JP2004193238A5 - - Google Patents

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Publication number
JP2004193238A5
JP2004193238A5 JP2002357620A JP2002357620A JP2004193238A5 JP 2004193238 A5 JP2004193238 A5 JP 2004193238A5 JP 2002357620 A JP2002357620 A JP 2002357620A JP 2002357620 A JP2002357620 A JP 2002357620A JP 2004193238 A5 JP2004193238 A5 JP 2004193238A5
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JP
Japan
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
heat
exhaust damper
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002357620A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004193238A (ja
JP4218825B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002357620A priority Critical patent/JP4218825B2/ja
Priority claimed from JP2002357620A external-priority patent/JP4218825B2/ja
Publication of JP2004193238A publication Critical patent/JP2004193238A/ja
Publication of JP2004193238A5 publication Critical patent/JP2004193238A5/ja
Application granted granted Critical
Publication of JP4218825B2 publication Critical patent/JP4218825B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002357620A 2002-12-10 2002-12-10 半導体製造装置 Expired - Lifetime JP4218825B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002357620A JP4218825B2 (ja) 2002-12-10 2002-12-10 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002357620A JP4218825B2 (ja) 2002-12-10 2002-12-10 半導体製造装置

Publications (3)

Publication Number Publication Date
JP2004193238A JP2004193238A (ja) 2004-07-08
JP2004193238A5 true JP2004193238A5 (enExample) 2005-10-13
JP4218825B2 JP4218825B2 (ja) 2009-02-04

Family

ID=32757570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002357620A Expired - Lifetime JP4218825B2 (ja) 2002-12-10 2002-12-10 半導体製造装置

Country Status (1)

Country Link
JP (1) JP4218825B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142747A1 (ja) * 2007-05-16 2008-11-27 Canon Anelva Corporation 加熱処理装置
JP6900412B2 (ja) 2019-03-20 2021-07-07 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置及び半導体装置の製造方法及びプログラム

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