JP2004221222A - Rigid flexible multi-layer printed-wiring board and method for accommodating the same in case - Google Patents
Rigid flexible multi-layer printed-wiring board and method for accommodating the same in case Download PDFInfo
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- JP2004221222A JP2004221222A JP2003005322A JP2003005322A JP2004221222A JP 2004221222 A JP2004221222 A JP 2004221222A JP 2003005322 A JP2003005322 A JP 2003005322A JP 2003005322 A JP2003005322 A JP 2003005322A JP 2004221222 A JP2004221222 A JP 2004221222A
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- Prior art keywords
- rigid
- flexible
- wiring board
- printed wiring
- multilayer printed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、リジッド部から複数のフレキ部が引き出されているリジッド・フレックス多層プリント配線板を、筐体に収納する際にそのフレキ部のたわみを解消し、フレキ部の断線を防止する収納方法及びその収納方法に好適なリジッド・フレックス多層プリント配線板に関する。
【0002】
【従来の技術】
従来、リジッド・フレックス多層プリント配線板は、リジッド部から複数のフレキ部が引き出され、該引き出されたフレキ部の延在する先が他のリジッド部と接続され一体化される構造となっているため、筐体にリジッド・フレックス多層プリント配線板のフレキ部を折り曲げて収納する際、外側のフレキ部と内側のフレキ部の長さが同一なため内側のフレキ部にたわみが生じ、それが原因でフレキ部に折り目が発生し、断線に至る不良がしばしば発生していた。
【0003】
この現象は、各フレキ部の長さが同一なために発生する不具合であり、折り曲げ角度が鋭角になるほど、フレキ部に折り目(断線)が顕著に現れる。
【0004】
図7は、従来技術のリジッド・フレックス多層プリント配線板11の断面図であり、フレキ部12、13とリジッド部14、15の構造となっている。リジッド部14の別々の層からフレキ部12、13がそれぞれ延在し、リジッド部15の各層と接続一体化している。
【0005】
図8は、フレキ部を折り曲げた際の状態を示す。リジッド部14、15を繋ぐフレキ部12、13は同一の長さのため、折り曲げた際、内側にあたるフレキ部12は円形には曲がらずに一部折り目を持った状態で折れ曲がる。
【0006】
上記記載の不具合を解決するため、一般にリジッド部14、15間のフレキ部12、13の距離を外周側と内周側で変化させるが、積層時の位置合わせが困難であり、非常に歩留まりが悪い。
【0007】
また、特開平2002−16323公報が示すように、一層のフレキ部を2経路に分けて作成し、両経路のフレキ基板を線対称に折り込むことにより、複数層からフレキ部が延在する状態と同じ機能を持たせる提案もなされているが、この構成であっても、フレキ部の外周側と内周側の距離が同一なため線対称で折り曲げると折り目にたわみが発生し、断線に至る場合があるため、十分な対策とはならなかった。
【0008】
【発明が解決しようとする課題】
本発明は、上記記載の問題点を解決すべくなされたもので、内周側に発生するたわみによるフレキ部の折り目の発生や配線の断線を防止することができるリジッド・フレックス多層プリント配線板の筐体への収納方法を提供することを目的とする。
【0009】
また特に、筐体に収納時のリジッド・フレックス多層プリント配線板のトータル厚みを薄くすることができるリジッド・フレックス多層プリント配線板の筐体への収納方法、更にその収納方法に好適なリジッド・フレックス多層プリント配線板を提供することを目的とする。
【0010】
【課題を解決するための手段】
請求項1記載の発明は、一方のリジッド部から2以上のフレキ部が引き出され、該引き出されたフレキ部の延在する先が他方のリジッド部と接続一体化されたリジッド・フレックス多層プリント配線板を、そのフレキ部を略S字状に折り曲げて筐体に収納することにより上記目的を達成したものである。
すなわち、フレキ部を略S字状に折り曲げることによって、内周側に発生していたたわみを吸収でき、フレキ部に折り目ができず配線が断線することが防止される。
【0011】
請求項2記載の発明は、請求項1記載の収納方法において、何れか一方のリジッド部に凹溝部を形成し、当該凹溝部にフレキ部の一部を収納保持せしめつつ略S字状に折り曲げることにより上記目的を達成したものである。
因に、フレキ部を略S字状に折り曲げて筐体に収納する場合、2以上のフレキ部が折り曲げられてリジッド部に重なり合う状態となるため、当該リジッド部とフレキ部が重ね合わされる部分は厚みが増し、筐体への収納上の問題が発生する場合がある。このような場合は上記の如く、フレキ部を折り曲げ、リジッド部に重なる位置に相当するリジッド部分に、フレキ部の幅に沿ってザグリ加工を施して凹溝部を形成し、当該凹溝部にフレキ部を収納保持することによって、トータルの厚みを薄くすることができ、筐体の厚さも薄くすることが可能になる。さらに、リジッド部にこの凹溝部を設けることで正確なフレキ部の位置決めも可能となる。
【0012】
請求項3記載の発明は、何れか一方のリジッド部に、フレキ部の略S字状折り曲げ時にその一部を収納保持する凹溝部を有するリジッド・フレックス多層プリント配線板により上記目的を達成したものである。
すなわち、斯かる凹溝部を有するリジッド・フレックス多層プリント配線板を用いることにより、フレキ部の略S字状の折り曲げ時にその一部を凹溝部に収納保持することができるので、フレキ部とリジッド部が重なり合う部分の厚みを薄くできる。
【0013】
【発明の実施の形態】
本発明の実施の形態を以下に説明する。
図1は、本発明のリジッド・フレックス多層プリント配線板を真上から見た平面図である。図2は、リジッド・フレックス多層プリント配線板を図1に対して反対面から見た底面図である。図3は、図1のA−A線断面図である。
【0014】
図1〜3において、リジッド・フレックス多層プリント配線板1は、フレキ部2、3とリジッド部4、5を備え、リジッド部4、5にフレキ部2、3を挟み込むような構造になっている。
【0015】
図4は、図1のB−B線断面図である。
【0016】
図4において、フレキ部2、3を折り曲げた際にフレキ部3がリジッド部5に重なる位置に相当するリジッド部分に、フレキ部2、3の幅に沿ってザグリ加工により凹溝部6が形成されている。
【0017】
前記記載の凹溝部6は、折り曲げたフレキ部を収納保持し得るものであれば、その具体的形設法は特に限定されないが、基板を積層する前に開口部を設けて形成する方が量産をする上で効率がよく好ましい。
【0018】
図5は、本発明のリジッド・フレックス多層プリント配線板のフレキ部を略S字状に折り曲げた状態を示す断面図である。
【0019】
図5においては、フレキ部2、3は、一旦180°折り曲げられた後、さらに180°反転し、凹溝部6に沿って略S字状に折り曲げられている。
【0020】
図6は、図5のC−C線断面図である。
【0021】
図6において、フレキ部3は折り曲げられてその一部がリジッド部5の凹溝部6に収納保持されている。
【0022】
尚、図5、6では、フレキ部3のみが凹溝部6に収納されているが、フレキ部2、3ともに収納しても構わない。
【0023】
而して、上記図5、6の状態で、筐体にリジッド・フレックス多層プリント配線板を収納する。
【0024】
【発明の効果】
本発明によれば、リジッド・フレックス多層プリント配線板の筐体への折り曲げ収納の際、フレキ部を折り曲げた時に発生する内周側のたわみや折り目をなくすることができる。特に、リジッド部の凹溝部を利用すれば、筐体にリジッド・フレックス多層プリント配線板を収納する際のトータル厚みを薄くすることができる。
【図面の簡単な説明】
【図1】図1は、本発明のリジッド・フレックス多層プリント配線板の平面図。
【図2】図2は、本発明リジッド・フレックス多層プリント配線板の底面図。
【図3】図3は、図1のA−A線断面図。
【図4】図4は、図1のB−B線断面図。
【図5】図5は、本発明リジッド・フレックス多層プリント配線板のフレキ部折り曲げ時の断面図。
【図6】図6は、図5のC−C線断面図。
【図7】図7は、従来リジッド・フレックス多層プリント配線板の断面図。
【図8】図8は、従来リジッド・フレックス多層プリント配線板のフレキ部折り曲げ時の断面図。
【符号の説明】
1、11:リジッド・フレックス多層プリント配線板
4、5、14、15:リジッド部
2、3、12、13:フレキ部
6:凹溝部[0001]
TECHNICAL FIELD OF THE INVENTION
SUMMARY OF THE INVENTION The present invention provides a method of storing a rigid-flex multilayer printed wiring board, in which a plurality of flexible portions are drawn out from a rigid portion, when the flexible portion is housed in a housing, in which the flexure of the flexible portion is eliminated and disconnection of the flexible portion is prevented. And a rigid-flex multilayer printed wiring board suitable for a method for storing the same.
[0002]
[Prior art]
Conventionally, a rigid-flex multilayer printed wiring board has a structure in which a plurality of flexible portions are drawn out from a rigid portion, and the extending end of the drawn-out flexible portion is connected to and integrated with another rigid portion. Therefore, when the flexible part of the rigid-flex multilayer printed wiring board is folded and stored in the housing, the length of the outer flexible part is the same as that of the inner flexible part, causing the inner flexible part to bend. In this case, a fold was formed in the flexible portion, and a defect leading to disconnection often occurred.
[0003]
This phenomenon is a problem that occurs because the lengths of the flexible portions are the same, and the sharper the bending angle, the more noticeable the folds (breaks) appear in the flexible portions.
[0004]
FIG. 7 is a cross-sectional view of a rigid-flex multilayer printed
[0005]
FIG. 8 shows a state where the flexible portion is bent. Since the
[0006]
In order to solve the problem described above, the distance between the
[0007]
Further, as disclosed in Japanese Patent Application Laid-Open No. 2002-16323, a single-layer flexible portion is divided into two paths, and the flexible substrates of both paths are folded in a line-symmetrical manner, so that the flexible portions extend from a plurality of layers. It has been proposed to have the same function, but even with this configuration, if the flexure is bent symmetrically due to the same distance between the outer periphery and the inner periphery of the flexible part, bending may occur at the fold, leading to disconnection Therefore, it was not enough measures.
[0008]
[Problems to be solved by the invention]
The present invention has been made in order to solve the problems described above, and a rigid-flex multilayer printed wiring board capable of preventing generation of folds in a flexible portion and disconnection of wiring due to bending generated on the inner peripheral side. It is an object of the present invention to provide a method for housing the housing.
[0009]
Particularly, a method of storing a rigid-flex multilayer printed wiring board in a housing, which can reduce the total thickness of the rigid-flex multilayer printed wiring board when housed in the housing, and a rigid-flex suitable for the storing method It is an object to provide a multilayer printed wiring board.
[0010]
[Means for Solving the Problems]
According to the first aspect of the present invention, there is provided a rigid-flex multilayer printed wiring in which two or more flexible portions are drawn out from one rigid portion, and the extension of the drawn-out flexible portion is connected to and integrated with the other rigid portion. The above object has been achieved by bending a flexible portion of the plate into a substantially S-shape and housing the plate in a housing.
That is, by bending the flexible portion into a substantially S-shape, the bending generated on the inner peripheral side can be absorbed, and it is possible to prevent the flexible portion from being creased and disconnecting the wiring.
[0011]
According to a second aspect of the present invention, in the storage method according to the first aspect, a concave groove portion is formed in one of the rigid portions, and a part of the flexible portion is stored and held in the concave groove portion and bent into a substantially S shape. Thereby, the above object has been achieved.
In the case where the flexible portion is bent into a substantially S-shape and stored in the housing, two or more flexible portions are bent and overlap with the rigid portion, so that the portion where the rigid portion and the flexible portion overlap each other is The thickness increases, and a problem in storage in the housing may occur. In such a case, as described above, the flexible portion is bent, and the rigid portion corresponding to the position overlapping the rigid portion is subjected to counterboring along the width of the flexible portion to form a concave groove portion, and the flexible portion is formed in the concave groove portion. By storing and holding, the total thickness can be reduced, and the thickness of the housing can also be reduced. Furthermore, accurate positioning of the flexible portion is possible by providing the concave portion in the rigid portion.
[0012]
The invention according to
That is, by using the rigid-flex multilayer printed wiring board having such a concave portion, a part of the flexible portion can be stored and held in the concave portion when the flexible portion is bent in a substantially S-shape. Can be made thinner at the portions where they overlap.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described below.
FIG. 1 is a plan view of a rigid-flex multilayer printed wiring board according to the present invention as viewed from directly above. FIG. 2 is a bottom view of the rigid-flex multilayer printed wiring board as viewed from the opposite side to FIG. FIG. 3 is a sectional view taken along line AA of FIG.
[0014]
1 to 3, a rigid-flex multilayer printed
[0015]
FIG. 4 is a sectional view taken along line BB of FIG.
[0016]
In FIG. 4, a
[0017]
The concrete groove forming method described above is not particularly limited as long as it can store and hold the bent flexible part. However, mass production is better if an opening is provided before laminating the substrates. In terms of efficiency, it is efficient and preferable.
[0018]
FIG. 5 is a cross-sectional view showing a state in which the flexible portion of the rigid-flex multilayer printed wiring board of the present invention is bent in a substantially S-shape.
[0019]
In FIG. 5, the
[0020]
FIG. 6 is a sectional view taken along line CC of FIG.
[0021]
In FIG. 6, the
[0022]
In FIGS. 5 and 6, only the
[0023]
Then, in the state of FIGS. 5 and 6, the rigid-flex multilayer printed wiring board is housed in the housing.
[0024]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, when bending and accommodating a rigid-flex multilayer printed wiring board in a housing | casing, the bending and the fold of the inner peripheral side which generate | occur | produce when bending a flexible part can be eliminated. In particular, by using the concave groove of the rigid portion, the total thickness when the rigid-flex multilayer printed wiring board is stored in the housing can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view of a rigid-flex multilayer printed wiring board according to the present invention.
FIG. 2 is a bottom view of the rigid-flex multilayer printed wiring board according to the present invention.
FIG. 3 is a sectional view taken along line AA of FIG. 1;
FIG. 4 is a sectional view taken along line BB of FIG. 1;
FIG. 5 is a cross-sectional view of the rigid-flex multilayer printed wiring board according to the present invention when the flexible portion is bent.
FIG. 6 is a sectional view taken along line CC of FIG. 5;
FIG. 7 is a cross-sectional view of a conventional rigid-flex multilayer printed wiring board.
FIG. 8 is a cross-sectional view of a conventional rigid / flexible multilayer printed wiring board when a flexible portion is bent.
[Explanation of symbols]
1, 11: rigid / flexible multilayer printed
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003005322A JP4188094B2 (en) | 2003-01-14 | 2003-01-14 | Rigid-flex multilayer printed wiring board storage method and rigid-flex multilayer printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003005322A JP4188094B2 (en) | 2003-01-14 | 2003-01-14 | Rigid-flex multilayer printed wiring board storage method and rigid-flex multilayer printed wiring board |
Publications (2)
Publication Number | Publication Date |
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JP2004221222A true JP2004221222A (en) | 2004-08-05 |
JP4188094B2 JP4188094B2 (en) | 2008-11-26 |
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JP2003005322A Expired - Fee Related JP4188094B2 (en) | 2003-01-14 | 2003-01-14 | Rigid-flex multilayer printed wiring board storage method and rigid-flex multilayer printed wiring board |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008072652A (en) * | 2006-09-15 | 2008-03-27 | Sumitomo Bakelite Co Ltd | Electronic device |
KR101055487B1 (en) * | 2009-05-12 | 2011-08-08 | 삼성전자주식회사 | Rigid-Flexible Stackable Module Substrate and Manufacturing Method Thereof |
WO2023233893A1 (en) * | 2022-05-31 | 2023-12-07 | 眞一 前田 | Electronic component wiring structure, and electronic component connecting method |
-
2003
- 2003-01-14 JP JP2003005322A patent/JP4188094B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008072652A (en) * | 2006-09-15 | 2008-03-27 | Sumitomo Bakelite Co Ltd | Electronic device |
KR101055487B1 (en) * | 2009-05-12 | 2011-08-08 | 삼성전자주식회사 | Rigid-Flexible Stackable Module Substrate and Manufacturing Method Thereof |
WO2023233893A1 (en) * | 2022-05-31 | 2023-12-07 | 眞一 前田 | Electronic component wiring structure, and electronic component connecting method |
Also Published As
Publication number | Publication date |
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JP4188094B2 (en) | 2008-11-26 |
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