JP2004207674A - Method for producing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin electronic component exhibiting excellent mountability in which coating resin is protected against chipping or cracking, and to provide its producing method. <P>SOLUTION: After level difference is reduced by filling the gap between surface acoustic wave elements 2 with side face coating resin 6, upper surface coating resin 7 is printed on the other major surface of the surface acoustic wave element 2 and on the upper surface of the side face coating resin 6. The gap between surface acoustic wave elements 2 is filled with side face coating resin 6 such that the cross-section is curved arcuately. First upper surface of the side face coating resin 6 touching the surface acoustic wave element 2 is flush with the upper surface of the surface acoustic wave element 2 and the second upper surface at a cutting part in sixth process is located lower than the first upper surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an electronic component device in which an electronic component element is flip-chip mounted to reduce the thickness.
[0002]
[Prior art]
2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter, as typified by mobile phones and the like, electronic component devices used in electronic devices have also been required to be smaller and thinner.
[0003]
Under such circumstances, an electronic component device 100 shown in FIG. 7 is conventionally known as an electronic component device in which an electronic component element and a base substrate are flip-chip mounted at predetermined intervals by solder bump members and sealed with resin. Have been. A connection electrode 102 is formed on an electronic component element 101 of the electronic component device 100, and an element connection electrode 106 is formed on a base substrate 105. The electronic component element 101 is arranged such that the connection electrode 102 and the element connection electrode 106 of the base substrate 105 face each other, and the connection electrode 102 and the element connection electrode 106 are connected by the solder bump member 103, so that the electronic component element 101 is electrically connected. The component element 101 is flip-chip mounted on the base substrate 103. A dam 107 is formed on the base substrate 103 so as to surround the element connection electrode 106. Thereafter, an epoxy-based exterior resin 108 is dropped from above the electronic component element 101, and cured by performing a heat treatment at a temperature of 100 ° C. to 150 ° C. for several hours, thereby sealing the electronic component element 101. At this time, since the exterior resin 108 is prevented from entering the inside from the gap between the electronic component element 101 and the base substrate 105 by the dam 107, the gap becomes airtight (see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-10-98134 [0005]
[Problems to be solved by the invention]
However, in the above-mentioned conventional electronic component device 100, since the liquid exterior resin 108 is dropped from above the electronic component element 101 and formed by heating and curing in this state, the cured resin layer is formed of the electronic component. The cross-sectional shape does not spread uniformly on the upper surface of the element 101, and has a mountain-like curved shape. Accordingly, since the thickness of the resin layer is relatively large, the thickness of the electronic component device 100 itself is also increased, and variations between products due to fluctuations in the viscosity and thixotropy of the liquid exterior resin 108 have occurred.
[0006]
Therefore, in the conventional resin forming method of the electronic component device 100, the thickness of the exterior resin 108 is formed more than necessary, and it is not possible to sufficiently cope with the demand for downsizing and thinning of the electronic component device. Was. In addition, since the upper surface of the electronic component device 100 is curved in a mountain-like shape and is not flat, the suction by the suction nozzle of the mounter does not work well during mounting on the motherboard, and a suction error occurs. As a result, productivity is reduced. There was also a problem of lowering.
[0007]
The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide an electronic component device which is thin, has no dimensional variation, and has excellent mountability, and a method of manufacturing the same.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, a method for manufacturing an electronic component device of the present invention includes: an electronic component element having a connection electrode and an outer peripheral sealing electrode formed on one main surface;
An element connection electrode connected to the connection electrode via a solder bump member, an outer peripheral sealing conductor film joined to the outer peripheral sealing electrode via a joining member, and a base substrate on which an external terminal electrode is formed,
Along with joining such that a predetermined interval is formed between the base substrate and the electronic component element,
A method for manufacturing an electronic component device in which a side surface exterior resin is applied to a side surface of the electronic component element and an outer peripheral surface of the joining member, and an upper surface exterior resin is applied to the other main surface of the electronic component element,
A step of preparing an electronic component element on which the connection electrode and the outer peripheral sealing electrode are formed,
A step of preparing an aggregate substrate in which a plurality of base substrates on which the element connection electrodes, the outer peripheral sealing conductor film and the external terminal electrodes are formed are continuous;
A step of forming the solder bump member and the bonding member on the element connection electrode and the outer peripheral sealing conductor film on each base substrate region of the collective substrate,
The connection electrode and the outer peripheral sealing electrode of the electronic component element are opposed to the solder bump member and the joining member on the collective substrate, and the electronic component element is mounted on each base substrate region of the collective substrate, and the solder bump member A step of connecting the connection electrode and the element connection electrode through, and bonding the outer peripheral sealing electrode and the outer peripheral sealing conductor film through the bonding member;
A step of filling a resin serving as a side surface exterior resin between the electronic component elements bonded on the collective substrate,
On the other main surface and the side exterior resin of the electronic component element, a step of printing a resin to be an upper exterior resin,
Simultaneously curing the resin to be the side exterior resin and the resin to be the top exterior resin,
Cutting the side surface exterior resin and the collective substrate for each base substrate region.
[0009]
The side surface exterior resin filled between the electronic component elements has a first upper surface at a position in contact with the electronic component element which is the same as the upper surface of the electronic component element, and a portion where the side surface exterior resin is cut. Is set to be lower than the first upper surface.
[0010]
The particle size of the filler contained in the upper exterior resin is a maximum particle size of 30 μm. Further, the upper exterior resin is an epoxy resin containing carbon black.
[0011]
[Action]
According to the present invention, the side exterior resin and the top exterior resin in the electronic component element are filled with the side exterior resin between the electronic component elements, and the top exterior resin is applied to the other main surface and the side exterior resin upper surface of the electronic component element. It is formed by a printing step and a step of simultaneously curing the side exterior resin and the top exterior resin. That is, after filling the gap between the electronic component elements by filling the side exterior resin between the electronic component elements, the upper exterior resin is formed on the other main surface of the electronic component element and the upper surface of the side exterior resin by printing. As a result, the step between the electronic component elements is reduced during printing of the upper exterior resin, so that the upper exterior resin is uniformly formed with a thin film thickness on the other main surface of the electronic component element and the upper surface of the side resin. can do. In other words, the electronic component device can be made thinner, and a flat surface is formed in the electronic component element portion, so that there is no occurrence of a suction error of the mounter device at the time of mounting on the motherboard, and the mountability is excellent. Electronic component device.
[0012]
Further, according to the present invention, the first upper surface of the side exterior resin to be filled, which is in contact with the electronic component element, is the same as the upper surface of the electronic component element, and the second upper surface located at the site where the side exterior resin is cut is , At a position lower than the first upper surface. That is, the side surface exterior resin has a cross-sectionally curved shape between the electronic component elements, and the upper surface exterior resin adhered to the upper surface thereof is also formed along the curved shape. Therefore, in the electronic component device after the individual cutting, the upper surface exterior resin is formed flat in the electronic component element portion, but is formed in the side exterior resin portion as a shape with a radius toward the outside. . Thus, the upper exterior resin is a thin layer, but the edge portion is chamfered, so that the resin layer can be maintained without chipping, cracking, and the like even when subjected to an external impact.
[0013]
In addition, since the maximum particle diameter of the filler contained in the upper exterior resin is 30 μm, the above-described reduction in thickness can be achieved, and the flatness can be stabilized. Furthermore, the upper surface exterior resin is an epoxy resin containing carbon black, and the carbon black has a very small particle diameter of 10 nm to 500 nm, so that an exterior resin having a thin layer thickness can be formed.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a method for manufacturing an electronic component device of the present invention will be described in detail with reference to the drawings. In the description, a surface acoustic wave device (electronic component device) using a surface acoustic wave element as an electronic component element will be described as an example.
[0015]
FIG. 1 is a sectional view of a surface acoustic wave device according to the present invention, and FIG. 2 is a plan view of a base substrate used in the surface acoustic wave device.
[0016]
The surface acoustic wave device (electronic component device) 1 includes a surface acoustic wave element (electronic component element) 2, a base substrate 3, a solder bump member 4, a joining member 5, a side exterior resin 6, and an upper exterior resin 7.
[0017]
The surface acoustic wave element 2 can be exemplified by a surface acoustic wave resonator, a surface acoustic wave filter, and the like. An interdigital transducer electrode (not shown) is formed on one main surface of a piezoelectric substrate 20 made of quartz, lithium niobate, lithium tantalate, or the like. In the present invention, a comb-shaped electrode and a reflector electrode are included, and the IDT electrode (hereinafter, simply referred to as an IDT electrode) is formed. Further, a connection electrode 8 connected to the IDT electrode is formed. Further, an annular outer peripheral sealing electrode 9 is formed on the entire outer periphery of the piezoelectric substrate 20 so as to surround the IDT electrode and the connection electrode 8. Each of these electrodes is formed of, for example, Al, Cu, or the like by a photolithography technique, and a layer of Cr, Ni, Au, or the like is formed on the surface as necessary.
[0018]
As shown in FIGS. 1 and 2, the base substrate 3 is made of, for example, a multi-layer substrate made of a glass-ceramic material or the like, and has, on its surface, an element connection electrode 10 facing the connection electrode 8 of the surface acoustic wave element 2; In addition, an annular outer peripheral sealing conductor film 11 facing the outer peripheral sealing electrode 9 is formed. An external terminal electrode 12 is formed on the bottom surface of the base substrate 3, and the element connection electrode 10 and the external terminal electrode 12 are connected by an internal wiring pattern including a via-hole conductor 13.
[0019]
As shown in FIG. 1, the solder bump member 4 connects the connection electrode 8 to the element connection electrode 10 of the base substrate 3, and also connects between the one main surface of the surface acoustic wave element 1 and the surface of the base substrate 3. A predetermined gap is formed.
[0020]
As shown in FIG. 1, the joining member 5 joins the outer peripheral sealing electrode 9 and the outer peripheral sealing conductor film 11 to form a connection between one main surface of the surface acoustic wave element 2 and the surface of the base substrate 3. The gap can be sealed, and the inside of the gap can be kept airtight, thereby preventing deterioration of the IDT electrode due to invasion of moisture or the like.
[0021]
The side surface exterior resin 6 is formed so as to cover the surface acoustic wave element 2, the outer periphery sealing electrode 9, the outer periphery sealing conductor film 11, and the outer periphery of the side surface of the bonding member 5.
[0022]
The upper surface exterior resin 7 is formed so as to cover the other main surface of the surface acoustic wave element 2 and the upper surface of the side surface exterior resin 6.
[0023]
The method for manufacturing the surface acoustic wave device 1 described above includes the steps shown in FIGS.
[0024]
First, in the first step, the surface acoustic wave element 2 on which the connection electrode 8 and the outer peripheral sealing electrode 9 are formed is prepared (see FIG. 3A). Subsequently, in a second step, the base substrate 3 on which the element connection electrode 10 connected to the connection electrode 8, the outer peripheral sealing conductor film 11 joined to the outer peripheral sealing electrode 9, and the external terminal electrode 12 are formed. A plurality of continuous collective substrates 14 are prepared (see FIG. 3B). In the third step, the solder bump members 4 and the joining members 5 are formed on the element connection electrodes 10 and the outer peripheral sealing conductor film 11 on the collective substrate 14. The solder bump member 4 and the joining member 5 are made of, for example, solder, and are formed by applying a solder paste and melting by heating. As a result, the molten solder paste becomes a projection having a substantially semicircular cross section on the element connection electrode 10 and the outer peripheral sealing conductor film 11 due to surface tension (see FIG. 3C).
[0025]
Then, in the fourth step, the surface acoustic wave element 2 is placed on the collective substrate 14 such that the connection electrode 8 and the element connection electrode 10 are opposed to the outer peripheral sealing electrode 9 and the outer peripheral sealing conductor film 11. The connection electrodes 8 and the element connection electrodes 10 are connected via the solder bump members 4 by performing a solder reflow process or the like by mounting a plurality of them, and the outer peripheral sealing electrodes 9 and the outer peripheral sealing electrodes 9 are joined via the joining members 5. The conductor film 11 is joined (see FIG. 3D). Thereby, a gap corresponding to the height of the solder bump member 4 and the joining member 5 is formed between one main surface of the surface acoustic wave element 2 and the surface of the base substrate 3 and is hermetically sealed. A stable surface acoustic wave can be vibrated on the main surface of the surface acoustic wave element 2. Subsequently, in a fifth step, first, the side surface exterior resin 6 is filled between the surface acoustic wave elements 2 on the collective substrate 14. The side surface exterior resin 6 is, for example, an epoxy-based resin, and is a liquid resin containing a solvent and having fluidity. Next, after the upper surface exterior resin 7 is formed on the other main surface of the surface acoustic wave element 2 and the upper surface of the side surface exterior resin 6 by a method such as screen printing, the upper surface exterior resin 7 is heated at a temperature of 150 ° C. for 1 hour, for example. The resin 6 and the upper exterior resin 7 are simultaneously cured (see FIG. 3E). Then, in the sixth step, the surface acoustic wave elements 2 are cut using a dicing saw or the like and separated into individual parts, thereby forming the surface acoustic wave device 1 (see FIG. 3F).
[0026]
Here, a characteristic feature of the present invention is that the fifth step of forming the side surface exterior resin 6 and the top surface exterior resin 7 on the electronic component element 2 includes a step of filling the side surface exterior resin 6 between the surface acoustic wave elements 2. A step of printing the upper surface exterior resin 7 on the other main surface and the upper surface of the side surface exterior resin 6 of the surface acoustic wave element 2, and a step of simultaneously curing the side surface exterior resin 6 and the upper surface exterior resin 7. . That is, after filling the gap between the surface acoustic wave elements 2 by filling the side surface covering resin 6 between the surface acoustic wave elements 2 and reducing the level difference, the other main surface and the side surface covering of the surface acoustic wave element 2 are printed. An upper exterior resin 7 is formed on the upper surface of the resin 6. Thereby, the upper surface exterior resin 7 can be uniformly formed with a small thickness on the other main surface of the surface acoustic wave element 2 and the upper surface of the side surface resin 6. Further, since the upper surface exterior resin 7 contains a filler having a maximum particle size of 10 μm to 30 μm (a maximum of 30 μm), the layer thickness can be formed with a maximum filler diameter, that is, a thickness of 30 μm. In order to make the surface acoustic wave device 1 thinner, it is preferable that the layer thickness of the upper surface exterior resin 7 is thinner. However, if the thickness is too thin, the strength of the resin layer is reduced. When the wave elements 2 are cut and separated individually, cracks and peeling occur. Therefore, in order to secure a minimum layer thickness of 30 μm that can be practically used, a filler having a maximum particle size of 10 μm to 30 μm is contained.
[0027]
Furthermore, if the upper surface exterior resin 7 is an epoxy resin containing carbon black, the particle size of the carbon black is very fine, 10 nm to 500 nm, so that the upper surface exterior resin 7 having a small layer thickness can be formed.
[0028]
Furthermore, a characteristic of the present invention is that, in the fifth step, when the side surface exterior resin 6 is filled, the side surface exterior resin 6 has a cross section curved between the surface acoustic wave elements 2 in an arcuate shape. The first upper surface of the side surface exterior resin 6 which is in contact with the surface acoustic wave element 2 is the same as the upper surface of the surface acoustic wave element 2, and the second upper surface located at the portion to be cut in the sixth step is , Lower than the first upper surface. This is because, as shown in FIG. 4 (a), the side surface exterior resin 6 is a liquid resin containing a solvent component, and when filled, the liquid level at a portion in contact with the surface acoustic wave element 2 becomes high due to a capillary phenomenon. by. In this state, as shown in FIG. 4B, the top exterior resin 7 is printed, and the side exterior resin 6 and the top exterior resin 7 are simultaneously cured. The cross section is formed in an arcuate shape. That is, in the surface acoustic wave device 1 after being individually cut along the cutting line XX ′ in the sixth step as shown in FIG. Although it is formed flat, it is formed in the side exterior resin 6 portion as a shape with a radius toward the outside. At this time, the side surface exterior resin is, for example, a thermosetting type resin composed of an inorganic filler ratio of 60 to 73 wt%, an epoxy resin component of 12 to 23 wt%, a curing agent component of 8 to 15 wt%, and a silicon elastic component of 0.7 to 1 wt%. It is a resin, and volume shrinkage occurs due to the curing of the epoxy resin component at the time of heat curing, so that the cross-section is more curvedly curved, and a more effective shape is obtained.
[0029]
In the above-described embodiment, an example of a surface acoustic wave device using a surface acoustic wave element as an electronic component element has been described. However, regardless of the type of the electronic component element, the electronic component element can be formed by using a solder pump and a joining member. Needless to say, the present invention can be widely applied to a method of manufacturing an electronic component device connected to a base substrate and covered with an exterior member.
[0030]
For example, FIG. 6 is a cross-sectional view schematically showing an example in which the present invention is applied to a piezoelectric device using a piezoelectric resonance element instead of a surface acoustic wave element.
[0031]
In the figure, a piezoelectric device 300 includes a piezoelectric element 30, a base substrate 3, a solder bump member 4, a solder bonding member 5, and an exterior member 6. The configuration other than the piezoelectric element 30 is exactly the same as the surface acoustic wave device 1 shown in FIG. 1, and the manufacturing method is exactly the same as the manufacturing method shown in FIG. 3 if the surface acoustic wave element is replaced with a piezoelectric element. is there.
[0032]
Examples of the piezoelectric element 30 include a piezoelectric resonator, a filter and a duplexer in which a plurality of piezoelectric resonators are combined, and, for example, a piezoelectric layer 32 made of aluminum nitride on one main surface of a substrate 31 made of silicon. Are formed, and a pair of vibrating electrodes 33 and connection electrodes 8 connected to the vibrating electrodes 33 are formed. Further, an annular outer peripheral sealing electrode 9 for hermetically sealing a gap formed between the piezoelectric element 30 and the base substrate 3 is formed on the outer periphery of one main surface of the base 31. A gap 34 is formed on the vibration area of the vibration electrode 33 to prevent the vibration from attenuating.
[0033]
The vibrating electrode 33 is made of molybdenum, tungsten, aluminum, or the like. A surface layer made of a chromium layer, a nickel layer, a gold layer, or the like is formed on the connection electrode 8 and the outer peripheral sealing electrode 9 as necessary. Has good connectivity.
[0034]
With the above-described configuration, the piezoelectric element 30 operates as a resonator using the vibration in the thickness direction of the piezoelectric layer 32 or a filter or a duplexer in which a plurality of the resonators are combined. Also in the method of manufacturing the device 300, a small-sized piezoelectric device having high reliability and high productivity can be formed.
[0035]
【The invention's effect】
According to the method for manufacturing an electronic component device of the present invention, the upper surface exterior resin can be uniformly formed with a small thickness on the other main surface of the electronic component element and the upper surface of the side resin. In other words, the electronic component device can be made thinner, and a flat surface is formed in the electronic component element portion, so that there is no occurrence of a suction error of the mounter device at the time of mounting on the motherboard, and the mountability is excellent. Electronic component device.
[0036]
Also, the upper surface exterior resin is formed flat in the electronic component element portion, but is formed in the side exterior resin portion as a shape with a radius toward the outside. Thus, the upper exterior resin is a thin layer, but the edge portion is chamfered, so that the resin layer can be maintained without chipping, cracking, and the like even when subjected to an external impact.
[Brief description of the drawings]
FIG. 1 is a sectional view of an electronic component device of the present invention.
FIG. 2 is a plan view of a base substrate used in the electronic component device of the present invention.
FIGS. 3A to 3F are cross-sectional views illustrating steps of a method for manufacturing an electronic component device according to the present invention.
FIG. 4A is a cross-sectional view illustrating a state of forming a side surface exterior resin, and FIG. 4B is a cross-sectional view illustrating a state of forming an upper side exterior resin.
FIG. 5A is a cross-sectional view showing an edge portion of a top exterior resin, and FIG. 5B is an enlarged view of a portion A of FIG.
FIG. 6 is a cross-sectional view schematically illustrating a structure of a piezoelectric device to which the present invention is applied.
FIG. 7 is a cross-sectional view of a conventional electronic component device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Surface acoustic wave device 2 ... Surface acoustic wave element 3 ... Base substrate 4 ... Solder bump member 5 ... Joining member 6 ... Side exterior resin 7 ... Top exterior resin 8 .. Connection electrode 9 ... outer peripheral sealing electrode 10 ... element connecting electrode 11 ... outer peripheral sealing conductor film 30 ... piezoelectric element 300 ... piezoelectric device

Claims (4)

On the other hand, an electronic component element having a connection electrode and an outer peripheral sealing electrode formed on a main surface,
An element connection electrode connected to the connection electrode via a solder bump member, an outer peripheral sealing conductor film joined to the outer peripheral sealing electrode via a joining member, and a base substrate on which an external terminal electrode is formed, respectively.
Along with joining such that a predetermined interval is formed between the base substrate and the electronic component element,
A method of manufacturing an electronic component device in which a side surface exterior resin is applied to a side surface of the electronic component element and an outer peripheral surface of the bonding member, and an upper surface exterior resin is applied to the other main surface of the electronic component element,
A step of preparing an electronic component element on which the connection electrode and the outer peripheral sealing electrode are formed,
A step of preparing an aggregate substrate in which a plurality of base substrates on which the element connection electrodes, the outer peripheral sealing conductor film and the external terminal electrodes are formed are continuous;
A step of forming the solder bump member and the bonding member on the element connection electrode and the outer peripheral sealing conductor film on each base substrate region of the collective substrate,
The connection electrode and the outer peripheral sealing electrode of the electronic component element are opposed to the solder bump member and the joining member on the collective substrate, and the electronic component element is mounted on each base substrate region of the collective substrate, and the solder bump member A step of connecting the connection electrode and the element connection electrode through, and bonding the outer peripheral sealing electrode and the outer peripheral sealing conductor film through the bonding member;
A step of filling a resin serving as a side surface exterior resin between the electronic component elements bonded on the collective substrate,
On the other main surface and the side exterior resin of the electronic component element, a step of printing a resin to be an upper exterior resin,
Simultaneously curing the resin to be the side exterior resin and the resin to be the top exterior resin,
Cutting the side exterior resin and the collective substrate for each base substrate region. The side exterior resin filled between the electronic component elements has a first upper surface at a position in contact with the electronic component element which is the same as the upper surface of the electronic component element, and a second cut portion of the side exterior resin. 2. The method according to claim 1, wherein an upper surface is set to be lower than the first upper surface. The method for manufacturing an electronic component device according to claim 1, wherein the upper surface exterior resin contains a filler having a maximum particle diameter of 30 μm. The method for manufacturing an electronic component device according to claim 1, wherein the upper surface exterior resin is an epoxy resin containing carbon black.

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