JP3864131B2

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Info

Publication number: JP3864131B2
Application number: JP2002321018A
Authority: JP
Inventors: 眞一榎村
Original assignee: M Technique Co Ltd
Current assignee: M Technique Co Ltd
Priority date: 2002-11-05
Filing date: 2002-11-05
Publication date: 2006-12-27
Anticipated expiration: 2022-11-05
Also published as: JP2004154635A

Description

【０００１】
【発明の属する技術分野】
本願発明は、磨砕機に関する。
【０００２】
【従来の技術】
挽臼原理を採用する粉砕機は、相互の間隔が調整できる上下二枚の砥石を有し、固定する砥石と高速回転する砥石の間に、強力な遠心力、衝撃磨砕力、ずりを生じさせ、それらの総合作用によって微粉砕化を行っている。このような回転砥石及び固定砥石及びこれを用いた磨砕装置としては、下記の特許文献１〜５に示されたものが挙げられる。
【０００３】
【特許文献１】
意匠登録第６５５３０４号公報
【０００４】
【特許文献２】
意匠登録第８４５６３２号公報
【０００５】
【特許文献３】
特公昭６２−５１６５８号公報
【０００６】
【特許文献４】
特公平３−１０６１号公報
【０００７】
【特許文献５】
特公平４−５５８３０号公報
【０００８】
ここで回転砥石及び固定砥石は、一般的にグラインダーと呼ばれ、その粒度は、通常１６♯、２４♯〜１２０♯、２４０♯程度が使用される。これらグラインダーは、粒度の違いは有るけれども凹凸を表面に形成されており、被粉砕物の硬度が高い場合、凸部の剥離や磨耗が発生し、異物混入の問題がある。
【０００９】
一方、次の特許文献６に示された磨砕装置では、噴射燃料、豆乳大豆等について、１〜５μｍ程度の微粒子に磨砕することが報告されているが、現状では、１μｍ以下の超微粒子を得ることが出来ない。
【００１０】
【特許文献６】
特公昭６２−５１６５８号
【００１１】
また、次の特許文献７に示されたものにおいて、高脂質、高水分、高タンパク質、糖質や特殊の酵素を多く含有する物質の微粉砕では、それらの被粉砕物質のもつ特有の物性のため摩擦熱によりねばりつき・べタつき・焦げつき・フィルム化などにより物性が変化してパウダーとして商品化が不可能であったところ、回転砥石の周速度がある一定のラインを超えると、急に粉砕能力が好転し且つ摩擦熱による昇温も低下することが報告されている。しかしながら周速度３４２２ｍ／分では、機械コスト及び機械的安全性にも問題が有ることを同時に報告されている。
【００１２】
【特許文献７】
特開平７−１８５３７２号
【００１３】
更に、次の特許文献８において、回転砥石と固定砥石のクリアランス自動制御方法が報告されているが、この方法では、高速回転により機械的発熱が発生し、駆動軸の熱膨張や回転砥石の芯振れなどの緩衝装置が無いため、最小クリアランスが数十μｍ以上となってしまう。
【００１４】
【特許文献８】
特開平８−１０２０号
【００１５】
次に、下記の特許文献９では、被処理流動体特に湿式（液体）粉砕・分散・乳化に有益な発明が報告されているが、これは、被処理流動体に所定の圧力を付与する流体圧力付与機構や水頭圧力が必要となる。
【００１６】
【特許文献９】
特願２００２−２０７５３３号
【００１７】
結局、上述してきた従来の各装置では、大気圧下で被粉砕原料を投入する場合において、上下二枚の砥石（研磨部材）のクリアランスをの１５μｍ以下にすることを実現することはできない。即ち、従来の機械的手段によっては、微細な磨砕や粉砕に適した上記のような微小なクリアランスを砥石間に確保することはできない。一方、ミルを用いて磨砕や粉砕を行うものでは、異物（ミル同士やミルと他との接触により削られて生じる異物）の混入が生じ、また、安全確保のために、高速回転出来る高性能な微粉砕機は、皆無であった。
【００１８】
【発明が解決しようとする課題】
本願発明は、上記事情に基づいてなされたものであり、最近のナノテクノロジーに関する開発に絶対的に必要とされる超微粉砕を実現する磨砕機を提供するものである。即ち、高精度で超微粉砕ができ且つ異物混入無くしかもシンプルな構造で安全性が高く、安価に製作可能な磨砕機、即ち、被粉砕物を砥石間で磨砕すると共に粒度を一定にしサブミクロン以下の微粉砕を可能とし、更に、被粉砕物の適応性状、物性が広い、磨砕機を提供して、上記問題の解決を図る。
【００１９】
【課題を解決するための手段】
本願第１の発明は、互いに対向するように配設され少なくとも一方が他方に対して回転することにより磨砕や粉砕の処理を行う、第１及び第２の少なくとも２つの研磨部材を備え、上記回転の中心側から両研磨部材の間に、被処理物を搬送する或いは被処理物自身となる流体を供給し、当該流体を上記第１及び第２の研磨部材の外側に排出する磨砕機において、
上記の第１及び第２の両研磨部材は、少なくともその一方が他方に対して、近接・離反可能に配設され、
両研磨部材を少なくとも近接させる方向に作用する付勢機構を備え、
上記の第１及び第２の研磨部材は、流体が両研磨部材間を通過しようとする力を両研磨部材の離反する方向に作用させる、動圧発生機構を備え、
この動圧発生機構により発生する動圧と上記の付勢機構による付勢力との均衡にて、第１及び第２の研磨部材間の間隔を、０．１〜１０μｍの微小間隔に維持するようにしたことを特徴とする磨砕機を提供する。
ここで流体とは、液体、気体の他、固体を含有する液体、固体を含有する気体を含む。また、この流体は、処理の対象物である場合も、処理の対象物でない場合も、双方含むものである。
磨砕機には、磨砕や粉砕の処理を行う装置の他、乳化や分散の処理を行う装置や、アトマイザー（微粒化機）を含む。
【００２０】
本願の第２の発明は、上記の第１の発明に係る磨砕機において、上記第１及び第２の両研磨部材は、鏡面研磨が施された平坦部を備え、研磨部材の一方は、平坦部に溝を備え、上記の溝は、研磨部材の中心側から研磨部材の外側に向かって伸びると共に、当該溝内を通って、研磨部材の中心から研磨部材の外側に通り抜けようとする流体の流路を制限する、流路制限部を備え、この流路制限部は、回転の中心側から研磨部材の外側に向けて漸次溝の断面積を小さくするものであり、この平坦部と溝とが上記の動圧発生機構を構成すること特徴とするものを提供する。
【００２１】
本願の第３の発明は、上記の第１又第２の発明に係る磨砕機において、上記の第１及び第２の研磨部材の少なくとも一方が、フローティング機構を備え、このフローティング機構は、両研磨部材間の上記近接・離反を可能とすると共に、回転により両研磨部材の少なくとも一方に生じた偏心挙動を、両研磨部材の少なくとも他方が吸収するものであることを特徴とするものを提供する。
【００２２】
本願の第４の発明は、上記の第１〜第３のいずれかの発明に係る磨砕機において、上記の付勢機構は、空気などの流体圧を利用した付勢手段を用いると共に、この流体圧による付勢力の調整を行うものであり、上記の動圧発生機構により発生する動圧と上記の付勢機構による付勢力との均衡にて、第１及び第２の研磨部材間の間隔を、０．１〜１０μｍの微小間隔に維持するようにしたことを特徴とするものを提供する。
【００２３】
本願の第５の発明は、上記の第１〜第４のいずれかの発明に係る磨砕機を用いて、上記の第１及び第２の両研磨部材の間に、被処理物を搬送する或いは被処理物自身となる流体を供給し、上記の動圧発生機構により発生する動圧と上記の付勢機構による付勢力との均衡にて、第１及び第２の研磨部材間の間隔を、０．１〜１０μｍの微小間隔に維持しつつ、磨砕や粉砕の処理を行うようにしたことを特徴とする被処理物の処理方法を提供するものである。
【００２４】
本願の上記第１乃至第５の発明に係る磨砕機は、上記の構成を採ることにより、付勢機構３の付勢に対し、動圧発生機構４が流体の両研磨部材１，２間を通過しようとする力を利用して両研磨部材１，２間の離反力を発生させ、少なくとも、付勢機構３の付勢と当該離反力との均衡により、両研磨部材１，２間について、従来機械的な方法では不可能であった、処理に必要な微小な間隔を確保することを可能とした。
【００２５】
特に、本願第２の発明に係る磨砕機は、上記の動圧発生機構４について、より好ましい手段を提供し得たものである。即ち、上記本願第２の発明に係る磨砕機は、双方の研磨部材１，２に鏡面研磨による平坦部を具備せしめると共に、当該平坦部の一方に、研磨部材の中心側から研磨部材の外側に流体が移動する経路を提供する溝を設けて、当該溝を鏡面研磨された両平坦部及び流路制限部にて、囲まれた空間とする。このため、溝を通り抜けようとする流体が流路制限部によって行き場を失い、少なくとも付勢機構３にて押し合わされた両平坦部の間に入り込み、両平坦部間（両研磨部材１，２間）に、従来機械的な方法では不可能であった、磨砕・粉砕処理に適した微小間隔を確保する。しかも、流路制限部が、回転の中心側から研磨部材の外側に向けて漸次溝の断面積を小さくすることによって、流体の通り抜けようとする力を徐々に受けるものであり、より円滑な上記の微小間隔の確保を可能とした。
【００２６】
更に、本願第３の発明に係る磨砕機では、研磨部材１，２が、フローティング機構によって、両研磨部材間の上記近接・離反のみならず、回転により両研磨部材１，２の少なくとも一方に生じた偏心挙動を、両研磨部材１，２の少なくとも他方が吸収する。このため、回転や発生した熱による研磨部材の変形によって、両平坦部間（両研磨部材１，２間）の各位置における間隔の不均衡を是正し、両平坦部間（両研磨部材１，２間）の各位置における隙間を一定のものとして、より確実で均一な処理を可能とした。即ち、フローティング機構によって、上記回転における、回転軸の芯振れ、軸膨張、第１研磨部材１の面振れ、振動を吸収することができ、上記の作用を奏することができる。
【００２７】
本願第４の発明に係る磨砕機は、空気などの流体圧を利用した付勢手段を用いると共に、この流体圧による付勢力の調整を行うものであり、フローティング機構の下、付勢機構と動圧発生機構とにおいて生じた力の均衡により、両研磨部材間の間隔を０．１〜１０μｍの微小間隔とし、従来不可能であった微小な磨砕や粉砕を実現した。
【００２８】
本願第５の発明に係る被処理物の処理方法は、流体圧による付勢力の調整を行うものであり、上記の動圧発生機構により発生する動圧と上記の付勢機構による付勢力との均衡にて、第１及び第２の研磨部材間の間隔を、０．１〜１０μｍの微小間隔に維持するようにし、従来不可能であった微小な磨砕や粉砕を実現した。
【００２９】
【発明の実施の形態】
以下、図面に基づき本願発明の実施の形態について説明する。
図１乃至図４へ、本願発明の一実施の形態を示す。図１は本願発明の一実施の形態に係る磨砕機の略縦断面図である。図２は、その一部切欠要部略縦断面図である。図３は、図１に示す磨砕機が備える第１研磨部材１の平面図である。図４は、上記磨砕機の第１及び第２研磨部材１，２の一部切欠要部略縦断面図である。
尚、説明の便宜上、Ｕは上方を、Ｓは下方を、夫々示している。
【００３０】
図１乃至図４に示す磨砕機は、大気圧下で、磨砕や粉砕処理の対象となる流体或いはこのような処理の対象物を搬送する流体が投入されるものである。
図１に示す通り、この磨砕機は、回転砥石である第１研磨部材１と、当該研磨部材１を保持する第１ホルダ１１と、固定砥石である第２研磨部材２と、当該第２研磨部材２が固定された第２ホルダ２１と、付勢機構３と、動圧発生機構４と、第１ホルダ１１と共に第１研磨部材１を回転させる駆動部５と、ハウジング６と、流体を供給（投入する）する導入部７と、流体を磨砕機の外部へ排出する排出部８とを備える。
以下、各部の構成について、詳しく説明する。
【００３１】
上記の第１研磨部材１と第２研磨部材２は、夫々、円柱の中心をくり抜いた形状の環状体である。両研磨部材１，２は、両研磨部材１，２の夫々が呈する円柱の一底面を研磨用面１０，２０とする砥石である。
上記の研磨用面１０，２０は、鏡面研磨された平坦部を有する。この実施の形態において、第２研磨部材２の研磨用面２０は、面全体に鏡面研磨が施された平坦面である。また、第１研磨部材１の研磨用面１０は、面全体を第２研磨部材２と同様の平坦面とするが、図３へ示す通り、平坦面中に、複数の溝１２…１２を有する。この溝１２…１２は、第１研磨部材１が呈する円柱の中心を中心側として円柱の外周方向へ、放射状に伸びる。
上記の第１及び第２の研磨部材１，２の研磨用面１０，２０についての、鏡面研磨は、面粗度Ｒａ０．０１〜１．０μｍとするのが好ましい。この鏡面研磨について、Ｒａ０．０３〜０．３μｍとするのがより好ましい。
研磨部材１，２の材質については、硬質且つ鏡面研磨が可能なものを採用する。研磨部材１，２のこの硬さについて、少なくともビッカース硬さ１５００以上、望ましくはビッカース硬さ１８００以上とする。また、線膨張係数が小さい素材を、採用するのが好ましい。磨砕処理にて熱を発する部分と他の部分との間で、膨張率の差が大きいと歪みが発生して、適正なクリアランスの確保に影響するからである。
このような研磨部材１，２の素材として、特に、ＳＩＣ（シリコンカーバイト／ビッカース硬さ２０００〜２５００）、表面にＤＬＣ（ダイヤモンドライクカーボン／ビッカース硬さ３０００〜４０００）コーティングが施されたＳＩＣ、ＷＣ（タングステンカーバイト／ビッカース硬さ１８００）、表面にＤＬＣコーティングが施されたＷＣ、ＺｒＢ2 やＢＴＣ，Ｂ4 Ｃに代表されるボロン系セラミック（ビッカース硬さ４０００〜５０００）などを採用するのが好ましい。
【００３２】
ハウジング６は、有底の筒状体であり、上方が上記の第２ホルダ２１に覆われている。第２ホルダ２１は、下面に上記第２研磨部２が固定されており、上方に上記導入部７が設けられている。導入部７は、外部から流体や被処理物を投入するためのホッパ７０を備える。
上記の駆動部５は、電動機などの動力源（図示せず。）と、当該動力源から動力の供給を受けて回転するシャフト５０とを備える。
上記回転は、第１研磨部材１の直径を１００ｍｍとした場合毎分２万回転、第１研磨部材１の直径を２００ｍｍとした場合毎分１万回転、第１研磨部材１の直径を４００ｍｍとした場合毎分５千回転である。即ち、第１研磨部材１の回転時の周速度という観点では、約６３００メートル毎分であり、これは、研磨用面１０と研磨用面２０のドライコンタクトを防止できるために可能となったのである。
図１に示すように、シャフト５０は、ハウジング６の内部に配され上下に伸びる。そして、シャフト５０の上端部に上記の第１ホルダ１１が、設けられている。第１ホルダ１１は、第１研磨部材１を保持するものであり、上記の通りシャフト５０に設けられることにより、第１研磨部材１の研磨用面１０を第２研磨部材２の研磨用面２０に対応させる。
【００３３】
第１ホルダ１１は、円柱状体であり、上面中央に、第１研磨部材１が固定されている。第１研磨部材１は、第１ホルダ１１と一体となるように、固着され、第１ホルダ１１に対してその位置を変えない。
一方、第２ホルダ２１の上面中央には、第２研磨部材２を受容する受容凹部２４が形成されている。
上記の受容凹部２４は、環状の横断面を有する。第２研磨部材２は、受容凹部２４と、同心となるように円柱状の受容凹部２４内に収容される。
【００３４】
詳しくは、上記の受容凹部２４内には、第２研磨部材２と別体の環状体２３が収容される。受容凹部２４の底面（天部２４ａ）には、突起物２７（ピン）が設けられている。環状体２３の上記天部２４ａを臨む面（上面）には、この突起物２７を収容することが可能な凹部２６が設けられている。突起物２７は、環状体２３の第２ホルダ２１に対する回り止めである。突起物２７は、凹部２６内に余裕（遊び）を持つように収容される。
この環状体２３の、受容凹部２４の天部２４ａと反対側（下方）に、第２研磨部材２が収容される。環状体２３の天部２４ａと反対側の面（下面）には、突起物２５（ピン）が設けられている。第２研磨部材２の研磨用面２０と反対側の面には、上記突起物２５を収容する凹部２２が設けられている。突起物２５は、環状体２３に対する第２研磨部材２の回り止めである。突起物２５は、凹部２２内に余裕（遊び）を持つように収容される。
【００３５】
そして、この第２ホルダ２１が、上記の付勢機構３を備える。付勢機構３は、ゴム製のＯリングやバネなどの弾性体を用いるのが好ましい。具体的には、この実施の形態において、上記の環状体２３について、その（上下）両端面間に複数の貫通孔３１…３１が設けられており、この貫通孔３１…３１に、付勢機構３となる複数のバネ３０…３０が収容される。これにて、第２研磨部材２の上面（研磨用面２０と反対側の面）と、受容凹部２４の底（天面２４ａ）との間に、第２研磨部材２を第１研磨部材１に向けて付勢する付勢機構３が介される。即ち、バネ３０…３０は、第２研磨部材２の研磨用面２０と反対側の面（底面）を押圧し、第１研磨部材１側（下方）に第２研磨部材２を付勢する。上記のバネ３０…３０は、受容凹部２４の底２４ａ上において、偏りなく分布する。
付勢機構３にバネを採用する場合、上記の通り複数のバネを用意するのに代え、第２研磨部材２の内周面の内径よりも大きく且つ第２研磨部材２の外径よりも小さな径を有するバネを一つ用意することによっても実施することができる。付勢機構３は、第２研磨部材２の研磨用面２０と反対側の面（図１及び図２において第２研磨部材２の上面）の各部に、偏りなく均一な付勢力を掛けることが可能なものであればよく、上記のバネに限定するものではない。
即ち、上記において、付勢機構３は、バネ３１のみにて構成されたものとしたが、この他、付勢機構３は、上記のバネ３１に代え、或いはバネ３１と共に、空気などの流体圧を利用した付勢手段を用いて実施することも可能である。
具体的には、図１に示すように、付勢機構３の一部として、高圧空気導入口３２を設けて、付勢力の調整を行うものとしても実施可能である。この場合、付勢機構３は、高圧空気導入口３２のみにて構成するものであってもよく、また、図１に示す通り、バネ３１と高圧空気導入口３２とによって構成するものであってもよい。
【００３６】
一方、受容凹部２４の内径は、第２研磨部材２の外径よりも大きく、これにて、上記の通り同心に配設した際、第２研磨部材２の外周面２ｂと受容凹部２４の内周面との間には、図２に示すように、隙間ｔ１が設定される。
同様に、第２研磨部材２の内周面２ａと受容凹部２４の中心部外周面との間には、図２に示すように、隙間ｔ２が設定される。
上記隙間ｔ１、ｔ２の夫々は、振動や偏芯挙動を吸収するためのものであり、動作寸法以上確保され且つシールが可能となる大きさに設定する。例えば、第１研磨部材１の直径が１００ｍｍから４００ｍｍの場合、当該隙間ｔ１、ｔ２の夫々は、０．１〜０．３ｍｍとするのが好ましい。
第１ホルダ１１は、その内ホルダ１５と共に、シャフト５０へ一体に固定され、シャフト５０と共に回転する。また、上記の突起物２５，２７によって、環状体２３を介しても、第２ホルダ２１に対して、第２研磨部材２は回らない。しかし、両研磨用面１０，２０間に、磨砕等の処理に必要な０．１〜１０ミクロンの微小な間隔ｔ（クリアランス／図４（Ｂ）参照）を確保するため、受容凹部２４の底面（天部２４ａ）と環状体２３の上記天部２４ａを臨む面（上面）と間に隙間ｔ３が設けられる。この隙間ｔ３については、上記のクリアランスと共に、シャフト５０の振れや伸びを考慮して設定する。
【００３７】
上記のように、隙間ｔ１〜ｔ３の設定により、第１研磨部材１は、第２研磨部材１に対して近接・離反する方向に可変であるのみならず、その研磨用面１０の中心や向き（方向ｚ１，ｚ２について）も可変としている。
即ち、この実施の形態において、付勢機構３と、上記隙間ｔ１〜ｔ３とが、フローティング機構を構成し、このフローティング機構によって、少なくとも第２研磨部材２の中心や傾きを、数ミクロンから数ミリの程度の僅かな量、可変としている。これにて、回転軸の芯振れ、軸膨張、第１研磨部材１の面振れ、振動を吸収する。
尚、上記突起物２５と凹部２２の間、及び突起物２７と凹部２６との間の遊びによって、第２研磨部材２の上記フローティング機構の動作は、確保され、これらの回り止めの機構に、当該動作が阻害されない。
【００３８】
第１研磨部材１の研磨用面１０が備える前記の溝１２について、更に詳しく説明する。溝１２の後端は、第１研磨部材１の内周面１ａに達するものであり、その先端を第１研磨部材１の外側ｙ（外周面側）に向けて伸ばす。この溝１２は、図３（Ａ）へ示すように、その横断面積を、環状の第１研磨部材１の中心ｘ側から、第１研磨部材１の外側ｙ（外周面側）に向かうにつれて、漸次減少するものとしている。
溝１２の左右両側面１２ａ，１２ｂの間隔ｗ１は、第１研磨部材１の中心ｘ側から、第１研磨部材１の外側ｙ（外周面側）に向かうにつれて小さくなる。また、溝１２の深さｗ２は、図３（Ｂ）へ示すように、第１研磨部材１の中心ｘ側から、第１研磨部材１の外側ｙ（外周面側）に向かうにつれて、小さくなる。即ち、溝１２の底１２ｃは、第１研磨部材１の中心ｘ側から、第１研磨部材１の外側ｙ（外周面側）に向かうにつれて、浅くなる。
このように、溝１２は、その幅及び深さの双方を、外側ｙ（外周面側）に向かうにつれて、漸次減少するものとして、その横断面積を外側ｙに向けて漸次減少させている。そして、溝１２の先端（ｙ側）は、行き止まりとなっている。即ち、溝１２の先端（ｙ側）は、第１研磨部材１の外周面１ｂに達するものではなく、溝１２の先端と外周面１ｂとの間には、外側平坦面１３が介在する（この外側平坦面１３は、研磨用面１０の一部である）。
この実施の形態において、このような溝１２の左右両側面１２ａ，１２ｂと底１２ｃとが流路制限部を構成している。この流路制限部と、第１研磨部材１の溝１２周囲の平坦部と、第２研磨部材２の平坦部とが、動圧発生機構４を構成している。
但し、溝１２の幅及び深さの何れか一方についてのみ、上記の構成を採るものとして、断面積を減少させるものとしてよい。その場合、上記の構成を採らない、左右両側面１２ａ，１２ｂ或いは底１２ｃは、流路制限部とならず、動圧発生機構４の構成要素とならない。
上記の動圧発生機構４は、第１研磨部材１の回転時、両研磨部材１，２間を通り抜けようとする流体によって、両研磨部材１，２の間に所望の微小間隔を確保することを可能とする、両研磨部材１，２を離反させる方向に働く力を発生させる。このような動圧の発生により、両研磨用面１０，２０間に、０．１〜１０μｍの微小間隔を発生させることができる。このような微小間隔は、処理の対象によって、調整し選択すればよいのであるが、１〜６μｍとするのが好ましく、より好ましくは、１〜２μｍである。この磨砕機においては、上記のような微小間隔による従来にない磨砕や粉砕処理が可能である。
【００３９】
溝１２…１２の夫々は、真っ直ぐ、中心ｘ側から外側ｙに伸びるものであっても実施可能である。但し、この実施の形態において、図３（Ａ）に示すように、第１研磨部材１の回転方向ｒについて、溝１２の中心ｘ側が、溝１２の外側ｙよりも、先行するように（前方に位置するように）、湾曲して溝１２を伸びるものとしている。
このように溝１２…１２が湾曲して伸びることにより、動圧発生機構４による離反力の発生をより効果的に行うことができる。
【００４０】
次に、この磨砕機の動作について説明する。
導入部７（ホッパ７０）から投入された、被処理物である流体Ｒは、環状の第２研磨部材２の中空部（中央）を通り、第１研磨部材１の回転よる遠心力を受けた流体は、両研磨部材１，２間に入り、回転する第１研磨部材１の研磨用面１０と、第２研磨部材２の研磨用面２０との間にて、磨砕や粉砕の処理が行われ、その後、両研磨部材１，２の外側に出て、排出部８から排出される。
上記において、環状の第２研磨部材２の中空部に入った流体Ｒは、図４（Ａ）へ示すように、先ず、回転する第１研磨部材１の溝１２に入る。一方、鏡面研磨された（平坦部である）両研磨用面１０，２０は、空気や窒素などの気体を通しても気密性が保たれている。従って、回転による遠心力を受けても、そのままでは、付勢機構３によって、押し合わされた両研磨用面１０，２０の間に、溝１２から流体は入り込むことはできない。しかし、流路制限部として形成された溝１２の上記両側面１２ａ，１２ｂや底１２ｃに、流体Ｒは徐々に突き当たり、両研磨用面１０，２０を離反させる方向に働く動圧を発生させる。これによって、流体Ｒが溝１２から平坦面に滲み出し、両研磨用面１０，２０の間に微小間隔（クリアランス）を確保することができる。そして、このような鏡面研磨された平坦面の間で、微小な磨砕や粉砕の処理が行われる。また上述の溝１２の湾曲が、より確実に流体へ遠心力を作用させ、上記動圧の発生をより効果的にしている。
このように、この磨砕機は、動圧と付勢機構３による付勢力との均衡にて、両鏡面（研磨用面１０，２０）間に、微細な間隔（クリアランス）を確保することを可能とした。そして、上記の構成により、当該微細間隔は、１μｍ以下の超微細なものとすることができる。
また、上記フローティング機構の採用により、研磨用面１０，２０間のアライメントの自動調整が可能となり、回転や発生した熱による各部の物理的な変形に対して、研磨用面１０，２０間の各位置における、クリアランスのばらつきを、抑制し、当該各位置における上記の小間隔の維持を可能とした。
【００４１】
尚、上記の実施の形態において、フローティング機構は、第２ホルダ２１にのみ設けられた機構であった。この他、第２ホルダ２１に代え、或いは第２ホルダ２１と共に、フローティング機構を、第２ホルダ２１にも設けるものとして実施することも可能である。
【００４２】
図５乃至図７に、上記の溝１２について、他の実施の形態を示す。
図５（Ａ）（Ｂ）に示すように、溝１２は、流路制限部の一部として、先端に平らな壁面１２ｄを備えるものとして実施することができる。また、この図５に示す実施の形態では、底１２ｃにおいて、第１壁面１２ｄと、内周面１ａとの間に段差１２ｅが設けられており、この段差１２ｅも流路制限部の一部を構成する。
図６（Ａ）（Ｂ）に示すように、溝１２は、複数に分岐する枝部１２ｆ…１２ｆを備えるものとし、各枝部１２ｆがその幅を狭めることにより流路制限部を備えるものとしても実施可能である。
図５及び図６の実施の形態においても、特に示した以外の構成については、図１乃至図４に示す実施の形態と同様である。
【００４３】
また、上記の各実施の形態において、溝１２の幅及び深さの少なくとも何れか一方について、第１研磨部材１の内側から外側に向けてその寸法を漸次小さくすることにて、流路制限部を構成するものとした。この他、図７（Ａ）や図７（Ｂ）へ示す通り、溝１２の幅や深さを変化させずに、溝１２に終端面１２ｆを設けることによって、このような溝１２の終端面１２ｆを流路制限部とすることができる。図３、図５及び図６に示す実施の形態において示した通り、動圧発生は、溝１２の幅及び深さを既述の通り変化させることによって溝１２の底や両側面を傾斜面とすることで、この傾斜面が流体に対する受圧部になり動圧を発生させた。一方図７（Ａ）（Ｂ）に示す実施の形態では、溝１２の終端面が流体に対する受圧部になり動圧を発生させる。
また、この図７（Ａ）（Ｂ）に示す場合、溝１２の幅及び深さの少なくとも何れか一方の寸法を漸次小さくすることも併せて実施することができる。
尚、溝１２の構成について、上記の図３、図５乃至図７に示すものに限定するものではなく、他の形状の流路制限部を備えたものとして実施することが可能である。
例えば、図３、図５乃至図７示すものでは、溝１２は、第１研磨部材１の外側に突き抜けるものではなかった。即ち、第１研磨部材１の外周面と、溝１２との間には、外側平坦面１３が存在した。しかし、このような実施の形態に限定するものではなく、上述の動圧を発生されることが可能であれば、溝１２は、第１研磨部材１の外周面側に達するものであっても実施可能である。
例えば、図７（Ｂ）に示す第１研磨部材１の場合、点線で示すように、溝１２の他の部位よりも断面積が小さな部分を、外側平坦面１３に形成して実施することができる。
また、溝１２を、上記の通り内側から外側へ向けて漸次断面積を小さくするように形成し、溝１２の第研磨部材１の外周に達した部分（終端）を、最も断面積が小さいものとすればよい（図示せず）。但し、動圧を効果的に発生させる上で、図３、図５乃至図７に示すように、溝１２は、第１研磨部材１の外周面側に突き抜けないほうが好ましい。
【００４４】
上記の各実施の形態では、第１研磨部材１のみが回転し、第２研磨部材２は、回転しないものとした。この他、第１研磨部材１のみならず、第２研磨部材２も回転するものとしても実施可能である。この場合、第２研磨部材２は、第１研磨部材１の回転方向ｒに対し、逆方向に回転するものとする。
このような磨砕機として、例えば、図８に示すように、既述の駆動部５とは別個の、シャフト５０ａを備えた駆動部５ａを設けて、ハウジング６と独立して形成された第２ホルダ２１を回転させればよい。この場合、駆動部５ａのシャフト５０ａを中空として、このシャフト５０内部を導入部７とする。
図８に示す磨砕機では、図１及び図２に示す磨砕機と同様、フローティング機構は、第２ホルダ２１が備えるものである。この他、第２ホルダ２１に代え或いは第２ホルダ２１と共に第１ホルダ１１もフローティング機構を備えるものとしても実施可能である。
【００４５】
最後に、本願発明について、総括する。
本願発明に係る磨砕機は、耗外周部に平坦磨砕面を有する回転砥石と同じく外周部に平坦磨砕面を有する固定砥石とをそれらの平坦磨砕面で同心的に相対向させ、同回転砥石の回転下に固定砥石の開口部より被粉砕原料を供給しながら両砥石の対向平面磨砕面間より該被粉砕原料を磨砕、粉砕して処理する磨砕機において機械的にクリアランスを調整するのではなく、回転砥石に増圧機構を設けてその圧力発生によりクリアランスを保持しかつ機械的クリアランス調整では、不可能であった１〜６μｍの微小クリアランスを可能とし磨砕、粉砕能力が著しく向上出来たものである。
即ち、本願発明は、回転砥石と固定砥石がその外周部に平坦磨砕面を有しその平坦磨砕面において、面上の密封機能を有することで流体静力学的（ハイドロスタティック）一流体動力学的（ハイドロダイナミック）な力、或いは、エアロスタティック−エアロダイナミックな力を発生させる高速回転式の磨砕機を提供しようとするものである。上記の力は、上記密封面間に僅かな間隙を発生させ、また非接触で機械的に安全で高度な磨砕機能を有した磨砕装置を提供することができる。この僅かな隙間が形成されうる要因は、一つは、回転砥石の回転速度によるものであり、もう一つは、被粉砕原料の投入側と排出側の圧力差によるものである。投入側に圧力付与機構が付設されている場合は、本願の出願人が先に行った特願２００２−２０７５３３で有益な発明を報告しているが、投入側に圧力付与機構が付設されていない場合即ち大気圧下で被粉砕原料を投入される場合、圧力差が無いわけであるから回転砥石の回転速度だけで密封面間の分離を生じさせる必要がある。これは、ハイドロダイナミックもしくはエアロダイナミック力として知られている。
【００４６】
【発明の効果】
本願第１乃至第４の発明は、被粉砕原料を流体とし、或いは被粉砕原料を流体中に投入する場合において、上下二枚の砥石（研磨部材）のクリアランスを１５μｍ以下にすることを実現した磨砕を提供し得たものである。即ち、最近のナノテクノロジーに関する開発に絶対的に必要とされる超微粉砕を実現したものである。さらに、本願の第５の発明は、かかる磨砕機を用いて、超微粉砕を可能にする被処理物の処理方法を提供し得たものである。
【図面の簡単な説明】
【図１】本願発明の一実施の形態に係る磨砕機の一部切欠縦断面図である。
【図２】上記の磨砕機の、第１研磨部材１及び第１ホルダ１１を中心とする要部略縦断面図である。
【図３】（Ａ）は上記磨砕機の第１研磨部材１の平面図であり、（Ｂ）はその要部縦断面図である。
【図４】（Ａ）は上記磨砕機の第１及び第２研磨部材１，２の要部縦断面図であり、（Ｂ）は微小間隔が開けられた上記第１及び第２研磨部材１，２の要部縦断面図である。
【図５】（Ａ）は第１研磨部材１の他の実施の形態の平面図であり、（Ｂ）はその要部略縦断面図である。
【図６】（Ａ）は第１研磨部材１の、更に他の実施の形態の平面図であり、（Ｂ）はその要部略縦断面図である。
【図７】（Ａ）は第１研磨部材１のまた更に他の実施の形態の平面図であり、（Ｂ）は第１研磨部材１の更にまた他の実施の形態の平面図である。
【図８】磨砕機の他の実施の形態を示す一部切欠略縦断面図である。
【符号の説明】
１第１研磨部材
２第２研磨部材
３付勢機構
４動圧発生機構[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a grinder.
[0002]
[Prior art]
The grinding machine that uses the grinding mill principle has two upper and lower grinding wheels that can adjust the distance between each other, and generates strong centrifugal force, impact grinding force, and shear between the fixed grinding wheel and the grinding wheel that rotates at high speed. And pulverization is performed by their combined action. As such a rotating grindstone, a fixed grindstone, and a grinding apparatus using the same, those shown in Patent Documents 1 to 5 below can be cited.
[0003]
[Patent Document 1]
Design Registration No. 655304
[0004]
[Patent Document 2]
Design Registration No. 845632
[0005]
[Patent Document 3]
Japanese Examined Patent Publication No. 62-51658
[0006]
[Patent Document 4]
Japanese Patent Publication No. 3-1061
[0007]
[Patent Document 5]
Japanese Patent Publication No. 4-55830
[0008]
Here, the rotating grindstone and the fixed grindstone are generally called grinders, and the particle sizes thereof are usually about 16 #, 24 # to 120 #, and 240 #. Although these grinders have different particle sizes, they have irregularities formed on the surface. When the hardness of the object to be crushed is high, the protrusions are peeled off and worn, and there is a problem of foreign matter contamination.
[0009]
On the other hand, in the grinding device shown in the following Patent Document 6, it has been reported that the sprayed fuel, soybean milk, etc. are ground into fine particles of about 1 to 5 μm, but at present, ultrafine particles of 1 μm or less are used. Can not get.
[0010]
[Patent Document 6]
JP-B 62-51658
[0011]
Moreover, in the thing shown by the following patent document 7, in the fine grinding | pulverization of the substance containing many high lipid, high water | moisture content, high protein, saccharide | sugar, and a special enzyme, the characteristic physical property which those to-be-ground materials have has. For this reason, it was impossible to commercialize powder as a result of changes in physical properties due to stickiness, stickiness, scorching, film formation, etc. due to frictional heat, but suddenly when the peripheral speed of the rotating stone exceeded a certain line It has been reported that the grinding ability improves and the temperature rise due to frictional heat decreases. However, at the peripheral speed of 3422 m / min, it has been simultaneously reported that there are problems in machine cost and mechanical safety.
[0012]
[Patent Document 7]
JP 7-185372 A
[0013]
Further, in the following Patent Document 8, a method for automatically controlling the clearance between the rotating grindstone and the fixed grindstone is reported. However, in this method, mechanical heat is generated by high-speed rotation, and thermal expansion of the drive shaft and the core of the rotating grindstone are performed. Since there is no shock absorber such as runout, the minimum clearance becomes several tens of μm or more.
[0014]
[Patent Document 8]
JP-A-8-1020
[0015]
Next, in Patent Document 9 below, an invention useful for a fluid to be treated, particularly wet (liquid) pulverization / dispersion / emulsification, has been reported. This is a fluid that applies a predetermined pressure to a fluid to be treated. A pressure applying mechanism and a water head pressure are required.
[0016]
[Patent Document 9]
Japanese Patent Application No. 2002-207533
[0017]
After all, in the conventional apparatuses described above, when the raw material to be crushed is charged under atmospheric pressure, it is not possible to achieve a clearance of 15 μm or less between the upper and lower grindstones (polishing members). In other words, the above-described minute clearance suitable for fine grinding and pulverization cannot be secured between the grindstones by conventional mechanical means. On the other hand, when milling and grinding using a mill, foreign matter (foreign matter generated by contact between mills and the mill and other parts) is mixed in, and high speed that can be rotated at high speed to ensure safety. There were no high-performance pulverizers.
[0018]
[Problems to be solved by the invention]
The present invention has been made on the basis of the above circumstances, and provides a grinding machine that realizes ultrafine grinding that is absolutely necessary for the development of recent nanotechnology. In other words, it is a grinding machine that can be finely pulverized with high accuracy, has no foreign matter, has a simple structure, is highly safe, and can be manufactured at low cost. The above problem is solved by providing a grinding machine that enables fine pulverization of micron or less, and further, adaptability and physical properties of the material to be crushed.
[0019]
[Means for Solving the Problems]
  The first invention of the present application isProvided with at least two polishing members that are disposed so as to face each other and perform grinding and pulverization by rotating at least one relative to the other, both polishing from the center side of the rotation In a grinding machine that conveys a workpiece or supplies a fluid to be processed itself between members, and discharges the fluid to the outside of the first and second polishing members.
The first and second polishing members are arranged such that at least one of them is close to or away from the other,
An urging mechanism that acts in a direction in which the two polishing members are at least close to each other;
Said 1st and 2nd polishing member is equipped with the dynamic pressure generation mechanism which makes the force which fluid tries to pass between both polishing members act in the direction which separates both polishing members,
By maintaining a balance between the dynamic pressure generated by the dynamic pressure generating mechanism and the biasing force by the biasing mechanism, the distance between the first and second polishing members is maintained at a minute distance of 0.1 to 10 μm. A grinding machine characterized by the above is provided.
  Here, the fluid includes liquid, gas, liquid containing solid, and gas containing solid. Further, this fluid includes both a case where it is a processing object and a case where it is not a processing object.
  The attritor includes an apparatus for performing emulsification and dispersion, and an atomizer (atomizer) in addition to an apparatus for performing attrition and pulverization.
[0020]
  According to a second invention of the present application, in the attritor according to the first invention, both the first and second polishing members include a flat portion subjected to mirror polishing, and one of the polishing members is flat. A groove is provided in the portion, and the groove extends from the center side of the polishing member toward the outside of the polishing member, passes through the groove, and passes through the groove from the center of the polishing member to the outside of the polishing member. A flow path limiting portion is provided for limiting the flow path, and the flow path limiting portion gradually reduces the cross-sectional area of the groove from the center of rotation toward the outside of the polishing member. Provides the above-described dynamic pressure generating mechanism.
[0021]
  According to a third invention of the present application, in the attritor according to the first or second invention, at least one of the first and second polishing members includes a floating mechanism, and the floating mechanism includes both polishing. Provided is one that enables the above-described approaching / separation between members, and that at least the other of both polishing members absorbs the eccentric behavior generated in at least one of both polishing members by rotation.
[0022]
  According to a fourth invention of the present application, in the attritor according to any one of the first to third inventions, the urging mechanism uses an urging means using fluid pressure such as air, and the fluid. The biasing force is adjusted by the pressure, and the distance between the first and second polishing members is determined by balancing the dynamic pressure generated by the dynamic pressure generating mechanism and the biasing force by the biasing mechanism. , 0.1 to 10 [mu] m minute intervals are maintained.
[0023]
  5th invention of this application conveys a to-be-processed object between both said 1st and 2nd grinding | polishing members using the grinder which concerns on one of said 1st-4th invention, or The fluid to be processed itself is supplied, and the balance between the dynamic pressure generated by the dynamic pressure generating mechanism and the urging force by the urging mechanism is set to the interval between the first and second polishing members, An object of the present invention is to provide a processing method for an object to be processed, characterized in that grinding and pulverization are performed while maintaining a minute interval of 0.1 to 10 μm.
[0024]
In the grinding machine according to the first to fifth inventions of the present application, the dynamic pressure generating mechanism 4 moves between the two polishing members 1 and 2 of the fluid against the biasing of the biasing mechanism 3 by adopting the above configuration. A separation force between the polishing members 1 and 2 is generated using a force to pass through, and at least between the polishing members 1 and 2 due to the balance between the urging force of the urging mechanism 3 and the separation force. It was possible to secure a minute interval necessary for processing, which was impossible with conventional mechanical methods.
[0025]
  In particular, the grinder according to the second invention of the present application can provide a more preferable means for the dynamic pressure generating mechanism 4 described above. That is, in the grinding machine according to the second invention of the present application, both of the polishing members 1 and 2 are provided with a flat portion by mirror polishing, and on one of the flat portions from the center side of the polishing member to the outside of the polishing member. A groove is provided to provide a path for the fluid to move, and the groove is defined as a space surrounded by both mirror-polished flat portions and the flow path restriction portion. For this reason, the fluid that tries to pass through the groove loses its place by the flow path restricting portion, enters at least between the two flat portions pressed together by the urging mechanism 3, and between the two flat portions (between the two polishing members 1 and 2). ) To ensure a fine interval suitable for grinding and pulverization, which was impossible with conventional mechanical methods.Moreover, the flow path restricting portion gradually receives a force to try to pass through the fluid by gradually reducing the cross-sectional area of the groove from the center side of rotation toward the outside of the polishing member, so that the smoother It was possible to secure a minute interval.
[0026]
  Further, in the grinding machine according to the third invention of the present application, the polishing members 1 and 2 are generated not only in the proximity and separation between the two polishing members but also in at least one of the two polishing members 1 and 2 by rotation by the floating mechanism. At least the other of the polishing members 1 and 2 absorbs the eccentric behavior. For this reason, the deformation of the polishing member due to rotation or generated heat corrects the imbalance in the distance between the flat portions (between both polishing members 1 and 2), and between the flat portions (both polishing members 1 and 1). The gap at each position (between 2) is fixed, and more reliable and uniform processing is possible. That is, the floating mechanism can absorb the runout of the rotation shaft, the shaft expansion, the surface shake and vibration of the first polishing member 1 in the above rotation, and the above-described effects can be achieved.
[0027]
  The grinder according to the fourth invention of the present application is:While using an urging means using fluid pressure such as air, the urging force is adjusted by this fluid pressure.Under the floating mechanism, the balance between the force generated in the urging mechanism and the dynamic pressure generating mechanism is set so that the distance between both polishing members is 0.1 to 10 μm. Grinding was realized.
[0028]
  The processing method of the to-be-processed object based on this invention 5 adjusts the urging | biasing force by a fluid pressure, and the dynamic pressure which generate | occur | produces by said dynamic pressure generation mechanism, and the urging | biasing force by said urging mechanism The balance between the first and second polishing members was maintained at a minute distance of 0.1 to 10 μm in a balanced manner, thereby realizing minute grinding and pulverization that were impossible in the past.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 4 show an embodiment of the present invention. FIG. 1 is a schematic longitudinal sectional view of a grinding machine according to an embodiment of the present invention. FIG. 2 is a schematic vertical sectional view showing a part of the notch. FIG. 3 is a plan view of the first polishing member 1 provided in the attritor shown in FIG. FIG. 4 is a schematic vertical cross-sectional view of a part of the first and second polishing members 1 and 2 of the above-described grinder.
For convenience of explanation, U indicates the upper side and S indicates the lower side.
[0030]
The grinder shown in FIGS. 1 to 4 is one in which a fluid to be subjected to grinding or pulverization processing or a fluid for conveying an object to be processed is introduced under atmospheric pressure.
As shown in FIG. 1, this grinding machine includes a first polishing member 1 that is a rotating grindstone, a first holder 11 that holds the polishing member 1, a second polishing member 2 that is a fixed grindstone, and the second polishing. The second holder 21 to which the member 2 is fixed, the biasing mechanism 3, the dynamic pressure generating mechanism 4, the drive unit 5 that rotates the first polishing member 1 together with the first holder 11, the housing 6, and the fluid are supplied. It includes an introduction unit 7 (to input) and a discharge unit 8 that discharges the fluid to the outside of the grinder.
Hereinafter, the configuration of each unit will be described in detail.
[0031]
Each of the first polishing member 1 and the second polishing member 2 is an annular body having a shape obtained by hollowing out the center of a cylinder. Both the polishing members 1 and 2 are grindstones having the polishing surfaces 10 and 20 as one bottom surface of a cylinder exhibited by each of the polishing members 1 and 2.
The polishing surfaces 10 and 20 have flat portions that are mirror-polished. In this embodiment, the polishing surface 20 of the second polishing member 2 is a flat surface in which the entire surface is mirror-polished. Further, the polishing surface 10 of the first polishing member 1 has the same flat surface as the second polishing member 2, but has a plurality of grooves 12 ... 12 in the flat surface as shown in FIG. . The grooves 12... 12 extend radially in the outer circumferential direction of the cylinder with the center of the cylinder exhibited by the first polishing member 1 as the center.
The mirror polishing of the polishing surfaces 10 and 20 of the first and second polishing members 1 and 2 is preferably a surface roughness Ra of 0.01 to 1.0 μm. The mirror polishing is more preferably Ra 0.03 to 0.3 μm.
The material of the polishing members 1 and 2 is a hard material that can be mirror polished. The hardness of the polishing members 1 and 2 is at least Vickers hardness 1500 or more, preferably Vickers hardness 1800 or more. Moreover, it is preferable to employ a material having a small linear expansion coefficient. This is because a large difference in expansion coefficient between the portion that generates heat and other portions in the grinding treatment causes distortion and affects the securing of an appropriate clearance.
As materials for such polishing members 1 and 2, in particular, SIC (silicon carbide / Vickers hardness 2000-2500), SIC coated with DLC (diamond-like carbon / Vickers hardness 3000-4000) on the surface, It is preferable to employ WC (tungsten carbide / Vickers hardness 1800), WC having a DLC coating on the surface, boron-based ceramics (Vickers hardness 4000 to 5000) typified by ZrB2 and BTC, B4 C, and the like. .
[0032]
The housing 6 is a bottomed cylindrical body, and the upper part is covered with the second holder 21. As for the 2nd holder 21, the said 2nd grinding | polishing part 2 is being fixed to the lower surface, and the said introduction part 7 is provided upwards. The introduction unit 7 includes a hopper 70 for introducing a fluid and an object to be processed from the outside.
The drive unit 5 includes a power source (not shown) such as an electric motor, and a shaft 50 that rotates upon receiving power from the power source.
The rotation is 20,000 rotations per minute when the diameter of the first polishing member 1 is 100 mm, 10,000 rotations per minute when the diameter of the first polishing member 1 is 200 mm, and the diameter of the first polishing member 1 is 400 mm. 5,000 revolutions per minute. That is, from the viewpoint of the peripheral speed during rotation of the first polishing member 1, it is about 6300 meters per minute, which is possible because dry contact between the polishing surface 10 and the polishing surface 20 can be prevented. is there.
As shown in FIG. 1, the shaft 50 is arranged inside the housing 6 and extends vertically. The first holder 11 is provided at the upper end of the shaft 50. The first holder 11 holds the first polishing member 1 and is provided on the shaft 50 as described above, whereby the polishing surface 10 of the first polishing member 1 is changed to the polishing surface 20 of the second polishing member 2. To correspond to.
[0033]
The first holder 11 is a cylindrical body, and the first polishing member 1 is fixed at the center of the upper surface. The first polishing member 1 is fixed so as to be integrated with the first holder 11 and does not change its position with respect to the first holder 11.
On the other hand, a receiving recess 24 for receiving the second polishing member 2 is formed in the center of the upper surface of the second holder 21.
The receiving recess 24 has an annular cross section. The second polishing member 2 is accommodated in the cylindrical receiving recess 24 so as to be concentric with the receiving recess 24.
[0034]
Specifically, in the receiving recess 24, the second polishing member 2 and a separate annular body 23 are accommodated. A protrusion 27 (pin) is provided on the bottom surface (the top portion 24 a) of the receiving recess 24. On the surface (upper surface) of the annular body 23 facing the top portion 24a, a concave portion 26 capable of accommodating the protrusion 27 is provided. The protrusion 27 is a detent for the annular body 23 relative to the second holder 21. The protrusion 27 is accommodated in the recess 26 so as to have a margin (play).
The second polishing member 2 is accommodated on the annular body 23 on the opposite side (downward) from the top 24 a of the receiving recess 24. Projections 25 (pins) are provided on the surface (lower surface) of the annular body 23 opposite to the top 24a. On the surface opposite to the polishing surface 20 of the second polishing member 2, a recess 22 for accommodating the protrusion 25 is provided. The protrusion 25 is a rotation stopper of the second polishing member 2 with respect to the annular body 23. The protrusion 25 is accommodated in the recess 22 so as to have a margin (play).
[0035]
The second holder 21 includes the urging mechanism 3 described above. The urging mechanism 3 preferably uses an elastic body such as a rubber O-ring or a spring. Specifically, in this embodiment, the annular body 23 is provided with a plurality of through holes 31... 31 between the (upper and lower) both end faces, and the through holes 31. A plurality of springs 30... Thus, the second polishing member 2 is placed between the upper surface of the second polishing member 2 (the surface opposite to the polishing surface 20) and the bottom of the receiving recess 24 (the top surface 24a). An urging mechanism 3 is urged toward the end. That is, the springs 30 ... 30 press the surface (bottom surface) opposite to the polishing surface 20 of the second polishing member 2 and urge the second polishing member 2 toward the first polishing member 1 (downward). The springs 30 ... 30 are distributed evenly on the bottom 24a of the receiving recess 24.
When a spring is employed for the urging mechanism 3, instead of preparing a plurality of springs as described above, it is larger than the inner diameter of the inner peripheral surface of the second polishing member 2 and smaller than the outer diameter of the second polishing member 2. It can also be implemented by preparing one spring having a diameter. The urging mechanism 3 may apply a uniform urging force to each part of the surface of the second polishing member 2 opposite to the polishing surface 20 (the upper surface of the second polishing member 2 in FIGS. 1 and 2) without deviation. What is possible is not limited to the spring described above.
That is, in the above description, the urging mechanism 3 is configured only by the spring 31. In addition to this, the urging mechanism 3 is replaced with the spring 31 or together with the spring 31, a fluid pressure such as air. It is also possible to carry out using an urging means using.
Specifically, as shown in FIG. 1, as a part of the urging mechanism 3, a high-pressure air introduction port 32 may be provided to adjust the urging force. In this case, the urging mechanism 3 may be constituted only by the high-pressure air inlet 32, and is constituted by the spring 31 and the high-pressure air inlet 32 as shown in FIG. Also good.
[0036]
On the other hand, the inner diameter of the receiving recess 24 is larger than the outer diameter of the second polishing member 2, so that when arranged concentrically as described above, the inner surface of the outer peripheral surface 2 b of the second polishing member 2 and the receiving recess 24. As shown in FIG. 2, a gap t1 is set between the peripheral surface.
Similarly, a gap t2 is set between the inner peripheral surface 2a of the second polishing member 2 and the outer peripheral surface of the central portion of the receiving recess 24 as shown in FIG.
Each of the gaps t1 and t2 is for absorbing vibrations and eccentric behavior, and is set to a size that can ensure the operating dimension or more and can be sealed. For example, when the diameter of the first polishing member 1 is 100 mm to 400 mm, each of the gaps t1 and t2 is preferably 0.1 to 0.3 mm.
The first holder 11 together with the inner holder 15 is integrally fixed to the shaft 50 and rotates together with the shaft 50. Further, the second polishing member 2 does not rotate with respect to the second holder 21 by the protrusions 25 and 27 even through the annular body 23. However, in order to secure a fine space t (clearance / see FIG. 4B) necessary for processing such as grinding between the polishing surfaces 10 and 20, the receiving recess 24 A gap t3 is provided between the bottom surface (top portion 24a) and the surface (upper surface) of the annular body 23 facing the top portion 24a. The gap t3 is set in consideration of the deflection and elongation of the shaft 50 together with the clearance.
[0037]
As described above, by setting the gaps t1 to t3, the first polishing member 1 is not only variable in the direction approaching / separating from the second polishing member 1, but also the center and orientation of the polishing surface 10 thereof. (Regarding directions z1 and z2) is also variable.
That is, in this embodiment, the urging mechanism 3 and the gaps t1 to t3 constitute a floating mechanism, and this floating mechanism allows at least the center and inclination of the second polishing member 2 to be several microns to several millimeters. A slight amount of the amount is variable. This absorbs the runout and axial expansion of the rotating shaft, the surface runout and vibration of the first polishing member 1.
In addition, the operation of the floating mechanism of the second polishing member 2 is ensured by play between the protrusion 25 and the recess 22 and between the protrusion 27 and the recess 26. The operation is not hindered.
[0038]
The groove 12 provided on the polishing surface 10 of the first polishing member 1 will be described in more detail. The rear end of the groove 12 reaches the inner peripheral surface 1 a of the first polishing member 1, and its front end extends toward the outer side y (outer peripheral surface side) of the first polishing member 1. As shown in FIG. 3A, the groove 12 has a cross-sectional area from the center x side of the annular first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1. It is supposed to gradually decrease.
The distance w1 between the left and right side surfaces 12a, 12b of the groove 12 decreases from the center x side of the first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1. Further, the depth w2 of the groove 12 decreases from the center x side of the first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1, as shown in FIG. . That is, the bottom 12 c of the groove 12 becomes shallower from the center x side of the first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1.
Thus, both the width and the depth of the groove 12 are gradually decreased toward the outer side y (outer peripheral surface side), and the cross-sectional area is gradually decreased toward the outer side y. And the front-end | tip (y side) of the groove | channel 12 is a dead end. That is, the front end (y side) of the groove 12 does not reach the outer peripheral surface 1b of the first polishing member 1, and the outer flat surface 13 is interposed between the front end of the groove 12 and the outer peripheral surface 1b (this). The outer flat surface 13 is a part of the polishing surface 10).
In this embodiment, the left and right side surfaces 12a and 12b and the bottom 12c of the groove 12 constitute a flow path restricting portion. The flow path restricting portion, the flat portion around the groove 12 of the first polishing member 1, and the flat portion of the second polishing member 2 constitute a dynamic pressure generating mechanism 4.
However, only one of the width and the depth of the groove 12 may be configured to reduce the cross-sectional area by adopting the above configuration. In that case, the left and right side surfaces 12a, 12b or the bottom 12c, which do not adopt the above-described configuration, do not serve as a flow path restricting portion and do not serve as a component of the dynamic pressure generating mechanism 4.
The dynamic pressure generating mechanism 4 secures a desired minute interval between the polishing members 1 and 2 by a fluid that tries to pass between the polishing members 1 and 2 when the first polishing member 1 rotates. It is possible to generate a force that works in the direction of separating the two polishing members 1 and 2. By generating such a dynamic pressure, a minute interval of 0.1 to 10 μm can be generated between the polishing surfaces 10 and 20. Such a minute interval may be adjusted and selected according to the object of processing, but is preferably 1 to 6 μm, and more preferably 1 to 2 μm. In this attritor, unprecedented attrition and pulverization can be performed with the above-mentioned minute intervals.
[0039]
Each of the grooves 12... 12 can be implemented even if it extends straight from the center x side to the outer side y. However, in this embodiment, as shown in FIG. 3A, with respect to the rotation direction r of the first polishing member 1, the center x side of the groove 12 precedes the outer side y of the groove 12 (frontward). It is assumed that the groove 12 is curved and extends.
In this way, the grooves 12... 12 are curved and extended, so that the separation force can be generated more effectively by the dynamic pressure generating mechanism 4.
[0040]
Next, the operation of this attritor will be described.
The fluid R, which is an object to be processed, introduced from the introduction portion 7 (hopper 70) passes through the hollow portion (center) of the annular second polishing member 2 and receives centrifugal force due to the rotation of the first polishing member 1. The fluid enters between the polishing members 1 and 2 and is subjected to grinding and pulverization between the rotating polishing surface 10 of the first polishing member 1 and the polishing surface 20 of the second polishing member 2. After that, it goes outside the polishing members 1 and 2 and is discharged from the discharge portion 8.
In the above, the fluid R that has entered the hollow portion of the annular second polishing member 2 first enters the groove 12 of the rotating first polishing member 1 as shown in FIG. On the other hand, both polishing surfaces 10 and 20 that have been mirror-polished (flat portions) are kept airtight even through a gas such as air or nitrogen. Accordingly, even if the centrifugal force due to the rotation is received, the fluid cannot enter the groove 12 between the polishing surfaces 10 and 20 pressed together by the biasing mechanism 3 as it is. However, the fluid R gradually strikes the side surfaces 12a and 12b and the bottom 12c of the groove 12 formed as the flow path restricting portion, and generates a dynamic pressure that works in a direction that separates both the polishing surfaces 10 and 20. As a result, the fluid R oozes out from the groove 12 to the flat surface, and a fine gap (clearance) can be secured between the polishing surfaces 10 and 20. Then, a fine grinding and pulverizing process is performed between the mirror-polished flat surfaces. Further, the above-described curvature of the groove 12 causes the centrifugal force to act on the fluid more reliably, and makes the generation of the dynamic pressure more effective.
Thus, this grinding machine can secure a fine gap (clearance) between both mirror surfaces (polishing surfaces 10 and 20) by balancing the dynamic pressure and the urging force by the urging mechanism 3. It was. And by said structure, the said fine space | interval can be made into the ultra fine thing of 1 micrometer or less.
In addition, the use of the floating mechanism enables automatic adjustment of the alignment between the polishing surfaces 10 and 20, and each physical relationship between the polishing surfaces 10 and 20 against physical deformation of each part due to rotation or generated heat. The variation in the clearance at the position is suppressed, and the above-described small interval at each position can be maintained.
[0041]
In the above embodiment, the floating mechanism is a mechanism provided only in the second holder 21. In addition, instead of the second holder 21 or together with the second holder 21, a floating mechanism can be provided also in the second holder 21.
[0042]
5 to 7 show other embodiments of the groove 12 described above.
As shown in FIGS. 5A and 5B, the groove 12 can be implemented as having a flat wall surface 12d at the tip as part of the flow path restricting portion. In the embodiment shown in FIG. 5, a step 12e is provided on the bottom 12c between the first wall surface 12d and the inner peripheral surface 1a, and this step 12e also forms a part of the flow path restricting portion. Constitute.
As shown in FIGS. 6 (A) and 6 (B), the groove 12 is provided with branch portions 12f... 12f that branch into a plurality of portions, and each branch portion 12f is provided with a flow path restriction portion by narrowing its width. Can also be implemented.
Also in the embodiment of FIGS. 5 and 6, the configuration other than that specifically shown is the same as that of the embodiment shown in FIGS. 1 to 4.
[0043]
Further, in each of the above-described embodiments, the flow path restriction portion is formed by gradually reducing the size of at least one of the width and the depth of the groove 12 from the inside to the outside of the first polishing member 1. It was supposed to constitute. In addition, as shown in FIGS. 7A and 7B, by providing the end surface 12f in the groove 12 without changing the width and depth of the groove 12, the end surface of such a groove 12 is provided. 12f can be used as a flow path restriction part. As shown in the embodiment shown in FIGS. 3, 5, and 6, the dynamic pressure is generated by changing the width and depth of the groove 12 as described above so that the bottom and both side surfaces of the groove 12 are inclined surfaces. By doing so, this inclined surface became a pressure receiving portion for the fluid, and dynamic pressure was generated. On the other hand, in the embodiment shown in FIGS. 7A and 7B, the end surface of the groove 12 becomes a pressure receiving portion for the fluid to generate dynamic pressure.
Further, in the case shown in FIGS. 7A and 7B, it is also possible to gradually reduce at least one of the width and depth of the groove 12 at the same time.
Note that the configuration of the groove 12 is not limited to that shown in FIGS. 3 and 5 to 7 described above, and can be implemented as having a channel restricting portion of another shape.
For example, in the case shown in FIGS. 3 and 5 to 7, the groove 12 does not penetrate to the outside of the first polishing member 1. That is, the outer flat surface 13 was present between the outer peripheral surface of the first polishing member 1 and the groove 12. However, the present invention is not limited to such an embodiment, and the groove 12 may reach the outer peripheral surface side of the first polishing member 1 as long as the above-described dynamic pressure can be generated. It can be implemented.
For example, in the case of the first polishing member 1 shown in FIG. 7B, as shown by a dotted line, a portion having a smaller cross-sectional area than other portions of the groove 12 may be formed on the outer flat surface 13. it can.
Further, the groove 12 is formed so as to gradually decrease the cross-sectional area from the inside to the outside as described above, and the portion (terminal) of the groove 12 reaching the outer periphery of the first polishing member 1 has the smallest cross-sectional area. (Not shown). However, in order to effectively generate the dynamic pressure, it is preferable that the groove 12 does not penetrate to the outer peripheral surface side of the first polishing member 1 as shown in FIGS. 3 and 5 to 7.
[0044]
In each of the above embodiments, only the first polishing member 1 rotates, and the second polishing member 2 does not rotate. In addition to this, not only the first polishing member 1 but also the second polishing member 2 can be rotated. In this case, the second polishing member 2 is rotated in the opposite direction to the rotation direction r of the first polishing member 1.
As such a grinder, for example, as shown in FIG. 8, a second drive unit 5 a provided with a shaft 50 a, which is separate from the drive unit 5 described above, is provided independently of the housing 6. The holder 21 may be rotated. In this case, the shaft 50 a of the drive unit 5 a is hollow, and the inside of the shaft 50 is used as the introduction unit 7.
In the grinding machine shown in FIG. 8, the floating mechanism is provided in the second holder 21 as in the grinding machine shown in FIGS. 1 and 2. In addition, the first holder 11 may be provided with a floating mechanism instead of the second holder 21 or together with the second holder 21.
[0045]
Finally, the present invention will be summarized.
The grinding machine according to the present invention concentrically opposes a rotating grindstone having a flat grinding surface on a wear outer periphery and a fixed grindstone having a flat grinding surface on the outer circumference, with the flat grinding surface. While supplying the material to be crushed through the opening of the fixed grindstone under the rotation of the rotating grindstone, the grinding material is ground and ground between the opposing flat grinding surfaces of the two grindstones, and mechanical clearance is provided in the grinding machine. Rather than adjusting, a rotating wheel is provided with a pressure increasing mechanism to maintain the clearance by generating the pressure, and fine clearance of 1-6 μm, which was impossible with mechanical clearance adjustment, is possible. This is a significant improvement.
That is, in the present invention, the rotating grindstone and the fixed grindstone have a flat grinding surface on the outer peripheral portion thereof, and the flat grinding surface has a sealing function on the surface, so that hydrostatic one hydrodynamic power It is an object of the present invention to provide a high-speed rotary attritor that generates a dynamic (hydrodynamic) force or an aerostatic-aerodynamic force. The above force can generate a slight gap between the sealing surfaces, and can provide a grinding device that is non-contact, mechanically safe, and has a high grinding function. One of the factors that can form this slight gap is due to the rotational speed of the rotating grindstone, and the other is due to the pressure difference between the raw material input side and the discharge side. In the case where the pressure application mechanism is attached to the input side, the applicant of the present application has reported a useful invention in Japanese Patent Application No. 2002-207533 filed earlier, but the pressure application mechanism is not attached to the input side. In this case, that is, when the raw material to be pulverized is introduced under atmospheric pressure, there is no pressure difference, and therefore it is necessary to cause separation between the sealing surfaces only by the rotational speed of the rotating grindstone. This is known as hydrodynamic or aerodynamic force.
[0046]
【The invention's effect】
  In the first to fourth inventions of the present application, when the raw material to be pulverized is a fluid or the raw material to be pulverized is put into the fluid, the clearance between the upper and lower two grindstones (abrasive members) is 15 μm or less. It was possible to provide grinding. In other words, ultra-fine grinding that is absolutely necessary for recent developments in nanotechnology has been realized. Furthermore, 5th invention of this application can provide the processing method of the to-be-processed object which enables superfine grinding | pulverization using this grinder.
[Brief description of the drawings]
FIG. 1 is a partially cutaway longitudinal sectional view of a grinding machine according to an embodiment of the present invention.
FIG. 2 is a schematic vertical sectional view of an essential part of the above-mentioned grinding machine, centering on a first polishing member 1 and a first holder 11.
FIG. 3A is a plan view of the first polishing member 1 of the grinding machine, and FIG. 3B is a longitudinal sectional view of an essential part thereof.
FIG. 4A is a longitudinal sectional view of a main part of the first and second polishing members 1 and 2 of the grinding machine, and FIG. 4B is the first and second polishing member 1 with a minute gap therebetween. , 2 is a longitudinal sectional view of an essential part of FIG.
5A is a plan view of another embodiment of the first polishing member 1, and FIG. 5B is a schematic vertical sectional view of an essential part thereof.
6A is a plan view of still another embodiment of the first polishing member 1, and FIG. 6B is a schematic vertical sectional view of an essential part thereof.
7A is a plan view of still another embodiment of the first polishing member 1, and FIG. 7B is a plan view of still another embodiment of the first polishing member 1. FIG.
FIG. 8 is a partially cutaway schematic longitudinal sectional view showing another embodiment of a grinding machine.
[Explanation of symbols]
1 First polishing member
2 Second polishing member
3 Energizing mechanism
4 Dynamic pressure generation mechanism

Claims

Provided with at least two polishing members that are disposed so as to face each other and perform grinding and pulverization by rotating at least one relative to the other, both polishing from the center side of the rotation In a grinding machine that conveys a workpiece or supplies a fluid to be processed itself between members, and discharges the fluid to the outside of the first and second polishing members.
The first and second polishing members are arranged such that at least one of them is close to or away from the other,
An urging mechanism that acts in a direction in which the two polishing members are at least close to each other;
Said 1st and 2nd polishing member is equipped with the dynamic pressure generation mechanism which makes the force which fluid tries to pass between both polishing members act in the direction which separates both polishing members,
By maintaining a balance between the dynamic pressure generated by the dynamic pressure generating mechanism and the biasing force by the biasing mechanism, the distance between the first and second polishing members is maintained at a minute distance of 0.1 to 15 μm. A grinder characterized by the fact that

Both the first and second polishing members include a flat portion subjected to mirror polishing, and one of the polishing members includes a groove in the flat portion,
The groove extends from the center side of the polishing member toward the outside of the polishing member, and restricts the flow path of fluid that passes through the groove from the center of the polishing member to the outside of the polishing member. A flow path limiting portion is provided , and this flow path limiting portion gradually reduces the cross-sectional area of the groove from the center of rotation toward the outside of the polishing member. The flat portion and the groove generate the dynamic pressure described above. The attritor according to claim 1, which constitutes a mechanism .

At least one of the first and second polishing members includes a floating mechanism. The floating mechanism enables the approach and separation between the two polishing members, and is generated in at least one of the two polishing members by rotation. The attrition behavior according to claim 1 or 2, wherein at least the other of the two polishing members absorbs the eccentric behavior.

The urging mechanism uses an urging means that utilizes fluid pressure such as air and adjusts the urging force by the fluid pressure.
By maintaining a balance between the dynamic pressure generated by the dynamic pressure generating mechanism and the biasing force by the biasing mechanism, the distance between the first and second polishing members is maintained at a minute distance of 0.1 to 10 μm. The attritor according to any one of claims 1 to 3, wherein the attritor is configured as described above .

Using the grinding machine according to any one of the first to fourth inventions described above, the fluid to be processed is conveyed between the first and second polishing members, or the fluid to be processed itself. The balance between the dynamic pressure generated by the dynamic pressure generating mechanism and the urging force by the urging mechanism is set so that the interval between the first and second polishing members is a minute interval of 0.1 to 10 μm. The processing method of the to-be-processed object characterized by performing grinding | pulverization and a grinding | pulverization process, maintaining it.