JP2004150736A5 - - Google Patents

Download PDF

Info

Publication number
JP2004150736A5
JP2004150736A5 JP2002317798A JP2002317798A JP2004150736A5 JP 2004150736 A5 JP2004150736 A5 JP 2004150736A5 JP 2002317798 A JP2002317798 A JP 2002317798A JP 2002317798 A JP2002317798 A JP 2002317798A JP 2004150736 A5 JP2004150736 A5 JP 2004150736A5
Authority
JP
Japan
Prior art keywords
cooling
pdp
substrate
cooling member
air supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002317798A
Other languages
Japanese (ja)
Other versions
JP3899305B2 (en
JP2004150736A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002317798A priority Critical patent/JP3899305B2/en
Priority claimed from JP2002317798A external-priority patent/JP3899305B2/en
Publication of JP2004150736A publication Critical patent/JP2004150736A/en
Publication of JP2004150736A5 publication Critical patent/JP2004150736A5/ja
Application granted granted Critical
Publication of JP3899305B2 publication Critical patent/JP3899305B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (7)

PDP用基板を複数のローラ上に載置して第一の方向に往復動作させるとともに、給気穴を有する冷却部材を上記第一の方向と上記PDP用基板の水平面内で直交する第二の方向に往復運動させながら、隣り合う上記ローラの間から上記給気穴を通して冷却用ガスを供給することにより上記PDP用基板の下面全体に上記冷却用ガスを吹付けて冷却するPDP用基板冷却方法A PDP substrate is placed on a plurality of rollers and reciprocated in a first direction, and a cooling member having an air supply hole is disposed in a second direction orthogonal to the first direction in the horizontal plane of the PDP substrate. A substrate cooling method for PDP in which cooling gas is blown to the entire lower surface of the PDP substrate by supplying cooling gas from between the adjacent rollers through the air supply hole while reciprocating in the direction. . 上記PDP用基板の下面全体に上記冷却用ガスを吹付けて冷却した後、上記第一の方向の往復運動を停止し、上記PDP用基板の下面に上記冷却部材を直接接触させて冷却する請求項1に記載のPDP用基板冷却方法 After cooling by blowing the cooling gas to the entire lower surface of the PDP substrate, the reciprocating motion in the first direction is stopped, and the cooling member is directly brought into contact with the lower surface of the PDP substrate for cooling . Item 2. A method for cooling a substrate for a PDP according to Item 1. 上記第二の方向に上記冷却部材を往復動作させる速度が、上記第一の方向に上記PDP用基板を往復動作させる速度より速い請求項1または2に記載のPDP用基板冷却方法3. The PDP substrate cooling method according to claim 1 , wherein a speed at which the cooling member is reciprocated in the second direction is faster than a speed at which the PDP substrate is reciprocated in the first direction . 上記第二の方向に上記冷却部材を往復動作させるストロークが、上記冷却部材に形成される複数の上記給気穴の上記第二の方向のピッチに大略等しい請求項1〜3のいずれか1つに記載のPDP用基板冷却方法The stroke of reciprocating the cooling member in the second direction is approximately equal to the pitch in the second direction of the plurality of air supply holes formed in the cooling member. The substrate cooling method for PDP described in 2. PDP用基板を支持する複数のローラと、
上記各ローラを回転させて上記PDP用基板を第一の方向に往復動作させる回転駆動部と、
上記隣り合うローラの間に配置され、かつ、冷却用ガスを上記PDP用基板の下面に向かって供給する給気穴を有する冷却部材と、
上記冷却部材を上記第一の方向と直交する第二の方向に往復動作させる往復運動駆動部と、
上記回転駆動部による上記各ローラの回転と上記往復運動駆動部による上記冷却部材の往復動作とを制御する制御部とを備えることを特徴とするPDP用基板冷却装置。
A plurality of rollers for supporting a PDP substrate;
A rotation drive unit that rotates each of the rollers to reciprocate the PDP substrate in a first direction;
A cooling member disposed between the adjacent rollers and having a supply hole for supplying a cooling gas toward the lower surface of the PDP substrate;
A reciprocating motion drive unit that reciprocates the cooling member in a second direction orthogonal to the first direction;
A substrate cooling apparatus for a PDP, comprising: a control unit that controls rotation of each roller by the rotation driving unit and reciprocation of the cooling member by the reciprocation driving unit .
上記PDP用基板の下面に上記冷却部材の上面を接触させる上昇位置と、上記冷却部材が上記PDP用基板から下方に離れてかつ、上記冷却部材の上記給気穴からの上記冷却用ガスが上記PDP用基板の下面に達する下降位置との間で昇降する昇降部とを備える請求項5に記載のPDP用基板冷却装置。 A rising position where the upper surface of the cooling member is brought into contact with the lower surface of the PDP substrate, the cooling member is separated downward from the PDP substrate, and the cooling gas from the air supply hole of the cooling member is The substrate cooling apparatus for PDP according to claim 5 , further comprising an elevating part that moves up and down between a lowered position that reaches the lower surface of the PDP substrate. 上記給気穴は、上記冷却部材上面に上記第二の方向に並んで複数形成された列が上記第一の方向に並んで複数形成されており、隣り合う上記列のそれぞれの給気穴の中心を通る第一の方向と平行な線が第二の方向にずれている請求項5または6に記載のPDP用基板冷却装置。 The plurality of air supply holes are formed in a row in the second direction on the upper surface of the cooling member, and a plurality of air supply holes are formed in the first direction. The substrate cooling apparatus for PDP according to claim 5 or 6 , wherein a line parallel to the first direction passing through the center is shifted in the second direction .
JP2002317798A 2002-10-31 2002-10-31 Substrate cooling apparatus and method for PDP Expired - Fee Related JP3899305B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002317798A JP3899305B2 (en) 2002-10-31 2002-10-31 Substrate cooling apparatus and method for PDP

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002317798A JP3899305B2 (en) 2002-10-31 2002-10-31 Substrate cooling apparatus and method for PDP

Publications (3)

Publication Number Publication Date
JP2004150736A JP2004150736A (en) 2004-05-27
JP2004150736A5 true JP2004150736A5 (en) 2005-09-02
JP3899305B2 JP3899305B2 (en) 2007-03-28

Family

ID=32461101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002317798A Expired - Fee Related JP3899305B2 (en) 2002-10-31 2002-10-31 Substrate cooling apparatus and method for PDP

Country Status (1)

Country Link
JP (1) JP3899305B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099721A (en) 2007-10-16 2009-05-07 Dainippon Screen Mfg Co Ltd Method of cooling substrate and apparatus of cooling substrate
KR100921523B1 (en) * 2008-05-30 2009-10-12 세메스 주식회사 Method and apparatus for fabricating substrates used in manufacturing flat panel display
CN107870602A (en) * 2017-12-22 2018-04-03 广西三威林产工业有限公司 Panel turnover machine sheet material cooling controller
KR102490764B1 (en) * 2021-04-09 2023-01-20 상신브레이크주식회사 Scotching processor of automobile brake pads
CN114157266B (en) * 2022-02-07 2022-05-10 深圳新声半导体有限公司 High-shielding surface acoustic wave filter
CN117906377B (en) * 2024-03-18 2024-05-14 山东科元窑炉工程有限公司 Tunnel kiln equipment and process for wide-section single-layer sintering alumina ceramic

Similar Documents

Publication Publication Date Title
CN1204801C (en) Component mounting machine and method
CN204053287U (en) The solar battery sheet grass-hopper of solar battery sheet automatic string welding machine
JP2006143468A (en) Plate material separating device
JP2004150736A5 (en)
CN1974167A (en) Scoring device and method and multi braking system
CN104772977B (en) One kind combination pad printing machine
JP2006191039A (en) Tray transfer device
KR100254263B1 (en) Mounting device of comppnent
CN207757103U (en) A kind of pcb board laser drill positioning device
CN202799420U (en) Six-head light-emitting diode (LED) chip mounter
CN210366099U (en) Separate feeding device
CN105563798B (en) A kind of water drilling arrangement and the former of water drilling plastic uptake
CN215283302U (en) Wood-plastic board cooling forming equipment
CN102315092A (en) Wet etching apparatus and method thereof
CN205969296U (en) A processingequipment for PCB plate making
CN211168879U (en) 180-degree turnover mechanism
CN205684909U (en) Laser marking equipment and marking workbench thereof
KR20120092844A (en) Dummy glass remover
CN106824761A (en) One kind vibration stone remover
CN215615903U (en) Adsorption conveying device of laser coding machine
CN1517756A (en) Chip transmitting equipment in chip processing system for two-dimentional display
JP3899305B2 (en) Substrate cooling apparatus and method for PDP
CN211812258U (en) Variable-spacing multi-suction-nozzle suction head
KR100739100B1 (en) Substrate transporting apparatus
CN110064276B (en) Ink jet printing apparatus