JP2004228551A - Method to produce substrate for use in transference and wiring plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for use in transference, particularly suitable for use in the transfer molding of a conductor wiring to a wiring plate by imparting appropriate adhesiveness and detachability to the substrate for use in transference through a simple process in the transfer of the metallic film to the resin layer by laminating a substrate for use in transference provided with a metal film on its surface on a resin layer so as to face each other and separating the substrate from the resin layer to leave the metal film on the resin layer side. <P>SOLUTION: On the surface of a metallic material with Fe content, a target process surface 3 is formed with ionization tendency smaller than Fe. In this way, appropriate adhesiveness and detachability are provided between the target process surface 3 and the metallic film 2. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０１０９】
【発明の効果】
上記のように請求項１に係る転写用基材では、金属鉄を含有する金属材に形成された鉄よりもイオン化傾向が小さい金属を含有する被処理面は、金属めっき皮膜との間で適度な密着性と離型性を有し、転写用基材にめっき皮膜からなる金属皮膜を設けた場合に、金属皮膜の転写時に転写用基材に金属皮膜が残存しないようにすることができて良好な剥離性を有し、また金属皮膜を設けた転写用基材の取り扱い時等においては金属皮膜が転写用基材から不用意に剥離するようなことを防止することができるものである。
【０１１０】
また請求項２の発明では、鉄イオンと、鉄よりもイオン化傾向が小さい金属のイオンとを含有するエッチング液を用いることで、形成される被処理面に特に優れた密着性と離型性とを付与することができるものである。
【０１１１】
また請求項３の発明では、塩化第二鉄、又は塩化第二鉄及び塩化第一鉄を含有すると共に銅及びニッケルのうち少なくとも一方の金属のイオンを０．０１〜２０重量％の濃度で含有するエッチング液を用いることで、特に金属皮膜として銅めっき皮膜を形成する場合に、形成される被処理面に更に優れた密着性と離型性とを付与することができるものである。
【０１１２】
また請求項４の発明では、ステンレス材を用いることで、ステンレス材は入手容易であるため、製造コスト削減が可能なものである。
【０１１３】
また請求項５の発明では、表面粗度Ｒａが０．０５〜１．００μｍの被処理面によって特に優れた密着性と離型性とを付与することができるものである。
【０１１４】
また請求項６の発明では、クロム含有率が１０〜２０％、ニッケル含有率が０〜１５％の、金属鉄を含有する金属材により、被処理面に表面粗化処理を施す場合に粗化容易となるようにすることができるものである。
【０１１５】
また請求項７の発明では、銅、銅及びニッケル、銅及びニッケル及び金、又はニッケルからなるめっき皮膜による金属皮膜により、特に配線板の導体配線形成用途に好適に用いることができるものである。
【０１１６】
また請求項８の発明は、めっき皮膜による金属皮膜の転写時における樹脂層と金属皮膜との密着性を、金属皮膜の表面に密着性付与のための表面処理を施すことで向上することができ、特に配線板用途において、長期信頼性を向上することができるものである。
【０１１７】
また請求項９の発明は、被処理面にめっきレジスト皮膜を形成した後にめっき処理を施すことで、めっき処理により被処理面に金属皮膜を形成することができるものである。
【０１１８】
また請求項１０の発明は、金属皮膜を厚み１〜１５０μｍに形成することでその表面を平坦に形成すると共に処理コストの増大を抑制することができるものである。
【０１１９】
また請求項１１の発明は、ばね性を有する金属鉄を含有する金属材により、転写用基材を剥離する際に撓ませたり応力をかけたりしても転写用基材に破損が生じにくくなり、使用後の転写用基材を洗浄して有機分の除去を行えば、再度めっき処理等により転写用基材に金属皮膜を設けて、転写用基材を繰り返し使用することが可能となり、材料コストを削減でき、また資源の有効活用により環境保護につながるものである。
【０１２０】
また請求項１２の発明は、金属鉄を含有する金属材の厚みを２０〜１５０μｍとすることで、転写用基材を剥離する際に、転写用基材をめくりあげて撓ませながら容易に剥離することができ、且つこのとき樹脂層に対して過大な応力がかかることを抑制して樹脂層の破損等を防止することができるものである。
【０１２１】
また請求項１３に係る配線板の製造方法では、金属皮膜の転写時に転写用基材に金属皮膜が残存しないようにすることができて良好な剥離性を有し、また金属皮膜を設けた転写用基材の取り扱い時等においては金属皮膜が転写用基材から不用意に剥離するようなことを防止することができるものである。
【０１２２】
また請求項１４に係る配線板の製造方法では、金属皮膜の転写時に転写用基材に金属皮膜が残存しないようにすることができて良好な剥離性を有し、また金属皮膜を設けた転写用基材の取り扱い時等においては金属皮膜が転写用基材から不用意に剥離するようなことを防止することができるものである。
【図面の簡単な説明】
【図１】本発明の実施の形態の一例を示すものであり、（ａ）乃至（ｃ）は概略断面図である。
【図２】配線板の製造工程の一例を示すものであり、（ａ）乃至（ｄ）は概略断面図である。
【図３】配線板の製造工程の他例を示すものであり、（ａ）乃至（ｄ）は概略断面図である。
【図４】配線板の製造工程の更に他例を示すものであり、（ａ）乃至（ｃ）は概略断面図である。
【図５】配線板の製造工程の更に他例を示すものであり、（ａ）乃至（ｃ）は概略断面図である。
【符号の説明】
１ 転写用基材
２ 金属皮膜
３ 被処理面
４ 樹脂層
５ めっきレジスト皮膜
６ 電気部品[0001]
BACKGROUND OF THE INVENTION
In the present invention, a transfer substrate having a metal film on the surface is laminated so that the metal film and the resin layer face the resin layer, and the transfer substrate is peeled off from the resin layer and the metal The present invention relates to a transfer substrate used for transferring a metal film to a resin layer by allowing the film to remain on the resin layer side, and a method of manufacturing a wiring board in which conductor wiring is formed on the resin layer using the transfer substrate. Is.
[0002]
[Prior art]
In recent years, with the demand for higher functionality and smaller size and thinner electronic devices, there has been a demand for shorter wiring distances and smaller printed wiring boards.
[0003]
The demand for such wiring boards has become difficult to cope with by forming conductor wiring by applying additive and subtractive methods to laminated boards, and new techniques for forming conductor wiring are required. It was.
[0004]
As one of the proposals for such a new conductor wiring formation technology, a conductor wiring is formed by plating or the like on the surface of a transfer substrate such as a stainless steel plate whose surface is roughened. There is a method of transferring and embedding a conductor wiring in a resin layer by laminating a conductor wiring of a transfer substrate and an adhesive resin layer facing each other, and then peeling only the transfer substrate (Patent Document 1). .
[0005]
[Patent Document 1]
Japanese Patent No. 3241505 (FIG. 1)
[0006]
[Problems to be solved by the invention]
However, in the method disclosed in Patent Document 1, only the surface roughening is performed as the surface treatment of the transfer substrate, so that the adhesion of the surface of the transfer substrate is desired. Have difficulty. That is, in order to transfer the conductor wiring to the resin layer with the transfer substrate, the conductor wiring is formed on the transfer substrate with a certain degree of adhesion, and when the transfer substrate is peeled off, the transfer substrate is formed. It was necessary to have an appropriate releasability so that no conductor wiring remained on the material and the resin of the resin layer adhered to the transfer substrate and the resin was not peeled off. Such adjustment of the adhesion of the transfer substrate is difficult only by roughening the transfer substrate.
[0007]
In addition, as a technique for controlling adhesion by metal surface treatment, for example, as disclosed in Japanese Patent Application Laid-Open No. 11-293576 and Japanese Patent Application Laid-Open No. 2002-53977, chemicals that involve film formation on a metal surface After etching treatment, this film is chemically removed to roughen the surface, and if necessary, a method to form a film on the metal surface has been proposed. Although it is possible to reduce the adhesion by changing the processing conditions such as reducing the concentration of the processing chemical solution, it is a special process, so the processing cost becomes very high. There was a problem.
[0008]
The present invention has been made in view of the above points, and the transfer base material provided with a metal film on the surface is laminated so that the metal film and the resin layer face the resin layer, When transferring the metal film to the resin layer by peeling the transfer substrate from the resin layer and leaving the metal film on the resin layer side, the transfer substrate is provided with appropriate adhesion and peelability by a simple process. In particular, it is intended to provide a transfer base material suitably used for transfer molding of conductor wiring on a wiring board, and a method of manufacturing a wiring board using the transfer base material. is there.
[0009]
[Means for Solving the Problems]
The transfer substrate according to claim 1 is formed by laminating the transfer substrate 1 having the metal film 2 provided on the surface thereof with respect to the resin layer 4 so that the metal film 2 and the resin layer 4 face each other. In the transfer substrate 1 used for transferring the metal film 2 to the resin layer 4 by peeling the transfer substrate 1 from the resin layer 4 and leaving the metal film 2 on the resin layer 4 side, A surface 3 to be treated containing a metal having a smaller ionization tendency than iron is formed on the surface of the contained metal material. Thereby, the to-be-processed surface 3 will have moderate adhesiveness and mold release property between the metal films 2.
[0010]
According to a second aspect of the present invention, in the first aspect, the surface of the metal material containing metallic iron is subjected to surface treatment using an etching solution containing iron ions and metal ions having a smaller ionization tendency than iron. Thus, a surface to be processed is formed, and thereby, particularly excellent adhesion and releasability can be imparted to the surface 3 to be processed.
[0011]
A third aspect of the present invention is that, in the second aspect, the etching solution contains ferric chloride, or ferric chloride and ferrous chloride, and copper and nickel as metals having a smaller ionization tendency than iron. Of these, at least one metal ion is contained at a concentration of 0.01 to 20% by weight. With this, particularly when a copper plating film is formed as the metal film 2, the surface to be treated 3 is further formed. Excellent adhesion and releasability can be imparted.
[0012]
The invention of claim 4 is characterized in that, in any one of claims 1 to 3, the metal material containing metallic iron is a stainless material, and the stainless material is easily available. Cost reduction is possible.
[0013]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the surface roughness Ra of the surface to be processed 3 is 0.05 to 1.00 μm. The surface 3 to be treated can be provided with particularly excellent adhesion and releasability.
[0014]
The invention of claim 6 is characterized in that, in claims 1 to 5, the metal material containing metallic iron has a chromium content of 10 to 20% and a nickel content of 0 to 15%, Thereby, when surface roughening processing is performed on the surface 3 to be processed, it is possible to facilitate roughening.
[0015]
A seventh aspect of the present invention is the metal film according to any one of the first to sixth aspects, wherein the surface to be treated 3 is a metal film formed of any one of copper, copper and nickel, copper, nickel and gold, and nickel. In this way, it can be suitably used particularly for a conductor wiring forming application of a wiring board.
[0016]
The invention of claim 8 is the method according to any one of claims 1 to 7, wherein a metal film 2 is formed on the surface to be treated 3 by a plating film, and the surface of the metal film 2 is subjected to a surface treatment for imparting adhesion. This makes it possible to improve the adhesion between the resin layer 4 and the metal film 2 at the time of transfer of the metal film 2, and to improve long-term reliability particularly in wiring board applications. It is something that can be done.
[0017]
A ninth aspect of the present invention is the method according to any one of the first to eighth aspects, wherein after the plating resist film 5 is formed on the surface 3 to be processed, the metal film 2 is formed on the surface 3 to be processed by plating. Thus, the metal film 2 can be formed on the surface to be processed 3 by plating.
[0018]
The invention of claim 10 is characterized in that, in any one of claims 1 to 9, a metal film 2 having a thickness of 1 to 150 μm is formed on the surface 3 to be treated. The surface of the substrate can be formed flat and an increase in processing cost can be suppressed.
[0019]
The invention of claim 11 is characterized in that, in any one of claims 1 to 10, the metal material containing metallic iron has a spring property. Even if the transfer substrate 1 is bent or stressed when it is peeled off, the transfer substrate 1 is less likely to be damaged. If the transfer substrate 1 after use is washed to remove organic components, the plating process is performed again. By providing the metal film 2 on the transfer substrate 1 by means of the above, the transfer substrate 1 can be used repeatedly, material costs can be reduced, and effective use of resources leads to environmental protection.
[0020]
The invention of claim 12 is characterized in that, in any one of claims 1 to 11, the metal material containing metallic iron has a thickness of 20 to 150 μm. At the time of peeling, the transfer substrate 1 can be easily peeled while being turned up and bent, and at this time, it is possible to suppress the application of excessive stress to the resin layer 4 and to damage the resin layer 4. Can be prevented.
[0021]
The method for manufacturing a wiring board according to claim 13 is characterized in that the substrate for transfer 1 according to claim 1, wherein the metal film 2 is provided on the surface 3 to be processed, the metal film 2 and the resin layer 4. Lamination is performed so that the resin layer 4 faces the substrate, and the transfer substrate 1 is peeled off from the resin layer 4 and the metal film 2 is left on the resin layer 4 side to transfer the metal film 2 to the resin layer 4. It is characterized by. Thereby, it is possible to prevent the metal film 2 from remaining on the transfer substrate 1 during the transfer of the metal film 2 and to have good releasability, and to handle the transfer substrate 1 provided with the metal film 2. In some cases, it is possible to prevent the metal film 2 from being inadvertently peeled off from the transfer substrate 1.
[0022]
According to a fourteenth aspect of the present invention, there is provided a method of manufacturing a wiring board according to the thirteenth aspect, wherein the electrical component 6 is mounted on the metal film 2 provided on the transfer base material 1, and the transfer base material 1 is attached to the resin layer 4. The metal film 2 and the electrical component 6 and the resin layer 4 are laminated so as to face each other, the electrical component 6 is embedded in the resin layer 4, the transfer substrate 1 is peeled from the resin layer 4, and the metal film 2 is The metal film 2 is transferred to the resin layer 4 by remaining on the resin layer 4 side, so that the metal film 2 does not remain on the transfer substrate 1 when the metal film 2 is transferred. The metal film 2 is carelessly peeled off from the transfer substrate 1 when the transfer substrate 1 provided with the metal film 2 is handled. Can be prevented.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0024]
The substrate for transfer 1 according to the present invention is obtained by forming a surface to be treated 3 containing a metal having a smaller ionization tendency than iron on the surface of a metal material containing metallic iron.
[0025]
As the metal material containing this metallic iron, an appropriate material is used, but in order to facilitate the roughening particularly when the surface roughening treatment is performed, the chromium content is preferably 10 to 20%, A nickel content of 0 to 15% is used. Examples of such a metal material containing metallic iron include an appropriate stainless steel material such as one made of SUS301 or SUS304. Surface roughening is possible with other materials, but it becomes difficult to control the concentration of the etching solution for the roughening treatment. Moreover, since the stainless steel materials having these compositions are widely used and easily available, manufacturing costs can be reduced.
[0026]
Moreover, it is preferable to use a metal material containing metallic iron having spring properties. Examples of the metal material containing metallic iron having spring properties include a stainless steel band for springs defined in JIS G 4313, and examples thereof include SUS301-CSP and SUS631-CSP. When such a metal material containing metallic iron is used, the transfer substrate 1 is not easily damaged even if it is bent or stressed when the transfer substrate 1 is peeled from the resin layer 4. Therefore, after the transfer of the metal film 2 by the transfer substrate 1, if the transfer substrate 1 is washed to remove organic components, the transfer film 1 is again provided with the metal film 2 by plating or the like. The base material 1 can be used repeatedly, the material cost can be reduced, and the environment can be protected by the effective use of resources.
[0027]
In order to improve peelability, the thickness of the metal material containing metallic iron is preferably in the range of 20 to 150 μm. In this case, when the transfer substrate 1 is peeled from the resin layer 4, the transfer is performed. The base material 1 can be easily peeled off while being turned up from the resin layer 4, and the resin layer 4 is prevented from being damaged by preventing excessive stress on the resin layer 4 at this time. can do. When the resin layer 4 is flexible, or when the transfer base material 1 requires sufficient rigidity due to processing limitations, the thickness may exceed 150 μm.
[0028]
And the base material 1 for transfer is obtained by forming the to-be-processed surface 3 containing the metal whose ionization tendency is smaller than iron on the surface of such a metal material containing metallic iron. Here, the surface to be treated 3 can be formed by attaching a metal having a smaller ionization tendency than iron or ions of this metal to a metal material containing metallic iron. The treated surface 3 containing a metal having a smaller ionization tendency than iron has an appropriate adhesion and releasability with a metal plating film, particularly a copper plating film, and is a metal film made of a plating film. 2 is provided, it is possible to prevent the metal film 2 from remaining on the transfer substrate 1 when the transfer substrate 1 is peeled off when the metal film 2 is transferred. Further, when handling the transfer substrate 1 provided with the metal film 2, it is possible to prevent the metal film 2 from being inadvertently peeled off from the transfer substrate 1, for example, as described later. When the electrical component 6 is mounted on the metal film 2 provided on the substrate 1 by solder reflow or the like, it is possible to prevent the metal film 2 from being detached during the solder reflow and to prevent the electrical component 6 from falling off. It can be done.
[0029]
In producing the transfer substrate 1, for example, an appropriate roughening treatment is first performed on one surface of a metal material containing metallic iron, and then the surface after treatment is more ionized than iron such as copper by vapor deposition or the like. Small metal can be deposited thinly.
[0030]
In addition, by treating one surface of the stainless steel material with an etching solution, the surface of the metal material containing metallic iron can be roughened, and at the same time, the surface to be treated 3 can be formed on this surface. At this time, as the etching solution, the metal solution contains metal iron by treating one surface of the metal material containing metal iron using an etching solution containing iron ions and metal ions having a smaller ionization tendency than iron. The surface to be treated 3 can be formed by applying a roughening treatment to the surface of the metal material and simultaneously containing a metal having a smaller ionization tendency than iron on the surface.
[0031]
This etchant contains ferric chloride, or an alkaline etchant (iron chloride etchant) containing ferric chloride and ferrous chloride to contain iron ions, which is more ionized than iron. It is preferable to use a metal ion containing a small metal ion, and it is preferable to contain a copper ion or a nickel ion as the metal ion having a smaller ionization tendency than iron.
[0032]
Here, for processing of a normal stainless steel material or the like, an etching solution having an oxidation-reduction potential of 660 mV or more is used to perform processing with less side etching. The purpose is to form irregularities that improve the properties, and it is preferable to perform the treatment with an etching solution having a lower redox potential than ordinary stainless steel processing in order to only roughen the surface. Specifically, as an alkaline etching solution containing ferric chloride or containing ferric chloride and ferrous chloride, the specific gravity is 1.1 to 1.7, and the redox potential is 400. It is preferable to use one in the range of ˜660 mV.
[0033]
If such an etching solution is used as a surface treatment solution for a metal material containing metallic iron, the following two reactions mainly occur simultaneously on the metal surface containing metallic iron, which is considered to enable surface treatment. .
[0034]
The first reaction is a reaction for roughening a metal surface containing metallic iron as shown below.
[0035]
2FeCl₃+ Fe → 3FeCl₂
That is, it is a reaction that etches iron, which is a main component of a metal material containing metallic iron. This is generally considered to be a reaction in which iron reacts with trivalent iron ions in the solution to become divalent iron ions and dissolves. It should be noted that, in the sense of dissolving iron, it is preferable that the oxidation-reduction potential of a general etching solution is as high as 660 to 700 mV. In such a case, since only the surface treatment of the metal material containing metallic iron is required, it is preferable to use an etching solution having a weak etching power of 400 to 660 mV, thereby containing metallic iron. Surface roughness can be achieved with almost no change in the thickness of the metal material before and after treatment.
[0036]
The second reaction is a reaction in which a metal having a smaller ionization tendency than iron such as copper is attached to the surface of a metal material containing metallic iron as shown below. The following formula is for the case where copper ions are contained by containing copper chloride in the etching solution.
[0037]
CuCl₂+ Fe → FeCl₂+ Cu
In this reaction, a metal ion containing metal ions and metal iron having a smaller ionization tendency than iron in the liquid by containing metal ions having a smaller ionization tendency than iron such as copper ions in the etching solution. Reacts with iron, which is the main component of the material, and the iron is etched and ionized, but metal ions that have a lower ionization tendency than iron are deposited on the roughened surface of the metal material containing metal iron as a metal. It will be in the state of containing.
[0038]
By these two reactions, the surface to be treated 3 containing copper can be formed on the surface roughened surface of the metal containing metallic iron, and appropriate adhesion between the metal plating film, particularly the copper plating film. It is possible to have
[0039]
In the present invention, a conventional etching technique is formed by forming the surface to be processed 3 by using an etching solution containing a metal ion having a smaller ionization tendency than iron in a generally used iron chloride etching solution. It became possible for the first time to provide adhesion with a plating film that could not be obtained by simply roughening with. The specific gravity of the etching solution containing metal ions having a smaller ionization tendency than iron in the iron chloride etching solution is preferably 1.1 to 1.7, and the oxidation-reduction potential is preferably 400 to 660 mV. Thus, as will be described in detail later, even if the component is mounted on a metal film 2 (conductor wiring) formed by plating or the like on a metal material containing metallic iron by solder reflow, the metal film 2 is not peeled off due to heat. It won't happen. Conversely, when the metal film 2 is transferred to a sheet material such as a resin sheet, the metal film 2 can be transferred in a temperature range of about 100 ° C., and can be transferred under conditions that do not promote curing of the resin sheet. It will be. As a result, it is possible to easily make a multi-layered structure of a resin sheet or the like having a built-in component.
[0040]
In this way, when an etching solution containing ions of a metal having a smaller ionization tendency than iron is used in the iron chloride etching solution, the metal adheres to the roughened surface of the metal containing metal iron, and the object to be processed The surface 3 can be formed, but in particular, in order to form a copper plating film as the metal film 2 and obtain appropriate adhesion between the copper plating film and the surface 3 to be treated, ionization is required. It is more efficient to treat the surface of a metal material containing metallic iron with an iron chloride solution etching solution containing copper ions or nickel ions, particularly copper ions, having a smaller tendency.
[0041]
When using an alkaline etching solution such as a ferric chloride solution in which ions of a metal having a smaller ionization tendency than iron are used as described above, a metal ion having a smaller ionization tendency than iron in the etching solution is used. The content of is preferably 0.01 to 20% by weight. If this content is less than 0.01% by weight, the metal film 2 peels off during solder reflow, and the electrical component 6 If the content exceeds 20% by weight, the adhesion between the transfer substrate 1 and the metal film 2 becomes too strong, and it is difficult to transfer the metal film 2 to the resin layer 4. There is a case. Further, when the content of copper ions is high, it is necessary to perform the treatment in a short time in order to prevent excessive roughening, and the degree of treatment tends to vary. It is preferable to be 1 to 5.0% by weight.
[0042]
The content of the metal having a smaller ionization tendency than iron in the surface to be processed 3 is not particularly limited, and is suitable according to processing conditions such as processing time required for roughening when performing processing using an etching solution. The amount of adhesion may also vary. For example, when the surface treatment is performed with an etching solution having a smaller ionization tendency than that of iron with a metal ion content, the treatment time is lengthened. When the surface treatment is performed with an etching solution having a high content, the treatment time is shortened. By changing the processing conditions such as, it is possible to obtain appropriate adhesion between the surface to be processed 3 and the metal plating film.
[0043]
Moreover, it is preferable to form the to-be-processed surface 3 of the transfer substrate 1 so that the surface roughness Ra is in the range of 0.05 to 1.00 μm. This surface roughness is based on JIS B0601, with a cutoff value λ_c= 0.80 mm, measurement length L = λ_cX5 = obtained by measuring at 4.0 mm. In this case, the transferability of the metal film 2 can be further improved, and inadvertent detachment of the metal film 2 from the transfer substrate 1 during solder reflow or the like can be further suppressed. Here, this surface roughness is small, and usually sufficient adhesion cannot be obtained between the transfer substrate 1 and the metal film 2, but the transfer substrate 1 is treated as described above. Since the surface 3 contains copper, moderate non-adhesiveness can be obtained between the transfer substrate 1 and the metal film 2. If the surface roughness Ra is less than 0.05 μm, the metal film 2 may be peeled off during the solder reflow, and the electrical component 6 may drop off, and if the surface roughness Ra exceeds 1.00 μm. In some cases, the adhesion between the transfer substrate 1 and the metal film 2 becomes too strong, making it difficult to transfer the metal film 2 to the resin layer 4.
[0044]
In forming the metal film 2 on such a transfer substrate 1, for example, as shown in FIG. 1, a plating resist film 5 having an appropriate pattern shape is formed on the treated surface 3 of the transfer substrate 1. After the formation, a plating film is formed by at least one of an electroless plating process and an electrolytic plating process, whereby the metal film 2 can be formed.
[0045]
As the plating resist film 5, an appropriate one can be formed, and for example, an acrylic or methacrylic photosensitive resin composition can be used.
[0046]
The material of the metal film 2 is not particularly limited, but when applied to transfer of conductor wiring at the time of wiring board manufacture, copper plating film, copper / nickel plating film with copper plating and nickel plating sequentially, copper plating, It is preferable to form a copper / gold / nickel plating film or the like that is sequentially subjected to gold plating and nickel plating. When used for purposes other than the transfer of conductor wiring at the time of manufacturing a wiring board, there is no particular limitation as long as it is a metal film 2 capable of forming a film by plating.
[0047]
Although the thickness in particular of the metal membrane | film | coat 2 is not restrict | limited, It is preferable to set it as the range of 1-150 micrometers equivalent to the thickness of a general metal foil. Further, the thickness of the metal film 2 can be increased by setting the thickness of the metal film 2 to less than 1 μm and subjecting the metal film 2 to plating after the transfer of the metal film 2 to the resin layer 4. If the thickness of the metal film 2 exceeds 150 μm, it takes too much time to form the metal film 2 and the processing cost increases, and the plating film needs to be thick. Otherwise, the metal film 2 will be formed in a mushroom shape with its upper part raised. In particular, the thickness of the metal film 2 is preferably 10 to 35 μm. In this case, when the surface 3 to be treated is formed by surface treatment with an etching solution containing copper ions, the copper ions are contained in an amount of 1 to 3% by weight. It is preferable to use an etching solution contained in a range.
[0048]
Further, the metal film 2 provided on the transfer substrate 1 is subjected to physical polishing, chemical polishing, etc., such as blackening treatment, sandblasting treatment, alkali-chlorous acid blackening treatment, honing, etc. It is preferable to improve the adhesion between the resin layer 4 and the metal film 2 at the time of transfer by applying a surface treatment for adhesion to the metal film 2. If it does in this way, long-term reliability can be improved especially in wiring board use.
[0049]
When the metal film 2 is formed on the transfer substrate 1 by plating as described above, the plating resist film 5 is peeled off after the metal film 2 is formed as shown in FIG. The plating resist film 5 can also be transferred to the resin layer 4 at the same time that the film 5 remains on the transfer substrate 1 and the metal film 2 is transferred to the resin layer 4. Details will be described later.
[0050]
When the transfer substrate 1 configured as described above is used, the metal film 2 can be transferred to an appropriate resin layer 4 and is particularly suitable for transferring a conductor wiring in manufacturing a wiring board. Although it can be used, the present invention is not limited to such applications, and may be applied to various applications such as transferring conductor wiring to electrical equipment other than a wiring board or forming decoration with a metal film 2. it can.
[0051]
The transfer method of the metal film 2 using the transfer substrate 1 configured as described above will be described by taking, as an example, a case where conductor wiring is formed on the resin layer 4 particularly when a wiring board is formed.
[0052]
The resin layer 4 can be composed of an appropriate electrically insulating thermosetting resin composition such as an epoxy resin composition.
[0053]
For the formation of the resin layer 4, for example, a resin composition is formed into a sheet shape and heated and dried to be in a semi-cured state, or a fiber sheet is impregnated with the resin composition and heat-dried to be in a semi-cured state. A sheet material made of an electrically insulating resin composition in a B stage state, such as a prepreg, can be used. The resin layer 4 can be formed by one sheet material, or can be formed by laminating and integrating a plurality of sheet materials.
[0054]
Then, the transfer substrate 1 provided with the metal film 2 is laminated on the resin layer 4 so that the metal film 2 and the resin layer 4 face each other, and only the transfer substrate 1 is peeled to remove the metal film 2 from the resin. By remaining on the layer 4 side, the metal film 2 is transferred to the resin layer 4 to form a conductor wiring, and a wiring board can be obtained.
[0055]
In the example shown in FIG. 2, the metal film 2 is formed on one or both surfaces of a single sheet material 4 a or a plurality of sheet materials 4 a laminated using the transfer substrate 1 from which the plating resist film 5 has been peeled off. The transfer substrate 1 thus made is integrated by stacking so that the surface on which the metal film 2 is formed is opposed to the sheet material 4a and performing heat and pressure molding. This heat and pressure molding is performed under the condition that the resin layer 4 formed from the sheet material 4a after molding is maintained in the B-stage state or the condition that the resin layer 4 is formed in the C-stage state.
[0056]
Next, the transfer substrate 1 is peeled off from the resin layer 4 and the metal film 2 is left on the resin layer 4, whereby the metal film 2 is formed on one surface or both surfaces of the resin layer 4 (insulating layer). A wiring board provided with conductor wiring can be obtained.
[0057]
In the wiring board thus formed, the conductor wiring made of the metal film 2 is embedded in the surface layer on one side or both sides of the resin layer 4 (insulating layer) so as to be exposed on the surface of the resin layer 4 (insulating layer). The outer surface of the resin layer 4 (insulating layer) and the exposed surface of the conductor wiring are flush with each other, and the surface is formed flat without unevenness.
[0058]
In the example shown in FIG. 3, the transfer substrate 1 in which the plating resist film 5 is left without being peeled after the metal film 2 is formed, and a sheet material 4 a or a plurality of sheet materials 4 a are first laminated. The transfer substrate 1 on which the metal film 2 is formed on one or both surfaces is laminated and heated so that the surface on which the metal film 2 is formed and the plating resist film 5 remains is opposed to the sheet material 4a. It integrates by performing pressure molding. This heat and pressure molding is performed under the condition that the resin layer 4 formed from the sheet material 4a after molding is maintained in the B-stage state or the condition that the resin layer 4 is formed in the C-stage state.
[0059]
Here, when performing lamination molding with the plating resist film 5 remaining as described above, it is preferable to form the plating resist film 5 with an appropriate permanent resist used for printed wiring board applications. A DSR series manufactured by Kenken, a DPR series manufactured by Asahi Kaken, a PSR series manufactured by Taiyo Ink, and the like can be used.
[0060]
Next, the transfer substrate 1 is peeled off from the metal film 2 and the plating resist film 5, and the metal film 2 and the plating resist film 5 are left on the resin layer 4, whereby one or both surfaces of the insulating layer are formed. A wiring board provided with a conductor wiring made of the metal film 2 can be obtained.
[0061]
In the wiring board formed in this way, an insulating layer is formed from the resin layer 4 and a plating resist film 5 formed in close contact with the resin layer 4, and a metal film is formed on one or both surface layers of the insulating layer. The conductor wiring made of 2 is embedded and formed so as to be exposed on the surface of the insulating layer, and the outer surface of the insulating layer and the exposed surface of the conductor wiring are flush with each other, so that the surface is formed flat without unevenness. . At this time, at the time of transfer of the metal film 2 to the resin layer 4, the resin constituting the resin layer 4 does not flow greatly, and the moldability is further improved.
[0062]
Further, after the transfer substrate 1 is peeled off, the plating resist film 5 may be peeled off from the resin layer 4 to obtain a wiring board. In this case, a wiring board is obtained in which the conductor wiring made of the metal film 2 is formed in a convex shape on one or both surfaces of the insulating layer made of the resin layer 4.
[0063]
The wiring board produced as described above is subjected to hole processing by laser processing, drilling, etc., and then plated with holes or filled with conductive paste in the holes. Can be formed. Before transferring the metal film 2, the resin layer 4 is previously perforated and filled with a conductive paste, and then the metal film 2 in the hole filled with the conductive paste is aligned. Then, the wiring board can be formed by transferring the metal film 2 to the resin layer 4.
[0064]
Further, when producing the wiring board, the metal film 2 is transferred to the resin layer 4 in a state where the electrical component 6 is mounted at a predetermined position of the metal film 2 on which the transfer substrate 1 is formed. A wiring board in which the electrical component 6 is embedded can also be produced. Furthermore, the wiring board produced in this way can embed the electrical component 6 in a predetermined position with high accuracy in the insulating layer by using the transfer substrate 1.
[0065]
In the example shown in FIG. 4, the electrical component 6 is mounted at a predetermined position of the metal film 2 on which the transfer substrate 1 is formed. As this electrical component 6, a passive component such as a chip resistor, a chip capacitor, a chip inductor, or the like can be mounted. At this time, the chip component is connected to the metal film 2 with solder 7. And can be implemented. As the electrical component 6, an active component such as a semiconductor bare chip such as a silicon bare chip can be mounted. In this case, the semiconductor bare chip is connected to the metal film 2 with a solder ball or the like, and the underfill is filled and cured. Can be implemented. As an underfill, what consists of an epoxy resin composition etc. which are generally used can be used.
[0066]
Note that the mounting of the electrical component 6 is not limited to the solder 7 and can be mounted using a conductive paste, but the solder 7 connection has higher mounting reliability.
[0067]
In mounting the electrical component 6, at least one of a resistance element and a capacitor element can be printed and molded as the electrical component 6 at a predetermined location on the transfer substrate 1 on which the metal film 2 is formed. For example, when printing a resistance element (printing resistance), a high-capacity element is formed by printing a paste-like resistance material in which metal powder is mixed in a thermosetting resin and then heating. be able to. In addition, when printing a capacitor element, a high-capacity element is formed by printing a paste-like dielectric material mixed with barium titanate or the like as a high dielectric constant filler in a thermosetting resin, and then heating. Can be formed. In particular, a higher dielectric element can be formed by firing the resin content of the paste and volatilizing it to form a ceramic.
[0068]
In this way, when the electrical component 6 is formed by printing, it is possible to form a very thin element and realize a reduction in thickness. In addition, since the electrical component 6 is not solder-mounted, it is possible to process the printed wiring board with existing equipment.
[0069]
In addition, for the printed and molded electrical component 6, the capacitance value and the resistance value are adjusted by laser trimming or the like. In this case, when directly printing and molding on a wiring board of FR-4 type, There is a risk that adverse effects such as damage to the substrate due to heat, and reduced reliability of the substrate due to thermal shrinkage, thermal degradation, or the like may occur. On the other hand, when the electrical component 6 is printed on the transfer substrate 1, laser processing can be performed in a state where the electrical component 6 is mounted on the transfer substrate 1. It is possible to perform processing without considering the adverse effects of heat on the material body.
[0070]
In producing a wiring board using the transfer substrate 1 in which the electrical component 6 is mounted on the metal film 2 as described above, one sheet material 4a or one surface of a plurality of sheet materials 4a laminated, On both sides, the metal film 2 is formed and the transfer base material 1 on which the electric component 6 is mounted is formed on the metal film 2, and the surface on which the metal film 2 is formed and the electric component 6 is mounted is the sheet material 4a. Are integrated so as to be opposed to each other by performing heat and pressure molding. This heat and pressure molding is performed under the condition that the resin layer 4 formed from the sheet material 4a after molding is maintained in the B-stage state or the condition that the resin layer 4 is formed in the C-stage state.
[0071]
In this molding process, first, when the sheet material 4a is melt-softened and a plurality of sheet materials 4a are laminated, the sheet materials 4a are integrated, and the melt-softened sheet material 4a flows. The metal film 2 formed on the transfer substrate 1 and the electrical component 6 mounted on the metal film 2 are embedded in the resin layer 4 formed from the sheet material 4a.
[0072]
Next, the transfer substrate 1 is peeled off from the resin layer 4 and the metal film 2 is left on the resin layer 4, whereby the metal film 2 is formed on one surface or both surfaces of the resin layer 4 (insulating layer). A wiring board in which conductor wiring is provided and the electric component 6 is embedded in the insulating layer can be obtained.
[0073]
In the wiring board thus formed, the conductor wiring made of the metal film 2 is embedded in the surface layer on one side or both sides of the resin layer 4 (insulating layer) so as to be exposed on the surface of the resin layer 4 (insulating layer). The outer surface of the resin layer 4 (insulating layer) and the exposed surface of the conductor wiring are flush with each other, and the surface is formed flat without unevenness.
[0074]
In the example shown in FIG. 5, similarly to the case shown in FIG. 3, the transfer substrate 1 that is left without peeling off the plating resist film 5 after the formation of the metal film 2 is used. The electrical component 6 is mounted in the same manner as shown in FIG. In the example shown in FIG. 5, the thickness of the metal film 2 is formed thinner than the thickness of the plating resist film 5, and at this time, the plating resist film 5 plays a role of underfill.
[0075]
First, the transfer base material 1 on which the metal film 2 is formed is formed on one surface or both surfaces of one sheet material 4a or a plurality of sheet materials 4a laminated, and the plating resist film 5 is formed. Are laminated so that the surface on which the material remains is opposed to the sheet material 4a and integrated by heating and pressing. This heat and pressure molding is performed under the condition that the resin layer 4 formed from the sheet material 4a after molding is maintained in the B-stage state or the condition that the resin layer 4 is formed in the C-stage state.
[0076]
In this molding process, first, when the sheet material 4a is melt-softened and a plurality of sheet materials 4a are laminated, the sheet materials 4a are integrated, and the melt-softened sheet material 4a flows. The electrical component 6 mounted on the metal film 2 formed on the transfer substrate 1 is embedded in the resin layer 4 formed from the sheet material 4a. The plating resist film 5 left on the transfer substrate 1 is laminated and integrated with the resin layer 4.
[0077]
Next, the transfer substrate 1 is peeled off from the metal film 2 and the plating resist film 5, and the metal film 2 and the plating resist film 5 are left on the resin layer 4, whereby one or both surfaces of the insulating layer are formed. Thus, it is possible to obtain a wiring board in which the conductor wiring made of the metal film 2 is provided and the electric component 6 is embedded in the insulating layer.
[0078]
In the wiring board formed in this way, an insulating layer is formed from the resin layer 4 and a plating resist film 5 formed in close contact with the resin layer 4, and a metal film is formed on one or both surface layers of the insulating layer. The conductor wiring made of 2 is embedded and formed so as to be exposed on the surface of the insulating layer, and the outer surface of the insulating layer and the exposed surface of the conductor wiring are flush with each other, so that the surface is formed flat without unevenness. .
[0079]
The thus formed wiring board in which the electrical component 6 is embedded in the insulating layer is subjected to hole drilling by laser machining, drilling or the like, and then subjected to hole plating or conductive paste. The through hole can be formed by filling the substrate. Before transferring the metal film 2, the resin layer 4 is previously perforated and filled with a conductive paste, and then the metal film 2 in the hole filled with the conductive paste is aligned. Then, the wiring board can be formed by transferring the metal film 2 to the resin layer 4.
[0080]
The wiring board obtained as described above is used as a wiring board having conductor wiring on one side or both sides of a single insulating layer when the insulating layer is cured to the C stage state. Further, a multilayer wiring board can be produced by a build-up method using this wiring board as a core material.
[0081]
In addition, by stacking another wiring board that maintains the insulating layer in the B stage state on one or both sides of the wiring board that is maintained in the B stage state or cured to the C stage state, and heat-cured A multilayer wiring board can also be obtained by integral molding.
[0082]
【Example】
(Example 1)
As the stainless steel, SUS301 (76% Fe, 17% Cr, 7% Ni), tempered 3 / 4H, thickness 100 μm was used, and chloride containing 3.0% by weight of copper ions on one side thereof. A surface to be treated was formed by performing an etching treatment with a ferric solution (oxidation-reduction potential 550 mV, specific gravity 1.46) for 15 seconds to obtain a transfer substrate.
[0083]
After the surface to be treated of the transfer substrate is washed with water and degreased, a photosensitive resin composition for resist (manufactured by DuPont, product number “FX-140”) is applied to the surface to be treated, and exposure and development are performed. A plating resist film was formed by applying. Next, after performing an acid treatment for 45 seconds using a 7% hydrochloric acid aqueous solution, an electrolytic copper plating (copper sulfate plating) treatment was performed to form a metal film having a thickness of 10 μm, and then the plating resist film was peeled off.
[0084]
(Example 2)
Etching for forming the surface to be processed is performed using a ferric chloride solution (redox potential 550 mV, specific gravity 1.46) containing 8.0% by weight of copper ions, and the processing time is 5 seconds. It was. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0085]
(Example 3)
Etching for forming the surface to be processed is performed using a ferric chloride solution (oxidation-reduction potential 555 mV, specific gravity 1.46) containing 1.0% by weight of copper ions, and the processing time is 40 seconds. It was. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0086]
Example 4
Etching for forming the surface to be processed is performed using a ferric chloride solution (oxidation-reduction potential 545 mV, specific gravity 1.46) containing 3.0% by weight of copper ions, and the processing time is 40 seconds. It was. The thickness of the metal film to be formed was set to 35 μm. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0087]
(Example 5)
The thickness of the stainless steel used was 50 μm, and the thickness of the metal film to be formed was 50 μm. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0088]
(Example 6)
The thickness of the stainless steel used was 200 μm, and the thickness of the metal film to be formed was 50 μm. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0089]
(Example 7)
Etching for forming the surface to be processed is performed using a ferric chloride solution (oxidation-reduction potential 552 mV, specific gravity 1.46) containing 3.0% by weight of copper ions, and the processing time is 40 seconds. It was. Moreover, the surface of the formed metal film was blackened. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0090]
(Example 8)
A plating resist film was formed to a thickness of 9 μm using a permanent resist having a gold plating resistance (product number “DSR 2200KGX-88” manufactured by Tamura Kaken). In forming the metal film, a 10 μm thick film was formed by copper sulfate plating, and then a 5 μm thick nickel plated film and a 0.5 μm thick gold plated film were formed. Further, the plating resist film was left on the transfer substrate without peeling off. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0091]
Example 9
As a stainless steel base material, the same material as in Example 1 was used except that SUS304 (74% Fe, 18% Cr, 8% Ni), tempered 3 / 4H, and a thickness of 100 μm was used. A film was formed.
[0092]
(Example 10)
As a stainless steel base material, except that SUS316 (67.5% Fe, 18% Cr, 12% Ni, 2.5% Mo), tempered H, and a thickness of 100 μm were used, the same as in Example 1, A metal film was formed on the transfer substrate.
[0093]
(Example 11)
For transfer in the same manner as in Example 1 except that SUS631-CSP (75% Fe, 17% Cr, 7% Ni, 1% Al), tempered H, and thickness of 100 μm was used as the stainless steel substrate. A metal film was formed on the substrate.
[0094]
(Example 12)
Etching treatment for forming the surface to be treated is performed using a ferric chloride solution (oxidation-reduction potential 555 mV, specific gravity 1.46) containing 0.08% by weight of copper ions, and the treatment time is 120 seconds. It was. Moreover, the surface of the formed metal film was blackened. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0095]
(Example 13)
Etching treatment for forming the surface to be treated is performed using a ferric chloride solution (oxidation-reduction potential 550 mV, specific gravity 1.45) containing 3% by weight of nickel ions, and the treatment time is 40 seconds. . Moreover, the surface of the formed metal film was blackened. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0096]
(Comparative Example 1)
A metal film was formed on the transfer substrate in the same manner as in Example 1 except that a stainless steel material having no surface to be processed was used as the transfer substrate.
[0097]
(Comparative Example 2)
Etching treatment for the stainless steel material was performed using a ferric chloride solution (oxidation-reduction potential 560 mV, specific gravity 1.45) containing no copper ions, and the treatment time was 40 seconds. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0098]
(Comparative Example 3)
As the stainless steel substrate, SUS304 (74% Fe, 18% Cr, 8% Ni), tempered 3 / 4H, 100 μm thick (same as in Example 9) was used, and the etching treatment for the stainless steel material was performed using copper. This was carried out using a ferric chloride solution containing no ions (oxidation-reduction potential 560 mV, specific gravity 1.46), and the treatment time was 40 seconds. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0099]
(Comparative Example 4)
Instead of etching the stainless steel, it was roughened by polishing with # 1500 sand paper to form a transfer substrate, and a metal film was formed on the roughened surface. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0100]
(Comparative Example 5)
Instead of etching the stainless steel, it was roughened by polishing with # 100 sand paper to form a transfer substrate, and a metal film was formed on the roughened surface. Otherwise, a metal film was formed on the transfer substrate in the same manner as in Example 1.
[0101]
(Evaluation test)
1. Surface roughness measurement
For each of the examples and comparative examples, the surface roughness Ra of the surface of the transfer base on which the metal film is provided is determined based on JIS B0601, a stylus type small surface roughness measuring instrument (handy surf; model number) Cut-off value λ using “E-35A” (manufactured by Tokyo Seimitsu)_c= 0.80 mm, measurement length L = λ_c× 5 = Measured at 4.0 mm.
[0102]
2. Solder heat resistance test
For each of the examples and comparative examples, the metal film provided on the transfer substrate was heated in a reflow oven at 260 ° C. for 20 seconds, and then observed for the peeling of the metal film from the transfer substrate. Evaluation was made according to the following evaluation criteria.
○: No peeling occurred. X: Floating peeling occurred. -: Separation occurred before reflow treatment, and determination is not possible.
[0103]
3. Peel strength evaluation and transferability evaluation
For each of the examples and comparative examples, the resin thickness of the resin-coated copper foil (product number “R-0870”) manufactured by Matsushita Electric Works, Ltd. using a thermosetting epoxy resin containing 85% by weight of filler was first changed to 400 μm. Then, the transfer base 6 is laminated on the resin surface of the resin-coated copper foil so that the surface on which the metal film 5 is formed faces the resin sheet, and the stainless steel foil is disposed on the other surface, and further on both sides thereof. A releasable PET film having a thickness of 75 μm, a SUS plate having a thickness of 2 mm, and two pat sheets were sequentially arranged between hot plates in a vacuum chamber.
[0104]
In this state, the inside of the reduced pressure chamber was evacuated to form a reduced pressure atmosphere of 1.3 kPa (10 Torr) or less, and then heat and pressure molding was performed. Molding is first performed at 130 ° C. and 29 MPa (3 kgf / cm²) For 10 minutes, then the temperature was raised to 175 ° C. over 15 minutes, and this state was maintained for 10 minutes.
[0105]
After molding, the peel strength when only the transfer substrate was peeled was measured by visual measurement of only the springs using a tensile tester.
[0106]
Further, the metal film transferred to the resin layer after the transfer substrate was peeled was observed, and the transferability was evaluated according to the following evaluation criteria.
○: All transferred. Δ: Transfer is difficult to implement. X: Not transferred. -: The metal film peels off before transfer and cannot be evaluated.
[0107]
The results are shown in Table 1.
[0108]
[Table 1]

[0109]
【The invention's effect】
As described above, in the transfer substrate according to the first aspect, the surface to be treated containing a metal having a smaller ionization tendency than the iron formed on the metal material containing metal iron is moderate between the metal plating film. It has excellent adhesion and releasability, and when a metal film consisting of a plating film is provided on the transfer substrate, the metal film can be prevented from remaining on the transfer substrate when the metal film is transferred. It has good releasability and can prevent the metal film from being inadvertently peeled off from the transfer substrate when handling the transfer substrate provided with the metal film.
[0110]
Further, in the invention of claim 2, by using an etching solution containing iron ions and metal ions having a smaller ionization tendency than iron, adhesion and releasability that are particularly excellent for a surface to be formed are obtained. Can be provided.
[0111]
The invention of claim 3 contains ferric chloride or ferric chloride and ferrous chloride and contains ions of at least one of copper and nickel at a concentration of 0.01 to 20% by weight. By using this etching solution, particularly when a copper plating film is formed as a metal film, it is possible to impart further excellent adhesion and releasability to the surface to be formed.
[0112]
In the invention of claim 4, by using a stainless steel material, the stainless steel material can be easily obtained, so that the manufacturing cost can be reduced.
[0113]
In the invention of claim 5, particularly excellent adhesion and releasability can be imparted by the surface to be treated having a surface roughness Ra of 0.05 to 1.00 μm.
[0114]
Further, in the invention of claim 6, when the surface to be treated is roughened with a metal material containing metallic iron having a chromium content of 10 to 20% and a nickel content of 0 to 15%. It can be made easy.
[0115]
Further, in the invention of claim 7, a metal film by a plating film made of copper, copper and nickel, copper and nickel and gold, or nickel can be suitably used particularly for a conductor wiring forming application of a wiring board.
[0116]
The invention of claim 8 can improve the adhesion between the resin layer and the metal film during the transfer of the metal film by the plating film by applying a surface treatment for imparting adhesion to the surface of the metal film. In particular, long-term reliability can be improved in wiring board applications.
[0117]
According to the ninth aspect of the present invention, a metal film can be formed on the surface to be treated by plating by forming a plating resist film on the surface to be treated and then performing a plating treatment.
[0118]
In the invention of claim 10, by forming the metal film to a thickness of 1 to 150 μm, the surface can be formed flat and an increase in processing cost can be suppressed.
[0119]
According to the invention of claim 11, even if the transfer base material is bent or stressed when the transfer base material is peeled off, the transfer base material is less likely to be damaged by the metal material containing metallic iron having a spring property. If the transfer substrate after use is washed to remove the organic component, the transfer substrate can be used repeatedly by providing a metal film on the transfer substrate again by plating, etc. Costs can be reduced, and effective use of resources leads to environmental protection.
[0120]
In the invention of claim 12, when the thickness of the metal material containing metallic iron is 20 to 150 μm, when the transfer substrate is peeled off, the transfer substrate is turned up and bent easily while being bent. In this case, the resin layer can be prevented from being damaged by preventing an excessive stress from being applied to the resin layer.
[0121]
Further, in the method for manufacturing a wiring board according to claim 13, the metal film can be prevented from remaining on the transfer substrate during the transfer of the metal film, has a good releasability, and is provided with the metal film. It is possible to prevent the metal film from being inadvertently peeled off from the transfer substrate when handling the transfer substrate.
[0122]
Further, in the method for manufacturing a wiring board according to claim 14, the metal film can be prevented from remaining on the transfer substrate at the time of transferring the metal film, has a good releasability, and is provided with a metal film. It is possible to prevent the metal film from being inadvertently peeled off from the transfer substrate when handling the transfer substrate.
[Brief description of the drawings]
FIG. 1 shows an example of an embodiment of the present invention, and (a) to (c) are schematic cross-sectional views.
FIG. 2 shows an example of a manufacturing process of a wiring board, and (a) to (d) are schematic cross-sectional views.
FIG. 3 shows another example of the manufacturing process of the wiring board, and (a) to (d) are schematic cross-sectional views.
FIG. 4 shows still another example of the manufacturing process of the wiring board, and (a) to (c) are schematic cross-sectional views.
FIG. 5 shows still another example of the manufacturing process of the wiring board, and (a) to (c) are schematic cross-sectional views.
[Explanation of symbols]
1 Transfer substrate
2 Metal coating
3 Surface to be treated
4 Resin layer
5 Plating resist film
6 Electrical parts

Claims (14)

A transfer base material provided with a metal film on the surface is laminated so that the metal film and the resin layer face the resin layer, and the transfer base material is peeled off from the resin layer and the metal film is applied to the resin layer. In the base material for transfer used to transfer the metal film to the resin layer by remaining on the side, the surface to be treated containing a metal having a smaller ionization tendency than iron is formed on the surface of the metal material containing the metal iron. A transfer substrate characterized by comprising: A surface to be treated is formed on a surface of a metal material containing metallic iron by performing a surface treatment using an etching solution containing iron ions and metal ions having a smaller ionization tendency than iron. The transfer substrate according to claim 1, wherein The etching solution contains ferric chloride, or ferric chloride and ferrous chloride, and has an ion of at least one of copper and nickel as a metal having a smaller ionization tendency than iron. The transfer substrate according to claim 2, which is contained at a concentration of 20% by weight. 4. The transfer substrate according to claim 1, wherein the metal material containing metallic iron is a stainless material. The substrate for transfer according to any one of claims 1 to 4, wherein the surface roughness Ra of the surface to be treated is 0.05 to 1.00 µm. 6. The transfer substrate according to claim 1, wherein the metal material containing metallic iron has a chromium content of 10 to 20% and a nickel content of 0 to 15%. 7. A metal film made of a plating film made of any one of copper, copper and nickel, copper, nickel and gold, and nickel is formed on the surface to be treated. The transfer substrate described in 1. 8. The transfer substrate according to claim 1, wherein a metal film is formed by a plating film on the surface to be treated, and the surface of the metal film is subjected to a surface treatment for imparting adhesion. Wood. 9. The transfer substrate according to claim 1, wherein a metal resist film is formed on the surface to be processed by forming a plating resist film on the surface to be processed and then performing a plating process. The transfer substrate according to claim 1, wherein a metal film having a thickness of 1 to 150 μm is formed on the surface to be processed. 11. The transfer substrate according to claim 1, wherein the metal material containing metallic iron has a spring property. The substrate for transfer according to any one of claims 1 to 11, wherein the metal material containing metallic iron has a thickness of 20 to 150 µm. The transfer substrate according to claim 1, wherein a metal film is provided on a surface to be treated, and the transfer substrate is laminated so that the metal film and the resin layer face the resin layer. A method for producing a wiring board, wherein the metal film is transferred to the resin layer by peeling off the resin layer and leaving the metal film on the resin layer side. An electrical component is mounted on a metal film provided on a transfer substrate, and the transfer substrate is laminated on a resin layer so that the metal film, the electrical component, and the resin layer face each other, and the electrical component is resin 14. The wiring board according to claim 13, wherein the wiring board is embedded in a layer, and the metal film is transferred to the resin layer by separating the transfer substrate from the resin layer and leaving the metal film on the resin layer side. Production method.

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