JP2004233120A - Instrument and method for measuring temperature - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an instrument and method for measuring temperature by which the temperature of an object to be measured can be measured accurately without coming into direct contact with the object. <P>SOLUTION: A temperature detecting part 23 outputs measured temperatures T1 and T2 from first and second temperature measuring parts disposed at different distances from the object to be measured and a measured temperature T3 measured in advance from the object. An inputting part 33 inputs the measured temperatures T1, T2, and T3 after performing A/D conversion on the temperatures T1, T2, and T3. A factor setting part 39 sets factors K related to the thermal resistances between the first and second temperature measuring parts and the object. A factor correcting part 35 determines correction factors K' for temperature calculation by correcting the factors K by using a correction factor α in accordance with the variations in the measured temperatures T1 and T2. A temperature calculating part 37 calculates the temperature T3' of the object by correcting the measured temperatures T1 and T2 by using the correction factors K' for temperature calculation. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a temperature measurement device and a temperature measurement method, and particularly to an object to be measured which is difficult to measure temperature by directly contacting a temperature sensor such as a high-temperature heating object, a moving body, a rotating object, etc. The present invention relates to a non-contact type temperature measuring device and a temperature measuring method for measuring.
[0002]
[Prior art]
Conventionally, as a non-contact type temperature measuring method, as shown in FIG. 9, three temperature measuring units Pa, for example, made of a thermocouple, are placed in a cylindrical body 5 having an open surface 3 at one end with respect to an object 1 to be measured. There is a type that measures the temperature Td of the measurement target point Pd of the DUT 1 using the sensor unit 7 on which Pb and Pc are arranged.
[0003]
The sensor unit 7 positions the temperature measurement units Pa and Pc at the same distance from the temperature measurement point Pd of the DUT 1 in the vicinity of the open surface 3 of the cylindrical body 5 and uses the temperature measurement units Pa and Pc as bases 2 The depth of the cylinder 5 is defined as a vertex of an equilateral triangle, and the depth of the cylinder 5 is defined as a temperature measuring portion Pb, and a voltage difference V between the temperature measuring portions Pa and Pc is measured.
[0004]
In such a temperature measurement method, the sensors are set so that the temperature difference (Td−Ta) and (Tb−Ta) become equal for the temperatures Ta, Tb, Tc, and Td of the temperature measurement units Pa to Pc and the temperature measurement point Pd. If the position intervals x1 and x2 of the unit 7 are adjusted, the relationship between the temperatures Ta to Td becomes as shown in the following Expression 1.
Td = Ta− (Tb−Ta) (Equation 1)
[0005]
Since the potential difference V is expressed by the following equation 2,
V∝Ta- (Tb-Ta) (Equation 2)
If the potential difference V, that is, the output voltage at the temperature measuring units Pa and Pc of the sensor unit 7 is measured, the temperature Td of the temperature measuring point Pd of the DUT 1 can be measured in a non-contact manner.
[0006]
Patent Document 1 of this type is, for example, Japanese Patent Application Laid-Open No. 58-83223.
[0007]
Further, as another temperature measuring method, as shown in FIG. 10, a concave portion 15 is provided on a hot plate 13 arranged at an interval with respect to an object 11 heated at an interval by a heater 9. The heat flux sensor 17 and the temperature sensor 19 are arranged in the recess 15 to form the sensor unit 21, and the temperature Te of the temperature measurement point Pe of the object 11 is measured by the method including the following adjustment steps 1 and 2. There is something to do.
[0008]
In this temperature measurement method, as an adjustment step 1 which is a pre-measurement, the temperature Te of the temperature measurement point Pe of the object 11 is measured by an appropriate measuring means, and the heat flow q passing through the sensor section 21 is measured by a heat flux sensor. 17 and the temperature Tf of the sensor section 21 is measured by the temperature sensor 19.
[0009]
Next, the combined thermal resistance (Ro + Rg1) of the thermal resistance Rg1 related to the distance g1 between the upper surface of the heating plate 13 and the temperature measurement point Pe of the object 11 and the thermal resistance Ro of the object 11 and the temperature measurement From the temperature Te at the point Pe, the measured temperature Tf at the temperature sensor 19, and the heat flow value q at the heat flux sensor 17, a combined thermal resistance (Ro + Rg1) is calculated in the form of a coefficient k as in the following Expression 3, and stored. deep.
[0010]
(Ro + Rg1) = (Te−Tf) / q (Equation 3)
[0011]
Then, as adjustment step 2 which is the actual main measurement, the temperature Te ′ of the measured temperature point Pe is estimated and calculated from the coefficient k, the measured temperature Tf and the heat flow value q at the time of the main measurement as in the following Expression 4. I do.
[0012]
Te ′ = Tf + q (Ro + Rg1) (Equation 4)
[0013]
FIG. 10B is a heat transfer equivalent circuit diagram of FIG. A. In FIG. 10B, reference symbols Rg2, Rs, and Retc denote the thermal resistance of the gap g2 between the heater 9 and the DUT, and the heat of the temperature sensor 19. Resistance, heat plate 13 and other thermal resistance.
[0014]
As this kind of Patent Document 2, there is, for example, JP-A-2002-170775.
[0015]
[Patent Document 1]
JP-A-58-83223
[0016]
[Patent Document 2]
JP-A-2002-170775
[0017]
[Problems to be solved by the invention]
However, in the temperature measurement method of FIG. 9 described above, the temperature difference (Td−Ta) becomes equal to (Tb−Ta) for the temperatures Ta to Td of the temperature measurement units Pa to Pc and the temperature measurement point Pd. It is necessary to physically adjust the distances x1 and x2 as described above, but since the thermal resistance between the temperature measuring unit Pa and the measured temperature point Pd changes depending on the measured temperature, the distances x1 and x2 are kept constant over the entire measured temperature range. It is difficult to do so, and every time the measured temperature Td of the DUT 1 changes, it is necessary to adjust the physical positions of the temperature measurement units Pa to Pc in the sensor unit 7, and the measurement operation becomes complicated.
[0018]
Further, in the latter temperature measurement method relating to FIG. 10 described above, the coefficient k is considered as a fixed constant. However, since the coefficient k is actually a function of temperature and changes, the coefficient k obtained in the adjustment step 1 is changed. When used in the calculation in the adjustment step 2 under different temperature conditions, the measured temperature error tends to increase, and the error increases as the temperature condition in the adjustment step 2 departs from the temperature condition in the adjustment step 1, and in some cases, the error increases. The level may reach several degrees Celsius and pose a practical problem.
[0019]
Further, since the sensor unit 21 is installed in the concave portion 15 of the heat plate 13, the heat plate 13 around the sensors 17 and 19 is removed due to a difference in material between the heat flux sensor 17 and the temperature sensor 19 and the heat plate 13. There is also a problem that the heat flow rate penetrating therethrough is different from the heat flow rate q actually penetrating the sensors 17 and 19, and an undesired temperature distribution is generated on the hot plate 13, which is likely to cause a measurement temperature error.
[0020]
The present invention has been made in order to solve such a problem, and an object of the present invention is to provide a temperature measuring device and a temperature measuring method capable of accurately measuring the temperature without directly contacting an object to be measured.
[0021]
[Means for Solving the Problems]
In order to solve such a problem, a temperature measuring device according to the present invention includes a first temperature measuring unit arranged at a different distance from an object to be measured and a second temperature closer to the object to be measured. A temperature detecting section having a measuring section, and a coefficient previously set in relation to each thermal resistance between the first temperature measuring section and the second temperature measuring section and between the second temperature measuring section and the device under test. A coefficient correction unit for obtaining a temperature calculation correction coefficient obtained by correcting the set coefficient according to a change in the measured temperature from the first and second temperature measurement units; and a first and second temperature correction unit. A temperature calculation unit configured to correct the measured temperature from the measurement unit with the temperature calculation correction coefficient to calculate the temperature of the device under test.
[0022]
Moreover, in the temperature measuring device according to the present invention, the coefficient correction unit is provided with a combination table of the change in the measured temperature from the first and second temperature measurement units and the temperature calculation correction coefficient in accordance therewith. The correction coefficient for temperature calculation corresponding to the measured temperature can be output from the combination table.
[0023]
Further, the temperature measuring device according to the present invention is provided with a third temperature measuring section, in which the temperature detecting section comes in contact with the object to be measured and preliminarily measures the temperature of the object to be measured. A coefficient setting unit that calculates the coefficient related to the thermal resistance from the measured temperatures of the first, second, and third temperature measuring units and sets the coefficient in advance, and outputs the calculated coefficient to the coefficient correction unit. A configuration having such a configuration is also possible.
[0024]
Furthermore, the temperature measurement device according to the present invention includes a correction coefficient setting unit that sets a correction coefficient of a coefficient related to the thermal resistance according to a change in measured temperature from the first and second temperature measurement units. Alternatively, the coefficient correction unit may be formed to obtain the temperature calculation correction coefficient using the correction coefficient from the correction coefficient setting unit.
[0025]
Still further, in the temperature measurement device according to the present invention, the correction coefficient setting unit is configured to calculate and set the correction coefficient from the measurement temperatures of the first, second, and third temperature measurement units at the time of the preliminary measurement. It can be formed.
[0026]
The temperature measurement method according to the present invention includes a first temperature measurement unit and a second temperature measurement unit closer to the measured object arranged at different distances from the measured object; From the respective measured temperatures of the third temperature measuring section that directly contacts the object, at a predetermined preliminary measurement, the thermal resistance between the first and second temperature measuring sections and the thermal resistance between the second temperature measuring section and the object to be measured. A first step of previously determining and setting a coefficient relating to the thermal resistance of the sample, and comparing the coefficient relating to the thermal resistance with the measured temperature from the first and second temperature measuring units during actual actual measurement. A second step of obtaining a temperature calculation correction coefficient corrected in accordance with the change of the temperature, and correcting the measured temperatures from the first and second temperature measuring units with the temperature calculation correction coefficient to obtain an actual actual measurement time. A third step of calculating the temperature of the device under test in It is constructed by Bei.
[0027]
Further, in the temperature measurement method, at the time of the pre-measurement, a correction coefficient of a coefficient related to the thermal resistance is changed according to a change in the measured temperature from the first and second temperature measurement units. There is provided a fourth step of obtaining from the measured temperatures of the second and third temperature measuring units, and the second step may be a method of obtaining the temperature-calculating correction coefficient at the time of actual main measurement from the correction coefficient. .
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0029]
FIG. 1 is a diagram including a temperature detector and an object to be measured used in the temperature measuring device according to the present invention, FIG. 2 is a heat transfer equivalent circuit diagram thereof, and FIG. 3 is a block diagram showing the temperature measuring device according to the present invention. It is.
[0030]
Note that the temperature measurement method according to the present invention will be described in the process of describing the operation of the temperature measuring device according to the present invention.
[0031]
In FIG. 1, the temperature detecting unit 23 is composed of a hot plate 27 on which a heat source 25 such as a heater (not shown) is arranged, and a thermocouple arranged in series in the hot plate 27 so as to be shifted in the thickness direction. The first and second temperature measuring portions P1 and P2 are formed.
[0032]
The temperature detection unit 23 measures the temperature T3 of the measured temperature point P3 of the measured object 29 arranged at a distance g1 from the upper surface of the hot plate 27 by adjusting step 1 and adjusting step 2 as described later. The measured temperatures of the first temperature measuring section P1 and the second temperature measuring section P2 and the temperature measuring point P3 closer to the measured object 29 are output as electric signals.
[0033]
In the adjustment step 1 to be described later, the device under test 29 directly contacts the opposite side (upper side in the drawing) of the heating plate 27 at the temperature measurement point P3, for example, a third temperature measuring unit (not shown) such as a thermocouple. ) Is formed so that the temperature T3 of that portion is measured and output, and the opposite side (upper side in the figure) to the hot plate 27 is open, but for convenience, it is in contact with room temperature with an interval g2. Is shown in FIG. Note that the third temperature measurement unit also uses the reference symbol P3 as appropriate.
[0034]
FIG. 2 is a heat transfer equivalent circuit diagram including the temperature detection unit 23 and the device under test 29 as described above, and the symbols Rg2, Ro, Rg1, Rs, Rx, and Retc represent the temperature between the device under test 29 and room temperature. Thermal resistance at interval g2, thermal resistance of DUT 29 itself, thermal resistance between DUT 29 and second temperature measurement unit P2, thermal resistance between second and first temperature measurement units P2 and P1, 1 is the thermal resistance between the temperature measurement unit P1 and the hot plate 25, and the other heat resistances of the hot plate 25.
[0035]
In FIG. 3 showing the temperature measuring device according to the present invention, an input unit 33 converts the measured voltages indicating the measured temperatures T1, T2, and T3 from the temperature detecting unit 23 into analog signals and takes in the converted voltages. , A temperature calculating section 37, a coefficient setting section 39 and a correction coefficient setting section 41.
[0036]
The coefficient setting unit 39 relates to the thermal resistance between the DUT 29 and the second temperature measuring unit P2 from the measured temperatures T1 to T3 input from the input unit 33 during the preliminary measurement (adjustment step 1 described later). It calculates a (proportional) coefficient K, and is connected to the coefficient correction unit 35 via the switch SW1.
[0037]
The coefficient K corresponds to the thermal resistance ratio (Ro + Rg1) / Rs of the heat transfer equivalent circuit in FIG. 2, and as shown in FIG. 4, any reference temperature among the measurement temperatures (T1, T2), for example, the measurement temperature T2, This corresponds to the temperature T2r. Although not shown, the coefficient K similarly corresponds to an arbitrary reference measurement temperature T1r among the measurement temperatures T1.
[0038]
The correction coefficient setting unit 41 is a storage unit in which a correction coefficient α for correcting the coefficient K in accordance with the measured temperature is set in advance during the pre-measurement, and is connected to the coefficient correction unit 35 via a switch SW2 interlocked with the switch SW1. Have been.
[0039]
The switches SW1 and SW2 are ON / OFF switched from outside the temperature measuring device 31.
[0040]
The correction coefficient α indicates the amount of temperature change of the coefficient K, and is obtained at the time of preliminary measurement. For example, the amount of change between the measured temperature T2 and the coefficient K shown in FIG. 4 is the correction coefficient α, and the individual measured temperatures T2 that arbitrarily change from the coefficient K corresponding to the reference measured temperature T2r of the measured temperatures T2. In order to obtain the correction coefficient K ′ for temperature calculation, the deviation due to the temperature change is corrected.
[0041]
The correction coefficient α can be used to calculate the temperature calculation correction coefficient K ′ in consideration of the measured temperature T1.
[0042]
With this correction coefficient α, a temperature calculation correction coefficient K ′ can be calculated from the measurement temperatures T1 and T2 and the coefficient K, which are arbitrarily changed, and are used in the coefficient correction unit 35 described later.
[0043]
The coefficient correction unit 35 sets and stores the coefficient K from the coefficient setting unit 39 and the correction coefficient α from the correction coefficient setting unit 41 at the time of preliminary measurement, and at the time of actual main measurement (adjustment step 2 described later), By substituting the measured temperatures T1 and T2 from the input unit 33, the coefficient K and the correction coefficient α into a function F shown in the following equation 3, and calculating the values, the values change along with the changes in the measured temperatures T1 and T2. The temperature calculating correction coefficient K ′ is calculated, and is connected to the temperature calculating unit 37.
[0044]
In other words, the temperature calculation correction coefficient K ′ corresponds to each of the measurement temperatures (T1, T2) of the heating plate 27 that arbitrarily changes, and is a set of coefficients obtained by the following equation. The reference measurement temperature (T1r, T2r) is a coefficient obtained by temperature correction of the coefficient K corresponding to T2r) by the above-described correction coefficient α.
[0045]
K ′ = F (α, K, T1, T2) (Equation 3)
[0046]
The temperature calculation unit 37 substitutes the temperature calculation correction coefficient K ′ from the coefficient correction unit 35 and the measured temperatures T1 and T2 into a function f of the following equation 4 to calculate the temperature of the measured object 29. It calculates the temperature T3 ′ at the point P3, and is connected to the display unit 43.
[0047]
T3 ′ = f (K ′, T1, T2) (Equation 4)
[0048]
The display unit 43 is a known CRT or a liquid crystal display that displays the calculated temperature T3 ′ of the calculated measured temperature point P3.
[0049]
Next, the operation of the above-described temperature measuring device 31 according to the present invention will be described.
[0050]
The operation of the above-described temperature measurement device 31 includes an adjustment step 1 which is a pre-measurement and an adjustment step 2 which is an actual main measurement. Therefore, the adjustment step 1 will be described first.
[0051]
The adjustment step 1 is a period in which a third temperature measurement unit (not shown) such as a temperature measurement sensor is brought into contact with the temperature measurement point P3 of the measurement object 29 to measure the temperature, and the switches SW1 and SW2 are turned on. (Closed) state (first step).
[0052]
In this state, the coefficient setting unit 39 determines the thermal resistance between the DUT 29 and the second temperature measuring unit P2 and the first and second temperature measuring units P1 and P2 from the measured temperatures T1, T2, and T3 from the input unit 33. Calculates a coefficient K corresponding to the heat resistance ratio (Ro + Rg1) / Rs of the heat transfer equivalent circuit in FIG. 1 and outputs the coefficient K to the coefficient correction section 35 via the switch SW1. (First step).
[0053]
The correction coefficient setting unit 41 outputs a correction coefficient α preset for correcting the coefficient K to the coefficient correction unit 35 via the switch SW2, and the coefficient correction unit 35 stores the coefficient K and the correction coefficient α. I do.
[0054]
Next, adjustment step 2, which is a period during which the third temperature measurement unit is not allowed to contact the third temperature measurement point P3 of the device under test 29, will be described. In this state, the switches SW1 and SW2 are off (open).
[0055]
In this state, the coefficient correction unit 35 calculates the above equation 3 “K” based on the measured temperatures T1 and T2 from the input unit 33, the correction coefficient α from the correction coefficient setting unit 41, and the coefficient K from the coefficient setting unit 39. A temperature calculation correction coefficient K ′ is calculated using “= F (α, K, T1, T2)” and output to the temperature calculation unit 37 (second step).
[0056]
The temperature calculation unit 37 uses the temperature calculation correction coefficient K ′ from the coefficient correction unit 35, the measured temperatures T1, T2, and the correction coefficient α to obtain the equation 4 “T3 ′ = f (K ′, T1, T2)”. Calculates the temperature T3 'of the measured temperature point P3 and outputs it to the display unit 43 (third step).
[0057]
The display unit 43 displays the calculated temperature T3 'of the measured temperature point P3.
[0058]
In the above-described embodiment, the coefficient K is calculated and set by the coefficient setting unit 39 and output to the coefficient correction unit 35. However, in the present invention, a known coefficient K obtained by another method (not shown) is previously set in the coefficient setting unit 39. 39 may be set in advance, and this may be output to the coefficient correction unit 35 and stored in advance, and the setting configuration is arbitrary.
[0059]
Further, the correction coefficient setting unit 41 is not limited to the configuration in which the known correction coefficient α is set, as described above, and the correction coefficient α is obtained from the measured temperatures T1, T2, and T3 input from the input unit 33 in the adjustment step 1. Can be calculated and set, and this is output to the coefficient correction unit 35 (fourth step).
[0060]
Further, as for the coefficient correction unit 35, a combination table of changes in the measured temperatures T1 and T2 from the first and second temperature measurement units P1 and P2 and correction coefficients for temperature calculation corresponding thereto is provided. The temperature calculation correction coefficient according to the measured temperature may be obtained from the combination table and output to the temperature calculation unit 37.
[0061]
That is, the basic configuration of the present invention is as follows. The coefficient correction unit 35 is configured such that the measurement temperatures T1 and T2 of the first and second temperature measurement units P1 and P2 and the second temperature measurement unit P2 and the DUT 29 And a coefficient K previously set in relation to the thermal resistance of the first and second temperature measuring sections P1 and P2, and correcting the coefficient K in accordance with the change in the measured temperatures T1 and T2 from the first and second temperature measuring sections P1 and P2. The temperature calculating unit 37 is formed to obtain the coefficient K ′, and the temperature calculating unit 37 corrects the measured temperatures T1 and T2 from the first and second temperature measuring units P1 and P2 with the temperature calculating correction coefficient K ′ and What is necessary is just to be formed so that the temperature of the thing 29 may be calculated.
[0062]
In such a basic configuration, the coefficient K is calculated by the coefficient setting unit 39 from the measured temperatures T1 to T3 of the first and second temperature measuring units P1 and P2 and the measured temperature point (third temperature measuring unit) P3. Or the correction coefficient α is set by the correction coefficient setting unit 41, and the temperature is calculated by the temperature calculation unit 37 using the coefficient K and the correction coefficient α. A configuration is possible in which the correction coefficient α is calculated and set from the measured temperatures T1 to T3 of the second temperature measuring units P1 and P2 and the measured temperature point (third temperature measuring unit) P3.
[0063]
Next, an application example of the above-described temperature measuring device 31 and temperature measuring method according to the present invention will be described.
[0064]
FIG. 5 schematically illustrates the relationship between the present invention described above and an object to be measured.
[0065]
That is, FIG. 5A corresponds to FIG. 1, and FIG. 5B provides the first and second temperature measuring units P1 and P2 on a hot plate 27a arranged on the side opposite to the heat source 25 omitting the hot plate 27, FIG. 2C shows a second embodiment in which a temperature detecting section 23a similar to the temperature detecting section 23 is formed. In FIG. 2C, the second temperature measuring section P2 in FIG. Thus, the temperature measuring unit 23c is formed, and the temperature measuring unit 23b and the temperature detecting unit 23c without the second temperature measuring unit P2 can measure the temperature by sandwiching the object to be measured 29.
[0066]
The temperature measuring device 31 and the method of the present invention can be implemented by any of the configurations shown in FIGS.
[0067]
FIG. 6 shows the measured (estimated) temperature T3 (indicated by a circle) and the coefficient K of Equation 3 as a fixed constant (calculated at T2 = 30 ° C.) as in the prior art, in the configuration of FIG. 5A. FIG. 9 is a characteristic diagram comparing T3 ′ (■) and a temperature T3 ′ (×) calculated (estimated) by correcting the temperature change of the coefficient K according to the present invention. Each shows an error defined as follows.
[0068]
▲: T3 (○)-T3 '(■)
● mark: T3 (○ mark)-T3 '(x mark)
[0069]
From this characteristic, in the present invention, even when the temperature T2 rises, the measurement error (● mark) becomes constant, and the calculated temperature (x mark) according to the present invention overlaps with the actually measured temperature (○ mark) of the DUT 29, and It can be seen that the temperature of the DUT 29 can be accurately measured.
[0070]
In this regard, since the coefficient K is conventionally a constant, when the measured temperature T2 from the second temperature measuring section P2 increases, the measurement error (（) increases.
[0071]
FIGS. 7 and 8 are diagrams schematically showing a temperature detecting unit when the above-described temperature measuring device 31 of the present invention is applied to a more specific device.
[0072]
FIG. 7 shows a state in which the temperature detector 23 as shown in FIG. 1 is arranged in the course of winding the sheet 47 formed from the injection molding machine 45 by the roller 49, and the temperature of the measurement point P3 of the sheet 47 is measured in advance. The temperature is measured by the temperature measuring device 31 of the present invention.
[0073]
FIG. 8 shows the measurement of the temperature of the molten resin (measured object) in the cylinder 45a of the injection molding machine 45.
[0074]
That is, in a cylinder 45a having a screw 45b rotated by a motor M, a hopper 45c for supplying material resin, and a band heater 45d, as shown in a partially enlarged view of FIG. The temperature measuring portions P1 and P2 are provided, and the temperature between the inner wall of the cylinder 45a and the screw 45b is measured as a temperature measurement point P3. Reference numeral 51 in FIG. 8 is a known mold.
[0075]
The temperature measurement point P3 is a portion to be measured appropriately, and it goes without saying that the temperature sensor and the like are removed during the actual injection operation.
[0076]
Further, although not shown, the temperature measuring device 31 of the present invention can be used in a baking process or a film forming process in a photolithography process in a semiconductor manufacturing apparatus.
[0077]
That is, a wafer as an object to be measured is placed on a hot plate such as a hot plate having a heat source, the first and second temperature measuring sections are arranged on the hot plate, and a temperature measurement for test is performed on a test wafer. This is a configuration for setting points.
[0078]
Further, a plurality of sets of the first and second temperature measuring units are dispersedly arranged on the hot plate, or one first temperature measuring unit and a plurality of second temperature measuring units are dispersed on the hot plate. A configuration in which they are arranged is also possible.
[0079]
That is, the present invention can achieve the object without arranging the first to third temperature measuring units P1 to P3 linearly. However, if the first to third temperature measuring units P1 to P3 are linearly arranged, it can be expected that the above-described calculation formula is simplified.
[0080]
By the way, the temperature measuring device of the present invention is suitable for the case where the temperature detectors 23 to 23c shown in FIGS. The present invention is also applicable to a case where the parts 23 to 23c and the DUT 29 are brought into direct contact.
[0081]
【The invention's effect】
As described above, the temperature measurement device according to the present invention includes the first temperature measurement unit and the second temperature measurement unit closer to the measured object, which are arranged at different distances from the measured object. A coefficient is set and stored in advance in relation to the temperature detector, the thermal resistance between the first and second temperature measuring units and the object to be measured, and the first and second temperature measurement are performed on the set coefficient. A coefficient correction unit for obtaining a temperature calculation correction coefficient corrected according to a change in the measured temperature from the unit, and a correction unit that corrects the measured temperatures from the first and second temperature measurement units using the temperature calculation correction coefficient. Since it has a temperature calculation unit for calculating the temperature of the measured object, it is possible to correct the thermal resistance between the measured object and the temperature detecting unit, without directly contacting the measured object, for the entire temperature range to be measured. Temperature can be measured accurately and the following UNA has an effect.
That is, since the coefficient K related to the thermal resistance is used in advance, the temperature can be measured without the necessity of precise position adjustment of the temperature sensor as in the related art, and the transmission can be performed by changing the temperature of the object to be measured. There is an advantage that even if the thermal resistance of the thermal equivalent circuit changes, highly accurate temperature measurement can be performed.
Furthermore, since the temperature detecting section is composed of two first and second temperature measuring sections and requires no special structure and is simple, it is possible to reduce the obstruction element of the heat flow passing through the temperature detecting section.
Furthermore, it is also possible to arrange a large number of first and second temperature measuring units in the temperature detecting unit to measure the temperature distribution of the object to be measured, so that the object to be measured is not limited and can be widely applied.
And a combination table of the change of the measured temperature from the first and second temperature measuring units and the correction coefficient for the temperature calculation corresponding to the change, and from the combination table, the temperature calculation corresponding to the measured temperature. In the configuration in which the coefficient correction section is formed so as to output the correction coefficient for use, it is not necessary to calculate the correction coefficient for temperature calculation during actual actual measurement, which simplifies the configuration and speeds up the temperature calculation of the DUT. Is done.
In addition, a third temperature measuring unit that preliminarily measures the temperature of the object to be measured by contacting the object to be measured is provided in the temperature detecting unit, and the first, second, and third temperatures during the preliminary measurement are measured. In a configuration including a coefficient setting unit for calculating and presetting the coefficient related to the thermal resistance from the measurement temperature of the measuring unit and outputting the calculated coefficient to the coefficient correction unit, The coefficient can be automatically calculated, and the setting of the coefficient can be simplified, and the present invention can be applied to temperature measurement of various objects to be measured.
And a correction coefficient setting section for setting a correction coefficient of a coefficient relating to the thermal resistance in accordance with a change in the measured temperature from the first and second temperature measurement sections. In the configuration in which the coefficient correction unit is formed so as to obtain the correction coefficient for temperature calculation from above, more accurate correction can be performed and reliability is improved.
Furthermore, in the configuration in which the correction coefficient setting section is formed so as to calculate and set the correction coefficient from the measured temperatures of the first, second, and third temperature measuring sections at the time of the preliminary measurement, The correction coefficient relating to the correction can be automatically calculated, so that the setting of the correction coefficient is not only simple, but also applicable to the temperature measurement of various objects to be measured.
[Brief description of the drawings]
FIG. 1 is a diagram showing a temperature detector used in a temperature measuring device according to the present invention.
FIG. 2 is a heat transfer equivalent circuit diagram including the temperature detector and the device under test in FIG. 1;
FIG. 3 is a block diagram showing an embodiment of a temperature measuring device according to the present invention.
FIG. 4 is a characteristic diagram showing a temperature change of a coefficient K in the temperature measuring device of the present invention.
FIG. 5 is a diagram illustrating a specific example of a temperature detection unit in the temperature measurement device according to the present invention.
FIG. 6 is a diagram showing an error temperature change according to the present invention and a conventional temperature measuring device or temperature measuring method.
FIG. 7 is a diagram illustrating another specific example of the temperature detection unit in the temperature measurement device according to the present invention.
FIG. 8 is a diagram illustrating another specific example of a temperature detection unit in the temperature measurement device according to the present invention.
FIG. 9 is a diagram illustrating a conventional temperature measurement method.
FIG. 10 is a diagram illustrating another conventional temperature measurement method.
[Explanation of symbols]
1, 11, 29 DUT
3 open side
5 cylinder
7, 21 Sensor unit
9, 25 heater
13,27,47 Hot plate
15 recess
17 Heat flux sensor
19 Temperature sensor
23 Temperature detector
31 Temperature measuring device
33 Input section
35 Coefficient setting section
37 coefficient correction unit
39 Temperature calculator
41 Correction coefficient setting section
43 Display
45 Injection molding machine
45a cylinder
45b screw
45c hopper
45d band heater
47 sheets (measurement object)
49 Laura
51 Mold
M motor
P1 First temperature measurement unit
P2 Second temperature measuring unit
P3 Temperature measurement point (third temperature measurement unit)
Pa, Pb, Pc Temperature measurement unit
Pd Temperature measurement point
T1, T2, T3 Measurement temperature
Ta, Tb, Tc, Td Measurement temperature

Claims (7)

A temperature measuring device that measures the temperature of the measured object without directly contacting the measured object,
A temperature detection unit having a first temperature measurement unit and a second temperature measurement unit arranged at different distances from each other with respect to the object to be measured;
A coefficient preset in relation to the thermal resistance between the first and second temperature measuring units and the object to be measured was corrected according to a change in the measured temperature from the first and second temperature measuring units. A coefficient correction unit for determining a correction coefficient for temperature calculation;
A temperature calculation unit that corrects the measured temperature from the first and second temperature measurement units with the temperature calculation correction coefficient to calculate the temperature of the device under test;
A temperature measuring device comprising: The coefficient correction unit has a combination table of the change in the measured temperature from the first and second temperature measurement units and the correction coefficient for temperature calculation in accordance with the change, and from this combination table to the measured temperature. The temperature measuring device according to claim 1, wherein the corresponding temperature calculation correction coefficient is output. The temperature detection unit includes a third temperature measurement unit that comes into contact with the object to be measured and preliminarily measures the temperature of the object to be measured,
The coefficient relating to the thermal resistance is calculated and set in advance from the measured temperatures of the first, second and third temperature measuring units at the time of the preliminary measurement, and the calculated coefficient is corrected for the coefficient. The temperature measuring device according to claim 1, further comprising a coefficient setting unit that outputs the coefficient setting unit. A correction coefficient setting unit that sets a correction coefficient for correcting the coefficient related to the thermal resistance according to a change in the measured temperature from the first and second temperature measurement units;
4. The temperature measuring device according to claim 3, wherein the coefficient correction unit obtains the temperature calculation correction coefficient using the correction coefficient from the correction coefficient setting unit. The temperature according to claim 4, wherein the correction coefficient setting unit calculates and sets the correction coefficient from the measured temperatures of the first, second, and third temperature measuring units at the time of the preliminary measurement. measuring device. A temperature measurement method for measuring the temperature of the measured object without directly contacting the measured object,
The first temperature measurement unit and the second temperature measurement unit arranged at different distances from each other with respect to the object to be measured, and the measured temperatures of the third temperature measurement unit that directly contacts the object to be measured. A first step of determining and setting in advance a coefficient relating to the thermal resistance between the first and second temperature measuring units and the object to be measured at a predetermined preliminary measurement;
A second step of obtaining a temperature calculation correction coefficient for the coefficient relating to the thermal resistance, which is corrected in accordance with a change in the measured temperature from the first and second temperature measurement units during actual main measurement. When,
A third step of correcting the measured temperature from the first and second temperature measurement units with the temperature calculation correction coefficient and calculating the temperature of the device under test during actual main measurement;
A temperature measuring method, comprising: At the time of the preliminary measurement, the first, second, and third correction coefficients for correcting the coefficient relating to the thermal resistance according to a change in the measured temperature from the first and second temperature measurement units 7. The temperature according to claim 6, further comprising a fourth step of obtaining from the measured temperature of the temperature measuring unit, the second step of calculating the correction coefficient for the actual temperature calculation during the actual measurement from the correction coefficient. Measuring method.

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