JP2004235407A5 - - Google Patents
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- Publication number
- JP2004235407A5 JP2004235407A5 JP2003021831A JP2003021831A JP2004235407A5 JP 2004235407 A5 JP2004235407 A5 JP 2004235407A5 JP 2003021831 A JP2003021831 A JP 2003021831A JP 2003021831 A JP2003021831 A JP 2003021831A JP 2004235407 A5 JP2004235407 A5 JP 2004235407A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003021831A JP4134741B2 (en) | 2003-01-30 | 2003-01-30 | Plasma etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003021831A JP4134741B2 (en) | 2003-01-30 | 2003-01-30 | Plasma etching method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004235407A JP2004235407A (en) | 2004-08-19 |
| JP2004235407A5 true JP2004235407A5 (en) | 2006-02-23 |
| JP4134741B2 JP4134741B2 (en) | 2008-08-20 |
Family
ID=32951062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003021831A Expired - Fee Related JP4134741B2 (en) | 2003-01-30 | 2003-01-30 | Plasma etching method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4134741B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007317988A (en) * | 2006-05-29 | 2007-12-06 | Shin Etsu Handotai Co Ltd | Manufacturing method of laminated wafer |
| JP5067006B2 (en) * | 2007-05-15 | 2012-11-07 | パナソニック株式会社 | Atmospheric pressure plasma treatment method |
| JP2013191404A (en) * | 2012-03-14 | 2013-09-26 | Toyota Gakuen | Nozzle for microplasma capable of contacting sample |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794712B2 (en) * | 1987-05-28 | 1995-10-11 | 東京エレクトロン株式会社 | Plasma processing device |
| US5336355A (en) * | 1991-12-13 | 1994-08-09 | Hughes Aircraft Company | Methods and apparatus for confinement of a plasma etch region for precision shaping of surfaces of substances and films |
| JP3345079B2 (en) * | 1993-02-26 | 2002-11-18 | 株式会社半導体エネルギー研究所 | Atmospheric pressure discharge device |
| JP3207611B2 (en) * | 1993-06-02 | 2001-09-10 | 三洋電機株式会社 | Method for manufacturing semiconductor device |
| JP3175891B2 (en) * | 1994-01-17 | 2001-06-11 | 株式会社半導体エネルギー研究所 | Plasma generator and etching method using the same |
| JP3612158B2 (en) * | 1996-11-18 | 2005-01-19 | スピードファム株式会社 | Plasma etching method and apparatus |
| JP4016540B2 (en) * | 1999-08-19 | 2007-12-05 | 松下電工株式会社 | Plasma processing system |
| JP2002057440A (en) * | 2000-06-02 | 2002-02-22 | Sekisui Chem Co Ltd | Discharge plasma processing method and apparatus thereof |
| JP2002155370A (en) * | 2000-11-14 | 2002-05-31 | Sekisui Chem Co Ltd | Method and system for atmospheric pressure plasma treatment |
| JP2003249490A (en) * | 2001-12-20 | 2003-09-05 | Mitsubishi Heavy Ind Ltd | Radical gun |
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2003
- 2003-01-30 JP JP2003021831A patent/JP4134741B2/en not_active Expired - Fee Related