JP2004174297A

JP2004174297A - Degassing machine with pulverizer and degassing method due to pulverization

Info

Publication number: JP2004174297A
Application number: JP2002340374A
Authority: JP
Inventors: Shinichi Enomura; 眞一榎村
Original assignee: M Technique Co Ltd
Current assignee: M Technique Co Ltd
Priority date: 2002-11-25
Filing date: 2002-11-25
Publication date: 2004-06-24
Anticipated expiration: 2022-11-25
Also published as: JP3955254B2

Abstract

<P>PROBLEM TO BE SOLVED: To remove fine air bubbles impossible to remove heretofore and to dispense with the troublesome washing work of a conventional apparatus. <P>SOLUTION: This degassing machine has at least two treatment surfaces, that is, first and second treatment surfaces 1 and 2 which constitute a part of a hermetically sealed fluid passage and is arranged in the fluid passage in a mutually opposed state and a contact surface pressure applying mechanism for bringing both treatment surfaces 1 and 2 to a pressure contact state. A fluid to be treated is pulverized between both treatment surfaces 1 and 2 by relatively rotating the second treatment surface 2 with respect to the first treatment surface 1. The first and second treatment surfaces 1 and 2 are brought to a mutual pressure contact state or a mutual approach state by the contact surface pressure applying mechanism and the fluid to be treated is passed through the gap between the first and second treatment surfaces 1 and 2 by rotating the second treatment surface 2 while forming a fluid film between both treatment surfaces to be brought to a desired pulverized state. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本願発明は、微細化装置付脱気機及び微細化による脱気方法に関する。
【０００２】
【従来の技術】
被処理物について脱気処理を行う脱気装置として、例えば液体から当該液体中の泡を抜く脱泡機がある。
この脱泡機は、内部が真空のタンク（ベッセル）内に配された円筒状の外側ロータと、当該外側ロータの内側に外側ロータと同心に配された円筒状の内側ロータと、モータによって回転する中空のシャフトとを備えたものであり、内側ロータは、上記のシャフトに接続され、外側ロータに対し相対的に回転する。
上記の筒状の内側ロータの周面部は、パンチングプレートにて形成されている。また、筒状の外側ロータの周面部は、上記パンチングプレートよりもきめの細かいスクリーンにて形成されている。
【０００３】
この脱泡機の動作を次に説明する。
上記シャフト内は、脱泡処理を行う液の通路となっており、シャフト内を通って、当該液は、内側ロータ内に導入される。このように、高速回転するシャフト内部を液体が通過することにより、液相はシャフト内壁面側に、気泡はシャフト中心側へ遠心分離される。このとき、気泡は、液相に先んじて、真空下のベッセル内に引かれ、膨張し脱気される。
続いて内側ロータ内に導入された上記の液相は、回転による遠心力にて、薄膜効果が発生し脱泡が進む。そして、内部側ロータのパンチングプレートを通過し、細分化される。このように細分化されることにより、脱泡が促進する。更に、パンチングプレートを通り抜けた液は、外側ロータに接し、そのスクリーンを通過する。当該スクリーンを通り抜けた液は、真空中で霧状にされ、ベッセル内壁に衝突してベッセル内壁を流れ落ち脱泡が完了する。
【０００４】
上記の通り、この脱泡機は、処理対象を上記のパンチングプレートやスクリーンの目へ通すことにより、主として処理対象の微細化を行う。このような微細化は、対象が内包する気泡の発散を促進させるものであり、当該脱気機は、このような作用を利用して脱気処理を円滑に行おうとするものである。
上記の微細化によって脱泡できる気泡の大きさは、上記のパンチングプレートやスクリーンの目の細かさに大きく依存する。
【０００５】
しかし、パンチングプレートやスクリーンの目を細かくするには、物理的な限界があり、パンチングプレートやスクリーンの目よりも遥かに細かい気泡の除去には向かないものであった。即ち、このような構造の脱泡機では、１０〜２０μｍの微細化（霧状化）が限界であり、１〜２μｍといった超微細化は不可能であった。
また処理対象物が、エマルションやサスペンションの場合、あらかじめ例えば高速の攪拌機や分散機でエマルションやサスペンション化されたものを当該脱気機で脱気処理する必要があった。
また、先の処理によって、パンチングプレートやスクリーンの目が汚れ、目詰まりが生じるので、次の脱泡処理に当該脱泡機を使用する前に、これらのパンチングプレートやスクリーンを十分に洗浄する必要がある。
このようなパンチングプレートやスクリーンは洗浄性が悪く、その洗浄（汚れの除去）は、極めて面倒な作業である。
【０００６】
【発明が解決しようとする課題】
本願発明は、上記事情に基づいてなされたものであり、上記の従来の微細化の機構と全く異なる微細化の機構を備えた脱気機を提供することにより、処理対象の更なる微細化による従来不可能とされた微細な気泡の除去を可能とし、更に、面倒なパンチングプレートやスクリーンの洗浄を不要として、上記問題の解決を図る。
【０００７】
【課題を解決するための手段】
本願第１の発明に係る微細化装置付脱気機は、被処理物を微細化して、脱泡等の脱気処理を行うものであり、次の構成を採る。
微細化装置は、互いに対向するように配設され少なくとも一方が他方に対して回転する第１及び第２の少なくとも２つの円盤と、両円盤の間を所定間隔に保つ間隔保持機構とを備える。両円盤の対向面の夫々は、鏡面研磨が施された処理用面である。また、この微細化装置は、当該処理用面間に被処理物を導入する流入部と、両処理用面から被処理物を排出する流出部とを備え、上記の回転により両処理用面間にて、被処理物の微細化の処理が行われるものである。ここで微細化の処理とは、被処理物の表面積の拡大を目的とする場合は勿論、霧状化の粒子径、液滴径を細かくすること、例えばエマルションやサスペンション（分散物）、リポソームの場合、その粒子径を、細かくすることを含むものである。
脱気機は、微細化により被処理物の成分の一部を気化して抽出できるものであり、脱泡機、脱ガス機、脱モノマー機、脱溶媒機などを含む。
【０００８】
本願第２の発明に係る微細化装置付脱気機は、被処理物を微細化して、脱泡等の脱気処理を行うものであり、次の構成を採る。
微細化装置は、第１及び第２の少なくとも２つの処理用部材と、フローティング機構と、付勢機構と、離反機構とを備える。両処理用部材の夫々は、互いに対向するように配設された処理用面を備え、両処理用部材の少なくとも一方が他方に対して回転することにより、両処理用面間にて微細化の処理を行うものである。両処理用面の夫々は、鏡面研磨が施され、両処理用面の間に被処理物が供給されるものである。フローティング機構は、第１及び第２の処理用部材の少なくとも一方に設けられたものであり、両処理用部材間の近接・離反を可能とすると共に、回転により両処理用部材の少なくとも一方に生じた偏心挙動を、両処理用部材の少なくとも他方が吸収するものである。付勢機構は、両処理用部材を近接させる方向に作用させるものであり、離反機構は、両処理用部材を離反させる方向に作用させるものである。また、離反機構は、処理用部材の少なくとも上記回転時、付勢機構の作用に抗して、微小間隔を両処理部材間に確保することが可能なものである。
【０００９】
本願第３の発明に係る微細化装置付脱気機は、上記本願第２の発明に係る微細化装置付脱気機にあって、第１及び第２の処理用部材間を通り抜けた処理物を抽出する減圧ポンプを備えたことを特徴とする。
【００１０】
本願第４の発明に係る微細化装置付脱気機は、互いに対向するように配設され少なくとも一方が他方に対して回転することにより微細化処理を行う、第１及び第２の少なくとも２つの処理用部材１０１，１０２を備え、上記回転の中心側から両処理用部材１０１，１０２の間に流体を供給し、当該流体を上記第１及び第２の処理用部材１０１，１０２の外側に排出するものである。上記の第１及び第２の両処理用部材１０１，１０２は、少なくともその一方が他方に対して、近接・離反可能に配設されている。両処理用部材１０１，１０２を少なくとも近接させる方向に作用する付勢機構１０３を備える。上記の第１及び第２の処理用部材１０１，１０２は、流体が両処理用部材１０１，１０２間を通過しようとする力を両処理用部材１０１，１０２の離反する方向に作用させる、動圧発生機構１０４を備える。
【００１１】
本願第５の発明に係る微細化装置付脱気機は、互いに対向するように配設され少なくとも一方が他方に対して回転することにより微細化処理を行う、第１及び第２の少なくとも２つの処理用部材１０１，１０２を備え、上記回転の中心側から両処理用部材１０１，１０２の間に流体を供給し、当該流体を上記第１及び第２の処理用部材１０１，１０２の外側に排出するものである。上記の第１及び第２の両処理用部材１０１，１０２は、少なくともその一方が他方に対して、近接・離反可能に配設されている。両処理用部材１０１，１０２を少なくとも近接させる方向に作用する付勢機構１０３を備える。上記両処理用部材１０１，１０２は、鏡面研磨が施された平坦部を備え、処理用部材の一方は、平坦部に溝を備える。上記の溝は、処理用部材の中心側から処理用部材の外側に向かって伸びると共に、当該溝内を通って、処理用部材の中心から処理用部材の外側に通り抜けようとする流体の流路を制限する、流路制限部を備える。
【００１２】
本願第６の発明に係る微細化装置付脱気機では、上記本願第５の発明に係る微細化装置付脱気機にあって、上記の流路制限部は、回転の中心側から処理用部材の外側に向けて漸次溝の断面積を小さくすることによって形成されたものである。
【００１３】
本願第７の発明に係る微細化装置付脱気機では、上記本願第４乃至６の何れかの発明に係る微細化装置付脱気機にあって、上記の第１及び第２の処理用部材１０１，１０２の少なくとも一方が、フローティング機構を備え、このフローティング機構は、両処理用部材１０１，１０２間の上記近接・離反を可能とすると共に、回転により両処理用部材１０１，１０２の少なくとも一方に生じた偏心挙動を、両処理用部材１０１，１０２の少なくとも他方が吸収するものであることを特徴とする。
【００１４】
本願第８の発明に係る微細化装置付脱気機は、互いに対向するように配設され少なくとも一方が他方に対して回転することにより微細化処理を行う、第１及び第２の少なくとも２つの処理用部材１０１，１０２を備え、上記回転の中心側から両処理用部材１０１，１０２の間に、被処理物を搬送する或いは被処理物自身となる流体を供給し、当該流体を上記第１及び第２の処理用部材１０１，１０２の外側に排出するものである。フローティング機構と、付勢機構と、動圧発生機構とを備える。フローティング機構は、上記の第１及び第２の両処理用部材１０１，１０２の、一方を他方に対して、近接・離反可能に配すると共に、両処理用部材１０１，１０２の回転軸の向きを変えることを可能とするものである。付勢機構は、上記の両処理用部材１０１，１０２を少なくとも近接させる方向に付勢するものである。動圧発生機構は、流体が両処理用部材１０１，１０２間を通過しようとする力を、両処理用部材１０１，１０２の離反する方向に作用させることによって、両処理用部材１０１，１０２間の間隔を０．１〜１０μｍの微小間隔とするものである。
【００１５】
本願第９の発明に係る微細化装置付脱気機は、被処理流動体に所定の圧力を付与する流体圧付与機構と、この所定圧力の被処理流動体が流される密封された流体流路に設けられた第１処理用部１０と第１処理用部１０に対して相対的に接近離反可能な第２処理用部２０の少なくとも２つの処理用部と、これらの処理用部１０，２０において互いに対向する位置に設けられた第１処理用面１及び第２処理用面２の少なくとも２つの処理用面と、第１処理用部１０と第２処理用部２０とを相対的に回転させる回転駆動機構とを備え、両処理用面１，２間にて、上記被処理流動体の微細化の処理を行うものである。第１処理用部１０と第２処理用部２０のうち少なくとも第２処理用部２０は所定のバランス比に設定された受圧面を備えるものであり、且つ、この受圧面の少なくとも一部が第２処理用面２により構成されている。接近離反可能且つ相対的に回転する第１処理用面１と第２処理用面２との間に所定圧力の被処理流動体が通されることにより、上記被処理流動体が所定膜厚の流体膜を形成しながら両処理用面１，２間を通過することで、当該被処理流動体について、所望の微細化の状態を得るものである。
【００１６】
本願第１０の発明に係る微細化装置付脱気機は、上記本願第９の発明に係る微細化装置付脱気機にあって、第１処理用面１及び第２処理用面２の少なくとも一方の、微振動やアライメントを調整する緩衝機構を備えたことを特徴とする。
【００１７】
本願第１１の発明に係る微細化装置付脱気機は、上記本願第９又は１０の発明に係る微細化装置付脱気機にあって、第１処理用面１及び第２処理用面２の一方又は双方の、磨耗などによる軸方向の変位を調整して、両処理用面１，２間の流体膜の膜厚を維持することを可能とする変位調整機構を備えたものであることを特徴とする。
【００１８】
本願第１２の発明に係る微細化装置付脱気機は、上記本願第９乃至１１の何れかの発明に係る微細化装置付脱気機にあって、被処理流動体に加える圧力の調整機構を備えたこと特徴とする。
【００１９】
本願第１３の発明に係る微細化装置付脱気機は、上記本願第９乃至１２の何れかの発明に係る微細化装置付脱気機にあって、上記第１処理用面１と第２処理用面２との間の最大間隔を規定し、それ以上の両処理用面１，２の離反を抑止する離反抑止部を備えることを特徴とする。
【００２０】
本願第１４の発明に係る微細化装置付脱気機は、上記本願第９乃至１３の何れかの発明に係る微細化装置付脱気機にあって、上記第１処理用面１と第２処理用面２との間の最小間隔を規定し、それ以上の両処理用面１，２の近接を抑止する近接抑止部を備えることを特徴とする。
【００２１】
本願第１５の発明に係る微細化装置付脱気機では、上記本願第９乃至１４の何れかの発明に係る微細化装置付脱気機にあって、第１処理用面１と第２処理用面２の双方が、互いに逆の方向に回転するものである。
【００２２】
本願第１６の発明に係る微細化装置付脱気機では、上記の本願第９乃至１５の何れかの発明に係る微細化装置付脱気機にあって、上記第１処理用面１と第２処理用面２の一方或いは双方の温度を調整する、温度調整用のジャケットを備える。
【００２３】
本願第１７の発明に係る微細化装置付脱気機では、上記本願第９乃至１６の何れかの発明に係る微細化装置付脱気機にあって、上記第１処理用面１及び第２処理用面２の一方或いは双方の少なくとも一部が、鏡面加工されたものであることを特徴とする。
【００２４】
本願第１８の発明に係る微細化装置付脱気機では、上記本願第９乃至１７の何れかの発明に係る微細化装置付脱気機にあって、上記第１処理用面１及び第２処理用面２の一方或いは双方は、凹部を備えたものである。
【００２５】
本願第１９の発明に係る微細化装置付脱気機は、上記本願第９乃至１８の何れかの発明に係る微細化装置付脱気機にあって、上記の流体通路とは独立した別途の導入路を備え、上記第１処理用面１と第２処理用面２の少なくとも何れ一方には、上記の導入路に通じる開口部を備え、導入路から送られてきた移送物を、上記処理中の被処理流動体に導入することが可能なものである。
【００２６】
本願第２０の発明に係る微細化装置付脱気機は、被処理流動体に所定の圧力を付与する流体圧付与機構と、この所定圧力の被処理流動体が流される密封された流体流路に接続された第１処理用面１及び第２処理用面２の少なくとも２つの相対的に接近離反可能な処理用面と、両処理用面１，２間に接面圧力を付与する接面圧力付与機構と、第１処理用面１と第２処理用面２とを相対的に回転させる回転駆動機構と、を備えることにより、両処理用面１，２間にて、被処理流動体の微細化の処理を行うものである。この微細化装置付脱気機では、接面圧力が付与されつつ相対的に回転する第１処理用面１と第２処理用面２との間に所定圧力の被処理流動体が通されることにより、上記被処理流動体が所定膜厚の流体膜を形成しながら両処理用面１，２間を通過することで、当該被処理流動体について、所望の微細化の状態を得るものである。
【００２７】
本願第２１の発明に係る微細化による脱気方法では、被処理流動体に所定の圧力を付与し、この所定の圧力を受けた被処理流動体が流される密封された流体流路に、第１処理用面１及び第２処理用面２の少なくとも２つの相対的に接近離反可能な処理用面を接続し、両処理用面１，２を接近させる接面圧力を付与し、第１処理用面１と第２処理用面２とを相対的に回転させ且つこれらの処理用面１，２間に被処理流動体を通過させて、当該被処理流動体の微細化の処理を行う。この脱気方法は、少なくとも被処理流動体に付与した上記の所定の圧力を両処理用面１，２を離反させる離反力とし、当該離反力と上記接面圧力とを、処理用面１，２間の被処理流動体を介して均衡させることにより、両処理用面１，２間を所定の微小間隔に維持し、被処理流動体を所定の厚みの流体膜として両処理用面１，２間を通過させて、所望の微細化の状態を得るものである。
【００２８】
上記の構成を採る本願第１乃至２１の発明は、被処理物を微細化して脱泡等の脱気処理を行う、微細化装置付脱気機において、２つの処理用面の少なくとも一方を回転して、もう一方の処理用面との間にて、処理対象の微細化を行うという新規な微細化の手段を提供したものであり、このように、微細化のために、従来のパンチングプレートやメッシュという構成を排除して、これら部材の面倒な洗浄という作業を不要とした。
そして、パンチングプレートやメッシュでは、不可能であった微細な気泡の抽出（排除）を可能とした。また、この脱気機は、２つの利点がある。その１点は、霧状に噴出する時の液滴径についてであり、これは、真空雰囲気に曝される表面積即ち界面の面積を多くし（大きくし）脱気能力を増大することができという点である。もう１点は、通常乳化機などで処理されたものは脱気機に導入される場合が多く、この点、この発明に係る脱気機は、その乳化機と脱気機とを１台で済ませることができるということである。
上記の通り、この脱気機は、微細化装置によって、被処理物を気泡を含んだ液体とする場合、上記にて、液体を微細化することにより、液体が内包する気体を発散しやすいものとしたものである。被処理対象については、上記ように気泡を内包する液体に限られず、二種以上の液状成分を有する液体から、一部の液状成分を微細化して気化させ、他の液状成分と分離するのにも用いることができる。また、被処理対象が、固体の混合物や化合物であり、その固形分について微細化による気化の促進により除去できるものであれば、これを含むものである。例えば、被処理物をポリマーとした場合、当該ポリマー中の不要なモノマー（揮発性物質）を微細化して気化させて除去することができる。被処理物が、固体と液体とが混合したものである場合も、気体部と液体部の何れか一方について、微細化により除去するのに、この脱気機を用いることができる。
また、脱気機には、被処理物中の水分も（微細化により）水蒸気として抜くことができるものも含む。
【００２９】
特に、本願第２の発明にあっては、上記の微細化装置付脱気機にあって、フローティング機構を備えることにて、微細化のために、必要とされる両処理用面間の微小間隔を、回転や各部の膨張係数の差にて回転で生じた熱による歪みで阻害されることなく、確実に維持できるものとし、精度の高い処理を可能とした。
また、本願第３の発明にあっては、微細化した被処理物を減圧ポンプにより減圧することにより、その移動を確実に行えるものとした。また、このような減圧ポンプによる減圧を利用して、微細化後の被処理物の、除去しようとする気体の気化を促進し、液状部との分離をより、確実なものとした。
具体的には、脱泡の場合を例に採ると、減圧ポンプにより、真空或いは真空に近い状態に減圧することにより、微細化された被処理物は、界面積が増大し、且つ微小な気泡が膨張し、被処理物に内包されているガス、溶剤、モノマー（揮発性物質）を蒸気等に気化して抜くことができる（これらのガス等を抽出の目的物とする場合も同様の作用にて当該抽出を行うことができる）。
上記の真空度（減圧の程度）は、気化させるものと残るものとの分離に適するように設定すればよい。
【００３０】
とりわけ、本願の上記第４乃至第８の発明に係る脱気機は、メカニカルシールにおける軸封の機構を、微細化のための手段として利用するという独創的な発想により、高精度の微細化の処理が出来しかも生産性の高い、シンプルな構造の脱気機を提供することを可能とし、上記問題の解決を図ったものであり、相対的に回転する少なくもと２つの処理用面間の間隔を所定の微小間隔に設定することができ、大きなせん断力を被処理流動体に与えることができる微細化装置を備えた脱気機を提供し、更に、被処理流動体の適応粘度領域が広い脱気装置を提供する。
即ち、本願の上記第４乃至第８の発明に係る脱気機は、上記の構成を採ることにより、付勢機構１０３の付勢に対し、動圧発生機構１０４が流体の両処理用部材１０１，１０２間を通過しようとする力を利用して両処理用部材１０１，１０２間の離反力を発生させ、少なくとも、付勢機構１０３の付勢と当該離反力との均衡により、両処理用部材１０１，１０２間について、機械的な方法では不可能であった、処理に必要な微小な間隔を確保することを可能とした。
【００３１】
特に、本願第５の発明に係る脱気機は、上記の動圧発生機構１０４について、より好ましい手段を提供し得たものである。即ち、上記本願第５の発明に係る脱気機は、双方の処理用部材１０１，１０２に鏡面研磨による平坦部を具備せしめると共に、当該平坦部の一方に、処理用部材の中心側から処理用部材の外側に流体が移動する経路を提供する溝を設けて、当該溝を鏡面研磨された両平坦部及び流路制限部にて、囲まれた空間とする。このため、溝を通り抜けようとする流体が流路制限部によって行き場を失い、少なくとも付勢機構１０３にて押し合わされた両平坦部の間に入り込み、両平坦部間（両処理用部材１０１，１０２間）に、機械的な方法では不可能であった、微細化の処理に適した微小間隔を確保する。
また、本願第６の発明に係る脱気機では、流路制限部が、回転の中心側から処理用部材の外側に向けて漸次溝の断面積を小さくすることによって、流体の通り抜けようとする力を徐々に受けるものであり、より円滑な上記の微小間隔の確保を可能とした。
更に、本願第７の発明に係る脱気機では、処理用部材１０１，１０２が、フローティング機構によって、両処理用部材間の上記近接・離反のみならず、回転により両処理用部材１０１，１０２の少なくとも一方に生じた偏心挙動を、両処理用部材１０１，１０２の少なくとも他方が吸収する。このため、回転や発生した熱による処理用部材の変形によって、両平坦部間（両処理用部材１０１，１０２間）の各位置における間隔の不均衡を是正し、両平坦部間（両処理用部材１０１，１０２間）の各位置における隙間を一定のものとして、より確実で均一な処理を可能とした。
即ち、フローティング機構によって、上記回転における、回転軸の芯振れ、軸膨張、第１処理用部材１０１の面振れ、振動を吸収することができ、上記の作用を奏することができる。
本願第８の発明に係る脱気機は、フローティング機構の下、付勢機構と動圧発生機構とにおいて生じた力の均衡により、両処理用部材間の間隔を０．１〜１０μｍの微小間隔とし、従来不可能であった微細化処理を実現した。
【００３２】
本願第９の発明にあっては、第１処理用面１と第２処理用面２の間隔を、従来他の分野で行われているような機械的に一定に保つという方式とは全く異なる発想により、所定の微小間隔に設定するようにした微細化装置を備えた脱気機を提供する。即ち、上記の通り、メカニカルシールに用いられ原理を利用して、受圧面を所定のバランス比に設定しておくことにより、被処理用流動体に掛けた所定の圧力を、第１処理用部１０及び第２処理用部２０の接近又は離反に作用させる。受圧面として、第２処理用面２は、両処理用部を離反させる方向に、上記の所定の圧力を作用させる。受圧面として、第２処理用面２は、両処理用部を離反させる方向に、上記の所定の圧力を作用させる。
第２処理用部２０には、必要に応じて、第２処理用面２の他、第２処理用面２と反対側を臨む受圧面（近接用調整面）と、第２処理用面２と同じ側に形成された受圧面（離反用調整面）とを設定することができる。
この場合第２処理用面２と離反用調整面とは、被処理用流動体に掛けた所定の圧力を受けて、第１処理用部１０に対して第２処理用部２０を離反させる方向に移動させる力を発生する。但し不要であれば、上記の離反用調整面は、設けなくてもよい（ここで、離反用調整面を設ける場合は、第２処理用面２と離反用調整面の双方を纏めて離反用面と称する。離反用調整面を設けない場合、離反用面は、第２処理用面２そのものである）。
そして、近接用調整面は、被処理用流動体に掛けた所定の圧力を受けて、第１処理用部１０に対して第２処理用部２０を接近させる方向に移動する力を発生する（近接用調整面が複数ある場合、全近接用調整面を纏めて近接用面と呼ぶ。近接用調整面が１つの場合は、当該近接用調整面のみが近接用面である）。
この場合、このような両処理用部を接近させる方向に上記所定の圧力を働かせる近接用面の面積と、離反用面の面積との比（面積比）をバランス比と呼び、近接用面の面積を離反用面の面積よりも大きくすることによって、上記所定の圧力のうち両処理用部を接近する方に働く力を離反させる方に働く力よりも大きいものとすることができる。
逆に、離反用面の面積を近接用面の面積よりも大きくすることによって、上記所定の圧力のうち両処理用部を離反する方に働く力を接近させる方に働く力よりも大きいものとすることができる。
また、上記の近接用面を設けないことにより、上記所定の圧力を全て離反用面で受け、当該所定の圧力の全てを上記の離反に働く力とすることができる。
これにて、他の要因によって生じた、両処理用部を接近させる力或いは離反させる力に対して、被処理用流動体に掛けた所定の圧力による両処理用部の接近又は離反の作用とを均衡させ、上記第１処理用面１と第２処理用面２との間に所望の微小な膜厚の流体膜を形成することができるのである。
即ち、このように、両処理用面１、２間を微小間隔に調整することにより、必要な大きさの剪断力を被処理流動体に付与することができる。その結果、従来得ることがでなかった超微細化を、実現した。即ち、被処理流動体に対して、両処理用面１，２間を通過する際、一定の微小隙間で大きなせん断力が与えられるものであり、かつ一定の微小な隙間より霧状に噴出することにより、１０ミクロン以下のオーダーの微細化を可能として、そのようなレベルの微細な気泡の抽出（除去）を可能とした。即ち、両処理用部１０，２０間の間隔を、従来の（パンチングプレートやメッシュを用いる）方法では、物理的に不可能であった微小なものとすることを可能として、より微小な微細化を実現して、より細かい気泡の脱気を可能とした。
【００３３】
本願第１０の発明にあっては、緩衝機構を備えることにより、芯振れなどのアライメントを吸収し、接触による磨耗などを原因とする事故の危険性を排除することができる。
本願第１１の発明にあっては、上記の変位調整機構にて、第１処理用面１及び第２処理用面２の間隔を保ち、流体膜の膜厚を所定の厚みに維持することにより、長期に渡って、確実な微細化処理を行うことが可能となり、脱気処理をより精度良く行えるものとした。
本願第１２の発明にあっては、被処理流動体に加える圧力の調整機構にて、第１処理用面１と第２処理用面２との間の隙間を調整できるので、これにて上記の流体膜の厚みの調整が可能である。従って、当該調整にて所望の微細化処理を選択し得、被処理流動体の粘度などの特性に合わせ脱気性能の向上が可能となり、また除去しようする気泡の大きさ（細かさ）にきめ細やかに対応することができる。
【００３４】
本願第１３の発明にあっては、上記の第１処理用面１と第２処理用面２との間の最大間隔を規定し、それ以上の両処理用面１，２の離反を抑止する離反抑止部を備えるため、第１処理用面１と第２処理用面２との間の隙間が必要以上に広がることを防止し、均一な微細化の処理を確実且つ円滑に行うことを可能とした。本願第１４の発明にあっては、上記の第１処理用面１と第２処理用面２との間の最小間隔を規定し、それ以上の両処理用面１，２の近接を抑止する近接抑止部を備えることによって、第１処理用面１と第２処理用面２との間の隙間が必要以上に狭まることを防止し、微細化の処理を確実且つ円滑に行うことを可能とした。
【００３５】
本願第１５の発明にあっては、第１処理用面１と第２処理用面２の双方が、互いに逆の方向に回転するものであり、このように、第１処理用面１と第２処理用面２の双方を互いに逆の方向に回転させるとによって、より大きな剪断力を発生させることが可能となり、より微小なオーダーの処理を可能とし、効率良く脱気を行うことを可能とした。
本願第１６の発明にあっては、温度調整用のジャケットにて、第１処理用面１及び第２処理用面２の一方或いは双方を、微細化の処理を行うのに適した温度に加熱或いは冷却することを可能として、より能率良くまた、確実な微細化の処理を可能とした。
【００３６】
本願第１７の発明にあっては、鏡面加工にて、第１処理用面１及び第２処理用面２間における上記微細化の処理をより高精度に行うことを可能とし、またより微細な処理を実現し得た。
本願第１８の発明にあっては、第１処理用面１又は第２処理用面２或いはその双方に凹部を形成することにより、攪拌能力を高めて、より効率的な微細化の処理を可能とし、また回転時凹部に動圧が発生することにより非接触で回転し確実に流体膜を形成する。
本願第１９の発明にあっては、処理を施す被処理流動体に対して、所望とする別途の物質や被処理流動体を、適宜混入することを可能として、装置の利用の範囲を広範なものとした。
【００３７】
本願第２０の発明にあっては、密封された流体流路に接続された第１処理用面１１と第２処理用面１２の間に、所定の圧力が付与された被処理流動体が通され、これにより、第１処理用面１１と第２処理用面１２とを離反させる力が作用する。他方、両処理用面１、２間には、接面圧力付与機構により接面圧力が付与され、且つ、相対的に接近離反可能であると同時に回転する第１処理用面１と第２処理用面２との間に被処理流動体を通過させる。その結果、処理流動体により両処理用面１、２間を離反させる方向に加えられる力と、接面圧力付与機構によって両処理用面１，２間に付与される接面圧力とが均衡し、両処理用面１、２間の間隔が所定の微小間隔に保たれるものであり、被処理流動体は流体膜を形成しながら両処理用面１、２間を通過する。
上記の接面圧力付与機構については、第１処理用面１と第２処理用面２とを近接させる方向に力を加えるものであり、スプリング、空気圧又は油圧等の流体圧（正圧）の加圧装置、被処理流動体に掛けた所定の圧力受けて両処理用面１，２を接近させる方向に働く接近用の受圧面の、少なくとも何れか一つにより構成することができる。
一方、このような接面圧力付与機構の押圧力（接面圧力）に抗する両処理用面１，２を離反させる離反力としては、第１或いは第２処理用面１，２などの被処理流動体に掛けた所定の圧力を離反方向に働かせる受圧面において受けた当該圧力、第１処理用面１と第２処理用面２とを相対的に回転させることによって生じた遠心力、空気圧又は油圧等の流体圧（負圧）を利用した吸引装置による吸引力、比処理流動体の粘性などを掲げることができる。
上記のバランス比の設定により、被処理流動体に掛けた所定の圧力のうち、接面圧力付与機構による押圧力として作用するものと、離反力として作用するものとの、大小を決定することができる。
被処理流動体は、上記の接面圧力と離反力の均衡の上で、被処理流動体は所定の微小厚さを有する流動体（即ち、流体膜）を形成して、両処理用面１、２間を通過するものであり、所定膜厚を示すように上記諸条件を調整することにより、両処理用面１、２間の間隔が所定の微小間隔に保たれた状態となる。
【００３８】
本願第２１の発明にあっては、従来不可能であった脱気における被処理物の超微細化を可能とし、また、従来の脱気処理中の微細化に必要であったパンチングプレートやメッシュを不要として、その洗浄という手間を排除した。
【００３９】
【発明の実施の形態】
以下、図面に基づき本願発明の実施の形態について説明する。
図１及び図２（Ａ）へ本願発明の一実施の形態を示す。この図１は、本願発明に係る脱気機の微細化装置Ｇの一部切欠縦断面図である。図２（Ａ）は、図１に示す脱気機の要部略縦断面図である。
説明の便宜上、各図中、Ｕは上方を、Ｓは下方を示している。
【００４０】
先ず、脱気機の構成について説明する。
この脱気機は、微細化装置Ｇと、減圧ポンプなどの周知の減圧装置（この実施の形態において図示せず。）とを備える。
上記の微細化装置Ｇは、被処理流動体に対する、ミクロン単位からナノメータ単位の微小なオーダーの微細化の処理に適したものであり、単一液体及び液体同士、液体と固体（粉体）、固体（粉体）同士、気体と液体、或いは、気体と固体（粉体）について、除去（抽出）成分の脱気による処理を施すのに適したものである。
図１に示す通り、この微細化装置は、第１ホルダ１１（メイティングリングホルダ）と、第１ホルダ１１の前方（上方）に配置された第２ホルダ２１（コンプレッションリングホルダ）と、第２ホルダ２１と共に第１ホルダ１１を覆うケース３と、流体圧付与機構ｐと、接面圧付与機構４とを備える。
以下微細化装置の構成について、順に説明する。
【００４１】
第１ホルダ１１には、第１処理用部１０と、回転軸５０と、攪拌羽根６とが設けられている。
第１処理用部１０は、メイティングリングと呼ばれる金属製の環状体であり、鏡面加工された第１処理用面１を備える。
回転軸５０は、第１ホルダ１１の中心にボルトなどの固定具５１にて固定されたものであり、その後端が電動機などの回転駆動装置５（回転駆動機構）と接続され、回転駆動装置５の駆動力を第１ホルダ１１に伝えて、当該第１ホルダ１１を回転させる。第１処理用部１０は、回転軸５０と同心に第１ホルダ１１前部（上端）へ取り付けられ、回転軸５０の回転にて、上記第１ホルダ１１と一体となって回転する。また、攪拌羽根６は、プレ攪拌（微細化の前処理）を行うために設けられたものであり、第１ホルダ１１前部（上面）において、環状の第１処理用部１０の内側に、回転軸５０と同心となるように第１ホルダ１１に軸止されている。
【００４２】
第１ホルダ１１の前部（上面）には、第１処理用部１０を受容することが可能な受容部が設けられており、当該受容部内にＯリングと共に第１処理用部１０をはめ込むことにて、第１ホルダ１１への第１処理用部１０の上記取付けが行われている。更に、第１処理用部１０は、回り止めピン１２にて、第１ホルダ１１に対して回転しないように固定されている。但し回り止めピン１２に代え、焼き嵌めなどの方法にて、回転しないように固定するものとしても良い。
上記の第１処理用面１は、第１ホルダ１１から露出して、第２ホルダ２１側を臨む。この第１処理用面１は、第１ホルダ１１にはめ込まれてから、研磨やラッピング、ポリッシングなどの鏡面加工を施すのが好ましい。
第１処理用部１０の材質は、セラミックや焼結金属、耐磨耗鋼、その他金属に硬化処理を施したものや、硬質材をライニングやコーティング、メッキなどを施工したものを採用する。特に、回転するため、軽量な素材にて第１処理用部１０を形成するのが望ましい。
【００４３】
上記のケース３は、軸挿通口３１と、排出部３２とを備えた有底の容器であり、その内部空間３０に、上記の第１ホルダ１１を収容する。軸挿通口３１は、ケース３の底部中央に設けられ、ケース３の内外を連絡する貫通口であり、上記の回転軸５０を挿通するものである。ケース３外部（下方）に配置された回転駆動装置５から上記の軸挿通口３１を通じて回転軸５０先端をケース３内部に挿通せしめ、上記の通りケース３内の第１ホルダ１１と回転軸５０とを接続する。
【００４４】
第２ホルダ２１には、第２処理用部２０と、被処理流動体の導入部２２と、接面圧力付与機構４とが設けられている。
第２処理用部２０は、コンプレッションリングと呼ばれる金属製の環状体であり、鏡面加工された第２処理用面２と、第２処理用面２の内側に位置して当該第２処理用面２に隣接する受圧面２３（以下離反用調整面２３と呼ぶ。）とを備える。図示の通り、この離反用調整面２３は、傾斜面である。第２処理用面２に施す鏡面加工は、第１処理用面１と同様の方法を採用する。また、第２処理用部２０の素材についても、第１処理用部１０と同様のものを採用する。離反用調整面２３は、環状の第２処理用部２０の内周面２５と隣接する。
【００４５】
第２ホルダ２１の底部（下部）には、収容部４０が形成され、その収容部４０内に、上記のＯリングと共に第２処理用部２０が受容されている。また、回り止め４５にて、第２処理用部２０は、第２ホルダ２１に対して回転しないよう、受容されている。上記の第２処理用面２は、第２ホルダ２１から露出する。
第２ホルダ２１は、図１に示すように、ケース３の開口部（上部）に配置されて当該開口部を覆い、周知の密閉手段３３にて、ケース３の内部空間３０を密閉する。この状態において、第２処理用面２は、ケース３内にて、第１処理用部１０の第１処理用面１と対面する。この処理用面１，２間において、第１処理用部１０及び第２処理用部２０の内側（中心側）が、（請求項１の）被処理物の流入部であり、第１処理用部１０及び第２処理用部２０の外側が、（請求項１の）被処理物の流出部である。
【００４６】
流体圧付与機構ｐは、第２ホルダ２１の外部（上部）において、上記の導入部２２と接続されている。この流体圧付与機構ｐは、微細化の処理を施す被処理流動体に、一定の送り込み圧を掛けるコンプレッサなどの加圧装置である。
【００４７】
接面圧力付与機構４は、第１処理用面１に対して第２処理用面２を、圧接又は近接した状態に押圧するものであり、この接面圧力と流体圧力（被処理流動体の流体圧）等の両処理用面１、２間を離反させる力との均衡によって、上記の所定膜厚の流体膜を発生させる（言い換えれば、両処理用面１、２間の間隔を所定の微小間隔に保つ）。
具体的には、この実施の形態において、接面圧力付与機構４は、上記の収容部４１と、収容部４１の奥に（最深部）に設けられた発条受容部４２と、スプリング４３と、エア導入部４４とにて構成されている。
但し、接面圧力付与機構４は、上記収容部４１と、上記発条受容部４２と、スプリング４３と、エア導入部４４の少なくとも、何れか１つを備えるものであればよい。
【００４８】
収容部４１は、収容部４１内の第２処理用部２０の位置を深く或いは浅く（上下に）変位することが可能なように、第２処理用部２０を遊嵌している。
上記のスプリング４３の一端は、発条受容部４２の奥に当接し、スプリング４３の他端は、収容部４１内の第２処理用部２０の前部（上部）と当接する。図１において、スプリング４３は、１つしか現れていないが、複数のスプリング４４にて、第２処理用部２０の各部を押圧するものとするのが好ましい。即ち、スプリング４３の数を増やすことによって、より均等な押圧力を第２処理用部２０に与えることができるからである。従って、第２ホルダ２１については、スプリング４３が数本から数十本取付けられたマルチ型とするのが好ましい。
【００４９】
この実施の形態において、上記の通りエア導入部４４にて他から、空気を収容部４１内に導入することを可能としている。このような空気の導入により、収容部４１と第２処理用部２０との間を加圧室として、スプリング４３と共に、空気圧を押圧力として第２処理用部２０に与えることができる。従って、エア導入部４４から導入する空気圧を調整することにて、運転中に（第１処理用面１に対する第２処理用面２の）接面圧力を調整することが可能である。尚空気圧を利用するエア導入部４４の代わりに、油圧などの他の流体圧にて押圧力を発生させる機構を利用しても実施可能である。
接面圧力付与機構４は、上記の押圧力（接面圧力）の一部を供給し調節する他、変位調整機構と、緩衝機構とを兼ねる。
詳しくは、接面圧力付与機構４は、変位調整機構として、始動時や運転中の軸方向への伸びや磨耗による軸方向変位にも、空気圧の調整によって追従し、当初の押圧力を維持できる。また、接面圧力付与機構４は、上記の通り、第２処理用部２０を変位可能に保持するフローティング機構を採用することによって、微振動や回転アライメントの緩衝機構としても機能するのである。
【００５０】
以上の構成を備えた第１の実施の形態に係る脱気機にあっては、次の作用により、脱気の処理がなされる。
まず、処理を施す被処理流動体が、流体圧付与機構ｐから一定の送圧を受けて、密閉されたケース３の内部空間へ、導入部２２より導入される。他方、回転駆動装置５（回転駆動機構）によって、第１処理用部１０が回転する。これにより、第１処理用面１と第２処理用面２とは微小間隔を保った状態で相対的に回転する。
ケース３の内部空間に導入された被処理流動体は、（流入部から入り）微小間隔を保った両処理用面１，２間で、流体膜となり、第１処理用面１の回転により第２処理用面２との間で剪断を受けることにて微細化される。ここで、第１処理用面１と第２処理用面２とは、１μｍから１ｍｍ（特に、１μｍから１０μｍ）の微小間隔に調整されることにより、数ｎｍ単位の超微粒化をも可能とする。
処理された被処理流動体は、両処理用面１，２間を経て（流出部から出て）、排出部３２から排出される。排出部３２から、排出された被処理物は、既述の減圧装置にて、真空或いは減圧された雰囲気内にて霧状にされ、雰囲気内の他に当たることによって流動体として流れ落ちたものが脱気後の液状物として回収される。
この実施の形態において、図１に示すように、ケース３が設けられているが、このようなケース３を微細化装置Ｇに設けずに実施することが可能である（図示しない）。例えば、脱気機を減圧タンク（真空タンク）として、そのタンク内部に、微細化装置Ｇを配置して、実施することが可能である。その場合、当然上記の排出部３２は、微細化装置Ｇには備えられない。
尚、攪拌羽根６は、上記被処理流動体の送圧を受けて第１ホルダ１１に対して回転し、上記の両処理用面１，２間における処理に先立ち、被処理流動体を攪拌する。
【００５１】
上記のように、第１処理用面１と第２処理用面２とは、機械的なクリアランスの設定では不可能とされたμｍ単位の微小間隔に調整され得るものであるが、そのメカニズムを次に説明する。
第１処理用面１と第２処理用面２とは、相対的に接近離反可能であり、且つ相対的に回転する。この例では、第１処理用面１が回転し、第２処理用面２が軸方向に摺動して第１処理用面に対して接近離反する。
よって、この例では、第２処理用面２の軸方向位置が、力（前述の接面圧力と離反力）のバランスによって、μｍ単位の精度で設定されることにより、両処理用面１，２間の微小間隔の設定がなされる。
【００５２】
接面圧力としては、接面圧力付与機構４において、エア導入部４４から正圧（空気圧）を付与した場合の当該圧力、スプリング４３の押圧力を挙げることができる。
他方、離反力としては、離反側の受圧面（即ち、第２処理用面２及び離反用調整面２３）に作用する流体圧と、第１処理用部１の回転による遠心力と、エア導入部４４に負圧を掛けた場合の当該負圧とを挙げることができる。
そして、これらの力の均衡によって、第２処理用面２が第１処理用面１に対して所定の微小間隔を隔てた位置にて安定することにより、μｍ単位の精度での設定が実現する。
【００５３】
離反力をさらに詳しく説明する。
まず、流体圧に関しては、密閉された流路中にある第２処理用部２０は、流体圧付与機構ｐから被処理流動体の送り込み圧力（流体圧）を受ける。その際、流路中の第１処理用面に対向する面（第２処理用面２と離反用調整面２３）が離反側の受圧面となり、この受圧面に流体圧が作用して、流体圧による離反力が発生する。
次に、遠心力に関しては、第１処理用部１０が高速にすると、流体に遠心力が作用し、この遠心力の一部は両処理用面１，２を互いに遠ざける方向に作用する離反力となる。
更に、上記のエア導入部４４から負圧を（第２処理用部２０へ）与えた場合には、当該負圧が離反力として作用する。
以上、本願の説明においては、第１第２の処理用面１，２を互いに離反させる力を離反力として説明するものであり、上記の示した力を離反力から排除するものではない。
【００５４】
上述のように、密閉された被処理流動体の流路において、処理用面１，２間の被処理流動体を介し、離反力と、接面圧力付与機構４が奏する接面圧力とが均衡した状態を形成することにより、両処理用面１，２間に、所望の微細化の処理を行うのに適した流体膜を形成する。このように、この微細化装置は、処理用面１，２間に強制的に流体膜を介することにより、従来の機械的な微細化装置では、不可能であった微小な間隔を、両処理用面１，２維持するを可能として、高精度な脱気処理を実現したのである。
【００５５】
言い換えると処理用面１，２間における流体膜の膜厚は、上述の離反力と接面圧力の調整により、所望の厚みに調整し、必要とする微細化の処理を行うことができる。従って、流体膜の厚みを小さくしようとする場合、離反力に対して相対的に接面圧力が大きくなるように、接面圧力或いは離反力を調整すればよく、逆に流体膜の厚みを大きくようとすれば、接面圧力に対して相対的に離反力が大きくなるように、離反力或いは接面圧力を調整すればよい。
接面圧力を増加させる場合、接面圧力付与機構４において、エア導入部４４から正圧（空気圧）を付与し、又は、スプリング４３を押圧力の大きなものに変更或いはその個数を増加させればよい。
離反力を増加させる場合、流体圧付与機構ｐの送り込み圧力を増加させ、或いは第２処理用面２や離反用調整面２３の面積を増加させ、またこれに加えて、第２処理用部２０の回転を調整して遠心力を増加させ或いはエア導入部４４からの負圧（空気圧）を付与すればよい。スプリング４３は、伸びる方向に押圧力を発する押し発条としたが、縮む方向に力を発する引き発条として、接面圧力付与機構４の構成の一部又は全部とすることが可能である。
【００５６】
さらに、接面圧力及び離反力の増加減少の要素として、上記の他に粘度などの被処理流動体の性状も加えることができ、このような被処理流動体の性状の調整も、上記の要素の調整として、行うことができる。
【００５７】
なお、離反力のうち、離反側の受圧面（即ち、第２処理用面２及び離反用調整面２３）に作用する流体圧は、メカニカルシールにおけるオープニングフォースを構成する力として理解される。
メカニカルシールにあっては、第２処理用部２０がコンプレッションリングに相当するが、この第２処理用部２０に対して流体圧が加えられた場合に、第２処理用部２を第１処理用部１から離反する力が作用する場合、この力がオープニングフォースとされる。
より詳しくは、上記の第１の実施の形態のように、第２処理用部２０に離反側の受圧面（即ち、第２処理用面２及び離反用調整面２３）のみが設けられている場合には、送り込み圧力の全てがオープニングフォースを構成する。なお、第２処理用部２０の背面側にも受圧面が設けられている場合（具体的には、後述する図２（Ｂ）及び図９の場合）には、送り込み圧力のうち、離反力として働くものと接面圧力として働くものとの差が、オープニングフォースとなる。
【００５８】
ここで、図２（Ｂ）を用いて、第２処理用部２０の他の実施の形態について説明する。
図２（Ｂ）に示す通り、この第２処理用部２０の収容部４１より露出する部位であり且つ内周面側に、第２処理用面２と反対側（上方側）を臨む近接用調整面２４が設けられている。
即ち、この実施の形態において、接面圧力付与機構４は、収容部４１と、エア導入部４４と、上記近接用調整面２４とにて構成されている。但し、接面圧力付与機構４は、上記収容部４１と、上記発条受容部４２と、スプリング４３と、エア導入部４４と、上記近接用調整面２４の少なくとも、何れか１つを備えるものであればよい。
【００５９】
この近接用調整面２４は、被処理流体に掛けた所定の圧力を受けて第１処理用面１に第２処理用面２を接近させる方向に移動させる力を発生させ、近接用接面圧力付与機構４の一部として、接面圧力の供給側の役目を担う。一方第２処理用面２（と前述の離反用調整面２３と）は、被処理流体に掛けた所定の圧力を受けて第１処理用面１から第２処理用面２を離反させる方向に移動させる力を発生させ、離反力（の一部について）の供給側の役目を担うものである。
近接用調整面２４と、第２処理用面２（及び離反用調整面２３）とは、共に前述の被処理流動体の送圧を受ける受圧面であり、その向きにより、上記接面圧力の発生と、離反力の発生という異なる作用を奏する。
【００６０】
この近接用調整面２４の面積Ａ１と、第２処理用部２０の第２処理用面２と離反側受圧面２３との合計面積Ａ２との面積比（Ａ１／Ａ２）は、バランス比Ｋと呼ばれ、上記のオープニングフォースの調整に重要である。
近接用調整面２４の先端と離反側受圧面２３の先端とは、共に環状の第２調整用部２０の内周面２５（先端線Ｌ１）に規定されている。このため、近接用調整面２４の基端線Ｌ２をどこに置くかの決定で、バランス比の調整が行われる。
即ち、この実施の形態において、被処理用流動体の送り出しの圧力をオープニングフォースとして利用する場合、第２処理用面２及び離反用調整面２３との合計面積を、近接用調整面２４の面積より大きいものとすることによって、その面積比率に応じたオープニングフォースを発生させることができる。
【００６１】
上記のオープニングフォースについては、上記バランスライン、即ち近接用調整面２４の面積Ａ１を変更することで、被処理流動体圧力（流体圧）により調整できる。
摺動面実面圧Ｐ（接面圧力のうち流体圧によるもの）は次式で計算される。
Ｐ＝Ｐ１×（Ｋ−ｋ）＋Ｐｓ
ここでＰ１は、被処理流動体の圧力（流体圧）を示し、Ｋは上記のバランス比を示し、ｋはオープニングフォース係数を示し、Ｐｓはスプリング及び背圧力を示す。
この（バランスラインの調整により）摺動面実面圧Ｐを調整することで処理用面１，２間を所望の微小隙間量（隙間幅）にし被処理流動体による流動体膜を形成させ所望の微細化処理を行うのである。
【００６２】
通常、両処理用面１，２間の流体膜の厚みを小さくすれば、被処理物（被処理流動体）をより細かくすることができる。逆に、当該流体膜の厚みを大きくすれば、処理が粗くなり単位時間あたりの処理量が増加する。従って、上記の摺動面実面圧Ｐ（以下面圧Ｐ）の調整により、両処理用面１，２間の間隔（隙間）を調整して、所望の微細化を行うことができる。
この関係を纏めると、上記の微細化処理を粗くする場合、バランス比を小さくし、面圧Ｐを小さくし、上記隙間を大きくして、上記膜厚を大きくすればよい。逆に、上記の微細化処理をより細かくする場合、バランス比を大きくし、面圧Ｐを大きくし、上記隙間を小さくし、上記膜厚を小さくする。
このように、接面圧力付与機構４の一部として、近接用調整面２４を形成して、そのバランスラインの位置にて、接面圧力の調整、即ち処理用面間の隙間を調整するものとしても実施可能である。
【００６３】
上記の隙間の調整には、既述の通り、他に、前述のスプリング４３の押圧力や、エア導入部４４の空気圧を考慮して行う。また、流体圧即ち被処理流動体の送り圧力の調整や、更に、第１処理用部１０（第１ホルダ１１）の回転（遠心力）の調整（も、重要な調整の要素（パラメータ）である。
上述の通り、この装置は、第２処理用部２０と、第２処理用部２０に対して回転する第１処理用部１０とについて、被処理流動体の送り込み圧力と当該回転遠心力、また接面圧力で圧力バランスを取り両処理用面に所定の流体膜を形成させ所望のせん断力を被処理流動体に与える構成にしている。またリングの少なくとも一方をフローティング構造とし芯振れなどのアライメントを吸収し接触による磨耗などの危険性を排除している。
【００６４】
この図２（Ｂ）の実施の形態においても、上記の調整用面を備える以外の構成については、図１に示す実施の形態と同様である。
また、図２（Ｂ）に示す実施の形態において、図９に示すように、上記の離反側受圧面２３を設けずに実施することも可能である。この場合、上記のバランス比Ｋは、近接用調整面２４の面積Ａ１と、第２処理用部２０の第２処理用面２の面積Ａ２との、面積比（Ａ１／Ａ２）となる。
図２（Ｂ）や図９に示す実施の形態のように、近接用調整面２４を設ける場合、近接用調整面２４の面積Ａ１を上記の面積Ａ２よりも大きいものとすること、即ちメカニカルシールにおけるアンバランス型とすることにより、オープニングフォースを発生させずに、逆に、被処理流動体に掛けられた所定の圧力は、全て接面圧力として働くことになる。このような設定も可能であり、この場合、他の離反力を大きくすることにより、両処理用面１，２を均衡させることができる。
【００６５】
上記の実施の形態において、既述の通り、スプリング４３は、摺動面（処理用面）に均一な応力を与える為に、取付け本数は、多いほどよい。但し、このスプリング４３については、図３（Ａ）へ示すように、シングルコイル型スプリングを採用することも可能である。これは、図示の通り、中心を環状の第２処理用部２０と同心とする１本のコイル型スプリングである。
第２処理用部２０と第２ホルダ２１との間のシールには、既述の通りＯリングを用いるのがよいが、このようなＯリングに代え、或いはＯリングと共に、図３（Ｂ）へ示すベローズ２６や、図３（Ｃ）へ示すダイアフラム２７を設けても実施可能である。
【００６６】
図４に示すように、第２ホルダ２１には、第２処理用面２（第２処理用部２０）とを、冷却或いは加熱して、その温度を調整することが可能な温度調整用ジャケット４６が設けられている。また、ケース３にも、同様の目的の温度調整用ジャケット３５が設けられている。
第２ホルダ２１の温度調整用ジャケット４６は、第２ホルダ２１内において、収容部４１の側面に形成された水回り用の空間であり、第２ホルダ２１の外部に通じる通路４７，４８と連絡している。通路４７，４８は、何れか一方が温度調整用ジャケット４６に、冷却用或いは加熱用の媒体を導入し、何れか他方が当該媒体を排出する。
また、ケース３の温度調整用ジャケット３５は、ケース３の外周を被覆する被覆部３４にて、ケース３の外周面と当該被覆部３４との間に設けられた、加熱用水或いは冷却水を通す通路である。
この実施の形態では、第２ホルダ２１とケース３とが、上記の温度調整用のジャケットを備えるものとしたが、第１ホルダ１１にも、このようなジャケットを設けて実施することが可能である。
【００６７】
接面圧力付与機構４の一部として、図１及び図２に示す構成と共に、図５に示すシリンダ機構７を設けて実施することも可能である。
このシリンダ機構７は、第２ホルダ２１内に設けられたシリンダ空間部７０と、シリンダ空間部７０を収容部４１と連絡する連絡部７１と、シリンダ空間部７０内に収容され且つ連絡部７１を通じて第２処理用部２０と連結されたピストン体７２と、シリンダ空間部７０上部に連絡する第１ノズル７３と、シリンダ空間部７０下部に第２ノズル７４と、シリンダ空間部７０上部とをピストン体７２との間に介された発条などの押圧体７５とを備えたものである。
【００６８】
ピストン体７２は、シリンダ空間部７０内にて上下に摺動可能であり、ピストン体７２の当該摺動にて第２処理用部２０が上下に摺動して、第１処理用面１と第２処理用面２との間の隙間を変更することができる。
具体的には、コンプレッサなどの圧力源（図示せず。）と第１ノズル７３とを接続し、第１ノズル７３からシリンダ空間部７０内のピストン体７２上方に空気圧（正圧）を掛けることにて、ピストン体７２を下方に摺動させ、第２処理用部２０を第１及び第２処理用面１，２間の隙間を狭める（閉じる方向に移動させる）ことができる。またコンプレッサなどの圧力源（図示せず。）と第２ノズル７４とを接続し、第２ノズル７４からシリンダ空間部７０内のピストン体７２下方に空気圧（正圧）を掛けることにて、ピストン体７２を上方に摺動させ、第２処理用部２０を第１及び第２処理用面１，２間の隙間を広げる（開く方向に移動させる）ことができる。このように、ノズル７３，７４にて得た空気圧で、接面圧力を調整できるのである。
【００６９】
収容部４１内における第２処理用部２０の上部と、収容部４１の最上部との間に余裕があっても、ピストン体７がシリンダ空間部７０の最上部７０ａと当接するよう設定することにより、このシリンダ空間部７０（の最上部７０ａ）が、両処理用面１，２間の隙間の幅の上限を規定する。即ち、ピストン体７とシリンダ空間部７０の最上部７０ａとが、両処理用面１，２の離反を抑止する離反抑止部（両処理用面１，２間の隙間の最大開き量を規制する機構）として機能する。
【００７０】
また、両処理用面１，２とが当接していなくても、ピストン体７がシリンダ空間部７０の最下部７０ｂと当接するよう設定することにより、このシリンダ空間部７０（の最下部７０ｂ）が、両処理用面１，２間の隙間の幅の下限を規定する。即ち、ピストン体７とシリンダ空間部７０の最下部７０ｂとが、両処理用面１，２の近接を抑止する近接抑止部（両処理用面１，２間の隙間の最小開き量を規制する機構）として機能する。
このように上記隙間の最大及び最小の開き量を規制しつつ、ピストン体７とシリンダ空間部７０の最上部７０ａとの間隔ｚ１（換言するとピストン体７とシリンダ空間部７０の最下部７０ｂとの間隔ｚ２）を上記ノズル７３，７４の空気圧にて調整する。
【００７１】
ノズル７３，７４は、別個の圧力源に接続されたものとしてもよく、一つの圧力源を切り換えて（つなぎ換えて）接続するものとしてもよい。
また圧力源は、正圧を供給するものでも負圧を供給するものでも何れでも実施可能である。真空などの負圧源と、ノズル７３，７４とを接続する場合、上記の動作は反対になる。
前述の他の接面圧力付与機構４に代え或いは前述の接面圧力付与機構４の一部として、このようなシリンダ機構７を設けて、被処理流動体の粘度や性状によりノズル７３，７４に接続する圧力源の圧力や間隔ｚ１，ｚ２の設定を行い流動体液膜の厚みを所望値にしせん断力をかけ微細化を行うことができる。特に、このようなシリンダ機構７にて、洗浄時や蒸気滅菌時など摺動部の強制開閉を行い洗浄や滅菌の確実性を上昇させることも可能とした。
【００７２】
図６（Ａ）〜（Ｃ）に示すように、第１処理用部１０の第１処理用面１に、第１処理用部１０の中心側から外側に向けて（径方向について伸びる）溝状の凹部１３…１３を形成して実施してもよい。この場合、図６（Ａ）へ示すように、凹部１３…１３は、第１処理用面１上をカーブして或いは渦巻き状伸びるものとして実施可能であり、図６（Ｂ）へ示すように、個々の凹部１３がＬ字状に屈曲するものであっても実施可能であり、また、図６（Ｃ）に示すように、凹部１３…１３ｆは真っ直ぐ放射状に伸びるものであっても実施可能である。
【００７３】
また、図６（Ｄ）へ示すように、図６（Ａ）〜（Ｃ）の凹部１３は、第１処理用面１の中心側に向かう程深いものとなるように勾配をつけて実施するのが好ましい。また、溝状の凹部１３は、連続したものの他、断続するものであっても実施可能である。
この様な凹部１３を形成することにより被処理流動体の吐出量（供給量）の増加または発熱量の減少への対応や、キャビテーションコントロールや流体軸受けなど効果がある。
上記の図６に示す各実施の形態において、凹部１３は、第１処理用面１に形成するものとしたが、第２処理用面２に形成するものとしても実施可能であり、更には、第１及び第２の処理用面１，２の双方に形成するものとしても実施可能である。
【００７４】
処理用面に、上記の凹部１３やテーパを設けない場合、若しくは、これらを処理用面の一部に偏在させた場合、処理用面１，２（平滑部）の面粗度が被処理流動体（流体）に与える影響は、上記（凹部１３を形成するもの）に比して、大きいものとなる。従って、このような場合、被処理流動体（流体）の粒子が小さくなればなるほど、面粗度を下げる（きめの細かいものとする）必要がある。特にナノサイズの超微化を行う場合その処理用面の面粗度については、既述の鏡面（鏡面加工を施した面）とするほうが所望のせん断力を与える上で有利である。
【００７５】
図７に示すように、導入部２２とは別に、第２処理用部２０に第２処理用面２に開口する供給通路２８を設け、当該供給通路２８を通じて他より、第１処理用面１と第２処理用面２との間の被処理流動体（流体）に直接違った物質または、被分断流動体の一部を投入するものとしても実施可能である。
【００７６】
図１に示す実施の形態において、不動の第２処理用部２０（第２ホルダ２１）に対して、第１処理用部１０（第１ホルダ１１）が回転駆動装置５より回転力を受けて回転するものであった。この他、図８に示すように、第２ホルダ２１を、別途の副回転駆動装置５２へ別途の回動軸５３（以下副回動軸５３と呼ぶ。）を介して接続して、第１ホルダ１１と逆方向に回転させるものとしても、より大きな剪断力を得る上で、効果的である。
この場合、前述の回転軸５０と上記の副回転軸５３とは、同心に配置される。そして。被処理流動体（流体）の導入部２２は、副回転駆動装置５２の内部及び副回転軸５３に設けられた中空の通路として形成され、ロータリージョイント（図示せず。）を利用して、被処理流動体（流体）を、副回転駆動装置５２の反対側（上方）より、第２処理用部２０の中心へ放出する。このようにケース３内に導入されて両処理用面１，２間にて処理された被処理流動体は、排出部３２より外部へ排出される。
【００７７】
この図８に示す装置では、回転速度を上げて大きなせん断力を得ようとする場合、極めて有効である。またこの場合、第１ホルダ１１と第２ホルダ２１の回転の速さ（回転数）は、同じとしても、異なるものとしても何れでも実施可能である。
この図８に示す実施の形態では、攪拌用羽根６は、設けていない。
【００７８】
図３乃至図８に示す実施の形態においても、特に明示した以外の構成については図１又は図２に示す実施の形態と同様である。
図１に示す実施の形態では、プレ分散を目的とする攪拌羽根６を有するものを示したが、この他、プレ分散としない場合は、このような攪拌羽根６を持たないものとしても実施可能である（図示しない）。
【００７９】
また、上記各実施の形態において、被処理流動体は、環状の第２処理用部２或いは第１処理用部１０の内側から外側に移動するものとした。この他、処理される被処理流動体を第２処理用部２或いは第１処理用部１０の外部からその内部へ移動させることによって、第１処理用面１と第２処理用面２との間を通過させるものとしてもよい（図示しない）。例えば、図１に示す装置の排出部を導入部として、導入部を排出部とするように変更して実施することも可能である。この場合、図１に示す排出部側から加圧する。但し、図１に示す導入部側から負圧で吸引するものとしても実施可能である。
【００８０】
このように、被処理流動体の移動を、第２処理用部２或いは第１処理用部１０の外部からその内部へ向けて行う場合、図６（Ｅ）に示すように、第１処理用部１０の第１処理用面１に、第１処理用部１０の外側から中心側に向けて伸びる溝状の凹部１３…１３を形成して実施することも可能である。このような図６（Ｅ）に示す凹部１３…１３を形成することにより、前述のバランス比については、１００％以上のアンバランス型とするのが好ましい。この結果、回転時に、上記の溝状の凹部１３…１３に動圧が発生し、両処理用面１，２は確実に非接触で回転でき、接触による磨耗などの危険がなくなる。
この図６（Ｅ）に示す実施の形態において、被処理流体の圧力による離反力は、凹部１３の内端１３ａにて発生する。
【００８１】
また、上記の各実施の形態において、ケース３内は全て密封されたものとしたが、この他、第１処理用部１０及び第２処理用部２０の内側のみ密封され、その外側は開放されたものとしても実施可能である。即ち、第１処理用面１及び第２処理用面２との間を通過するまでは流路は密封され、被処理流動体は送圧を全て受けるものとするが、通過後は、流路は開放され処理後の被処理流動体は送圧を受けないものとしてもよい。
加圧装置は、既述のとおり、コンプレッサを用いて実施するのが好ましいが、常に被処理流動体に所定の圧力を掛けることが可能であれば、他の手段を用いて実施することも可能である。例えば、被処理流動体の自重（重力）を利用して、常に一定の圧力を被処理流動体に付与するものとしても実施可能である。
【００８２】
上記の各実施の形態における微細化装置について総括すると、被処理流動体に所定の圧力を付与し、この所定の圧力のを受けた被処理流動体が流される密封された流体流路に、第１処理用面１及び第２処理用面２の少なくとも２つの接近離反可能な処理用面を接続し、両処理用面１，２を接近させる接面圧力を付与し、第１処理用面１と第２処理用面２とを相対的に回転させることにより、メカニカルシールにおいてシールに利用される流体膜を、被処理流動体を用いて発生させ、メカニカルシールと逆に（流体膜をシールに利用するのではなく）、当該流体膜を第１処理用面１及び第２処理用面２の間から敢えて漏らして、微細化の処理を、両面間１，２にて膜とされた被処理流動体に施し、回収することを特徴とするものである。
このような画期的な微細化処理の方法により、両処理用面１，２間の間隔を１μから１ｍｍとする調整、特に、１〜１０μとする調整を可能とした。
【００８３】
上記の実施の形態において、装置内は密閉された流体の流路を構成するものであり、被処理流動体（被処理物）を、脱気機の導入部側に設けた流体圧付与機構ｐにて、被処理流動体は加圧されたものであった。
この他、このような流体圧付与機構ｐを用いて加圧するものではなく、被処理流動体の流路は開放されたものであっても実施可能である。
図１０乃至図１３へ、そのような微細化装置付脱気機の一実施の形態を示す。図１０は脱気機の略縦断面図である。図１１は、その一部切欠要部略縦断面図である。図１２は、図１０に示す微細化装置が備える第１処理用部材１の平面図である。図１３は、上記脱気機の第１及び第２処理用部材１，２の一部切欠要部略縦断面図である。
【００８４】
この図１０乃至図１３に示す脱気機は、上記の通り、大気圧下で、脱気処理の対象となる流体（以下、上述してきた被処理流動体を、必要に応じて、このように単に「流体」と呼ぶ。）或いはこのような処理の対象物を搬送する流体が投入されるものである。
図１０に示す通り、この脱気機は、微細化装置Ｇと、減圧ポンプＱとを備えたものである。この微細化装置Ｇは、回転部材である第１処理用部材１０１と、当該処理用部材１０１を保持する第１ホルダ１１１と、固定部材である第２処理用部材１０２と、当該第２処理用部材１０２が固定された第２ホルダ１２１と、付勢機構１０３と、動圧発生機構１０４と、第１ホルダ１１１と共に第１処理用部材１０１を回転させる駆動部１０５と、ハウジング１０６と、流体を供給（投入する）する導入部１０７と、流体を減圧ポンプＱへ排出する排出部１０８とを備える。
【００８５】
上記の第１処理用部材１０１と第２処理用部材１０２は、夫々、円柱の中心をくり抜いた形状の環状体である。両処理用部材１０１，１０２は、両処理用部材１０１，１０２の夫々が呈する円柱の一底面を処理用面１１０，１２０とする部材である。
上記の処理用面１１０，１２０は、鏡面研磨された平坦部を有する。この実施の形態において、第２処理用部材１０２の処理用面１２０は、面全体に鏡面研磨が施された平坦面である。また、第１処理用部材１０１の処理用面１１０は、面全体を第２処理用部材１０２と同様の平坦面とするが、図３へ示す通り、平坦面中に、複数の溝１１２…１２を有する。この溝１１２…１２は、第１処理用部材１０１が呈する円柱の中心を中心側として円柱の外周方向へ、放射状に伸びる。上記の第１及び第２の処理用部材１０１，１０２の処理用面１１０，１２０についての、鏡面研磨は、面粗度Ｒａ０．０１〜１．０μｍとするのが好ましい。この鏡面研磨について、Ｒａ０．０３〜０．３μｍとするのがより好ましい。
処理用部材１０１，１０２の材質については、硬質且つ鏡面研磨が可能なものを採用する。処理用部材１０１，１０２のこの硬さについて、少なくともビッカース硬さ１５００以上、望ましくはビッカース硬さ１８００以上とする。また、線膨張係数が小さい素材を、採用するのが好ましい。微細化処理にて熱を発する部分と他の部分との間で、膨張率の差が大きいと歪みが発生して、適正なクリアランスの確保に影響するからである。
このような処理用部材１０１，１０２の素材として、特に、ＳＩＣ（シリコンカーバイト／ビッカース硬さ２０００〜２５００）、表面にＤＬＣ（ダイヤモンドライクカーボン／ビッカース硬さ３０００〜４０００）コーティングが施されたＳＩＣ、ＷＣ（タングステンカーバイト／ビッカース硬さ１８００）、表面にＤＬＣコーティングが施されたＷＣ、ＺｒＢ２やＢＴＣ，Ｂ４Ｃに代表されるボロン系セラミック（ビッカース硬さ４０００〜５０００）などを採用するのが好ましい。
【００８６】
ハウジング１０６は、有底の筒状体であり、上方が上記の第２ホルダ１２１に覆われている。第２ホルダ１２１は、下面に上記第２処理部材１０２が固定されており、上方に上記導入部７が設けられている。導入部１０７は、外部から流体や被処理物を投入するためのホッパ１７０を備える。
上記の駆動部１０５は、電動機などの動力源（図示せず。）と、当該動力源から動力の供給を受けて回転するシャフト１５０とを備える。
上記回転は、第１処理用部材１０１の直径を１００ｍｍとした場合毎分２万回転、第１処理用部材１０１の直径を２００ｍｍとした場合毎分１万回転、第１処理用部材１０１の直径を４００ｍｍとした場合毎分５千回転である。即ち、第１処理用部材１０１の回転時の周速度という観点では、約６３００メートル毎分であり、これは、処理用面１１０と処理用面１２０のドライコンタクトを防止できるために可能となったのである。
図１０に示すように、シャフト１５０は、ハウジング１０６の内部に配され上下に伸びる。そして、シャフト１５０の上端部に上記の第１ホルダ１１１が、設けられている。第１ホルダ１１１は、第１処理用部材１０１を保持するものであり、上記の通りシャフト１５０に設けられることにより、第１処理用部材１０１の処理用面１１０を第２処理用部材１０２の処理用面１２０に対応させる。
【００８７】
第１ホルダ１１１は、円柱状体であり、上面中央に、第１処理用部材１０１が固定されている。第１処理用部材１０１は、第１ホルダ１１１と一体となるように、固着され、第１ホルダ１１１に対してその位置を変えない。
一方、第２ホルダ１２１の上面中央には、第２処理用部材１０２を受容する受容凹部１２４が形成されている。
上記の受容凹部１２４は、環状の横断面を有する。第２処理用部材１０２は、受容凹部１２４と、同心となるように円柱状の受容凹部１２４内に収容される。
【００８８】
詳しくは、上記の受容凹部１２４内には、第２処理用部材１０２と別体の環状体１２３が収容される。受容凹部１２４の底面（天部１２４ａ）には、突起物１２７（ピン）が設けられている。環状体１２３の上記天部１２４ａを臨む面（上面）には、この突起物１２７を収容することが可能な凹部１２６が設けられている。突起物１２７は、環状体１２３の第２ホルダ１２１に対する回り止めである。突起物１２７は、凹部１２６内に余裕（遊び）を持つように収容される。
この環状体１２３の、受容凹部１２４の天部１２４ａと反対側（下方）に、第２処理用部材１０２が収容される。環状体１２３の天部１２４ａと反対側の面（下面）には、突起物１２５（ピン）が設けられている。第２処理用部材１０２の研磨用面１２０と反対側の面には、上記突起物１２５を収容する凹部１２２が設けられている。突起物１２５は、環状体１２３に対する第２処理用部材１０２の回り止めである。突起物１２５は、凹部１２２内に余裕（遊び）を持つように収容される。
【００８９】
そして、この第２ホルダ１２１が、上記の付勢機構１０３を備える。付勢機構１０３は、ゴム製のＯリングやバネなどの弾性体を用いるのが好ましい。具体的には、この実施の形態において、上記の環状体１２３について、その（上下）両端面間に複数の貫通孔１３１…１３１が設けられており、この貫通孔１３１…１３１に、付勢機構１０３となる複数のバネ１３０…１３０が収容される。これにて、第２処理用部材１０２の上面（処理用面１２０と反対側の面）と、受容凹部１２４の底（天面１２４ａ）との間に、第２処理用部材１０２を第１処理用部材１０１に向けて付勢する付勢機構１０３が介される。即ち、バネ１３０…１３０は、第２処理用部材１０２の処理用面１２０と反対側の面（底面）を押圧し、第１処理用部材１０１側（下方）に第２処理用部材１０２を付勢する。上記のバネ１３０…１３０は、受容凹部１２４の底１２４ａ上において、偏りなく分布する。
付勢機構１０３にバネを採用する場合、上記の通り複数のバネを用意するのに代え、第２処理用部材１０２の内周面の内径よりも大きく且つ第２処理用部材１０２の外径よりも小さな径を有するバネを一つ用意することによっても実施することができる。付勢機構１０３は、第２処理用部材１０２の処理用面１２０と反対側の面（図１０及び図１１において第２処理用部材１０２の上面）の各部に、偏りなく均一な付勢力を掛けることが可能なものであればよく、上記のバネに限定するものではない。
即ち、上記において、付勢機構１０３は、バネ１３１のみにて構成されたものとしたが、この他、付勢機構１０３は、上記のバネ１３１に代え、或いはバネ１３１と共に、空気などの流体圧を利用した付勢手段を用いて実施することも可能である。
具体的には、図１０に示すように、付勢機構１０３の一部として、高圧空気導入口１３２を設けて、付勢力の調整を行うものとしても実施可能である。この場合、付勢機構１０３は、高圧空気導入口１３２のみにて構成するものであってもよく、また、図１０に示す通り、バネ１３１と高圧空気導入口１３２とによって構成するものであってもよい。
【００９０】
一方、受容凹部１２４の内径は、第２処理用部材１０２の外径よりも大きく、これにて、上記の通り同心に配設した際、第２処理用部材１０２の外周面１０２ｂと受容凹部１２４の内周面との間には、図１１に示すように、隙間ｔ１が設定される。
同様に、第２処理用部材１０２の内周面１０２ａと受容凹部１２４の中心部外周面との間には、図１１に示すように、隙間ｔ２が設定される。
上記隙間ｔ１、ｔ２の夫々は、振動や偏芯挙動を吸収するためのものであり、動作寸法以上確保され且つシールが可能となる大きさに設定する。例えば、第１処理用部材１０１の直径が１００ｍｍから４００ｍｍの場合、当該隙間ｔ１、ｔ２の夫々は、０．１〜０．３ｍｍとするのが好ましい。
第１ホルダ１１１は、その内ホルダ１１５と共に、シャフト１５０へ一体に固定され、シャフト１５０と共に回転する。また、上記の突起物１２５，１２７によって、環状体１２３を介しても、第２ホルダ１２１に対して、第２処理用部材１０２は回らない。しかし、両処理用面１１０，１２０間に、微細化処理に必要な０．１〜１０ミクロンの微小な間隔ｔ（クリアランス／図１３（Ｂ）参照）を確保するため、受容凹部１２４の底面（天部１２４ａ）と環状体１２３の上記天部１２４ａを臨む面（上面）と間に隙間ｔ３が設けられる。この隙間ｔ３については、上記のクリアランスと共に、シャフト１５０の振れや伸びを考慮して設定する。
【００９１】
上記のように、隙間ｔ１〜ｔ３の設定により、第１処理用部材１０１は、第２処理用部材１０２に対して近接・離反する方向に可変であるのみならず、その処理用面１１０の中心や向き（方向ｚ１，ｚ２について）も可変としている。
即ち、この実施の形態において、付勢機構１０３と、上記隙間ｔ１〜ｔ３とが、フローティング機構を構成し、このフローティング機構によって、少なくとも第２処理用部材１０２の中心や傾きを、数ミクロンから数ミリの程度の僅かな量、可変としている。これにて、回転軸の芯振れ、軸膨張、第１処理用部材１０１の面振れ、振動を吸収する。
尚、上記突起物１２５と凹部１２２の間、及び突起物１２７と凹部１２６との間の遊びによって、第２処理用部材１０２の上記フローティング機構の動作は、確保され、これらの回り止めの機構に、当該動作が阻害されない。
【００９２】
第１処理用部材１０１の研磨用面１１０が備える前記の溝１１２について、更に詳しく説明する。溝１１２の後端は、第１処理用部材１０１の内周面１０１ａに達するものであり、その先端を第１処理用部材１０１の外側ｙ（外周面側）に向けて伸ばす。この溝１１２は、図１２（Ａ）へ示すように、その横断面積を、環状の第１処理用部材１０１の中心ｘ側から、第１処理用部材１０１の外側ｙ（外周面側）に向かうにつれて、漸次減少するものとしている。
溝１１２の左右両側面１１２ａ，１１２ｂの間隔ｗ１は、第１処理用部材１０１の中心ｘ側から、第１処理用部材１０１の外側ｙ（外周面側）に向かうにつれて小さくなる。また、溝１１２の深さｗ２は、図１２（Ｂ）へ示すように、第１処理用部材１０１の中心ｘ側から、第１処理用部材１０１の外側ｙ（外周面側）に向かうにつれて、小さくなる。即ち、溝１１２の底１１２ｃは、第１処理用部材１０１の中心ｘ側から、第１処理用部材１０１の外側ｙ（外周面側）に向かうにつれて、浅くなる。
このように、溝１１２は、その幅及び深さの双方を、外側ｙ（外周面側）に向かうにつれて、漸次減少するものとして、その横断面積を外側ｙに向けて漸次減少させている。そして、溝１１２の先端（ｙ側）は、行き止まりとなっている。即ち、溝１１２の先端（ｙ側）は、第１処理用部材１０１の外周面１０１ｂに達するものではなく、溝１１２の先端と外周面１０１ｂとの間には、外側平坦面１１３が介在する（この外側平坦面１１３は、処理用面１１０の一部である）。
この実施の形態において、このような溝１１２の左右両側面１１２ａ，１１２ｂと底１１２ｃとが流路制限部を構成している。この流路制限部と、第１処理用部材１０１の溝１１２周囲の平坦部と、第２処理用部材１０２の平坦部とが、動圧発生機構１０４を構成している。
但し、溝１１２の幅及び深さの何れか一方についてのみ、上記の構成を採るものとして、断面積を減少させるものとしてよい。その場合、上記の構成を採らない、左右両側面１１２ａ，１１２ｂ或いは底１１２ｃは、流路制限部とならず、動圧発生機構１０４の構成要素とならない。
上記の動圧発生機構１０４は、第１処理用部材１０１の回転時、両処理用部材１０１，１０２間を通り抜けようとする流体によって、両処理用部材１０１，１０２の間に所望の微小間隔を確保することを可能とする、両処理用部材１０１，１０２を離反させる方向に働く力を発生させる。このような動圧の発生により、両処理用面１１０，１２０間に、０．１〜１０μｍの微小間隔を発生させることができる。このような微小間隔は、処理の対象によって、調整し選択すればよいのであるが、１〜６μｍとするのが好ましく、より好ましくは、１〜２μｍである。この脱気機においては、上記のような微小間隔による従来にない微細な気泡等の脱泡等の処理が可能である。
【００９３】
溝１１２…１１２の夫々は、真っ直ぐ、中心ｘ側から外側ｙに伸びるものであっても実施可能である。但し、この実施の形態において、図１２（Ａ）に示すように、第１処理用部材１０１の回転方向ｒについて、溝１１２の中心ｘ側が、溝１１２の外側ｙよりも、先行するように（前方に位置するように）、湾曲して溝１１２を伸びるものとしている。
このように溝１１２…１１２が湾曲して伸びることにより、動圧発生機構１０４による離反力の発生をより効果的に行うことができる。
【００９４】
次に、この脱気機の動作について説明する。
導入部１０７（ホッパ１７０）から投入された、被処理物である流体Ｒは、環状の第２処理用部材１０２の中空部（中央）を通り、第１処理用部材１０１の回転よる遠心力を受けた流体は、両処理用部材１０１，１０２間に入り、回転する第１処理用部材１０１の処理用面１１０と、第２処理用部材１０２の処理用面１２０との間にて、微細化の処理が行われ、その後、両処理用部材１０１，１０２の外側に出て、排出部１０８から減圧ポンプＱ側へ排出される。
上記において、環状の第２処理用部材１０２の中空部に入った流体Ｒは、図１３（Ａ）へ示すように、先ず、回転する第１処理用部材１０１の溝１１２に入る。一方、鏡面研磨された（平坦部である）両処理用面１１０，１２０は、空気や窒素などの気体を通しても気密性が保たれている。従って、回転による遠心力を受けても、そのままでは、付勢機構１０３によって、押し合わされた両処理用面１１０，１２０の間に、溝１１２から流体は入り込むことはできない。しかし、流路制限部として形成された溝１１２の上記両側面１１２ａ，１１２ｂや底１１２ｃに、流体Ｒは徐々に突き当たり、両処理用面１１０，１２０を離反させる方向に働く動圧を発生させる。これによって、流体Ｒが溝１１２から平坦面に滲み出し、両処理用面１１０，１２０の間に微小間隔（クリアランス）を確保することができる。そして、このような鏡面研磨された平坦面の間で、微細化の処理が行われる。また上述の溝１１２の湾曲が、より確実に流体へ遠心力を作用させ、上記動圧の発生をより効果的にしている。
このように、この脱気機は、動圧と付勢機構１０３による付勢力との均衡にて、両鏡面（処理用面１１０，１２０）間に、微細な間隔（クリアランス）を確保することを可能とした。そして、上記の構成により、当該微細間隔は、１μｍ以下の超微細なものとすることができる。
また、上記フローティング機構の採用により、処理用面１１０，１２０間のアライメントの自動調整が可能となり、回転や発生した熱による各部の物理的な変形に対して、処理用面１１０，１２０間の各位置における、クリアランスのばらつきを、抑制し、当該各位置における上記の小間隔の維持を可能とした。
【００９５】
尚、上記の実施の形態において、フローティング機構は、第２ホルダ１２１にのみ設けられた機構であった。この他、第２ホルダ１２１に代え、或いは第２ホルダ１２１と共に、フローティング機構を、第２ホルダ１２１にも設けるものとして実施することも可能である。
【００９６】
図１４乃至図１６に、上記の溝１１２について、他の実施の形態を示す。
図１４（Ａ）（Ｂ）に示すように、溝１１２は、流路制限部の一部として、先端に平らな壁面１１２ｄを備えるものとして実施することができる。また、この図１４に示す実施の形態では、底１１２ｃにおいて、第１壁面１１２ｄと、内周面１０１ａとの間に段差１１２ｅが設けられており、この段差１１２ｅも流路制限部の一部を構成する。
図１５（Ａ）（Ｂ）に示すように、溝１１２は、複数に分岐する枝部１１２ｆ…１１２ｆを備えるものとし、各枝部１１２ｆがその幅を狭めることにより流路制限部を備えるものとしても実施可能である。
図１４及び図１５の実施の形態においても、特に示した以外の構成については、図１０乃至図１３に示す実施の形態と同様である。
【００９７】
また、上記の各実施の形態において、溝１１２の幅及び深さの少なくとも何れか一方について、第１処理用部材１０１の内側から外側に向けてその寸法を漸次小さくすることにて、流路制限部を構成するものとした。この他、図１６（Ａ）や図１６（Ｂ）へ示す通り、溝１１２の幅や深さを変化させずに、溝１１２に終端面１１２ｆを設けることによって、このような溝１１２の終端面１１２ｆを流路制限部とすることができる。図１２、図１４及び図１５に示す実施の形態において示した通り、動圧発生は、溝１１２の幅及び深さを既述の通り変化させることによって溝１１２の底や両側面を傾斜面とすることで、この傾斜面が流体に対する受圧部になり動圧を発生させた。一方図１６（Ａ）（Ｂ）に示す実施の形態では、溝１１２の終端面が流体に対する受圧部になり動圧を発生させる。
また、この図１６（Ａ）（Ｂ）に示す場合、溝１１２の幅及び深さの少なくとも何れか一方の寸法を漸次小さくすることも併せて実施することができる。
尚、溝１１２の構成について、上記の図１２、図１４乃至図１６に示すものに限定するものではなく、他の形状の流路制限部を備えたものとして実施することが可能である。
例えば、図１２、図１４乃至図１６示すものでは、溝１１２は、第１処理用部材１０１の外側に突き抜けるものではなかった。即ち、第１処理用部材１０１の外周面と、溝１１２との間には、外側平坦面１１３が存在した。しかし、このような実施の形態に限定するものではなく、上述の動圧を発生されることが可能であれば、溝１１２は、第１処理用部材１０１の外周面側に達するものであっても実施可能である。
例えば、図１６（Ｂ）に示す第１処理用部材１０１の場合、点線で示すように、溝１１２の他の部位よりも断面積が小さな部分を、外側平坦面１１３に形成して実施することができる。
また、溝１１２を、上記の通り内側から外側へ向けて漸次断面積を小さくするように形成し、溝１１２の第１処理用部材１０１の外周に達した部分（終端）を、最も断面積が小さいものとすればよい（図示せず）。但し、動圧を効果的に発生させる上で、図１２、図１４乃至図１６に示すように、溝１１２は、第１処理用部材１０１の外周面側に突き抜けないほうが好ましい。
【００９８】
上記の各実施の形態では、第１処理用部材１０１のみが回転し、第２処理用部材１０２は、回転しないものとした。この他、第１処理用部材１０１のみならず、第２処理用部材１０２も回転するものとしても実施可能である。この場合、第２処理用部材１０２は、第１処理用部材１０１の回転方向ｒに対し、逆方向に回転するものとする。
このような脱気機として、例えば、図１７に示すように、既述の駆動部１０５とは別個の、シャフト１５０ａを備えた駆動部１０５ａを設けて、ハウジング１０６と独立して形成された第２ホルダ１２１を回転させればよい。この場合、駆動部５ａのシャフト１５０ａを中空として、このシャフト１５０内部を導入部１０７とする。
図１７に示す脱気機では、図１０及び図１１に示す脱気機と同様、フローティング機構は、第２ホルダ１２１が備えるものである。この他、第２ホルダ１２１に代え或いは第２ホルダ１２１と共に第１ホルダ１１１もフローティング機構を備えるものとしても実施可能である。
【００９９】
ここで、上記図１０乃至図１７に示す各実施の形態について、総括する。
この脱気機は、平坦処理用面を有する回転部材と同じく平坦処理用面を有する固定部材とをそれらの平坦処理用面で同心的に相対向させ、回転部材の回転下に固定部材の開口部より被粉砕原料を供給しながら両部材の対向平面処理用面間より該被粉砕原料を微細化して処理する脱気機において機械的にクリアランスを調整するのではなく、回転部材に増圧機構を設けてその圧力発生によりクリアランスを保持しかつ機械的クリアランス調整では、不可能であった１〜６μｍの微小クリアランスを可能とし微細化能力が著しく向上出来たものである。
即ち、この脱気機は、回転部材と固定部材がその外周部に平坦処理用面を有しその平坦処理用面において、面上の密封機能を有することで流体静力学的（ハイドロスタティック）一流体動力学的（ハイドロダイナミック）な力、或いは、エアロスタティック−エアロダイナミックな力を発生させる高速回転式の脱気機を提供しようとするものである。上記の力は、上記密封面間に僅かな間隙を発生させ、また非接触で機械的に安全で高度な微細化機能を有した脱気機を提供することができる。この僅かな隙間が形成されうる要因は、一つは、回転部材の回転速度によるものであり、もう一つは、被処理物（流体）の投入側と排出側の圧力差によるものである。投入側に圧力付与機構が付設されている場合は、投入側に圧力付与機構が付設されていない場合即ち大気圧下で被処理物（流体）を投入される場合、圧力差が無いわけであるから回転部材の回転速度だけで密封面間の分離を生じさせる必要がある。これは、ハイドロダイナミックもしくはエアロダイナミック力として知られている。
【０１００】
減圧ポンプＱ（図１０）を上記微細化装置Ｇの排出部に接続したものを示したが、既述の通りハウジング１０６（ケース３）を設けず、また減圧ポンプＱを設けずに、図１８（Ａ）に示すように脱気機を減圧用のタンクＴとして、当該タンクＴの中に、微細化装置Ｇを配設することにて実施することが可能である。
この場合、タンクＴ内を真空或いは真空に近い状態に減圧することにて、微細化装置Ｇにて微細化された被処理物をタンクＴ内に霧状に噴射せしめ、タンクＴの内壁にぶつかって流れ落ちる被処理物を回収すること、或いはこのような流れ落ちる被処理物に対して気体（蒸気）として分離されタンクＴ内上部に充満するものを回収することにて、処理後の目的物を得ることができる。
また、減圧ポンプＱを用いる場合も、図１８（Ｂ）へ示すように、微細化装置Ｇに、減圧ポンプＱを介して、気密なタンクＴを接続することにより、当該タンクＴ内にて、処理後の被処理物を霧状にして、目的物の分離（抽出）を行うことができる。
更に、図１８（Ｃ）へ示すように、減圧ポンプＱを直接微細化装置Ｇに接続し、当該タンクＴに、減圧ポンプＱと、減圧ポンプＱとは別の流体Ｒの排出部とを接続して、目的物の分離を行うことができる。この場合、気化部については、減圧ポンプＱに吸いよせられ、液体Ｒ（液状部）は排出部より、気化部とは別に排出される。
【０１０１】
【発明の効果】
本願第１乃至２１の発明の実施によって、微細化のために、従来のパンチングプレートやメッシュという構成を排除して、これら部材の面倒な洗浄という作業を不要とした。そして、パンチングプレートやメッシュでは、不可能であった微細な気泡の抽出（排除）を可能とした。
特に、本願第４乃至第８の発明の実施によって、被粉砕原料を流体とし、或いは被粉砕原料を流体中に投入する場合において、上下二枚の部材（処理用部材）のクリアランスを１５μｍ以下にすることを実現した。
また、本願第９〜２１の発明の実施によって、不純物の混入がなく、被処理流動体の適応粘度域が広く且つ被処理流動体に対して大きなせん断力を与えられると共に、高い精度で微細化が可能な脱気機及び脱気方法を提供することを可能とし、高精度で微細化が出来しかも生産性の高い、シンプルな構造の脱気機及び脱気方法を提供し得た。
即ち、メカニカルシールにおける軸封の機構を、微細化のための手段として利用することにより、高精度で微細化が出来しかも生産性の高い、シンプルな構造の脱気機及び脱気方法を提供し得た。特にこの発明の実施によって、被処理流動体の送り込み圧力（流体圧）や、コンプレッションリング（第２処理用部）の背圧またメイティングリング（第１処理用部）の回転などで被処理流動体の粘度域に制限を受けず、被処理流動体膜の厚みを微小量から調整でき、従来の装置では、不可能であった数ｎｍ（ナノメートル）程度の微細化をも可能としかつ、微振動やアライメント、軸方向変位など緩衝装置を設けているため不純物など発生無くして高度な微細化状態を得ることが出来る。また簡単な機構であるため、装置の制御に熟練を要せず、無人化、自動化も容易であり、装置は安定稼動し生産性が高く安価に製作できる。
【図面の簡単な説明】
【図１】本願発明の一実施の形態に係る装置の一部切欠縦断面図である。
【図２】（Ａ）は上記装置の要部略縦断面図であり、（Ｂ）は他の実施の形態の要部略縦断面図である。
【図３】（Ａ）は更に他の実施の形態の要部略縦断面であり、（Ｂ）は又他の実施の形態の要部略縦断面図であり、（Ｃ）は又更に他の実施の形態の要部略縦断面図である。
【図４】更に又他の実施の形態の要部略縦断面図である。
【図５】又他の実施の形態の要部略縦断面図である。
【図６】（Ａ）は更に他の実施の形態の要部略横断面であり、（Ｂ）は又他の実施の形態の要部略横断面図であり、（Ｃ）は又更に他の実施の形態の要部略横断面図であり、（Ｄ）は又他の実施の形態の一部切欠要部略縦断面図であり、（Ｅ）は更に他の実施の形態の要部略横断面である。
【図７】更に他の実施の形態の要部略縦断面図である。
【図８】又更に他の実施の形態の縦断面図である。
【図９】又更に他の実施の形態の要部略縦断面図である。
【図１０】本願発明の、更に他の実施の形態に係る脱気機の一部切欠縦断面図である。
【図１１】図１０に示す脱気機の、第１処理用部材１及び第１ホルダ１１を中心とする要部略縦断面図である。
【図１２】（Ａ）は図１０に示す上記脱気機の第１処理用部材１の平面図であり、（Ｂ）はその要部縦断面図である。
【図１３】（Ａ）は図１０に示す脱気機の第１及び第２処理用部材１，２の要部縦断面図であり、（Ｂ）は微小間隔が開けられた上記第１及び第２処理用部材１，２の要部縦断面図である。
【図１４】（Ａ）は第１処理用部材１の他の実施の形態の平面図であり、（Ｂ）はその要部略縦断面図である。
【図１５】（Ａ）は第１処理用部材１の、更に他の実施の形態の平面図であり、（Ｂ）はその要部略縦断面図である。
【図１６】（Ａ）は第１処理用部材１のまた他の実施の形態の平面図であり、（Ｂ）は第１処理用部材１の更にまた他の実施の形態の平面図である。
【図１７】脱気機の他の実施の形態を示す一部切欠略縦断面図である。
【図１８】（Ａ）（Ｂ）（Ｃ）は、夫々、微細化後の被処理物の分離方法について、蒸気以外の実施の形態を示す説明図である。
【符号の説明】
１第１処理用部材
２第２処理用部材
３付勢機構
４動圧発生機構[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a deaerator with a miniaturization device and a deaeration method by miniaturization.
[0002]
[Prior art]
As a deaerator for performing a deaeration process on an object to be processed, for example, there is a deaerator for removing bubbles in a liquid from the liquid.
The defoaming machine includes a cylindrical outer rotor disposed in a tank (vessel) having a vacuum inside, a cylindrical inner rotor disposed concentrically with the outer rotor inside the outer rotor, and rotated by a motor. And the inner rotor is connected to the shaft, and rotates relatively to the outer rotor.
The peripheral surface of the cylindrical inner rotor is formed by a punching plate. The peripheral surface of the cylindrical outer rotor is formed of a screen finer than the punching plate.
[0003]
The operation of the defoamer will now be described.
The inside of the shaft is a passage for a liquid for performing a defoaming process, and the liquid is introduced into the inner rotor through the shaft. As described above, when the liquid passes through the inside of the high-speed rotating shaft, the liquid phase is centrifuged toward the inner wall surface of the shaft, and the bubbles are centrifuged toward the center of the shaft. At this time, the air bubbles are drawn into the vessel under vacuum, expanded and degassed prior to the liquid phase.
Subsequently, the liquid phase introduced into the inner rotor generates a thin film effect by centrifugal force due to rotation, and defoaming proceeds. Then, it passes through the punching plate of the inner rotor and is subdivided. Such subdivision promotes defoaming. Further, the liquid passing through the punching plate contacts the outer rotor and passes through the screen. The liquid that has passed through the screen is atomized in a vacuum, collides with the inner wall of the vessel, flows down the inner wall of the vessel, and completes defoaming.
[0004]
As described above, this defoamer mainly performs the miniaturization of the processing object by passing the processing object through the above-mentioned punching plate or screen. Such miniaturization promotes the divergence of air bubbles contained in the object, and the deaerator intends to perform the deaeration process smoothly by utilizing such an action.
The size of the bubbles that can be defoamed by the above miniaturization largely depends on the fineness of the punching plate and the screen.
[0005]
However, there is a physical limit to making the fineness of the punching plate or the screen fine, and it is not suitable for removing air bubbles much finer than the fineness of the punching plate or the screen. That is, in the defoaming machine having such a structure, miniaturization (atomization) of 10 to 20 μm is a limit, and ultra-miniaturization of 1 to 2 μm is impossible.
Further, when the object to be processed is an emulsion or a suspension, it is necessary to deaerate an emulsion or a suspension that has been made into a emulsion or a suspension with a high-speed stirrer or a disperser in advance.
In addition, the punching plates and screens become dirty and clogged due to the previous processing. Therefore, it is necessary to sufficiently wash these punching plates and screens before using the defoaming machine in the next defoaming process. There is.
Such punching plates and screens have poor cleaning properties, and cleaning (removing dirt) is an extremely troublesome operation.
[0006]
[Problems to be solved by the invention]
The invention of the present application has been made based on the above circumstances, and by providing a deaerator having a mechanism for completely miniaturization that is completely different from the conventional mechanism for micronization described above, further miniaturization of the processing target is achieved. The above-described problem is solved by enabling removal of fine air bubbles which has been impossible in the past and eliminating the need for troublesome cleaning of a punching plate and a screen.
[0007]
[Means for Solving the Problems]
The deaerator with a miniaturization device according to the first invention of the present application is for miniaturizing an object to be processed and performing deaeration processing such as defoaming, and has the following configuration.
The miniaturization apparatus includes first and second at least two disks which are disposed so as to face each other and at least one of which rotates with respect to the other, and an interval maintaining mechanism which maintains a predetermined interval between the two disks. Each of the opposing surfaces of both disks is a processing surface subjected to mirror polishing. Further, this miniaturization apparatus includes an inflow portion for introducing the object to be processed between the processing surfaces, and an outflow portion for discharging the object to be processed from both the processing surfaces, and the rotation between the two processing surfaces by the rotation described above. In the above, a process of miniaturizing the object is performed. Here, the term “micronization treatment” refers to not only the case where the surface area of the object to be treated is increased, but also the case where the particle size and the droplet size of atomization are reduced, for example, emulsions, suspensions (dispersions) and liposomes. In this case, the method includes making the particle diameter fine.
The deaerator is capable of evaporating and extracting a part of the components of the object to be treated by pulverization, and includes a defoaming device, a degassing device, a demonomerizing device, a desolvating device and the like.
[0008]
The deaerator with a miniaturization device according to the second invention of the present application miniaturizes an object to be processed and performs deaeration processing such as defoaming, and employs the following configuration.
The miniaturization device includes first and second at least two processing members, a floating mechanism, an urging mechanism, and a separation mechanism. Each of the two processing members is provided with a processing surface disposed so as to face each other, and at least one of the two processing members is rotated with respect to the other, so that the fine processing is performed between the two processing surfaces. Processing is performed. Each of the two processing surfaces is subjected to mirror polishing, and an object to be processed is supplied between the two processing surfaces. The floating mechanism is provided on at least one of the first and second processing members, allows the two processing members to approach and separate from each other, and generates the floating mechanism on at least one of the two processing members by rotation. The eccentric behavior is absorbed by at least the other of the two processing members. The urging mechanism acts in a direction in which both processing members are brought close to each other, and the separation mechanism acts in a direction in which both processing members are separated from each other. The separating mechanism can secure a minute interval between the processing members at least during the rotation of the processing member against the action of the urging mechanism.
[0009]
The deaerator with a finer device according to the third invention of the present application is the deaerator with a finer device according to the second invention of the present application, and is a processed product that has passed between the first and second processing members. And a decompression pump for extracting water.
[0010]
The deaerator with a miniaturization device according to the fourth invention of the present application is a first and second at least two deaerators that are disposed so as to face each other and perform a miniaturization process by rotating at least one of them relative to the other. The processing members 101 and 102 are provided, a fluid is supplied between the two processing members 101 and 102 from the center of the rotation, and the fluid is discharged to the outside of the first and second processing members 101 and 102. Is what you do. At least one of the first and second processing members 101 and 102 is disposed so as to be able to approach and separate from the other. An urging mechanism 103 is provided which acts in a direction in which the two processing members 101 and 102 are at least brought close to each other. The first and second processing members 101 and 102 are provided with a dynamic pressure that applies a force for causing a fluid to pass between the two processing members 101 and 102 in a direction in which the two processing members 101 and 102 are separated from each other. A generating mechanism 104 is provided.
[0011]
The deaerator with a miniaturization device according to the fifth invention of the present application is a first and second at least two deaerators that are disposed so as to face each other and perform a miniaturization process by rotating at least one of them relative to the other. The processing members 101 and 102 are provided, a fluid is supplied between the two processing members 101 and 102 from the center of the rotation, and the fluid is discharged to the outside of the first and second processing members 101 and 102. Is what you do. At least one of the first and second processing members 101 and 102 is disposed so as to be able to approach and separate from the other. An urging mechanism 103 is provided which acts in a direction in which the two processing members 101 and 102 are at least brought close to each other. Each of the processing members 101 and 102 has a flat portion subjected to mirror polishing, and one of the processing members has a groove in the flat portion. The above-mentioned groove extends from the center side of the processing member toward the outside of the processing member, and passes through the groove to pass through the groove from the center of the processing member to the outside of the processing member. And a flow path restricting unit that restricts
[0012]
In the deaerator with a finer device according to the sixth invention of the present application, in the deaerator with the finer device according to the fifth invention of the present application, the flow path restricting portion may be used for processing from the center side of rotation. It is formed by gradually reducing the cross-sectional area of the groove toward the outside of the member.
[0013]
The deaerator with a finer device according to the seventh invention of the present application is the deaerator with a finer device according to any of the fourth to sixth inventions, wherein the first and second processing At least one of the members 101 and 102 includes a floating mechanism. The floating mechanism enables the approach and separation between the processing members 101 and 102, and rotates at least one of the processing members 101 and 102. Is characterized in that at least the other of the two processing members 101 and 102 absorbs the eccentric behavior that has occurred.
[0014]
The deaerator with a miniaturization device according to the eighth invention of the present application is a first and second at least two degassing units that are disposed so as to face each other and perform a miniaturization process by rotating at least one of them relative to the other. The processing members 101 and 102 are provided, and a fluid for transporting the workpiece or supplying the fluid to be the workpiece itself is supplied between the two processing members 101 and 102 from the center of the rotation. And is discharged to the outside of the second processing members 101 and 102. A floating mechanism, an urging mechanism, and a dynamic pressure generating mechanism are provided. The floating mechanism arranges one of the first and second processing members 101 and 102 so as to be able to approach and separate from the other, and adjusts the direction of the rotation axis of both the processing members 101 and 102. It allows you to change. The urging mechanism urges the processing members 101 and 102 at least in a direction to approach them. The dynamic pressure generating mechanism applies a force that causes the fluid to pass between the two processing members 101 and 102 in a direction in which the two processing members 101 and 102 are separated from each other, so that the fluid is generated between the two processing members 101 and 102. The interval is a minute interval of 0.1 to 10 μm.
[0015]
A deaerator with a micronizing device according to a ninth aspect of the present invention includes a fluid pressure applying mechanism for applying a predetermined pressure to a processing target fluid, and a sealed fluid passage through which the processing target fluid at the predetermined pressure flows. , And at least two processing units of a second processing unit 20 which can be relatively approached to and separated from the first processing unit 10, and the processing units 10, 20 , At least two of the first processing surface 1 and the second processing surface 2 provided at positions facing each other, and the first processing unit 10 and the second processing unit 20 are relatively rotated. And a rotary drive mechanism for performing the fine processing of the fluid to be processed between the processing surfaces 1 and 2. At least the second processing unit 20 of the first processing unit 10 and the second processing unit 20 includes a pressure receiving surface set to a predetermined balance ratio, and at least a part of the pressure receiving surface is the second pressure receiving surface. It is composed of two processing surfaces 2. The fluid to be processed having a predetermined pressure is passed between the first processing surface 1 and the second processing surface 2 which are relatively rotatable and relatively rotatable. By passing between the processing surfaces 1 and 2 while forming a fluid film, a desired state of miniaturization of the processing target fluid is obtained.
[0016]
The deaerator with a finer device according to the tenth invention of the present application is the deaerator with the finer device according to the ninth invention of the present application, wherein at least one of the first processing surface 1 and the second processing surface 2 is provided. On the other hand, it is characterized by having a buffer mechanism for adjusting micro vibration and alignment.
[0017]
The deaerator with a finer device according to the eleventh invention of the present application is the deaerator with a finer device according to the ninth or tenth aspect of the present invention, wherein the first processing surface 1 and the second processing surface 2 are provided. A mechanism for adjusting the displacement of one or both of them in the axial direction due to wear or the like and maintaining the thickness of the fluid film between the two processing surfaces 1 and 2 It is characterized by.
[0018]
A deaerator with a finer device according to a twelfth invention of the present application is the deaerator with a finer device according to any one of the ninth to eleventh inventions, wherein the mechanism for adjusting the pressure applied to the fluid to be processed is provided. It is characterized by having.
[0019]
A deaerator with a finer device according to a thirteenth invention of the present application is the deaerator with a finer device according to any one of the ninth to twelfth inventions, wherein the first processing surface 1 and the second It is characterized in that it includes a separation prevention unit that defines the maximum distance between the processing surfaces 2 and the further processing surfaces 1 and 2.
[0020]
A deaerator with a finer device according to a fourteenth invention of the present application is the deaerator with a finer device according to any one of the ninth to thirteenth inventions, wherein the first processing surface 1 and the second It is characterized in that it is provided with a proximity suppressing unit that regulates a minimum distance between the processing surfaces 2 and 2 and suppresses the proximity of the two processing surfaces 1 and 2 beyond that.
[0021]
A deaerator with a finer device according to a fifteenth invention of the present application is the deaerator with a finer device according to any of the ninth to fourteenth inventions, wherein the first processing surface 1 and the second processing Both of the working surfaces 2 rotate in directions opposite to each other.
[0022]
The deaerator with a finer device according to the sixteenth invention of the present application is the deaerator with a finer device according to any one of the ninth to fifteenth inventions, wherein the first processing surface 1 and the second 2 A temperature adjusting jacket for adjusting the temperature of one or both of the processing surfaces 2 is provided.
[0023]
The deaerator with a finer device according to the seventeenth invention of the present application is the deaerator with a finer device according to any of the ninth to sixteenth inventions, wherein the first processing surface 1 and the second At least a part of one or both of the processing surfaces 2 is mirror-finished.
[0024]
The deaerator with a finer device according to the eighteenth aspect of the present invention is the deaerator with a finer device according to any one of the ninth to seventeenth aspects of the present invention, wherein the first processing surface 1 and the second One or both of the processing surfaces 2 has a concave portion.
[0025]
The deaerator with a finer device according to the nineteenth invention of the present application is the deaerator with the finer device according to any one of the ninth to eighteenth inventions, wherein the deaerator with a separate device independent of the fluid passage is provided. An introduction path is provided, and at least one of the first processing surface 1 and the second processing surface 2 is provided with an opening communicating with the introduction path. It can be introduced into the fluid to be treated.
[0026]
A deaerator with a micronizing device according to a twentieth aspect of the present invention includes a fluid pressure applying mechanism for applying a predetermined pressure to a processing target fluid, and a sealed fluid passage through which the processing target fluid at the predetermined pressure flows. At least two of the first processing surface 1 and the second processing surface 2 that are relatively close to and separated from each other, and a contact surface that applies a contact surface pressure between the two processing surfaces 1 and 2 By providing a pressure applying mechanism and a rotation drive mechanism for relatively rotating the first processing surface 1 and the second processing surface 2, the fluid to be processed is provided between the two processing surfaces 1 and 2. Is performed. In this deaerator with a micronizing device, a fluid to be processed having a predetermined pressure is passed between the first processing surface 1 and the second processing surface 2 that relatively rotate while the contact surface pressure is applied. Thus, the fluid to be processed passes between the processing surfaces 1 and 2 while forming a fluid film having a predetermined thickness, thereby obtaining a desired state of miniaturization of the fluid to be processed. is there.
[0027]
In the degassing method by micronization according to the twenty-first aspect of the present invention, a predetermined pressure is applied to the target fluid, and the target fluid is subjected to the predetermined pressure in a sealed fluid flow path through which the target fluid flows. At least two processing surfaces that can be relatively approached to and separated from each other, ie, the first processing surface 1 and the second processing surface 2, are connected to each other, and a contact surface pressure is applied to bring the two processing surfaces 1 and 2 closer to each other. The processing surface 1 and the second processing surface 2 are relatively rotated, and the processing target fluid is passed between the processing surfaces 1 and 2 to perform the processing for miniaturization of the processing target fluid. In this deaeration method, at least the predetermined pressure applied to the fluid to be processed is used as a separating force for separating the two processing surfaces 1 and 2, and the separating force and the contact surface pressure are used as the processing surfaces 1 and 2. The two processing surfaces 1 and 2 are equilibrated with each other through a fluid to be processed, so that the two processing surfaces 1 and 2 are maintained at a predetermined minute interval, and the fluid to be processed is formed into a fluid film having a predetermined thickness. By passing between the two, a desired state of miniaturization is obtained.
[0028]
According to the first to twenty-first aspects of the present invention having the above-described configuration, in a deaerator with a miniaturization device, which performs deaeration processing such as defoaming by miniaturizing an object to be processed, at least one of two processing surfaces is rotated. Thus, a new means of miniaturization of miniaturizing the object to be processed is provided between the other processing surface and the conventional punching plate for miniaturization. By eliminating the configuration of a mesh and a mesh, the troublesome work of cleaning these members is not required.
Then, it was possible to extract (eliminate) fine bubbles, which were impossible with a punching plate or a mesh. This deaerator also has two advantages. One of the points is the droplet diameter when ejected in the form of a mist, which means that the surface area exposed to the vacuum atmosphere, that is, the area of the interface can be increased (increased) and the degassing ability can be increased. Is a point. Another point is that the one usually treated with an emulsifier or the like is often introduced into a deaerator, and in this regard, the deaerator according to the present invention uses one emulsifier and one deaerator. It can be done.
As described above, in the case where the object to be processed is a liquid containing air bubbles by the micronizing device, the degassing device described above is configured to micronize the liquid to easily emit gas contained in the liquid. It is what it was. As for the object to be treated, it is not limited to the liquid containing bubbles as described above, and from a liquid having two or more liquid components, it is possible to finely vaporize some liquid components and separate them from other liquid components. Can also be used. Further, the object to be treated includes a solid mixture or a compound as long as the solid content can be removed by accelerating vaporization by miniaturization. For example, when the object to be treated is a polymer, unnecessary monomers (volatile substances) in the polymer can be made finer and vaporized and removed. Even when the object to be processed is a mixture of a solid and a liquid, the deaerator can be used to remove one of the gas part and the liquid part by miniaturization.
In addition, the deaerator includes one that can also remove moisture in the object to be processed (by miniaturization) as water vapor.
[0029]
In particular, in the second invention of the present application, in the above-described deaerator equipped with a miniaturization device, by providing a floating mechanism, a minute space between both processing surfaces required for miniaturization is provided. The interval can be reliably maintained without being hindered by distortion due to heat generated by rotation due to rotation or a difference in expansion coefficient of each part, thereby enabling highly accurate processing.
Further, in the third invention of the present application, the movement of the finely processed object can be surely performed by reducing the pressure of the object to be reduced by the pressure reducing pump. In addition, by utilizing the reduced pressure of such a reduced-pressure pump, the gas to be removed of the object to be treated after the miniaturization is promoted to be vaporized, and the separation from the liquid portion is further ensured.
Specifically, taking a case of defoaming as an example, by reducing the pressure to a vacuum or a state close to a vacuum by a decompression pump, the finely processed object has an increased interfacial area and small bubbles. Expands and vaporizes gas, solvent, and monomer (volatile substance) contained in the object to be vaporized and can be extracted (e.g., when these gases and the like are used as an object of extraction, the same effect is obtained). Can perform the extraction).
The degree of vacuum (the degree of reduced pressure) may be set so as to be suitable for separating a substance to be vaporized from a remaining substance.
[0030]
In particular, the deaerators according to the fourth to eighth aspects of the present invention use the original idea of using a shaft sealing mechanism in a mechanical seal as a means for miniaturization. It is possible to provide a deaerator having a simple structure that can perform processing and has high productivity, and solves the above-described problem. An interval can be set to a predetermined minute interval, and a deaerator provided with a finer device capable of applying a large shearing force to the fluid to be processed is provided. Provides a wide deaerator.
That is, the deaerator according to the fourth to eighth inventions of the present application employs the above-described configuration, whereby the dynamic pressure generating mechanism 104 responds to the urging of the urging mechanism 103 by the fluid processing member 101. , 102 is generated by using a force that tries to pass between the two processing members 101, 102, and at least the balance between the urging of the urging mechanism 103 and the repulsion force causes the both processing members 101, 102 to be separated. It has become possible to secure a minute space required for processing between 101 and 102, which was impossible with a mechanical method.
[0031]
In particular, the deaerator according to the fifth invention of the present application can provide more preferable means for the dynamic pressure generating mechanism 104 described above. That is, in the deaerator according to the fifth aspect of the present invention, both the processing members 101 and 102 are provided with flat portions by mirror polishing, and one of the flat portions is provided with a processing portion from the center side of the processing member. A groove that provides a path for fluid to move is provided outside the member, and the groove is a space surrounded by both mirror-polished flat portions and a flow path restriction portion. For this reason, the fluid that tries to pass through the groove loses its place due to the flow path restricting portion, enters at least between the two flat portions pressed by the urging mechanism 103, and between the two flat portions (the two processing members 101 and 102). In the meantime, a minute interval suitable for the processing of miniaturization, which is impossible by a mechanical method, is secured.
Further, in the deaerator according to the sixth aspect of the present invention, the flow path restricting portion gradually reduces the cross-sectional area of the groove from the center of rotation toward the outside of the processing member, thereby trying to pass through the fluid. It receives the force gradually, and it has made it possible to secure the above-mentioned minute interval more smoothly.
Further, in the deaerator according to the seventh aspect of the present invention, the processing members 101 and 102 are rotated by not only the above-described approach / separation between the processing members but also the rotation of the processing members 101 and 102 by the floating mechanism. At least one of the two processing members 101 and 102 absorbs the eccentric behavior generated in at least one of them. For this reason, due to the deformation of the processing member due to the rotation or the generated heat, the imbalance in the interval between the flat portions (between the processing members 101 and 102) at each position is corrected, and the gap between the flat portions (both the processing members) is corrected. The gap at each position (between the members 101 and 102) is fixed so that more reliable and uniform processing is possible.
In other words, the floating mechanism can absorb the runout of the rotating shaft, the axial expansion, the surface runout of the first processing member 101, and the vibration during the rotation, and the above effects can be achieved.
In the deaerator according to the eighth aspect of the present invention, the distance between the processing members is set to a minute distance of 0.1 to 10 μm by the balance of the forces generated by the urging mechanism and the dynamic pressure generating mechanism under the floating mechanism. This realizes a miniaturization process that was impossible in the past.
[0032]
In the ninth invention of the present application, the distance between the first processing surface 1 and the second processing surface 2 is completely different from the method of mechanically keeping the distance between the first processing surface 1 and the second processing surface 2 as conventionally performed in other fields. According to the idea, a deaerator provided with a miniaturization device which is set at a predetermined minute interval is provided. That is, as described above, by using the principle used for the mechanical seal and setting the pressure receiving surface to a predetermined balance ratio, the predetermined pressure applied to the fluid to be processed is reduced by the first processing unit. It acts on the approach or separation of the 10 and the second processing member 20. As the pressure receiving surface, the second processing surface 2 applies the above-described predetermined pressure in a direction in which the two processing units are separated from each other. As the pressure receiving surface, the second processing surface 2 applies the above-described predetermined pressure in a direction in which the two processing units are separated from each other.
The second processing unit 20 includes, as necessary, a pressure receiving surface (adjustment surface for proximity) facing the second processing surface 2, in addition to the second processing surface 2, and a second processing surface 2. And a pressure-receiving surface (separation adjustment surface) formed on the same side as.
In this case, the second processing surface 2 and the separation adjusting surface are in a direction in which the second processing unit 20 is separated from the first processing unit 10 by receiving a predetermined pressure applied to the processing target fluid. Generates the force to move. However, if it is unnecessary, the separation adjusting surface may not be provided. (If the separation adjusting surface is provided, both the second processing surface 2 and the separation adjusting surface are collectively used. When the separation surface is not provided, the separation surface is the second processing surface 2 itself).
Then, the proximity adjustment surface receives a predetermined pressure applied to the processing target fluid, and generates a force that moves the second processing unit 20 toward the first processing unit 10 in a direction of approaching the first processing unit 10 ( When there are a plurality of proximity adjustment surfaces, all the proximity adjustment surfaces are collectively referred to as a proximity surface. When there is one proximity adjustment surface, only the proximity adjustment surface is the proximity surface.)
In this case, the ratio (area ratio) between the area of the proximity surface that exerts the predetermined pressure in the direction in which the two processing units approach each other and the area of the separation surface is called a balance ratio, and the ratio of the proximity surface is By making the area larger than the area of the separating surface, it is possible to make the predetermined pressure larger than the force acting to separate the two processing units from the predetermined pressure.
Conversely, by making the area of the separating surface larger than the area of the approaching surface, the predetermined pressure is larger than the force acting on the approaching one of the predetermined pressures that acts on the one that separates the two processing units. can do.
In addition, by not providing the proximity surface, all of the predetermined pressure can be received by the separation surface, and all of the predetermined pressure can be used as the force acting on the separation.
With this, the action of approaching or separating the two processing units by a predetermined pressure applied to the processing target fluid with respect to the force for causing the processing units to approach or separate from each other, caused by other factors. And a fluid film having a desired minute film thickness can be formed between the first processing surface 1 and the second processing surface 2.
That is, by adjusting the distance between the processing surfaces 1 and 2 to a minute interval in this manner, a required amount of shearing force can be applied to the fluid to be processed. As a result, ultra-miniaturization that could not be obtained conventionally has been realized. That is, when the fluid to be processed passes between the processing surfaces 1 and 2, a large shearing force is given in a certain minute gap, and the fluid is ejected in a mist form from the certain minute gap. Thus, miniaturization on the order of 10 microns or less has been made possible, and extraction (removal) of fine bubbles at such a level has been made possible. That is, the interval between the processing units 10 and 20 can be made minute, which is physically impossible with the conventional method (using a punching plate or a mesh), so as to make the space finer. Was realized, and deaeration of finer bubbles was enabled.
[0033]
According to the tenth aspect of the present invention, the provision of the buffer mechanism can absorb alignment such as runout of the core and eliminate the risk of an accident caused by wear due to contact.
In the eleventh invention of the present application, the above-described displacement adjusting mechanism maintains the distance between the first processing surface 1 and the second processing surface 2 and maintains the film thickness of the fluid film at a predetermined thickness. For this reason, it is possible to perform a reliable miniaturization process over a long period of time, and to perform the deaeration process with higher accuracy.
In the twelfth aspect of the present invention, the gap between the first processing surface 1 and the second processing surface 2 can be adjusted by the adjustment mechanism of the pressure applied to the fluid to be processed. The thickness of the fluid film can be adjusted. Therefore, a desired fine processing can be selected by the adjustment, and the deaeration performance can be improved in accordance with the characteristics such as the viscosity of the fluid to be processed, and the size (fineness) of the bubbles to be removed is determined. It can respond finely.
[0034]
In the thirteenth invention of the present application, the maximum distance between the first processing surface 1 and the second processing surface 2 is defined, and further separation of the two processing surfaces 1 and 2 is suppressed. Since the separation prevention portion is provided, it is possible to prevent the gap between the first processing surface 1 and the second processing surface 2 from being unnecessarily widened, and it is possible to surely and smoothly perform uniform miniaturization processing. And According to the fourteenth aspect of the present invention, the minimum distance between the first processing surface 1 and the second processing surface 2 is defined, and the further approach of the two processing surfaces 1 and 2 is suppressed. Provision of the proximity suppressing portion prevents the gap between the first processing surface 1 and the second processing surface 2 from being unnecessarily narrowed, thereby making it possible to reliably and smoothly perform the miniaturization processing. did.
[0035]
In the fifteenth invention of the present application, both the first processing surface 1 and the second processing surface 2 rotate in directions opposite to each other, and thus the first processing surface 1 and the second processing surface 2 are rotated in opposite directions. 2 By rotating both processing surfaces 2 in directions opposite to each other, it becomes possible to generate a greater shearing force, to enable processing in a finer order, and to efficiently perform degassing. did.
In the sixteenth invention of the present application, one or both of the first processing surface 1 and the second processing surface 2 are heated to a temperature suitable for performing the miniaturization process by the temperature adjusting jacket. Alternatively, cooling can be performed, and more efficient and reliable miniaturization processing can be performed.
[0036]
According to the seventeenth aspect of the present invention, the above-described miniaturization process between the first processing surface 1 and the second processing surface 2 can be performed with higher precision by mirror finishing, and more fine processing can be performed. Processing could be realized.
According to the eighteenth aspect of the present invention, by forming a concave portion in the first processing surface 1 or the second processing surface 2 or in both of them, the stirring ability is increased, and more efficient fine processing can be performed. In addition, when a dynamic pressure is generated in the concave portion during rotation, it rotates in a non-contact manner and reliably forms a fluid film.
According to the nineteenth aspect of the present invention, it is possible to appropriately mix a separate substance or a fluid to be processed into a fluid to be processed which is to be processed, thereby expanding the range of use of the apparatus. It was taken.
[0037]
According to the twentieth aspect of the present invention, a fluid to be processed to which a predetermined pressure is applied flows between the first processing surface 11 and the second processing surface 12 connected to the sealed fluid flow path. As a result, a force acts to separate the first processing surface 11 and the second processing surface 12 from each other. On the other hand, a contact surface pressure is applied between the two processing surfaces 1 and 2 by a contact surface pressure applying mechanism, and the first processing surface 1 and the second processing surface which are relatively close to each other and rotate simultaneously and rotate. The fluid to be processed is passed between the processing surface 2 and the processing surface 2. As a result, the force applied in the direction of separating the two processing surfaces 1 and 2 by the processing fluid and the contact surface pressure applied between the two processing surfaces 1 and 2 by the contact surface pressure applying mechanism are balanced. The space between the processing surfaces 1 and 2 is maintained at a predetermined minute interval, and the fluid to be processed passes between the processing surfaces 1 and 2 while forming a fluid film.
The above-described contact surface pressure applying mechanism applies a force in a direction in which the first processing surface 1 and the second processing surface 2 are brought close to each other, and applies a fluid pressure (positive pressure) such as a spring, an air pressure, or a hydraulic pressure. It can be constituted by at least one of a pressurizing device and an approaching pressure receiving surface that acts in a direction in which the two processing surfaces 1 and 2 approach in response to a predetermined pressure applied to the fluid to be processed.
On the other hand, the separating force for separating the two processing surfaces 1 and 2 against the pressing force (contact surface pressure) of such a contact surface applying mechanism is a force applied to the first or second processing surfaces 1 and 2 or the like. The pressure received on the pressure receiving surface that exerts a predetermined pressure applied to the processing fluid in the separating direction, the centrifugal force generated by relatively rotating the first processing surface 1 and the second processing surface 2, and air pressure Alternatively, a suction force by a suction device using a fluid pressure (negative pressure) such as a hydraulic pressure, a viscosity of a specific processing fluid, and the like can be given.
By setting the above-mentioned balance ratio, it is possible to determine the magnitude of the predetermined pressure applied to the processing target fluid, the one acting as the pressing force by the contact surface pressure applying mechanism and the one acting as the separating force. it can.
The fluid to be processed forms a fluid (that is, a fluid film) having a predetermined minute thickness on the basis of the balance between the contact pressure and the repulsion force. The distance between the processing surfaces 1 and 2 is maintained at a predetermined minute interval by adjusting the above conditions so as to indicate a predetermined film thickness.
[0038]
According to the twenty-first aspect of the present invention, the object to be processed can be made ultra-fine in degassing, which has been impossible in the past, and a punching plate or mesh required for miniaturization in the conventional degassing process Is unnecessary, and the trouble of washing is eliminated.
[0039]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 and 2A show an embodiment of the present invention. FIG. 1 is a partially cutaway vertical cross-sectional view of a micronizing device G for a deaerator according to the present invention. FIG. 2A is a schematic vertical sectional view of a main part of the deaerator shown in FIG.
For convenience of explanation, U indicates an upper part and S indicates a lower part in each drawing.
[0040]
First, the configuration of the deaerator will be described.
This deaerator is provided with a miniaturization device G and a known decompression device such as a decompression pump (not shown in this embodiment).
The above-mentioned micronizing apparatus G is suitable for micronizing processing of a fluid to be processed on a micro order from a micron unit to a nanometer unit, and includes a single liquid and liquids, a liquid and a solid (powder), The solid (powder), the gas and the liquid, or the gas and the solid (powder) are suitable to be subjected to a process of removing (extracting) components by degassing.
As shown in FIG. 1, the miniaturization apparatus includes a first holder 11 (a mating ring holder), a second holder 21 (a compression ring holder) disposed in front (above) of the first holder 11, A case 3 that covers the first holder 11 together with the holder 21, a fluid pressure applying mechanism p, and a contact surface pressure applying mechanism 4 are provided.
Hereinafter, the configuration of the miniaturization apparatus will be described in order.
[0041]
The first holder 11 is provided with a first processing unit 10, a rotating shaft 50, and a stirring blade 6.
The first processing unit 10 is a metal ring called a mating ring, and includes a first processing surface 1 that has been mirror-finished.
The rotation shaft 50 is fixed to the center of the first holder 11 by a fixing tool 51 such as a bolt, and the rear end thereof is connected to a rotation driving device 5 (rotation driving mechanism) such as an electric motor. Is transmitted to the first holder 11 to rotate the first holder 11. The first processing unit 10 is attached to the front (upper end) of the first holder 11 concentrically with the rotation shaft 50, and rotates integrally with the first holder 11 by rotation of the rotation shaft 50. Further, the stirring blade 6 is provided for performing pre-stirring (pretreatment for miniaturization), and is provided inside the annular first processing portion 10 at the front (upper surface) of the first holder 11. The shaft is fixed to the first holder 11 so as to be concentric with the rotation shaft 50.
[0042]
A receiving portion capable of receiving the first processing portion 10 is provided on a front portion (upper surface) of the first holder 11, and the first processing portion 10 is fitted together with the O-ring into the receiving portion. At this time, the first processing unit 10 is attached to the first holder 11 as described above. Further, the first processing portion 10 is fixed by a rotation preventing pin 12 so as not to rotate with respect to the first holder 11. However, instead of the rotation preventing pin 12, it may be fixed so as not to rotate by a method such as shrink fitting.
The first processing surface 1 is exposed from the first holder 11 and faces the second holder 21. The first processing surface 1 is preferably subjected to mirror finishing such as polishing, lapping, and polishing after being fitted into the first holder 11.
As the material of the first processing portion 10, a material obtained by subjecting a hardening treatment to a ceramic, a sintered metal, a wear-resistant steel, or other metal, or a material obtained by applying a lining, coating, plating, or the like to a hard material is used. In particular, it is desirable that the first processing portion 10 be formed of a lightweight material for rotation.
[0043]
The case 3 is a bottomed container provided with a shaft insertion port 31 and a discharge portion 32, and houses the first holder 11 in an internal space 30 thereof. The shaft insertion port 31 is provided in the center of the bottom of the case 3, is a through hole communicating between the inside and the outside of the case 3, and allows the rotation shaft 50 to pass therethrough. The tip of the rotary shaft 50 is inserted into the case 3 from the rotary drive device 5 disposed outside (below) the case 3 through the shaft insertion opening 31, and the first holder 11 and the rotary shaft 50 in the case 3 are connected as described above. Connect.
[0044]
The second holder 21 is provided with a second processing unit 20, an introduction unit 22 for the fluid to be processed, and a contact pressure applying mechanism 4.
The second processing portion 20 is a metal ring-shaped body called a compression ring, and has a mirror-finished second processing surface 2 and a second processing surface located inside the second processing surface 2. 2 is provided with a pressure receiving surface 23 (hereinafter referred to as separation adjusting surface 23). As illustrated, the separation adjusting surface 23 is an inclined surface. The mirror processing performed on the second processing surface 2 employs the same method as that of the first processing surface 1. In addition, the same material as that of the first processing unit 10 is employed for the material of the second processing unit 20. The separation adjusting surface 23 is adjacent to the inner peripheral surface 25 of the annular second processing unit 20.
[0045]
An accommodating portion 40 is formed at the bottom (lower portion) of the second holder 21, and the second processing portion 20 is received in the accommodating portion 40 together with the O-ring. Further, the second processing portion 20 is received by the detent 45 so as not to rotate with respect to the second holder 21. The second processing surface 2 is exposed from the second holder 21.
As shown in FIG. 1, the second holder 21 is arranged at the opening (upper part) of the case 3 to cover the opening, and seals the internal space 30 of the case 3 with a well-known sealing means 33. In this state, the second processing surface 2 faces the first processing surface 1 of the first processing unit 10 in the case 3. Between the processing surfaces 1 and 2, the inside (center side) of the first processing unit 10 and the second processing unit 20 is an inflow portion of the object to be processed (of claim 1), and the first processing unit The outside of the part 10 and the second processing part 20 is an outflow part of the object to be processed (of claim 1).
[0046]
The fluid pressure imparting mechanism p is connected to the introduction section 22 outside (upper part) of the second holder 21. The fluid pressure imparting mechanism p is a pressurizing device such as a compressor that applies a constant feeding pressure to a fluid to be processed on which a fine processing is performed.
[0047]
The contact surface pressure applying mechanism 4 presses the second processing surface 2 against the first processing surface 1 in a pressure contact or a close state, and the contact surface pressure and the fluid pressure (of the fluid to be processed). The fluid film having the above-mentioned predetermined thickness is generated by balancing with the force for separating the two processing surfaces 1 and 2 such as fluid pressure) (in other words, the distance between the two processing surfaces 1 and 2 is set to a predetermined value). Keep at minute intervals).
Specifically, in this embodiment, the contact surface pressure applying mechanism 4 includes the above-described housing portion 41, a spring receiving portion 42 provided at the deepest portion (the deepest portion) of the housing portion 41, a spring 43, The air inlet 44 is provided.
However, the contact surface pressure applying mechanism 4 only needs to be provided with at least one of the above-mentioned housing part 41, the above-mentioned spring receiving part 42, a spring 43, and an air introduction part 44.
[0048]
The accommodation section 41 has the second processing section 20 loosely fitted therein so that the position of the second processing section 20 in the accommodation section 41 can be displaced deeply or shallowly (up and down).
One end of the spring 43 is in contact with the inner side of the spline receiving portion 42, and the other end of the spring 43 is in contact with the front portion (upper portion) of the second processing portion 20 in the storage portion 41. In FIG. 1, only one spring 43 appears, but it is preferable that a plurality of springs 44 press each part of the second processing unit 20. That is, by increasing the number of springs 43, a more uniform pressing force can be applied to the second processing unit 20. Therefore, it is preferable that the second holder 21 be a multi-type in which several to several tens of springs 43 are attached.
[0049]
In this embodiment, as described above, the air can be introduced into the housing portion 41 from the other by the air introduction portion 44. By introducing such air, the pressure between the housing part 41 and the second processing part 20 can be given to the second processing part 20 as a pressing force using the spring 43 together with the spring 43. Therefore, by adjusting the air pressure introduced from the air introduction part 44, it is possible to adjust the contact surface pressure (of the second processing surface 2 with respect to the first processing surface 1) during operation. Note that, instead of the air introduction unit 44 using air pressure, a mechanism that generates a pressing force by another fluid pressure such as a hydraulic pressure may be used.
The contact surface pressure applying mechanism 4 supplies and adjusts a part of the pressing force (contact surface pressure), and also functions as a displacement adjusting mechanism and a buffering mechanism.
More specifically, the contact surface pressure applying mechanism 4 as a displacement adjusting mechanism can follow the axial displacement due to axial elongation or wear during start-up or operation by adjusting the air pressure and maintain the initial pressing force. . Further, as described above, the contact surface pressure applying mechanism 4 also functions as a buffering mechanism for microvibration and rotational alignment by adopting a floating mechanism for displaceably holding the second processing unit 20.
[0050]
In the deaerator according to the first embodiment having the above configuration, the deaeration process is performed by the following operation.
First, a fluid to be treated is subjected to a constant pressure from the fluid pressure imparting mechanism p and is introduced from the introduction part 22 into the internal space of the closed case 3. On the other hand, the first processing unit 10 is rotated by the rotation driving device 5 (rotation driving mechanism). As a result, the first processing surface 1 and the second processing surface 2 relatively rotate while maintaining a small interval.
The fluid to be processed introduced into the internal space of the case 3 becomes a fluid film between the two processing surfaces 1 and 2 that are kept at a minute interval (entering from the inflow portion), and becomes a fluid film by the rotation of the first processing surface 1. (2) It is miniaturized by being sheared with the processing surface 2. Here, the first processing surface 1 and the second processing surface 2 are adjusted to a minute interval of 1 μm to 1 mm (particularly, 1 μm to 10 μm), so that ultrafine atomization in units of several nanometers is possible. I do.
The processed fluid to be processed is discharged from the discharge unit 32 through the space between the processing surfaces 1 and 2 (exiting from the outflow unit). The object to be processed discharged from the discharge unit 32 is atomized in a vacuum or a reduced pressure atmosphere by the above-described pressure reducing device, and the material that has flowed down as a fluid by being hit by other components in the atmosphere is removed. Collected as a late liquid.
In this embodiment, the case 3 is provided as shown in FIG. 1, but it is possible to implement without providing such a case 3 in the miniaturization apparatus G (not shown). For example, the deaerator may be used as a decompression tank (vacuum tank), and the miniaturization device G may be disposed inside the tank. In this case, the discharge unit 32 is not provided in the miniaturization apparatus G.
The stirring blade 6 receives the pressure of the fluid to be processed and rotates with respect to the first holder 11 to stir the fluid to be processed prior to the processing between the processing surfaces 1 and 2. .
[0051]
As described above, the first processing surface 1 and the second processing surface 2 can be adjusted to a minute interval in units of μm, which is impossible by setting a mechanical clearance. This will be described next.
The first processing surface 1 and the second processing surface 2 are relatively close to each other and relatively rotate. In this example, the first processing surface 1 rotates, the second processing surface 2 slides in the axial direction, and approaches and separates from the first processing surface.
Therefore, in this example, the axial position of the second processing surface 2 is set with an accuracy of μm unit by the balance of the force (the above-described contact surface pressure and separation force), so that the two processing surfaces 1 A minute interval between the two is set.
[0052]
Examples of the contact surface pressure include the pressure when the positive pressure (air pressure) is applied from the air introduction unit 44 and the pressing force of the spring 43 in the contact surface pressure application mechanism 4.
On the other hand, the separating force includes a fluid pressure acting on the pressure receiving surface on the separating side (that is, the second processing surface 2 and the separating adjustment surface 23), a centrifugal force due to the rotation of the first processing unit 1, and air introduction. The negative pressure when the negative pressure is applied to the portion 44 can be mentioned.
The balance of these forces stabilizes the second processing surface 2 at a position separated by a predetermined minute interval with respect to the first processing surface 1, thereby realizing setting with a precision of μm. .
[0053]
The separating force will be described in more detail.
First, regarding the fluid pressure, the second processing unit 20 in the closed flow path receives the sending pressure (fluid pressure) of the fluid to be processed from the fluid pressure applying mechanism p. At this time, the surface (the second processing surface 2 and the separation adjusting surface 23) facing the first processing surface in the flow path becomes the pressure receiving surface on the separation side, and fluid pressure acts on this pressure receiving surface, A separation force is generated by the pressure.
Next, regarding the centrifugal force, when the first processing unit 10 is operated at a high speed, a centrifugal force acts on the fluid, and a part of this centrifugal force is a repulsive force acting in a direction of moving the two processing surfaces 1 and 2 away from each other. It becomes.
Further, when a negative pressure is applied from the air introduction unit 44 (to the second processing unit 20), the negative pressure acts as a separating force.
As described above, in the description of the present application, the force for separating the first and second processing surfaces 1 and 2 from each other is described as a separating force, and the above-described force is not excluded from the separating force.
[0054]
As described above, in the sealed flow path of the fluid to be processed, the separating force and the contact pressure exerted by the contact pressure applying mechanism 4 are balanced through the fluid to be processed between the processing surfaces 1 and 2. By forming such a state, a fluid film suitable for performing desired miniaturization processing is formed between the processing surfaces 1 and 2. In this way, the miniaturization apparatus forcibly interposes a fluid film between the processing surfaces 1 and 2 to remove a minute gap which was impossible with the conventional mechanical miniaturization apparatus. The use surfaces 1 and 2 can be maintained, and a highly accurate deaeration process is realized.
[0055]
In other words, the thickness of the fluid film between the processing surfaces 1 and 2 can be adjusted to a desired thickness by adjusting the separation force and the contact surface pressure described above, and the required fine processing can be performed. Therefore, when trying to reduce the thickness of the fluid film, the contact surface pressure or the separating force may be adjusted so that the contact surface pressure becomes relatively large with respect to the separating force, and conversely, the thickness of the fluid film is increased. In this case, the separation force or the contact surface pressure may be adjusted so that the separation force is relatively large with respect to the contact surface pressure.
When the contact pressure is increased, the contact pressure applying mechanism 4 applies a positive pressure (air pressure) from the air introduction unit 44, or changes the spring 43 to a large pressing force or increases the number thereof. Good.
When increasing the separation force, the feeding pressure of the fluid pressure applying mechanism p is increased, or the area of the second processing surface 2 or the separation adjusting surface 23 is increased. May be adjusted to increase the centrifugal force or to apply a negative pressure (air pressure) from the air introduction unit 44. Although the spring 43 is a pushing bar that generates a pressing force in the extending direction, a part or all of the configuration of the contact surface pressure applying mechanism 4 can be used as a pulling bar that generates a force in the contracting direction.
[0056]
Further, in addition to the above, properties of the fluid to be treated such as viscosity can be added as factors for increasing and decreasing the contact surface pressure and the separating force. Can be adjusted.
[0057]
It should be noted that, among the separation forces, the fluid pressure acting on the pressure receiving surface on the separation side (that is, the second processing surface 2 and the separation adjustment surface 23) is understood as a force constituting an opening force in the mechanical seal.
In the case of a mechanical seal, the second processing member 20 corresponds to a compression ring. When a fluid pressure is applied to the second processing member 20, the second processing member 2 performs the first processing. When a force separating from the working portion 1 acts, this force is used as an opening force.
More specifically, as in the first embodiment, only the pressure receiving surface on the separation side (that is, the second processing surface 2 and the separation adjustment surface 23) is provided in the second processing portion 20. In that case, all of the feed pressures constitute the opening force. When a pressure-receiving surface is also provided on the back side of the second processing unit 20 (specifically, in the case of FIG. 2B and FIG. 9 described later), of the sending pressure, the separation force The difference between what works as a contact and what works as an interface pressure is the opening force.
[0058]
Here, another embodiment of the second processing unit 20 will be described with reference to FIG.
As shown in FIG. 2 (B), a proximity portion which is a portion exposed from the accommodation portion 41 of the second processing portion 20 and faces the opposite side (upper side) to the second processing surface 2 on the inner peripheral surface side. An adjustment surface 24 is provided.
That is, in this embodiment, the contact surface pressure applying mechanism 4 includes the housing portion 41, the air introduction portion 44, and the proximity adjustment surface 24. However, the contact surface pressure applying mechanism 4 includes at least any one of the housing portion 41, the spline receiving portion 42, the spring 43, the air introduction portion 44, and the proximity adjustment surface 24. I just need.
[0059]
The proximity adjusting surface 24 receives a predetermined pressure applied to the fluid to be processed, generates a force for moving the second processing surface 2 toward the first processing surface 1 in a direction to approach the first processing surface 1, and generates a proximity contact surface pressure. As a part of the application mechanism 4, it plays a role of a supply side of the contact surface pressure. On the other hand, the second processing surface 2 (and the separating surface 23 described above) receives a predetermined pressure applied to the fluid to be processed and moves the second processing surface 2 away from the first processing surface 1. It generates a moving force and plays a role on the supply side of (part of) the separating force.
The proximity adjustment surface 24 and the second processing surface 2 (and the separation adjustment surface 23) are both pressure receiving surfaces that receive the pressure of the above-mentioned fluid to be processed. It has a different effect of generation and generation of a separating force.
[0060]
The area ratio (A1 / A2) of the area A1 of the proximity adjustment surface 24 and the total area A2 of the second processing surface 2 of the second processing portion 20 and the separation-side pressure receiving surface 23 is equal to the balance ratio K. This is important for adjusting the opening force.
Both the tip of the proximity adjustment surface 24 and the tip of the separation-side pressure receiving surface 23 are defined on the inner peripheral surface 25 (tip line L1) of the annular second adjustment portion 20. Therefore, the balance ratio is adjusted by determining where to place the base line L2 of the proximity adjustment surface 24.
That is, in this embodiment, when the pressure of sending out the fluid to be processed is used as the opening force, the total area of the second processing surface 2 and the separation adjustment surface 23 is determined by the area of the proximity adjustment surface 24. By making it larger, an opening force corresponding to the area ratio can be generated.
[0061]
The opening force can be adjusted by the pressure of the fluid to be processed (fluid pressure) by changing the balance line, that is, the area A1 of the proximity adjustment surface 24.
The actual sliding surface pressure P (the fluid pressure of the contact surface pressure) is calculated by the following equation.
P = P1 × (K−k) + Ps
Here, P1 indicates the pressure (fluid pressure) of the fluid to be processed, K indicates the above-mentioned balance ratio, k indicates the opening force coefficient, and Ps indicates the spring and back pressure.
By adjusting the actual sliding surface pressure P (by adjusting the balance line), a desired minute gap (gap width) is formed between the processing surfaces 1 and 2 to form a fluid film by the fluid to be processed. Is performed.
[0062]
Usually, if the thickness of the fluid film between the processing surfaces 1 and 2 is reduced, the object to be processed (fluid to be processed) can be made finer. Conversely, if the thickness of the fluid film is increased, the processing becomes coarse and the processing amount per unit time increases. Therefore, by adjusting the actual surface pressure P of the sliding surface (hereinafter referred to as the surface pressure P), the distance (gap) between the two processing surfaces 1 and 2 can be adjusted, and desired miniaturization can be performed.
To summarize this relationship, when the above miniaturization process is roughened, the balance ratio may be reduced, the surface pressure P may be reduced, the gap may be increased, and the film thickness may be increased. Conversely, when the finer processing is to be performed finer, the balance ratio is increased, the surface pressure P is increased, the gap is reduced, and the film thickness is reduced.
As described above, the proximity adjustment surface 24 is formed as a part of the contact surface pressure applying mechanism 4, and the contact surface pressure is adjusted at the position of the balance line, that is, the gap between the processing surfaces is adjusted. It can also be implemented.
[0063]
As described above, the adjustment of the gap is performed in consideration of the pressing force of the spring 43 and the air pressure of the air introduction unit 44. In addition, the adjustment of the fluid pressure, that is, the feed pressure of the fluid to be processed, and the adjustment of the rotation (centrifugal force) of the first processing unit 10 (first holder 11) are also important adjustment elements (parameters). is there.
As described above, the apparatus includes the second processing unit 20 and the first processing unit 10 rotating with respect to the second processing unit 20, the feeding pressure of the fluid to be processed and the rotational centrifugal force, The pressure is balanced by the contact surface pressure, a predetermined fluid film is formed on both processing surfaces, and a desired shear force is applied to the fluid to be processed. In addition, at least one of the rings has a floating structure to absorb alignment such as runout and eliminate the danger of wear due to contact.
[0064]
The configuration of FIG. 2B is the same as that of the embodiment shown in FIG. 1 except for the configuration including the adjustment surface.
Further, in the embodiment shown in FIG. 2B, as shown in FIG. 9, it is also possible to carry out without providing the separation-side pressure receiving surface 23 described above. In this case, the balance ratio K is an area ratio (A1 / A2) between the area A1 of the proximity adjustment surface 24 and the area A2 of the second processing surface 2 of the second processing unit 20.
When the proximity adjustment surface 24 is provided as in the embodiments shown in FIGS. 2B and 9, the area A1 of the proximity adjustment surface 24 is set to be larger than the area A2, that is, the mechanical seal. By using the unbalanced type, the predetermined pressure applied to the fluid to be processed, on the contrary, acts as the contact surface pressure without generating the opening force. Such a setting is also possible. In this case, the other processing surfaces 1 and 2 can be balanced by increasing the other separating force.
[0065]
In the above-described embodiment, as described above, the larger the number of springs 43, the better the number of springs 43 to apply uniform stress to the sliding surface (processing surface). However, as the spring 43, as shown in FIG. 3A, a single coil type spring can be employed. This is a single coil type spring whose center is concentric with the annular second processing portion 20 as shown.
As described above, it is preferable to use an O-ring for the seal between the second processing portion 20 and the second holder 21, but instead of such an O-ring or together with the O-ring, FIG. The present invention can also be implemented by providing a bellows 26 shown in FIG. 3 or a diaphragm 27 shown in FIG.
[0066]
As shown in FIG. 4, the second holder 21 is provided with a temperature adjustment jacket capable of cooling or heating the second processing surface 2 (the second processing portion 20) to adjust the temperature thereof. 46 are provided. The case 3 is also provided with a jacket 35 for temperature adjustment for the same purpose.
The temperature adjusting jacket 46 of the second holder 21 is a space around the water formed in the side surface of the housing portion 41 in the second holder 21 and communicates with the passages 47 and 48 communicating with the outside of the second holder 21. are doing. One of the passages 47, 48 introduces a cooling or heating medium into the temperature adjusting jacket 46, and the other discharges the medium.
In addition, the temperature adjusting jacket 35 of the case 3 allows the heating water or the cooling water provided between the outer peripheral surface of the case 3 and the covering portion 34 to pass through the covering portion 34 covering the outer periphery of the case 3. It is a passage.
In this embodiment, the second holder 21 and the case 3 are provided with the above-mentioned jacket for temperature adjustment. However, the first holder 11 may be provided with such a jacket. is there.
[0067]
As a part of the contact surface pressure applying mechanism 4, it is also possible to provide a cylinder mechanism 7 shown in FIG. 5 in addition to the configuration shown in FIGS.
The cylinder mechanism 7 includes a cylinder space portion 70 provided in the second holder 21, a communication portion 71 that connects the cylinder space portion 70 to the housing portion 41, and a communication portion 71 that is housed in the cylinder space portion 70 and communicates therewith. The piston body 72 connected to the second processing unit 20, the first nozzle 73 communicating with the upper part of the cylinder space 70, the second nozzle 74 below the cylinder space 70, and the upper part of the cylinder space 70 72 and a pressing body 75 such as a spring formed between them.
[0068]
The piston body 72 is slidable up and down within the cylinder space 70, and the sliding of the piston body 72 causes the second processing unit 20 to slide up and down, and the first processing surface 1 The gap between the second processing surface 2 can be changed.
Specifically, a pressure source (not shown) such as a compressor is connected to the first nozzle 73, and air pressure (positive pressure) is applied from the first nozzle 73 above the piston body 72 in the cylinder space 70. By sliding the piston body 72 downward, the gap between the first and second processing surfaces 1 and 2 can be narrowed (moved in the closing direction) of the second processing portion 20. In addition, a pressure source (not shown) such as a compressor is connected to the second nozzle 74, and air pressure (positive pressure) is applied from the second nozzle 74 to the lower part of the piston body 72 in the cylinder space 70, whereby the piston By sliding the body 72 upward, the gap between the first and second processing surfaces 1 and 2 can be widened (moved in the opening direction) of the second processing portion 20. Thus, the contact pressure can be adjusted by the air pressure obtained at the nozzles 73 and 74.
[0069]
Even if there is a margin between the upper part of the second processing part 20 in the storage part 41 and the uppermost part of the storage part 41, the piston body 7 is set to be in contact with the uppermost part 70a of the cylinder space part 70. Thus, (the uppermost portion 70a of) the cylinder space 70 defines the upper limit of the width of the gap between the two processing surfaces 1 and 2. That is, the piston body 7 and the uppermost portion 70a of the cylinder space 70 are separated from each other by the separation suppressing portion (the maximum opening amount of the gap between the processing surfaces 1 and 2). Function as a mechanism).
[0070]
Even if the processing surfaces 1 and 2 are not in contact with each other, the piston body 7 is set to be in contact with the lowermost portion 70b of the cylinder space 70 so that (the lowermost portion 70b of) the cylinder space 70. Defines the lower limit of the width of the gap between the processing surfaces 1 and 2. That is, the piston body 7 and the lowermost part 70b of the cylinder space 70 are provided with the proximity suppressing portion (the minimum opening amount of the gap between the two processing surfaces 1 and 2) for suppressing the proximity of the two processing surfaces 1 and 2. Function as a mechanism).
In this way, while restricting the maximum and minimum opening amounts of the gap, the distance z1 between the piston body 7 and the uppermost part 70a of the cylinder space 70 (in other words, the distance between the piston body 7 and the lowermost part 70b of the cylinder space 70). The interval z2) is adjusted by the air pressure of the nozzles 73 and 74.
[0071]
The nozzles 73 and 74 may be connected to separate pressure sources, or may be connected by switching (switching) one pressure source.
Further, the pressure source may be either a source that supplies a positive pressure or a source that supplies a negative pressure. When a negative pressure source such as a vacuum is connected to the nozzles 73 and 74, the above operation is reversed.
Such a cylinder mechanism 7 is provided in place of the other contact pressure applying mechanism 4 described above or as a part of the above described contact pressure applying mechanism 4, and the nozzles 73 and 74 are provided depending on the viscosity and properties of the fluid to be processed. By setting the pressure of the pressure source to be connected and the intervals z1 and z2, the thickness of the fluid liquid film can be set to a desired value, and a shearing force can be applied to perform finer processing. In particular, with such a cylinder mechanism 7, it is possible to increase the reliability of cleaning and sterilization by forcibly opening and closing the sliding portion such as during cleaning or steam sterilization.
[0072]
As shown in FIGS. 6A to 6C, grooves are formed on the first processing surface 1 of the first processing unit 10 from the center side of the first processing unit 10 to the outside (extending in the radial direction). 13 may be formed and practiced. In this case, as shown in FIG. 6 (A), the recesses 13... 13 can be implemented as curved or spirally extending on the first processing surface 1, as shown in FIG. 6 (B). The present invention can be implemented even if the individual recesses 13 are bent in an L-shape, and can be implemented even if the recesses 13... 13f extend straight and radially as shown in FIG. It is.
[0073]
As shown in FIG. 6 (D), the recess 13 in FIGS. 6 (A) to 6 (C) is formed with a gradient so as to become deeper toward the center of the first processing surface 1. Is preferred. Further, the groove-shaped concave portion 13 can be implemented even if it is continuous or intermittent.
By forming such a concave portion 13, it is possible to cope with an increase in the discharge amount (supply amount) of the fluid to be processed or a decrease in the calorific value, as well as effects such as cavitation control and fluid bearing.
In each of the embodiments shown in FIG. 6 described above, the concave portion 13 is formed on the first processing surface 1. However, the concave portion 13 may be formed on the second processing surface 2. The present invention can also be implemented as being formed on both the first and second processing surfaces 1 and 2.
[0074]
If the concave portion 13 or the taper is not provided on the processing surface, or if these are unevenly distributed on a part of the processing surface, the surface roughness of the processing surfaces 1 and 2 (smooth portion) causes The effect on the body (fluid) is greater than that described above (the one forming the recess 13). Therefore, in such a case, the smaller the particles of the fluid (fluid) to be processed, the lower the surface roughness (the finer the surface). In particular, in the case of performing nano-size ultra-miniaturization, it is more advantageous to provide the above-mentioned mirror surface (mirror-finished surface) with respect to the surface roughness of the processing surface in order to apply a desired shear force.
[0075]
As shown in FIG. 7, a supply passage 28 that opens to the second processing surface 2 is provided in the second processing portion 20 separately from the introduction portion 22, and the first processing surface 1 is opened through the supply passage 28. The present invention is also applicable to a case in which a different substance or a part of the fluid to be separated is directly injected into the fluid to be processed (fluid) between the second processing surface 2 and the second processing surface 2.
[0076]
In the embodiment shown in FIG. 1, the first processing unit 10 (first holder 11) receives a rotational force from the rotation driving device 5 with respect to the immobile second processing unit 20 (second holder 21). It was spinning. In addition, as shown in FIG. 8, the second holder 21 is connected to a separate auxiliary rotation driving device 52 via a separate rotation shaft 53 (hereinafter, referred to as a sub rotation shaft 53), and the first holder 21 is connected to the first holder 21. Rotating in the opposite direction to the holder 11 is also effective in obtaining a larger shear force.
In this case, the rotation shaft 50 and the sub rotation shaft 53 are arranged concentrically. And. The introduction section 22 for the fluid to be processed (fluid) is formed as a hollow passage provided in the sub-rotation drive device 52 and the sub-rotation shaft 53, and is formed using a rotary joint (not shown). The processing fluid (fluid) is discharged to the center of the second processing unit 20 from the opposite side (upper side) of the auxiliary rotation driving device 52. The fluid to be processed introduced into the case 3 and processed between the two processing surfaces 1 and 2 is discharged to the outside from the discharge unit 32.
[0077]
The device shown in FIG. 8 is extremely effective when trying to obtain a large shear force by increasing the rotation speed. Further, in this case, the first holder 11 and the second holder 21 can be implemented with the same or different rotation speeds (number of rotations).
In the embodiment shown in FIG. 8, the stirring blade 6 is not provided.
[0078]
Also in the embodiment shown in FIGS. 3 to 8, configurations other than those particularly shown are the same as those in the embodiment shown in FIG. 1 or FIG. 2.
In the embodiment shown in FIG. 1, the one having the stirring blade 6 for the purpose of the pre-dispersion is shown. However, in the case where the pre-dispersion is not performed, it is also possible to perform without the stirring blade 6 as well. (Not shown).
[0079]
In each of the above embodiments, the fluid to be processed moves from the inside of the annular second processing unit 2 or the first processing unit 10 to the outside. In addition, by moving the fluid to be processed from the outside of the second processing unit 2 or the first processing unit 10 to the inside thereof, the first processing surface 1 and the second processing surface 2 The space may be passed (not shown). For example, the apparatus shown in FIG. 1 may be modified so that the discharge unit is an introduction unit and the introduction unit is a discharge unit. In this case, pressure is applied from the discharge unit side shown in FIG. However, the present invention can also be implemented as a case where suction is performed at a negative pressure from the introduction section side shown in FIG.
[0080]
As described above, when the fluid to be processed is moved from the outside of the second processing unit 2 or the first processing unit 10 to the inside thereof, as shown in FIG. It is also possible to form the first processing surface 1 of the portion 10 by forming groove-shaped concave portions 13 extending from the outside of the first processing portion 10 toward the center side. By forming the recesses 13 shown in FIG. 6 (E), it is preferable that the above-mentioned balance ratio be an unbalanced type of 100% or more. As a result, during rotation, a dynamic pressure is generated in the groove-shaped recesses 13... 13, so that the processing surfaces 1 and 2 can be reliably rotated without contact, and there is no danger of wear due to contact.
In the embodiment shown in FIG. 6 (E), the separation force due to the pressure of the fluid to be processed is generated at the inner end 13a of the concave portion 13.
[0081]
In addition, in each of the above embodiments, the inside of the case 3 is completely sealed. In addition, only the inside of the first processing unit 10 and the second processing unit 20 is sealed, and the outside is opened. It is also possible to implement it. That is, the flow path is sealed until the liquid passes between the first processing surface 1 and the second processing surface 2, and the fluid to be processed receives all the pressures. May be opened, and the processed fluid after the treatment may not receive the pressure.
The pressurizing device is preferably implemented using a compressor as described above, but may be implemented using other means as long as a predetermined pressure can always be applied to the fluid to be processed. It is. For example, the present invention can also be implemented in such a manner that a constant pressure is always applied to the fluid to be processed by utilizing the own weight (gravity) of the fluid to be processed.
[0082]
To summarize the miniaturization apparatus in each of the above-described embodiments, a predetermined pressure is applied to the processing target fluid, and a sealed fluid flow path through which the processing target fluid having received the predetermined pressure is flowed, The first processing surface 1 is connected by connecting at least two processing surfaces which can be approached to and separated from each other, the first processing surface 1 and the second processing surface 2, and applying a contact surface pressure for bringing both the processing surfaces 1 and 2 closer to each other. And the second processing surface 2 are relatively rotated to generate a fluid film used for sealing in the mechanical seal using the fluid to be processed. Instead, the fluid film is intentionally leaked from between the first processing surface 1 and the second processing surface 2, and the processing for miniaturization is performed by forming a film between the first and second surfaces 1 and 2. It is applied to a fluid and collected.
By such an epoch-making miniaturization method, it is possible to adjust the distance between the processing surfaces 1 and 2 to 1 μm to 1 mm, particularly to adjust the distance between the processing surfaces 1 and 1 to 1 to 10 μm.
[0083]
In the above-described embodiment, the inside of the device constitutes a closed fluid flow path, and the fluid to be processed (the material to be processed) is supplied to the fluid pressure imparting mechanism p provided at the introduction side of the deaerator. In the above, the fluid to be treated was pressurized.
In addition, pressurization is not performed using the fluid pressure applying mechanism p, and the embodiment can be implemented even if the flow path of the fluid to be processed is open.
10 to 13 show an embodiment of such a deaerator with a miniaturization device. FIG. 10 is a schematic vertical sectional view of the deaerator. FIG. 11 is a schematic vertical cross-sectional view of a main part of the notch. FIG. 12 is a plan view of the first processing member 1 included in the miniaturization apparatus shown in FIG. FIG. 13 is a schematic vertical sectional view of a main portion of the first and second processing members 1 and 2 of the deaerator, which is partially cut away.
[0084]
As described above, the deaerator shown in FIGS. 10 to 13 converts the fluid to be subjected to the deaeration process (hereinafter, the above-described fluid to be processed, as This is simply referred to as “fluid”.) Alternatively, a fluid for transporting an object to be processed as described above is supplied.
As shown in FIG. 10, this deaerator is provided with a miniaturization device G and a decompression pump Q. This miniaturization apparatus G includes a first processing member 101 that is a rotating member, a first holder 111 that holds the processing member 101, a second processing member 102 that is a fixed member, and a second processing member 102 that is a fixed member. The second holder 121 to which the member 102 is fixed, the urging mechanism 103, the dynamic pressure generating mechanism 104, the driving unit 105 that rotates the first processing member 101 together with the first holder 111, the housing 106, and the fluid An introduction unit 107 for supplying (inputting) and a discharge unit 108 for discharging a fluid to the decompression pump Q are provided.
[0085]
Each of the first processing member 101 and the second processing member 102 is an annular body having a hollow cylindrical center. The two processing members 101 and 102 are members having the processing surfaces 110 and 120 as the bottom surfaces of the cylinders provided by the two processing members 101 and 102, respectively.
The processing surfaces 110 and 120 have mirror-polished flat portions. In this embodiment, the processing surface 120 of the second processing member 102 is a flat surface whose entire surface is mirror-polished. Further, the processing surface 110 of the first processing member 101 has a flat surface similar to that of the second processing member 102, but a plurality of grooves 112... 12 in the flat surface as shown in FIG. Having. The grooves 112... 12 radially extend from the center of the cylinder represented by the first processing member 101 toward the outer periphery of the cylinder. The mirror polishing of the processing surfaces 110 and 120 of the first and second processing members 101 and 102 is preferably performed with a surface roughness Ra of 0.01 to 1.0 μm. For this mirror polishing, Ra is preferably set to 0.03 to 0.3 μm.
As the material of the processing members 101 and 102, a material that is hard and capable of mirror polishing is adopted. The hardness of the processing members 101 and 102 is set to at least Vickers hardness of 1500 or more, desirably 1800 or more. Further, it is preferable to use a material having a small linear expansion coefficient. This is because a large difference in the coefficient of expansion between a portion that emits heat in the miniaturization process and another portion causes distortion, which affects the securing of an appropriate clearance.
As a material of such processing members 101 and 102, in particular, SIC (silicon carbide / Vickers hardness 2000 to 2500), and SIC coated with DLC (diamond-like carbon / Vickers hardness 3000 to 4000) are used. , WC (tungsten carbide / Vickers hardness 1800), WC coated with DLC on the surface, boron-based ceramics (Vickers hardness 4000-5000) represented by ZrB2, BTC, B4C, etc. preferable.
[0086]
The housing 106 is a cylindrical body with a bottom, and the upper part is covered with the above-mentioned second holder 121. The second processing member 102 is fixed to the lower surface of the second holder 121, and the introduction portion 7 is provided above the second processing member 102. The introduction unit 107 includes a hopper 170 for externally introducing a fluid or a workpiece.
The driving unit 105 includes a power source (not shown) such as an electric motor, and a shaft 150 that receives power from the power source and rotates.
The rotation is 20,000 rotations per minute when the diameter of the first processing member 101 is 100 mm, and 10,000 rotations per minute when the diameter of the first processing member 101 is 200 mm. The diameter of the first processing member 101 Is 5,000 revolutions per minute when is set to 400 mm. That is, from the viewpoint of the peripheral speed during rotation of the first processing member 101, the speed is about 6300 meters per minute, which is possible because dry contact between the processing surface 110 and the processing surface 120 can be prevented. It is.
As shown in FIG. 10, the shaft 150 is disposed inside the housing 106 and extends vertically. The first holder 111 is provided at the upper end of the shaft 150. The first holder 111 holds the first processing member 101, and is provided on the shaft 150 as described above, so that the processing surface 110 of the first processing member 101 can be processed by the second processing member 102. Corresponding to the working surface 120.
[0087]
The first holder 111 is a columnar body, and the first processing member 101 is fixed at the center of the upper surface. The first processing member 101 is fixed so as to be integrated with the first holder 111, and does not change its position with respect to the first holder 111.
On the other hand, a receiving recess 124 for receiving the second processing member 102 is formed at the center of the upper surface of the second holder 121.
The receiving recess 124 has an annular cross section. The second processing member 102 is accommodated in the cylindrical receiving recess 124 so as to be concentric with the receiving recess 124.
[0088]
Specifically, an annular body 123 separate from the second processing member 102 is accommodated in the receiving recess 124. A projection 127 (pin) is provided on the bottom surface (top portion 124a) of the receiving recess 124. A concave portion 126 capable of accommodating the projection 127 is provided on a surface (upper surface) of the annular body 123 facing the top portion 124a. The protrusion 127 serves as a stopper for the annular body 123 with respect to the second holder 121. The protrusion 127 is accommodated in the recess 126 so as to have a margin (play).
The second processing member 102 is housed on the opposite side (downward) of the annular body 123 from the top 124a of the receiving recess 124. A projection 125 (pin) is provided on a surface (lower surface) of the annular body 123 opposite to the top part 124a. On the surface opposite to the polishing surface 120 of the second processing member 102, a concave portion 122 for accommodating the projection 125 is provided. The protrusion 125 serves as a stopper for the second processing member 102 with respect to the annular body 123. The protrusion 125 is accommodated in the recess 122 with a margin (play).
[0089]
The second holder 121 includes the above-described urging mechanism 103. It is preferable that the urging mechanism 103 uses an elastic body such as a rubber O-ring or a spring. Specifically, in this embodiment, a plurality of through-holes 131... 131 are provided between the (upper and lower) end faces of the annular body 123, and the through-holes 131. 130 are housed. As a result, the second processing member 102 is placed between the upper surface of the second processing member 102 (the surface opposite to the processing surface 120) and the bottom of the receiving recess 124 (the top surface 124a). The urging mechanism 103 that urges the urging member 103 toward the user member 101 is interposed. That is, the springs 130 press the surface (bottom surface) of the second processing member 102 opposite to the processing surface 120, and attaches the second processing member 102 to the first processing member 101 side (downward). Energize. The springs 130 are uniformly distributed on the bottom 124a of the receiving recess 124.
When a spring is used for the urging mechanism 103, instead of preparing a plurality of springs as described above, the spring is larger than the inner diameter of the inner peripheral surface of the second processing member 102 and larger than the outer diameter of the second processing member 102. It can also be implemented by preparing one spring having a small diameter. The urging mechanism 103 applies a uniform urging force without bias to each part of the surface (the upper surface of the second processing member 102 in FIGS. 10 and 11) opposite to the processing surface 120 of the second processing member 102. The spring is not limited to the above-described one as long as the spring can be used.
That is, in the above description, the urging mechanism 103 is configured by only the spring 131. In addition, the urging mechanism 103 may be replaced with the spring 131 or together with the spring 131 may be a fluid pressure such as air. It is also possible to carry out using an urging means utilizing the above.
More specifically, as shown in FIG. 10, a high-pressure air inlet 132 may be provided as a part of the urging mechanism 103 to adjust the urging force. In this case, the urging mechanism 103 may be configured only with the high-pressure air inlet 132, or as illustrated in FIG. 10, configured with the spring 131 and the high-pressure air inlet 132. Is also good.
[0090]
On the other hand, the inner diameter of the receiving concave portion 124 is larger than the outer diameter of the second processing member 102, so that when the concentrically arranged receiving member 124 and the outer peripheral surface 102 b of the second processing member 102 As shown in FIG. 11, a gap t1 is set between the inner peripheral surface and the inner peripheral surface.
Similarly, a gap t2 is set between the inner peripheral surface 102a of the second processing member 102 and the outer peripheral surface of the central portion of the receiving recess 124 as shown in FIG.
Each of the gaps t1 and t2 is for absorbing vibration and eccentricity behavior, and is set to a size that secures an operating dimension or more and enables sealing. For example, when the diameter of the first processing member 101 is 100 mm to 400 mm, each of the gaps t1 and t2 is preferably set to 0.1 to 0.3 mm.
The first holder 111 is integrally fixed to the shaft 150 together with the inner holder 115, and rotates together with the shaft 150. Further, the second processing member 102 does not rotate with respect to the second holder 121 even through the annular body 123 by the protrusions 125 and 127. However, in order to secure a minute interval t (clearance / see FIG. 13B) between the processing surfaces 110 and 120 of 0.1 to 10 μm required for the miniaturization process, the bottom surface of the receiving recess 124 ( A gap t3 is provided between the top portion 124a) and a surface (upper surface) of the annular body 123 facing the top portion 124a. The gap t3 is set in consideration of the clearance and the run-out and elongation of the shaft 150.
[0091]
As described above, by setting the gaps t1 to t3, the first processing member 101 is not only variable in the direction approaching / separating from the second processing member 102 but also the center of the processing surface 110. And directions (for directions z1 and z2) are also variable.
That is, in this embodiment, the urging mechanism 103 and the gaps t1 to t3 form a floating mechanism, and the center and inclination of at least the second processing member 102 are reduced from several microns to several microns by the floating mechanism. A small amount of millimeters is variable. As a result, the center runout of the rotating shaft, the axial expansion, the surface runout of the first processing member 101, and the vibration are absorbed.
The play between the protrusion 125 and the recess 122 and the play between the protrusion 127 and the recess 126 ensure the operation of the floating mechanism of the second processing member 102, and the mechanism for preventing rotation of the second processing member 102. , The operation is not hindered.
[0092]
The groove 112 provided on the polishing surface 110 of the first processing member 101 will be described in more detail. The rear end of the groove 112 reaches the inner peripheral surface 101a of the first processing member 101, and the front end extends toward the outside y (outer peripheral surface side) of the first processing member 101. As shown in FIG. 12A, the groove 112 has a cross-sectional area extending from the center x side of the annular first processing member 101 to the outside y (outer peripheral surface side) of the first processing member 101. , And gradually decrease.
The distance w1 between the left and right side surfaces 112a and 112b of the groove 112 decreases from the center x side of the first processing member 101 toward the outside y (outer peripheral surface side) of the first processing member 101. As shown in FIG. 12B, the depth w2 of the groove 112 increases from the center x side of the first processing member 101 toward the outside y (outer peripheral surface side) of the first processing member 101. Become smaller. That is, the bottom 112c of the groove 112 becomes shallower from the center x side of the first processing member 101 toward the outside y (outer peripheral surface side) of the first processing member 101.
In this way, the groove 112 has both its width and depth gradually decreasing toward the outside y (outer peripheral surface side), and its cross-sectional area is gradually decreasing toward the outside y. The end (y side) of the groove 112 is a dead end. That is, the front end (y side) of the groove 112 does not reach the outer peripheral surface 101b of the first processing member 101, and the outer flat surface 113 is interposed between the front end of the groove 112 and the outer peripheral surface 101b ( The outer flat surface 113 is a part of the processing surface 110).
In this embodiment, the left and right side surfaces 112a, 112b and the bottom 112c of such a groove 112 constitute a flow path restricting portion. The flow path restricting portion, the flat portion around the groove 112 of the first processing member 101, and the flat portion of the second processing member 102 constitute the dynamic pressure generating mechanism 104.
However, only one of the width and the depth of the groove 112 may have the above configuration, and the sectional area may be reduced. In this case, the left and right side surfaces 112a, 112b or the bottom 112c, which do not adopt the above-described configuration, do not function as flow passage restricting portions and do not function as components of the dynamic pressure generating mechanism 104.
When the first processing member 101 rotates, the above-mentioned dynamic pressure generating mechanism 104 creates a desired minute interval between the two processing members 101 and 102 by a fluid that tries to pass between the two processing members 101 and 102. A force is generated that acts in a direction in which the processing members 101 and 102 can be separated from each other, and can be secured. Due to the generation of such a dynamic pressure, a minute interval of 0.1 to 10 μm can be generated between the processing surfaces 110 and 120. Such a minute interval may be adjusted and selected depending on the processing target, but is preferably 1 to 6 μm, more preferably 1 to 2 μm. In this deaerator, processing such as defoaming of unprecedented fine air bubbles and the like at the minute intervals as described above is possible.
[0093]
Each of the grooves 112... 112 can be implemented even if they are straight and extend from the center x side to the outside y. However, in this embodiment, as shown in FIG. 12A, in the rotation direction r of the first processing member 101, the center x side of the groove 112 precedes the outside y of the groove 112 ( (So as to be located forward) to extend the groove 112 in a curved manner.
In this way, the grooves 112... 112 are bent and extended, so that the repulsive force by the dynamic pressure generating mechanism 104 can be generated more effectively.
[0094]
Next, the operation of the deaerator will be described.
The fluid R, which is an object to be processed, introduced from the introduction unit 107 (hopper 170) passes through the hollow portion (center) of the annular second processing member 102, and generates centrifugal force due to rotation of the first processing member 101. The received fluid enters between the two processing members 101 and 102, and is miniaturized between the processing surface 110 of the rotating first processing member 101 and the processing surface 120 of the second processing member 102. Is carried out, and thereafter, it goes out of both the processing members 101 and 102 and is discharged from the discharge part 108 to the pressure reducing pump Q side.
In the above description, the fluid R that has entered the hollow portion of the annular second processing member 102 first enters the groove 112 of the rotating first processing member 101 as shown in FIG. On the other hand, the processing surfaces 110 and 120 that have been mirror-polished (flat portions) are kept airtight even when gas such as air or nitrogen is passed through. Therefore, even if the centrifugal force due to the rotation is received, the fluid cannot enter from the groove 112 between the two processing surfaces 110 and 120 pressed by the urging mechanism 103 as it is. However, the fluid R gradually comes into contact with the side surfaces 112a and 112b and the bottom 112c of the groove 112 formed as a flow path restricting portion, and generates a dynamic pressure acting in a direction for separating the two processing surfaces 110 and 120. As a result, the fluid R seeps out of the groove 112 onto the flat surface, and a minute gap (clearance) can be secured between the processing surfaces 110 and 120. Then, a miniaturization process is performed between such mirror-polished flat surfaces. In addition, the above-described curvature of the groove 112 more reliably applies a centrifugal force to the fluid, thereby making the generation of the dynamic pressure more effective.
As described above, the deaerator secures a fine gap (clearance) between both mirror surfaces (processing surfaces 110 and 120) by balancing the dynamic pressure and the urging force of the urging mechanism 103. Made it possible. Then, with the above configuration, the fine interval can be made as very fine as 1 μm or less.
In addition, the use of the floating mechanism enables automatic adjustment of the alignment between the processing surfaces 110 and 120, and prevents each of the processing surfaces 110 and 120 from being physically deformed due to rotation or generated heat. Variations in clearance at positions are suppressed, and the above-described small intervals at each position can be maintained.
[0095]
In the above embodiment, the floating mechanism is a mechanism provided only on the second holder 121. In addition, a floating mechanism may be provided in the second holder 121 instead of, or in addition to, the second holder 121.
[0096]
14 to 16 show another embodiment of the above-described groove 112. FIG.
As shown in FIGS. 14A and 14B, the groove 112 can be embodied as a part of the flow path restriction portion having a flat wall surface 112d at the tip. In the embodiment shown in FIG. 14, a step 112e is provided on the bottom 112c between the first wall surface 112d and the inner peripheral surface 101a, and the step 112e also forms a part of the flow path restricting portion. Constitute.
As shown in FIGS. 15A and 15B, the groove 112 is provided with branch portions 112f... 112f that branch into a plurality, and each branch portion 112f is provided with a flow path restricting portion by reducing the width thereof. Is also feasible.
14 and 15 are the same as those in the embodiments shown in FIGS. 10 to 13 except for the configuration particularly shown.
[0097]
Further, in each of the above-described embodiments, the size of at least one of the width and the depth of the groove 112 is gradually reduced from the inside to the outside of the first processing member 101, so that the flow path is restricted. Part. In addition, as shown in FIGS. 16 (A) and 16 (B), by providing the end surface 112 f in the groove 112 without changing the width and depth of the groove 112, the end surface of such a groove 112 is provided. 112f can be a flow path restriction part. As shown in the embodiment shown in FIGS. 12, 14 and 15, the dynamic pressure is generated by changing the width and depth of the groove 112 as described above so that the bottom and both sides of the groove 112 are inclined. As a result, the inclined surface became a pressure receiving portion for the fluid and generated a dynamic pressure. On the other hand, in the embodiment shown in FIGS. 16A and 16B, the end surface of the groove 112 serves as a pressure receiving portion for the fluid and generates dynamic pressure.
In the case shown in FIGS. 16A and 16B, at least one of the width and the depth of the groove 112 may be gradually reduced.
Note that the configuration of the groove 112 is not limited to those shown in FIGS. 12, 14 to 16 described above, and can be implemented as having a flow path restricting portion of another shape.
For example, in FIGS. 12 and 14 to 16, the groove 112 does not penetrate outside the first processing member 101. That is, the outer flat surface 113 was present between the outer peripheral surface of the first processing member 101 and the groove 112. However, the present invention is not limited to such an embodiment. If the above-described dynamic pressure can be generated, the groove 112 reaches the outer peripheral surface side of the first processing member 101. Is also feasible.
For example, in the case of the first processing member 101 shown in FIG. 16B, a portion having a smaller cross-sectional area than the other portion of the groove 112 is formed on the outer flat surface 113 as shown by a dotted line, and the process is performed. Can be.
Further, the groove 112 is formed so as to gradually reduce the cross-sectional area from the inside to the outside as described above, and a portion (termination) of the groove 112 reaching the outer periphery of the first processing member 101 has the largest cross-sectional area. It may be small (not shown). However, in order to effectively generate dynamic pressure, it is preferable that the groove 112 does not penetrate to the outer peripheral surface side of the first processing member 101 as shown in FIGS. 12, 14 to 16.
[0098]
In each of the above embodiments, only the first processing member 101 rotates, and the second processing member 102 does not rotate. In addition, not only the first processing member 101 but also the second processing member 102 can be rotated. In this case, the second processing member 102 rotates in a direction opposite to the rotation direction r of the first processing member 101.
As such a deaerator, for example, as shown in FIG. 17, a drive unit 105a having a shaft 150a is provided separately from the drive unit 105 described above, and a second drive unit 105 is formed independently of the housing 106. The two holders 121 may be rotated. In this case, the shaft 150a of the driving unit 5a is hollow, and the inside of the shaft 150 is used as the introduction unit 107.
In the deaerator shown in FIG. 17, the floating mechanism is provided in the second holder 121, as in the deaerator shown in FIGS. 10 and 11. In addition, the first holder 111 may be provided with a floating mechanism instead of the second holder 121 or together with the second holder 121.
[0099]
Here, the respective embodiments shown in FIGS. 10 to 17 will be summarized.
In this deaerator, a rotating member having a flat processing surface and a fixing member having the same flat processing surface are concentrically opposed to each other on the flat processing surface, and the opening of the fixed member is rotated under rotation of the rotating member. Instead of mechanically adjusting the clearance in a deaerator that finely processes the raw material to be crushed from between the opposed flat processing surfaces of both members while supplying the raw material to be crushed from the part, a pressure increasing mechanism is provided to the rotating member. Is provided, the clearance is maintained by the generation of the pressure, and a fine clearance of 1 to 6 μm has been made possible by mechanical clearance adjustment, and the miniaturization ability has been significantly improved.
That is, in this deaerator, the rotating member and the fixing member have a flattening surface on the outer periphery thereof, and the flattening surface has a sealing function on the surface. It is an object of the present invention to provide a high-speed rotary deaerator that generates hydrodynamic force or aerostatic-aerodynamic force. The above-mentioned force generates a small gap between the sealing surfaces, and can provide a non-contact mechanically safe deaerator having a high degree of miniaturization function. One of the factors that can form such a small gap is due to the rotation speed of the rotating member, and the other is due to the pressure difference between the input side and the discharge side of the processing object (fluid). When a pressure applying mechanism is provided on the input side, when no pressure applying mechanism is provided on the input side, that is, when an object to be processed (fluid) is input under atmospheric pressure, there is no pressure difference. Therefore, it is necessary to cause the separation between the sealing surfaces only by the rotation speed of the rotating member. This is known as hydrodynamic or aerodynamic force.
[0100]
Although the decompression pump Q (FIG. 10) is shown connected to the discharge portion of the above miniaturization apparatus G, the housing 106 (case 3) is not provided and the decompression pump Q is not provided as shown in FIG. As shown in (A), the deaerator can be used as a depressurizing tank T, and a miniaturization device G is provided in the tank T.
In this case, the inside of the tank T is decompressed to a vacuum or a state close to the vacuum, so that the object to be treated finely divided by the refiner G is sprayed into the tank T in the form of a mist, and hits the inner wall of the tank T. The object to be processed can be obtained by collecting the object to be processed falling down, or by collecting the object to be separated into a gas (vapor) and filling the upper portion of the tank T with the object to be processed falling down. be able to.
Also, in the case of using the decompression pump Q, as shown in FIG. 18B, by connecting an airtight tank T to the miniaturization device G via the decompression pump Q, The object to be processed after the treatment can be atomized to separate (extract) the object.
Further, as shown in FIG. 18 (C), the decompression pump Q is directly connected to the miniaturization device G, and the decompression pump Q and the discharge part of the fluid R different from the decompression pump Q are connected to the tank T. Thus, the target object can be separated. In this case, the vaporizing section is sucked by the pressure reducing pump Q, and the liquid R (liquid section) is discharged from the discharging section separately from the vaporizing section.
[0101]
【The invention's effect】
By implementing the first to twenty-first inventions of the present application, the conventional structure of a punching plate and a mesh is eliminated for miniaturization, and the troublesome work of cleaning these members becomes unnecessary. Then, it was possible to extract (eliminate) fine bubbles, which were impossible with a punching plate or a mesh.
In particular, according to the fourth to eighth aspects of the present invention, when the raw material to be crushed is used as a fluid or the raw material to be crushed is introduced into the fluid, the clearance between the upper and lower two members (processing members) is reduced to 15 μm or less. I realized that.
In addition, by implementing the ninth to twenty-first inventions of the present application, there is no contamination of impurities, the applicable viscosity range of the fluid to be processed is wide, a large shear force is applied to the fluid to be processed, and the fineness is reduced with high precision. It is possible to provide a deaerator and a deaeration method with a simple structure that can be miniaturized with high precision and have high productivity.
That is, by using the mechanism of the shaft seal in the mechanical seal as a means for miniaturization, it is possible to provide a deaerator and a deaeration method with a simple structure that can be miniaturized with high accuracy and high productivity. Obtained. In particular, by the implementation of the present invention, the flow to be processed is caused by the feeding pressure (fluid pressure) of the fluid to be processed, the back pressure of the compression ring (second processing section), or the rotation of the mating ring (first processing section). The thickness of the fluid film to be processed can be adjusted from a very small amount without being restricted by the viscosity range of the body, and it is possible to make the thickness of several nanometers (nanometers) impossible with a conventional apparatus, and Since a buffering device such as microvibration, alignment, and axial displacement is provided, a high degree of miniaturization can be obtained without generation of impurities or the like. In addition, since the mechanism is simple, it does not require skill in controlling the apparatus, and can be easily automated and automated. The apparatus can be operated stably, has high productivity, and can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 is a partially cutaway longitudinal sectional view of an apparatus according to an embodiment of the present invention.
FIG. 2A is a schematic vertical sectional view of a main part of the above apparatus, and FIG. 2B is a schematic vertical sectional view of a main part of another embodiment.
FIG. 3A is a schematic vertical sectional view of a main part of still another embodiment, FIG. 3B is a schematic vertical sectional view of a main part of another embodiment, and FIG. It is a principal part schematic longitudinal cross-sectional view of embodiment.
FIG. 4 is a schematic vertical sectional view of a main part of still another embodiment.
FIG. 5 is a schematic vertical sectional view of a main part of another embodiment.
FIG. 6A is a schematic cross-sectional view of a main part of still another embodiment, FIG. 6B is a schematic cross-sectional view of a main part of another embodiment, and FIG. It is a principal part schematic cross-sectional view of one Embodiment, (D) is also a partially cut-away principal part schematic longitudinal cross-sectional view of another embodiment, (E) is a principal part of still another embodiment. It is a substantially cross section.
FIG. 7 is a schematic vertical sectional view of a main part of still another embodiment.
FIG. 8 is a longitudinal sectional view of still another embodiment.
FIG. 9 is a schematic vertical sectional view of a main part of still another embodiment.
FIG. 10 is a partially cutaway longitudinal sectional view of a deaerator according to still another embodiment of the present invention.
11 is a schematic vertical sectional view of an essential part of the deaerator shown in FIG. 10, centering on the first processing member 1 and the first holder 11. FIG.
12A is a plan view of the first processing member 1 of the deaerator shown in FIG. 10, and FIG. 12B is a longitudinal sectional view of a main part thereof.
13A is a longitudinal sectional view of a main part of first and second processing members 1 and 2 of the deaerator shown in FIG. 10, and FIG. It is a principal part longitudinal cross-sectional view of the member 1 for 2nd processing.
14A is a plan view of another embodiment of the first processing member 1, and FIG. 14B is a schematic vertical sectional view of a main part thereof.
15A is a plan view of still another embodiment of the first processing member 1, and FIG. 15B is a schematic vertical sectional view of a main part thereof.
FIG. 16A is a plan view of still another embodiment of the first processing member 1, and FIG. 16B is a plan view of still another embodiment of the first processing member 1. .
FIG. 17 is a partially cut-away schematic longitudinal sectional view showing another embodiment of the deaerator.
FIGS. 18A, 18B, and 18C are explanatory views each showing an embodiment other than steam for a method of separating an object to be processed after miniaturization.
[Explanation of symbols]
1 First processing member
2 Second processing member
3 biasing mechanism
4 Dynamic pressure generation mechanism

Claims

In a deaerator with a refiner,
The miniaturization device includes first and second at least two disks that are disposed so as to face each other and at least one of which rotates with respect to the other, and an interval holding mechanism that maintains a predetermined interval between the two disks, Each of the opposing surfaces of both disks is a processing surface subjected to mirror polishing,
The miniaturization device includes an inflow portion for introducing the object to be processed between the processing surfaces, and an outflow portion for discharging the object to be processed from both the processing surfaces, and between the two processing surfaces by the above rotation, A deaerator with a miniaturization device, wherein a process for miniaturization of an object to be processed is performed.

In a deaerator with a refiner,
The miniaturization device includes a first and a second at least two processing members, a floating mechanism, an urging mechanism, and a separation mechanism,
Each of the two processing members is provided with a processing surface disposed so as to face each other, and at least one of the two processing members is rotated with respect to the other, so that the fine processing is performed between the two processing surfaces. Processing.
Each of the two processing surfaces is subjected to mirror polishing, and an object to be processed is supplied between the two processing surfaces.
The floating mechanism is provided on at least one of the first and second processing members. The floating mechanism enables the two processing members to approach and separate from each other, and is generated on at least one of the two processing members by rotation. Eccentric behavior is absorbed by at least the other of the two processing members,
The biasing mechanism is to act in a direction to bring both processing members close to each other,
The separation mechanism is to act in a direction to separate both processing members,
The separation mechanism is capable of securing a minute gap between the processing members at least during the rotation of the processing member against the action of the biasing mechanism, and is provided with a detachment device with a miniaturization device. Mind.

3. The deaerator with a miniaturization device according to claim 2, further comprising a decompression pump for extracting a processed material passing between the first and second processing members.

First and second at least two processing members disposed so as to oppose each other and performing at least one of the processing members by rotating with respect to the other, and both the processing members from the center of rotation. And supplying the fluid to the outside of the first and second processing members.
The first and second processing members are arranged so that at least one of them can approach or separate from the other,
A biasing mechanism that acts in a direction to at least bring both processing members close to each other,
The first and second processing members are provided with a dynamic pressure generating mechanism that applies a force for causing a fluid to pass between the two processing members in a direction in which the two processing members are separated from each other. Deaerator with a finer device.

First and second at least two processing members disposed so as to oppose each other and performing at least one of the processing members by rotating with respect to the other, and both the processing members from the center of rotation. And supplying the fluid to the outside of the first and second processing members.
The first and second processing members are arranged so that at least one of them can approach or separate from the other,
A biasing mechanism that acts in a direction to at least bring both processing members close to each other,
Both of the processing members include a flat portion subjected to mirror polishing, and one of the processing members includes a groove in the flat portion,
The above-mentioned groove extends from the center side of the processing member toward the outside of the processing member, and passes through the groove to pass through the groove from the center of the processing member to the outside of the processing member. A deaerator equipped with a miniaturization device, comprising: a flow path restricting section for restricting the pressure.

6. The miniaturization apparatus according to claim 5, wherein the flow path restricting portion is formed by gradually reducing the cross-sectional area of the groove from the center of rotation to the outside of the processing member. With deaerator.

At least one of the first and second processing members includes a floating mechanism. The floating mechanism enables the proximity and separation between the two processing members, and rotates at least one of the two processing members. The deaerator with a miniaturization device according to any one of claims 4 to 6, wherein the eccentric behavior generated on one side is absorbed by at least the other of the processing members.

First and second at least two processing members disposed so as to oppose each other and performing at least one of the processing members by rotating with respect to the other, and both the processing members from the center of rotation. During the process, a fluid for transporting the workpiece or the workpiece itself is supplied, and the fluid is discharged to the outside of the first and second processing members.
A floating mechanism, a biasing mechanism, and a dynamic pressure generating mechanism,
The floating mechanism enables one of the first and second processing members to be disposed so as to be able to approach / separate from the other and to change the direction of the rotation axis of both processing members. Things,
The urging mechanism is for urging the two processing members at least in a direction to approach them.
The dynamic pressure generating mechanism applies a force that causes the fluid to pass between the two processing members in a direction in which the two processing members are separated from each other, so that the distance between the two processing members is reduced to 0.1 to 10 μm. A deaerator with a miniaturization device, wherein the deaerator has an interval.

A fluid pressure applying mechanism for applying a predetermined pressure to the fluid to be processed, and a first processing unit and a first processing unit provided in a sealed fluid flow path through which the processing fluid at the predetermined pressure flows. At least two processing units of a second processing unit (20) which can relatively approach and separate from each other;
At least two processing surfaces of a first processing surface and a second processing surface provided at positions facing each other in these processing units;
A rotation drive mechanism that relatively rotates the first processing unit and the second processing unit,
Between the two processing surfaces, to perform the processing of miniaturization of the fluid to be processed,
At least the second processing member of the first processing member and the second processing member has a pressure receiving surface set at a predetermined balance ratio, and at least a part of the pressure receiving surface is the second processing member. Composed of surfaces,
The fluid to be processed having a predetermined pressure is passed between the first processing surface and the second processing surface which are relatively rotatable and relatively rotatable, so that the fluid to be processed has a predetermined thickness. A deaerator equipped with a micronizing device, wherein a desired state of micronization is obtained for the fluid to be processed by passing between the two processing surfaces while forming the gas.

10. The deaerator with a miniaturization device according to claim 9, further comprising a buffer mechanism for adjusting fine vibration and alignment of at least one of the first processing surface and the second processing surface.

Displacement adjustment for adjusting one or both of the first processing surface and the second processing surface in the axial direction due to abrasion or the like so as to maintain the thickness of the fluid film between the two processing surfaces. The deaerator with a miniaturization device according to claim 9 or 10, further comprising a mechanism.

12. The deaerator with a micronizing device according to claim 9, further comprising a pressure adjusting mechanism for applying pressure to the fluid to be processed.

13. The separation processing device according to claim 9, further comprising a separation prevention unit that defines a maximum distance between the first processing surface and the second processing surface, and further suppresses separation of the two processing surfaces. A deaerator with a miniaturization device according to any one of the above.

14. The image processing apparatus according to claim 9, further comprising a proximity suppressing unit that defines a minimum distance between the first processing surface and the second processing surface, and further suppresses the proximity of the two processing surfaces. A deaerator with a miniaturization device according to any one of the above.

The deaerator with a miniaturization device according to any one of claims 9 to 14, wherein both the first processing surface and the second processing surface rotate in directions opposite to each other.

16. A detachable device with a miniaturization apparatus according to claim 9, further comprising a temperature adjusting jacket for adjusting the temperature of one or both of the first processing surface and the second processing surface. Mind.

17. A detachable device with a miniaturization device according to claim 9, wherein at least a part of one or both of the first processing surface and the second processing surface is mirror-finished. Mind.

The deaerator with a miniaturization device according to any one of claims 9 to 17, wherein one or both of the first processing surface and the second processing surface has a concave portion.

An independent introduction path independent of the fluid passage is provided, and at least one of the first processing surface and the second processing surface includes an opening communicating with the introduction path, and is sent from the introduction path. 19. The deaerator with a micronizing device according to claim 9, wherein the transferred material can be introduced into the fluid to be processed during the processing.

A fluid pressure applying mechanism for applying a predetermined pressure to the processing target fluid; and a first processing surface and a second processing surface connected to a sealed fluid flow path through which the processing target fluid having the predetermined pressure flows. At least two relatively approachable / separable processing surfaces, a contact surface pressure applying mechanism for applying a contact surface pressure between the two processing surfaces, and a first processing surface and a second processing surface relatively By providing a rotation drive mechanism to rotate, between the two processing surfaces, to perform a process of miniaturization of the fluid to be processed,
The fluid to be processed having a predetermined pressure is passed between the first processing surface and the second processing surface, which relatively rotate while the contact surface pressure is applied, so that the fluid to be processed has a predetermined thickness. A deaerator equipped with a miniaturization device, wherein a desired state of micronization of the fluid to be processed is obtained by passing between the two processing surfaces while forming a fluid film.

A predetermined pressure is applied to the fluid to be processed, and at least two relative surfaces of the first processing surface and the second processing surface are provided in a sealed fluid passage through which the fluid to be processed under the predetermined pressure flows. Connecting the processing surfaces which can be approached and separated from each other, applying a contact surface pressure for bringing the two processing surfaces closer to each other, rotating the first processing surface and the second processing surface relatively, and The fluid to be processed is passed between the surfaces to perform a process of miniaturizing the fluid to be processed,
At least the above-mentioned predetermined pressure applied to the fluid to be processed is set as a separating force for separating the two processing surfaces, and the separating force and the contact surface pressure are balanced through the processing fluid between the processing surfaces. Thus, the processing surface is maintained at a predetermined minute interval, and the fluid to be processed is passed between the processing surfaces as a fluid film having a predetermined thickness to obtain a desired state of miniaturization. A degassing method by miniaturization.