JP2004157304A - Optical device fixing device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical device fixing device capable of accurately positioning and fixing an optical device. <P>SOLUTION: A base part 22 on which a semiconductor laser 41 is fixed is placed on the holding part 121 of the optical device fixing device 101, and a reference optical axis 5 is decided by the laser 41. Solder is applied and fused in the groove of the base part 22. A collimator lens 42 supported by a supporting arm 61 capable of relatively moving along three moving axes perpendicular with each other to the holding part 121 and relatively turning around three turning axes perpendicular with each other is carried to the groove of the base part 22. A light beam from the laser 41 is guided to an image pickup part 7 through the lens 42, and the lens 42 is accurately positioned and fixed with respect to the optical axis 5 based on an image showing the state of the acquired light beam in the device 101. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for positioning and fixing an optical element.
[0002]
[Prior art]
In an optical element unit (that is, an assembly part of an optical element, for example, an assembly part of an optical fiber, an optical communication device, or the like), a small optical element is positioned and fixed with respect to a predetermined optical axis (so-called, As a method of alignment and adjusting the position and posture, the optical element is moved and positioned in one or two directions while being in contact with the contact surface of the holding member, and solder or an adhesive (for example, including an ultraviolet curable resin is included). Conventionally, fixing is performed by filling the surroundings with an adhesive, or by laser fusion for irradiating high-energy pulse light such as a YAG laser or glass fusion using glass powder. .
[0003]
For example, as shown in FIG. 1, when positioning and fixing a bare chip 191 (hereinafter, referred to as a “semiconductor laser”) of a semiconductor laser and an optical fiber 192, a groove 193a having a V-shaped cross-sectional shape is formed. The tip of the optical fiber 192 is positioned with respect to the holding member 193 by abutting the side surface of the groove 193a. The semiconductor laser 191 supported by a collet (not shown) is positioned with respect to the optical fiber 192 while being in contact with the upper surface of the holding member 193, and is fixed by a fixing medium (for example, solder).
[0004]
Further, as shown in FIG. 2, the optical waveguide element 194 and the plurality of optical fibers 192 are positioned and fixed. In the case of a so-called coupling, the optical waveguide element 194 is positioned and fixed to the holding member 195. Is done. The positioning member 196 having a plurality of grooves 196a having a V-shaped cross section and the positioning member 197 having a groove 197a having a similar cross section have a plurality of optical fibers 192 having grooves 196a and 197a, respectively. The optical fibers 192 are positioned with respect to the optical waveguide element 194 by being fixed by an adhesive or the like in contact with the side surfaces of the optical waveguide elements 194 by fixing the positioning members 196 and 197 to the holding member 195.
[0005]
In addition, as a related technique, there is a technique described in the following document.
[0006]
[Non-patent document 1]
"Optical Technology Contact", Japan Optomechatronics Association, December 20, 1996, Vol. 34, no. 12 (1996), p. 619-627, 636-640
[Non-patent document 2]
"OPTRONICS", Optronics Co., Ltd., April 10, 1999, no. 4 (1999), p. 129-133, 140-149
[Non-Patent Document 3]
“OPTRONICS”, Optronics, Inc., July 10, 1999, No. 7 (1999), p. 149-155
[0007]
[Problems to be solved by the invention]
By the way, in the optical element unit shown in FIG. 1, the optical fiber 192 can be adjusted to a desired position in the Z direction, but the position and posture in other directions are determined by the shape of the groove 193a. The semiconductor laser 191 is positioned with respect to the optical fiber 192 by moving in the X and Z directions, but the position in the Y direction cannot be freely determined. As a result, the relative positioning accuracy in the X and Z directions can be made as high as 1 to 2 μm, while the relative positioning accuracy in the Y direction is the processing accuracy of the groove 193a and the fixed medium. Since it depends on the reproducibility of the thickness, it is worse (for example, several μm) than in the X and Z directions.
[0008]
In the case of the optical element unit shown in FIG. 2, an adhesive or the like is applied between each of the positioning members 196 and 197 and the holding member 195, and the bonding position is adjusted in the X and Z directions to adjust the light guide. The positioning accuracy can be set to about 0.2 μm with respect to the waveguide element 194, but in the Y direction, the positioning accuracy becomes about 1 μm due to the processing accuracy of the grooves 196 a and 197 a and the variation in the diameter of the optical fiber 192. .
[0009]
The present invention has been made in view of the above problems, and has as its object to position and fix an optical element with high accuracy.
[0010]
[Means for Solving the Problems]
The invention according to claim 1 is an optical element fixing device for fixing an optical element to a base section, wherein the holding section holds a base section to which a fixing medium for fixing the first optical element is applied; The first optical element is supported and conveyed to the base section, and is emitted through the support section that is separated from the first optical element after fixing and the first optical element or the second optical element attached to the base section. A light receiving unit that receives a reference light beam, a mechanism that relatively moves or rotates the support unit with respect to the holding unit, and a second position based on an output from the light receiving unit with respect to the second optical element. A control unit for positioning one optical element.
[0011]
The invention according to claim 2 is the optical element fixing device according to claim 1, wherein the control section controls the position of the first optical element while the fixing medium is being cured.
[0012]
The invention according to claim 3 is the optical element fixing device according to claim 1 or 2, wherein the first optical element is a collimator lens.
[0013]
The invention according to claim 4 is the optical element fixing device according to any one of claims 1 to 3, wherein the second optical element is a semiconductor light emitting element that emits light toward the first optical element. is there.
[0014]
The invention according to claim 5 is the optical element fixing device according to claim 1 or 2, wherein the first optical element is a microlens array.
[0015]
The invention according to claim 6 is the optical element fixing device according to claim 1, 2 or 5, wherein the second optical element is an optical waveguide element that emits light toward the first optical element. .
[0016]
The invention according to claim 7 is the optical element fixing device according to claim 1 or 2, wherein the first optical element is an optical fiber.
[0017]
The invention according to claim 8 is the optical element fixing device according to claim 1 or 2, wherein the first optical element and the second optical element each include a front optical element near the light receiving section and the light receiving section. Further comprising a switching lens capable of moving forward and backward with respect to an optical path, wherein the front optical element is a lens, and a light receiving element surface in the light receiving section and the front optical element in a state where the switching lens is disposed on the optical path. Are optically conjugated.
[0018]
The invention according to claim 9 is an optical element fixing device for fixing an optical element to a base section, wherein a holding section for holding a base section to which a fixing medium for fixing the optical element is provided, and A supporting unit that supports and conveys to the base unit and separates from the optical element after being fixed; and a moving mechanism that moves or rotates the supporting unit relatively to at least three axes with respect to the holding unit.
[0019]
According to a tenth aspect of the present invention, in the optical element fixing device according to the ninth aspect, the moving mechanism relatively moves the supporting portion with respect to the holding portion along three moving axes. Relative rotation about two rotation axes.
[0020]
An eleventh aspect of the present invention is the optical element fixing device according to the ninth or tenth aspect, wherein the optical element is a semiconductor light emitting element, a collimator lens, a microlens array, or an optical fiber.
[0021]
The invention according to claim 12 is the optical element fixing device according to any one of claims 1 to 11, further comprising a temperature control unit that controls a temperature of the support unit, wherein the support unit is provided with a solder. To support the optical element.
[0022]
According to a thirteenth aspect of the present invention, there is provided the optical element fixing device according to any one of the first to twelfth aspects, wherein the fixing medium is an adhesive containing a resin component, and the fixing medium on the base is hardened. Means are further provided.
[0023]
According to a fourteenth aspect of the present invention, in the optical element fixing device according to any one of the first to twelfth aspects, the fixing medium is glass powder or solder, and further controls the temperature of the holding unit. And two temperature controllers.
[0024]
The invention according to claim 15 is an optical element fixing device for fixing an optical element to a base section, wherein a holding section for holding a base section to which a fixing medium for fixing the optical element is provided; The supporting part which is supported and conveyed to the base part, and which is separated from the optical element after fixing, the light receiving part which receives a reference light beam emitted through the optical element, and the supporting part is relative to the holding part. And a control unit that positions the optical element at a position based on the base unit based on the output from the light receiving unit.
[0025]
The invention according to claim 16 is an optical element fixing method for fixing an optical element to a base portion, wherein the step of supporting the first optical element by a support portion and positioning the first optical element at a predetermined position with respect to the base portion; An optical element, or a step of receiving, by a light receiving unit, a reference light beam emitted through a second optical element attached to the base unit, and using the second optical element as a reference based on an output from the light receiving unit. A step of positioning the first optical element at a position to be fixed, a step of fixing the first optical element to the base portion with a fixing medium, and a step of separating the support section from the fixed first optical element. Having.
[0026]
The invention according to claim 17 is an optical element fixing method for fixing an optical element to a base portion, wherein the optical element is supported by a support portion and relatively moved or rotated about at least three axes. Positioning the optical element to the base with a fixing medium, and separating the support from the optical element after fixing.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 3 is a perspective view showing the optical element fixing device 101 according to the first embodiment of the present invention. The optical element fixing device 101 shown in FIG. 3 includes a collimator lens 42 (for example, a SELFOC (registered trademark) microlens having a diameter of about 1 mm or an aspherical press) on a base 22 to which a semiconductor laser 41 that emits a light beam is fixed. An optical element unit (hereinafter, referred to as a “semiconductor laser module”) 11 that emits a light beam as parallel light is manufactured by an optical element fixing apparatus 101. You. The optical element fixing device 101 includes a holding unit 121 that holds the base unit 22, a support arm 61 that supports the collimator lens 42, and a control unit 105 that includes a CPU that performs various arithmetic processes and a memory that stores various information. Is provided.
[0028]
The holding part 121 is provided on a plate 120 extending in the Z direction in FIG. 3, and protrudes in the (+ Y) direction on the upper surface of the holding part 121, and a base part auxiliary member 122 used for positioning the base part 22, and , A collimator lens auxiliary member 123 in which a groove having a V-shaped cross section is formed, and the collimator lens 42 before assembly is mounted on the collimator lens auxiliary member 123 in contact with the side surface of the groove. The holding unit 121 includes a holding unit heater 124 for heating the holding unit 121, a temperature sensor 125 for detecting a surface temperature of the holding unit 121, and a probe pin 126 (having an anode terminal and a cathode terminal) connected to the semiconductor laser 41. ) Is further provided, and the holding unit heater 124, the temperature sensor 125, and the probe pin 126 are connected to the control unit 105.
[0029]
The support arm 61 is provided with an arm heater 161 connected to the control unit 105, and the surface temperature of the support arm 61 is adjusted by the arm heater 161. The support arm 61 is moved in the Y direction by various moving mechanisms to be described later, and pivots parallel to the X, Y, and Z axes (hereinafter, referred to as α, β, and γ axes, respectively). It is rotatably supported as a center.
[0030]
The optical element fixing device 101 has an X direction moving mechanism 131 that moves the holding unit 121 in the X direction in FIG. 3 and a Z direction moving mechanism 134 that moves the holding unit 121 in the Z direction. The X-direction moving mechanism 131 provided on the base 111 has an X-stage 133 to which an X-direction adjusting mechanism 132 having a micrometer is fixed, and the X-stage 133 is controlled by controlling the X-direction adjusting mechanism 132. It moves in the X direction along a guide rail (not shown) provided between itself and the table 111. The Z-direction moving mechanism 134 has the same configuration, and the Z-stage 136 fixed to the plate 120 moves in the Z direction by controlling the Z-direction adjusting mechanism 135 having a micrometer. The X-direction moving mechanism 131 and the Z-direction moving mechanism 134 are connected to the control unit 105.
[0031]
The optical element fixing device 101 includes a Y-direction moving mechanism 137 that moves the support arm 61 in the Y direction, an α-rotation mechanism 141 that rotates around the α-axis, and a γ-rotation that rotates around the γ-axis. It has a mechanism 144 and a β rotation mechanism 147 that rotates around the β axis. The Y-direction moving mechanism 137 is attached to the plate 112 provided on the base 111, and has a Y stage 139 to which a Y-direction adjusting mechanism 138 having a micrometer is fixed. By controlling the Y direction adjusting mechanism 138, the Y stage 139 moves in the Y direction.
[0032]
The Y stage 139 is provided with a motor 142 having a reduction mechanism of the α rotation mechanism 141, and the α table 143 is rotated about the α axis by controlling the motor 142 having the reduction mechanism. The L-shaped member 140 is fixed to the α table 143. The L-shaped member 140 has a surface 140a projecting in the X direction and having a normal line parallel to the Z axis, and a γ rotation mechanism 144 is attached to the surface 140a. The γ rotation mechanism 144 has the same configuration as the α rotation mechanism 141, and the γ table 146 is rotated about the γ axis by the motor 145 with a speed reduction mechanism. The γ table 146 is provided with a β rotation mechanism 147 that supports the support arm 61 so as to be rotatable about the β axis, and the motor 148 with the speed reduction mechanism of the β rotation mechanism 147 causes the support arm 61 to rotate about the β axis. And rotate. Note that the Y-direction moving mechanism 137 and each of the rotating mechanisms 141, 144, and 147 are connected to the control unit 105.
[0033]
The optical element fixing device 101 further includes an imaging unit 7 (for example, a CCD camera) that receives a light beam from the semiconductor laser 41 to which the probe pin 126 is connected. It is provided to face. The imaging unit 7 has a detection lens 171 and an imaging device 172, and a light beam from the semiconductor laser 41 is received by the imaging device 172 via the detection lens 171. A switching lens 173 is further provided on the plate 120, and the switching lens 173 is movable between the imaging unit 7 and the collimator lens 42 with respect to the optical path of the light beam. In a state where the switching lens 173 is arranged on the optical path, the collimator lens 42 and the imaging device 172 (strictly, the light receiving surface of the imaging device 172) are optically conjugated by the switching lens 173 and the detection lens 171. . Further, above the imaging unit 7, a holding unit imaging unit 174 having a macro lens is provided, and an image of the vicinity of the collimator lens 42 on the base unit 22 is taken.
[0034]
FIG. 4 is a block diagram illustrating the configuration of the optical element fixing device 101. The control unit 151, the image processing unit 152, and the arm movement control unit 153 are stored in the control unit 105 in FIG. The image processing unit 152 performs various processes on the image data from the imaging unit 7 and outputs a signal to the control unit 151. The arm movement control unit 153 controls each of the movement mechanisms 131, 134, 137 and each of the rotation mechanisms 141, 144, and 147 (hereinafter, collectively referred to as “arm movement mechanism 130”) based on a signal from the control unit 151. Accordingly, the support arm 61 relatively moves along the three moving axes (that is, X, Y, and Z axes) perpendicular to each other with respect to the holding unit 121, and the three rotating axes (that is, α) that are perpendicular to each other. , Β, γ axes). In the optical element fixing device 101, an optical element unit is manufactured by the control unit 151 further controlling other components.
[0035]
Here, the basic configuration of the optical element unit manufactured by the optical element fixing device 101 according to the present invention will be described. FIGS. 5A to 5C are diagrams showing the basic configuration of the optical element unit. In the optical element unit 1a according to the first basic configuration shown in FIG. 5A, a predetermined optical axis 5 (that is, an axis serving as a reference when an optical element is positioned; The optical element 4 positioned with respect to the reference optical axis 5 is located above the base 2 to which is relatively fixed. The solder 3 is interposed between the base 2 and the optical element 4, and the optical element 4 is fixed to the base 2 in a non-contact manner. When the optical element 4 is positioned, the optical element 4 is supported by the support portion 6 (corresponding to the support arm 61) and is orthogonal to each other in three axial directions (that is, the X, Y, and Z axes in FIG. 5A). Direction), and further, about a rotation axis parallel to each axis (that is, α, β, γ axes). Thereby, the optical element 4 is positioned with respect to the reference optical axis 5.
[0036]
In the optical element unit 1b according to the second basic configuration shown in FIG. 5B, the reference light relatively fixed to one of the two optical elements 4 (that is, determined by one optical element 4). While the other optical element 4 is positioned with respect to the shaft 5, it is fixed via the solder 3 in a non-contact manner with each other. In the optical element unit 1c according to the third basic configuration shown in FIG. 5C, the reference optical axis 5 is positioned above the base 2 to which the reference optical axis 5 is relatively fixed. The plurality of optical elements 4 are located, and each optical element 4 is fixed to the base 2 in a non-contact manner with the solder 3 interposed therebetween. When the optical element units 1a, 1b, 1c are manufactured, each optical element 4 is positioned by the support 6 having six degrees of freedom.
[0037]
In the second basic configuration, a reference optical axis 5 serving as a reference for positioning the other optical element 4 is determined by one optical element 4, and a part of the one optical element 4 is a base in the first basic configuration. When considered to correspond to the unit 2, the second basic configuration can be said to be an application of the first basic configuration. Also in the third basic configuration, when it is considered that the other optical element 4 is positioned with respect to the base 2 to which the one optical element 4 for determining the reference optical axis 5 is fixed, the third basic configuration is adopted. The configuration can be said to be an application of the first basic configuration.
[0038]
FIG. 6 is a diagram illustrating a state in which the semiconductor laser module 11 is manufactured by the optical element fixing device 101 (however, only a part of the members on the holding unit 121, the support arm 61, and the imaging unit 7 are illustrated). FIG. 7 is a diagram showing a flow of a process of manufacturing the semiconductor laser module 11. Hereinafter, the manufacturing process and structure of the semiconductor laser module 11 will be described with reference to FIGS. 3, 4, and 6 along with FIG.
[0039]
A fixing portion 221 projecting in the (+ Y) direction in FIG. 6 is provided on the base portion 22, and a groove 222 having a U-shaped cross section is formed in the fixing portion 221. A semiconductor laser 41 for emitting a light beam is fixed in advance to a plate-shaped submount 21 via a solder 32, and the submount 21 is connected to a base portion via a solder 33 (preferably having a melting point lower than that of the solder 32). 22. At this time, the semiconductor laser 41 is arranged such that the surface of the semiconductor laser 41 from which the light beam is emitted faces the fixing portion 221. By attaching the semiconductor laser 41, the reference optical axis 5 corresponding to the light beam emitted from the semiconductor laser 41 is determined with respect to the base 22 (step S11).
[0040]
The base portion 22 to which the semiconductor laser 41 is attached is mounted on the holding portion 121 such that the side surface on the fixing portion 221 side contacts the base portion auxiliary member 122 (see FIG. 3). Positioned. The reference surface on which the base portion 22 is positioned may be appropriately changed as necessary. For example, a member that contacts a side surface orthogonal to the side surface of the base portion 22 on the fixed portion 221 side is provided on the holding portion 121. The base portion 22 may be positioned by this member and the upper surface of the holding portion 121 (and the auxiliary member 122 for the base portion). That is, in the optical element fixing device 101, the base portion 22 may be placed on the holding portion 121 with a fixed surface as a reference surface.
[0041]
Subsequently, the collimator lens 42 on the collimator lens auxiliary member 123 is supported by the support arm 61 via the solder 60 (Step S12). Specifically, the support arm 61 is moved by the arm moving mechanism 130 onto the collimator lens 42 mounted on the collimator lens auxiliary member 123 while being heated by the arm heater 161 under the control of the controller 151, and further, The solder 60 is applied to the tip of the support arm 61. Then, the tip of the support arm 61 and the collimator lens 42 come into contact with each other, and the heating by the arm heater 161 is stopped. The collimator lens 42 is formed of glass, and a metal such as gold is vapor-deposited on the outer peripheral surface in advance (so-called metallized) in order to fix the collimator lens 42 to the tip of the support arm 61 via the solder 60. Thus, the support arm 61 can easily support the collimator lens 42. Since the collimator lens 42 is placed along the groove of the collimator lens auxiliary member 123, the collimator lens 42 is supported by the support arm 61 in a predetermined posture.
[0042]
Powder solder 31 (for example, ball solder or cream solder) is applied to the groove 222 of the fixing portion 221 (or is applied in advance). The melting point of the solder 31 is lower than the melting points of the solders 32, 33, and 60 (for example, the melting point is 140 degrees), and the base part 22 is heated by the holding part heater 124 via the holding part 121. Heated until.
[0043]
FIG. 8 is a diagram illustrating a relationship between the temperature of the holding unit 121 detected by the temperature sensor 125 and time (that is, a temperature profile). In FIG. 8, time T1 is when the heating of the holding unit heater 124 is started, and at time T2, the temperature of the holding unit 121 is set to the temperature A at which the solder 31 melts. When the temperature of the holding unit 121 rises to A, the holding unit 121 is held at the temperature A (or a temperature slightly higher than A) by the holding unit heater 124. The state in which the solder 31 is melted is imaged by the imaging unit 174 for the holding unit, and is also confirmed from the acquired image. When the solder 31 is melted, the collimator lens 42 is transported to the groove 222 by the support arm 61 (step S13).
[0044]
A semiconductor laser driver (not shown) stored in the control unit 105 is electrically connected to the semiconductor laser 41 via a probe pin 126, and a light beam from the semiconductor laser 41 is collimated by the control of the semiconductor laser driver. 42 (that is, in the (-Z) direction in FIG. 6). The light beam is guided through the collimator lens 42 to the imaging unit 7 located in the (-Z) direction of the base unit 22. In the imaging unit 7, an image indicating the state of the light beam derived from the collimator lens 42 is obtained (step S14), and output to the image processing unit 152 (see FIG. 4). The image processing unit 152 appropriately processes the acquired image, and outputs the processed image to the control unit 151. When the control unit 151 outputs a control signal to the arm movement control unit 153 based on the processed image, the support arm 61 moves the collimator lens 42 in the X, Y, and Z axis directions, and α, β, γ. Rotating about the axis, the position and orientation of the collimator lens 42 are adjusted with respect to the semiconductor laser 41 (that is, so that the light beam is along the reference optical axis 5) (so-called active alignment is performed). (Step S15).
[0045]
FIGS. 9A to 9D are views for explaining how the collimator lens 42 is positioned. FIG. 9A shows a state in which the collimator lens 42 is appropriately positioned, and the light beam from the collimator lens 42 is parallel light parallel to the reference optical axis 5 (that is, a state in which the degree of parallelism (collimation property) is good). ), And the light beam forms a small spot on the imaging device 172 by the detection lens 171 (that is, the size of a bright region in an acquired image is reduced). Further, since the light beam is applied to a predetermined position on the imaging device 172, it can be confirmed that the directionality of the light beam is good.
[0046]
In the state of FIG. 9B, since the collimating property of the light beam is insufficiently adjusted, the spot of the light beam becomes large on the imaging device 172, and the bright area in the acquired image becomes a so-called blurred state. Become. In the state of FIG. 9C, the position and orientation of the collimator lens 42 are not appropriate, the direction of the light beam is shifted from the reference optical axis 5, and the predetermined position on the imaging device 172 is not irradiated with the light beam. .
[0047]
In the case where the semiconductor laser module 11 is used as a light source of an image recording apparatus or the like, since the light beam immediately after being emitted from the collimator lens 42 is used, in addition to the above-described adjustment of the collimation and directionality of the light beam, Then, as shown in FIG. 9D, the position and orientation of the collimator lens 42 are finely adjusted in a state where the switching lens 173 is arranged on the optical path of the light beam. That is, an image indicating the state of the light beam immediately after being derived from the collimator lens 42 is obtained, and the collimator lens 42 is positioned based on this image (that is, the cross-sectional shape of the light beam immediately after being derived). Steps S14 and S15 are repeated as necessary.
[0048]
FIG. 10 is a diagram showing a state when the semiconductor laser module 11 being manufactured is viewed from the (−Z) side in the (+ Z) direction. As shown in FIG. 10, the collimator lens 42 positioned with high precision (for example, with a precision of 0.1 to 0.2 μm with respect to the reference optical axis 5) is not in contact with the base portion 22. In addition, the solder 31 sufficiently intervenes between the collimator lens 42 and the base 22. This state is confirmed from an image acquired by the holding unit imaging unit 174. When the collimator lens 42 is positioned, subsequently, the heating by the holding unit heater 124 is stopped (time T3 in FIG. 8), the temperature of the solder 31 is reduced by natural cooling, and curing is started (step S16). .
[0049]
When the temperature of each member decreases, the relative position of the collimator lens 42 with respect to the reference optical axis 5 moves due to contraction, but the image of the light beam derived from the collimator lens 42 in the imaging unit 7 even during the curing of the solder 31. Is acquired (step S17), the position of the collimator lens 42 is confirmed (step S18), and the controller 151 follows the relative movement with respect to the reference optical axis 5 to position the collimator lens 42 (step S19). Steps S17 to S19 are repeated until the curing of the solder 31 is completed (step S20), whereby the relative position and orientation of the collimator lens 42 with respect to the reference optical axis 5 are maintained (that is, by the imaging unit 7). The obtained image is positioned so as to substantially maintain the state immediately before the hardening of the solder 31 is started.)
[0050]
When the solder 31 has hardened (time T4 in FIG. 8), the image acquired by the imaging unit 7 is in a constant state, and the temperature of the holding unit 121 becomes a predetermined temperature (for example, a temperature B (for example, It is confirmed by the temperature sensor 125 that the temperature is lower than 10 °))). Thereafter, the support arm 61 is heated by the arm heater 161, the solder 60 is melted, and the support arm 61 is separated from the collimator lens 42 (Step S21), whereby the semiconductor laser module 11 is completed.
[0051]
As described above, in the optical element fixing device 101, the collimator lens 42 is positioned with high accuracy with respect to the reference optical axis 5, and is in a non-contact state with the base portion 22 which is a portion fixed to the semiconductor laser 41. It can be fixed by the solder 31. As a result, in the optical element fixing device 101, it is possible to manufacture the semiconductor laser module 11 that emits an appropriate light beam having excellent directionality and collimation properties, and to simplify the structure (and reduce the size) of the semiconductor laser module 11. Is realized.
[0052]
Further, in the optical element fixing device 101, since the posture of the collimator lens 42 is adjusted in advance by the collimator lens auxiliary member 123, the support arm 61 is at least three axes (here, X, Y, By relatively moving with respect to the (Z axis), the collimator lens 42 is provisionally accurately positioned. Even when the posture changes when the collimator lens 42 is supported by the support arm 61, the support arm 61 moves relatively along three movement axes (that is, X, Y, and Z axes) and the three By relatively rotating about the rotation axis (that is, the α, β, and γ axes), the base portion 22 is accurately positioned in a non-contact state.
[0053]
Note that the semiconductor laser module 11 corresponds to the optical element unit 1a according to the first basic configuration of the basic configurations of FIGS. 5A to 5C. That is, by fixing the semiconductor laser 41, the collimator lens 42 is positioned with respect to the reference optical axis 5 fixed to the base 22. Further, the semiconductor laser 41 (or the submount 21 to which the semiconductor laser 41 is fixed) is positioned with respect to the reference optical axis assumed with respect to the base 22, and is brought into non-contact with the base 22 through solder. In this case, the semiconductor laser module corresponds to the optical element unit 1c according to the third basic configuration in FIG. 5C.
[0054]
FIG. 11 is a diagram showing an optical head 8 using the above-described semiconductor laser module 11. The optical head 8 has a light source unit 81 having a plurality of channels, and a light beam emitted from the light source unit 81 is applied to an exposure area where a photosensitive material or the like is located through a lens group 82 forming a double-sided telecentric optical system. You. The light source unit 81 includes a module support section 811 for supporting the semiconductor laser module 11, a semiconductor laser drive control section 812 for controlling the driving of the semiconductor laser module 11, and a temperature adjusting section 813 for adjusting the temperature of the semiconductor laser module 11. Then, the semiconductor laser modules 11 are fitted into the plurality of holes formed two-dimensionally in the module support 811.
[0055]
At this time, since the semiconductor laser module 11 is adjusted with the side surface of the base portion 22 on the fixing portion 221 side as a reference surface (that is, because the collimator lens 42 is positioned), this side surface corresponds to the surface of the module support portion 811. By contacting the optical head 8, the optical head 8 is accurately positioned.
[0056]
By using the semiconductor laser module 11 in the optical head 8, a small-sized optical head 8 capable of appropriately emitting (for example, in a certain direction) light beams of a plurality of channels is realized, and an image recording apparatus (for example, raster Thus, downsizing of the scanning image recording apparatus and high-precision drawing can be realized.
[0057]
FIG. 12 is a diagram illustrating an optical element unit 12 according to another example manufactured by the optical element fixing device 101. An optical element unit 12 (for example, a Mach-Zehnder modulator) shown in FIG. 12 is an optical fiber 43, an optical waveguide formed of a dielectric material such as lithium niobate (LN) or a semiconductor material such as gallium arsenide (GaAs). An optical waveguide element 44 having an element 44, a microlens array 45 in which a plurality of lenses 451 are arranged and formed, and a base 23, and from an optical fiber 43 connected to an external light source (for example, a semiconductor laser). Introduced to. The light beam is split at the optical waveguide element 44, and is led out to each of the lenses 451 included in the microlens array 45, and the modulated light is guided to a predetermined position.
[0058]
FIG. 13 is a diagram showing a state when the optical element unit 12 on the optical element fixing device 101 is viewed from the (+ X) side in the (−X) direction, and the optical element unit 12 and the support arm 61 (or , Support arm 62) only. The support arm 62 has a grip 621 at the tip. When the optical element unit 12 is manufactured, the support arm 61 and the support arm 62 of the optical element fixing device 1 are exchanged according to the process, but both are shown in FIG. In the optical element unit 12, the microlens array 45 is positioned after the optical fiber 43 is positioned with respect to the optical waveguide element 44. Hereinafter, the manufacturing process and the structure of the optical element unit 12 will be described in detail according to the flow of the manufacturing process in FIG.
[0059]
The optical waveguide element 44 has a plurality of optical waveguide outlets 442 for one optical waveguide entrance 441, and is fixed to the base portion 23. Thereby, the reference optical axis 5a corresponding to the direction of the optical waveguide entrance 441 of the optical waveguide element 44 is determined with respect to the base 23 (step S11). Subsequently, an optical fiber 43 having a metallized tip (or a metal sleeve) is provided at another location on the holding section 121 via the solder 60 by the support arm 61 (for example, provided for the optical fiber 43). (On the provided auxiliary member) (step S12). The solder 31a is applied to the optical waveguide element 44 on the side of the optical waveguide entrance 441 on the base portion 23, and the base portion 23 is heated to the melting point of the solder 31a (that is, the holding portion 121 is heated). 31a is melted. Then, the optical fiber 43 is transported to the optical waveguide entrance 441 by the support arm 61 (step S13).
[0060]
It is possible to introduce light from a separately provided light source into the optical fiber 43 during the manufacturing process, and the light beam introduced into the optical fiber 43 enters the optical waveguide element 44 from the optical waveguide entrance 441. And the branched light is respectively derived from the plurality of optical waveguide outlets 442. The derived light is received by the imaging unit 7 (see FIG. 3) via a separately provided dedicated lens system, and an image is obtained (step S14). The support arm 61 moves the optical fiber 43 in the X, Y, and Z axis directions by the arm moving mechanism 130, and rotates around the α, β, and γ axes based on the brightness and distribution of light indicated by the acquired image. The optical fiber 43 is moved to position the distal end of the optical fiber 43 so that the image indicating the state of light is in a predetermined state (that is, the distal end of the optical fiber 43 is along the reference optical axis 5a) (step S15). At this time, the solder 31a is interposed between the optical fiber 43 and the base 23.
[0061]
Subsequently, by stopping the heating of the base portion 23, the curing of the solder 31a is started (step S16), and the positioning of the optical fiber 43 is repeated following the relative movement of the reference optical axis 5a due to cooling (step S16). Steps S17 to S19). When the solder 31a is hardened (Step S20), the support arm 61 is heated by the arm heater 161 to melt the solder 60 and separate it from the optical fiber 43 (Step S21).
[0062]
When the optical fiber 43 is fixed to the base 23, the microlens array 45 is subsequently gripped by the grip 621 of the support arm 62 at another location on the holder 121 (step S12). In addition, since the plurality of reference optical axes 5b serving as a reference for positioning the microlens array 45 correspond to the directions of the plurality of optical waveguide outlets 442 of the optical waveguide element 44, the optical waveguide element 44 is fixed to the base portion 23. At this point, a plurality of reference optical axes 5b have already been determined (corresponding to step S11).
[0063]
Then, the base portion 23 is heated to the melting point of the solder 31 b while the solder 31 b is applied to the side surface 231 of the base portion 23 on the optical waveguide outlet 442 side (that is, the (−Z) side), and the microlens array 45 is moved to the support arm 62. To the side 231 (step S13). The distance between the lenses 451 of the microlens array 45 is equal to the distance between the optical waveguide outlets 442, and the microlens array 45 is held at a position where each lens 451 corresponds to each optical waveguide outlet 442. The surface of the microlens array 45 facing the base 23 is metallized, and a solder 31b having a melting point lower than that of the solder 31a is used.
[0064]
A plurality of lights led out from the optical waveguide outlet 442 of the optical waveguide element 44 toward the microlens array 45 are guided to the imaging unit 7 (see FIG. 3) via the lenses 451, respectively, and correspond to the plurality of lights. An image is obtained (Step S14). Under the control of the control unit 151, the support arm 62 moves the microlens array 45 in three directions orthogonal to each other and rotates about three axes orthogonal to each other based on the acquired image, and outputs a plurality of light beams. Are positioned along the reference optical axis 5b so as to be in an appropriate state (step S15). At this time, the solder 31b is interposed between the microlens array 45 and the base 23. Then, the hardening of the solder 31b is started (step S16), and the microlens array 45 is positioned following the relative movement with respect to the reference optical axis 5b (steps S17 to S19). When the solder 31b is hardened (Step S20), the holding of the microlens array 45 by the support arm 62 is released (Step S21).
[0065]
As described above, in the optical element fixing device 101, the optical fiber 43 and the microlens array 45 are fixed to the base portion 23 in a non-contact manner via the solders 31a and 31b, and the reference light determined by the optical waveguide element 44. Positioning can be performed with high accuracy with respect to the shafts 5a and 5b. As a result, light is efficiently introduced by the optical element fixing device 101, the optical element unit 12 capable of emitting branched light in an appropriate direction is easily manufactured, and the structure of the optical element unit 12 is simplified. Can be. The optical element unit 12 corresponds to the optical element unit 1a (FIG. 5A) according to the first basic configuration in the relationship between the base 23 and the optical fiber 43, and the base 23, the optical fiber 43, and the optical When the waveguide element 44 is integrally captured, the relationship between the optical waveguide element 44 and the microlens array 45 corresponds to the optical element unit 1b (FIG. 5B) according to the second basic configuration.
[0066]
FIG. 14 is a diagram showing an optical element unit 13 according to still another example manufactured by the optical element fixing device 101. In the optical element unit 13 shown in FIG. 14, each of the plurality of semiconductor lasers 41 is fixed at a position corresponding to the lens 461 of the microlens array 46, and is a light source unit of a plurality of channels. When the optical element unit 14 shown in FIG. 14 is manufactured, a support arm 62 having a grip portion whose tip is directed in the (-Z) direction is used.
[0067]
FIG. 15 is a longitudinal sectional view of the optical element unit 13, and shows only a part of the optical element unit 13. Hereinafter, a manufacturing process and a structure of the optical element unit 13 will be described with reference to FIGS.
[0068]
In the optical element unit 13, the plurality of reference optical axes 5 serving as references at the time of manufacture correspond to the optical axes of the lenses 461 of the microlens array 46 (that is, step S11 in FIG. 7 is unnecessary). ). The semiconductor laser 41 is fixed to the submount 21 in advance, and the submount 21 is fixed to the auxiliary plate 24. Subsequently, the auxiliary plate 24 is gripped by the support arm 62 that can move in the X, Y, and Z axis directions and can rotate around the α, β, and γ axes (step S12). One surface 462 of the microlens array 46 is metallized, and the semiconductor laser 41 is transported by the support arm 62 to a position corresponding to one lens 461 together with the auxiliary plate 24 (step S13).
[0069]
Then, while the solder 31 is applied between the auxiliary plate 24 and the main surface 462, the auxiliary plate 24 is heated by the arm heater 161 to the melting point of the solder 31 via the support arm 62. Thus, the solder 31 is interposed between the auxiliary plate 24 and the microlens array 46 as shown in FIG.
[0070]
The semiconductor laser 41 is electrically connected to the semiconductor laser driving unit, as in the example of the semiconductor laser module 11, and the semiconductor laser 41 emits a light beam under the control of the semiconductor laser driving unit. The light beam is guided to the imaging unit 7 (see FIG. 3) via the lens 461, and an image corresponding to the state of the light beam is obtained (Step S14).
[0071]
The support arm 62 moves and rotates the semiconductor laser 41 based on the image obtained under the control of the control unit 151, and the semiconductor laser 41 is positioned with respect to the reference optical axis 5 (step S15). At this time, the microlens array 46 and the auxiliary plate 24 are brought into a non-contact state, and by stopping the heating of the auxiliary plate 24, the hardening of the solder 31 is started (step S16), and the positioning of the semiconductor laser 41 is determined as a reference. This is repeated following the relative movement of the optical axis 5 (steps S17 to S19). When the solder 31 has hardened (step S20), the holding of the auxiliary plate 24 by the support arm 62 is released (step S21).
[0072]
Steps S12 to S21 are repeated for each of the plurality of reference optical axes 5, and the plurality of semiconductor lasers 41 are fixed to the microlens array 46.
[0073]
As described above, in the optical element fixing device 101, the solder 31 is positioned while positioning the plurality of semiconductor lasers 41 with respect to the plurality of reference optical axes 5 determined by the plurality of lenses 461 of the microlens array 46 with high accuracy. It can be fixed to the microlens array 46 in a non-contacting manner. Thereby, in the optical element fixing device 101, the optical element unit 13, which is a light source unit of a plurality of channels, can be easily manufactured. It can be simplified. In the optical element unit 13, the microlens array 46 is a base for supporting the semiconductor laser 41 while determining the plurality of reference optical axes 5, and each lens of the microlens array 46 and the semiconductor laser 41 are 5B corresponds to the optical element unit 1b according to the second basic configuration.
[0074]
FIG. 16 is a diagram illustrating a state in which an optical element unit 14 according to still another example is manufactured in the optical element fixing device 101. The optical element unit 14 is configured such that a plurality of optical fibers 43 connected to a semiconductor laser for optical communication or the like are arranged on the base 23 with high accuracy. Hereinafter, the optical element unit 14 will be referred to as a fiber array 14, and the flow of manufacturing the fiber array 14 and the structural features of the fiber array 14 will be described with reference to FIG.
[0075]
First, the base unit 23 is arranged to face the imaging unit 7 (that is, placed on the holding unit 121), and a plurality of reference optical axes 5 assumed for the base unit 23 are determined (step S11). . Subsequently, the optical fiber 43 having a metallized tip (or a metal sleeve provided at the tip) is supported by the support arm 61 via the solder 60 (step S12). The support arm 61 is movable in the X, Y, and Z axis directions and is rotatable about the α, β, and γ axes, and the optical fiber 43 is moved by the support arm 61 to a plurality of reference optical axes 5 above the base portion 23. (Step S13).
[0076]
FIG. 17 is a diagram showing a state when the fiber array 14 being manufactured is viewed from the (−Z) side in the (+ Z) direction. As shown in FIG. 17, the solder 31 is applied to the base portion 23, and the base portion 23 is heated to the melting point of the solder 31 (that is, the holding portion heater 124 heats the holding portion 121). 31 is melted, and the solder 31 is interposed between the optical fiber 43 and the base 23. Here, a light beam is emitted from the core of the optical fiber 43, the support arm 61 moves based on the image of the light beam acquired by the imaging unit 7, and the optical fiber 43 is moved to a position based on the base unit 23. (Specifically, the center axis of the optical fiber 43 is positioned on the reference optical axis 5) (steps S14 and S15).
[0077]
At this time, as in the case of the semiconductor laser module 11, by disposing the switching lens 173 on the optical path, the position of the core of the optical fiber 43 is confirmed, and the optical fibers 43 are arranged corresponding to the reference optical axis 5. You. Then, the direction of the light beam is confirmed by switching the switching lens 173 to another lens provided separately. Subsequently, the heating of the base portion 22 is stopped and the hardening of the solder 31 is started (step S16). In the imaging unit 7, the positioning of the optical fiber 43 is repeated following the relative movement of the reference optical axis 5 while checking the image of the light beam (steps S17 to S19).
[0078]
When the solder 31 has hardened (step S20), the support arm 61 is heated and separated from the optical fiber 43 (step S21). Then, by repeating steps S12 to S21, the next optical fiber 43 is positioned with respect to the next reference optical axis 5. In this manner, the plurality of optical fibers 43 are arranged on the base 23 with high accuracy. It has been empirically known that the solder 31 once melted and solidified will not be re-melted unless the temperature is raised to a temperature higher than the temperature immediately before being melted. The fiber 43 can be fixed to the base 23.
[0079]
In step S18 in the above description, the movement of the reference optical axis 5 may be detected based on the light from the optical fiber 43 already attached, or may be detected by a separately provided detector.
[0080]
As described above, in the optical element fixing device 101, the solder 31 is interposed while each of the plurality of optical fibers 43 is positioned with high accuracy with respect to the plurality of reference optical axes 5 relatively fixed to the base portion 23. And can be fixed without contact with the base portion 23. Accordingly, in the optical element fixing device 101, the structure of the fiber array 14 that emits a plurality of light beams having excellent directivity (that is, a plurality of light beams whose emission angles are appropriately adjusted) can be simplified. , The production cost can be reduced. Each optical fiber 43 and the base 23 correspond to the optical element unit 1a according to the first basic configuration.
[0081]
Further, in the optical element fixing device 101, glass powder may be used instead of the solder 31 as a fixing medium for fixing the optical element. In this case, an optical element (for example, a collimator) positioned with respect to the reference optical axis 5 The lens 42) is fixed in a non-contact manner with the base portion with the glass powder interposed. Thus, in the optical element fixing device 101, it is possible to manufacture an optical element unit in which the optical element is positioned with high precision while the optical element is fixed by the glass powder.
[0082]
FIG. 18 is a perspective view showing an optical element fixing device 101a according to the second embodiment of the present invention. In the optical element fixing device 101a shown in FIG. 18, a cooling unit 127 including an air nozzle 127b connected to an air supply unit 127a is provided, and air (or nitrogen gas) is directed toward the holding unit 121 by the cooling unit 127. Granted. Other configurations are the same as those of the optical element fixing device 101 according to the first embodiment, and are denoted by the same reference numerals.
[0083]
The optical element fixing device 101a in FIG. 18 differs from the optical element fixing device 101 in FIG. 3 in the method of curing the solder 31. Specifically, when the solder 31 is cured in step S16 in FIG. 7, air is applied from the cooling unit 127 to the holding unit 121. That is, when the solder 31 is hardened, the cooling by the cooling unit 127 is forcibly cooled while the heating by the holding unit heater 124 is stopped. Thereby, in the optical element fixing device 101a, the solder 31 can be cured in a short time. The method of positioning the optical element (for example, the collimator lens 42) following the relative movement with respect to the reference optical axis 5 in steps S17 to S20 is the same as that in the first embodiment.
[0084]
Further, as another example in which the optical element fixing device 101a hardens the solder 31, the holding unit 121 may be constantly heated by the holding unit heater 124, and the cooling unit 127 may sequentially apply air. For example, in the example of the semiconductor laser module 11, first, the base part 22 to which the semiconductor laser 41 is fixed is placed on the holding part 121 maintained at the melting temperature of the solder 31 by the holding part heater 124, and the solder 31 is It is melted (that is, a part of the process of step S13 is performed). The semiconductor laser 41 is electrically connected via a probe pin 126, and the collimator lens 42 moves in the X, Y, and Z-axis directions and is supported by a support arm 61 that can rotate around α, β, and γ axes. (May be supported in advance) (step S12), and is conveyed to the groove 222 having the molten solder 31 (see FIG. 6) (step S13). Then, as in the first embodiment, an image is acquired by the imaging unit 7, and the collimator lens 42 is quickly positioned based on the image (steps S14 and S15).
[0085]
Subsequently, air is applied from the cooling unit 127 while the holding unit 121 is heated. At this time, only the vicinity of the upper surface of the holding unit 121 including the base unit 22 is cooled by the cooling unit 127, and the temperature is reduced. The positioning of the collimator lens 42 is repeated following the relative movement of the reference optical axis 5 due to the temperature drop, and the hardening of the solder 31 is completed and the collimator lens 42 is fixed (steps S16 to S20). The support arm 61 is separated from the collimator lens 42 while being heated (step S21), and the semiconductor laser module 11 maintained at a temperature equal to or lower than the solidification temperature of the solder 31 is removed from the holding unit 121. Then, the application of air from the cooling unit 127 is stopped, and the temperature near the upper surface of the holding unit 121 is quickly heated to the melting temperature of the solder 31. As described above, in the optical element unit manufacturing method according to another example of the optical element fixing device 101a, the temperature profile of the base section 22 (that is, the temporal change of the temperature) of the base section 22 is changed while the holding section 121 is constantly heated. Therefore, the optical element units (for example, the optical element units 11 to 14) can be appropriately manufactured.
[0086]
As described above, in the optical element fixing device 101a according to the second embodiment, the temperature of the holding unit 121 is controlled by the holding unit heater 124 and the cooling unit 127. Thereby, in the optical element fixing device 101a, the solder 31 is quickly melted or solidified, and an optical element unit in which the optical element is positioned with high precision can be appropriately manufactured.
[0087]
FIG. 19 is a perspective view showing an optical element fixing device 101b according to the third embodiment of the present invention. In the optical element fixing device 101b, as compared with the optical element fixing device 101 of FIG. 3, the holding unit heater 124 and the temperature sensor 125 are deleted, and a light irradiation unit 128 is provided. The light irradiating section 128 has an optical fiber 128b connected to a light source 128a, and irradiates light (for example, ultraviolet light) to the optical element unit on the holding section 121. Other configurations are the same as those of the optical element fixing device 101 according to the first embodiment, and are denoted by the same reference numerals.
[0088]
In the optical element fixing device 101b, an adhesive containing an ultraviolet curable resin is used as a fixing medium for fixing the optical element. Hereinafter, an example of manufacturing the semiconductor laser module 11 will be described with reference to FIG. 6 (however, the solder 31 in FIG. 6 will be described as an adhesive). Similarly to the first embodiment, the support arm 61 is relatively movable with respect to the holding unit 121 along three movement axes perpendicular to each other, and is relatively rotatable about three rotation axes perpendicular to each other. Is moved to the groove 222 of the base unit 22 and is positioned with respect to the reference optical axis 5 based on the output of the imaging unit 7 (steps S11 to S15). (Corresponding to the reference numeral 31 in FIG. 6), and ultraviolet light is irradiated from the light irradiation unit 128 toward the vicinity of the groove 222. Thereby, the curing of the adhesive is started (step S16), and the relative movement of the reference optical axis 5 due to the contraction of the adhesive is confirmed from the image by the imaging unit 7 until the curing is completed (for example, several tens of seconds). Then, the positioning of the collimator lens 42 is repeated following the relative movement (steps S17 to S19).
[0089]
If it is confirmed from the image that the relative movement of the reference optical axis 5 has stopped (that is, if the adhesive has been cured) (step S20), the support arm 61 is heated and separated from the collimator lens. Then, the semiconductor laser module 11 is removed from the holding unit 121. Note that other optical element units (for example, the optical element units 12 to 14) may be manufactured by the optical element fixing device 101b by the same method.
[0090]
As described above, in the optical element fixing device 101b according to the third embodiment, the light irradiation unit 128 is provided, so that the adhesive interposed between the optical element and the base unit is cured, and the optical element is fixed. An optical element unit positioned with high precision can be manufactured appropriately. Note that the resin component contained in the adhesive does not necessarily need to be an ultraviolet curable resin, and may be, for example, a thermosetting resin. In this case, as in the first embodiment, the adhesive may be cured by the holding unit heater 124.
[0091]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0092]
The support arm is not limited to the above embodiment, and may be a collet that supports the optical element by vacuum suction. When a collet is used, the optical element is supported or separated by ON / OFF of the vacuum. Further, in a support arm that supports an optical element with solder interposed therebetween, an adhesive may be used instead of solder. In this case, the support arm and the optical element are separated by rotating the support arm. Is also good.
[0093]
The optical element fixing device may be provided with a fixed medium supply unit that supplies solder or an adhesive, and the fixed medium may be applied to the base unit from the fixed medium supply unit under the control of the control unit 151.
[0094]
The light emitted through the optical element supported by the support arm 61 or the optical element attached to the base does not necessarily need to be received by the imaging unit 7, for example, based on only the directionality of the light. When the optical element is positioned, the light may be received by a PSD element or the like that detects the position of the received light.
[0095]
A light source for emitting a light beam may be provided in the optical element fixing device, and the optical element may be positioned using the light beam as a reference optical axis.
[0096]
In the optical element fixing device, in any optical element unit, in addition to being positioned with respect to the reference optical axis, the state of light derived from the optical element is in a desired state (for example, a state in which collimation adjustment is performed). It may be positioned so that Specifically, in the case of an optical element unit to which a plurality of optical elements are fixed, and the optical element close to the imaging unit 7 (that is, the optical element forward in the light traveling direction) is a lens, In a state where the switching lens 173 is disposed between the optical element and the imaging unit 7, the front optical element and the imaging device 172 of the imaging unit 7 are optically conjugate, and any one of the optical elements is positioned. You may.
[0097]
The optical element included in the optical element unit does not necessarily need to be a collimator lens, a lens included in a microlens array, an optical fiber, a semiconductor laser, or an optical waveguide element. It may be a minute optical element requiring accuracy. The optical element fixing device can accurately position even a small optical element. The optical element that determines the reference optical axis 5 may be an optical element other than a semiconductor laser, an optical waveguide element, or a lens included in a microlens array. For example, the optical element that emits light may be a light emitting diode or the like. Alternatively, a semiconductor light emitting device of a type different from the semiconductor laser may be used.
[0098]
In an optical element unit in which a plurality of optical elements are positioned, the manner in which the optical elements are arranged is not limited to the above embodiment. In the optical element fixing device according to the present invention, since the position and orientation of the optical element can be freely determined (that is, the optical element can be adjusted with many degrees of freedom), the optical elements are arranged in a complicated manner. High-precision optical axis adjustment is possible.
[0099]
【The invention's effect】
According to the present invention, the optical element can be positioned with high precision and fixed to the base.
[0100]
According to the eighth aspect of the present invention, the optical element can be positioned based on the state of light immediately after emission from the front optical element.
[0101]
According to the tenth aspect, the optical element can be freely positioned.
[0102]
According to the twelfth aspect, the optical element can be easily supported.
[Brief description of the drawings]
FIG. 1 is a diagram showing a state in which a conventional optical element unit is manufactured.
FIG. 2 is a perspective view showing a conventional optical element unit.
FIG. 3 is a perspective view showing the optical element fixing device according to the first embodiment.
FIG. 4 is a block diagram illustrating a configuration of an optical element fixing device.
FIGS. 5A to 5C are diagrams showing a basic configuration of an optical element unit.
FIG. 6 is a diagram illustrating an example of a state in which an optical element unit is manufactured.
FIG. 7 is a diagram showing a flow of a process of manufacturing an optical element unit.
FIG. 8 is a diagram illustrating a temperature profile of a holding unit.
FIGS. 9A to 9D are diagrams for explaining how a collimator lens is positioned.
FIG. 10 is a diagram showing a state of manufacturing an optical element unit.
FIG. 11 is a perspective view showing an optical head.
FIG. 12 is a perspective view showing another example of the optical element unit.
FIG. 13 is a diagram illustrating a state in which an optical element unit is manufactured.
FIG. 14 is a diagram showing still another example of how to manufacture an optical element unit.
FIG. 15 is a diagram illustrating a state in which an optical element unit is manufactured.
FIG. 16 is a view showing still another example of a state in which an optical element unit is manufactured.
FIG. 17 is a diagram illustrating a state in which an optical element unit is manufactured.
FIG. 18 is a perspective view showing an optical element fixing device according to a second embodiment.
FIG. 19 is a perspective view showing an optical element fixing device according to a third embodiment.
[Explanation of symbols]
1a to 1c, 11 to 14 Optical element unit
2,22,23 Base part
3,31,31a, 31b, 32,33,60 solder
4 Optical element
5,5a, 5b Reference optical axis
7 Imaging unit
41 Semiconductor Laser
42 Collimator lens
43 Optical fiber
44 Optical waveguide device
45, 46 micro lens array
61,62 Support arm
101, 101a, 101b Optical element fixing device
121 Holder
124 Holder heater
127 Cooling unit
128 Light irradiator
130 Arm moving mechanism
151 control unit
161 Arm heater
172 Imaging device
173 switching lens
451,461 lens
S11 to S21 Step

Claims (17)

An optical element fixing device for fixing an optical element to a base portion,
A holding unit that holds a base unit to which a fixing medium for fixing the first optical element is applied;
A supporting unit that supports the first optical element, conveys the first optical element to the base unit, and separates from the first optical element after being fixed;
A first optical element, or a light receiving unit that receives a reference light beam emitted through the second optical element attached to the base unit;
A mechanism for moving or rotating the support portion relative to the holding portion,
A control unit that positions the first optical element at a position based on the second optical element based on an output from the light receiving unit;
An optical element fixing device comprising: The optical element fixing device according to claim 1,
The optical element fixing device, wherein the control unit controls the position of the first optical element while the fixing medium is being cured. The optical element fixing device according to claim 1 or 2,
An optical element fixing device, wherein the first optical element is a collimator lens. The optical element fixing device according to claim 1, wherein:
The optical element fixing device, wherein the second optical element is a semiconductor light emitting element that emits light toward the first optical element. The optical element fixing device according to claim 1 or 2,
An optical element fixing device, wherein the first optical element is a microlens array. The optical element fixing device according to claim 1, 2 or 5,
The optical element fixing device, wherein the second optical element is an optical waveguide element that emits light toward the first optical element. The optical element fixing device according to claim 1 or 2,
An optical element fixing device, wherein the first optical element is an optical fiber. The optical element fixing device according to claim 1 or 2,
A switching lens capable of moving forward and backward with respect to an optical path between a front optical element near the light receiving unit and the light receiving unit among the first optical element and the second optical element;
An optical element, wherein the front optical element is a lens, and wherein the front optical element and a light receiving element surface in the light receiving section are optically conjugate in a state where the switching lens is disposed on the optical path. Fixing device. An optical element fixing device for fixing an optical element to a base portion,
A holding unit that holds a base unit to which a fixing medium for fixing the optical element is applied,
Supporting the optical element and transporting it to the base part, a supporting part that separates from the optical element after fixing,
A moving mechanism that relatively moves or rotates the support unit with respect to at least three axes with respect to the holding unit;
An optical element fixing device comprising: The optical element fixing device according to claim 9,
The optical element fixing device, wherein the moving mechanism relatively moves the supporting portion with respect to the holding portion along three moving axes and relatively rotates about three rotating axes. The optical element fixing device according to claim 9 or 10,
The optical element fixing device, wherein the optical element is a semiconductor light emitting element, a collimator lens, a microlens array, or an optical fiber. The optical element fixing device according to claim 1, wherein:
Further comprising a temperature control unit for controlling the temperature of the support unit,
The optical element fixing device, wherein the support section supports the optical element via solder. An optical element fixing device according to any one of claims 1 to 12,
The fixing medium is an adhesive containing a resin component,
An optical element fixing device, further comprising a curing means for curing a fixing medium on a base portion. An optical element fixing device according to any one of claims 1 to 12,
The fixing medium is glass powder or solder,
An optical element fixing device, further comprising another temperature control unit for controlling a temperature of the holding unit. An optical element fixing device for fixing an optical element to a base portion,
A holding unit that holds a base unit to which a fixing medium for fixing the optical element is applied,
Supporting the optical element and transporting it to the base part, a supporting part that separates from the optical element after fixing,
A light receiving unit that receives a reference light beam emitted through the optical element,
A mechanism for moving or rotating the support portion relative to the holding portion,
A control unit that positions the optical element at a position based on the base unit based on the output from the light receiving unit,
An optical element fixing device comprising: An optical element fixing method for fixing an optical element to a base portion,
A step of supporting the first optical element by the support portion and positioning the first optical element at a predetermined position with respect to the base portion;
A first optical element, or a step of receiving a reference light beam emitted through a second optical element attached to the base unit by a light receiving unit;
A step of positioning the first optical element at a position based on the second optical element based on an output from the light receiving unit;
Fixing the first optical element to the base with a fixing medium;
Separating the supporting portion from the first optical element after fixing;
An optical element fixing method comprising: An optical element fixing method for fixing an optical element to a base portion,
A step of supporting the optical element by a support portion and positioning the optical element at a predetermined position with respect to the base portion by relatively moving or rotating with respect to at least three axes;
Fixing the optical element to the base with a fixing medium;
Separating the support from the optical element after fixing,
An optical element fixing method comprising:

Images