JP2004235466A - Electronic part mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To utilize the space effectively and to shorten the assembly line when part supplying units are provided for tape-accommodated electronic parts and for tray-accommodated electronic parts. <P>SOLUTION: In this electronic part mounting apparatus 1 wherein a beam 15 capable of moving in one direction is provided with a mounting head 6 capable of moving in the direction along the beam 15, first part-supplying units 3A, 3B, 3C, and 3D are arranged with their part-supplying ends facing a printed board transportation route, and also a second part-supplying unit 4A is arranged at a position upstream a printed board transportation mechanism. The second part-supplying unit 4A comprises an elevator mechanism 21 for elevating a multiplicity of pallets 12 mounted with trays 11 accommodating electronic parts to a level set for transportation, a pallet feeding mechanism 22 for moving the pallets 12 to a specified location in an electronic part pickup region from the elevator mechanism 21 along a chute 20, and a delivery mechanism for delivering printed boards P from the upstream unit to the printed board transportation mechanism. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a beam movable in one direction by a drive source, a mounting head movable in the direction along the beam by a drive source, and a print transported by a substrate transport mechanism by attracting an electronic component to the mounting head. The present invention relates to an electronic component mounting device provided with a suction nozzle to be mounted on a substrate.
[0002]
[Prior art]
An electronic component mounting apparatus of this type is disclosed in, for example, Japanese Patent Application Laid-Open No. H10-341098. In this type of electronic component mounting device, it is common to arrange a component supply device before and after the device.
[0003]
[Patent Document]
Japanese Patent Application Laid-Open No. H10-341098
[Problems to be solved by the invention]
For this reason, in this case, the component supply device for the electronic components stored in the tape and the component supply device for the electronic components stored in the tray are selected and installed in a form suitable for the production mode. However, when a component supply device for electronic components stored in a tape is installed before and after the device across the transport path of a printed circuit board, a user who wants to handle electronic components stored in a tray is provided with a component supply device for electronic components stored in a tray. Although the assembly line is adjusted by installing a plurality of mounting devices, there is a problem that the assembly line becomes long.
[0005]
Therefore, an object of the present invention is to effectively utilize a space and shorten an assembly line even when a component supply device for a tape storage electronic component and a component supply device for a tray storage electronic component are installed.
[0006]
[Means for Solving the Problems]
For this reason, the first invention provides a beam movable in one direction by a drive source, a mounting head movable in a direction along the beam by a drive source, adsorbs electronic components to the mounting head, and uses a substrate transport mechanism. In an electronic component mounting apparatus provided with a suction nozzle to be mounted on a printed circuit board to be conveyed, a first component supplying apparatus is provided in the apparatus main body such that a leading end on a component supplying side faces a conveying path of the printed circuit board. A second component supply device provided at an upstream position of the substrate transport mechanism, wherein the second component supply device raises and lowers a number of pallets on which trays storing and arranging electronic components are mounted so as to match a moving level. A pallet introduction mechanism for moving the pallet from the elevator mechanism along the chute to a predetermined position in the electronic component pickup area; The cement board is characterized in that a transfer mechanism for transferring the substrate transport mechanism.
[0007]
According to a second aspect of the present invention, a beam movable in one direction by a drive source is provided with a mounting head movable in a direction along the beam by the drive source, and the electronic component is attracted to the mounting head and transported by a substrate transport mechanism. An electronic component mounting device provided with a suction nozzle for mounting on a printed circuit board, wherein a first component supply device disposed in the device main body such that a leading end on a component supply side faces a conveyance path of the printed circuit board; A second component supply device provided at a downstream position of the substrate transport mechanism, wherein the second component supply device raises and lowers a number of pallets mounted with trays storing and arranging electronic components so as to match a movement level; A pallet introduction mechanism for moving the pallet from the elevator mechanism along the chute to a predetermined position in the electronic component pickup area, Characterized by comprising a transfer mechanism for transferring the preparative substrate downstream device.
[0008]
A third invention is characterized in that, in the first and second inventions, the delivery mechanism is arranged below the pallet, and is moved up and down by the elevator mechanism together with the pallet.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting device. The electronic component mounting device 1 includes a device main body 2 for mounting an electronic component on a printed circuit board P and a first device for supplying a relatively small electronic component to the device main body 2. The apparatus includes component supply devices 3A, 3B, 3C, and 3D, and second component supply devices 4A and 4B that supply large electronic components such as multi-lead components to the device main body 2.
[0010]
The first component supply devices 3A, 3B, 3C, and 3D can be detachably attached to the device main body 2 via a connector (not shown) so that the tip on the component supply side faces the transport path of the printed circuit board P. It is arranged so that it can be moved by a caster provided on the lower surface when the connecting tool is released and a handle (not shown) is pulled. The first component supply devices 3A, 3B, 3C, and 3D have a large number of cassette-type tape feeders 5 arranged side by side. Each of the tape feeders 5 peels off the cover tape by a peeling mechanism (not shown) and supplies the electronic components loaded in the storage portion of the carrier tape (not shown) one by one from the tip.
[0011]
A supply conveyor 7, a positioning unit 8 (having a conveyor), and a discharge conveyor 9 that constitute a substrate transport mechanism are provided between the opposed first component supply devices 3A and 3B and 3C and 3D. . The supply conveyor 7 conveys the printed circuit board P received from the upstream device to the positioning unit 8, and after the electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) by the positioning unit 8, the discharge conveyor 7 9 and then to the downstream device 13.
[0012]
By moving the mounting head 6 in the XY directions by the XY stage 10, the mounting head 6 picks up electronic components from the first component supply devices 3A, 3B, 3C, 3D or the second component supply devices 4A, 4B. The electronic component is mounted on the printed circuit board P on the positioning unit 8.
[0013]
Note that the first component supply devices 3A, 3B, 3C, and 3D are not limited to those in which a large number of cassette-type tape feeders 5 are arranged side by side, and a stick-type supply device or a bulk-type supply device may be used. .
[0014]
Then, the second component supply devices 4A and 4B face the other side that intersects perpendicularly with one side of the device main body 2 where the first component supply devices 3A, 3B, 3C and 3D face, and It is provided at an upstream position of the supply conveyor 7 and a downstream position of the discharge conveyor 9 constituting the substrate transfer mechanism. In the second component supply devices 4A and 4B, a large number of electronic components are arranged and arranged on a tray 11, and one or a plurality of the trays 11 are mounted on a pallet 12, and the pallet 12 is attached to a suction nozzle 17a. The electronic component is supplied to the apparatus main body 2 by facing the pickup area.
[0015]
Next, the XY stage 10 for moving the mounting head 6 in the XY directions will be described. That is, the beams 15, 15 long in the X direction rotate a screw shaft (not shown) by driving of a Y-axis motor, and move in the Y direction along a pair of left and right guides 16, 16. Each mounting head 6 is moved in the X direction by the X-axis motor.
[0016]
Note that each mounting head 6 is equipped with a vertical axis motor for moving the suction nozzle 17 up and down, and a θ axis motor for rotating the suction nozzle 17 around a vertical axis. Therefore, each suction nozzle 17 of the mounting head 6 can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.
[0017]
A component recognition camera (not shown) for recognizing the position of the electronic component sucked by the suction nozzle 17 is provided at a predetermined position between the substrate transport mechanism and the first component supply devices 3A, 3B, 3C, 3D. The displacement amount of the suction nozzle 17 with respect to the axis is detected, and the θ-axis motor, the X-axis motor, and the Y drive motor for driving the XY stage 10 by the displacement amount based on the detection result. Is moved for correction.
[0018]
Next, the second component supply devices 4A and 4B will be described in detail below. Each of the second component supply devices 4A and 4B includes an elevator mechanism 21 that stocks a large number of pallets 12 and vertically conveys the pallets 12 to a drawer level position that is a predetermined moving level position, that is, a position of the chute 20; A pallet introduction mechanism 22 for transporting the printed circuit board 12 from an elevator mechanism 21 to a pickup area of the apparatus main body 2 in a horizontal direction, a printed circuit board from an upstream apparatus (not shown) to the supply conveyor 7, and a printed circuit board P from the discharge conveyor 9. And a delivery mechanism 23 for delivery to the downstream device 13. The delivery mechanism 23 is arranged below the pallet 12 and is moved up and down together with the pallet 12 by the elevator mechanism 21. Therefore, since the delivery mechanism 23 is raised and lowered by the elevator mechanism 21, it does not hinder the operation of the elevator mechanism 21, there is no need to provide a special installation space, and a part of the elevator mechanism 21 is used. It can be manufactured at a low cost with a small space. The delivery mechanism 23 is specifically configured by a bridging conveyor, but may be a chute in which the printed board P slides as long as a mechanism for moving the delivery board 23 is provided.
[0019]
The transfer mechanism 23 of the second component supply device 4A transfers the printed board P from the upstream device to the board transfer mechanism, and the transfer mechanism 23 of the second component supply device 4B transfers the printed board P from the board transfer mechanism. It is transferred to the downstream device 13.
[0020]
The elevator mechanism 21 includes a pallet stocker 25 for accommodating a large number of pallets 12 in a vertical direction, and an elevating mechanism 26 for elevating each pallet 12 via the pallet stockers 25. The pallet stocker 25 includes a plurality of shelves 27 on which the pallets 12 are placed. The pallets 12 are opened in the vertical direction. Drawn to.
[0021]
The elevating mechanism 26 includes a ball screw 28 that is screwed to a part of the pallet stocker 25 and elevates the pallet stocker 25, guide rails 29 disposed on both sides of the ball screw 28, and an elevating motor 30 that rotates the ball screw 28. It consists of. The pallet stocker 25 is guided by a guide rail 29 to move up and down by the forward and reverse rotation of the ball screw 28 via the elevating motor 30.
[0022]
In the elevating operation by the elevator mechanism 21 configured as above, the desired level position of the shelf member 27 of the pallet stocker 25 and the level position of the chute 20 of the pallet introduction mechanism 22 are matched.
[0023]
The pallet introduction mechanism 22 includes a chute 20 disposed on the apparatus main body 2 and a pair of locking claws 32 which slide on the chute 20 to advance and retreat and can be locked to the hooks 31 of the pallet 12. And a drive mechanism (not shown) for moving the drawer housing 33 forward and backward. Then, the drawer housing 33 is advanced by the driving mechanism, and is moved along the guide 34 so that the pair of locking claws 32 is moved away from the hooks 31 of the pallet 12 housed in the elevator mechanism 21 by a driving source (not shown). The drawer housing 33 is retracted along the chute 20 by the driving mechanism and introduced into the pickup area.
[0024]
The operation of the above configuration will be described below. First, the transfer mechanism 23 of the second component supply device 4A transfers the printed board P from an upstream device (not shown) to the board transfer mechanism. In this case, the elevator motor 21 is driven to move the elevator mechanism 21 up and down so that the level position of the supply conveyor 7 matches the level position of the bridging conveyor of the delivery mechanism 23. To the positioning unit 8 via the supply conveyor 7. Then, in the positioning section 8, the positioning mechanism is positioned and fixed by a positioning mechanism, and a plurality of positioning marks attached to the printed circuit board P are imaged by a board recognizing camera (not shown).
[0025]
Then, according to the mounting data (not shown), the XY coordinate position to be mounted on the printed circuit board, the rotation angle position around the vertical axis, and the electronic components and the like, which are stored for each step number, are first set. The electronic component to be mounted by the suction nozzle 17 corresponding to the component type of the electronic component is sucked and taken out from the first component supply device 3A, for example. At this time, the mounting head 6 moves to take out the electronic component to be mounted, but the X-axis motor and the Y-axis motor are driven to move the XY stage 10 to move the mounting head 6 and to drive the vertical motor. The electronic component is taken out from the first component supply device 3A by lowering the suction nozzle 17.
[0026]
On the other hand, the mounting head 6 moves to a position above the printed circuit board P. During this movement, the mounting head 6 stops at a position above a component recognition camera (not shown), and the electronic component held by the suction nozzle 17 is held by the component recognition camera. The position of the electronic component is recognized by the component recognition processing unit with respect to the XY directions and the rotation angle as to how much the electronic component is sucked and held with respect to the suction nozzle 17.
[0027]
The X-axis motor, the Y-axis motor, and the θ-axis control unit (not shown) are imaged by the board recognition camera and correspond to the position shift of the printed circuit board by the board recognition processing unit and the position shift of the electronic component by the component recognition processing unit. By controlling the motor, the rotational angular position around the X, Y directions and the vertical axis is corrected. After this correction, the suction nozzle 17 is lowered and the electronic component is mounted at a predetermined position on the printed circuit board P. Hereinafter, the electronic components are sequentially mounted on the printed circuit board P.
[0028]
Next, a case where the second component supply devices 4A and 4B are used as shown in FIGS. 5 and 6 will be described. For example, when the electronic component of the mounting step number 0002 is stored in the second component supply device 4B, the operation of pulling out the pallet 12 storing the electronic component starts. That is, the lifting / lowering operation of the elevator mechanism 21 is controlled by driving the lifting / lowering motor 30 by a control device (not shown), and the level position of the shelf member 27 of the pallet stocker 25 containing the electronic component of the mounting step number 0002 and the level position described above. As described above, the level position of the chute 20 of the pallet introduction mechanism 22 is matched, the drawer storage body 33 is advanced by the drive mechanism, and the pair of locking claws 32 are moved away from each other to be locked on the hook 31. Next, the drawer housing 33 is retracted, the pallet 12 is slid on the chute 20 and introduced into the pickup area (see FIG. 5), and the electronic components are sucked and taken out by the suction nozzle 17. The second component supply device 4A for storing other electronic components operates in the same manner, and a description thereof will be omitted.
[0029]
At this time, the mounting head 6 moves to take out the electronic component to be mounted, but the X-axis motor and the Y-axis motor are driven to move the XY stage 10 to move the mounting head 6, and the vertical motor is moved. The electronic component is taken out from the tray 11 on the pallet 12 of the second component supply device 4B by being driven to lower the suction nozzle 17.
[0030]
At this time, the suction nozzle 17 is moved up by the vertical motor after the component is sucked, and the mounting head 7 moves to a position above the printed circuit board P. During this movement, the mounting head 7 stops at a position above a component recognition camera (not shown). A component recognition camera captures an image of the electronic component sucked and held by the suction nozzle, and determines how much the electronic component is sucked and held with respect to the suction nozzle 17 in the XY directions and the rotation angle. Indicates the position.
[0031]
Then, the control device controls the X-axis motor, the Y-axis motor, and the θ-axis motor by the position shift of the printed circuit board by the board recognition processing unit and the position shift of the electronic component by the component recognition processing unit. Under the control, the rotation angle position around the X, Y directions and the vertical axis is corrected. After this correction, the suction nozzle 17 is lowered and the electronic component is mounted at a predetermined position on the printed circuit board P. Hereinafter, the electronic components are sequentially mounted on the printed circuit board P.
[0032]
If the electronic component to be mounted next is not stored in the tray 11 on the pallet 12 that has been pulled out, but is stored in the tray 11 on another pallet 12, the drawer storage is performed by a driving mechanism. After the body 33 is advanced to enter the pallet stocker 25, the pair of locking claws 32 are moved closer to each other to release the locking with the hook 31, and the pallet 12 is returned to the pallet stocker 25 and then pulled out. The storage body 33 is moved backward while sliding on the chute 20. Next, as described above, the elevator motor 21 is driven to move the elevator mechanism 21 up and down, and the level position of the shelf member 27 of the pallet stocker 25 containing the next electronic component matches the level position of the chute 20. Then, the drawer storage body 33 is advanced by the drive mechanism, the pair of locking claws 32 are moved away from each other, and the drawer storage body 33 locked on the hook 31 is retracted, and the pallet 12 is slid on the chute 20. The electronic component is moved into the pickup area, and the electronic components are sucked out of the tray 11 by the suction nozzle 17 to be taken out. After the removal, the pallet 12 is returned to the pallet stocker 25 as described above.
[0033]
As described above, the suction nozzle 17 of the mounting head 6 picks up an electronic component from the first component supply device 3A, 3B, 3C, 3D or the second component supply device 4A, 4B according to the mounting data (not shown) one after another. Then, the electronic component is mounted on the printed circuit board P.
[0034]
When all the electronic components have been mounted on the printed circuit board P, the electronic components are transported from the positioning unit 8 to the discharge conveyor 9 and then transported to the downstream device 13. In this case, the elevator motor 30 is driven to move the elevator mechanism 21 up and down so that the level position of the discharge conveyor 9 matches the level position of the bridge conveyor of the delivery mechanism 23, and the bridge conveyor of the delivery mechanism 23 is moved from the discharge conveyor 9. It is conveyed to the downstream device 13 via the control unit.
[0035]
Although the embodiments of the present invention have been described above, various alternatives, modifications or variations are possible for those skilled in the art based on the above description, and the present invention is not limited to the above various alternatives without departing from the spirit thereof. It is intended to cover examples, modifications or variations.
[0036]
【The invention's effect】
As described above, according to the present invention, the space can be effectively used and the assembly line can be shortened even when the component supply device for the tape storage electronic components and the component supply device for the tray storage electronic components are installed.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting device in a state where a pallet is pulled out from a second component supply device.
FIG. 2 is a vertical cross-sectional front view of the electronic component mounting device in a state where a pallet is pulled out from a second component supply device.
FIG. 3 is a right side view of the electronic component mounting device.
FIG. 4 is a plan view of the drawer storage body on which a pallet is placed.
FIG. 5 is a partial vertical front view of the electronic component mounting apparatus showing a pallet pull-out operation.
FIG. 6 is a partial vertical front view of the electronic component mounting apparatus showing a delivery operation of a printed circuit board.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 electronic component mounting device 2 device main bodies 3A to 3D first component supply device 4A, 4B second component supply device 6 mounting head 11 tray 12 pallet 15 beam 17 suction nozzle 20 shoot 21 elevator mechanism 22 pallet introduction mechanism 23 delivery mechanism 25 pallet Stocker 26 lifting mechanism

Claims (3)

A beam that can be moved in one direction by the drive source is provided with a mounting head that can be moved by the drive source in a direction along the beam. An electronic component mounting device provided with a suction nozzle that is provided with a first component supply device disposed on the device main body such that a tip end on the component supply side faces a transport path of a printed board; and an upstream position of the substrate transport mechanism. And a second component supply device provided in the second component supply device. The second component supply device lifts and lowers a large number of pallets on which trays containing electronic components are arranged to fit a moving level, and a chute from the elevator mechanism. A pallet introduction mechanism for moving the pallet to a predetermined position in the electronic component pickup area along the An electronic component mounting apparatus characterized by comprising a transfer mechanism for transferring the mechanism. A beam that can be moved in one direction by the drive source is provided with a mounting head that can be moved by the drive source in a direction along the beam. An electronic component mounting apparatus provided with a suction nozzle to be mounted, a first component supply apparatus disposed in the apparatus main body such that a leading end on the component supply side faces a transport path of a printed circuit board, and a downstream position of the substrate transport mechanism. And a second component supply device provided in the second component supply device. The second component supply device lifts and lowers a large number of pallets on which trays containing electronic components are arranged to fit a moving level, and a chute from the elevator mechanism. A pallet introduction mechanism for moving the pallet to a predetermined position in the electronic component pickup area along the printed circuit board; An electronic component mounting apparatus characterized by comprising a transfer mechanism for transferring the device. The electronic component mounting apparatus according to claim 1, wherein the delivery mechanism is disposed below a pallet, and is moved up and down by the elevator mechanism together with the pallet.

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