JP2004165382A - Shield structure and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shield structure of low cost whose number of components is small, and to provide its manufacturing method. <P>SOLUTION: The shield structure 14 is provided with a multilayer substrate 7 which is composed of thermoplastic resin and has a GND pattern 4 on the surface, and a shield case 13 which abuts against the GND pattern 4 and performs electromagnetic wave shielding. The multilayer substrate 7 has a protruding part 12 at a prescribed position in which part 12 the multilayer substrate itself is transformed, the GND pattern 4 is arranged on the surface and resilient deformation is possible. The shield case 13 abuts against the protruding part 12 and fixed to the multilayer substrate 7 while electrical contact is ensured with the GND pattern 4. The shield structure 14 has the protruding part 12 which is formed by transformation of the multilayer substrate itself and in which resilient deformation is possible, so that reduction of the number of components and of manufacturing cost is realized. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a shield structure having a substrate that requires an electromagnetic wave shield, and a method for manufacturing the same.
[0002]
[Prior art]
For example, in a wireless communication device such as a mobile phone, in order to prevent leakage of electromagnetic waves to the outside, influence of a circuit portion of a printed circuit board by an external electromagnetic wave, and influence of a circuit portion by an electromagnetic wave radiated from its own antenna. , It is necessary to shield the circuit part. As a method of electromagnetically shielding the circuit portion, there is a method of covering a printed circuit board with a metal shield case made of metal or a resin on which metal is deposited.
[0003]
At this time, it is necessary to secure electrical contact between the GND pattern of the printed circuit board and the shield case. Examples thereof are disclosed in Patent Literature 1 and Patent Literature 2. In Patent Document 1, an elastic conductor is arranged between a printed board and a shield case to secure electrical contact between the printed board ground pattern and the shield case. Japanese Patent Application Laid-Open No. H11-163873 discloses that a conductive elastic body is integrated with a shield case to secure electrical contact with a ground pattern on a printed circuit board.
[0004]
[Patent Document 1] Japanese Patent Application Laid-Open No. 7-45938
[Patent Document 2] JP-A-10-200286
[Problems to be solved by the invention]
However, in Patent Document 1, the number of components is large, and the cost of forming a conductor and the cost of mounting are required. In Patent Document 2, the cost of preparing a conductive elastic body, and the cost of providing a shield case and a printed circuit board are required. The cost of parts such as screws used for fixing the components and the cost of mounting them are required.
[0007]
The present invention has been made in view of the above problems, and has as its object to provide a low-cost shield structure with a small number of components and a method of manufacturing the same.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a shield structure according to claim 1 is provided in which a conductive pattern including a GND pattern is formed on at least one side of a resin film made of a thermoplastic resin, and the shield structure is brought into contact with the GND pattern of the substrate. And a shield case for performing electromagnetic wave shielding, wherein at a predetermined position of the substrate, the substrate itself is deformed and provided with an elastically deformable projection having a GND pattern on the surface thereof, and the shield case is provided with It is characterized in that it is fixed to the substrate while being in contact with the projection.
[0009]
As described above, the present shield structure has the projections having the GND pattern on the surface of the substrate itself which is deformed. Since the projection has elasticity, when the shield case is pressed against the projection when the shield case is fixed to the substrate, the projection is deformed while maintaining contact with the shield case. The shield case can be fixed to the substrate while electrical contact between the pattern and the shield case is ensured. Further, since the projection is formed by deforming the substrate itself, the number of components of the shield structure can be reduced, and the manufacturing cost can be reduced.
[0010]
As described in claim 2, the substrate may be a multilayer substrate in which a plurality of resin films including a resin film having a conductor pattern including a GND pattern are laminated. Even in the case of a multilayer substrate, if the multilayer substrate itself has a deformed projection and a GND pattern is formed on the surface of the projection, the shield case is connected to the multilayer case while bringing the GND pattern into contact with the shield case. Can be fixed.
[0011]
Specifically, a part of the multilayer substrate may be separated, and the separated substrate may have an arbitrary angle with respect to the original arrangement position. The protruding portions are formed by deforming the substrate itself. The present substrate is formed of a resin film made of a thermoplastic resin, and a separation substrate obtained by separating a part of the multilayer substrate can be bent at an arbitrary angle by applying heat or the like. And, since the bent separation substrate keeps the predetermined shape, it can be elastically deformed with the bent portion as a fulcrum, so when the shield case is pressed, it is elastically deformed and the contact state with the shield case is secured. it can. That is, if the GND pattern is formed on the surface of the separation substrate, it is possible to secure electrical contact with the shield case GND pattern. In addition, the use of protrusions obtained by deforming the multilayer substrate itself for securing electrical contact between the shield case and the GND pattern eliminates the need to newly dispose an elastic conductor or the like. Points can be reduced.
[0012]
As described in claim 4, the shield case is provided with a locking portion that engages with a peripheral portion of the other substrate surface that opposes the substrate surface on which the protrusion is formed, and the locking portion is formed of a peripheral portion. , Electrical contact between the shield case and the GND pattern may be ensured. As described above, when the locking portion is provided on the shield case, the shield case can be pressed against the projection of the substrate, and the locking portion can be engaged with the peripheral portion of the surface of the substrate facing the GND pattern forming surface. it can. Therefore, the shield case can be mounted on the substrate with one touch, and electrical contact between the shield case and the GND pattern can be ensured. Further, in this case, since a fixed component such as a screw is not used, the number of components can be reduced, and the manufacturing cost can be reduced.
[0013]
As described in claim 5, the method for manufacturing a shield structure includes a pattern forming step of forming a conductor pattern including a GND pattern on at least one surface of a resin film made of a thermoplastic resin, and a conductor pattern including at least a GND pattern. The mounting process of mounting components on the surface of a substrate made of a resin film provided with a resin film, and the shield case is fixed to the substrate while the shield case for shielding electromagnetic waves is in contact with the GND pattern on the substrate surface on which the components are mounted. And a local heating / heating step of projecting the predetermined portion from the substrate surface by locally pressing the predetermined portion including the GND pattern of the substrate while locally heating the substrate before the mounting process. And a pressure step.
[0014]
As described above, in the substrate on which the GND pattern is formed on the surface, a predetermined position including the GND pattern is locally heated and pressurized, thereby deforming the substrate itself and having elasticity protruding from the substrate surface. A protrusion can be formed. Therefore, by fixing the shield case to the substrate while pressing it against the projection, a shield structure is formed, and electrical contact between the GND pattern and the shield case can be ensured.
[0015]
Further, as described in claim 6, the local heating / pressing step is preferably performed after the mounting step. It is preferable to perform the local heating / pressing step after the mounting step, since it is not necessary to consider the unevenness of the substrate (by the protrusion) when mounting the component on the substrate surface.
[0016]
The method for manufacturing a shield structure according to claim 7 is a method for manufacturing the shield structure according to claim 3, and the operation and effect are the same as those according to claim 3, so that Description is omitted.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First Embodiment)
FIG. 1 is a cross-sectional view of each step for manufacturing a shield structure according to the present embodiment. In FIGS. 1A to 1G, only some of the members constituting the shield structure are shown for convenience. In addition, the shield structure according to the present embodiment is used for an electronic device that needs an electromagnetic wave shield, such as a mobile phone.
[0018]
As shown in FIG. 1A, reference numeral 1 denotes a single-sided conductor pattern film having a conductor pattern 3 and a GND pattern 4 in which a conductor foil attached to one surface of a resin film 2 is formed by etching. Here, as the resin film 2, for example, a resin film having a thickness of 25 to 100 μm including 65 to 35% by weight of a polyetheretherketone (PEEK) which is a thermoplastic resin and 35 to 65% by weight of a polyetherimide (PEI) Can be used. Further, as the conductive foil, for example, a low-resistance metal foil containing at least one of Au, Ag, Cu, and Al is preferable, and a Cu foil that is inexpensive and has no fear of migration is preferable.
[0019]
As the GND pattern 4, the same metal as that of the conductor pattern 3 is used, and is formed almost simultaneously to shorten the manufacturing process. The GND pattern 4 is in electrical contact with a shield case described later, but will be described later in detail. The formation of the conductor pattern 3 and the GND pattern 4 may be performed by a printing method other than the etching of the conductor foil.
[0020]
When the process of forming the conductor pattern 3 and the GND pattern 4 on the resin film 2 in FIG. 1A is completed, then, for example, a carbon dioxide laser is irradiated from the resin film 2 side as shown in FIG. Then, a via hole 5 as a bottomed hole having the conductive pattern 3 and the GND pattern 4 as bottom surfaces is formed, and the via hole 5 is filled with a conductive paste 6 as an interlayer connection material.
[0021]
In forming the via hole 5, a UV-YAG laser, an excimer laser, or the like can be used in addition to the carbon dioxide gas laser. In addition, it is possible to mechanically form the via hole 5 by drilling or the like. However, since it is necessary to process the conductor pattern 3 and the GND pattern 4 with a small diameter so as not to damage them, laser processing is used. It is preferred to choose a method.
[0022]
When the formation of the via hole 5 is completed, the via hole 5 is filled with a conductive paste 6 which is an interlayer connection material. The conductive paste 6 is obtained by adding an organic solvent to metal particles such as Cu, Ag, and Sn, kneading the mixture, and forming a paste. In addition, the conductive paste 6 may be appropriately mixed with a low melting point glass frit, an organic resin, or an inorganic filler. The conductive paste 6 is filled in the via hole 5 using a screen printing machine or a dispenser (not shown).
[0023]
When the filling of the conductive paste 6 into the via hole 5 is completed, as shown in FIG. 1C, a plurality of resin films including the single-sided conductive pattern film 1 are laminated (four in this example). In addition to the single-sided conductor pattern film 1, a single-sided conductor pattern film 1a on which a GND pattern 4 (no via hole 5 is formed) as a solid ground together with the conductor pattern 3 and a single-sided conductor pattern on which the GND pattern 4 is not formed The film 1b is used. At this time, of the four single-sided conductor pattern films 1, 1a, 1b, the conductor pattern 3 is formed on the upper two sheets (1,1a from the top in the present embodiment) with the center of the lamination as a boundary. The lower two sheets (both 1b in the present embodiment) are stacked such that the surface on which the conductor pattern 3 is formed is lower. Therefore, the GND pattern 4 is exposed on the upper surface of the laminate.
[0024]
After the laminating step is performed as shown in FIG. 1C, a heating and pressurizing step of forming a multilayer substrate is performed by applying pressure while heating the upper and lower surfaces of the laminated body by using a press die of a heating press machine (not shown). You. In the present embodiment, the pressing conditions are heating to a temperature of 250 to 350 ° C. and pressurizing at a pressure of 1 to 10 MPa. Note that a buffer member (not shown) having a buffering effect may be provided between the press die and the surface of the laminate in order to prevent the conductor pattern 3 from being displaced. Further, a release member (not shown) such as polyimide is provided between the buffer member and the laminate and between the buffer member and the press die for the purpose of improving the releasability between the respective members. A pressure step may be performed.
[0025]
Through the above-described manufacturing process, the respective resin films 2 are thermally welded and integrated, and the conductive paste 6 in the via hole 5 makes interlayer connection with the adjacent conductive pattern 3 or conductive paste 6. As shown in FIG. 1D, a multilayer substrate 7 having a GND pattern 4 on its upper surface is formed.
[0026]
The formed multilayer substrate 7 has a land 8 made of the conductor pattern 3 on its surface, and a component 9 is mounted on the land 8 as shown in FIG. In FIG. 1E, the connection between the land 8 and the component 9 is made by using solder as the joining member 11 between the electrode 10 of the component 9 and the land 8. However, other than that, a solder bump (not shown) formed on the electrode 10 of the component 9 may be directly connected to the land 8, or the electrode 10 and the land 8 may be conductively connected via a wire (not shown). May be.
[0027]
Next, with respect to the multilayer board 7 on which the components 9 are mounted, a predetermined position including a place where the GND pattern 4 is formed is placed on the upper and lower surfaces of the multilayer board by a pair of concave and convex press dies of a heating press machine (not shown). The substrate 7 is locally heated and pressed (in this embodiment, a concave press is used on the GND pattern 4 forming surface side, and a convex press is used on the non-GND pattern forming surface side). In the present embodiment, as the pressing conditions, heating was performed at a temperature of approximately 250 ° C., and pressure was applied at a pressure of 1 to 10 MPa. Thereby, as shown in FIG. 1F, the multilayer substrate 7 having the convex protrusion 12 having the GND pattern 4 on its surface is formed. In addition, it is preferable that the protrusions 12 are formed with an interval equal to or less than a distance at which a shielding effect by a shield case described later can be exerted.
[0028]
Then, as shown in FIG. 1G, the shield case 13 is fixed to the multilayer substrate 7 on which the protrusions 12 are formed, and the shield structure 14 is formed. The shield case 13 has a beam-like structure, and can accommodate the components 9 mounted on the multilayer board 7 in the recess 15 inside the shield case 13.
[0029]
The shield case 13 for shielding electromagnetic waves is made of, for example, a metal such as Cu or a resin material whose surface is subjected to metal plating or vapor deposition, and faces the surface of the multilayer substrate 7 on which the protrusions 12 are formed. And a beam portion 17 corresponding to the shape of the GND pattern 4 on the surface of the multilayer substrate 7 and in contact with the projection 12. When the locking portion 16 is engaged with the peripheral portion of the multilayer substrate 7, when the shield case 13 is brought close to the upper surface of the multilayer substrate 7, the beam portion 17 of the shield case 13 is brought into contact with the projection 12 of the multilayer substrate 7. Pressed. Then, while the contact between the GND pattern 4 formed on the surface of the projection 12 and the beam 17 is ensured, the locking portion 16 of the shield case 13 faces the surface of the multilayer substrate 7 where the projection 12 is formed. It will be engaged with the periphery of the surface. The details of the protrusion 12 and the shield case 13 of the multilayer substrate 7 will be described later.
[0030]
Next, the protrusion 12 and the shield case 13 of the multilayer substrate 7 will be described in detail with reference to FIGS. 2A and 2B show the multilayer substrate 7 according to the present embodiment, wherein FIG. 2A is a plan view as viewed from the upper surface on which the protrusions 12 are formed, and FIG. 2B is a cross-sectional view taken along the line AA of FIG. . FIG. 3 is an enlarged view of the vicinity of a contact portion between the shield case 13 and the protrusion 12 in the present embodiment. 4A and 4B show a shield structure 14 in which a shield case 13 is mounted on the multilayer substrate 7 of FIG. 2, wherein FIG. 4A is a plan view of the shield case 13 as viewed from above, and FIG. FIG. 1C is a cross-sectional view taken along the line CC of FIG. FIG. 1 (g) shows a part of FIG. 4 (c). 2 to 4, the resin film 2 shown in FIG. 1, the GND pattern 4 on the surface of the multilayer substrate, the conductor pattern 3 other than the protrusion 12, the GND pattern 4 existing in the inner layer of the multilayer substrate 7, the via hole 5, The conductive paste 6 and the like are omitted for convenience.
[0031]
As shown in FIG. 2A, the multilayer substrate 7 has a protrusion 12 at a predetermined position including the GND pattern 4 formed on the surface thereof. Here, the protrusion 12 is a convex protrusion as shown in FIG. 2B and has elasticity because it is formed of the resin film 2 made of a thermoplastic resin.
[0032]
Therefore, as shown in FIG. 3, when the beam 17 of the shield case 13 is pressed against the protrusion 12 of the multilayer substrate 7, the protrusion 12 elastically deforms according to the applied pressure. That is, since the projection 12 is deformed in the direction of the arrow while maintaining contact with the beam 17 of the shield case 13, the shield case 13 can be pushed deep.
[0033]
Then, as shown in FIGS. 4B and 4C, when the shield case 13 is pressed deeply into the multilayer substrate 7, the locking portions 16 of the shield case 13 are engaged with the protrusions 12 of the multilayer substrate 7. Engage a peripheral edge of the surface opposite the formed surface. Therefore, the shield case 13 is fixed to the multilayer substrate 7, and the shield structure 14 is formed.
[0034]
At this time, as shown in FIGS. 4B and 4C, the multilayer substrate 7 is fixed by the locking portions 16 and the beam portions 17 of the shield case 13. Therefore, the projection 12 of the multilayer substrate 7 and the beam 17 of the shield case 13 are in contact with each other, and electrical contact between the GND pattern 4 on the surface of the projection 12 and the beam 17 is ensured. Here, a plurality of protruding portions 12 having the GND pattern 4 are formed with an interval equal to or less than a distance capable of exhibiting a shielding effect between the protruding portion 12 and the shield case 13 having the beam portion 17. Therefore, the shield structure 14 in the present embodiment performs electromagnetic wave shielding on the multilayer substrate 7 although the shield case 13 and the GND pattern 4 are not in contact over the whole area but are in contact at a plurality of points. be able to. In the present embodiment, the example of the multilayer substrate 7 having the seven protrusions 12 is shown, but the number is not limited to seven, and as described above, after sufficiently considering the shielding effect, The location and number of the projections 12 are set. Instead of providing a plurality of protrusions 12 intermittently, the protrusions 12 may be formed in a shape (for example, an annular shape) corresponding to the GND pattern formed on the surface of the multilayer substrate 7. Thereby, the number of contact points between the GND pattern 4 and the shield case 13 increases, and the shielding effect becomes more reliable.
[0035]
As described above, in the present embodiment, the protrusion 12 having the GND pattern 4 on the surface is formed at a predetermined position of the multilayer substrate 7 made of a thermoplastic resin. The protrusions 12 have elasticity, and when the shield case 13 is mounted on the multilayer substrate 7, the protrusions 12 are elastically deformed to facilitate the mounting of the shield case 13. Therefore, since it is not necessary to separately prepare an elastic conductor or the like, the number of components is small, and the manufacturing cost can be reduced. When the shield case 13 is mounted, the beam portion 17 of the shield case 13 is in contact with the above-described protrusion portion 12. Is pushed in, the projection 12 is elastically deformed. Therefore, electrical contact can be secured between the GND pattern 4 formed on the surface of the projection 12 and the beam 17 (shield case 13). Since the protrusions 12 are formed at intervals at which the shielding effect can be exhibited, the shield structure 14 in the present embodiment can shield the multilayer substrate 7 from electromagnetic waves.
[0036]
(Second embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG.
[0037]
Since the multilayer substrate according to the second embodiment has many parts in common with those according to the first embodiment, detailed description of common parts will be omitted, and different parts will be mainly described below.
[0038]
The second embodiment differs from the first embodiment in that a part of the multilayer substrate 7 is separated and the bent separated substrate is used as the projection 12.
[0039]
In manufacturing a multilayer substrate having a separation substrate, first, a plurality of resin films 2 including a single-sided conductor pattern film 1 having a conductor pattern 3 including a GND pattern 4 are laminated (the single-sided conductor pattern film 1 is formed in the first embodiment). The same as in the embodiment).
[0040]
At this time, a release film (not shown) made of polyimide or the like is disposed in a predetermined range between the lowermost resin film 2 and the adjacent lower resin film 2 in the formation region to be a separation substrate later. In the region where the separation substrate is formed, when the separation substrate is bent, the surface of the separation substrate is provided with the GND pattern 4, and serves as a bent portion (a fulcrum of bending) when the separation substrate is separated from the multilayer substrate 7 and bent. A slit (not shown) is previously formed along the formation region other than the portion from the surface of the multilayer substrate 7 to the surface of the release film. The slit is preferably formed before lamination. Then, the multilayer body 7 having a release film therein is formed by heating and pressing the above-described laminate from both upper and lower surfaces by a press die of a heating press machine.
[0041]
Next, after the formation of the multilayer substrate 7, the upper layer of the release film is peeled off from the release film with the above-described slit as a starting point, and the release film is removed, whereby the multilayer substrate 7 having the separation substrate 18 is formed. . At this time, the separation substrate 18 has the GND pattern 4 on the surface thereof, and as shown in FIG. 5, the separation substrate 18 is held in such a manner that the GND pattern 4 contacts the beam portion 17 of the shield case 13. Bend to any angle relative to the original location.
[0042]
Here, the separation substrate 18 is formed of the resin film 2 made of a thermoplastic resin, and can be bent at a predetermined angle with respect to the original arrangement position by applying pressure such as heat to the bent portion. . The bent separation substrate 18 retains its shape at a predetermined angle, but is elastically deformable, so that when pressure is applied to its surface, it can bend in the direction in which the pressure is applied. That is, the separation substrate 18 protrudes upward from the surface of the multilayer substrate 7 and can function as the elastic protrusion 12.
[0043]
As described above, the shield structure 14 in the present embodiment includes the separation substrate 18 as the elastic projection 12 in the multilayer substrate 7, and the beam portion 17 of the shield case 13 is brought into contact with the separation substrate 18. When the separation substrate 18 is bent, the locking portion 16 of the shield case 13 is engaged with the peripheral portion of the surface of the multilayer substrate 7 facing the surface on which the separation substrate 19 is formed as the protrusion 12. be able to. Therefore, also in the present embodiment, the number of parts can be reduced, and the manufacturing cost can be reduced.
[0044]
Further, the GND pattern 4 is formed on the surface of the separation substrate 18, and the beam portion 17 of the shield case 13 is electrically contacted with the GND pattern 4. Electromagnetic shielding can be performed.
[0045]
Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and can be implemented with various modifications.
[0046]
In the above embodiment, the resin film is a thermoplastic resin film composed of 65 to 35% of PEEK resin and 35 to 65% of PEI resin, but it is also possible to use PEEK and PEI alone. Further, polyethersulfone (PES), polyphenylene ether (PPE), polyethylene naphthalate (PEN), a liquid crystal polymer, a styrene resin having a syndiotactic structure, or the like may be used alone, or PEEK or PEI may be used. Any of these may be used as a mixture. In short, in the heating / pressing step, the resin films can be bonded to each other, and any resin film having heat resistance required for soldering or the like in a later step can be suitably used.
[0047]
Further, in the present embodiment, as the resin film, an example of laminating a one-sided conductor pattern film having a conductor pattern formed on one side has been described, but other than that, a thermoplastic resin having a conductor pattern formed on both sides may be used. A processed resin film may be used. Further, the resin film to be laminated may include a resin film having no conductor pattern on its surface.
[0048]
Further, in the present embodiment, an example of the printing method in which the conductive paste is filled in the via hole has been described, but other than that, electroless plating, electrolytic plating, vapor deposition, metal coating, or the like may be used.
[0049]
In the present embodiment, a bottomed via hole is formed, and the bottomed via hole is filled with a conductive paste as an interlayer connection material. However, a through hole is formed at the time of forming the via hole, and an interlayer connection material is formed in the through via hole. May be filled.
[0050]
Further, in the present embodiment, an example of a multilayer substrate in which four single-sided conductor pattern films are laminated as a substrate has been described, but it goes without saying that the number of layers is not limited.
[0051]
Further, in this embodiment, the example in which the GND pattern is formed on the surface of the multilayer substrate and the second layer has been described, but the location where the GND pattern is formed is not limited to this embodiment.
[0052]
Further, in the present embodiment, the timing of forming the convex protrusions is after mounting the components on the surface of the multilayer board, but after forming the multilayer substrate, the protrusions are formed before the components are mounted. It may be formed. However, when mounting the component on the multilayer substrate surface, it is easier for the multilayer substrate surface to have no irregularities, for example, by applying cream solder, etc., preferably after the component is mounted, when a convex projection is formed. good.
[0053]
Further, in the present embodiment, an example of the shield case including five locking portions has been described, but the number and locations of the locking portions are not limited to the example of the present embodiment.
[0054]
In the present embodiment, an example has been shown in which the shield case is mounted on the board by engaging the locking portion provided on the shield case with the peripheral edge of the board in order to reduce the number of components. However, the present invention can be applied to the case where other shield cases are fixed to the substrate, such as the case where the shield case is fixed to the substrate with screws or the like.
[0055]
Further, in this embodiment, the example in which the protrusion formed by deforming the substrate is a convex protrusion and the separation substrate has been described. However, any other protrusion may be used as long as the substrate itself deforms and projects from the substrate surface.
[0056]
Further, in this embodiment, an example is shown in which the protrusion is formed only on one surface of the substrate, and the shield case is mounted only on the surface on which the protrusion is formed. A part may be formed and a shield case may be attached to both surface sides.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a manufacturing process of a shield structure according to a first embodiment of the present invention.
FIGS. 2A and 2B show a multi-layer substrate according to the first embodiment, wherein FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along the line AA of FIG.
FIG. 3 is an enlarged view of a contact portion between a protrusion and a printing pressure beam.
4A and 4B show a shield structure in which a shield case is mounted on the multilayer substrate of FIG. 2; FIG. 4A is a plan view, FIG. 4B is a cross-sectional view taken along the line BB of FIG. FIG. 3A is a cross-sectional view taken along the line CC of FIG.
FIG. 5 is an enlarged sectional view of a shield structure according to a second embodiment.
[Explanation of symbols]
4 ... GND pattern, 7 ... Multilayer board, 12 ... Protrusion, 13 ... Shield case, 14 ... Shield structure, 16 ... Locking part, 17 ... Beam part

Claims (7)

A substrate having a conductor pattern including a GND pattern formed on at least one surface of a resin film made of a thermoplastic resin,
A shield case that abuts on the GND pattern of the substrate to perform electromagnetic wave shielding,
The substrate is provided at a predetermined position with an elastically deformable projection having the GND pattern on the surface of the substrate itself, and the shield case is fixed to the substrate while abutting on the projection. A shield structure characterized by the above. The shield structure according to claim 1, wherein the substrate is a multilayer substrate in which a plurality of resin films including a resin film having a conductor pattern including the GND pattern are laminated. The shield structure according to claim 2, wherein the protrusion separates a part of the multilayer substrate, and the separation substrate has an arbitrary angle with respect to an original arrangement position. The shield case is provided with a locking portion that engages with a peripheral portion of a surface of the substrate facing the surface on which the protrusion is formed, and the locking portion engages with the peripheral portion, The shield structure according to any one of claims 1 to 3, wherein electrical contact between the shield case and the GND pattern is ensured. A pattern forming step of forming a conductor pattern including a GND pattern on at least one surface of a resin film made of a thermoplastic resin,
A mounting step of mounting components on a surface of a substrate made of a resin film having a conductor pattern including at least the GND pattern;
A mounting step of fixing the shield case to the substrate while bringing a shield case for shielding electromagnetic waves into contact with the GND pattern on the surface of the substrate on which the components are mounted,
Before the mounting step, a local heating / pressing step of projecting the part from the surface of the substrate by locally heating and pressing a predetermined part including the GND pattern of the substrate is provided. Manufacturing method of a shield structure. The method according to claim 5, wherein the local heating / pressing step is performed after the mounting step. A pattern forming step of forming a conductor pattern including a GND pattern on at least one surface of a resin film made of a thermoplastic resin,
A lamination step of laminating a plurality of resin films including a resin film having a conductor pattern including the GND pattern, such that at least one release film is disposed in a predetermined range below the GND pattern.
A heating and pressing step of forming a multilayer substrate by bonding the resin films to each other by pressing while heating the laminate of the resin films including the release film using a press mold,
A mounting step of mounting components on the surface of the multilayer board,
A separation step of separating the release film from the resin film of the upper and lower layers where the release film is disposed, and removing the release film,
Among the upper and lower resin films separated from the release film, the resin film on the mounting surface side of the component as a separation substrate, a bending step of bending so as to have an arbitrary angle with respect to the original arrangement position,
After the bending step, comprises a mounting step of fixing the shield case to the separation board while abutting the shield case for shielding the electromagnetic waves of the multilayer board to the separation board,
A resin film having the GND pattern is disposed in the laminating step so that the GND pattern is disposed on a contact surface of the separation substrate with the shield case. Production method.

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