JP2004151561A - Method for manufacturing electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a liquid crystal display device by using the existing manufacturing facilities of glass substrates, and also manufacturing an electro-optical device such as an inexpensive liquid crystal display device having high strength. <P>SOLUTION: The method for manufacturing an electro-optical device according to this invention is to manufacture the electro-optical device by forming a resin base material 12 on a glass substrate 11 (Fig.(b)), forming a display element 13 on the formed resin base material 12 (Fig.(c)), and thereafter removing the glass substrate 11 by etching (Fig.(d)). Thus, the existing manufacturing facilities for the electro-optical device can be utilized, and moreover, a thin-film and light-weighted electro-optical device can be manufactured. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an electro-optical device, such as a liquid crystal device, for displaying an image such as a character, a numeral, or a picture by controlling the orientation of a liquid crystal sealed between a pair of substrates.
[0002]
[Prior art]
In general, a liquid crystal device is formed by attaching an additional device such as a lighting device such as a backlight or an IC for driving a liquid crystal to a liquid crystal panel having a structure in which liquid crystal is sealed between a pair of substrates. In general, a liquid crystal panel is configured such that a first substrate on which a first electrode is formed and a second substrate on which a second electrode is formed are bonded to each other with a sealant, and a gap formed between the substrates, that is, a so-called cell. It is formed by enclosing liquid crystal in the gap.
[0003]
As a method of manufacturing the above-described liquid crystal device, conventionally, a first substrate preform on which a plurality of liquid crystal panel first electrodes are formed and a second substrate preform on which a plurality of liquid crystal panels second electrodes are formed are mutually bonded. Combined to form a large-sized panel structure including a plurality of liquid crystal panel parts, and then cut the large-sized panel structure to form a medium-sized panel structure in which the liquid crystal injection ports of the plurality of liquid crystal panel parts are exposed to the outside. Then, liquid crystal is injected into each liquid crystal panel portion through the exposed liquid crystal injection port, then the medium-sized panel structure is divided into individual liquid crystal panels, and then the divided individual liquid crystal panels are divided. There is known a manufacturing method including a series of steps of attaching a polarizing plate to a substrate.
[0004]
Prior to the step of attaching the polarizing plate, an IC mounting step of mounting an IC chip such as a liquid crystal driving IC on a liquid crystal panel may be executed as necessary.
[0005]
In such a liquid crystal device, the pair of first and second substrates are often formed of a hard member such as glass or plastic. Here, plastic is less likely to be broken than glass, and has advantages such as light weight, but has low rigidity and has no so-called rigidity, so that when it is bent, various film-formed electrodes, alignment films, The insulating film and the like are cracked and broken, and it is difficult to hold the substrate flat and firmly. Therefore, it is more difficult to form a substrate of a liquid crystal device using a plastic film than when using glass. Met.
[0006]
To alleviate this manufacturing difficulty, various steps conventionally required to form a substrate for a liquid crystal device are performed on a plastic film adhered to a glass support member by an adhesive layer. After the completion of these steps, a method has been proposed in which the adhesive layer is irradiated with ultraviolet rays to reduce the adhesive strength, and then the glass support member is peeled off from the plastic film (Patent Documents 1 and 2). 2).
[0007]
[Patent Document 1]
JP-A-9-105896 [Patent Document 2]
JP-A-7-192321
[Problems to be solved by the invention]
However, with respect to the plastic film laminate used in the conventional method of manufacturing a liquid crystal device according to Patent Document 1 or 2, when the glass support member that is no longer needed after various processes including a heat treatment is peeled off from the plastic film. In addition, there is a problem that the plastic film is deformed, for example, contracted, and a dimensional error occurs in the plastic film substrate of the liquid crystal device.
[0009]
In addition, when such a dimensional error occurs, when a pair of plastic film substrates are combined with each other or when a plastic film substrate and a glass substrate are combined with each other, a displacement between the assembled substrates, that is, a so-called misalignment occurs. Therefore, there is a problem that the quality of the liquid crystal device is deteriorated.
[0010]
Further, when forming a resin layer, an adhesive layer or an adhesive layer or the like is essential, so that there is a problem that, for example, in a sputtering step or the like, treatment cannot be performed at a high temperature (for example, 200 ° C.).
[0011]
Further, when the pressure-sensitive adhesive or the adhesive remains, there is a problem that process contamination or the like occurs.
[0012]
Furthermore, at present, the production line of liquid crystal display devices using glass substrates is the mainstream, and when this work procedure or equipment is significantly changed, a significant change in the production line or replacement of production equipment occurs. As a result of an increase in equipment costs, there is a problem that it is not possible to provide an inexpensive liquid crystal display device, which is reflected in manufacturing costs.
[0013]
The present invention has been made in view of the above problems, and provides a method of manufacturing an electro-optical device such as a liquid crystal display device having high strength and being inexpensive, in which a liquid crystal display device can be manufactured using existing glass substrate manufacturing equipment. That is the task.
[0014]
[Means for Solving the Problems]
In order to solve the above problems, a method for manufacturing an electro-optical device according to the present invention includes, in a method for manufacturing an electro-optical device having a display element on a resin substrate, a step of forming the resin substrate on a substrate, A step of forming the display element on the resin base, and a step of removing the substrate by etching to leave the resin base and the display element.
[0015]
According to this manufacturing method, existing electro-optical device manufacturing equipment can be used, and an electro-optical device with a reduced thickness and reduced weight can be manufactured.
[0016]
Further, the display element is any one of a liquid crystal display element, a plasma display element, an organic electroluminescence display element, and an inorganic electroluminescence display element. This makes it possible to manufacture an electro-optical device in which a liquid crystal display element, a plasma display element, an organic EL display element, an inorganic EL display element, and the like are reduced in thickness and weight.
[0017]
In order to solve the above problems, a method for manufacturing an electro-optical device according to the present invention includes a method for manufacturing an electro-optical device having a resin base, wherein the resin base is provided on one or both of a first substrate and a second substrate. A step of forming, a step of bonding both the first substrate and the second substrate, each having the resin base material formed on one or both thereof, via a sealant, and a step of bonding the first substrate and the second substrate. Removing one of the resin base material formed or both of the resin base material formed by etching.
[0018]
According to this manufacturing method, it is possible to divert an existing manufacturing apparatus for an electro-optical device, and to manufacture an electro-optical device for a liquid crystal panel that is thinner and lighter.
[0019]
In order to solve the above-mentioned problems, a method of manufacturing an electro-optical device according to the present invention forms a large-sized panel structure including a plurality of electro-optical panel portions by bonding a first substrate base material and a second substrate base material to each other. A method of manufacturing an electro-optical device having a step and a break step of cutting the large-sized panel structure into individual electro-optical panels, wherein one or both of the first substrate base material and the second substrate base material are provided. Forming a resin base material on the first substrate base material and a second substrate base material having a resin base material formed on one or both of the first base material and the second base material via a sealing material; Removing one of the one substrate base material and the second substrate base material on which the resin base material is formed or both of the one substrate base material and the resin base material formed thereon by etching. .
[0020]
According to this manufacturing method, existing manufacturing equipment for electro-optical devices can be diverted, and further, electro-optical devices for a plurality of liquid crystal panels with a reduced thickness and reduced weight can be manufactured at a time.
[0021]
Further, in the step of removing by the etching, the etching is performed while protecting the electrode with a coating material so that at least a part of the electrode is not etched. Thereby, the glass substrate can be etched while protecting the electrode portions.
[0022]
Further, the step of removing by etching is after the step of bonding, and in the step of removing by etching, etching is performed while covering the periphery of the large-sized panel structure with the covering material. is there. This makes it possible to perform an etching process on the glass substrate while preventing an etching agent from entering the inside of the bonding.
[0023]
The step of removing by etching is after the break step, and in the step of removing by etching, at least a part of the electrode is covered with the covering material while being divided into the individual electro-optical panels. The etching is performed while performing the etching.
Thereby, the glass substrate can be removed by performing the etching process for each of the plurality of divided liquid crystal panels.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the contents of the present invention will be described in detail with reference to embodiments of the present invention, but the present invention is not limited thereto.
[0025]
[First Embodiment]
FIG. 1 is a process chart of a method for manufacturing an electro-optical device according to the present embodiment.
As shown in FIG. 1, in the method for manufacturing an electro-optical device according to the first embodiment, a resin base 12 is formed on a glass substrate 11 (FIG. 1B), and the formed resin base 12 is formed. The display element 13 is formed on the substrate (FIG. 1C), and then the glass substrate 11 is removed by etching (FIG. 1D) to manufacture an electro-optical device.
[0026]
In the present invention, a resin base material to be a future substrate is formed on a glass substrate, and the glass substrate is thereafter removed by etching. The process can be used as it is, eliminating the need for additional investment in manufacturing equipment.
[0027]
Further, since the resin substrate is supported on the glass substrate until the etching process, there is no deformation due to shrinkage or the like, and the screen has excellent flatness.
[0028]
Further, since a pressure-sensitive adhesive or an adhesive as in the case of using a conventional resin film is not used, it is possible to withstand heating at a high temperature, and there is no need to change working conditions in a film forming process. .
[0029]
Further, since an adhesive layer or an adhesive is not used as in the case of attaching a resin film to a glass substrate, there is no occurrence of process contamination or the like.
[0030]
Here, in the present invention, the display element formed on the glass substrate is not particularly limited, and examples thereof include a liquid crystal display element, a plasma display element, an organic electroluminescence display element, and an inorganic electroluminescence display element. it can. Hereinafter, the contents of the present invention will be described by taking a liquid crystal display device having a liquid crystal element as an example.
[0031]
[Second embodiment]
FIG. 2 is a perspective view of a liquid crystal display device which is an electro-optical device. FIG. 3 is a schematic sectional view of the liquid crystal display device. FIG. 4 is a process diagram of the liquid crystal display device. FIG. 5 is a configuration diagram of a liquid crystal panel using a large-sized glass substrate. FIG. 6 is a perspective view of a personal computer. FIG. 7 is a perspective view of a mobile phone.
[0032]
As shown in FIG. 2, the liquid crystal display device 50 includes a liquid crystal display panel 20, and a liquid crystal drive circuit board 40 on which a liquid crystal drive circuit including a driving IC and driving and displaying the liquid crystal display panel 20 is mounted. On the liquid crystal drive circuit board 40, semiconductor drive input terminals (not shown) are formed as a wiring pattern. Here, the liquid crystal display device is incorporated in various electronic devices such as a mobile phone, a telephone, a pager, an electronic organizer, and a personal computer, and is widely used as a display unit for displaying visible information. The liquid crystal display panel 20 is a simple matrix type driving liquid crystal display panel (so-called passive type liquid crystal panel), and forms a display surface for displaying visible information. The liquid crystal drive circuit board 40 has a drive IC connected to a board on which a connection circuit is printed, and is supported by a resin holder member 41 to maintain the overall strength.
[0033]
The liquid crystal drive circuit board 40 and the liquid crystal display panel 20 are connected via a connection terminal 42 included in the liquid crystal drive circuit board 40 and an electrode terminal group 23 heat seal 43 included in the liquid crystal display panel 20.
The liquid crystal display panel 20 has a first substrate 21 and a second substrate 22 which are arranged to face each other. Liquid crystal display elements are formed on the inner surfaces of the first substrate 21 and the second substrate 22, respectively.
[0034]
Specifically, as shown in FIG. 3, a reflection film (aluminum or the like) 24, a color filter (CF) 25, an overcoat (OVC) layer 26, a transparent electrode 27, and an alignment film 28 are formed on the first substrate 21. They are formed sequentially. On one second substrate 22, a transparent electrode 27 and an alignment film 28 are formed. The transparent electrode 27 is formed of ITO (Indium Tin Oxide) or another transparent electrode material, and has a predetermined pattern. As the alignment film 28, a film of, for example, polyimide (PI) is formed, and an alignment process (rubbing process) is performed.
[0035]
The first substrate 21 and the second substrate 22 are formed in a loop shape with a sealing material 61 in which conductive conductive particles 60 are dispersed around the inner periphery between the two substrates, and are sealed by a spacer 62 with a predetermined gap, a so-called cell gap. Is being worn.
[0036]
Then, as shown in FIG. 2, a liquid crystal (LC) sealing area 70 is defined between the first substrate 21 and the second substrate 22 by the sealing material 61.
The liquid crystal enclosing region 70 has a substantially rectangular liquid crystal enclosing portion 72 forming a main body of the liquid crystal enclosing space, and protrudes from the liquid crystal enclosing portion 72 toward the short sides of the first substrate 21 and the second substrate 22. A liquid crystal injection port 73 opened to the side is included. After injecting the liquid crystal from the liquid crystal injection port 73, the liquid crystal display device is completed by sealing with a sealing material (not shown).
[0037]
Next, a method for manufacturing the liquid crystal display device of the present embodiment will be described with reference to FIGS.
Here, in the present invention, the liquid crystal display element may be formed as a single product on a glass substrate, but may be formed once using large-size glass (also referred to as mother glass) with improved productivity as in recent years. Alternatively, a plurality of liquid crystal panels may be formed.
In the case of a large display device, one liquid crystal panel is obtained from one substrate base material.
[0038]
In this embodiment, as shown in FIG. 5, an example will be described in which a large number of liquid crystal panels are manufactured on a large-sized glass substrate base material (motherboard) at once. In this example, six liquid crystal panels can be obtained from one glass substrate.
[0039]
First, as shown in FIG. 4, a process of manufacturing a color filter substrate on the first substrate 21 side will be described.
1) A glass substrate 70 is prepared, and a process of forming a resin base material 71 to be the first substrate 21 is performed (S101).
Here, the resin substrate 71 is not particularly limited as long as it has a property of being a substrate of an optical display device. For example, polyether sulfone (PES), acrylic resin, polycarbonate, polyvinyl alcohol (PVA) ), Ethylene-vinyl acetate copolymer (EVA) and the like.
In addition, the coating method may be such that a thin film is uniformly formed on the glass substrate 70 by, for example, a spin coating method, a printing method, or the like.
[0040]
2) A step of forming the reflection film 24 on the resin substrate 71 is performed (S102).
3) A step of forming a color filter 25 on the reflection film 24 is performed (S103). 4) A step of forming an overcoat layer 26 on the color filter 25 for planarization is performed (S104).
5) A step of forming a transparent electrode (ITO) 27 on the overcoat layer 26 and processing the electrode is performed (S105).
6) A step of forming an alignment film 28 on the transparent electrode 27 is performed (S106).
7) A step of applying the sealing material 61 around the color filter substrate on which the alignment film 28 is formed is performed (S107).
[0041]
Next, a process of manufacturing an array substrate of the second substrate in parallel with the manufacturing of the color filter substrate will be described.
1) A glass substrate 70 is prepared, and a step of forming a resin base 71 to be the second substrate 22 is performed (S201).
2) A step of forming a transparent electrode (ITO) 27 on the resin substrate 71 and processing the electrode is performed (S202).
3) A step of forming an alignment film 28 on the transparent electrode 27 is performed (S203).
4) A step of applying a sealing material 61 around the array (opposite) substrate on which the alignment film 28 is formed (S204).
5) A step of spraying spacers 62 for keeping the gap between the electrodes constant is performed (S205).
[0042]
1) Next, the color filter substrate thus prepared and the array substrate are bonded to each other to perform a substrate assembling step, and as shown in FIG. 5A, a bonded substrate on which a plurality of liquid crystal panels 20 are formed. 80 is obtained (S301).
2) After that, a step of integrating the two by pressing and drying is performed (S302).
3) Next, as shown in FIG. 5B, a step of cutting the bonded substrate 80 in the X-axis direction and performing a primary break to form a strip-shaped substrate 81 is performed (S303).
4) Next, a step of injecting liquid crystal into the liquid crystal enclosing section 72 from the opening 73 and sealing with a sealing material is performed (S304).
5) Next, as shown in FIG. 5C, a step of cutting the strip-shaped substrate 81 in the Y-axis direction and performing a secondary break to form a single liquid crystal panel 20 is performed (S305).
6) A step of covering the electrode terminal portions 23, which are electrode portions of the single panel, with a protective member, and thereafter performing an etching process to completely remove the glass substrate 70 (S306).
This etching treatment may be performed by removing the glass substrate 70 by a known method. At this time, the electrode may be protected by a covering material such as a resist so that the electrode is not affected by the etching process.
7) After that, an inspection process is performed to obtain a liquid crystal panel product (S307).
[0043]
The liquid crystal panel thus obtained can be used as it is on a conventional liquid crystal panel production line using a conventional glass substrate, so that a liquid crystal panel made of a thin resin substrate is provided without reducing production efficiency. be able to.
[0044]
In the present embodiment, the above-described etching processing is performed when the single processing is performed after the secondary break is performed, but the present invention is not limited to this. For example, after the pressing and drying step (S302) performed after the substrate assembling step of bonding the substrates, an etching process may be performed to remove the glass substrate.
At this time, the entire periphery of the bonded substrates may be covered with a covering material to prevent the etching agent from entering the inside.
[0045]
Here, an etching method for removing the glass substrate will be described.
As an etching agent, a hydrofluoric acid-based chemical can be suitably used. For example, an etching agent such as a hydrofluoric acid solution, a fluorinated sulfuric acid solution, hydrofluoric acid, ammonium fluoride, or hydrofluoric acid can be suitably used. Further, an aqueous solution containing them can also be used. For example, a mixed aqueous solution of hydrofluoric acid and nitric acid, a mixed aqueous solution of hydrofluoric acid and ammonium fluoride, a mixed aqueous solution of hydrofluoric acid, ammonium fluoride, and nitric acid, an aqueous solution of hydrofluoric acid and ammonium hydrogen difluoride, An aqueous solution of hydrofluoric acid, ammonium hydrogen difluoride, and nitric acid can be used. Although the etching rate is low, a strongly alkaline chemical such as caustic soda (NaOH) or potassium hydroxide (KOH) can also be used.
[0046]
As an etching method, wet etching using an etching agent as described above, which is a general glass etching method, is preferable, but a dry etching method using an etching gas can also be used.
[0047]
In addition, the raw material of the glass substrate constituting the liquid crystal panel is not particularly limited, and various glasses such as soda lime glass, borosilicate glass, and alkali-free glass can be used.
[0048]
Examples of a method of coating the electrode when performing the etching treatment include a method using a chemical resistant material having resistance to a chemical solution used as an etching agent, and a method of applying a positive resist or a negative resist.
[0049]
Examples of the chemical resistant material include a method of applying a wax or oily coating, attaching a chemical resistant tape, and covering a portion to be masked with a putty or a viscous material. This method is particularly effective in an etching process performed on a large panel substrate.
[0050]
Further, as a method of applying a resist, there is a method of dipping (dipping) or spraying a resist in a masked portion into the resist, applying the resist, and then exposing and developing to form a desired mask pattern. Further, a resist may be applied to the masked portion using a brush or a brush. In this case, the equipment used for resist coating can be inexpensive. There is also a method of applying a resist to a desired mask pattern by discharging a droplet material from a nozzle (a so-called inkjet method).
[0051]
On the other hand, the method of removing the coating thus formed basically differs for each coating formation method. When a photoresist is used, the resist may be removed by dissolving the resist using a predetermined chemical solution. In the case of wax or oil-based coating, the coating can be removed by dissolving the coating with a chemical solution. When a chemical resistant tape, putty, or the like is used, they may simply be peeled off.
[0052]
In the liquid crystal panel 20 from which the glass substrate has been removed by this etching treatment, the thin resin base material constitutes the first substrate 21 and the second substrate 22, and when the product is used, the substrate is made thinner. A liquid crystal display device is provided.
[0053]
Therefore, the difficulty in handling in a liquid crystal panel manufacturing line as in the case of a conventional thin film film alone is also solved.
[0054]
Further, in the manufacturing process of the liquid crystal panel, the glass substrate 70 supports the resin base material 71, so that there is no elongation or the like even in the case of processing at a high temperature by sputtering or the like. Obtainable.
[0055]
Therefore, it is possible to provide a liquid crystal panel having the same accuracy as that using a conventional glass substrate, and to provide a panel with a reduced thickness.
[0056]
In the present invention, the thickness of the resin base material is not particularly limited, but can be 0.5 mm or less, and 0.2 mm or less when further reducing the thickness. In this case, the first and second substrates can be 0.09 mm. In particular, by reducing the film thickness, the weight of the product can be reduced.
[0057]
In the etching treatment, it is preferable to recycle the collected glass substrate material again and use it for manufacturing a liquid crystal panel, thereby saving resources.
[0058]
In the case where a reflection plate is provided outside the substrate by reducing the thickness of the resin base material, transmission loss in the substrate can be reduced and contrast can be improved, which is preferable.
[0059]
Further, in the present embodiment, the first substrate and the second substrate are both made of a resin substrate, but the present invention is not limited to this, and only the first substrate 21 side or only the second substrate 22 side is made of a resin substrate. You may make it.
In particular, it is preferable that the first substrate 21 side is made of a resin base material, since cracks of a substrate such as a mobile phone can be prevented. That is, while the mobile phone is in use, unexpected excessive stress may be applied from the observation side. However, by using the first substrate 21 having the reflective film as a resin base material, the observer side It can withstand tensile stress more than a glass substrate, and can prevent cracks and cracks.
[0060]
It is preferable that the glass substrate has the thickness used in the existing production equipment without changing the line equipment. Suitable glass substrate thicknesses are 0.7 mm, 0.5 mm, and 0.4 mm.
[0061]
Further, by reducing the thickness of the glass substrate, etching time and etching chemicals can be reduced, which is preferable.
[0062]
Next, a specific example of an electronic device to which the liquid crystal display panel according to the present invention can be applied will be described with reference to FIG.
[0063]
First, an example in which the liquid crystal display panel according to the present invention is applied to a display unit of a portable personal computer (so-called notebook computer) will be described. FIG. 6 is a perspective view showing the configuration of the personal computer. As shown in the figure, the personal computer 91 includes a main body 912 having a keyboard 911, and a display 913 to which the liquid crystal display panel according to the present invention is applied.
[0064]
Subsequently, an example in which the liquid crystal display panel according to the present invention is applied to a display unit of a mobile phone will be described. FIG. 7 is a perspective view showing the configuration of the mobile phone.
As shown in the drawing, the mobile phone 92 includes a plurality of operation buttons 921, a receiver 922, a transmitter 923, and a display unit 924 to which the liquid crystal display panel according to the present invention is applied.
[0065]
Electronic devices to which the liquid crystal display panel according to the present invention can be applied include, in addition to the personal computer shown in FIG. 6 and the mobile phone shown in FIG. 7, a liquid crystal television, a viewfinder type and a monitor direct view type video. Examples include, but are not limited to, tape recorders, car navigation devices, pagers, electronic organizers, calculators, word processors, workstations, videophones, POS terminals, digital still cameras, and the like.
[0066]
Further, in the above-described embodiment, the case where the present invention is applied to a liquid crystal device as an electro-optical device has been described. However, the present invention is not limited to this. , Plasma display device, FED (field emission display) device, LED (light emitting diode) display device, electrophoretic display device, thin TV, thin television using liquid crystal shutter, etc., device using digital micromirror device (DMD) And other various electro-optical devices.
[Brief description of the drawings]
FIG. 1 is a process chart of a first embodiment.
FIG. 2 is a perspective view of a liquid crystal display device that is an electro-optical device.
FIG. 3 is a schematic sectional view of a liquid crystal display device.
FIG. 4 is a process drawing of the liquid crystal display device.
FIG. 5 is a configuration diagram of a liquid crystal panel when a large-sized glass substrate is used.
FIG. 6 is a perspective view of a personal computer.
FIG. 7 is a perspective view of a mobile phone.
[Explanation of symbols]
11: glass substrate, 12: resin substrate, 13: display element, 50: liquid crystal display device, 20: liquid crystal display panel, 21: first substrate, 22 ... 2nd substrate, 23 ... electrode terminal group, 24 reflection film (aluminum etc.), 25 ... color filter (CF), 26 ... overcoat (OVC) layer, 27 ... transparent electrode, 28 ... ..Alignment film, 40 ... Liquid crystal drive circuit board, 41 ... Holder member, 42 ... Connection terminal, 43 ... Heat seal, 60 ... Electric particles, 61 ... Seal material, 62 ... spacer, 70 ... liquid crystal (LC) sealing area, 72 rectangular liquid crystal sealing part, 73 ... liquid crystal injection port

Claims (7)

In a method of manufacturing an electro-optical device having a display element on a resin base material,
Forming the resin substrate on a substrate,
Forming the display element on the resin substrate,
Removing the substrate by etching to leave the resin substrate and the display element,
A method for manufacturing an electro-optical device, comprising: In claim 1,
A method of manufacturing an electro-optical device, wherein the display element is any one of a liquid crystal display element, a plasma display element, an organic electroluminescence display element, and an inorganic electroluminescence display element. In a method for manufacturing an electro-optical device having a resin base material,
Forming the resin substrate on one or both of the first substrate and the second substrate; and sealing the first substrate and the second substrate having the resin substrate formed on one or both of them with a sealing material. Laminating through
A step of removing one of the first substrate and the second substrate on which the resin substrate is formed or both of the resin substrate on which the resin substrate is formed, and
A method for manufacturing an electro-optical device, comprising: Bonding a first substrate preform and a second substrate preform together to form a large panel structure including a plurality of electro-optical panel portions;
In the method of manufacturing an electro-optical device having a break step of cutting the large-sized panel structure and dividing the panel into individual electro-optical panels,
Forming a resin base material on one or both of the first substrate base material and the second substrate base material;
A step of bonding both the first substrate base material and the second substrate base material having the resin base material formed on one or both thereof via a sealing material,
Removing, by etching, one of the first substrate base material and the second substrate base material on which the resin substrate is formed or both of the resin substrate formed thereon;
A method for manufacturing an electro-optical device, comprising: In claim 3 or 4,
Further comprising a step of forming an electrode on the resin substrate,
The method of manufacturing an electro-optical device, wherein in the step of removing by etching, etching is performed while protecting at least a part of the electrode with a covering material so as not to be etched. In claim 5,
The step of removing by etching is after the step of bonding,
The method of manufacturing an electro-optical device, wherein in the step of removing by etching, etching is performed while covering a periphery of the large-sized panel structure with the covering material. In claim 5,
The step of removing by etching is after the break step,
The method of manufacturing an electro-optical device, wherein in the step of removing by the etching, etching is performed while covering at least a part of the electrode with the coating material in a state of being divided into the individual electro-optical panels.

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