JP2004151393A - Optical component module, optical isolator and semiconductor laser module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the generation of a crack and a deviation of the optical axis in a group of elements 13 for optical isolator, when a joining material 14 with which the group of elements for optical isolator 13 is fused onto a base substrate composed of a concave form at a high temperature is directly joined. <P>SOLUTION: An optical component module Y having a flat base substrate 5 and optical components 6 and 13, forming a concave part 15 with bottom on the base substrate 5, and composed by joining optical components 6 and 13 on the bottom of the concave part 15 via the joining material 14, is characterized by forming a space in which the joining material 14 does not exist between the side face of the optical components 6 and 13 and the side wall of the concave part 15 of the base substrate 5. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical component module, an optical isolator, and a semiconductor laser module mainly used for optical communication.
[0002]
[Prior art]
At present, an optical communication system using an optical fiber is rapidly developing in place of the conventional telecommunication system. As a light source of the optical communication system, a semiconductor laser is mainly used, and a semiconductor laser module for guiding light emitted from the semiconductor laser to an end face of an optical fiber via a condensing means such as a lens is widely used. In this semiconductor laser module, in order to stabilize the operation of the semiconductor laser, an optical isolator as an optical component module is disposed between the semiconductor laser and the optical fiber, in addition to the lens.
[0003]
This optical isolator is used to prevent reflected light from the connection end of the optical fiber or the light receiving surface from returning to the semiconductor laser, and to prevent the oscillation of the semiconductor laser from being disturbed and becoming noise.
[0004]
A conventional optical isolator will be described with reference to FIGS. FIG. 4 is a vertical cross-sectional view showing the semiconductor laser module 10X having the optical isolator 300, and FIG. 5 is an exploded perspective view of the cross section taken along line BB 'of FIG.
[0005]
The semiconductor laser module 10X includes a semiconductor laser 100, a lens 600 as an optical component, and an optical isolator 300 in a package 200. An optical fiber end 700 is attached to a side wall of the package 200.
[0006]
The optical isolator 300 includes a polarizer 100, a Faraday rotator 110, and an optical isolator element group 130 of an analyzer 120. The transmission polarization planes of the polarizer 100 and the analyzer 120 are preset so that rotation alignment is unnecessary. Have been. As disclosed in Patent Document 1, a magnet 900 is formed in an arch shape so as to cover the periphery of the optical isolator element group 130, and is configured to apply a magnetic field to the Faraday rotator 110.
[0007]
Since the optical isolator 300 and the lens 600 are conventionally very brittle and easily damaged, the optical isolator element group 130 is once mounted on the base substrate 500 without being directly mounted on the bottom surface of the package 600 as shown in FIG. Was joined to. That is, the bottomed concave portion 150 in which the lens 600 and the optical isolator element group 130 can be sequentially mounted on the emission light side of the semiconductor laser 100 on the base substrate 500 is larger than the size of the lens 600 and the optical isolator element group 130. The lens 600 and the optical isolator element group 130 are slightly wider and have a depth such that the optical axis of the semiconductor laser 100 and the optical axis of the lens 600 and the optical isolator element group 130 coincide with each other. It was fixed to the bottom of the recess 150 via a bonding material 140 such as solder. This not only provides protection when the lens 600 and the optical isolator element group 130 are attached, but also enables downsizing and cost reduction. The semiconductor laser 100 is mounted and fixed on a base substrate 500, and the base substrate 500 is fixed on a bottom plate 200a in a package 200 made of metal or ceramic by soldering or the like.
[0008]
Then, the light emitted from the semiconductor laser 100 is focused on the end face of the optical fiber end 700 by the lens 600. At this time, the optical isolator 300 is configured to suppress the reflected return light to the semiconductor laser 100.
[Patent Document 1]
JP 2001-120043 A
[Problems to be solved by the invention]
However, in the semiconductor laser module 10X using the conventional optical isolator 300 shown in FIGS. 4 and 5, when the optical isolator element group 130 and the lens 600 are fixed to the bottom surface of the concave portion 150 of the base substrate 500 by the bonding material 140, the concave portion 150 The bonding material 140 becomes a fluid at the time of thermosetting because the side wall of the optical isolator element group 130 and the lens 600 are close to each other. It crawls up and hardens, and the joining material 140 is interposed.
Therefore, since the thickness varies depending on the crawling-up portion, when cured, for example, the concave portion 150 of the base substrate 500 is temporarily fixed by a positioning jig (not shown), and the optical isolator element group 130 is positioned to position the optical axis. Even if an attempt is made to adjust the position, the position is shifted by an amount corresponding to the thickness of the cured bonding material 140, and the position of the optical axis adjustment position is shifted.
Also, due to the difference in the coefficient of thermal expansion from the base substrate 500 at the time of curing, the optical surface of the optical isolator element group 130 and the lens 600 is pulled by the base substrate 500, causing the stress concentration on the optical isolator element group 130 and the lens 600. It was.
[0010]
Accordingly, when glass or solder is used as the bonding material 140, processing is performed at an extremely high temperature, and cracks may occur due to residual stress generated during cooling.
This residual stress is present inside the product at room temperature and is hard to find, but a thermal shock test for evaluating the residual stress adds thermal stress to the residual stress, and as a result, cracks can be confirmed.
Accordingly, not only the bonding strength between the base substrate 500 and the optical isolator element group 130 or the lens 600 is reduced, but also the residual stress causing cracks is required to maintain the characteristics of the optical isolator element group 130 or the lens 600. Had to be kept as small as possible.
[0011]
Also, it is assumed that the semiconductor laser module 10X having the optical isolator 300 on the base substrate 500 is manufactured under the problem of the deviation of the optical axis adjustment position of the optical isolator element group 130 and the lens 600 and the problem of the crack. However, since the function of the optical isolator 300 cannot be sufficiently exhibited, there is also a problem that reflected light from the optical fiber connection end or the light receiving surface returns to the semiconductor laser 100, and the oscillation of the semiconductor laser 100 is disturbed to generate noise. Was.
[0012]
The present invention has been made in view of the above points, and an object of the present invention is to provide an optical axis that can easily adjust an optical axis and has a very small number of cracks even under a severe thermal shock test environment and can obtain a sufficient bonding strength. The purpose is to provide a component module.
[0013]
Another object of the present invention is to provide an optical isolator capable of sufficiently exhibiting characteristics of blocking return light from a connection end of an optical fiber or a light receiving surface.
[0014]
Still another object of the present invention is to provide a semiconductor laser module capable of obtaining good characteristics such as the oscillation of a semiconductor laser as a light source not being disturbed when an optical component such as an optical isolator is used. Is to do.
[0015]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention has a flat base substrate and an optical component that transmits or receives light, and forms a bottomed recess on the base substrate, and has a bottom surface on the bottom surface of the recess. In the optical component module formed by bonding the optical components via a bonding material, a space where the bonding material does not exist is formed between a side surface of the optical component and a side wall of the concave portion of the base substrate. To provide an optical component module.
[0016]
In this case, a positioning member for performing positioning by contacting the outer peripheral portion of the optical component may be arranged around the opening of the concave portion. The bonding material may be low-melting glass or gold-tin solder.
[0017]
Further, the present invention includes a flat base substrate, an optical component including a Faraday rotator, a polarizer, and / or an analyzer, and a magnet that applies a magnetic field to the Faraday rotator. In the optical isolator formed with the bottomed concave portion and bonding the optical component to the bottom surface of the concave portion via a bonding material, between the side surface of the optical component and the side wall of the concave portion of the base substrate, An optical isolator characterized by forming a space in which no bonding material is present.
[0018]
In this case, the magnet may be arranged around the opening of the concave portion of the base substrate, and may be positioned by contacting the outer peripheral portion of the optical component. Note that the bonding material may be low-melting glass or gold-tin solder.
[0019]
Further, the present invention comprises a flat base substrate, a semiconductor laser mounted on the base substrate, and an optical component that transmits or receives light, and the light is emitted from the semiconductor laser on the base substrate. A semiconductor laser having a bottomed recess formed so that the optical axis of the semiconductor laser coincides with the optical axis of the optical component, and the optical component being joined to the bottom surface of the recess via a bonding material; In the module, there is provided a semiconductor laser module, wherein a space in which the bonding material does not exist is formed between a side surface of the optical component and a side wall of a concave portion of the base substrate.
[0020]
Further, a flat base substrate, a semiconductor laser mounted on the base substrate, an optical component including a Faraday rotator, a polarizer and / or an analyzer, and a magnet for applying a magnetic field to the Faraday rotator. And forming a bottomed recess formed on the base substrate on the emission light side of the semiconductor laser so that the optical axis of the semiconductor laser and the optical axis of the optical component coincide with each other, and at the bottom of the recess. In the semiconductor laser module in which the optical component is bonded via a bonding material, a space where the bonding material does not exist is formed between a side surface of the optical component and a side wall of a concave portion of the base substrate. To provide a semiconductor laser module.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a longitudinal sectional view of a semiconductor laser module X having an optical component module of the present invention, and FIGS. 2A and 2B are diagrams for explaining an optical isolator 3 which is an example of the optical component module Y. FIG. 2 is an exploded perspective view taken along the line AA ′ in FIG. 1.
In a laser light source device X of the present invention, a semiconductor laser 1 and an optical component module Y are arranged on a base substrate 5, and these are housed in a package 2.
[0022]
The semiconductor laser 1 may be directly bonded to the base substrate 5 or may be bonded via a heat radiating member such as a heat sink.
[0023]
As the optical component module Y, a lens 6 as an optical component and an optical isolator 3 are joined on a base substrate 5. This optical component is not limited to the lens 6 and the optical isolator 3, but includes a prism for splitting light, a filter for selecting a signal wavelength, and optical glass (quartz glass, borosilicate crown glass such as BK7 (trade name of Schott)); (A material obtained by adding an optical characteristic film to a single crystal glass such as quartz) may be used.
[0024]
As the optical characteristics of the optical component, those having various functions such as wavelength selection, spectral distribution, optical axis shift, and lens function may be used. There are various shapes such as a cube, a rectangular parallelepiped, a cylinder, a triangular prism, and a sphere.
[0025]
The lens 6 used in the present invention has a function of condensing the light of the optical element 1 on the end face of the optical fiber end 7.
[0026]
The optical isolator 3 includes an optical isolator element group 13 and a magnet 9. The optical isolator element group 13 includes a polarizer 10 having a flat bottom surface, a Faraday rotator 11, and an analyzer 12, which are sequentially provided from the emission side of the semiconductor laser 1, and is formed in parallel with the polarizer 10. The transmission polarization plane of the photon 12 is set in advance so that rotation alignment is not required. By making the optical isolator 3 into a prismatic shape, it is easy to hold the optical isolator 3 when mounting the optical isolator 3 on the base substrate 5, and it is also easy to join the optical isolator 3 with an automatic machine.
[0027]
The magnet 5 is formed in an arch shape so as to cover the optical isolator element group 13, is configured to apply a magnetic field to the Faraday rotator 11, and is disposed around the opening of the concave portion 15 of the base substrate 5.
[0028]
The base substrate 5 has a bottomed concave portion 15 on which the lens 6 and the isolator element group 13 can be sequentially mounted on the emission light side of the semiconductor laser 1. The concave portion 15 is formed to have a depth such that the optical axis of the semiconductor laser 1 and the optical axis of each of the lens 6 and the optical isolator element group 13 coincide with each other. The bottom surface of the concave portion 15 is formed to be wider than the size of the lens 6 and the optical isolator element group 13. When the lens 6 and the optical isolator element group 13 are bonded to the bottom surface of the concave portion 15 by the bonding material 14, the lens A space in which no bonding material is formed is formed between the side surface of the optical isolator element 6 and the side surface of the optical isolator element 13 and the side wall of the concave portion 15, and has a sufficiently larger area than the bottom surface of the lens 6 and the optical isolator element group 13. are doing. Here, the side surfaces of the lens 6 and the optical isolator element group 13 are all surfaces facing the side wall of the concave portion 15.
[0029]
The positioning for adjusting the optical axis of the optical component may be performed such that the magnet 9 is brought into contact with the outer peripheral portion of the optical isolator element group 13 to perform the positioning. The abutting position may be any portion other than the portion through which light passes, that is, any portion as long as it is the outer peripheral portion. In this case, the periphery of the opening of the recess 15 and the joining surface of the magnet 9 are machined with a predetermined accuracy. Therefore, even if the optical isolator element group 13 is freely joined to the bottom surface of the concave portion 15 via the joining material 14, the positional accuracy of the optical isolator element group 13 can be improved by abutting the magnet.
[0030]
Further, the present invention is not limited to this. After applying the bonding material 14 to the bottom surface of the concave portion 15 of the base substrate 5, the fixing material is temporarily fixed by a positioning jig (not shown) and then cured, so that the lens 6 and the optical isolator element group 13 are formed. May be positioned.
[0031]
Further, as shown in FIG. 3, a positioning member 16 for positioning by contacting the outer periphery of the lens 6 and the optical isolator element group 13 may be arranged around the opening of the recess 15. In this case, the portion where the positioning member 16 of the lens 6 and the optical isolator element group 13 comes into contact may be any portion as long as it is an outer peripheral portion, that is, a portion excluding a portion through which light is transmitted. As shown in FIG. 3, since the positioning member 16 is disposed around the opening which is one step higher than the bottom surface of the concave portion 15 to which the bonding material 14 is applied, the bonding between the lens 6, the optical isolator element group 13 and the positioning member 16 is performed. This is because the material 14 can perform a sufficient positioning function without climbing up.
[0032]
At the time of positioning, the lens 6 and the optical isolator element group 13 are pressed and fixed via the bonding material 14 on the bottom surface of the concave portion 15 while the positioning member 16 is in contact with the outer periphery thereof. Pressure can be applied to the lens 6 and the optical isolator element group 13 using the member 16 as a reference, and the mounting position accuracy can be easily improved.
[0033]
As a material of the base substrate 5, a copper tungsten material used as a heat sink of the semiconductor laser 1, 50Ni-Fe, or the like is used in addition to a silicon material.
[0034]
The base substrate 5 is made of a material that reduces the difference in thermal expansion coefficient between the lens 6, the optical isolator element group 13, and the bonding material 4.
[0035]
The package 2 is formed in a housing shape, and is made of metal or ceramic as its material. An optical fiber end 7 is fitted into and bonded to the side wall of the package 2 in the through hole.
[0036]
As a material of the bonding material 14, an adhesive, a low-melting glass, a solder, or the like is used. In the case of the adhesive, the resin component is generated as a corrosive gas, and the optical output of the semiconductor laser 1 is deteriorated, and the optical axis adjustment position of the optical element such as the lens 6 is shifted due to the influence of the temperature and humidity environment. Therefore, solder or low melting point glass is preferable.
There are two types of low-melting glass used in the case of glass bonding: a crystallized type and an amorphous type. The crystallized type has a longer sealing time due to crystal growth. Can be shortened and handling is easy. Further, since metalization and the like are not required, it is suitable for cost reduction.
The types of solder used for solder bonding include lead-tin solder, gold-tin solder, and silver-tin solder. In particular, in order to obtain high reliability required for optical communication applications, it is preferable to use gold tin solder having a high melting point.
[0037]
By using these materials, even if the bonding material 14 whose working temperature is 300 ° C. or higher is used, after the bonding material 14 is melted, the glass 6 and the side surfaces of the optical isolator element group 13 and the concave portions of the base substrate 5 are recessed. There is no creeping up of the bonding material 14 between the side walls of the base 15 and no cracks due to residual stress generated during cooling due to a difference in thermal expansion coefficient from the base substrate 5 at the time of curing do not occur.
[0038]
【Example】
Hereinafter, a semiconductor laser module X shown in FIG. 1 was manufactured as an experimental example of the present invention. In FIG. 1, a semiconductor laser 1 is mounted and fixed on a base substrate 5 made of silicon by gold-tin solder. A concave portion 15 in which the lens 6 and the optical isolator element group 13 are mounted is formed in the base substrate 5, and the lens 6 and the optical isolator element group 13 are mounted and fixed in the concave portion 15 by a bonding material 14 made of low melting point glass. did. In this case, the mounting positions of the lens 6 and the optical isolator element group 13 were set using a positioning jig (not shown) in order to match the optical axis of the optical element 1.
[0039]
In FIGS. 2A and 2B, the optical isolator element group 13 includes a rectangular polarizer 10, a Faraday rotator 11, and an analyzer 12 having the same shape and a flat bottom. The size was such that the polarizer 10 and the analyzer 12 were vertical × horizontal × thickness = 1 × 1 × 0.2 mm, and the Faraday rotator 11 was vertical × horizontal × thickness = 1 × 1 × 0.5 mm. In addition, the transmission polarization planes of the polarizer 10 and the analyzer 12 are set in advance when cutting into a square shape so that rotation alignment is unnecessary.
As the size of the lens 6, a condensing system aspheric lens having a length, width, and thickness of 1.5 × 1.5 × 1 mm was employed.
[0040]
The depth of the concave portion 15 on the base substrate 5 is set to 0.45 mm where the optical axis of the semiconductor laser 1 and the optical axis of the optical isolator element group 13 coincide with each other. but not to non-contact and close proximity to the side wall of the recess 15 which forms a concave shape, and a ² × 2.5 = 5mm 2 sufficiently larger than the bottom area 0.9 × 1 = 0.9mm ² of the optical isolator element group 13. Thus, when the bonding material 14 was hardened, it was hardened so that a space in which the bonding material 15 did not exist was formed between the side surface of the optical isolator element group 13 and the side wall of the concave portion 15 of the base substrate 5.
[0041]
Bottom area also recess 15 for accommodating the lens 6 is set to 1.5 × 1 = sufficiently larger than ^{1.5mm 2 2.5 × 2.5 = 6.25mm 2} .
[0042]
Next, the optical isolator 3 was formed by soldering around the concave opening of the base substrate 5 so as to cover the optical isolator element group 13 with the arc-shaped magnet 9.
[0043]
Further, the base substrate 5 formed as described above is housed and fixed in the package 2 made of ceramic by soldering, and the end face of the optical fiber end 7 is moved to a position where the light of the semiconductor laser 1 is condensed by the lens 6. The semiconductor laser module X was completed by axially aligning and fixing the package 2 by YAG laser welding and sealing the opening.
[0044]
Incidentally, the side surface of the bottom area 0.9 × 1 = 0.9mm 1 ² slightly larger than × 1.1 = 1.1 mm ² as an optical isolator element group 3 bottom of the optical isolator element group of the recess 15 as a comparative example A semiconductor laser module X having the same configuration as that of the experimental example was manufactured except that the bonding material 14 was interposed by creeping up and bonded to the side wall of the concave portion 15 of the base substrate 5.
[0045]
Ten semiconductor laser modules X of the experimental example and the comparative example were manufactured, and the noise of the semiconductor laser 1 was examined. As a reference for the noise, the relationship (slope) between the light output of the semiconductor laser 1 and the current was represented by differential characteristics, and the maximum change amount of the light output was compared.
[0046]
As a result of this experiment, it has been found that when the bonding material 14 creeps up on the side surface of the optical isolator element group 13 as in the comparative example, the amount of change in optical output increases by about 10% due to noise. When the semiconductor laser module X of the comparative example was disassembled and the crack occurrence rate of the optical isolator element group 13 was examined, cracks were found in all of them.
[0047]
On the other hand, the semiconductor laser module X of the experimental example was free of noise and had good differential characteristics of light output and current. When the semiconductor laser module X was disassembled and the crack generation rate was examined, it was 0%.
[0048]
【The invention's effect】
According to the configuration of the present invention, it has a flat base substrate and an optical component that transmits or receives light, forms a bottomed recess on the base substrate, and attaches a bonding material to the bottom surface of the recess. In the optical component module in which the optical component is joined through a gap, a space in which the joining material does not exist is formed between the side surface of the optical component and the side wall of the concave portion of the base substrate. A highly reliable optical component module that does not cause the optical axis to shift due to the difference in thermal expansion coefficient from the base substrate to the base substrate and the optical component to be free from cracks due to residual stress generated during cooling. Can be provided.
[0049]
In this case, a sufficient distance can be formed between the bottom surface of the concave portion and the periphery of the concave portion by using a positioning member that contacts the outer peripheral portion of the optical component for positioning around the concave portion opening, and is applied to the concave bottom surface. The bonding material does not crawl up to the positioning member. Therefore, it is possible to accurately and accurately determine the position regardless of the bonding state of the bottom surface.
[0050]
Further, the present invention includes a flat base substrate, an optical component including a Faraday rotator, a polarizer, and / or an analyzer, and a magnet that applies a magnetic field to the Faraday rotator. In the optical isolator formed with the bottomed concave portion and bonding the optical component to the bottom surface of the concave portion via a bonding material, between the side surface of the optical component and the side wall of the concave portion of the base substrate, By forming a space in which no bonding material is formed, it is possible to easily manufacture the optical isolator, and it is possible to provide a highly reliable and low-priced optical isolator which does not shift the optical axis or cause cracks.
[0051]
In this case, the magnet is arranged around the opening of the concave portion of the base substrate, and is positioned in contact with the outer peripheral portion of the optical component, thereby providing an optical isolator that can save space and reduce manufacturing cost. be able to.
[0052]
Further, the present invention includes a flat base substrate, a semiconductor laser mounted on the base substrate, and an optical component that transmits or receives light, and a semiconductor is provided on the base substrate on the emission light side of the semiconductor laser. A semiconductor laser module in which a bottomed recess formed so that an optical axis of a laser coincides with an optical axis of the optical component and the optical component is bonded to a bottom surface of the recess via a bonding material. Since a space in which the bonding material does not exist is formed between the side surface of the optical component and the side wall of the concave portion of the base substrate, it is possible to provide a semiconductor laser module capable of providing good light output.
[0053]
Similarly, a flat base substrate, a semiconductor laser mounted on the base substrate, an optical component including a Faraday rotator, a polarizer and / or an analyzer, and a magnetic field are applied to the Faraday rotator. And a bottomed recess formed on the base substrate on the emission light side of the semiconductor laser so that the optical axis of the semiconductor laser coincides with the optical axis of the optical component. In the semiconductor laser in which the optical component is bonded to the bottom surface of the semiconductor laser via a bonding material, a space where the bonding material does not exist is formed between the side surface of the optical component and the side wall of the concave portion of the base substrate. In addition, it is possible to provide a good semiconductor laser module which does not generate return light due to displacement of the optical axis and does not cause oscillation failure of the semiconductor laser.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a laser light source device of the present invention.
FIGS. 2A and 2B are views for explaining an optical isolator which is an example of an optical component module, and are exploded perspective views as viewed from a cross-sectional side along AA ′ in FIG.
FIG. 3 is a perspective view illustrating a part of the optical component module of the present invention in the case where an optical component positioning member is provided.
FIG. 4 is a longitudinal sectional view of a conventional laser light source device.
FIG. 5 is an exploded perspective view seen from a cross-sectional side taken along line BB ′ of FIG. 4;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Optical element 2 ... Package 3 ... Optical isolator 5 ... Base substrate 6 ... Lens 7 ... Optical fiber end 9 ... Magnet 10 ... Polarizer 11 ... Faraday rotator 12 ... Analyzer 13 ... Optical isolator 14 ... Bonding material 15 ... Recess 16: Positioning member

Claims (6)

It has a flat base substrate and an optical component that transmits or receives light, forms a bottomed recess on the base substrate, and joins the optical component to the bottom surface of the recess via a bonding material. Optical component module
An optical component module, wherein a space in which the bonding material does not exist is formed between a side surface of the optical component and a side wall of a concave portion of the base substrate. 2. The optical component module according to claim 1, wherein a positioning member for positioning by contacting an outer peripheral portion of the optical component is arranged around an opening of the concave portion. A flat base substrate, an optical component comprising a Faraday rotator, a polarizer and / or an analyzer, and a magnet for applying a magnetic field to the Faraday rotator, forming a bottomed recess on the base substrate And an optical isolator formed by bonding the optical component to the bottom surface of the concave portion via a bonding material,
An optical isolator, wherein a space in which the bonding material does not exist is formed between a side surface of the optical component and a side wall of a concave portion of the base substrate. The optical isolator according to claim 3, wherein the magnet is disposed around an opening of a concave portion of the base substrate, and is positioned by contacting an outer peripheral portion of the optical component. A flat base substrate, a semiconductor laser mounted on the base substrate, and an optical component for transmitting or receiving light; and an optical axis of the semiconductor laser on the base substrate on an emission light side of the semiconductor laser. And a concave portion with a bottom formed so that the optical axis of the optical component coincides with the optical component, and a semiconductor laser module in which the optical component is bonded to the bottom surface of the concave portion via a bonding material,
A semiconductor laser module, wherein a space in which the bonding material does not exist is formed between a side surface of the optical component and a side wall of a concave portion of the base substrate. A flat base substrate, a semiconductor laser mounted on the base substrate, an optical component including a Faraday rotator, a polarizer and / or an analyzer, and a magnet for applying a magnetic field to the Faraday rotator, Forming a bottomed recess formed on the base substrate on the emission light side of the semiconductor laser so that an optical axis of the semiconductor laser and an optical axis of the optical component coincide with each other, and a bonding material is provided on a bottom surface of the recess. A semiconductor laser module in which the optical components are joined via
A semiconductor laser module, wherein a space in which the bonding material does not exist is formed between a side surface of the optical component and a side wall of a concave portion of the base substrate.

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