the photocatalyst-treated layer in this manner, the adhesiveness of the characteristic-change adhesive layer is reduced by irradiation of energy, so that peeling after processing can be easily performed.
[0012]
According to the second aspect of the present invention, as described in the third aspect, the property-change adhesive layer has an adhesiveness-reduction type adhesive whose surface adhesiveness is reduced by the action of a photocatalyst by irradiation of energy. An energy-curable adhesive layer, wherein the adhesiveness-reduced adhesive layer is cured by irradiation of energy, and the adhesiveness of its surface is reduced, as described in claim 4. It can be. Such an energy-curable adhesive layer is cured by itself when irradiated with energy, so that the adhesiveness of the surface is reduced. At the same time, at the interface with the photocatalyst treatment layer, the energy-curable adhesive is acted upon by the action of a photocatalyst. The effect of the decomposition of the layer surface takes place, which leads to a further significant reduction in the adhesion. Therefore, peeling after processing becomes extremely easy.
[0013]
Also, in the invention described in claim 2, as described in claim 5, the decomposition-removable adhesive layer in which the property-change adhesive layer is decomposed and removed by the action of a photocatalyst due to energy irradiation. It may be. In the case of the decomposition-removable adhesive layer as described above, the decomposition-removable adhesive layer is decomposed and removed by the action of the photocatalyst in the photocatalyst-treated layer due to the irradiation of energy, so that the function can be performed from above the processed substrate. This is because peeling of the conductive element substrate becomes extremely easy.
[0014]
In the invention described in any one of claims 2 to 5, as described in claim 6, the photocatalyst treatment layer can be a layer made of a photocatalyst. This makes it possible to efficiently change the properties of the above-mentioned property-change adhesive layer, which is preferable in terms of production efficiency and the like.
[0015]
In this case, as described in claim 7, the photocatalyst treatment layer is preferably a layer formed by forming a photocatalyst by a vacuum film formation method. Thereby, it is possible to form a uniform photocatalyst treatment layer having a uniform film thickness with less unevenness on the surface, and it is possible to uniformly and efficiently change the characteristics of the above-mentioned adhesive layer. is there.
[0016]
Further, in the invention described in any one of claims 2 to 5, as described in claim 8, the photocatalyst treatment layer is a layer having a photocatalyst and a binder. Can be. This is because the photocatalyst treatment layer is a layer having a photocatalyst and a binder, whereby the photocatalyst treatment layer can be easily formed, and as a result, a functional element can be manufactured at low cost.
[0017]
In the invention described in the first aspect, as described in the ninth aspect, the self-peelable adhesive layer includes a photocatalyst as a layer containing the photocatalyst and a layer having the self-peelability. It may have a photocatalyst-containing adhesive layer to be contained. Such a photocatalyst-containing adhesive layer can reduce the adhesiveness at both the interface on the substrate side and the interface on the functional element substrate side by irradiation of energy, so that the functional element substrate can be easily peeled off after processing. This is because it can be performed.
[0018]
In the invention described in any one of the first to ninth aspects, as described in the tenth aspect, the self-peelable adhesive layer has a more flexible polymer resin. It may have a substrate and a removable adhesive layer formed on the polymer resin substrate. As described above, if the flexible polymer resin substrate has a flexible polymer resin substrate and a removable adhesive layer formed thereon, the adhesive is applied to the functional element substrate side after the peeling step described later. Even when a layer such as the reduced adhesive layer remains, it is possible to remove these layers by peeling the polymer resin base material from the functional element substrate. Can be performed without leaving a layer of.
[0019]
In the invention described in any one of claims 1 to 11, as described in claim 11, the photocatalyst is made of titanium oxide (TiO 2). ₂ ), Zinc oxide (ZnO), tin oxide (SnO) ₂ ), Strontium titanate (SrTiO) ₃ ), Tungsten oxide (WO ₃ ), Bismuth oxide (Bi ₂ O ₃ ), And iron oxide (Fe ₂ O ₃ ) Is preferably selected from the group consisting of one or more substances selected from the group consisting of titanium oxide (TiO 2) and titanium oxide (TiO 2). ₂ ) Is preferable. This is because titanium dioxide has a high band gap energy and is effective as a photocatalyst, and is chemically stable, has low toxicity, and is easily available.
[0020]
In the invention described in any one of the first to twelfth aspects, as described in the thirteenth aspect, the irradiation of the energy is preferably irradiation of ultraviolet light. This makes it possible to excite the photocatalyst usually, which is preferable in terms of production cost and efficiency.
[0021]
In the invention described in any one of claims 1 to 13, at least one of the base material and the functional element substrate is irradiated as described in claim 14. It is preferably transparent to the above energy.
[0022]
The present invention also includes, as described in claim 15, a substrate, a layer containing a photocatalyst formed on the substrate, and a layer having self-peeling properties due to the action of the photocatalyst accompanying energy irradiation. A self-peelable substrate having a self-peelable adhesive layer containing the same. By using such a self-peeling substrate, the functional element substrate is fixed on the base material, and after processing, the functional element plate is easily peeled from the self-peeling substrate by irradiating energy. This is because the functional element substrate can be easily processed.
[0023]
In the invention described in claim 15, as described in claim 16, the self-peelable adhesive layer includes a photocatalyst treatment layer as a layer containing the photocatalyst formed on the base material. A layer having a property change adhesive layer as the layer having the self-peeling property formed on the photocatalyst treatment layer. In this case, as described in claim 17, the property change is performed. Even if the adhesive layer is a reduced adhesive type adhesive layer whose surface adhesiveness is reduced by the action of a photocatalyst by irradiation of energy, as described in claim 18, the characteristic-change adhesive layer is Alternatively, a decomposition-removable adhesive layer that is decomposed and removed by the action of a photocatalyst due to energy irradiation may be used. This is because, with such a layer, the functional element substrate to which it is adhered can be easily peeled off by performing energy irradiation.
[0024]
Further, in the invention described in claim 15, as described in claim 19, the self-peelable adhesive layer is a layer containing the photocatalyst, and a layer having the self-peelability, It may have a photocatalyst-containing adhesive layer containing a photocatalyst. This is because such a photocatalyst-containing adhesive layer has an advantage that the peeling can be easily performed on both surfaces thereof.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention relates to a method for producing a functional element and a self-peeling substrate used for the method. Hereinafter, each will be described.
[0026]
A. Method for manufacturing functional element
First, a method for manufacturing a functional element of the present invention will be described. The method for producing a functional element of the present invention includes a base, a layer containing a photocatalyst formed on the base, and a layer having a self-peeling property by the action of the photocatalyst accompanying energy irradiation. Self-peeling substrate preparation step of preparing a self-peeling substrate having a mold adhesive layer,
An bonding step of bonding the functional element substrate to the self-peeling adhesive layer,
A processing step of processing the functional element substrate,
For the self-peeling adhesive layer, an energy irradiation step of irradiating energy,
A peeling step of peeling the functional element substrate from the self-peeling substrate,
Which is characterized by having
[0027]
In the present invention, a self-peeling substrate having a self-peeling adhesive layer is used, and a functional element substrate is adhered and fixed to the surface thereof. This self-peelable adhesive layer has self-peelability by reducing the adhesiveness of its surface by the action of a photocatalyst due to energy irradiation. Therefore, in the bonding step, it is possible to provide an adhesive force between the functional element substrate and the self-peeling base material to such an extent that it can be stably fixed without considering the difficulty of the peeling treatment in the subsequent peeling step. . Therefore, in a subsequent processing step, the functional element substrate is fixed with stable adhesive force to the base material, so that processing with high accuracy such as positional accuracy can be performed. Then, after the processing step, since the self-peeling adhesive layer of the self-peeling substrate has self-peeling property by irradiating energy, the functional element is very easily peeled in the peeling step. be able to. Therefore, according to the method for manufacturing a functional element of the present invention, a functional element can be manufactured with good yield and high accuracy.
[0028]
Hereinafter, a method for manufacturing such a functional element of the present invention will be specifically described with reference to the drawings.
[0029]
FIG. 1 shows an example of a method for manufacturing a functional element of the present invention. In this example, a self-peeling substrate preparation step of preparing a self-peeling substrate 4 having a photocatalyst treatment layer 2 formed on a transparent substrate 1 and further having a decomposition-removable adhesive layer 3 formed on the surface thereof is performed. (FIG. 1A). Here, the photocatalyst treatment layer 2 is a layer containing the photocatalyst referred to in the present invention, and the decomposition-removable adhesive layer 3 is a layer having self-peeling properties by the action of the photocatalyst accompanying energy irradiation.
[0030]
Next, a functional element substrate 5 which becomes a plate-shaped or film-shaped functional element is disposed on the decomposition-removable adhesive layer 3 and an adhesion step of adhering is performed. Is performed (FIG. 1B). The processing step at this time is, for example, a process of reducing the thickness by surface grinding, forming a pattern of a functional portion on the surface of the functional element substrate 5, and the like. Processing that can ensure processing performance and can perform accurate positioning can be suitably performed.
[0031]
Then, as shown in FIG. 1C, an energy irradiating step of irradiating an energy 6, usually an ultraviolet ray, is performed. In this case, the irradiation direction of the energy 6 is from the transparent substrate 1 side since the transparent substrate 1 is used in the example shown in FIG. 1, but the energy emitted by the functional element substrate 3 is transmitted therethrough. If so, irradiation may be performed from the functional element substrate 3 side.
[0032]
By this energy irradiation step, as shown in FIG. 1D, the decomposition-removable adhesive layer 3 formed on the photocatalyst treatment layer 2 is decomposed and removed.
[0033]
Therefore, as shown in FIG. 1E, the last peeling step of peeling the functional element substrate 4 from the photocatalyst processing layer 2 can be easily peeled without requiring a particularly large peeling force.
[0034]
Hereinafter, such a method for producing a functional element of the present invention will be described in detail for each step.
[0035]
1. Self-peeling substrate preparation process
In the present invention, first, a self-peeling substrate is prepared. This self-peeling substrate is a self-peeling adhesive layer including a substrate, a layer containing a photocatalyst formed on the substrate, and a layer having self-peeling properties by the action of the photocatalyst accompanying energy irradiation. And
[0036]
Each member used in such a self-peeling substrate preparing step will be described.
[0037]
(Base material)
The substrate used in the present invention is not particularly limited as long as it can form a self-peeling adhesive layer on the surface.
[0038]
However, when the functional element substrate to be adhered is opaque to the irradiated energy, the substrate used in the present invention needs to be transparent to the irradiated energy.
[0039]
Further, it may be formed of a material having flexibility, for example, a material such as a plastic film, or may be a material having no flexibility, for example, a material such as glass, metal, or a plastic plate.
[0040]
Further, the shape is not limited to a film shape or a plate shape, and for example, a shape having a concave portion on the surface can be used according to the shape of the functional element substrate. In general, a plate or a film having a flat surface is preferably used from the versatility of the application.
[0041]
As such a substrate, for example, in a case where the back surface of the semiconductor wear on which a circuit is formed is thinned by grinding, etc., a substrate having a predetermined rigidity, and a transparent and flat surface is preferable, Specifically, a glass substrate or the like is suitably used.
[0042]
Further, in the case where an organic EL layer or the like is formed on a plastic film using a conventionally used single-wafer apparatus to obtain an organic EL element, a substrate that can be transported by the above apparatus is used. Although not particularly limited, for example, a transparent plastic plate having a predetermined rigidity is preferably used.
[0043]
As described above, the base material used in the present invention is appropriately selected depending on the type of the functional element substrate and the type of processing performed on the functional element substrate in a processing step described later, Specific examples include metals such as glass, aluminum, and alloys thereof, plastics, woven fabrics, and nonwoven fabrics.
[0044]
(Self-peeling adhesive layer)
Next, the self-peeling adhesive layer formed on the base material will be described. The self-peelable adhesive layer used in the present invention is basically limited as long as it includes a layer containing a photocatalyst and a layer having self-peelability due to the action of the photocatalyst accompanying the irradiation of energy. Not something.
[0045]
Such a self-peeling type adhesive layer has a photocatalyst treatment layer as a layer containing the photocatalyst formed on the base material, and a self-peeling property by the action of the photocatalyst formed on the photocatalyst treatment layer. An embodiment having a property changing adhesive layer as a layer having the same (hereinafter, referred to as a first embodiment), and a layer containing the photocatalyst and a layer having self-peeling property by the action of the photocatalyst are the same layer. The second embodiment includes two embodiments having the photocatalyst-containing adhesive layer formed (hereinafter, referred to as a second embodiment). Hereinafter, these two embodiments will be described separately.
[0046]
(1) First embodiment
The first embodiment of the self-peeling adhesive layer used in the present invention has at least a photocatalyst treatment layer as a layer containing a photocatalyst, and a property changing adhesive layer exhibiting self-peeling property by the action of the photocatalyst. It is an aspect.
[0047]
a. Photocatalyst treatment layer
The photocatalyst treatment layer used in the present invention is not particularly limited as long as the photocatalyst in the photocatalyst treatment layer can change the properties of the property-change adhesive layer described later and exert self-peeling properties. Instead, the photocatalyst and the binder may be used, and the photocatalyst alone may be used to form a film.
[0048]
In such a photocatalyst treatment layer, the action mechanism of a photocatalyst represented by titanium dioxide as described later is not necessarily clear, but the carrier generated by light irradiation is a direct reaction with a nearby compound, or It is considered that the reactive oxygen species generated in the presence of oxygen, water and water change the chemical structure of organic matter. In the present embodiment, it is considered that this carrier acts on the compound in the property changing adhesive layer disposed on the photocatalyst treatment layer.
[0049]
The photocatalyst used in the present embodiment includes, for example, titanium dioxide (TiO 2) which is known as an optical semiconductor. ₂ ), Zinc oxide (ZnO), tin oxide (SnO) ₂ ), Strontium titanate (SrTiO) ₃ ), Tungsten oxide (WO ₃ ), Bismuth oxide (Bi ₂ O ₃ ), And iron oxide (Fe ₂ O ₃ ), And one or more of them may be used in combination.
[0050]
In this embodiment, titanium dioxide is particularly preferably used because it has a high band gap energy, is chemically stable, has no toxicity, and is easily available. Titanium dioxide includes an anatase type and a rutile type, and any of them can be used in this embodiment. Anatase type titanium dioxide is preferable. Anatase type titanium dioxide has an excitation wavelength of 380 nm or less.
[0051]
Examples of such anatase-type titanium dioxide include, for example, anatase-type titania sol of peptized hydrochloric acid (STS-02 (average particle size: 7 nm) manufactured by Ishihara Sangyo Co., Ltd .; ST-K01 manufactured by Ishihara Sangyo Co., Ltd.); Glue-type anatase titania sol (TA-15 (average particle diameter: 12 nm) manufactured by Nissan Chemical Industries, Ltd.) and the like can be mentioned.
[0052]
The smaller the particle size of the photocatalyst is, the more effective the photocatalytic reaction takes place. It is preferable that the average particle size is 50 nm or less, and it is particularly preferable to use a photocatalyst having a mean particle size of 20 nm or less.
[0053]
As described above, the photocatalyst treatment layer in the present embodiment may be formed by using only the photocatalyst, or may be formed by mixing with the binder.
[0054]
In the case of the photocatalyst treatment layer composed of only the photocatalyst, the efficiency with respect to the change in the property on the property-change adhesive layer is improved, which is advantageous in terms of cost such as shortening of the processing time. On the other hand, the photocatalyst treatment layer including the photocatalyst and the binder has an advantage that the photocatalyst treatment layer can be easily formed.
[0055]
Examples of the method for forming the photocatalyst treatment layer composed of only the photocatalyst include a method using a vacuum film forming method such as a sputtering method, a CVD method, and a vacuum evaporation method. By forming the photocatalyst treatment layer by the vacuum film forming method, it is possible to form a uniform film and a photocatalyst treatment layer containing only the photocatalyst, thereby uniformly changing the properties on the property change adhesive layer. It is possible to change the characteristics on the characteristic-change adhesive layer more efficiently than in the case where a binder is used, since it is possible to use only a photocatalyst.
[0056]
Further, as another example of a method for forming a photocatalyst treatment layer composed of only a photocatalyst, for example, when the photocatalyst is titanium dioxide, a method of forming amorphous titania on a base material and then performing a phase change to crystalline titania by firing. And the like. As the amorphous titania used here, for example, titanium tetrachloride, hydrolysis and dehydration condensation of inorganic salts of titanium such as titanium sulfate, tetraethoxytitanium, tetraisopropoxytitanium, tetra-n-propoxytitanium, tetrabutoxytitanium, An organic titanium compound such as tetramethoxytitanium can be obtained by hydrolysis and dehydration condensation in the presence of an acid. Next, it can be denatured to anatase type titania by baking at 400 ° C. to 500 ° C., and can be denatured to rutile type titania by baking at 600 ° C. to 700 ° C.
[0057]
When a binder is used, it is preferable that the binder has a high binding energy such that the main skeleton of the binder is not decomposed by the photoexcitation of the photocatalyst, and examples thereof include organopolysiloxane.
[0058]
When the organopolysiloxane is used as a binder in this manner, the photocatalyst-treated layer is prepared by dispersing a photocatalyst and an organopolysiloxane as a binder in a solvent together with other additives as necessary. It can be formed by applying this coating liquid on a substrate. As the solvent to be used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. The coating can be performed by a known coating method such as spin coating, spray coating, dip coating, roll coating, and bead coating. When an ultraviolet-curable component is contained as a binder, the photocatalyst-treated layer can be formed by irradiating ultraviolet rays and performing a curing treatment.
[0059]
Further, an amorphous silica precursor can be used as a binder. This amorphous silica precursor has the general formula SiX ₄ X is preferably a silicon compound such as a halogen, a methoxy group, an ethoxy group, or an acetyl group, a hydrolyzate of the compound, silanol, or a polysiloxane having an average molecular weight of 3000 or less.
[0060]
Specific examples include tetraethoxysilane, tetraisopropoxysilane, tetra-n-propoxysilane, tetrabutoxysilane, tetramethoxysilane and the like. In this case, the precursor of the amorphous silica and the particles of the photocatalyst are uniformly dispersed in a non-aqueous solvent, and the substrate is hydrolyzed with moisture in the air to form silanol, and then cooled to room temperature. The photocatalyst-treated layer can be formed by dehydration-condensation polymerization in If the dehydration-condensation polymerization of silanol is performed at 100 ° C. or higher, the degree of polymerization of silanol increases and the strength of the film surface can be improved. These binders can be used alone or in combination of two or more.
[0061]
When a binder is used, the content of the photocatalyst in the photocatalyst treatment layer can be set in the range of 5 to 60% by weight, preferably 20 to 40% by weight. The thickness of the photocatalyst treatment layer is preferably in the range of 0.05 to 10 μm.
[0062]
The photocatalyst treatment layer may contain a surfactant in addition to the photocatalyst and the binder. Specifically, hydrocarbons such as NIKKOL BL, BC, BO, and BB series manufactured by Nikko Chemicals Co., Ltd .; ZONYL FSN and FSO manufactured by DuPont; Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd .; Megafac F-141 and 144 manufactured by Ink Chemical Industry Co., Ltd., Futagent F-200 and F251 manufactured by Neos Co., Ltd., Unidyne DS-401 and 402 manufactured by Daikin Industries, Ltd., and Florad FC-170 manufactured by 3M Corporation. 176 and the like, and a fluorine-based or silicone-based nonionic surfactant can be mentioned, and a cationic surfactant, an anionic surfactant, and an amphoteric surfactant can also be used.
[0063]
Further, in addition to the above surfactant, the photocatalyst treatment layer, polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate, Oligomers, polymers such as polyvinyl chloride, polyamide, polyimide, styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, epichlorohydrin, polysulfide, polyisoprene, etc. It can be contained.
[0064]
b. Property change adhesive layer
Next, the property changing adhesive layer used in the present embodiment will be described. The property changing adhesive layer used in the present embodiment is a layer formed on the above-described photocatalyst treatment layer, and in the energy irradiation step described later, the property is changed by the influence of the photocatalyst contained in the above-described photocatalyst treatment layer. Is a layer which changes and has a self-peeling property.
[0065]
In the present embodiment, the self-peeling property refers to a property in which the adhesive force is reduced by the action of a photocatalyst accompanying energy irradiation from the initial adhesive force, and the adhesive force is completely lost and no peeling force is required at all. In addition, the concept includes a state in which the adhesive force is reduced to such an extent that the functional element substrate can be peeled without being damaged in a peeling step described later.
[0066]
In addition, the property changing adhesive layer used in the present embodiment may be formed on the entire surface of the photocatalyst treatment layer, or may be formed in a pattern.
[0067]
The property changing adhesive layer used in the present embodiment is not particularly limited as long as it has the above-mentioned properties. It is preferable that the adhesive layer has an adhesiveness-reducing adhesive layer whose surface adhesiveness is reduced or a decomposition-removable adhesive layer that is decomposed and removed by the influence of a photocatalyst accompanying energy irradiation. Hereinafter, the adhesiveness-decreasing adhesive layer and the decomposition-removable adhesive layer will be described.
[0068]
(I) Adhesive-reducing adhesive layer
First, the adhesiveness-decreasing adhesive layer used in the present embodiment will be described. The adhesiveness-decreasing adhesive layer used in the present embodiment is a layer formed on the photocatalyst treatment layer and bonded to a functional element substrate described later, and was irradiated with energy in an energy irradiation step described later. In this case, the action of the photocatalyst is a layer in which the molecular chains inside the adhesiveness-decreasing adhesive layer at the interface on the photocatalyst treatment layer side are cut, and the adhesiveness at the interface is reduced.
[0069]
Such an adhesiveness-decreasing adhesive layer is not particularly limited as long as it is an adhesive layer having the above-mentioned properties, and is generally a solvent-based adhesive, a two-part curable adhesive, May be a thermosetting adhesive or an energy-curing adhesive that is cured by energy rays such as ultraviolet rays and EB.
[0070]
In the present embodiment, the energy-curable adhesive layer is particularly preferable. Since the energy-curable adhesive layer is in a state before being polymerized before the energy irradiation, it has a predetermined tackiness and can be used to adhere to the functional element substrate. Then, since this layer is polymerized and cured by irradiation of energy, the first effect that the adhesiveness on the surface is reduced, and the energy at the interface with the photocatalyst treatment layer due to the action of the photocatalyst in the photocatalyst treatment layer. Since the molecular chains on the surface of the curable adhesive layer are cut, the second adhesive effect of reducing the adhesiveness at the interface between the photocatalyst treatment layer and the energy-curable adhesive layer has two effects of reducing adhesiveness. This is because, after the energy irradiation, the adhesive strength can be greatly reduced, and the peeling can be extremely easily performed in a peeling step described later.
[0071]
In general, as a material used for such an energy-curable adhesive layer, a composition including a polymer elastic material, an energy-curable component, a photopolymerization initiator, and the like, and a crosslinking agent, Additives such as imparting agents, plasticizers, fillers, and deterioration inhibitors may be added.
[0072]
Examples of the polymer elastic body include an adhesive such as an acrylic adhesive and a saturated copolyester. As the acrylic adhesive, a homopolymer or a copolymerizable comonomer of (meth) acrylic acid ester is usually used. Is used. Examples of the monomer or comonomer constituting these polymers include alkyl esters of (meth) acrylic acid such as methyl ester, ethyl ester, butyl ester, 2-ethylhexyl ester and octyl ester, for example, hydroxyethyl ester, hydroxypropyl ester (meth ) Hydroxyalkyl esters such as acrylic acid, glycidyl (meth) acrylate, (meth) acrylic acid, itaconic acid, maleic anhydride, (meth) acrylic acid amide, (meth) acrylic acid N-hydroxymethylamide such as dimethyl Examples thereof include alkylaminoalkyl (meth) acrylates such as aminoethyl methacrylate and t-butylaminoethyl methacrylate, vinyl acetate, styrene and acrylonitrile. As the main monomer, an alkyl acrylate having a glass transition temperature of a homopolymer of −50 ° C. or lower is usually used.
[0073]
Examples of the saturated copolyester include a saturated copolyester of a polyhydric alcohol and two or more polycarboxylic acids. Examples of the polyhydric alcohol include glycols such as ethylene glycol, propylene glycol, and 1,4-butanediol. The polyvalent carboxylic acids include terephthalic acid, aromatic dicarboxylic acids such as isophthalic acid, adipic acid, and aliphatic dicarboxylic acids such as sebacic acid, among which aromatic dicarboxylic acids and aliphatic dicarboxylic acids are used in combination. I often do it.
[0074]
Next, as the ultraviolet curable component, a monomer, oligomer, or polymer having a carbon-carbon double bond in a molecule and curable by radical polymerization can be used. Specifically, trimethylolpropane Tri (meth) acrylate, tetramethylolmethanetetraacrylate, pentaerythritol tri (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate ) Ester of (meth) acrylic acid and polyhydric alcohol such as acrylate and dipentaerythritol hexa (meth) acrylate, ester acrylate oligomer, 2-propenyl di-3-butenyl cyanurate, 2-hydroxyethyl bis (2- Acryloxyethyl Isocyanurate, tris (2-acryloyloxyethyl) isocyanurate, tris (2-methacryloxyethyl) cyanurate or isocyanurate compounds such as isocyanurate.
[0075]
Next, as the photopolymerization initiator, in the energy irradiation step described later, benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether, as long as the substance generates a radical by irradiation energy, Aromatic ketones such as benzyl, benzoin, benzophenone and α-hydroxycyclohexylphenyl ketone; aromatic ketals such as benzyldimethyl ketal; polyvinyl benzophenone; thioxanthones such as chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone and diethylthioxanthone; .
[0076]
Examples of the crosslinking agent include a polyisocyanate compound, a melamine resin, a urea resin, an epoxy resin, an acid anhydride, a polyamine, and a carboxyl group-containing polymer.
[0077]
In the present embodiment, the composition of the above-described material is applied by, for example, a comma coater, a gravure coater, a gravure reverse coater, a three-reverse coater, a slit reverse coater, a die coater, or the like, and then dried by energy-curing adhesion. Form an agent layer.
[0078]
The thickness of the energy-curable adhesive layer used in the present embodiment is preferably 3 μm to 100 μm, and more preferably 10 μm to 40 μm.
[0079]
(Ii) Decomposition-removable adhesive layer
Next, the decomposition-removable adhesive layer used in the present embodiment will be described. The decomposition-removable adhesive layer used in the present embodiment is a layer formed on the above-described photocatalyst treatment layer, and is a layer to which a functional element substrate described later is adhered on the surface. Such a decomposition-removable adhesive layer is decomposed and removed by the action of the photocatalyst in the photocatalyst treatment layer accompanying the energy irradiated in the energy irradiation step described later.
[0080]
Specifically, when the energy 6 is irradiated as shown in FIG. 1C, the decomposition-removable adhesive layer 3 is formed by the action of the photocatalyst in the photocatalyst treatment layer 2 as shown in FIG. It is broken down and completely removed.
[0081]
As described above, since the decomposition-removable adhesive layer removes the decomposition-removable adhesive layer itself by the action of the photocatalyst accompanying the energy irradiation, the adhesion between the remaining photocatalyst treatment layer and the functional element substrate is reduced. Therefore, in the peeling step described later, the functional element substrate can be peeled only by moving the functional element substrate as it is.
[0082]
The material used for such a decomposition-removable adhesive layer is not particularly limited as long as it can be decomposed and removed by the action of a photocatalyst accompanying the irradiation of energy as described above. Adhesives, butadiene adhesives and emulsion adhesives, among which acrylic adhesives are preferred.
[0083]
The method for forming the decomposition-removable adhesive layer in the present embodiment is the same as the method for the energy-curable adhesive layer described above, and a description thereof will be omitted.
[0084]
Further, the thickness of the decomposition-removable adhesive layer in the present embodiment is preferably in the range of 10 μm to 200 μm, particularly preferably in the range of 10 μm to 50 μm. When the film thickness is smaller than the above range, a problem may occur in the adhesiveness.When the film thickness is larger than the above range, the photocatalyst at the time of energy irradiation can completely decompose and remove the film. Because it is difficult.
[0085]
(2) Second embodiment
As a second embodiment of the self-peelable adhesive layer, the self-peelable adhesive layer is a photocatalyst-containing adhesive layer containing a photocatalyst, as the photocatalyst-containing layer, and as the self-peelable layer. It is the aspect which has.
[0086]
Such a photocatalyst-containing adhesive layer is such that the adhesiveness of the surface is reduced by the action of a photocatalyst contained in the photocatalyst-containing adhesive layer by irradiation of energy, and thus the surface of the photocatalyst-containing adhesive layer on the substrate side is reduced. In addition, the adhesiveness can be reduced at the interface between the functional element substrate side surface and both surfaces. Therefore, peeling can be performed in a peeling step described later without leaving another layer on the functional element substrate.
[0087]
Such a photocatalyst-containing adhesive layer is a layer made of an adhesive containing a photocatalyst as described above.
[0088]
Since the photocatalyst used here is the same as that described in the first embodiment, the description is omitted here.
[0089]
As the adhesive that can be used, any of the adhesiveness-decreasing adhesive layer and the decomposition-removable adhesive described in the first embodiment can be used. Since these adhesives are the same as those described in the first embodiment, the description here is omitted.
[0090]
The amount of the photocatalyst introduced into the adhesive is appropriately set according to the type of the adhesive, the type and strength of the energy to be irradiated, and the required processing time. Specifically, an experiment is performed in the same state so that the processing time required in advance is obtained, and the content is determined based on the result.
[0091]
(3) Other
The self-peelable adhesive layer used in the present invention further comprises a flexible polymer resin base material and a removable adhesive layer formed on the polymer resin base material. You may.
[0092]
For example, as shown in FIG. 2, when the photocatalyst treatment layer 2 is formed on the base material 1 and the adhesiveness-reducing adhesive layer 7 is further formed thereon, the adhesive-reducing adhesive is further added. Alternatively, a polymer resin base material 8 may be adhered to the layer 7, and the removable adhesive layer 9 may be formed on the polymer resin base material 8. The self-peeling adhesive layer in this case is all the layers formed on the substrate 1, and specifically, the photocatalyst treatment layer 2, the adhesiveness-decreasing adhesive layer 7, the polymer resin substrate 8, It consists of the removable adhesive layer 9.
[0093]
As shown in this example, when the adhesiveness-reduced adhesive layer described in the first embodiment is used, the adhesiveness is reduced between the adhesiveness-reduced adhesive layer 7 and the photocatalyst treatment layer 2. Will happen. In this case, when peeled in a peeling step described later, the adhesiveness-reduced adhesive layer 7 remains on the functional element substrate side. Depending on the type of the functional element, there may be a serious problem if such other layers are adhered, and it is difficult to peel off and remove only the adhesiveness-decreasing adhesive layer 7. is there. In such a case, a polymer resin base material 8 having more flexibility on the self-peelable adhesive layer 2 and a removable adhesive layer 9 formed on the polymer resin base material 8 are combined. By forming, the functional element substrate is peeled off at the interface between the functional element substrate and the removable adhesive layer 9 by utilizing the strength of the polymer resin substrate 8 after the peeling step described later is completed. This makes it possible to simultaneously remove the above-mentioned adhesiveness-reduced adhesive layer 7, so that the functional element substrate does not have another layer attached thereto.
[0094]
a. Polymer resin substrate
The polymer resin substrate used in the present invention is not particularly limited in its shape and the like as long as it has a film-like flexibility, but it is a transparent or translucent polymer that is not colored. A resinous film is preferably used. Thereby, for example, when the energy-curable adhesive layer is used, it is possible to transmit the irradiated energy in the energy irradiation step described below, and the energy-curable adhesive layer is cured to reduce the adhesiveness. This is because the functional element substrate and the energy-curable adhesive layer can be easily separated from each other.
[0095]
Further, in the present invention, it is preferable that the polymer resin base material has been subjected to a corona treatment, a plasma treatment, or a sandblast treatment on one or both surfaces. This makes it possible to improve the adhesion between the polymer resin base material and the removable adhesive layer or the property-change adhesive layer described later.
[0096]
Specific examples of the polymer resin used in the present invention include polypropylene, polyethylene, polybutadiene, polymethylpentene, polycarbonate, polyvinyl chloride, polyvinyl chloride copolymer, polyethylene terephthalate, polyethylene naphthalate, and polybutylene. Terephthalate, polyethylene naphthalate, polyurethane, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), ethylenetetrafluoroethylene (ETFE), polychlorotrifluoroethylene (PCTFE), ethylenechlorotrifluoroethylene (ECTFE), fluoride Vinylidene resin (PVDF), polyvinyl fluoride (PVF) ethylene-vinyl acetate copolymer (EVA), ionomer resin, cyclic polyolefin resin, polystyrene Emissions-based resin, silicone resin, polyamide resin, polyimide resin, there may be mentioned polyamide-imide resins, etc., is preferably Among them, polyethylene terephthalate, polypropylene, and polyethylene.
[0097]
Further, the film thickness of the polymer resin substrate used in the present invention is preferably in the range of 10 μm to 500 μm, particularly preferably in the range of 25 μm to 150 μm.
[0098]
Further, in the present invention, an anchor layer or the like may be provided on the above-mentioned polymer resin base material in order to enhance the adhesiveness with the above-mentioned property-change adhesive layer or the removable adhesive layer described later.
[0099]
b. Removable adhesive layer
Next, the removable adhesive layer used in the present invention will be described. The removable adhesive layer used in the present invention is a layer for bonding the polymer resin substrate and the functional element substrate, and can be separated from the functional element substrate in a peeling step described later. If the layer is an energy-curable adhesive layer, the above-described energy-curable adhesive layer, or an easily peelable re-peelable adhesive layer, etc., is not particularly limited. preferable. Since the adhesive layer in the present embodiment is the above-mentioned energy-curable adhesive layer, in the energy irradiation step described later, it becomes possible to weaken the adhesiveness by energy irradiation, so that the functional element substrate can be easily formed. This is because it is possible to peel off the removable adhesive layer without leaving the removable adhesive layer.
[0100]
Further, the thickness of the removable adhesive layer used in the present embodiment is preferably 3 μm to 100 μm, more preferably 10 μm to 40 μm.
[0101]
2. Bonding process
Next, the bonding step in the present invention will be described. The bonding step in the present invention is a step of bonding a functional element substrate to the self-peeling adhesive layer.
[0102]
This bonding step is not particularly limited, but usually, the functional element substrate is also solid, so that the self-peelable adhesive layer of the self-peeling substrate and the functional element substrate are arranged to be in contact with each other. Then, they are bonded by applying pressure. In addition, as described in the section of the functional element substrate described below, in a case where the functional element substrate is formed by applying a coating liquid on the surface of the self-peeling adhesive layer, pressure bonding is unnecessary. Yes, the application of the coating liquid corresponds to the bonding step.
[0103]
Hereinafter, the functional element substrate bonded to the self-peeling substrate in the bonding step will be described.
[0104]
(Functional element substrate)
The functional element substrate used in the present invention is a functional element having various functions after a processing step and a peeling step described later, and further, after the peeling step, the functional element is subjected to further processing. There is no particular limitation as long as it becomes an element.
[0105]
Here, the functionalities include optical (light selective absorption, reflectivity, polarization, light selective transmittance, nonlinear optical properties, luminescence such as fluorescence or phosphorescence, photochromic properties, etc.) and magnetic (hard magnetic, soft magnetic) , Non-magnetic, magnetic permeability, etc., electric / electronic (conductive, insulating, piezoelectric, pyroelectric, dielectric, etc.), chemical (adsorbing, desorbing, catalytic, water absorbing, ionic conductivity) , Redox properties, electrochemical properties, electrochromic properties, etc.), mechanical properties (abrasion resistance properties, etc.), thermal properties (thermal conductivity, thermal insulation properties, infrared radiation properties, etc.), biofunctional properties (biocompatibility, antithrombotic properties, etc.) ) Means various functions.
[0106]
As an example of the functional element substrate according to the present invention, semiconductor wear having a circuit formed on one side can be given. After forming a circuit, such a semiconductor wafer is thinned by grinding the surface opposite to the circuit surface, but since the semiconductor wafer is brittle, it has a predetermined rigidity and is flat. Grinding is performed by fixing the substrate to a substrate having an appropriate surface, specifically, a glass substrate or the like. Such a semiconductor wafer before and after grinding can be cited as an example of the functional element substrate in the present invention.
[0107]
Further, when forming various functional portions such as an organic EL layer on a flexible film to form a flexible organic EL element, it has been used in conventional processing on a glass substrate. When performing processing such as patterning using a single-wafer apparatus, it is conceivable that a flexible film is fixed on a substrate having a predetermined rigidity and is flowed through the single-wafer apparatus. Can be A flexible film in such a case can also be mentioned as an example of the functional element substrate of the present invention.
[0108]
Further, for example, after applying a coating liquid on the surface of the self-peeling type adhesive layer and curing it, or forming a thin film by a vapor deposition method or the like, irradiating energy by an energy irradiation step described below, and peeling the thin film, After that, when used as a functional element, the thin film corresponds to the functional element substrate according to the present invention.
[0109]
In the present invention, when the functional element substrate is transparent to the energy irradiated in the energy irradiation step described later, the energy can be irradiated from the functional element substrate side. The material need not be particularly transparent to the energy being irradiated. That is, it is only necessary that any one of the base material and the functional element substrate is transparent to the energy applied.
[0110]
3. Processing process
In the present invention, after the bonding step, a processing step of processing the functional element substrate fixed on the base material is performed.
[0111]
In this processing, various processing is performed according to the use of the functional element substrate, and the type and the like are not particularly limited.
[0112]
Specifically, in the above-described example of the semiconductor wear, the grinding processing corresponds to the processing referred to in the present invention, and in the example of the formation of the organic EL layer on the flexible film, the patterning of the organic EL layer or the like is performed. The process of depositing the electrode layer and the like corresponds to the processing in the present invention. In the case where a thin film is obtained by applying a coating liquid, a treatment such as curing corresponds to the processing in the present invention.
[0113]
In addition, for example, in the case of forming a thin film on a self-peeling adhesive layer by evaporating a metal, the thin film is formed only by an evaporation process. It is to be interpreted as including both of the steps and the processing step.
[0114]
4. Energy irradiation process
Next, the energy irradiation step in the present invention will be described. The energy irradiation step in the present invention is a step of irradiating the self-peeling type adhesive layer with energy, and after the processing step, when the base material is transparent to the irradiated energy, the base material side In addition, if the functional element substrate is transparent, the self-peeling property is generated in the self-peelable adhesive layer by irradiating energy from the functional element substrate side.
[0115]
The term “irradiation of energy” in the present invention is a concept that includes irradiation of any energy ray capable of causing the self-peelable adhesive layer to have self-peeling property, that is, capable of causing the photocatalyst to have catalytic activity. It is not limited to light irradiation.
[0116]
Usually, the wavelength of light used for such energy irradiation is preferably ultraviolet light set within a range of 400 nm or less, preferably 380 nm or less. This is because a preferable photocatalyst used for the photocatalyst treatment layer or the photocatalyst-containing adhesive layer is titanium dioxide as described above, and light having the above-described wavelength is preferable as energy for activating the photocatalysis by the titanium dioxide. .
[0117]
Examples of the light source that can be used for such energy irradiation include a mercury lamp, a metal halide lamp, a xenon lamp, an excimer lamp, and various other light sources.
[0118]
In the present invention, this energy irradiation may be performed in a pattern. By irradiating the energy in a pattern, it is possible to adjust the adhesive force after the energy irradiation.
[0119]
Irradiation of such a pattern of energy is performed by using a light source as described above and performing pattern irradiation through a photomask, or by pattern irradiation using a laser such as excimer or YAG. It is also possible.
[0120]
In addition, the energy irradiation amount at the time of the energy irradiation is an irradiation amount necessary for causing the self-peelable adhesive layer to have a self-peeling property.
[0121]
At this time, by irradiating energy while heating the photocatalyst-treated layer or the photocatalyst-containing adhesive layer, the sensitivity can be increased, and self-peeling properties can be efficiently imparted. Specifically, it is preferable to heat in the range of 30 ° C to 80 ° C.
[0122]
5. Peeling process
Finally, the peeling step in the present invention will be described. The peeling step of the present invention is a step of peeling the functional element substrate from the self-peeling substrate.
[0123]
The peeling step in the present invention has various modes depending on the type of the self-peeling adhesive layer in the self-peeling substrate.
[0124]
First, in the case where the self-peelable adhesive layer is a photocatalyst treatment layer and a reduced adhesion type adhesive layer formed on the surface thereof, peeling between the photocatalyst treatment layer and the adhesion decrease type adhesive layer is difficult. Done. Therefore, in this case, the adhesive layer with reduced adhesiveness remains on the functional element substrate side. If there is a problem that the reduced adhesive layer remains, the process of removing the reduced adhesive layer is performed thereafter, or the surface of the reduced adhesive layer is treated as described above. The polymer resin substrate and the removable adhesive layer are formed in advance.
[0125]
Next, when the self-peelable adhesive layer is a photocatalyst treatment layer and a decomposition-removable adhesive layer formed on the surface thereof, the decomposition removal layer between the photocatalyst treatment layer and the functional element substrate is already removed. Therefore, the functional element substrate can be separated by moving the functional element substrate.
[0126]
Further, in the case where the self-peeling adhesive layer is a photocatalyst-containing adhesive layer, the adhesion on both surfaces of the photocatalyst-containing adhesive layer is significantly reduced or is decomposed and removed. The functional element substrate can be easily peeled off.
[0127]
As described above, when the self-peelable adhesive layer has the polymer resin base material and the removable adhesive layer, after the peeling step, the polymer resin base material is removed from the functional element substrate surface. It is necessary to perform a step of peeling off. This makes it possible to peel off at the interface between the surface of the removable adhesive layer and the surface of the functional element substrate, and to obtain a functional element substrate in which no other layer remains.
[0128]
B. Self-peeling substrate
Next, the self-peeling substrate of the present invention will be described. The self-peelable substrate of the present invention is a self-peelable adhesive comprising a base material, a layer containing a photocatalyst formed on the base material, and a layer having self-peelability due to the action of the photocatalyst accompanying energy irradiation. And a layer.
[0129]
If such a self-peeling substrate is used, the functional element substrate can be stably fixed by bonding the functional element substrate thereon, and processing can be performed with high accuracy and high yield. After the processing of the functional element substrate is completed, the self-peelable adhesive layer exhibits self-peeling properties by irradiating energy, so that the functional element base material can be easily peeled.
[0130]
The self-peeling adhesive layer and the base material used in the present invention are the same as those described in the above-described method for producing a functional element, and thus description thereof will be omitted.
[0131]
Note that the present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and has substantially the same configuration as the technical idea described in the claims of the present embodiment, and any device having the same function and effect can be provided. The technical scope of the present embodiment is included.
[0132]
【Example】
Hereinafter, the present embodiment will be described in more detail through examples.
[0133]
<Characteristic-change adhesive layer: energy-curable adhesive>
(Example 1)
1. Support substrate formation process
5 g of tetramethoxysilane (TSL8114 manufactured by GE Toshiba Silicone Co., Ltd.) and 2.5 g of 0.05 N hydrochloric acid were mixed and stirred for 24 hours. 0.1 g of this solution and 50 g of a photocatalytic inorganic coating agent (ST-K03 manufactured by Ishihara Sangyo Co., Ltd.) were mixed and stirred at room temperature for 1 hour. This was diluted twice with isopropyl alcohol to obtain a composition for a photocatalyst treatment layer.
[0134]
Next, on a glass substrate having a thickness of 1 mm, the composition for a photocatalyst treatment layer was applied by a spin coater, and then dried at 150 ° C. for 10 minutes to form a photocatalyst treatment layer having a thickness of 0.15 μm. It was formed on a glass substrate having a thickness of 1.5 mm to obtain a supporting substrate.
[0135]
2. Formation of adhesive laminate
[First step]
Soken Chemical Co., Ltd., a two-part UV-curable acrylic adhesive. Main agent: SK Dyne SW-11A and curing agent L-45 are mixed at a weight ratio of 100: 2 and mixed with toluene / acetic acid. The mixture was prepared using ethyl to a solid content of 20%. Next, the prepared mixture was coated on a release film surface of a 25 μm release PET Toyobo E7007 fed out from the first paper feeder by a comma coater so as to have a dryness of 25 μm, and a line speed of 20 m / min. At a temperature setting of 100 ° C. and a drying hood having a length of 10 m or more, a 50 μm PET substrate of a transparent resin substrate having a corona treatment applied to both sides thereof in advance from the second sheet is used. By bonding, the coating of the first layer of the ultraviolet curable pressure-sensitive adhesive was completed.
[0136]
[Second step]
Next, the same mixture as the mixture prepared in the first step was fed from the first paper feeder and fed out from Toyobo E7007 at a line speed of 20 m / min so that the drying time was 25 μm with a comma coater. Drying with a drying hood having a setting of 100 ° C. and a length of 10 m or more, bonding to the PET surface of the bonded film prepared in the first step from the second paper feed, and PET having an ultraviolet curing adhesive on both surfaces Preparation of the film was completed.
[0137]
3. Functional element (film display filter) sticking process
On the photocatalyst treatment layer of the supporting substrate, the release film on one side of the film prepared in the second step in the formation of the bonding laminate was peeled off, and bonded with a rubber roller so that air bubbles did not enter. . Next, the other release film was peeled off, and one side of a 100-μm PET film Toyobo A4300 as a film-like display filter substrate was bonded with a rubber roller so that air bubbles did not enter.
[0138]
4. Film display filter processing method
Next, a film-shaped display filter substrate was attached to the supporting substrate, and a single-wafer deposition process was performed. At the time of vapor deposition, silver and ITO (indium tin oxide) were alternately vapor-deposited, and after completion, a protective film for preventing scratches was attached to the vapor-deposited surface.
[0139]
5. Energy irradiation process
Next, the film-shaped display filter substrate on which the protective film was bonded was fixed from the protective film surface with a vacuum chuck, and UV light was irradiated from the glass surface at a power of 80 W / cm from a distance of 15 cm for 1 minute. went. As a result, the photocatalyst-treated layer and the ultraviolet-curable pressure-sensitive adhesive were separated by a synergistic effect of the polymer decomposition effect of the photocatalyst and the decrease in the adhesive strength of the ultraviolet-curable pressure-sensitive adhesive.
[0140]
Next, the PET film having the pressure-sensitive adhesive cured on both sides by ultraviolet light was slowly peeled off to obtain a film-like display filter substrate without dust generation or the like.
[0141]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0142]
(Example 2)
A film-like display filter base material was formed in the same manner as in Example 1, except that GF-2 manufactured by PE Tamapoli Co., Ltd. was used as the transparent resin substrate.
[0143]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0144]
(Example 3)
A film-like display filter substrate was formed in the same manner as in Example 1, except that polycarbonate was used for the supporting substrate.
[0145]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0146]
(Example 4)
The UV-curable pressure-sensitive adhesive used in the first step and the second step in Example 1 was cured with Soken Chemical's pressure-sensitive adhesive, a two-part UV-curable pressure-sensitive adhesive, the main agent: SK Dyne AG-790. Example 1 was repeated except that Agent L-45 was mixed at a weight ratio of 100: 4.5 and mixed with toluene / ethyl acetate to a solid content of 20%. Similarly, a film-like display filter substrate was formed.
[0147]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0148]
(Example 5)
The UV-curable pressure-sensitive adhesive used in the second step in Example 1 was a UV-curable acrylic two-liquid pressure-sensitive adhesive, a Soken Chemical pressure-sensitive adhesive main agent: SK Dyne AG-790 and curing agent L-45 Were mixed in a weight ratio of 100: 4.5, and a mixture was prepared in the same manner as in Example 1 except that toluene and ethyl acetate were used to prepare a solid content of 20%. A display filter substrate was formed.
[0149]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0150]
(Comparative Example 1)
A film display filter substrate was formed in the same manner as in Example 1, except that the photocatalyst treatment layer was not formed.
[0151]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0152]
(Comparative Example 2)
The photocatalyst treatment layer was not formed, and the UV-curable pressure-sensitive adhesive used in the first step in Example 1 was a heat-peelable acrylic two-liquid pressure-sensitive adhesive, an adhesive made by Soken Chemical Co., Ltd. Main agent: SK Dyne SK -1795 and curing agent L-45 were mixed at a weight ratio of 100: 3, and the mixture was adjusted to a solid content of 20% using toluene / ethyl acetate. The UV-curable pressure-sensitive adhesive used in the second step is a UV-curable acrylic two-liquid pressure-sensitive adhesive, a pressure-sensitive adhesive manufactured by Soken Chemical Co., Ltd. Main agent: SK Dyne AG-790 and curing agent L-45 in a weight ratio of 100: A film display filter was prepared in the same manner as in Example 1 except that the mixture was mixed at a mixing ratio of 4.5, and a mixture prepared using toluene and ethyl acetate so as to have a solid content of 20% was used. A substrate was formed.
[0153]
Table 1 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0154]
[Table 1]

[0155]
Regarding the adhesive strength, the strength before and after UV irradiation was measured. Regarding the adhesive strength before irradiation, the strength of the sample (between the adhesive and the film-like display filter) prepared without bonding a glass substrate or a polycarbonate substrate was measured.
[0156]
Regarding the measurement of the adhesive strength, the strength was measured under the conditions of a temperature of 23 ° C. and a humidity of 60% with a universal tensile tester under the conditions of a peeling angle of 90 ° and a peeling speed of 300 mm / min. Was carried out.
[0157]
In any of the film-shaped display filters from Example 1 to Example 5, a vapor deposition process is performed to a uniform film thickness on a substrate having no curl during vapor deposition, and the flatness after the process is maintained. Thus, there was no occurrence of cracks, cracks, etc. in the deposited film, and a product maintaining the performance as a display filter substrate could be obtained.
[0158]
<Characteristic-change adhesive layer: decomposition-removable adhesive>
(Example 6)
1. Support substrate formation process
5 g of tetramethoxysilane (TSL8114 manufactured by GE Toshiba Silicone Co., Ltd.) and 2.5 g of 0.05 N hydrochloric acid were mixed and stirred for 24 hours. 0.1 g of this solution and 50 g of a photocatalytic inorganic coating agent (ST-K03 manufactured by Ishihara Sangyo Co., Ltd.) were mixed and stirred at room temperature for 1 hour. This was diluted twice with isopropyl alcohol to obtain a composition for a photocatalyst treatment layer.
[0159]
Next, on a glass substrate having a thickness of 1 mm, the composition for a photocatalyst treatment layer was applied by a spin coater, and then dried at 150 ° C. for 10 minutes to form a photocatalyst treatment layer having a thickness of 0.15 μm. It was formed on a glass substrate having a thickness of 1.5 mm to obtain a supporting substrate.
[0160]
2. Formation of adhesive laminate
[First step]
Soken Chemical Co., Ltd., a two-part UV-curable acrylic adhesive, main agent: SK Dyne SW-11A and curing agent L-45 mixed at a weight ratio of 100: 3, toluene and ethyl acetate Was used to prepare a solid content of 10%. Next, the prepared mixture was coated on a release film surface of a 25 μm release PET Toyobo E7007 fed out from the first paper feeder so as to have a dryness of 0.5 μm with a gravure coater, and a line speed of 20 m / min. Is dried at a speed of 100 ° C. with a drying hood having a length of 10 m or more at a temperature setting of 100 ° C., and a 50 μm PET substrate of a transparent resin substrate on which both surfaces have been subjected to corona treatment in advance from the second paper feed. Then, the coating of the first layer of the ultraviolet curable pressure-sensitive adhesive was completed.
[0161]
[Second step]
Next, Soken Chemical's adhesive base material: SK Dyne SW-11A and curing agent L-45 are mixed in a weight ratio of 100: 2, and the solid content becomes 20% using toluene / ethyl acetate. Was prepared as follows. From the first paper feeder, feed out Toyobo E7007 and dry it with a drying hood having a length of 10 m or more at a temperature setting of 100 ° C. at a line speed of 20 m / min so that the drying time becomes 25 μm with a comma coater. The PET film of the laminated film produced in the first step from the second paper feed was adhered to the PET film, and the production of the PET film having the ultraviolet curing adhesive on both surfaces was completed.
[0162]
3. Functional element (film display filter) sticking process
On the photocatalyst treatment layer of the supporting substrate, the release film on one side of the film prepared in the second step in the formation of the bonding laminate was peeled off, and bonded with a rubber roller so that air bubbles did not enter. . Next, the other release film was peeled off, and one side of a 100-μm PET film Toyobo A4300 as a film-like display filter substrate was bonded with a rubber roller so that air bubbles did not enter.
[0163]
4. Film display filter processing method
Next, a film-shaped display filter substrate was attached to the supporting substrate, and a single-wafer deposition process was performed. At the time of vapor deposition, silver and ITO (indium tin oxide) were alternately vapor-deposited, and after completion, a protective film for preventing scratches was attached to the vapor-deposited surface.
[0164]
5. Energy irradiation process
Next, the film-shaped display filter substrate on which the protective film was bonded was fixed from the protective film surface with a vacuum chuck, and UV light was irradiated from the glass surface at a power of 80 W / cm from a distance of 15 cm for 3 minutes. went. As a result, the adhesive strength of the UV-curable pressure-sensitive adhesive was reduced, and the UV-curable pressure-sensitive adhesive layer was decomposed and removed by a polymer decomposition action by the photocatalyst for a long time thereafter.
[0165]
Next, the PET film having the pressure-sensitive adhesive cured on both sides by ultraviolet light was slowly peeled off, and a film-like display filter could be obtained without dust generation or the like.
[0166]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0167]
(Example 7)
A film-like display filter substrate was formed in the same manner as in Example 6, except that GF-2 manufactured by PE Tamapoli Co., Ltd. was used as the transparent resin substrate.
[0168]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0169]
(Example 8)
A film-like display filter substrate was formed in the same manner as in Example 6, except that polycarbonate was used for the supporting substrate.
[0170]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0171]
(Example 9)
The UV-curable pressure-sensitive adhesive used in the first step in Example 6 was a UV-curable acrylic two-liquid pressure-sensitive adhesive manufactured by Soken Chemical Co., Ltd. Main agents: SK Dyne AG-790 and curing agent L-45 Were mixed in a weight ratio of 100: 6, and the mixture was adjusted to a solid content of 20% using toluene / ethyl acetate, in the same manner as in Example 6, except that the solid content was 20%. A substrate was formed.
[0172]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0173]
(Example 10)
The UV-curable pressure-sensitive adhesive used in the second step in Example 6 was a UV-curable acrylic two-liquid pressure-sensitive adhesive, a pressure-sensitive adhesive manufactured by Soken Chemical Co., Ltd. Main agents: SK Dyne AG-790 and curing agent L-45 Was mixed in a weight ratio of 100: 4.5, and a mixture was prepared in the same manner as in Example 6 except that toluene and ethyl acetate were used to prepare a solid content of 20%. A display filter substrate was formed.
[0174]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0175]
(Comparative Example 3)
A film display filter substrate was formed in the same manner as in Example 6, except that the photocatalyst treatment layer was not formed.
[0176]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0177]
(Comparative Example 4)
Without forming the photocatalyst treatment layer, the UV-curable pressure-sensitive adhesive used in the first step in Example 6 was replaced with a heat-peelable acrylic-based two-part pressure-sensitive adhesive, an adhesive made by Soken Chemical Co., Ltd. Main agent: SK Dyne SK Example 17 except that -1795 and curing agent L-45 were mixed at a weight ratio of 100: 3, and were mixed using toluene / ethyl acetate to a solid content of 20%. A film-shaped display filter substrate was formed in the same manner as in No. 6.
[0178]
Table 2 shows the results of measuring the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0179]
[Table 2]

[0180]
Regarding the adhesive strength, the strength before and after UV irradiation was measured. Regarding the adhesive strength before irradiation, the strength of the sample (between the adhesive and the film-like display filter) prepared without bonding a glass substrate or a polycarbonate substrate was measured.
[0181]
Regarding the measurement of the adhesive strength, the strength was measured under the conditions of a temperature of 23 ° C. and a humidity of 60% with a universal tensile tester under the conditions of a peeling angle of 90 ° and a peeling speed of 300 mm / min. Was carried out.
[0182]
In any of the film-shaped display filters from Example 6 to Example 10, a vapor deposition process is performed to a uniform film thickness on a substrate having no curl during vapor deposition, and the flatness after the process is maintained. Thus, there was no occurrence of cracks, cracks or the like in the deposited film, and a product maintaining the performance as a display filter substrate could be obtained.
[0183]
<Characteristic-change adhesive layer: Photocatalyst-containing adhesive>
(Example 11)
1. Support substrate
As a supporting substrate, a glass substrate having a thickness of 1.5 mm was used as a supporting substrate.
[0184]
2. Preparation of photocatalyst solution
A solution in which tetramethoxysilane (TSL8114, manufactured by GE Toshiba Silicone Co., Ltd.) and 0.05 N hydrochloric acid were mixed at a ratio of 2: 1 was stirred for 24 hours. A solvent in which this solution and a photocatalytic inorganic coating agent (ST-K03 manufactured by Ishihara Sangyo Co., Ltd.) were mixed at a mixing ratio of 0.1: 50 was stirred at room temperature for 1 hour. This was diluted twice with isopropyl alcohol to prepare a photocatalyst solution.
[0185]
3. Formation of adhesive laminate
[First step]
Soken Chemical Co., Ltd., a two-part UV-curable acrylic adhesive, main agent: SK Dyne SW-11A and curing agent L-45 mixed at a weight ratio of 100: 3, toluene and ethyl acetate Was used to prepare a solid content of 10%. Further, the adhesive layer and the photocatalyst-containing adhesive layer obtained by mixing the above-prepared solution for the photocatalyst treatment layer at a ratio of 10: 1 in a dry state were fed out from the first paper feeder to a 25 μm release PET. The release film surface of Toyobo E7007 is coated with a gravure coater so as to be 25 μm when dried, and dried at a line speed of 20 m / min with a drying hood having a temperature setting of 100 ° C. and a length of 10 m or more. From the second paper feed, a 50 μm PET base material, Torel Mirror T-50, made of a transparent resin substrate that had been subjected to corona treatment on both surfaces in advance, was bonded to complete the coating of the first layer of the curable UV curable adhesive.
[0186]
[Second step]
Next, an adhesive agent made by Soken Chemical Co., Ltd .: SK Dyne SW-11A and curing agent L-45 are mixed at a weight ratio of 100: 2, and the solid content becomes 20% using toluene / ethyl acetate. Was prepared as follows. From the first paper feeder, feed out Toyobo E7007 and dry it with a drying hood having a length of 10 m or more at a temperature setting of 100 ° C. at a line speed of 20 m so that the drying time becomes 25 μm with a comma coater, The PET film was bonded to the PET surface of the bonded film prepared in the first step from the second paper feed, and the preparation of the PET film having the ultraviolet curable adhesive on both surfaces was completed.
[0187]
4. Functional element (film display filter) sticking process
On the photocatalyst treatment layer of the supporting substrate, the release film on one side of the film prepared in the second step in the formation of the bonding laminate was peeled off, and bonded with a rubber roller so that air bubbles did not enter. . Next, the other release film was peeled off, and one side of a 100-μm PET film Toyobo A4300 as a film-like display filter substrate was bonded with a rubber roller so that air bubbles did not enter.
[0188]
4. Film display filter processing method
Next, a film-shaped display filter substrate was attached to the supporting substrate, and a single-wafer deposition process was performed. At the time of vapor deposition, silver and ITO (indium tin oxide) were alternately vapor-deposited, and after completion, a protective film for preventing scratches was attached to the vapor-deposited surface.
[0189]
5. Energy irradiation process
Next, the film-shaped display filter substrate on which the protective film was bonded was fixed from the protective film surface with a vacuum chuck, and UV light was irradiated from the glass surface at a power of 80 W / cm from a distance of 15 cm for 3 minutes. went. As a result, the photocatalyst-containing adhesive layer and the supporting substrate were separated from each other by the synergistic effect of the polymer decomposition effect of the photocatalyst and the decrease in the adhesive strength of the ultraviolet-curable pressure-sensitive adhesive.
[0190]
Next, the PET film having the pressure-sensitive adhesive cured on both sides by ultraviolet light was slowly peeled off to obtain a film display filter without dust generation or the like.
[0191]
Table 3 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0192]
(Example 12)
A film-like display filter substrate was formed in the same manner as in Example 11 except that GF-2 manufactured by 50 μm PE Tamapoly Co., Ltd. was used as the transparent resin substrate.
[0193]
Table 3 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0194]
(Example 13)
A film-like display filter substrate was formed in the same manner as in Example 11, except that polycarbonate was used for the supporting substrate.
[0195]
Table 3 shows the measurement results of the adhesive strength of the ultraviolet-curable adhesive before the energy irradiation and the adhesive strength with the ultraviolet-curable adhesive after the irradiation.
[0196]
[Table 3]

[0197]
The comparative examples shown in Table 3 are the same as the comparative examples 1 and 2 described above.
[0198]
Regarding the adhesive strength, the strength before and after UV irradiation was measured. Regarding the adhesive strength before irradiation, the strength of the sample (between the adhesive and the film-like display filter) prepared without bonding a glass substrate or a polycarbonate substrate was measured.
[0199]
Regarding the measurement of the adhesive strength, the strength was measured at a peeling angle of 90 ° and a peeling speed of 300 mm / min with a universal tensile tester in an environment of a temperature of 23 ° C. and a humidity of 60%. Was carried out.
[0200]
In any of the film-shaped display filters from Example 11 to Example 13, a vapor deposition process is performed to a uniform film thickness on a substrate having no curl during vapor deposition, and the flatness after the process is maintained. Thus, there was no occurrence of cracks, cracks or the like in the deposited film, and a product maintaining the performance as a display filter substrate could be obtained.
[0201]
【The invention's effect】
According to the present invention, since the self-peelable adhesive layer contains a layer containing a photocatalyst and a layer having self-peeling properties by the action of the photocatalyst, when the functional element substrate is peeled off from the substrate after processing, In addition, since the adhesive force of the self-peeling adhesive layer is significantly reduced by irradiating the energy, the functional element substrate can be very easily peeled from the substrate. Therefore, there is an advantage that the functional element substrate can be stably fixed on the base material at the time of processing, and that when the functional element substrate is separated after the processing, the functional element substrate can be easily separated.
[Brief description of the drawings]
FIG. 1 is a process chart showing an example of a method for producing a functional element of the present invention.
FIG. 2 is a schematic sectional view showing an example of the self-peeling substrate of the present invention.
[Explanation of symbols]
1 ... substrate
2. Photocatalyst treatment layer
3. Decomposition-removable adhesive layer
4 Self-peeling adhesive layer
5 ... Functional element substrate
6 Energy
7 ... Adhesive-reducing adhesive layer
8… Polymer resin substrate
9: Removable adhesive layer

Claims (19)

A self-peeling substrate having a substrate and a self-peeling adhesive layer including a layer containing a photocatalyst formed on the substrate, and a layer having self-peeling properties due to the action of the photocatalyst accompanying energy irradiation Preparing a self-peeling substrate,
An adhesion step of adhering the functional element substrate to the self-peeling adhesive layer,
A processing step of processing the functional element substrate,
An energy irradiation step of irradiating energy to the self-peeling adhesive layer,
A step of separating the functional element substrate from the self-peeling substrate. The self-peelable adhesive layer has a photocatalyst treatment layer as a layer containing the photocatalyst formed on the substrate, and a property as the self-peelable layer formed on the photocatalyst treatment layer. The method for producing a functional element according to claim 1, wherein the functional element is a layer having a variable adhesive layer. The method for manufacturing a functional element according to claim 2, wherein the property changing adhesive layer is an adhesiveness-decreasing adhesive layer whose surface adhesiveness is reduced by the action of a photocatalyst due to energy irradiation. . 4. The production of a functional element according to claim 3, wherein the adhesiveness-decreasing adhesive layer is an energy-curable adhesive layer that is cured by irradiation of energy and has a reduced adhesiveness on its surface. 5. Method. The method for manufacturing a functional element according to claim 2, wherein the characteristic-change adhesive layer is a decomposition-removable adhesive layer that is decomposed and removed by the action of a photocatalyst by irradiation of energy. The method for manufacturing a functional element according to claim 2, wherein the photocatalyst treatment layer is a layer made of a photocatalyst. The method according to claim 6, wherein the photocatalyst treatment layer is a layer formed by forming a photocatalyst by a vacuum film forming method. The method for manufacturing a functional element according to claim 2, wherein the photocatalyst treatment layer is a layer having a photocatalyst and a binder. 2. The function according to claim 1, wherein the self-peelable adhesive layer has a photocatalyst-containing adhesive layer containing a photocatalyst as the photocatalyst-containing layer and the self-peelable layer. 3. Method for manufacturing a conductive element. 2. The self-peelable adhesive layer further comprises a polymer resin base material having flexibility and a removable adhesive layer formed on the polymer resin base material. A method for manufacturing a functional element according to any one of claims 1 to 9. The photocatalyst includes titanium oxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), strontium titanate (SrTiO ₃ ), tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), and oxidized The method for producing a functional element according to claim 1, wherein the functional element is one or two or more substances selected from iron (Fe ₂ O ₃ ). Method for producing a functional element according to claim 11, wherein the photocatalyst is titanium oxide (TiO _2). The method for manufacturing a functional element according to claim 1, wherein the irradiation of energy is irradiation of ultraviolet light. The functional element according to any one of claims 1 to 13, wherein at least one of the base material and the functional element substrate is transparent to the applied energy. Production method. A self-peeling substrate having a substrate and a self-peeling adhesive layer including a layer containing a photocatalyst formed on the substrate, and a layer having self-peeling properties due to the action of the photocatalyst accompanying energy irradiation . The self-peelable adhesive layer has a photocatalyst treatment layer as a layer containing the photocatalyst formed on the substrate, and a property as the self-peelable layer formed on the photocatalyst treatment layer. The self-peeling substrate according to claim 15, which is a layer having a variable adhesive layer. 17. The self-peeling substrate according to claim 16, wherein the property changing adhesive layer is an adhesiveness-decreasing adhesive layer whose surface adhesiveness is reduced by the action of a photocatalyst due to energy irradiation. 17. The self-peeling substrate according to claim 16, wherein the property changing adhesive layer is a decomposition-removable adhesive layer that is decomposed and removed by the action of a photocatalyst due to energy irradiation. The self-peeling adhesive layer according to claim 15, wherein the self-peeling adhesive layer has a photocatalyst-containing adhesive layer containing a photocatalyst as the photocatalyst-containing layer and the self-peeling layer. Release substrate.

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