JP2004193401A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can reduce a running cost. <P>SOLUTION: The substrate processing apparatus is equipped with an airconditioning unit that adjusts the temperature of air within a coating unit. The airconditioning unit can operate in normal mode and in power saving mode with less power consumption. Its operation is switched from power saving mode to normal mode at a timing T6 earlier by a time Ti0 necessary for adjustment before a timing T8 for transferring a substrate to the coating unit so that the temperature within the coating unit may be ideal at the timing T8. In addition, the airconditioning unit AC is switched to power saving mode at a timing T9 when the substrate is taken out from the coating unit. Thus, the airconditioning unit can be operated only when it becomes necessary, thus reducing the running cost of the substrate processing apparatus. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus for processing a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, and the like (hereinafter, referred to as a “substrate”).
[0002]
[Prior art]
In the manufacture of semiconductors and liquid crystal displays, various types of substrate processing equipment are used to perform a series of processes such as cleaning, resist coating, exposure, development, etching, formation of interlayer insulating films, heat treatment, and dicing on substrates. Is used. In such a substrate processing apparatus, since the temperature and humidity of the atmosphere may affect the processing result and the yield may be deteriorated, the temperature and the temperature of the air in the processing unit that performs the processing affected by the temperature and humidity may be reduced. Humidity is adjusted using an air conditioning unit.
[0003]
For example, in a coating / developing apparatus (coater / developer) which is a substrate processing apparatus for performing resist coating processing and developing processing, the temperature and humidity of air in a coating processing unit for coating a resist on a substrate are affected by the thickness of the resist film. In order to exert an influence, the temperature and humidity of the air in the coating processing unit are adjusted by an air conditioning unit (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-10-154644
[0005]
[Problems to be solved by the invention]
By the way, the processing unit of the substrate processing apparatus is in a state of waiting for processing when a substrate to be processed is not being transported. In such a standby state, since the temperature and humidity of the atmosphere do not affect the processing result, it can be said that it is not necessary to adjust the temperature and humidity of the air in the processing unit.
[0006]
However, in the conventional substrate processing apparatus, the air conditioning unit is always operated at the maximum capacity regardless of the state of the processing unit. For this reason, there has been a problem that the running cost of the substrate processing apparatus becomes large. Further, in response to recent demand for energy saving, a substrate processing apparatus capable of achieving energy saving has been demanded.
[0007]
The present invention has been made in view of the above problems, and has as its object to provide a substrate processing apparatus capable of reducing running costs and saving energy.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, an invention according to claim 1 is a substrate processing apparatus including a processing unit that receives a transported substrate and processes the substrate, and adjusts the temperature or humidity of air in the processing unit. Air adjusting means, and control means for controlling an adjusting operation relating to an output of the air adjusting means between a plurality of operating states having different power consumption in accordance with a transfer state of the substrate to the processing unit. ing.
[0009]
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the air adjusting unit adjusts the temperature or humidity of the air in the processing unit to a value within a specific adjustment range. The control means changes the adjustment range.
[0010]
According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect, the control means adjusts the adjustment range between a first range and a second range larger than the first range. A first timing acquisition unit that acquires a first timing at which the substrate is transported to the processing unit, the first timing, and the air adjustment unit is configured to change air inside the processing unit. The control unit changes the adjustment range from the second range based on an adjustment time required to adjust the temperature or humidity of the second range from a value in the second range to a value in the first range. A second timing acquisition unit for acquiring a second timing to be changed to the first range.
[0011]
According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the second range includes the first range.
[0012]
According to a fifth aspect of the present invention, in the substrate processing apparatus according to the third or fourth aspect, the substrate is transported from outside the substrate processing apparatus, and the substrate is provided outside the substrate processing apparatus. Receiving means for receiving a signal indicating the transport state from a predetermined external device, wherein the first timing obtaining means obtains the first timing based on the signal.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Hereinafter, as an example of the substrate processing apparatus, a coating and developing apparatus (coater / developer) that performs a resist coating process, a developing process, and the like will be described.
[0014]
<1. First Embodiment>
<1-1. Configuration>
FIG. 1 is a diagram showing a schematic configuration of a coating and developing apparatus 1 which is a substrate processing apparatus according to an embodiment of the present invention. As shown in the drawing, the coating and developing apparatus 1 mainly includes an indexer ID, a unit arrangement section MP, and an interface IF. In FIG. 1, in order to clarify the direction, an XYZ orthogonal coordinate system in which the Z direction is a vertical direction and the XY plane is a horizontal plane is given.
[0015]
The indexer ID includes a transfer robot TF and a mounting stage 15. Four carriers C can be arranged and mounted on the mounting stage 15 along the Y-axis direction. Each carrier C has a plurality of storage grooves formed therein, and each groove can store one substrate in a horizontal posture.
[0016]
The transfer robot TF is movable along the Y-axis direction. At the same time, the transfer robot TF has one transfer arm that can move up and down in the Z-axis direction, rotate in the XY plane, and move forward and backward in the X-axis direction. Thereby, the transfer robot TF can move the transfer arm three-dimensionally. By such an operation of the transfer robot TF, the indexer ID takes out an unprocessed substrate from the carrier C and transfers it to the unit placement unit MP, and receives a processed substrate from the unit placement unit MP and stores it in the carrier C. can do.
[0017]
The unit arrangement unit MP includes various processing units that perform predetermined processing on the substrate. Two coating processing units SC are arranged on the front side (Y axis minus side) of the unit arrangement part MP, and two development processing units SD are arranged on the back side (Y axis plus side). The coating processing unit SC is a so-called spin coater, and performs a resist coating process of applying a resist while rotating the substrate to form a resist film on the main surface of the substrate. The developing unit SD is a so-called spin developer, and performs a developing process by supplying a developing solution onto the exposed substrate. The coating unit SC and the developing unit SD are opposed to each other with the transport path 16 interposed therebetween.
[0018]
Further, three heat treatment unit groups 13 are arranged above the development processing unit SD. The heat treatment unit group 13 includes an adhesion strengthening unit AH that performs an adhesion strengthening process on the substrate before the resist coating process, a heating unit HP that heats the substrate to raise the temperature to a predetermined temperature, and a cooling unit that cools the substrate to a predetermined temperature. (See FIG. 2).
[0019]
A transfer robot TR is disposed on a transfer path 16 sandwiched between the coating unit SC and the development unit SD. The transfer robot TR is movable along the X-axis direction. In addition, the transfer robot TR includes two transfer arms capable of moving up and down in the Z-axis direction, rotating in the XY plane, and moving forward and backward in the Y-axis direction. The substrate to be processed is circulated and transported by the transport arm of the transport robot TR between the processing units arranged in the unit arrangement section MP according to a predetermined processing procedure.
[0020]
That is, each processing unit arranged in the unit arrangement part MP receives the substrate transported by the transport robot TR and performs a predetermined process on the substrate. The substrate processed in one processing unit is transferred again to the transport robot TR, and transported to a processing unit that performs the next processing in the processing procedure. Further, the transfer robot TR can transfer the substrate between the transfer robot TF of the indexer ID and the interface IF.
[0021]
The interface IF receives the resist-coated substrate from the unit arrangement unit MP and transfers it to an adjacently arranged exposure apparatus (not shown), and receives the exposed substrate from the exposure apparatus and returns it to the unit arrangement unit MP. Has functions. In order to realize this function, a transfer robot (not shown) for transferring a substrate is arranged at the interface IF. In this specification, the transfer robot TF, the transfer robot TR, the delivery robot, and the like that transfer a substrate are collectively referred to as a substrate transfer unit 14 (see FIG. 3).
[0022]
An air conditioning unit AC is arranged above each of the two coating processing units SC. In the coating processing unit SC, the thickness of the formed resist film changes according to the temperature and humidity of the air (atmosphere) inside the coating processing unit SC. Since such a change in film thickness may lead to a deterioration in yield, it is necessary to control the temperature and humidity of the air inside the coating processing unit SC. Therefore, the temperature and humidity of the air inside the two coating processing units SC are adjusted by the air conditioning unit AC disposed immediately above each of the two coating processing units SC.
[0023]
FIG. 2 is a diagram illustrating an outline of a cross section of the unit arrangement section MP of the coating and developing apparatus 1. As described above, the coating processing unit SC has a transfer path on which the transfer robot TR is disposed for the heat treatment unit group 13 in which the adhesion strengthening unit AH, the heating unit HP, the cooling unit CP, and the like are incorporated, and the development processing unit SD. 16 are arranged opposite to each other. Then, the air conditioning unit AC is disposed directly above the coating processing unit SC.
[0024]
The air conditioning unit AC is configured to take in air outside the apparatus from the upper air intake and supply air having adjusted temperature and humidity to the lower coating processing unit SC. , A primary chemisorption filter 22, a secondary chemisorption filter 23, a humidifier 24, a cooler 25, a heater 26, a second fan 27, and an air filter 28 are arranged and built in this order.
[0025]
The first fan 21 takes in air outside the apparatus (normally, air in a clean room) into the air conditioning unit AC, and the second fan 27 sends out air whose temperature and humidity have been adjusted to the coating processing unit SC. The primary chemical adsorption filter 22 and the secondary chemical adsorption filter 23 adsorb and remove alkaline substances (mainly ammonia gas) from the air taken in by the first fan 21. The humidifier 24, the cooler 25, and the heater 26 respectively humidify, cool (dehumidify), and heat the air passing through the air conditioning unit AC. As the humidifier 24, for example, an evaporation type humidifier or the like can be adopted, and as the cooler 25 and the heater 26, a Peltier element or the like can be adopted. The air filter 28 is formed of a high-performance filter such as an ULPA filter, and removes fine particles contained in air. With such a configuration, the air conditioning unit AC can supply the cleaning air whose temperature and humidity have been adjusted to the coating processing unit SC.
[0026]
At an appropriate position in the coating unit SC, a temperature and humidity sensor 29 for detecting the temperature and humidity of the air in the coating unit SC is provided. The air conditioning unit AC performs an adjusting operation based on the detection result obtained by the temperature and humidity sensor 29, and adjusts the temperature and humidity of the air in the coating processing unit SC to values within a specific adjustment range.
[0027]
The air-conditioning unit AC can perform a power-saving operation that consumes relatively little power as well as a normal operation. In the normal operation and the power saving operation, the temperature adjustment range and the humidity adjustment range (generally speaking, the adjustment range of the air adjustment ability) targeted by the air conditioning unit AC are set differently.
[0028]
For example, assuming that the temperature of the air that is ideal in the resist coating process (hereinafter referred to as “ideal temperature”) is Te (° C.) and the humidity of the ideal air is Hu (% RH), in normal operation, The temperature adjustment range is set to Te ± 1 (° C.), and the humidity adjustment range is set to Hu ± 1 (% RH). When performing the resist coating process, the temperature and the humidity of the atmosphere are required to be values within these ranges, and this range is hereinafter referred to as a “normal range”.
[0029]
On the other hand, in the power saving operation, the temperature adjustment range is set to a range of Te ± 5 (° C.), and the humidity adjustment range is set to a range of Hu ± 5 (% RH). That is, the adjustment range of the temperature and the humidity in the power saving operation (hereinafter referred to as “power saving range”) is set to a range larger than the normal range and including the normal range.
[0030]
In the air conditioning unit AC, when the temperature or humidity in the air conditioning unit AC obtained by the temperature / humidity sensor 29 is a value outside the adjustment range or a value near the limit of the adjustment range, there is a possibility that the temperature or humidity may fall outside the adjustment range. Otherwise, the air adjustment operation is stopped. Therefore, in the normal operation in which the adjustment range is relatively small, the adjustment operation of the air conditioning unit AC is almost always performed, but in the power saving operation in which the adjustment range is relatively large, the adjustment operation of the air conditioning unit AC is performed. Time is reduced compared to normal operation. For this reason, in the power saving operation, the power consumption of the air conditioning unit AC is suppressed as compared with the normal operation.
[0031]
Control for switching the operation of the air conditioning unit AC between normal operation and power saving operation, that is, control for changing the adjustment range of the air conditioning unit AC between the normal range and the power saving range, is performed inside the coating and developing apparatus 1. This is done by the provided controller.
[0032]
FIG. 3 is a diagram showing a functional configuration of the coating and developing apparatus 1 including the controller 11 using functional blocks. The controller 11 is configured by a computer including a CPU for performing arithmetic processing, a RAM serving as a work area for arithmetic, a ROM for storing a control program, and the like. Various functions of the controller 11 are realized by the CPU performing arithmetic processing according to a control program stored in the ROM. Further, the controller 11 is connected to a nonvolatile storage device 12 such as a hard disk. The storage device 12 stores data necessary for the processing of the controller 11, such as recipe data indicating a processing procedure of the substrate.
[0033]
Further, as shown in the figure, the above-described coating processing unit SC, developing processing unit SD, heat treatment unit group 13, substrate transport unit 14, and air conditioning unit AC are each electrically connected to the controller 11. With such a configuration, each unit of the coating and developing apparatus 1 is controlled by the controller 11 and performs a predetermined operation under the control of the controller 11.
[0034]
<1-2. Operation>
Next, the operation of the coating and developing apparatus 1 will be described. FIG. 4 is a timing chart for explaining the operation of the coating and developing apparatus 1, and reference numerals T1 to T14 in the figure indicate time points. The upper part of FIG. 4 focuses on one substrate to be processed, and while the one substrate (hereinafter, referred to as “target substrate”) is transported from the indexer ID to the interface IF, a plurality of processes of the unit arrangement part MP are performed. FIG. 2 is a diagram showing a state of being processed in the unit. On the other hand, the lower part of FIG. 4 shows the operation of the air conditioning unit AC at the same time as the upper part. At time T1, it is assumed that the target substrate is placed on the placement stage 15 of the indexer ID while being stored in the carrier C.
[0035]
As shown in the upper part of FIG. 4, the board of interest is first taken out of the carrier C by the transfer robot TF of the indexer ID (time T1), and is transferred to the transfer robot TR of the unit placement unit MP (time T2).
[0036]
Next, the target substrate is transported by the transport robot TR to the adhesion strengthening unit AH (time T3), and the adhesion enhancement processing is performed (time T3 to T4).
[0037]
Next, the substrate of interest is transferred to the transfer robot TR (time T4), transferred to the cooling unit CP (time T5), and cooled down to about room temperature (time T5 to T7).
[0038]
Next, the target substrate is transferred to the transfer robot TR (time T7), transferred to the coating processing unit SC (time T8), and subjected to a resist coating process. That is, the resist is applied to the target substrate while being rotated, and a resist film is formed on the main surface (time T8 to T9).
[0039]
Next, the target substrate is transferred to the transport robot TR (time T9), transported to the heating unit HP (time T10), and subjected to a heating process called pre-baking (a baking process before exposure) (time T10). T11).
[0040]
Next, the substrate of interest is transferred to the transfer robot TR (time T11), transferred to the cooling unit CP (time T12), and cooled to about room temperature (time T12 to T13).
[0041]
Next, the target board is transferred to the transfer robot TR (time T13), and further transferred to the transfer robot of the interface IF (time T14). Thereafter, the target substrate is transferred to the exposure apparatus, subjected to exposure processing in the exposure apparatus, and then transferred again to the transfer robot of the interface IF. Then, after the development processing and the like are performed in the development processing unit SD, the target substrate is again stored in the carrier C of the indexer ID.
[0042]
The time during which the resist processing is performed in the coating processing unit SC (hereinafter, referred to as “coating processing time”) of the processing time for the target substrate as described above is the time Tt from time T8 to T9. It is. Therefore, in the coating processing time Tt, it is necessary to manage the temperature and humidity of the air in the coating processing unit SC. On the other hand, the coating processing unit SC is in a standby state (idling state) in which the coating processing unit SC waits for processing for other times, so that it is not necessary to manage the temperature and humidity of the air in the coating processing unit SC. That is, with regard to the coating processing time Tt, it is necessary to adjust the temperature and humidity of the air in the coating processing unit SC to values within a normal range, but to adjust the other times to values within the power saving range. It will be.
[0043]
Therefore, during the coating processing time Tt, the controller 11 controls the operation of the air conditioning unit AC between the power saving operation and the normal operation so that the temperature and humidity of the air in the coating processing unit SC fall within the normal range. Switching control is performed between them. However, when the operation of the air conditioning unit AC is switched from the power saving operation to the normal operation, the temperature and humidity of the air in the coating unit SC do not immediately become values within the normal range. Time is needed.
[0044]
FIG. 5 is a diagram illustrating a change in the temperature of the air in the coating processing unit SC when the operation of the air conditioning unit AC is switched from the power saving operation to the normal operation. In the figure, the horizontal axis represents time, and the vertical axis represents the temperature of air in the coating unit SC. It is also assumed that the operation of the air conditioning unit AC has been switched from the power saving operation to the normal operation at the time Ta.
[0045]
In the power saving operation up to the time point Ta, the temperature of the air in the coating processing unit SC is any value within the power saving range (range of Te ± 5 ° C.) Ra2. Then, when the operation of the air conditioning unit AC is switched to the normal operation at the time Ta, the temperature of the air in the coating processing unit SC gradually changes to the ideal temperature Te.
[0046]
The time required for the temperature of the air in the coating processing unit SC to change from a value in the power saving range Ra2 to a value in the normal range (range of Te ± 1 ° C.) Ra1 required in the resist coating processing (hereinafter, referred to as “Ra1”). , "Change time") becomes larger as the temperature of the air during the power saving operation becomes farther from the ideal temperature Te. For example, in the example of FIG. 5, the temperature during the power saving operation is relatively close to the ideal temperature Te when indicated by a reference symbol L2, and relatively far from the ideal temperature Te when indicated by a reference symbol L1 and L3. Then, as shown in the figure, the change time Pe1 in the case indicated by the code L1 and the code L3 is longer than the change time Pe2 in the case of the code L2.
[0047]
Therefore, such a change time becomes maximum when the temperature during the power saving operation is at the limit value of the power saving range (Te + 5 ° C. or Te−5 ° C.). The maximum change time (hereinafter, referred to as “maximum change time”) can be obtained in advance by measurement or the like. As for the humidity, similarly to the temperature, the maximum time (maximum change time) of the time required to change from a value within the power saving range to a value within the normal range can be obtained.
[0048]
The larger one of the maximum change time of the temperature and the maximum change time of the humidity ensures that both the temperature and the humidity of the air in the coating processing unit SC are changed from the value in the power saving range to the value in the normal range. (Hereinafter referred to as "adjustment time" and using the symbol Ti0). That is, after switching the operation of the air conditioning unit AC from the power saving operation to the normal operation, in order to ensure that both the temperature and humidity of the air in the coating processing unit SC are within the normal range, the adjustment time Ti0 It takes time.
[0049]
From this, at the start time T8 of the coating processing time Tt (see FIG. 4), both the temperature and the humidity of the air in the coating processing unit SC are adjusted to be within the normal range from the time T8. At the time T6, which is earlier by the time Ti0, it is necessary to switch the operation of the air conditioning unit AC from the power saving operation to the normal operation.
[0050]
The timing for switching the operation of the air conditioning unit AC (hereinafter, referred to as “switching timing”) is obtained by the controller 11. In order to determine the switching timing, first, the time from when the target substrate is taken out by the transfer robot TF of the indexer ID to when it is transported to the coating processing unit SC (hereinafter referred to as “in-apparatus transport time”) Ti1. Is required. The in-apparatus transfer time Ti1 is obtained from the processing procedure of the target substrate. Specifically, the processing time of each processing unit and the transport time between the processing units are stored in the storage device 12 in advance, and the processing procedure for the substrate of interest is performed before the substrate of interest is transported to the coating processing unit SC. The required time is added, and the intra-device transport time Ti1 is obtained by this calculation.
[0051]
Then, when the target substrate is taken out by the transfer robot TF, the in-apparatus transfer time Ti1 is added to the taken-out timing (time T1), and the timing at which the target substrate is transferred to the coating processing unit SC (hereinafter, “transfer timing The time T8) is determined. Then, the switching time (time T6) is obtained by subtracting the adjustment time Ti0 from the transport timing. The adjustment time Ti0 is stored in the storage device 12 in advance.
[0052]
Such calculation for determining the switching timing is instantaneously performed at the timing (time T1) when the target substrate is taken out by the transfer robot TF. Then, at the switch timing (time T6), the operation of the air conditioning unit AC is switched from the power saving operation to the normal operation by the controller 11 at that time. As a result, the temperature and humidity of the air in the coating processing unit SC gradually change, and each of them is surely adjusted to a value within the adjustment range at the transport timing (time T8).
[0053]
When the substrate of interest is removed from the coating processing unit SC, the temperature and humidity of the air in the coating processing unit SC are no longer required. Therefore, at the timing when the substrate of interest is removed (time T9), the air conditioning unit AC is turned off. The operation is switched from the normal operation to the power saving operation. By such control, the air conditioning unit AC does not operate at the maximum capacity in an idling state in which the substrate is not transferred to the coating processing unit SC and the processing is not performed. As a result, the running cost of the coating and developing apparatus 1 can be reduced and energy can be saved.
[0054]
In the above description, the coating and developing apparatus 1 processes only one substrate (substrate of interest), but the coating and developing apparatus 1 can also process a plurality of substrates continuously in time. . When processing a plurality of substrates successively in time as described above, when processing is performed on the first substrate among the plurality of substrates, a switching timing is derived, and the operation of the air conditioning unit AC is performed at the switching timing. The operation can be switched from the power saving operation to the normal operation. When the resist coating process on the last substrate among the plurality of substrates to be processed continuously is completed, the operation of the air conditioning unit AC is switched from the normal operation to the power saving operation. Thereby, even when processing a plurality of substrates continuously in time, the operation of the air conditioning unit AC is switched between the normal operation and the power saving operation as needed, and the running cost of the coating and developing apparatus 1 is reduced. Thus, reduction and energy saving can be achieved.
[0055]
Further, in the present embodiment, since the power saving range includes the normal range, the adjustment necessary for adjusting the temperature and humidity of the air in the coating processing unit SC from the value in the power saving range to the value in the normal range. Time can be reduced. As a result, the time during which the adjustment range is set to the power saving range, that is, the time during which the air conditioning unit AC performs the power saving operation can be made longer, so that the running cost can be reduced and energy can be saved.
[0056]
As described above, the first embodiment of the present invention has been described. However, in the coating and developing apparatus 1, the operation of the air conditioning unit AC is changed to the normal operation and the power saving operation according to the transfer state of the substrate to the coating processing unit SC. Therefore, when the substrate is not transferred to the coating processing unit SC and there is little need to adjust the temperature and humidity, the air conditioning unit AC does not operate at the maximum capacity. As a result, the running cost of the coating and developing apparatus 1 can be reduced and energy can be saved.
[0057]
In addition, a switching timing for changing the adjustment range is obtained by subtracting an adjustment time required for the air conditioning unit AC to adjust the temperature and the humidity from the transfer timing at which the substrate is transferred to the coating processing unit SC. Therefore, at the transport timing, the temperature and humidity of the air in the coating processing unit SC can be surely adjusted to values within the normal range. At the same time, the time during which the adjustment range is set in the power saving range can be made as long as possible, so that it is possible to effectively reduce running costs and save energy.
[0058]
<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. In the coating and developing apparatus 1 of the first embodiment, the adjustment time Ti0 is shorter than the in-apparatus transfer time Ti1, but in the coating and developing apparatus 1 of the present embodiment, the adjustment time Ti0 is set to the in-apparatus transfer time Ti1. It is bigger. As described above, when the adjustment time Ti0 is longer than the in-apparatus transfer time Ti1, there is a switching timing to switch the operation of the air conditioning unit AC before the start of the transfer in the apparatus. Is required to indicate the substrate transfer state at the time. For this reason, the coating and developing apparatus 1 of the present embodiment receives a signal indicating the state of transport of the substrate outside the apparatus.
[0059]
FIG. 6 is a diagram illustrating a schematic configuration of a substrate processing system 100 to which the coating and developing apparatus 1 of the present embodiment is applied. As shown in the figure, the substrate processing system 100 includes a plurality of various substrate processing apparatuses 6 required in a substrate product manufacturing process. The plurality of substrate processing apparatuses 6 include, in addition to the coating and developing apparatus 1 of the present embodiment, a cleaning apparatus 3 for performing a cleaning process on a substrate and an exposure apparatus 2.
[0060]
Further, the substrate processing system 100 includes a transfer device 4 including an AGV (Automatic Guided Vehicle), an RGV (Rail Guided Vehicle), an OHT (Over-head Hoist Transport), and the like. The substrate W to be processed by the substrate processing apparatus 6 is circulated and transported by the transport apparatus 4 between the plurality of substrate processing apparatuses 6 in a predetermined process order while being accommodated in the carrier C. In the process of the present embodiment, it is assumed that the substrate W that has been subjected to the cleaning process by the cleaning device 3 is transferred to the coating and developing device 1 by the transfer device 4.
[0061]
The plurality of substrate processing apparatuses 6 and the transfer apparatuses 4 are connected to a network included in the substrate processing system 100. FIG. 7 is a diagram illustrating a configuration of the substrate processing system 100 including the network 101. As shown in the figure, a plurality of substrate processing apparatuses 6 including a coating and developing apparatus 1, an exposure apparatus 2, and a cleaning apparatus 3 and a transport apparatus 4 are connected to a network 101. Further, a host computer 5 that controls the entire substrate processing system 100 is connected to the network 101. The host computer 5 and each of the substrate processing apparatuses 6 and the transfer apparatus 4 can communicate signals and data between the apparatuses via the network 101. Further, the plurality of substrate processing apparatuses 6 and the transfer apparatuses 4 perform predetermined operations under the control of the host computer 5.
[0062]
FIG. 8 is a timing chart for explaining the operation of the coating and developing apparatus 1 of the present embodiment, and reference numerals T21 to T27 in the figure each indicate a time point. The upper part of FIG. 8 is a diagram showing a state in which one substrate (substrate of interest) to be processed is processed by the cleaning device 3, the transport device 4, and the coating and developing device 1 while being transported between the devices and between the processing units. Is shown in On the other hand, the lower part of FIG. 8 shows the operation of the air conditioning unit AC at the same time as the upper part. At time T21, it is assumed that the target substrate has been subjected to the cleaning process in the cleaning device 3.
[0063]
As shown in the upper part of FIG. 8, when the cleaning process by the cleaning device 3 is completed, the target substrate is stored in the carrier C and delivered to the transport device 4 (time T22). Then, the sheet is transported to the indexer ID of the coating and developing apparatus 1 by the transport device 4 (time T24).
[0064]
The board of interest transported to the indexer ID is taken out of the carrier C to the transfer robot TF of the indexer ID (time T24). Then, similarly to the first embodiment, the transport robot TR transports the wafer to the adhesion strengthening unit AH and the cooling unit CP, and performs a predetermined process. Then, the target substrate is transported to the coating processing unit SC (time T25), and a resist coating process is performed (time T25 to T26). Subsequently, the target board is transferred to the transport robot TR (time T26), and thereafter, is transported to the interface IF while performing predetermined processing as in the first embodiment (time T27). .
[0065]
In FIG. 8, the time T25 to T26 is the coating processing time Tt. In the coating processing time Tt, the temperature and humidity of the air in the coating processing unit SC need to be within the normal range. However, the adjustment time Ti0 of the air conditioning unit AC of the present embodiment is longer than the intra-apparatus transfer time Ti1 (time T24 to T25), and therefore, before the start time T24 of the intra-apparatus transfer time Ti1, the air-conditioning unit AC is adjusted. It is necessary to determine a switching timing at which the operation of the switch should be switched.
[0066]
In order to determine the switching timing, the coating and developing apparatus 1 of the present embodiment completes the cleaning process of the cleaning apparatus 3 which is a step before the step performed by the coating and developing apparatus 1 on the target substrate. When the transfer of the board of interest is started (time T22), a signal indicating that is transmitted from the host computer 5.
[0067]
Specifically, when the cleaning process of the target substrate is completed in the cleaning device 3 and the target substrate is transferred to the transfer device 4, a completion signal is transmitted from the cleaning device 3 to the host computer 5. The host computer 5 that has received the completion signal further transfers the received completion signal to the coating and developing apparatus 1. Then, the transferred completion signal is received by the controller 11 of the coating and developing apparatus 1. Upon receiving the completion signal, the controller 11 of the coating and developing apparatus 1 sets a timing (hereinafter, referred to as “transfer start timing”: time T22) at which the transfer of the target substrate is started from the cleaning device 3 that performs the preceding process. It will be possible to grasp.
[0068]
When the controller 11 grasps the transfer start timing, at the transfer start timing (time T22), the time required for the transfer device 4 to transfer the target substrate from the cleaning device 3 to the coating and developing device 1 (hereinafter, “transport outside the device”) Time).) Ti2 is added, and the timing at which the target board arrives at the indexer ID (hereinafter referred to as “arrival timing”: time point T24) is derived. The external transport time Ti2 is stored in the storage device 12 in advance.
[0069]
Subsequently, the intra-device transport time Ti1 is added to the derived arrival timing T24, and a transport timing (time T25) is obtained. Further, the switching time (time T23) is obtained by subtracting the adjustment time Ti0 from the transport timing.
[0070]
Such calculation for determining the switching timing is performed instantaneously at the same time (time T22) when the completion signal is received from the host computer 5. Then, at the switching timing (time T23), the operation of the air conditioning unit AC is switched from the power saving operation to the normal operation by the controller 11 at that time. Thereby, the temperature and humidity of the air in the coating processing unit SC gradually change, and each of them is surely adjusted to a value within the adjustment range at the transport timing (time T25).
[0071]
When the substrate of interest is taken out of the coating processing unit SC, thereafter, the management of the temperature and humidity of the air in the coating processing unit SC is not necessary. Therefore, similarly to the first embodiment, the timing (at which the substrate of interest is taken out) At time T26), the operation of the air conditioning unit AC is switched from the normal operation to the power saving operation.
[0072]
In this embodiment, the coating and developing apparatus 1 can also process a plurality of substrates continuously in time. When processing a plurality of substrates successively in time in this manner, the switching timing is derived when processing is performed on the first substrate of the plurality of substrates, as in the first embodiment. At the switching timing, the operation of the air conditioning unit AC is switched from the power saving operation to the normal operation. When the resist coating process on the last substrate among the plurality of substrates to be processed continuously is completed, the operation of the air conditioning unit AC is switched from the normal operation to the power saving operation.
[0073]
As described above, the second embodiment has been described. In the coating and developing apparatus 1 according to the present embodiment, a signal indicating the transport state of the substrate outside the coating and developing apparatus 1 is received, and based on this signal, Then, a transfer timing at which the substrate is transferred to the coating processing unit SC is obtained, and a switching timing is obtained from the transfer timing. Therefore, even when the adjustment time is longer than the in-apparatus transfer time, the temperature or humidity of the air in the coating processing unit SC can be reliably adjusted to a value within the normal range at the transfer timing. .
[0074]
<3. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0075]
For example, the air conditioning unit AC of the above embodiment adjusts the temperature and humidity of the air in the coating processing unit SC, but adjusts the temperature and humidity of the air in another processing unit such as the development processing unit SD. May be used.
[0076]
The substrate processing apparatus (coating and developing apparatus 1) described in the above embodiment adjusts both the temperature and humidity of the air inside the processing unit (coating processing unit SC). Only one of these may be adjusted.
[0077]
In the second embodiment, the signal transmitted from the host computer 5 is based on the timing (transfer start) at which the transfer of the substrate to be processed is started in the substrate processing apparatus (cleaning apparatus 3) responsible for the preceding process. (Timing), but may indicate the timing (arrival timing) at which the substrate to be processed arrives at the substrate processing apparatus (coating and developing apparatus 1) according to the present invention. In this case, for example, the arrival timing may be derived in the host computer 5.
[0078]
In the above description, the coating and developing apparatus 1 has been described. However, the present invention is not limited to this, and processing for processing a substrate such as a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and a substrate for an optical disk. A substrate processing apparatus having an air adjusting means for adjusting the temperature or humidity of the air in the processing section, the technology according to the present invention can be applied to any substrate processing apparatus. is there.
[0079]
【The invention's effect】
As described above, according to the first to fifth aspects of the present invention, the adjusting operation of the air adjusting means is controlled in accordance with the state of transport of the substrate to the processing unit, so that it is not necessary to adjust the temperature or humidity. Sometimes, the air adjusting means does not operate at the maximum capacity, so that the running cost can be reduced and the energy can be saved.
[0080]
In particular, according to the second aspect of the present invention, since the adjustment operation time of the air adjustment means is reduced by increasing the adjustment range, it is possible to reduce running costs and save energy.
[0081]
In particular, according to the third aspect of the present invention, the control means can be controlled based on an adjustment time required for the air adjustment means to adjust the temperature or humidity and the first timing at which the substrate is transferred to the processing section. A second timing at which the adjustment range should be changed is determined. Therefore, at the first timing, the temperature or the humidity of the air in the processing unit can be surely adjusted to a value within the first range. At the same time, the time during which the adjustment range is set to the second range can be made as long as possible, thereby reducing running costs and saving energy.
[0082]
In particular, according to the invention of claim 4, the adjustment necessary for the air adjusting means to adjust the temperature or humidity of the air inside the processing unit from a value in the second range to a value in the first range. Time can be reduced. As a result, the time during which the adjustment range is set to the second range can be made longer, and the running cost can be reduced and energy can be saved.
[0083]
In particular, according to the fifth aspect of the present invention, a signal indicating a substrate transfer state outside the substrate processing apparatus is received, and the first timing at which the substrate is transferred to the processing unit based on the signal is acquired. The second timing can be obtained even when the substrate is transported from outside the substrate processing apparatus. Therefore, at the first timing, the temperature or the humidity of the air in the processing unit can be surely adjusted to a value within the first range.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a coating and developing apparatus which is a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a cross section of a unit arrangement portion of the coating and developing apparatus.
FIG. 3 is a diagram illustrating a functional configuration of a coating and developing apparatus using functional blocks.
FIG. 4 is a diagram for explaining the operation of the coating and developing apparatus according to the first embodiment.
FIG. 5 is a diagram showing a change in temperature of air in a coating processing unit.
FIG. 6 is a diagram illustrating a schematic configuration of a substrate processing system.
FIG. 7 is a diagram showing a configuration including a network of the substrate processing system.
FIG. 8 is a diagram for explaining the operation of the coating and developing apparatus according to the second embodiment.
[Explanation of symbols]
1 Coating and developing equipment
4 Transport device
14 Substrate transport section
13 Heat treatment unit group
29 Temperature and humidity sensor
AC air conditioning unit
ID indexer
IF interface
SC coating unit
SD processing unit

Claims (5)

A substrate processing apparatus including a processing unit that receives the transported substrate and performs processing on the substrate,
Air adjusting means for adjusting the temperature or humidity of the air in the processing unit,
A control unit that controls an adjustment operation regarding an output of the air adjustment unit between a plurality of operation states having different power consumptions, according to a transfer state of the substrate to the processing unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The air adjustment means is for adjusting the temperature or humidity of the air in the processing unit to a value within a specific adjustment range,
The substrate processing apparatus, wherein the control unit changes the adjustment range. The substrate processing apparatus according to claim 2,
The control means changes the adjustment range between a first range and a second range larger than the first range,
First timing acquisition means for acquiring a first timing at which the substrate is transported to the processing unit;
The first timing and an adjustment time required for the air adjustment unit to adjust the temperature or humidity of the air inside the processing unit from a value in the second range to a value in the first range. A second timing obtaining unit configured to obtain a second timing at which the control unit changes the adjustment range from the second range to the first range based on
A substrate processing apparatus, further comprising: The substrate processing apparatus according to claim 3,
The substrate processing apparatus according to claim 2, wherein the second range includes the first range. The substrate processing apparatus according to claim 3, wherein
The substrate is transported from outside the substrate processing apparatus,
Receiving means for receiving a signal indicating the transfer state of the substrate outside the substrate processing apparatus from a predetermined external device,
Further comprising
The substrate processing apparatus according to claim 1, wherein the first timing obtaining unit obtains the first timing based on the signal.

Images