JP2004191389A - Optical communication equipment, flat panel display and electronic appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide optical communication equipment, a flat panel display and an electronic appliance which permit the speed-up of signal transmission speed, make a device fine and compact easily and are simply manufactured. <P>SOLUTION: The optical communication equipment is provided with a microscopic tile-shaped element 20 having an optical element on the end surface of an optical fiber 10. The optical element such as a light emitting element or a light receiving element is directly attached to the optical fiber terminal, thereby, the optical loss is made small and the coupling efficiency is made high. Therefore, the error of data communication is reduced and the effective transmission speed can be enhanced. Therein, the connection between the optical fiber and the equipment is performed by allowing an electrode of the light emitting element or the light receiving element which is attached to the optical fiber terminal to electrically contact with an electrode of the equipment side. The optical fiber is thus integrated with the optical element such as the light emitting element or the light receiving element. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical communication device, a flat panel display, and an electronic device.
[0002]
[Prior art]
With an increase in data transmission between electronic devices such as computers and between electronic boards, a signal transmission technique using an optical fiber is being studied (for example, see Non-Patent Document 1).
[0003]
[Non-patent document 1]
SPECTRUM August 2002, Issued by IEEE, P32-36
[0004]
In addition, IEEE is the Institute of Electrical and Electronics Engineers organizations (URL; http://www.ieee.org/portal/index.jsp).
Data transmission using an optical fiber between and within electronic devices has excellent advantages different from conventional electric data transmission, such as high speed and no occurrence of electromagnetic interference (EIM).
[0005]
[Problems to be solved by the invention]
However, the connection of the optical fiber requires extremely high positioning accuracy because the optical axis shift directly leads to the deterioration of the light coupling efficiency. Therefore, conventionally, an expensive connector is required. In addition, in the conventional optical fiber connection technology, since the light emitting element or the light receiving element and the connector must be accurately aligned and assembled, there is a limit to miniaturization of a connection device called an optical module.
[0006]
For example, it is not possible to connect minute semiconductor chips using conventional optical fibers and optical components. In addition, it is difficult to connect the substrates including the integrated circuits, the resistors, the transistors, the capacitors, and the like using conventional optical fibers and optical components. Cost is required. Further, it is not easy to connect a device equipped with various devices such as a plurality of substrates using a conventional optical fiber and an optical component, which requires a large production cost.
[0007]
The present invention has been made in view of the above circumstances, and it is possible to increase the signal transmission speed and easily miniaturize and compact the device, and to easily manufacture an optical communication device, The purpose is to provide flat panel displays and electronic devices.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, an optical communication device according to the present invention is characterized in that an optical element is provided on an end face of an optical fiber.
According to the present invention, since an optical element such as a light emitting element or a light receiving element is directly attached to an end of an optical fiber, the optical loss is small and the coupling efficiency is high. Therefore, errors in data communication are small, and the effective transmission speed can be increased.
Here, the connection between the optical fiber and the device can be performed by making electrical contact between the electrode of the light emitting element or the light receiving element attached to the end of the optical fiber and the electrode on the device side. Therefore, according to the present invention, the allowable positional accuracy can be increased as compared with the conventional optical connection method, and the optical fiber can be easily connected to the device.
Further, according to the present invention, since the optical fiber and the optical element such as the light-emitting element or the light-receiving element are integrated, the connection device corresponding to the conventional optical module can be made extremely small.
Therefore, according to the present invention, it is possible to provide an optical communication device that can increase the signal transmission speed, can easily miniaturize the device, and can easily manufacture the device. Can be.
Further, according to the present invention, when the optical element provided on the end face of the optical fiber breaks down, it can be easily repaired by replacing the optical fiber.
[0009]
Further, in the optical communication device of the present invention, the optical element is constituted by a minute tile-shaped element made of a minute tile-shaped semiconductor element, and the minute tile-shaped element is directly attached to an end face of the optical fiber. Is preferred.
According to the present invention, an optical signal transmission unit using an extremely compact optical fiber can be easily configured by directly attaching a light emitting element or a light receiving element composed of a minute tile element to an end face of an optical fiber. it can.
For example, by configuring a micro-tile-shaped element that forms a light emitting element or a light receiving element with an area of several hundred μm square or less and a thickness of several tens μm or less, an optical element smaller than the area of the end face of the optical fiber is provided on the end face. Can be provided. Here, for example, by temporarily adhering the minute tile-shaped element to one surface of the flexible tape (film), the minute tile-shaped element can be easily handled at a precise position.
[0010]
Further, in the optical communication device of the present invention, it is preferable that the minute tile-shaped element is one of a surface emitting laser, an LED, a photodiode, and a phototransistor.
According to the present invention, a surface emitting laser, an LED, a photodiode, a phototransistor, and the like are once formed on a certain substrate, and then the surface emitting laser and the like are cut out from the substrate in a minute tile shape and a piece of a flexible tape (film) is cut. By temporarily bonding the optical fiber to the direction and handling it and bonding it to the end face of the optical fiber, a compact and high-performance optical signal transmission means can be easily provided.
[0011]
Further, in the optical communication device according to the present invention, it is preferable that an anode electrode and a cathode electrode of the micro tile element are formed concentrically with a center of an end face of the optical fiber.
According to the present invention, when an optical fiber is connected to a socket or the like, and an optical element provided on an end face of the optical fiber is electrically connected to the socket or the like, even the center axis of the optical fiber is used as a socket or the like. As long as the position matches the desired position, the position in the rotational direction can be set arbitrarily.
[0012]
Further, in the optical communication device of the present invention, it is preferable that the anode electrode and the cathode electrode of the small tile-shaped element have a projection shape.
ADVANTAGE OF THE INVENTION According to this invention, since the protrusion shape, such as what is called a bump, is provided in the anode electrode and the cathode electrode of a micro tile-shaped element, the electrode of an optical element can be connected reliably to the electrode such as a socket.
[0013]
Further, in the optical communication device of the present invention, it is preferable that the minute tile-shaped element has a disk shape.
According to the present invention, since the end surface of the cylindrical optical fiber is circular, the area of the end surface of the optical fiber can be efficiently utilized by making the micro tile-shaped element into a disk shape.
[0014]
Further, the optical communication device of the present invention preferably includes a socket having an insertion hole into which the optical fiber is inserted, and an electrode formed at the bottom of the insertion hole.
According to the present invention, the optical element of the optical fiber can be electrically connected to the electrode of the socket only by inserting the optical fiber having the optical element on the end face into the insertion hole of the socket. Thus, for example, by applying a desired voltage (signal) to the electrode of the socket, light (signal) can be emitted from the optical element provided on the end face of the optical fiber.
[0015]
Further, in the optical communication device of the present invention, when the electrode of the socket includes an anode electrode and a cathode electrode, and the optical fiber is inserted into the insertion hole, the anode electrode of the socket and the anode electrode of the small tile-shaped element are connected. It is preferable that the cathode electrode of the socket and the cathode electrode of the microtile-shaped element be in contact with each other at the same time.
According to the present invention, the anode electrode of the optical element of the optical fiber and the anode electrode of the socket can be electrically connected only by inserting the optical fiber having the optical element on the end face into the insertion hole of the socket, and The cathode electrode and the cathode electrode of the socket can be electrically connected.
[0016]
In the optical communication device of the present invention, the anode electrode of the socket is located at a position where the distance from the center of the bottom surface of the insertion hole is substantially the same as the radius of a concentric circle formed by the anode electrode of the micro tile element. The cathode electrode of the socket is provided on the bottom surface of the insertion hole at a position where the distance from the center of the bottom surface is substantially the same as the radius of a concentric circle formed by the cathode electrode of the micro tile element. Is preferred.
According to the present invention, the distance from the center of the bottom surface of the insertion hole for the anode electrode and the cathode electrode of the socket corresponds to the arrangement of the anode electrode and the cathode electrode of the micro tile-shaped element provided on the end face of the optical fiber, respectively. Therefore, as long as the center axis of the optical fiber and the center axis of the insertion hole of the socket are substantially aligned, the position of the optical fiber in the rotation direction can be arbitrarily set, so that the optical fiber can be easily attached.
[0017]
Further, in the optical communication device of the present invention, it is preferable that the anode electrode and the cathode electrode of the socket are formed on the bottom surface of the insertion hole so as to be concentric with the center of the bottom surface.
According to the present invention, when the optical fiber is attached to the socket, if the center axis of the optical fiber and the center axis of the insertion hole of the socket are substantially aligned, the position of the optical fiber in the rotation direction can be arbitrarily determined. The fiber can be easily attached.
[0018]
Further, in the optical communication device of the present invention, it is preferable that an anode electrode and a cathode electrode of the socket have a projection shape.
ADVANTAGE OF THE INVENTION According to this invention, since the projection shape, such as what is called a bump, is provided in the anode electrode and the cathode electrode of a socket, the electrode of an optical element can be reliably connected to the electrode of a socket.
[0019]
Further, in the optical communication device of the present invention, the optical fiber is inserted into the insertion hole of the socket, and an insulating heat conductive agent is provided between at least one of the side surface and the bottom surface of the insertion hole and the optical fiber. Preferably, it is filled.
According to the present invention, the optical fiber is inserted into the insertion hole of the socket, and the space between the optical fiber and the insertion hole is filled with the insulating heat conductive agent. The heat generated from an optical element such as a surface emitting laser can be efficiently dissipated, and the optical fiber can be firmly fixed to the socket.
Further, according to the present invention, when the optical element provided on the end face of the optical fiber breaks down, the optical fiber can be easily removed from the insertion hole of the socket. Then, by replacing the extracted optical fiber with an optical fiber provided with another normal optical element, or by replacing only the optical element of the extracted optical fiber with another normal optical element, such a failure can be easily and simply performed. Can be repaired quickly.
[0020]
Further, in the optical communication device of the present invention, the optical fiber is inserted into the insertion hole of the socket, and an anisotropic conductive material is filled between the side and bottom surfaces of the insertion hole and the optical fiber. The anode electrode of the micro tile element is electrically connected to the anode electrode of the socket via a part of the anisotropic conductive material, and the cathode electrode of the micro tile element is Preferably, it is electrically connected to the cathode electrode of the socket via a part of the isotropic conductive material.
According to the present invention, for example, when an anisotropic conductive material is filled in an insertion hole of a socket and then an optical fiber is inserted into the insertion hole, the anisotropic conductive material is inserted near the bottom of the insertion hole. Only in the axial direction (longitudinal direction of the optical fiber). Therefore, even when the electrode of the micro tile element and the electrode of the socket do not directly contact, the anisotropic conductive material can electrically connect the electrodes. Therefore, according to the present invention, it is not necessary to provide a bump in the shape of a protrusion on the electrode, and the manufacturing cost can be reduced.
[0021]
Further, in the optical communication device of the present invention, it is preferable that a cross section of the insertion hole is circular.
[0022]
Further, in the optical communication device of the present invention, it is preferable that a cross section of the insertion hole is a polygon.
According to the present invention, before inserting an optical fiber having a cylindrical shape or the like into the insertion hole, it is possible to provide a clearance such as an insulating heat conductive agent or an anisotropic conductive agent filled in the insertion hole. The optical fiber can be reliably connected to the socket both electrically and mechanically.
[0023]
Further, in the optical communication device according to the present invention, it is preferable that the socket is formed by laminating a member having a through hole serving as at least a part of the insertion hole and a plate-like member having an electrode.
ADVANTAGE OF THE INVENTION According to this invention, the socket provided with the electrode in the bottom face of an insertion hole can be manufactured easily, and low-cost and high-performance optical signal transmission means can be provided.
[0024]
Further, in the optical communication device of the present invention, it is preferable that a space is provided inside the socket so as to be connected to a bottom surface or a vicinity of the bottom surface of the insertion hole.
According to the present invention, when an optical fiber is inserted into the insertion hole, it can be provided inside the escape socket such as an insulating filler or an anisotropic filler filled in the insertion hole, The optical fiber can be reliably and mechanically connected to the socket.
[0025]
Further, in the optical communication device according to the present invention, it is preferable that at least a part of the space is formed by a groove provided in the plate-shaped member.
ADVANTAGE OF THE INVENTION According to this invention, the escape of an insulating filler or an anisotropic filler can be easily comprised, and a low-cost and high-performance optical signal transmission means can be provided.
[0026]
Further, a flat panel display according to the present invention includes the optical communication device.
According to the present invention, by transmitting a scanning signal or the like by the optical communication device, the scanning signal or the like can be transmitted at a high speed, and a compact flat panel display with high display quality can be provided at low cost. .
[0027]
An electronic device according to another aspect of the invention includes the optical communication device.
According to the present invention, for example, an optical signal can be transmitted and received between semiconductor chips, boards (substrates) or between devices, and high-speed signal processing can be performed, and a compact electronic device can be provided at low cost. .
Further, according to the present invention, there is provided an electronic apparatus which can easily replace an optical element and an optical fiber even when an optical element fails, and can easily add or change an optical signal transmission means. be able to.
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an optical communication device according to an embodiment of the present invention will be described with reference to the drawings.
(1st Embodiment)
An optical communication device according to a first embodiment of the present invention will be described with reference to FIGS. 1A and 1B are cross-sectional views illustrating an optical communication device according to a first embodiment. FIG. 1A illustrates a state before an optical fiber 10 is inserted into a socket 30, and FIG. This shows the state after the operation. 2A and 2B show electrodes and the like of the micro tile element 20 provided on the end face of the optical fiber 10, FIG. 2A is a perspective view of the optical fiber 10 and the micro tile element 20, and FIG. It is a top view.
[0029]
The optical communication device is configured to include an optical fiber 10, a micro tile element 20 bonded to an end face of the optical fiber 10, and a socket 30 into which the optical fiber 10 is inserted.
[0030]
The micro tile element 20 includes an optical element 23. As the optical element 23, one of a surface emitting laser (VCSEL), an LED, a photodiode (PD), a phototransistor (PTr), and the like is applied. The minute tile-shaped element 20 is a semiconductor device having a minute tile shape, for example, a disk-shaped member having a thickness of 20 μm or less and a diameter of several tens μm to several hundred μm. The minute tile-shaped element 20 is not limited to a disk shape, and may be a polygonal shape such as a square or a rectangle, or may be an elliptical shape. A method for manufacturing the micro tile element 20 will be described later in detail. Note that as the micro tile element 20, a combination of a photodiode and a transistor may be used instead of the phototransistor.
[0031]
The micro tile element 20 includes a cathode electrode 21 and an anode electrode 22. As shown in FIG. 2, the cathode electrode 21 and the anode electrode 22 are provided concentrically with respect to the center axis of the optical fiber 10 on the surface of the micro tile element 20. That is, the anode electrode 22 has a circular shape with a radius r2 provided substantially at the center O of the surface of the micro tile element 20. The cathode electrode 21 has a donut shape with a radius r1 formed on the surface of the minute tile-shaped element 20 with a certain distance from the anode electrode 22.
[0032]
The socket 30 has an insertion hole 35 into which the optical fiber 10 is inserted. The insertion hole 35 has a circular cross section and has a slightly larger diameter than the diameter of the optical fiber 10. On the bottom surface of the insertion hole 35, a cathode electrode 33 and an anode electrode 34 are provided. Then, as shown in FIG. 2B, a bump 31 having a projection shape is provided on the cathode electrode 33, and a bump 32 having a projection shape is also provided on the anode electrode 34.
[0033]
Here, the arrangement of the bumps 31 of the cathode electrode 33 is located at a distance r1 from the center of the bottom surface of the insertion hole 35. This distance r1 is substantially the same as the doughnut-shaped radius r1 formed by the cathode electrode 21 of the micro tile element 20. The bump 32 of the anode electrode 34 is located at a distance r2 from the center O of the bottom surface of the insertion hole 35. This distance r2 is a value smaller than the radius r1 of the circle formed by the anode 22 of the minute tile element 20.
[0034]
Then, when the optical fiber 10 is inserted into the insertion hole 35 of the socket 30, the cathode electrode 21 of the micro tile element 20 and the bump 31 of the cathode electrode 33 of the socket 30 come into contact, and the anode electrode 22 of the micro tile element 20 contacts the anode electrode 22 of the micro tile element 20. The bumps 32 of the anode electrode 34 of the socket 30 make contact.
[0035]
Therefore, only by inserting the optical fiber 10 into the insertion hole 35 of the socket 30, the cathode electrode 21 of the micro tile element 20 is electrically connected to the cathode electrode 33 of the socket 30, and the anode electrode 22 of the micro tile element 20 is electrically connected. And the anode electrode 34 of the socket 30 are electrically connected. These electrical connections are maintained no matter how the optical fiber 10 is rotated with respect to the insertion hole 35 of the socket 30.
[0036]
For example, if the micro tile element 20 includes a light emitting element, an optical signal is emitted from the micro tile element 20 by applying a signal voltage to the anode electrode 34 and the cathode electrode 33 of the socket 30. The optical signal propagates through the optical fiber 10 and is detected by a light receiving element of another micro tile element 20 adhered to the other end of the optical fiber 10. The detected light signal is converted into an electric signal by the light receiving element, and is output as an electric signal from the anode electrode 34 and the cathode electrode 33 of another socket 30.
[0037]
Thus, according to the present embodiment, since the optical element 23 serving as a light emitting element or a light receiving element is directly attached to the end face of the optical fiber 10, light loss is small and coupling efficiency can be increased. Therefore, according to the present embodiment, errors in data communication are small, and the effective transmission speed can be increased.
Here, the connection between the optical fiber 10 and the socket 30 on the device side is made by connecting the electrodes (cathode electrode 21 and anode electrode 22) of the optical element 23 (light emitting device or light receiving device) attached to the end of the optical fiber 10 to the device side. This can be performed by making electrical contact with the electrodes (bumps 31 and 32). Therefore, according to the present embodiment, the allowable positional accuracy can be increased as compared with the conventional optical connection method, and the optical fiber 10 can be easily connected to the device.
Further, according to the present embodiment, since the optical fiber 10 and the optical element 23 such as a light emitting element or a light receiving element are integrated, the connecting device corresponding to a conventional optical module can be extremely miniaturized.
[0038]
(2nd Embodiment)
Next, an optical communication device according to a second embodiment of the present invention will be described with reference to FIG. 3A and 3B show an optical communication device according to the second embodiment, in which FIG. 3A is a perspective view of the optical fiber 10 and the minute tile-shaped element 40, and FIG. 3B is a plan view of the socket 30.
[0039]
The micro tile element 40 bonded to the end face of the optical fiber 10 corresponds to the micro tile element 20 in FIG. That is, the minute tile-shaped element 40 forms an optical element such as a surface emitting laser (VCSEL), an LED, a photodiode (PD), or a phototransistor (PTr). The micro tile element 40 is, for example, a plate-shaped member having a thickness of 20 μm or less and a length and width of several tens μm to several hundred μm. The minute tile-shaped element 40 is formed of a rectangular plate-like member, but is not limited to this shape, and may be a circle, an ellipse, or another polygonal shape.
[0040]
The micro tile element 40 has a cathode electrode 41 and an anode electrode 42. The optical element 43 is formed at the center of the micro tile element 40. The cathode electrode 41 has a bump having a protruding shape. The bump of the cathode electrode 41 is provided at a position separated from the center O of the micro tile element 40 by a distance r3. The anode electrode 42 also includes a bump having a protruding shape. The bump of the anode electrode 42 is provided at a position separated from the center O of the micro tile element 40 by a distance r4.
[0041]
On the bottom surface of the insertion hole 35 of the socket 30, a cathode electrode 36 and an anode electrode 37 are provided. The cathode electrode 36 and the anode electrode 37 correspond to the cathode electrode 33 and the anode electrode 34 shown in FIGS. The anode electrode 37 has a circular shape with a radius r4 provided substantially at the center of the bottom surface of the insertion hole 35. This radius r4 is substantially the same as the distance r4 from the center O in the arrangement of the anode electrode 42 of the micro tile element 40. The cathode electrode 36 has a donut shape with a radius r3 formed with a certain distance from the anode electrode 37. This radius r3 is substantially the same as the distance r3 from the center O in the arrangement of the cathode electrodes of the micro tiled element 40. Therefore, the cathode electrode 36 and the anode electrode 37 are formed concentrically on the bottom surface of the insertion hole 35 with respect to the center O of the bottom surface.
[0042]
Then, when the optical fiber 10 is inserted into the insertion hole 35 of the socket 30, the bump of the cathode electrode 41 of the micro tile element 40 comes into contact with the cathode electrode 36 of the socket 30, and the bump of the anode electrode 42 of the micro tile element 40 contacts. And the anode electrode 37 of the socket 30 contacts.
[0043]
Therefore, similarly to the first embodiment, just by inserting the optical fiber 10 into the insertion hole 35 of the socket 30, the cathode electrode 41 of the minute tile-shaped element 40 and the cathode electrode 36 of the socket 30 are electrically connected, and The anode electrode 42 of the tiled element 40 and the anode electrode 37 of the socket 30 are electrically connected. These electrical connections are maintained no matter how the optical fiber 10 is rotated with respect to the insertion hole 35 of the socket 30.
[0044]
(Third embodiment)
Next, an optical communication device according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a sectional view showing an optical communication device according to the third embodiment. The optical communication device is different from the optical communication devices of the first and second embodiments in that the insertion hole 35 of the socket 30 is filled with the insulating heat conductive agent 50 in the optical communication device. is there. Others are the same as the optical communication devices of the first embodiment and the second embodiment.
[0045]
The insulating heat conductive agent 50 is a liquid or a fluid, and is made of a substance having electrical insulation and a high heat conductivity. Before the optical fiber 10 is inserted into the insertion hole 35, the insulating heat conductive agent 50 is filled in the insertion hole 35. After that, the optical fiber 10 is inserted into the insertion hole 35 filled with the insulating heat conductive agent 50. In this insertion, the electrodes (cathode electrode 21 and anode electrode 22) of the micro tile element 20 adhered to the end face of the optical fiber 10 and the electrodes of the socket 30 (cathode electrode bump 31 and anode electrode bump 32) come into contact. The optical fiber 10 is pushed into the insertion hole 35 until the insertion.
[0046]
Then, as shown in FIG. 4, the insulating heat is applied between the side surface of the insertion hole 35 and the side surface of the optical fiber 10 and between the bottom surface of the insertion hole 35 and the bottom surface of the optical fiber 10 (the minute tile-shaped element 20). The conductive agent 50 will be filled. The insulating heat conductive agent 50 may be cured after inserting the optical fiber.
Thus, heat generated from an optical element such as a surface emitting laser formed by the minute tile-shaped element 20 provided on the end face of the optical fiber 10 can be efficiently dissipated, and the optical fiber can be firmly fixed to the socket. it can.
[0047]
Further, according to the present embodiment, when an optical element such as a surface emitting laser formed by the minute tile-shaped element 20 fails, the optical fiber 10 can be easily extracted from the insertion hole 35 of the socket 30. Therefore, the failure can be easily and quickly repaired by replacing the extracted optical fiber 10 with an optical fiber 10 to which another normal fine tile-shaped element 20 is adhered. Further, the repair may be performed by replacing only the extracted minute tile element 20 of the optical fiber 10 with another normal minute tile element 20.
[0048]
Next, a modification of the third embodiment will be described with reference to FIG. FIG. 5 is a sectional view showing a modification of the optical communication device according to the third embodiment. The main difference between the present optical communication device and the optical communication device shown in FIG. 4 is that the insertion hole 35 of the socket 30 is filled with the anisotropic conductive material 51 in the present optical communication device. Further, in the present optical communication device, the bumps are not provided on the electrodes of the minute tile-shaped elements 20 provided on the end face of the optical fiber 10, and the bumps are not provided on the electrodes of the socket 30. Different from the embodiment.
[0049]
The anisotropic conductive agent 51 is a liquid or a fluid in which conductive particles are dispersed. Before the optical fiber 10 is inserted into the insertion hole 35, the anisotropic conductive agent 51 is filled in the insertion hole 35. After that, the optical fiber 10 is inserted into the insertion hole 35 filled with the anisotropic conductive agent 51. The optical fiber 10 is pushed toward the bottom surface of the insertion hole 35 until the distance between the bottom surface of the insertion hole 35 and the surface of the micro tile element 20 provided on the end surface of the optical fiber 10 becomes equal to or less than a predetermined value. Then, the bottom surface of the insertion hole 35 and the surface of the micro tile element 20 conduct only in the vertical direction (the longitudinal direction of the optical fiber 10).
[0050]
Therefore, the cathode electrode 21 of the micro tile element 20 and the cathode electrode 36 of the socket 30 conduct through the anisotropic conductive agent 51, and the anode electrode 22 of the micro tile element 20 and the anode electrode 37 of the socket 30 are connected. It conducts through the anisotropic conductive agent 51. Therefore, according to the present embodiment, it is not necessary to provide a bump in the shape of a protrusion on the electrode, and the manufacturing cost can be reduced.
[0051]
In the socket 30 of the present embodiment, an insulating film 38 is provided on desired regions of the cathode electrode 36 and the anode electrode 37 in order to prevent a short circuit between the cathode electrode 36 and the anode electrode 37 due to the anisotropic conductive agent 51. I have.
[0052]
Next, another modified example of the third embodiment will be described with reference to FIG. FIG. 6 is a plan view showing another modified example of the optical communication device according to the third embodiment. In this optical communication device, the point that the cross section of the insertion hole 35 of the socket 30 is square is the optical communication device of the above embodiment. Others are the same as the optical communication device of the above embodiment.
[0053]
According to the present embodiment, the clearance 35a of the insulating heat conductive agent 50 or the anisotropic conductive agent 51 filled in the insertion hole 35 before inserting the cylindrical optical fiber 10 into the insertion hole 35. Can be easily provided. Therefore, according to the present embodiment, the optical fiber 10 can be securely and electrically connected to the socket 30 both electrically and mechanically.
[0054]
In addition, by making the vertical and horizontal widths in the cross section of the insertion hole 35 substantially the same as the diameter of the optical fiber 10, the arrangement of the optical fiber 10 with respect to the socket 30 can be made more accurate, and poor electrical connection and the like can be prevented. It can be further reduced.
In the present embodiment, the cross-sectional shape of the insertion hole 35 is square, but the present invention is not limited to this, and the cross-sectional shape of the insertion hole 35 may be an equilateral triangle or another polygonal shape. Good. In addition, a clearance may be provided by making the insertion hole 35 tapered.
[0055]
Next, another modified example of the third embodiment will be described with reference to FIG. FIG. 7 is a sectional view showing another modification of the optical communication device according to the third embodiment. This optical communication device is different from the above-described embodiment shown in FIG. 6 in that a clearance 30a for a filler such as an insulating heat conductive agent 50 or an anisotropic conductive agent 51 is provided inside a socket 30. Others are the same as the optical communication device of the above embodiment.
[0056]
The escape margin 30 a is a space provided inside the socket 30 and is a space connected to the bottom surface of the insertion hole 35 of the socket 30. When the optical fiber 10 is inserted into the insertion hole 35, a part of the filler, such as the insulating thermal conductive agent 50 or the anisotropic conductive agent 51, filled in the insertion hole 35 of the socket 30 is pushed into the clearance 30a. .
[0057]
Thus, according to the present embodiment, the unnecessary filler is prevented from being present between the micro tile element 20 provided on the end face of the optical fiber 10 and the bottom face of the insertion hole 35 of the socket 30. be able to. Therefore, according to the present embodiment, the optical fiber 10 can be securely and electrically connected to the socket 30 both electrically and mechanically.
[0058]
In the present embodiment, the socket 30 is preferably composed of a plate-shaped member 30 'and a plate-shaped member 30 "as shown in Fig. 7. A through-hole is formed in the plate-shaped member 30 'to form the insertion hole 35. A groove is formed in the plate-shaped member 30 "to form the clearance 30a. The plate member 30 "is also provided with the cathode electrode 33, the anode electrode 34, and the like shown in FIG. 1 and the like of the above-described embodiment. Thereafter, the plate member 30 'and the plate member 30" are attached to each other to obtain the structure shown in FIG. The socket 30 shown is formed.
[0059]
According to the present embodiment, high-performance optical signal transmission means can be provided easily and at low cost.
The method of manufacturing the socket 30 according to the present embodiment includes a plate member 30 ′ having a through hole forming an insertion hole 35 and a plate member 30 having electrodes such as a cathode electrode 33 and an anode electrode 34. 1 can be applied to the embodiment shown in FIGS. 1 to 6 described above.
[0060]
(Production method of micro tile element)
Next, a method of manufacturing the micro tile elements 20 and 40 will be described with reference to FIGS. The micro tile element of the present embodiment is manufactured by a method based on an epitaxial lift-off method. In this manufacturing method, a case in which a compound semiconductor device (compound semiconductor device) as a minute tile-shaped element is bonded onto a silicon / LSI chip serving as a substrate will be described. The invention can be applied.
[0061]
That is, the present manufacturing method can also be applied to the case where a micro tile element is bonded to the end face of the optical fiber 10 according to the above embodiment.
The “semiconductor substrate” in the present embodiment refers to an object made of a semiconductor material, but is not limited to a plate-shaped substrate, and any shape of semiconductor material is included in the “semiconductor substrate”. .
[0062]
<First step>
FIG. 8 is a schematic cross-sectional view showing a first step of the method for manufacturing a micro tile element. In FIG. 8, a substrate 110 is a semiconductor substrate, for example, a gallium-arsenic compound semiconductor substrate. A sacrificial layer 111 is provided on the lowest layer of the substrate 110. The sacrificial layer 111 is made of aluminum arsenic (AlAs) and has a thickness of, for example, several hundred nm.
For example, a functional layer 112 is provided above the sacrificial layer 111. The thickness of the functional layer 112 is, for example, about 1 μm to 10 (20) μm. Then, a semiconductor device (semiconductor element) 113 is formed in the functional layer 112. Examples of the semiconductor device 113 include a light emitting diode (LED), a surface emitting laser (VCSEL), a photodiode (PD), and a phototransistor (PTr). In each of these semiconductor devices 113, an element is formed by laminating a multilayer epitaxial layer on a substrate 110. Further, an electrode is formed on each semiconductor device 113, and an operation test is also performed.
Here, the semiconductor device 113 includes a light emitting element 23, a cathode electrode 21, and an anode electrode 22, as shown in FIG.
[0063]
<Second step>
FIG. 9 is a schematic cross-sectional view showing a second step of the method for manufacturing a micro tile element. In this step, an isolation groove 121 is formed so as to divide each semiconductor device 113. The separation groove 121 is a groove having a depth that reaches at least the sacrifice layer 111. For example, both the width and the depth of the separation groove are set to 10 μm to several hundred μm. In addition, the separation groove 121 is a groove that is connected without a dead end so that a selective etching solution to be described later flows through the separation groove 121. Further, it is preferable that the separation grooves 121 are formed in a lattice shape like a go board.
Further, by setting the interval between the separation grooves 121 to several tens μm to several hundred μm, the size of each semiconductor device 113 divided and formed by the separation grooves 121 has an area of several tens μm to several hundred μm square. Shall be. As a method for forming the separation groove 121, a method using photolithography and wet etching, or a method using dry etching is used. Further, the separation groove 121 may be formed by dicing a U-shaped groove to the extent that cracks do not occur in the substrate.
[0064]
<Third step>
FIG. 10 is a schematic cross-sectional view showing a third step of the method for manufacturing a micro tile element. In this step, the intermediate transfer film 131 is attached to the surface of the substrate 110 (on the semiconductor device 113 side). The intermediate transfer film 131 is a flexible belt-shaped film having a surface coated with an adhesive.
[0065]
<Fourth step>
FIG. 11 is a schematic cross-sectional view showing a fourth step of the method for manufacturing a micro tile element. In this step, the selective etching solution 141 is injected into the separation groove 121. In this step, in order to selectively etch only the sacrificial layer 111, low concentration hydrochloric acid having high selectivity to aluminum and arsenic is used as the selective etching solution 141.
[0066]
<Fifth step>
FIG. 12 is a schematic cross-sectional view showing a fifth step of the method for manufacturing a micro tile element. In this step, after injecting the selective etching solution 141 into the separation groove 121 in the fourth step, the entire sacrificial layer 111 is selectively etched and removed from the substrate 110 after a predetermined time has elapsed.
[0067]
<Sixth step>
FIG. 13 is a schematic cross-sectional view showing a sixth step of the method for manufacturing a micro tile element. When the sacrificial layer 111 is entirely etched in the fifth step, the functional layer 112 is separated from the substrate 110. Then, in this step, by separating the intermediate transfer film 131 from the substrate 110, the functional layer 112 attached to the intermediate transfer film 131 is separated from the substrate 110.
As a result, the functional layer 112 on which the semiconductor device 113 is formed is divided by forming the separation groove 121 and etching the sacrificial layer 111 to form a semiconductor element having a predetermined shape (for example, a minute tile shape) (“ A micro tile-shaped element ") is attached and held on the intermediate transfer film 131. Here, it is preferable that the thickness of the functional layer is, for example, 1 μm to 8 μm, and the size (length and width) is, for example, several tens μm to several hundred μm.
[0068]
<Seventh step>
FIG. 14 is a schematic cross-sectional view showing a seventh step of the method for manufacturing a micro tile element. In this step, by moving the intermediate transfer film 131 (to which the minute tile-shaped element 161 is attached), the minute tile-shaped element 161 is aligned with the end face of the optical fiber 10 which is the final substrate. For example, an LSI composed of another micro tile-shaped element may be already bonded to the end face of the optical fiber 10. This LSI may include an APC circuit for a surface emitting laser or the like.
Here, an adhesive 173 for adhering the micro tile element 161 is applied to the end face of the optical fiber 10.
[0069]
<Eighth step>
FIG. 15 is a schematic cross-sectional view showing an eighth step of the method for manufacturing a small tile element. In this step, the minute tile-shaped element 161 aligned on the end face of the optical fiber 10 is pressed with the backing pin 181 over the intermediate transfer film 131 and joined to the end face of the optical fiber 10. Here, since the adhesive 173 is applied to the end face of the optical fiber 10, the micro tile element 161 is bonded to the end face.
[0070]
<Ninth step>
FIG. 16 is a schematic cross-sectional view showing a ninth step of the method for manufacturing a small tile element. In this step, the adhesive force of the intermediate transfer film 131 is eliminated, and the intermediate transfer film 131 is peeled off from the minute tile-shaped element 161.
The adhesive of the intermediate transfer film 131 is UV-curable or thermosetting. In the case of using a UV-curable adhesive, the backing pin 181 is made of a transparent material, and the adhesive force of the intermediate transfer film 131 is eliminated by irradiating ultraviolet rays (UV) from the tip of the backing pin 181. When a thermosetting adhesive is used, the back push pin 181 may be heated. Alternatively, after the sixth step, the adhesive force may be completely eliminated by irradiating the intermediate transfer film 131 with ultraviolet light over the entire surface. Although the adhesive force has disappeared, the adhesiveness actually remains slightly, and the micro tile element 161 is held on the intermediate transfer film 131 because it is very thin and light.
[0071]
<Tenth step>
FIG. 17 is a schematic cross-sectional view showing a tenth step of the method for manufacturing a microtile element. In this step, the adhesive 173 is subjected to a heat treatment or the like, so that the micro tile element 161 is permanently bonded to the end face of the optical fiber 10. As a result, a component which is a component of the optical communication device shown in FIG. 1 and the like, that is, a micro tile-shaped element adhered to the end face of the optical fiber according to the present invention is completed.
[0072]
(Electronics)
An example of an electronic device including the optical communication device of the above embodiment will be described.
FIG. 18 is a perspective view showing an example of a mobile phone. In FIG. 23, reference numeral 1000 denotes a mobile phone body using the optical communication device, and reference numeral 1001 denotes a display unit including a flat panel display using the optical communication device.
[0073]
FIG. 19 is a perspective view showing an example of a wristwatch-type electronic device. In FIG. 19, reference numeral 1100 denotes a watch main body using the above-described optical communication device, and reference numeral 1101 denotes a display unit including a flat panel display using the above-described optical communication device.
[0074]
FIG. 20 is a perspective view showing an example of a portable information processing device such as a word processor or a personal computer. 20, reference numeral 1200 denotes an information processing device, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing device main body using the optical communication device, and reference numeral 1206 denotes a flat panel display using the optical communication device. Is shown.
[0075]
Since the electronic device shown in FIGS. 18 to 20 includes the optical communication device of the above-described embodiment, it can transmit a signal at a very high speed and process the signal at a high speed, and can produce a compact electronic device at a low cost. Can be provided.
[0076]
Note that the technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. These are only examples and can be changed as appropriate.
[0077]
For example, a scanning signal of a flat panel display may be transmitted using the optical communication device according to the present invention. Here, the flat panel display corresponds to an organic EL display, a liquid crystal display, a plasma display, or the like.
[0078]
Further, the optical communication device according to the present invention can be used for transmitting and receiving optical signals between semiconductor chips, between boards (substrates), between devices, and the like.
[0079]
Further, the optical communication device according to the present invention, when the semiconductor chips are superimposed, when the substrates are superimposed, or when the substrate and the semiconductor chip are superimposed, the optical signal between those superimposed Can be used for transmission and reception. In this case, the length of the optical fiber 10 is shortened.
[Brief description of the drawings]
FIG. 1 is a sectional view of an optical communication device according to a first embodiment of the present invention.
FIG. 2 is a diagram showing an electrode structure of the above optical communication device.
FIG. 3 is a diagram illustrating an optical communication device according to a second embodiment of the present invention.
FIG. 4 is a sectional view showing an optical communication device according to a third embodiment of the present invention.
FIG. 5 is a sectional view showing an optical communication device according to a modification of the above.
FIG. 6 is a plan view showing an optical communication device according to another modification of the above.
FIG. 7 is a sectional view showing an optical communication device according to another modification of the above.
FIG. 8 is a schematic cross-sectional view showing a first step of a method for manufacturing a micro tile element.
FIG. 9 is a schematic cross-sectional view showing a second step of the above manufacturing method.
FIG. 10 is a schematic cross-sectional view showing a third step of the above manufacturing method.
FIG. 11 is a schematic sectional view showing a fourth step of the above manufacturing method.
FIG. 12 is a schematic sectional view showing a fifth step of the manufacturing method according to the third embodiment;
FIG. 13 is a schematic cross-sectional view showing a sixth step of the above manufacturing method.
FIG. 14 is a schematic sectional view showing a seventh step of the above manufacturing method.
FIG. 15 is a schematic sectional view showing an eighth step of the above manufacturing method.
FIG. 16 is a schematic sectional view showing a ninth step of the above manufacturing method.
FIG. 17 is a schematic sectional view showing an eleventh step of the above manufacturing method.
FIG. 18 is a diagram illustrating an example of an electronic apparatus including the circuit according to the embodiment.
FIG. 19 is a diagram illustrating an example of an electronic apparatus including the circuit according to the embodiment.
FIG. 20 is a diagram illustrating an example of an electronic apparatus including the circuit of the present embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Optical fiber, 20, 40 ... Micro tile element, 21, 33, 36, 41 ... Cathode electrode, 22, 34, 37, 42 ... Anode electrode, 23, 43 ... Optical element, 30 ... Socket, 30 ', Reference numeral 30 ": plate member, 31, 32: bump, 35: insertion hole, 30a, 35a: escape, 38: insulating film, 50: insulating heat conductive agent, 51: anisotropic conductive material

Claims (22)

An optical communication device comprising an optical element on an end face of an optical fiber. The optical element is configured by a minute tile-shaped element made of a minute tile-shaped semiconductor element,
2. The optical communication device according to claim 1, wherein the micro tile-shaped element is directly attached to an end face of the optical fiber. The optical communication device according to claim 2, wherein the micro-tile-shaped element is one of a surface emitting laser, an LED, a photodiode, and a phototransistor. The optical communication device according to claim 2, wherein an anode electrode and a cathode electrode of the micro tile element are formed concentrically with a center of an end face of the optical fiber. The optical communication device according to claim 4, wherein the anode electrode and the cathode electrode of the small tile-shaped element have a projection shape. The optical communication device according to claim 5, wherein the projection shape is a bump. The optical communication device according to any one of claims 2 to 6, wherein the minute tile-shaped element has a disk shape. The optical communication according to any one of claims 1 to 7, further comprising a socket having an insertion hole into which the optical fiber is inserted, and an electrode formed at a bottom of the insertion hole. machine. The electrodes of the socket include an anode electrode and a cathode electrode,
When the optical fiber is inserted into the insertion hole, the anode electrode of the socket and the anode electrode of the micro tile element are in contact with each other, and the cathode electrode of the socket is in contact with the cathode electrode of the micro tile element. The optical communication device according to claim 8, wherein: The anode electrode of the socket is provided on the bottom surface of the insertion hole at a position where the distance from the center of the bottom surface is substantially the same as the radius of a concentric circle formed by the anode electrode of the micro tile element,
The cathode electrode of the socket is provided on the bottom surface of the insertion hole at a position where the distance from the center of the bottom surface is substantially the same as the radius of a concentric circle formed by the cathode electrode of the micro tile element. The optical communication device according to claim 9. The optical communication device according to claim 9, wherein the anode electrode and the cathode electrode of the socket are formed on a bottom surface of the insertion hole so as to be concentric with a center of the bottom surface. The optical communication device according to any one of claims 9 to 11, wherein the anode electrode and the cathode electrode of the socket have a projection shape. The optical communication device according to claim 12, wherein the projection shape is a bump. The optical fiber is inserted into an insertion hole of the socket,
14. The optical communication device according to claim 8, wherein an insulating heat conductive agent is filled between at least one of the side surface and the bottom surface of the insertion hole and the optical fiber. . The optical fiber is inserted into an insertion hole of the socket,
An anisotropic conductive material is filled between the side and bottom surfaces of the insertion hole and the optical fiber,
An anode electrode of the micro tile element is electrically connected to an anode electrode of the socket through a part of the anisotropic conductive material,
The cathode electrode of the micro tile element is electrically connected to the cathode electrode of the socket via a part of the anisotropic conductive material. An optical communication device according to item 1. The optical communication device according to claim 8, wherein a cross section of the insertion hole is circular. The optical communication device according to claim 8, wherein a cross section of the insertion hole is a polygon. 18. The socket according to claim 8, wherein a member having a through-hole serving as at least a part of the insertion hole and a plate-like member having an electrode are attached to each other. An optical communication device according to the item. 19. The optical communication device according to claim 8, wherein a space connected to a bottom surface or a vicinity of the bottom surface of the insertion hole is provided inside the socket. 20. The optical communication device according to claim 19, wherein at least a part of the space is formed by a groove provided in the plate-shaped member. A flat panel display comprising the optical communication device according to any one of claims 1 to 20. An electronic device comprising the optical communication device according to claim 1.

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