JP2004249369A - Cutting method of workpiece and workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently improve luminance of a light conductive plate by efficiently improving transmissivity of the light of the microlens array type light conductive plate 11 having a required plurality of microlenses. <P>SOLUTION: The microlenses of the light conductive plate 1 are formed as a mirror surface by removing a part between a contour line 34 of a transparent raw material 31 and the light conductive plate 11 by elliptically vibrating and cutting the required-shaped transparent raw material 31 such as an acrylic plate by a cutting tool 32. That is, first of all, the transparent raw material 31 is cut in the main component force direction B by the cutting tool 32, and the cutting tool 3 is separated in the back component force direction D from a machined material 1, and next, chips 5 cut from the transparent raw material 31 are pulled up in the back component force direction D by an edge of the cutting tool 32, and the chips 5 are made to flow out in the chip flowing-out direction E, and the microlenses of the light conductive plate 11 are formed as the mirror surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
TECHNICAL FIELD The present invention relates to a method of cutting a processed product for cutting a material (workpiece) and a processed product formed by the cutting method.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, various processed products have been formed by normally cutting a material (workpiece) using a normal cutting method.
For example, a light guide plate (processed product) used for a liquid crystal display device is formed by usually cutting a transparent material (work material) made of a plastic material such as an acrylic resin. As one type of light plate, a microlens array type light guide plate (optically transparent body) is known.
That is, the microlens array type (hereinafter, referred to as MLA type) light guide plate has a required number of microlenses (fine lenses) arranged on the surface of the light guide plate.
Therefore, it has been considered to form the above-mentioned MLA type light guide plate by usually cutting a transparent material.
[0003]
In addition, although the patent publication which described the conventional example mentioned above was investigated, it could not be found.
[0004]
[Problems to be solved by the invention]
However, when processing the microlenses of the MLA-type light guide plate described above, fine processing is required. However, when a transparent material such as the above-mentioned acrylic resin is usually cut and processed to form the MLA-type light guide plate. In some cases, it is difficult to perform fine processing, for example, a processing surface including a surface of each microlens formed on the light exit surface side of the light guide plate is melted by friction heat (cutting heat).
That is, as described above, in the case of ordinary cutting, the above-mentioned cut surface (including the surface of the microlens) does not become a mirror surface (a processed surface having transparency), but is easily formed into a ground glass (white turbidity).
Therefore, the light exit surface of the light guide plate including the frosted glass-like microlens surface becomes an obstacle to light, and there is an adverse effect that the light transmittance of the MLA-type light guide plate is reduced and the luminance is reduced.
[0005]
That is, an object of the present invention is to efficiently improve the light transmittance of a processed product (optically transparent body) that has been cut, thereby efficiently improving the luminance.
Another object of the present invention is to provide a processed product and a method of cutting the processed product, which can efficiently improve light transmittance and improve luminance efficiently.
[0006]
[Means for Solving the Problems]
A method of cutting a processed product for solving the above-mentioned technical problem is characterized in that a processed material having a required shape is formed by performing elliptical vibration cutting on a material.
[0007]
Further, a processed product according to the present invention for solving the above-mentioned technical problem is characterized by being subjected to elliptical vibration cutting into a required shape.
[0008]
Further, a processed product according to the present invention for solving the technical problem as described above is characterized in that the processed product is a transparent body.
[0009]
Further, a processed product according to the present invention for solving the technical problem as described above is characterized in that the processed product is a suction component.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a description will be given based on an embodiment diagram.
[0011]
First, the first embodiment will be described with reference to FIGS. 1 (1), 1 (2), 2 (1), 2 (2), and 3. FIG.
FIGS. 1A and 1B are diagrams illustrating a method of processing an MLA-type light guide plate according to the present invention by performing elliptical vibration cutting.
FIGS. 2A and 2B are patterns (including size, number, and arrangement) of the microlenses of the MLA-type light guide plate according to the present invention.
FIG. 3 is a diagram illustrating a processing method (principle) of the elliptical vibration cutting.
[0012]
Further, as shown in FIGS. 1 (2) and 2 (1), a required number of microlens projections 13 are provided on the light exit surface 12 side of the MLA type light guide plate 11 processed and formed in this embodiment. And a required number of concave portions 15 of the microlenses are provided on the reflection surface 14 side of the light guide plate 11 in correspondence with the convex portions 13 of the microlenses.
The convex portion 13 of the microlens is formed on the light exit surface 12 of the light guide plate 11 in a state of, for example, projecting into a single lens shape or a hemispherical shape, and the concave portion 15 of the microlens is formed. The light guide plate 11 is formed, for example, in a single lens shape or a hemispherical shape under the reflection surface 14 of the light guide plate 11.
As shown in FIGS. 1 (2) and 2 (1), the pattern (16) of the microlens convex portion 13 formed on the light exit surface 12 of the light guide plate 11 is formed by microlenses having different sizes. The microlenses (the above-mentioned projections 13) are arranged at predetermined positions, and the microlenses 18 and the large microlenses 19 are sequentially increased from the sidelight with a reflector (the position of which is indicated by the light source 17) side. (Referred to as “pattern 16 of different kinds of lenses”).
Therefore, the light (not shown) from the light source 17 passes while being separated from the small microlens 18 (above the small microlens 18 shown in the figure), and is transmitted to the large microlens 19. The light enters and exits from the light exit surface 12 side, so that the luminance of the light guide plate 11 can be efficiently improved.
As shown in FIG. 2B, on the light exit surface 22 side of the MLA type light guide plate 21, the “similar lens pattern 24” is configured by arranging microlenses 23 having the same size with a predetermined regularity. May be adopted.
[0013]
That is, the light guide plate 11 can form a microlens having a fine shape by elliptical vibration cutting.
Therefore, as shown in FIG. 1A, for example, a transparent material 31 of a required shape such as an acrylic plate is cut by a cutting tool 32 such as a cutting tool while the cutting edge thereof is elliptically vibrated, thereby obtaining a light guide plate of a required shape. (The MLA type light guide plate 11 shown in FIGS. 1 (2) and 2 (1)) is formed.
In FIG. 1A, reference numeral 33 denotes the trajectory of the elliptical vibration drawn by the cutting edge of the cutting tool 32, A denotes the cutting direction, B denotes the main component direction, C denotes the feed component direction, and D denotes the spine direction. The direction of the component force is shown.
In FIG. 1 (2), reference numeral 34 denotes an outline of the transparent material 31. The light guide plate 11 is shown inside (the outline 34 of) the transparent material 31 and the transparent material 31 is provided. The space between the outer line 34 of the light guide plate 31 and the light guide plate 11 is removed by elliptical vibration cutting.
[0014]
Next, the elliptical vibration cutting will be described with reference to FIG.
That is, the example of the elliptical vibration cutting shown in FIG. 3 is configured to cut a work material 1 (corresponding to the above-described transparent material 31) such as a steel material or a plastic material with a predetermined cutting thickness 2, and An elliptical vibration cutting device is used to perform elliptical vibration cutting of the work material 1 (material).
In addition, the above-described elliptical vibration cutting apparatus includes, for example, a piezoelectric element (not shown) that applies vibration to the cutting edge of the cutting tool 3 (corresponding to the above-described cutting tool 32) such as a cutting tool in the X direction or in the X direction. ) Is provided, and the piezoelectric element for generating vibrations in the XY directions includes a sinusoidal voltage having a predetermined voltage, a predetermined frequency (for example, an ultrasonic region), and a predetermined phase difference (for example, 90 degrees). It is configured so that each can be input separately.
Therefore, in the above-described elliptical vibration cutting device, by inputting a predetermined sine-wave voltage to each of the piezoelectric elements separately, the vibration generated in the two directions of XY is mechanically resonantly synthesized to perform the cutting. The trajectory 4 of the elliptical vibration having a predetermined cycle at the cutting edge of the tool 3 (corresponding to the trajectory 33 described above) can be generated.
In FIG. 3, the X direction corresponds to the cutting direction A and the main component force direction B, and the Y direction corresponds to the back component force direction D.
[0015]
That is, as shown in FIG. 3, first, the work material 1 is cut by the cutting tool 3 in the main component force direction B (the left direction in the figure) according to the trajectory 4 of the elliptical vibration. The cutting tool 3 is separated from the workpiece 1 in the back force direction D (upward in the illustrated example).
At this time, the chips 5 cut from the work material 1 are lifted in the back force direction D (upward in the example in the figure) by the cutting tool 3 (the cutting edge thereof). The chips 5 flow out in the chip outflow direction E.
That is, in the cutting by the above-described elliptical vibration cutting method, the frictional resistance decreases or reverses (negative frictional resistance) as compared with the normal cutting method.
Accordingly, the cutting resistance of the work material 1 with respect to the cutting tool 3 is reduced, and the cutting force of the cutting tool 3 can be reduced, thereby improving the machinability.
Next, the cutting tool 3 is separated from the chip 5 in the main component force direction B (right direction in the example), and the cutting tool 3 is moved in the back force direction D (downward in the example). ), That is, it is moved to the work material 1 side.
That is, by the above-described elliptical vibration cutting method, the cutting tool 3 is periodically vibrated according to the trajectory 4 of the elliptical vibration, whereby the work material 1 is processed by the elliptical vibration cutting. It is configured to be able to.
Therefore, in the above-mentioned elliptical vibration cutting method, the thickness of the chip 5 is reduced, the cutting resistance is reduced, and the surface of the work material 1 is compressed and deformed as compared with the normal cutting method. Embrittlement can be efficiently prevented, mirror finishing is possible, the life of the cutting tool 3 is extended, the accuracy of the processed shape is improved, and burrs are suppressed. There are advantages such as prevention of chatter vibration and reduction of cutting heat (friction heat).
In FIG. 3, reference numeral 6 denotes a shear angle. As the shear angle 6 increases, the machinability of the work material 1 improves.
[0016]
In addition, improvement of light transmittance (improvement of luminance) of a processed product by the above-described elliptical vibration cutting method will be described.
That is, when the above-described work material 1 (material) is normally cut by the above-described normal cutting method, the cutting resistance increases and a frictional resistance force (friction heat) is generated. The surface of ()) is melted and becomes frosted glass, and light transmittance is deteriorated.
However, in the cutting by the elliptical vibration described above, the cutting resistance is reduced and the frictional resistance (friction heat) is reduced as compared with the normal cutting method, so that the surface of the work material 1 (material) is melted. Since the deterioration can be efficiently prevented, it is possible to efficiently prevent the surface of the work material 1 from being formed into a frosted glass shape and to perform mirror finishing.
Therefore, the surface of the workpiece 1 can be mirror-finished by the above-described elliptical vibration cutting method, so that the light transmittance of the processed product processed by the above-described elliptical vibration cutting method can be efficiently increased. Can be improved.
[0017]
The improvement in mechanical strength (including durability and abrasion resistance) of a processed product by the above-described elliptical vibration cutting method will be described.
That is, when the work material 1 (raw material) is normally cut by the above-described normal cutting method, the cutting resistance increases, and the surface of the work material 1 becomes compressively deformed and becomes brittle (as described above). Melt deterioration and crack vibration), the mechanical strength of the surface of the above-mentioned normally cut workpiece becomes weaker than the mechanical strength of the work material 1 itself as a material, and as a result, The mechanical strength of the entire processed product is weakened, and finally, the durability of the processed product is deteriorated.
However, in the above-mentioned elliptical vibration cutting method, the above-mentioned chip 5 is pulled up by the above-mentioned cutting tool 1, and is not a structure in which the surface of the work material 1 is compressed and embrittled.
That is, when the work material 1 is cut by the elliptical vibration cutting method, the surface of the work material 1 is not subjected to compression embrittlement, so that the strength of the material itself of the work material 1 is maintained. be able to.
Therefore, the processed product cut by the above-mentioned elliptical vibration cutting method can efficiently improve the mechanical strength of the entire processed product as compared with the conventional ordinary cutting method, thereby improving the durability of the processed product. It can be improved efficiently.
The processed product cut by the elliptical vibration cutting method described above can efficiently prevent the surface of the processed product from being embrittled and degraded as compared with the conventional normal cutting method. The mechanical strength of the product can be efficiently improved, and the wear resistance of the processed product can be efficiently improved.
[0018]
In addition, high-precision machining of a processed product by the above-described elliptical vibration cutting method will be described.
That is, when the above-mentioned work material (raw material) is normally cut by the above-mentioned normal cutting method, the cutting resistance increases, and the surface of the work material becomes compressively deformed and becomes brittle. Cannot be formed into a required shape, and the dimensional accuracy of the processed product is reduced.
In particular, when a work having a fine shape is usually cut from the above-described work material, the dimensional accuracy of the work becomes extremely low.
However, the above-described elliptical vibration cutting method has a configuration in which the above-described chip 5 is pulled upward by the above-described cutting tool, and does not have a configuration in which the surface of the work material is compression-brittle.
Therefore, by performing the elliptical vibration cutting of the above-described work material 1 by the above-described elliptical vibration cutting method, the processed product is efficiently and efficiently formed into a required shape (including a fine shape) with a high processing accuracy. be able to.
[0019]
That is, in the first embodiment, as shown in FIGS. 1 (1) and 1 (2), when the transparent material 31 is subjected to the elliptical vibration cutting to form the MLA type light guide plate 11, the above-described elliptical vibration is used. The cutting method can reduce the frictional heat as compared with the normal cutting method, and efficiently forms the MLA-type light guide plate 11 into a mirror surface (transparent processing surface) instead of a ground glass (white turbidity). Accordingly, the light transmittance of the MLA-type light guide plate 11 can be efficiently improved, and the luminance can be efficiently improved.
[0020]
Further, conventionally, silk-screen printing of a reflective dot pattern has been performed on the reflective surface side of a light guide plate.
That is, the above-described elliptical vibration cutting method can efficiently form a fine shape on a work material (raw material) with high accuracy.
Therefore, it is possible to employ a configuration in which the light guide plate having the above-described reflection dot pattern is processed and formed by the above-described elliptical vibration cutting method.
[0021]
Next, the convex lens type optical sensor 35 shown in the second embodiment shown in FIG. 4A will be described.
That is, the convex lens type optical sensor 35 includes a convex lens 37 (optically transparent body) and a lens mounting section 38.
Further, similarly to the first embodiment, the above-described convex lens 37 can be formed by performing elliptical vibration cutting on a transparent material such as acrylic.
Therefore, similarly to the first embodiment, the light transmittance of the convex lens 37 can be efficiently improved, and the luminance can be efficiently improved.
Note that the convex lens type optical sensor in which the convex lens body 37 and the lens mounting portion 38 are integrated may be formed by performing elliptical vibration cutting on a transparent material.
[0022]
Next, the fine cross groove lens 41 provided in the cross groove lens type optical sensor of the third embodiment shown in FIG. 4B will be described.
That is, the cross groove lens 41 has a light receiving surface 42 having a fine cross groove formed on the end face side of the cross groove lens 41, and the cross groove of the light receiving surface 42 has a required number. And a required number of horizontally running fine V-shaped grooves 43 (finely shaped prisms) are provided at right angles (crossroads) to each other. Have been.
Further, similarly to the first embodiment, the cross groove lens 41 can be formed by performing an elliptical vibration cutting process on a transparent material such as acrylic.
Therefore, similarly to the first embodiment, the light transmittance of the cross groove lens 41 (prism surface) can be efficiently improved, and the luminance can be efficiently improved.
The convex lens type optical sensor 35 shown in FIG. 4A and the cross groove lens type optical sensor (cross groove lens 41) shown in FIG. 4B detect and detect a predetermined position of an object. .
[0023]
Further, in each of the above-described embodiments, the configuration in which the MLA-type light guide plate, the convex lens, and the cross groove lens which are the optically transparent body are formed by performing the elliptical vibration cutting of the transparent material is exemplified. For example, a prism, a concave lens, or the like may be formed by elliptical vibration cutting.
[0024]
In addition, an acrylic resin, a methacrylic resin, a polycarbonate resin, or the like can be used as the transparent material.
[0025]
Next, the suction unit 52 (suction component) of the suction conveyance device 51 of the fourth embodiment shown in FIG. 5 will be described.
That is, for example, the suction conveyance device 51 includes a suction unit 52 that suctions an object to be suctioned (not shown) such as a light guide plate, and a vacuum path 53 such as a vacuum tube whose one end is fitted to the suction unit. And a vacuuming mechanism 54 such as a vacuum pump provided at the other end of the vacuum path 3.
The suction section 52 includes a suction surface 55 having a fine cross groove, a fitting hole 56 for fitting the vacuum path 53 (vacuum tube), and a suction section 52 including the fitting hole 56. Is provided with a split portion 57 for fitting, which is partially cut away, and the suction surface 55 having the cross groove is provided with a required number of vertically running fine V-shaped grooves 58 (fine prisms). ) And a required number of laterally running fine V-shaped grooves 59 (fine-shaped prisms) are provided at right angles (crossroads) to each other.
Therefore, in the above-described suction and transfer device 51, the suction unit is operated by forcibly sucking and discharging the vacuum path 53 from one end side (the suction surface 55 side) of the vacuum path 53 by operating the above-described vacuuming mechanism 54. The suction target 55 is configured to be suction-fixed and transported on the suction surface 55 having the 52 cross grooves.
The cross grooves (the V-shaped grooves 58 and 59) of the suction surface 55 are formed by performing elliptical vibration cutting with a cutting tool such as a cutting tool.
Further, since the cross groove is provided on the suction surface 55 of the suction component 52 (part for suction), the present invention can be used not only for a hard suction target but also for a soft suction target. The object to be adsorbed can be efficiently adsorbed and fixed to the adsorbed surface 55 thus formed.
The suction component 52 can also serve as an optical sensor. In a normal case (when the optical sensor is not used), the material (the suction component 52) for processing the suction component 52 is as follows. It is not always necessary to use an optically transparent material.
[0026]
Now, with respect to the suction component shown in FIG. 5, the cross groove of the suction surface of the suction component of the suction conveyance device is conventionally formed by normally cutting a material such as a plastic material by a normal cutting method. .
However, the above-mentioned ordinary cutting has low machinability, and the surface of the material is easily deformed by compression deformation to be brittle, so that the mechanical strength and abrasion resistance on the suction surface of the suction component are easily reduced, and as a result, the suction The durability of the parts tends to deteriorate.
In particular, when the object to be suctioned is continuously transported in a state of being fixed by suction, the mechanical strength and the wear resistance of the suction surface of the suction component tend to be low. The shape of 59 is easily collapsed (along with the fine shape), and finally, there is a disadvantage that the durability of the suction component is reduced.
Therefore, it is required that the mechanical strength and abrasion resistance of the surface of the suction component in the suction transport device can be efficiently improved, and the durability of the suction component described above is efficiently improved.
[0027]
That is, as described above, the cross grooves 58 and 59 on the suction surface of the suction component shown in FIG. 5 are formed by performing elliptical vibration cutting on a material such as a plastic material.
Therefore, as compared with the suction component formed by the normal cutting method, the suction component formed by the elliptical vibration cutting method has the fine cross grooves 58 and 59 despite having the fine cross grooves 58 and 59. , The mechanical strength and the abrasion resistance can be efficiently improved, and the durability can be efficiently improved.
The elliptical vibration cutting according to the fourth embodiment is as described with reference to FIG.
[0028]
In addition, although a plastic material has been described as an example of the material of the suction component, an appropriate material such as a thermoplastic resin, a thermosetting resin, or a metal material can be used.
[0029]
In addition, the embodiment of the suction component of the suction conveyance device illustrated in FIG. 5 can be applied to, for example, a mechanical device component included in a mechanical device.
Further, the present invention can be applied to, for example, processing and forming a plastic gear as the mechanical device component.
That is, conventionally, a plastic material is usually cut by a normal cutting method to form a gear.
However, as described above, in the above-described normal cutting method, the surface of the gear is compression-brittle and the mechanical strength and wear resistance are likely to be low. When transmitting from one gear to another gear, the gears described above are liable to collapse from the contact portion, and ultimately the durability of the gears is poor.
Therefore, it is required that the mechanical strength and wear resistance of the surface of the gear can be efficiently improved and the durability of the gear can be efficiently improved.
In other words, as described above, a gear such as a plastic material is formed by elliptical vibration cutting.
Therefore, compared to a gear formed by a normal cutting method, a gear formed by an elliptical vibration cutting method can efficiently improve mechanical strength and abrasion resistance on the surface and efficiently improve durability. Can be improved.
[0030]
Next, a connector 61 (joint) according to a fifth embodiment will be described with reference to FIGS. 6 (1) and 6 (2).
FIG. 6A shows a state in which the above-described coupler 61 is separated, and FIG. 6B shows a state in which the above-described coupler 61 is united.
The connecting tool 61 includes a connecting tool main body 62 (female type) and an insertion member 63 (male type) that is inserted into the connecting tool main body 62 and fitted.
In addition, the insertion member 63 includes an insertion rod portion 64 (a convex portion) to be inserted into the connection tool main body 62 and a collar-shaped locking portion 65 provided on the base end side of the rod portion 64. It is composed of
The above-mentioned rod portion 64 is formed, for example, in a cylindrical shape.
Further, the connecting member main body 62 has the fitting portion 66 (recessed portion) into which the above-mentioned insertion rod portion 64 is fitted by being inserted, and the inside of the fitting portion 66 (the innermost portion in the illustrated example). A communication path 67 for communicating and connecting the communication path with the outside and an opening / closing means 68 for opening and closing the communication path 67 are provided.
[0031]
In addition, at least the surface of the connecting member 61 where the connecting member main body 62 and the insertion member 63 are in contact with each other is, for example, an elliptical vibration of the outer surface of the rod portion 64 and the inner surface of the fitting portion 66 described above. It is formed by cutting.
That is, by using the elliptical vibration cutting method described above, the size dimensions of the rod portion 64 and the fitting portion 66 can be formed with high precision as described above.
Therefore, when the above-mentioned rod portion 64 is inserted into the above-mentioned fitting portion 66 and fitted, it is possible to configure so that no gap is formed between the two.
In addition, when the said connection tool is formed using the usual cutting method conventionally performed, a clearance gap tends to generate | occur | produce between the said fitting part and the said bar part.
[0032]
Therefore, first, the rod portion 64 of the insertion member 63 is inserted and fitted into the fitting portion 66 of the coupling tool main body 62 described above.
At this time, the communication path 67 is open, and the air and the like in the fitting portion 66 are discharged to the outside through the communication path 67.
Next, the communication path 67 is closed by the opening / closing means 68.
At this time, in the fitting portion 66, a small space (not shown) formed on the tip side of the rod portion 64 is in a state of shutting off the outside air from the outside, and as described above. It is configured such that no gap is generated between the inner surface of the fitting portion 66 and the outer surface of the rod portion 66 described above.
That is, the insertion member 63 (the rod portion 64) can be combined with the connecting member main body 62 (the fitting portion 66) and fixed therewithin the range of the atmospheric pressure. As described above, the connecting tool 61 is connected.
Therefore, by using the above-mentioned elliptical vibration cutting method, a new type of connector 61 shown in FIGS. 6A and 6B can be provided.
[0033]
Further, the present invention may employ a configuration in which, for example, a mold material for resin molding is processed and formed by performing elliptical vibration cutting of a mold material by an elliptical vibration cutting method.
In this case, since the cavity surface for resin molding formed in the mold is mirror-finished, the mirror surface of the cavity is formed by the resin (cavity) during the resin molding by the mold. It can be transferred to the outer surface of the molded resin article to be mirror-finished.
In addition, as the above-mentioned resin molded product, an optical transparent body such as a light guide plate and a lens can be used.
Accordingly, by forming the mold for resin molding by performing elliptical vibration cutting on the mold material described above, it is possible to efficiently improve the light transmittance of the resin molded product resin-molded with the mold, and to improve the brightness. Can be efficiently improved.
[0034]
The present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately changed and selected as needed without departing from the spirit of the present invention. It is.
[0035]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, it has the outstanding effect that the transmittance | permeability of light in a processed product (optically transparent body) which has been cut can be efficiently improved, and the luminance can be efficiently improved.
[0036]
Further, according to the present invention, there is an excellent effect that it is possible to provide a processed product and a method of cutting the processed product, which are capable of efficiently improving light transmittance and improving luminance efficiently.
[Brief description of the drawings]
FIG.
FIG. 1 (1) is a schematic perspective view schematically showing a cutting method according to the present invention, and FIG. 1 (2) schematically shows a processed product according to the present invention corresponding to FIG. 1 (1). FIG.
FIG. 2 (1) is a schematic plan view schematically showing a reflection surface of the light guide plate shown in FIG. 1 (2), and FIG. 2 (2) is a schematic view of a reflection surface of another light guide plate. FIG.
FIG. 3 is a schematic front view schematically showing a cutting method according to the present invention.
FIG. 4 (1) and FIG. 4 (2) are schematic perspective views each schematically showing another processed product according to the present invention.
FIG. 5 is a schematic perspective view schematically showing another processed product according to the present invention.
6 (1) and 6 (2) are schematic front views schematically showing another processed product according to the present invention, and FIG. 6 (1) is a state where the processed product is separated. FIG. 6 (2) shows a state in which the processed products are united.
[Explanation of symbols]
1 Work material
2 Prescribed thickness
3 Cutting tools
4 Elliptical vibration trajectory
5 chips
6 Shear angle
11 Light guide plate
12 Light emitting surface
13 Micro lens convex part
14 Reflective surface
15 Micro lens convex part
16 Different lens patterns
17 Light source
18 small micro lens
19 Large Micro Lens
21 Light guide plate
22 Light emitting surface
23 micro lens
24 Same type lens pattern
31 Transparent material
32 cutting tools
33 locus
34 Outer Line
36 convex lens type optical sensor
37 convex lens
38 Lens mounting part
41 Cross groove lens
42 Cross groove light receiving surface
43 V-shaped groove
44 V-shaped groove
51 Suction transfer device
52 Suction part (suction part)
53 Vacuum path
54 Evacuation mechanism
55 suction surface
56 Fitting hole
57%
58 V-shaped groove
59 V-shaped groove
61 Connecting Tool
62 Connector body
63 Insertion member
64 insertion rod
65 Locking part
66 Fitting part
67 connecting passage
68 Opening / closing means
A Cutting direction
B main component force direction
C Feed force direction
D Back force direction
E Chip outflow direction

Claims (4)

A method for cutting a processed product, comprising forming a processed product of a required shape by performing elliptical vibration cutting on a material. A processed product characterized by being subjected to elliptical vibration cutting to a required shape. The processed product according to claim 2, wherein the processed product is a transparent body. The processed product according to claim 2, wherein the processed product is a suction component.

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