JP2004169157A5 - - Google Patents
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- Publication number
- JP2004169157A5 JP2004169157A5 JP2002339038A JP2002339038A JP2004169157A5 JP 2004169157 A5 JP2004169157 A5 JP 2004169157A5 JP 2002339038 A JP2002339038 A JP 2002339038A JP 2002339038 A JP2002339038 A JP 2002339038A JP 2004169157 A5 JP2004169157 A5 JP 2004169157A5
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- silver
- silver plating
- affinity
- reacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Claims (1)
- 銀メッキ層の処理方法であって、銀メッキ層を、銀と反応もしくは親和性を有する有機化合物で処理することを特徴とする銀メッキ層の処理方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002339038A JP2004169157A (ja) | 2002-11-22 | 2002-11-22 | 銀メッキ層の処理方法及び銀メッキ層の処理液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002339038A JP2004169157A (ja) | 2002-11-22 | 2002-11-22 | 銀メッキ層の処理方法及び銀メッキ層の処理液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004169157A JP2004169157A (ja) | 2004-06-17 |
| JP2004169157A5 true JP2004169157A5 (ja) | 2005-11-04 |
Family
ID=32702081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002339038A Pending JP2004169157A (ja) | 2002-11-22 | 2002-11-22 | 銀メッキ層の処理方法及び銀メッキ層の処理液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004169157A (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007169685A (ja) * | 2005-12-20 | 2007-07-05 | Mitsubishi Paper Mills Ltd | 被金属めっき材 |
| JP2007197743A (ja) * | 2006-01-24 | 2007-08-09 | Mitsubishi Paper Mills Ltd | 銀鏡用活性化処理液 |
| TWI453301B (zh) * | 2007-11-08 | 2014-09-21 | Enthone | 浸鍍銀塗層上的自組分子 |
| US7631798B1 (en) * | 2008-10-02 | 2009-12-15 | Ernest Long | Method for enhancing the solderability of a surface |
| CN102713007A (zh) * | 2010-01-19 | 2012-10-03 | 吉坤日矿日石金属株式会社 | 金属的表面处理剂 |
| JP5473135B2 (ja) * | 2010-03-26 | 2014-04-16 | Ｊｘ日鉱日石金属株式会社 | 金属の表面処理剤 |
| EP3133188A4 (en) | 2014-04-15 | 2017-08-30 | Sumitomo Metal Mining Co., Ltd. | Coating film, method for forming coating film, and light-emitting diode device |
| CN114378299B (zh) * | 2021-12-30 | 2023-09-05 | 安徽壹石通材料科学研究院有限公司 | 一种核壳结构金属复合材料的制备方法 |
-
2002
- 2002-11-22 JP JP2002339038A patent/JP2004169157A/ja active Pending
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