JP2004193191A - Apparatus and method of mounting electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method of mounting electronic parts wherein the influence of a foreign matter in a vacuum suction system is reduced to the utmost, and stable mounting operation can be kept unchanged. <P>SOLUTION: In electronic part mounting for mounting electronic parts on a substrate with an suction nozzle 10 by picking up the electronic parts by vacuum attraction, a flow rate of air passing through the inside of a vacuum suction circuit is measured at a predetermined interval by a flow rate sensor 12, and the actuation timing of a changeover valve 13 is updated each time by a valve actuation timing control unit 18 based upon the result of measurement of the flow rate. Consequently, valve action timing is set in response to a change in the response characteristic of vacuum suction owing to the adhesion of the foreign matter in the vacuum suction circuit. Accordingly, the influence of the foreign matter in a vacuum suction system is reduced to the utmost to keep stable mounting operation. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate by sucking and holding the electronic component by a suction nozzle.
[0002]
[Prior art]
As a method for holding an electronic component in an electronic component mounting apparatus that mounts the electronic component on a substrate, a method using vacuum suction is used. In this method, an electronic component is held by utilizing a negative pressure generated by vacuum suction from the suction hole while a suction nozzle having a suction hole provided at a lower end portion is in contact with the upper surface of the electronic component. There is an advantage that the holding state can be controlled only by turning on / off the vacuum suction.
[0003]
On the other hand, there is a drawback that the suction operation tends to be unstable depending on the state of the components constituting the vacuum suction system, such as the suction holes of the suction nozzle and the filter for removing foreign substances incorporated therein. That is, the vacuum pressure of the suction nozzle needs to reach a predetermined pressure in order to reliably hold the electronic component by the suction nozzle, and the vacuum of the suction nozzle is broken to release the suction of the electronic component. It is necessary to return the pressure to atmospheric pressure by applying pressure.However, as described above, if foreign matter is adhered or clogged in the vacuum suction system, these effects may cause an increase in vacuum pressure or vacuum destruction. The required response time is delayed, and the desired operation tact time cannot be maintained. For this reason, an electronic component mounting apparatus using a suction nozzle is conventionally known which includes a mechanism such as an air blow for removing such foreign matter (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-61-252643
[0005]
[Problems to be solved by the invention]
However, in the above-mentioned conventional example, only the foreign matter adhering to the end of the suction nozzle can be removed, but it is not effective for foreign matter existing inside the vacuum suction circuit due to clogging of the filter or the like. In addition, since air is blown against the suction nozzle, scattering of foreign matter is inevitable at the same time as foreign matter is removed, which may cause a new problem due to the scattering of foreign matter adhering to the mounting surface of the substrate. As described above, in the conventional electronic component mounting apparatus, there are cases where it is difficult to perform a stable mounting operation due to the influence of the foreign matter in the vacuum suction system that suctions the vacuum from the suction nozzle.
[0006]
Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of minimizing the influence of foreign matter in a vacuum suction system and maintaining a stable mounting operation.
[0007]
[Means for Solving the Problems]
2. The electronic component mounting apparatus according to claim 1, wherein the electronic component is picked up from a component supply unit by a suction nozzle of a transfer head by vacuum suction and mounted on a substrate, and vacuum suction is performed from the suction nozzle. Vacuum suction means, vacuum connection / disconnection means for connecting / disconnecting a vacuum suction circuit from the vacuum suction means to the suction nozzle, and a flow sensor interposed in the vacuum suction circuit and measuring a flow rate of air passing through the vacuum suction circuit, And timing control means for controlling connection / disconnection timing of the vacuum connection / disconnection means based on the flow rate measurement result of the flow rate sensor.
[0008]
According to a second aspect of the present invention, there is provided an electronic component mounting method in which an electronic component in a component supply unit is sucked and held by vacuum suction from a suction nozzle of a transfer head via a vacuum suction circuit and mounted on a substrate. A flow rate measuring step of measuring a flow rate of air passing through the vacuum suction circuit by a flow rate sensor provided in the vacuum suction circuit in a specific state of the suction nozzle, and a vacuum connection / disconnection means for connecting / disconnecting the vacuum suction circuit A pickup step of sucking and holding and taking out the electronic component by the suction nozzle by bringing the suction nozzle into contact state, and moving the suction nozzle holding the electronic component by suction up and down with respect to the substrate, and disconnecting the vacuum connection / disconnection means. The electronic component is detached from the suction nozzle to be mounted on the substrate by releasing the suction holding. In Bimatawa mounting process, to control the disengagement timing of the vacuum disengaging means based on the flow rate measurement result.
[0009]
According to the present invention, in a specific state of the suction nozzle, the flow rate sensor measures the flow rate of the air passing through the vacuum suction circuit, and based on the flow rate measurement result, controls the connection / disconnection timing of the vacuum suction circuit to achieve suction. The effect of foreign matter in a vacuum suction system for vacuum suction from the nozzle is minimized, and a stable mounting operation can be maintained.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a diagram showing a configuration of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing a configuration of a vacuum suction / air blow system of the electronic component mounting apparatus according to one embodiment. FIG. 4 is a diagram showing a time of a degree of vacuum inside a vacuum suction circuit in a pickup operation by the electronic component mounting apparatus according to one embodiment of the present invention. FIG. 5 is a graph showing a temporal change in the degree of vacuum inside the vacuum suction circuit in a component mounting operation by the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 6B is a graph showing the relationship between the degree of vacuum inside the vacuum suction circuit and the flow rate of air in the electronic component mounting apparatus according to one embodiment, and FIG. 6B is a vacuum suction circuit in the electronic component mounting apparatus according to one embodiment of the present invention. Internal flow deviation and disconnection Graph showing the relationship between the timing correction value of the valve, Fig 7 is a flow diagram of a valve actuation timing setting process in the electronic component mounting method of an embodiment of the present invention.
[0011]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports the substrate 3 and positions the electronic component at a mounting position. Component supply units 4 are arranged on both sides of the transport path 2, and a large number of tape feeders 5 are arranged in each component supply unit 4. The tape feeder 5 stores the electronic components held on the tape, and supplies the electronic components by feeding the tape at a pitch.
[0012]
Y-axis tables 6A and 6B are provided on both ends of the upper surface of the base 1, and two X-axis tables 7A and 7B are provided on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. A transfer head 8 and a camera 9 that moves integrally with the transfer head 8 are mounted on the X-axis tables 7A and 7B, respectively.
[0013]
By driving the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B in combination, the transfer head 8 moves horizontally, and picks up an electronic component from each component supply unit 4 by the suction nozzle 10 ( 2), and mounted on the substrate 3 positioned on the transport path 2. The camera 9 that has moved onto the substrate 3 captures an image of the substrate 3 and recognizes it. A line camera 11 is provided on a path from the component supply unit 4 to the transport path 2. The line camera 11 captures an image of the electronic component held by each transfer head 8 from below.
[0014]
Next, the transfer head 8 will be described with reference to FIG. As shown in FIG. 2, the transfer head is a multi-type, and has a configuration including eight unit transfer heads 8a as component holding means. Each of these unit transfer heads 8a is provided with a suction nozzle 10 at its lower end for sucking and holding an electronic component, and can individually move up and down. Here, the suction nozzle 10 is detachably mounted on a mounting portion 8b (see FIG. 3) provided below the unit transfer head 8a, and is replaced according to the type of electronic component.
[0015]
Here, a configuration of a vacuum suction / air blow system that suctions vacuum from the suction nozzle 10 will be described with reference to FIG. As shown in FIG. 3, a switching valve 13 is connected via a flow rate sensor 12 to a mounting portion 8b of the unit transfer head 8a where the suction nozzle 10 is mounted. The switching port a on one side of the switching valve 13 is connected to a vacuum pump 14, and the switching port b on the other side is connected to an air supply source 17 via a blow valve 16. By controlling the switching valve 13 by the control unit 20, the suction nozzle 10 can be selectively connected to one of the switching ports a and b.
[0016]
The suction nozzle 10 is mounted on the mounting portion 8b, and the switching valve 13 is switched to the switching port a side in a state where the vacuum pump 14 is driven, so that the suction hole 10a provided on the suction surface at the lower end of the suction nozzle 10 is vacuumed. Suction. A filter 15 is incorporated in the mounting portion 8b, and foreign matter sucked together with air from the suction nozzle 10 during vacuum suction is collected by the filter 15.
[0017]
In the above configuration, the circuit from the suction nozzle 10 to the vacuum pump 14 is a vacuum suction circuit through which air passes during vacuum suction, and the vacuum pump 14 is vacuum suction means for vacuum suction from the suction nozzle 10. The switching valve 13 serves as a vacuum connecting / disconnecting means for connecting / disconnecting the vacuum suction circuit. That is, by switching to the switching port a side, the vacuum suction circuit is brought into contact with the suction nozzle 10 to suction the vacuum, and by switching to the switching port b side, the vacuum suction circuit is turned off and the suction nozzle 10 Vacuum suction stops.
[0018]
By opening the blow valve 16 with the switching valve 13 switched to the switching port b side, positive pressure air is discharged from the suction hole 10 a provided in the suction surface at the lower end of the suction nozzle 10. . The circuit from the suction nozzle 10 to the air supply source 17 is an air blow circuit, and the air supply source 17 is an air blow means for discharging positive pressure air from the suction nozzle 10.
[0019]
The flow rate of the vacuum suction circuit at the time of vacuum suction and the flow rate of the air blow circuit at the time of air blowing are measured by the flow rate sensor 12. The flow rate sensor 12 measures the amount of air passing through the vacuum suction / air blow circuit per unit time by vacuum suction / air blow by detecting the temperature difference of the fluid flowing inside. This flow rate measurement can measure both the flow rate of air in the direction of vacuum suction from the suction nozzle 10 and the flow rate of air in the direction of discharging air from the suction nozzle 10. The flow measurement result is sent to the valve operation timing setting unit 18.
[0020]
The valve operation timing setting unit 18 uses the valve operation timing correction data stored in the storage unit 19 based on the flow measurement result of the flow sensor 12 to operate the switching valve 13, that is, disconnect / connect the vacuum connection / disconnection unit. Set the timing. The setting result of the operation timing is sent to the control unit 20, and the control unit 20 controls the switching valve 13 based on the setting result. Therefore, the valve operation timing setting unit 18 and the control unit 20 serve as timing control means for controlling the connection / disconnection timing of the vacuum connection / disconnection unit based on the flow measurement result of the flow sensor 12.
[0021]
Here, the valve operation timing and the valve operation timing setting data will be described with reference to FIG. 4, FIG. 5, and FIG. FIGS. 4A and 4B show a state in which the vacuum pump 14 is driven and the switching valve 13 is moved from the switching port b side (vacuum suction OFF) to the switching port a side in a pick-up operation of picking up the electronic component by the suction nozzle 10. 5 shows a temporal change of the vacuum pressure P in the suction nozzle 10 when the mode is switched to (vacuum suction ON).
[0022]
5 (a) and 5 (b) show that in a mounting operation for mounting the electronic component held by the suction nozzle 10 on the substrate 3, the switching valve 13 is switched to the switching port a side (vacuum suction) while the vacuum pump 14 is driven. 5 shows a temporal change of the vacuum pressure P in the suction nozzle 10 when switching from the ON state to the switching port b side (vacuum suction OFF). In any case, the vacuum pressure P indicates a differential pressure from the atmospheric pressure, and the direction in which the absolute pressure decreases and the differential pressure increases is defined as the positive direction of the vacuum pressure P.
[0023]
First, the valve operation timing in the pickup operation will be described. In the electronic component mounting operation, when picking up the electronic component by the transfer head 8, the switching valve 13 is switched to the switching port a side (vacuum suction ON) as described above, and the suction nozzle 10 suctions the vacuum. In this component suction operation, in order to reliably hold the electronic component by the suction nozzle 10, the vacuum pressure inside the suction nozzle 10 is set to a predetermined pressure sufficient to hold the electronic component by a pressure difference from the atmospheric pressure. It is required to reach.
[0024]
At this time, there is a time lag from when the switching valve 13 is switched to the vacuum suction side to when the vacuum pressure in the suction nozzle 10 reaches a predetermined pressure. That is, as shown in FIG. 4A, at a timing tb delayed by a time lag t1 from the timing ta when the switching valve 13 is switched to the vacuum suction ON, the vacuum pressure P in the suction nozzle 10 is increased to a predetermined pressure (for electronic components). The pressure reaches the reference vacuum pressure Ps1 for holding by suction (see a pressure curve p1 indicated by a solid line). After confirming that the reference vacuum pressure Ps1 has been reached, the suction nozzle 10 is raised and the electronic component is picked up.
[0025]
However, in the process of repeatedly performing vacuum suction from the suction nozzle 10, if clogging of the filter 15 or adhesion of foreign matter inside the suction nozzle 10 progresses, the response state of the vacuum suction system deteriorates and reaches the reference vacuum pressure Ps 1. The timing tends to be delayed (see a pressure curve p2 indicated by a broken line), and at a timing tb at which pickup should be performed, the vacuum pressure state is lower than the reference vacuum pressure Ps1 by a difference ΔP1.
[0026]
In this case, an additional time lag Δt1 is required before the arrival of the reference vacuum pressure Ps1 is confirmed, and the electronic component is picked up by the suction nozzle 10 at a timing after the lapse of the time lag Δt1 from the timing tb. . That is, the deterioration of the response state of the vacuum suction system causes a delay in the pickup operation by the time lag Δt1 described above. Here, within the condition range actually used, the difference ΔP1 and the time lag Δt1 are in a substantially proportional relationship.
[0027]
In order to prevent such a delay in the pickup operation, in the electronic component mounting method of the present embodiment, the setting of the valve operation timing of the switching valve 13 is changed by using the valve operation timing correction data described below. An increase in tact time due to a delay in the pickup operation is prevented.
[0028]
FIG. 6A shows the relationship between the flow rate Q of air in the vacuum suction circuit (horizontal axis) and the vacuum pressure P in the suction nozzle 10 (vertical axis). As shown in FIG. 6A, the flow rate Q of air in a state where the vacuum suction is performed from the suction nozzle 10 has a substantially linear correspondence with the vacuum pressure P within a condition range used for actual vacuum suction. That is, when the flow rate Q decreases by the flow rate deviation ΔQ1 from the reference flow rate value Q1 indicating the flow rate in the normal vacuum suction state, the vacuum pressure P decreases by the difference ΔP1 proportional to the flow rate deviation ΔQ1.
[0029]
In other words, when it is desired to detect the state of the change in the vacuum pressure P in the suction nozzle 10, the change in the flow rate Q may be measured. In the valve operation timing correction data shown in the present embodiment, a flow deviation ΔQ1 with respect to the reference flow value Q1 of the flow Q is obtained from the measurement result of the flow Q by utilizing this relationship, and then the suction nozzle corresponding to the flow deviation ΔQ1 A difference ΔP1 between the vacuum pressures P within 10 is obtained, and a time lag Δt1 corresponding to the difference ΔP1 (ie, a timing correction value Δt1 corresponding to the flow rate deviation ΔQ1) is obtained.
[0030]
In the graph of FIG. 6B, in the relationship between the flow rate deviation ΔQ, the difference ΔP of the vacuum pressure P and the timing correction value Δt1, the proportional relation between the flow rate deviation ΔQ and the timing correction value Δt1 is omitted from the vacuum pressure P. It is shown. By preparing such valve operation timing correction data, the flow rate Q in the vacuum suction circuit is measured by the flow rate sensor 12 at an appropriate interval during the operation of the electronic component mounting apparatus, and the difference from the reference flow rate value Q1 is calculated. Thus, a flow rate deviation ΔQ1 is obtained, and a timing correction value Δt1 corresponding to the flow rate deviation ΔQ1 is obtained.
[0031]
Then, the operation timing of the switching valve 13 is advanced by the calculated timing correction value Δt1. Accordingly, as shown in FIG. 4B, the pressure curve p2 moves to the left by Δt1, and the vacuum pressure P reaches the reference vacuum pressure Ps1 at the original pickup timing tb. Therefore, even when the response state of the vacuum suction circuit changes due to factors such as clogging of the filter 15, electronic components can be picked up without causing a time delay. In FIG. 6B, the relationship for associating the timing correction value with the flow rate deviation is shown by a linear correlation line, but other than this, a correlation line suitable for practical use, such as a step-like correlation line. May be selected and used.
[0032]
The above-described valve operation timing correction is similarly applied to the component mounting operation. That is, as shown in FIG. 5, in this component mounting operation, the switching valve 13 is switched to the switching port b side (vacuum suction OFF) as described above, and the suction state of the suction nozzle 10 is released. In this component mounting operation, in order to reliably detach the electronic component from the suction nozzle 10, the vacuum inside the suction nozzle 10 is broken to a reference vacuum pressure value Ps2 (set to a pressure substantially equal to the atmospheric pressure). Is needed.
[0033]
At this time, there is a time lag between the timing when the switching valve 13 is switched to the switching port b side (vacuum suction OFF) and the time when the vacuum pressure in the suction nozzle 10 returns to the atmospheric pressure as in the case of vacuum suction. That is, as shown in FIG. 5A, the vacuum pressure P in the suction nozzle 10 at the timing td which is delayed by the time lag t2 from the timing tc when the switching valve 13 is switched to the switching port a (vacuum suction ON) is equal to the reference pressure. The pressure reaches the vacuum pressure value Ps2 (see the pressure curve p3 indicated by the solid line). After confirming that the reference vacuum pressure Ps2 has been reached, the suction nozzle 10 from which the electronic component has been detached rises and the component mounting operation is completed.
[0034]
However, in the process of repeatedly performing vacuum suction from the suction nozzle 10, if clogging of the filter 15 or adhesion of foreign matter inside the suction nozzle 10 progresses, the response state of the vacuum suction system deteriorates and reaches the reference vacuum pressure Ps2. The timing tends to be delayed (see the pressure curve p4 indicated by the broken line), and at the timing td at which the parts should be separated, the vacuum pressure state exceeds the reference vacuum pressure Ps2 by the difference ΔP2.
[0035]
In this case, an additional time lag Δt2 is required until the arrival of the reference vacuum pressure Ps2 is confirmed, and the suction nozzle 10 from which the electronic component has been detached is raised at the timing when the time lag Δt2 has elapsed from the timing td. Is performed. That is, the deterioration of the response state of the vacuum suction system causes a delay in the component mounting operation by the time lag Δt2, almost similarly to the time of the pickup operation. Here, within the condition range actually used, the difference ΔP2 and the time lag Δt2 are substantially proportional to each other, as in the case of the pickup operation.
[0036]
In order to prevent such a delay in the component mounting operation, in the electronic component mounting method of the present embodiment, the valve operation timing correction data similar to the valve operation timing correction data in the pickup operation is used to perform the component mounting operation. By changing the setting of the valve operation timing of the switching valve 13, an increase in the tact time due to a delay in the component mounting operation is prevented.
[0037]
That is, as shown in FIG. 6B, valve operation timing correction data indicating the relationship between the flow deviation ΔQ2 and the timing correction value Δt2 is prepared. Then, at an appropriate interval during the operation of the electronic component mounting apparatus, the flow rate in the vacuum suction circuit is measured by the flow rate sensor 12 and the difference from the reference flow rate value Q2 is calculated to obtain a flow rate deviation ΔQ2, which corresponds to the flow rate deviation ΔQ2. The timing correction value Δt2 is obtained.
[0038]
Then, the operation timing of the switching valve 13 is advanced by the calculated timing correction value Δt2. Thus, as shown in FIG. 5B, the pressure curve p4 moves to the left by Δt2, and the vacuum pressure P reaches the reference vacuum pressure Ps2 at the original electronic component detachment timing td. Therefore, even when the response state of the vacuum suction circuit changes due to factors such as clogging of the filter 15, electronic components can be mounted without a time delay.
[0039]
Next, the above-described valve operation timing setting processing will be described with reference to FIG. In this electronic component mounting method, the electronic component of the component supply unit 4 is suction-held and mounted on the substrate 3 by vacuum-suctioning the electronic component from the suction nozzle 10 of the transfer head 8 via a vacuum suction circuit. The process is executed by the valve operation timing setting unit 18 (for example, every time the substrate is replaced).
[0040]
First, the valve operation timing correction data is read from the storage unit 19 (ST1). Here, the valve operation timing in the reference state, that is, the timing corresponding to the timings ta and tc shown in FIGS. 4 and 5 and the reference flow rate values Q1 and Q2 shown in FIG. Read the appropriate data. Here, the timings ta and tc are given from the mounting sequence. The reference flow value Q1 is a flow value when the switching valve 13 is switched from vacuum suction OFF to vacuum suction ON in a normal reference state in which the filter 15 is not clogged or the suction nozzle 10 is not closed. Q2 is a flow value when the switching valve 13 is switched from vacuum suction ON to vacuum suction OFF. These data are measured in advance and stored in the storage unit 19.
[0041]
Next, the flow rate of the vacuum suction circuit is measured by the flow rate sensor 12 (ST2) (flow rate measurement step). In this flow rate measurement, in a state where the electronic component is not held by the suction nozzle 10 (specific state for flow rate measurement), first, a flow rate when the switching valve 13 is switched from vacuum suction OFF to vacuum suction ON is measured. Next, the flow rate when the switching valve 13 is switched from vacuum suction ON to vacuum suction OFF is measured.
[0042]
From these flow rate measurement results, flow rate deviations ΔQ1 and ΔQ2 indicating the differences between the flow rate measurement values and the reference flow rate values Q1 and Q2, respectively, are obtained (ST3). Next, the timing correction values Δt1 and Δt2 corresponding to the flow deviations ΔQ1 and ΔQ2 are obtained from the valve operation timing correction data (see FIG. 6B) (ST4). Then, the valve operation timing considering the timing correction values Δt1 and Δt2 is set as a new valve operation timing (ST5), and the setting result is output to the control unit 20.
[0043]
When the new valve operation timing is set in this way, the mounting operation is started. That is, the switching valve 13 is switched to the switching port a side, and the electronic component is sucked, held, and taken out by the suction nozzle 10 (pickup process). The valve operation timing at this time is a timing in which the timing ta is moved forward by Δt1, as shown in FIG. Thereafter, the transfer head 8 holding the electronic component moves above the line camera 11 to perform recognition here, and then moves onto the substrate 3.
[0044]
Then, the suction nozzle 10 holding the electronic component by suction is moved up and down with respect to the substrate 3, and the switching valve 13 is switched to the switching port b to release the suction and holding of the electronic component by the suction nozzle 10. The electronic component is detached from the suction nozzle 10 and mounted on the substrate 3 (mounting step). The valve operation timing at this time is a timing in which the timing tc is advanced by Δt2 as shown in FIG. 5B.
[0045]
That is, in the pick-up step and the mounting step of the electronic component mounting method described above, the timing correction values Δt1 and Δt2 are added to the initial timings ta and tc, respectively, based on the flow rate measurement results in the flow rate measurement step of the valve operation timing setting processing. The control unit 20 controls the operation timing of the switching valve 13 using the obtained valve operation timing.
[0046]
As described above, in the electronic component mounting apparatus shown in the present embodiment, as a countermeasure against the tact time delay and the instability of the mounting operation due to the influence of the foreign matter of the vacuum suction system, the foreign matter removal by the air blow which has been conventionally used is used. Not. Thereby, the disadvantage in the conventional method, that is, the foreign matter adhering to the end of the suction nozzle can only be removed, but the foreign matter existing inside the vacuum suction system due to clogging of the filter or the like is not effective. Has a configuration in which air is blown against the suction nozzle, so that the foreign matter is inevitably scattered at the same time as the foreign matter is removed, and there is no problem that the scattered foreign matter adheres to the mounting surface of the substrate to cause a new problem.
[0047]
Therefore, the influence of the foreign matter of the vacuum suction system which is inevitably generated with the elapse of the operation time can be minimized, the maintenance work interval can be extended, and the work load can be reduced. Since the valve operation timing is updated according to the attached state, a stable mounting operation can be always maintained.
[0048]
In the above-described embodiment, only the operation timing of the switching valve 13 is targeted for the timing correction. However, the operation timing of the air blow valve 16 for applying a positive pressure to the inside of the suction nozzle 10 at the time of component detachment in the mounting process is set. At the same time, the timing may be corrected. In this case, the measurement of the reference flow rate value Q2 and the flow rate measurement at the time of timing correction are performed in a state where the positive pressure is applied.
[0049]
【The invention's effect】
According to the present invention, in a specific state of the suction nozzle, the flow rate sensor measures the flow rate of the air passing through the vacuum suction circuit, and based on the flow rate measurement result, controls the connection / disconnection timing of the vacuum suction circuit to achieve suction. The effect of foreign matter in a vacuum suction system for vacuum suction from the nozzle is minimized, and a stable mounting operation can be maintained.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;
FIG. 3 is a block diagram showing a configuration of a vacuum suction / air blow system of the electronic component mounting apparatus according to one embodiment of the present invention;
FIG. 4 is a graph showing a temporal change in the degree of vacuum inside a vacuum suction circuit in a pickup operation performed by the electronic component mounting apparatus according to one embodiment of the present invention;
FIG. 5 is a graph showing a temporal change in the degree of vacuum inside a vacuum suction circuit in a component mounting operation by the electronic component mounting apparatus according to one embodiment of the present invention;
FIG. 6A is a graph showing the relationship between the degree of vacuum inside a vacuum suction circuit and the flow rate of air in the electronic component mounting apparatus according to one embodiment of the present invention;
(B) A graph showing the relationship between the flow rate deviation inside the vacuum suction circuit and the timing correction value of the switching valve in the electronic component mounting apparatus according to one embodiment of the present invention.
FIG. 7 is a flowchart of a valve operation timing setting process in the electronic component mounting method according to one embodiment of the present invention;
[Explanation of symbols]
1 base
3 substrate
4 Parts supply unit
8 Transfer head
8a Unit transfer head
8b Mounting part
10 Suction nozzle
12 Flow sensor
13 Switching valve
14 Vacuum pump
15 Filter
16 Blow valve
18 Valve operation timing setting section
19 Memory
20 control unit

Claims (2)

An electronic component mounting apparatus for picking up an electronic component by vacuum suction from a component supply unit by a suction nozzle of a transfer head and mounting the electronic component on a substrate, wherein a vacuum suction unit for vacuum suction from the suction nozzle and a suction from the vacuum suction unit Vacuum connection / disconnection means for connecting / disconnecting a vacuum suction circuit to a nozzle, a flow sensor interposed in the vacuum suction circuit for measuring a flow rate of air passing through the vacuum suction circuit, and a flow sensor based on a flow measurement result of the flow sensor. An electronic component mounting apparatus, comprising: timing control means for controlling connection / disconnection timing of vacuum connection / disconnection means. An electronic component mounting method in which an electronic component of a component supply unit is suction-held by vacuum suction from a suction nozzle of a transfer head via a vacuum suction circuit and mounted on a substrate, wherein the vacuum is held in a specific state of the suction nozzle. A flow rate measuring step of measuring the flow rate of air passing through the vacuum suction circuit by a flow rate sensor interposed in the suction circuit, and a vacuum connection / disconnection means for connecting / disconnecting the vacuum suction circuit to bring the electronic device into contact with the suction nozzle. A pick-up step of sucking and holding the component and taking out the electronic component by moving the suction nozzle holding the electronic component up and down with respect to the substrate and releasing the suction holding by disconnecting the vacuum connection / disconnection means; A mounting step of detaching the substrate from the suction nozzle and mounting the substrate on the substrate. Electronic component mounting method and controlling the disengagement timing of the vacuum disengaging means based on the measurement results.

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