JP2004140147A - Detecting device and processing system for body to be transferred - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a detecting device for a body to be transferred, which is simple in the structure thereof and not requiring any delicate adjustment upon setting while capable of surely detecting the body to be transferred even it is transparent. <P>SOLUTION: The detecting device for the body W to be transferred in a transferring space is provided with a light emitting unit 54 for emitting inspection light La into a direction substantially orthogonal to the transferring direction of the body to be transferred, a photo detector 56 for receiving reflection light Lr from the body to be transferred and a reflecting member 58 positioned in the emitting direction of the inspection light while having a reflection surface 60 for reflecting the inspection light into a direction different from a direction wherein the photo detector is positioned. According to this constitution, the inspection light is reflected by the body to be transferred and is received by the photo detector when the body to be transferred exists while the inspection light is reflected into another direction without any relation to the body to be transferred when the body to be transferred does not exist. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a detection device and a processing system for confirming the presence / absence (presence / absence) of an object such as a semiconductor wafer.
[0002]
[Prior art]
Generally, in order to manufacture a semiconductor integrated circuit, various processes such as film formation, etching, oxidation, and diffusion are performed on a substrate such as a semiconductor wafer. Then, in order to improve throughput and yield by miniaturization and high integration of the semiconductor integrated circuit, a plurality of processing apparatuses performing the same processing or a plurality of processing apparatuses performing different processing are transferred through a common transfer chamber. So-called clustered processing system devices, which are interconnected and enable continuous processing of various processes without exposing the substrate to the atmosphere, are already known.
[0003]
In this type of processing system, for example, a substrate such as a semiconductor wafer is taken out from a cassette container installed at an introduction port of an object to be processed provided in a preceding stage of the processing system by using a transport mechanism and introduced into the processing system. After the substrate is taken into the side transfer chamber, the substrate is positioned by an orienter for positioning, the substrate is carried into a load lock chamber capable of being evacuated, and the substrate is subjected to a plurality of vacuum processes. The chamber is carried into another common transfer chamber in a vacuum atmosphere connected to the surroundings by using another transfer mechanism, and the substrate is sequentially introduced into each of the processing chambers with the common transfer chamber as a center, and the processing is continuously performed. It has become. Then, the processed substrate is stored in the original cassette container, for example, via the original path.
By the way, as described above, this type of processing system has a single or a plurality of transfer mechanisms inside, and the transfer and transfer of the substrate are automatically performed by these transfer mechanisms.
[0004]
In addition, an opening / closing door, for example, a gate valve, which can be opened and closed in an airtight manner for providing and blocking communication between these chambers is provided between the respective chambers maintained in a vacuum state. The gate valve is opened and closed each time a substrate is transferred or transferred between the respective chambers, and when the substrate is in the open state, the substrate is held by a pick of a transfer mechanism and transferred in and out. In this case, since the transfer and delivery of the substrate are performed automatically as described above, when the gate valve is closed, the target transfer mechanism holds the substrate with a pick when receiving the substrate. Or, when transferring the substrate, the pick is not holding the substrate, that is, the gate valve is closed after confirming the presence or absence of the substrate at the pick, so that the reliability of the transfer and transfer of the substrate has been secured. I have.
[0005]
Conventionally, in order to confirm the presence or absence of a substrate as described above, for example, an optical sensor is provided for each gate valve. This optical sensor includes a transmission sensor that detects the presence of the substrate by blocking the inspection light from the substrate, and a reflection sensor that detects the presence of the substrate by detecting the light reflected from the substrate. There are types. In the case of a transmission type sensor, not only detection becomes difficult when the substrate is transparent, but also two viewport windows, ie, an inspection light emission window and a detection window, must be provided in the vacuum chamber. Therefore, there is a tendency that a reflection type sensor is mainly used. Examples of the conventional reflection type sensor are disclosed in, for example, Patent Documents 1 and 2.
[0006]
In the case of Patent Literature 1 and Patent Literature 2, for example, as shown in FIG. 5, the inspection sensor 106 emits the inspection light 106 from a diagonally upper part of the surface of the wafer mounting table 102 in a vacuum chamber 100 such as a load lock chamber. Then, a reflection unit 108 having a reflection surface orthogonal to the inspection light 106 is provided on the surface of the mounting table. When there is no wafer 110 on the wafer mounting table 102, the detection sensor 104 receives the reflected light from the reflection unit 108, and thus determines “no wafer”. Also, when there is a wafer, the inspection light 106 is reflected in the other deviated direction, so that no reflected light is detected and it is determined that "wafer is present".
[0007]
[Patent Document 1]
JP-A-5-294405 (page 3, FIG. 1)
[Patent Document 2]
JP-A-2002-164416 (page 4, FIG. 1)
[0008]
[Problems to be solved by the invention]
By the way, in the case of the above-mentioned conventional reflection type sensor, when the inspection light emitted from the detection sensor is reflected on the reflection portion, delicate position adjustment is performed so that the reflected light surely returns to the detection sensor. It is quite hard to do, and it takes a lot of time to adjust.
Further, when the substrate is a transparent substrate such as a glass substrate, the inspection light passes through the transparent substrate, so that an erroneous determination may be made as “no substrate”. The present invention has been devised in view of the above problems and effectively solving the problems. SUMMARY OF THE INVENTION It is an object of the present invention to provide a transported object detection apparatus and a processing system which have a simple structure, do not require fine adjustment for mounting, and can reliably detect a transparent transported object.
[0009]
[Means for Solving the Problems]
The invention according to claim 1 is a detection device for a transported object transported in a transporting space, wherein the light emitting unit that emits inspection light in a direction substantially orthogonal to a transport direction of the transported object, A light receiving unit that receives reflected light from a carrier, and a reflecting member that is located in the emission direction of the inspection light and has a reflection surface that reflects the inspection light in a direction different from the direction in which the light receiving unit is located, A device for detecting an object to be transported, comprising:
[0010]
In this manner, the inspection light is emitted in a direction substantially perpendicular to the transport direction of the transported object, and the reflection surface that reflects the inspection light in a direction different from the direction in which the light receiving unit is located in the emission direction of the inspection light. Since the reflection member is provided, when the transported object is present, the inspection light is reflected by the transported object, and the reflected light is received by the light receiving unit, and the transported object does not exist. In some cases, the inspection light is reflected by the reflection member in another direction unrelated to the reflected light, so that the reflected light does not enter the light receiving portion, whereby the presence or absence of the transported body can be reliably recognized.
In addition, since the light reflected by the reflecting member is not made to enter the light receiving portion, it is possible to suppress the necessity of finely adjusting the mounting position when mounting these components.
[0011]
In this case, for example, as defined in claim 2, the light emitting unit and the light receiving unit are installed at the same place. Further, for example, as defined in claim 3, the reflecting member is formed of a cone.
The invention according to claim 4 is a processing chamber for performing a predetermined process on the object to be processed, the transfer chamber connected to the processing chamber via a gate valve that can be opened and closed, A processing system having a transport mechanism provided in the transport chamber for transporting the workpiece, wherein the transport chamber is provided with one of the above-described transport device detection devices. It is a processing system.
[0012]
In this case, for example, as defined in claim 5, a plurality of the processing chambers are provided and commonly connected to the transfer chamber, and the device for detecting the object to be transferred is provided corresponding to each of the processing chambers. Can be
Further, for example, as defined in claim 6, the transfer chamber can be evacuated.
Further, for example, as defined in claim 7, the light emitting section and the light receiving section of the apparatus for detecting a transferred object are provided on a bottom plate of the transfer chamber, and the reflection member is provided on a ceiling plate of the transfer chamber.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a transported object detecting apparatus and a processing system according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a configuration diagram illustrating an example of a processing system provided with a device for detecting a transferred object according to the present invention, and FIG. 2 is an enlarged cross-sectional view illustrating an attached state of the device for detecting a transferred object.
[0014]
First, the processing system will be described.
As shown in FIG. 1, this processing system 2 has a plurality of, for example, four processing chambers 4A, 4B, 4C, and 4D, a substantially hexagonally-shaped common transfer chamber 6 that can be evacuated, and a load lock function. It mainly has first and second load lock chambers 8A and 8B that can be evacuated, and an elongated introduction-side transfer chamber 10.
Specifically, each of the processing chambers 4A to 4D is joined to four sides of the common transfer chamber 6 having a substantially hexagonal shape, and the first and second load lock chambers 8A and 8B are connected to the other two sides. Each is joined. The introduction-side transfer chamber 10 is commonly connected to the first and second load lock chambers 8A and 8B.
[0015]
The space between the common transfer chamber 6 and the four processing chambers 4A to 4D and the space between the common transfer chamber 6 and the first and second load lock chambers 8A and 8B can be opened and closed in an airtight manner. The gate valves G1 to G4 and G5, G6 are respectively connected and joined to form a cluster tool, and can communicate with the common transfer chamber 6 as necessary. Further, between the first and second load lock chambers 8A and 8B and the introduction-side transfer chamber 10, gate valves G7 and G8 that can be opened and closed in an airtight manner are respectively interposed.
[0016]
In the four processing chambers 4A to 4D, susceptors 12A to 12D for mounting a semiconductor wafer as a processing target are provided, respectively, and the same type of susceptors as substrates W such as semiconductor wafers as the processing target. Alternatively, different types of processing are performed. The object to be processed is transported in the processing system, and thus also serves as the object to be transported. In the common transfer chamber 6, a multi-joint arm is provided at a position where the two load lock chambers 8A and 8B and the four processing chambers 4A to 4D can be accessed. A second transfer mechanism 14 is provided, which has two picks B1 and B2 which can bend and stretch independently in opposite directions so that two wafers can be handled at a time. I have. In addition, a mechanism having only one pick may be used as the second transport mechanism 14.
[0017]
The introduction-side transfer chamber 10 is formed of a horizontally elongated box. One or a plurality of, in the illustrated example, three loading chambers for introducing a semiconductor wafer to be processed is provided on one side of the horizontally long box. An opening 16 is provided, and an opening / closing door 21 that can be opened and closed is provided at each carry-in entrance 16. In addition, introduction ports 18A, 18B, and 18C are provided corresponding to each of the carry-in ports 16, and one cassette container 20 can be placed on each of the introduction ports 18A, 18B, and 18C. Each cassette container 20 is capable of accommodating a plurality of, for example, 25 substrates W in multiple stages at equal pitches.
[0018]
In the introduction-side transfer chamber 10, a first transfer mechanism 22, which is an introduction-side transfer mechanism for transferring the substrate W along the longitudinal direction, is provided. The first transfer mechanism 22 is slidably supported on a guide rail 24 provided so as to extend along the length direction in the center of the introduction-side transfer chamber 10. The guide rail 24 incorporates, for example, a linear motor having an encoder as a moving mechanism. By driving the linear motor, the first transport mechanism 22 moves along the guide rail 24.
[0019]
Further, the first transport mechanism 22 has two articulated arms 32 and 34 arranged in two upper and lower stages. Bifurcated picks A1 and A2 are attached to the tips of the articulated arms 32 and 34, respectively, and the substrates W are directly held on the picks A1 and A2, respectively. Therefore, each of the articulated arms 32 and 34 can freely bend and extend and move up and down in the radial direction from the center, and the bending and elongating operation of each of the articulated arms 32 and 34 can be individually controlled. The rotating shafts of the articulated arms 32 and 34 are coaxially and rotatably connected to the base 36, respectively, so that they can be integrally rotated, for example, in a turning direction with respect to the base 36. Here, the picks A1 and A2 may be provided only instead of two.
[0020]
An orienter 26 for aligning a wafer is provided at the other end of the introduction-side transfer chamber 10, and the two load-lock chambers 8A and 8B are provided in the middle of the introduction-side transfer chamber 10 in the longitudinal direction. They are provided via the gate valves G7 and G8 which can be opened and closed.
The orienter 26 has a turntable 28, and rotates with the substrate W placed thereon. An optical sensor 30 for detecting the peripheral edge of the substrate W is provided on the outer periphery of the turntable 28, whereby a notch for positioning the substrate W, for example, a position direction of a notch or an orientation flat or a position of a center of the substrate W is provided. The shift amount can be detected.
[0021]
In the first and second load lock chambers 8A and 8B, mounting tables 38A and 38B each having a diameter smaller than the diameter of the wafer are provided for temporarily mounting the substrate W thereon. The control of the entire operation of the processing system 2, for example, the operation control of each of the transport mechanisms 14, 22 and the orienter 26, is performed by a control unit 40 including, for example, a microcomputer.
Further, at a predetermined position of the common transfer chamber 6 and the introduction-side transfer chamber 10, a transported object detection device (hereinafter, also simply referred to as a detection device) of the present invention is provided corresponding to each gate valve G.
[0022]
Specifically, the common transfer chamber 6 corresponds to the gate valves G1 to G4 of the processing chambers 4A to 4D and the gate valves G5 and G6 of the first load lock chamber 8A and the second load lock chamber 8B. Four detection devices 50A to 50D and two 50E and 50F are provided, respectively. In the introduction-side transfer chamber 10, two detection devices 50G and 50H are respectively provided corresponding to the introduction gate valves G7 and G8 of the first and second load lock chambers 8A and 8B on the introduction-side transfer chamber 10 side. Is provided.
Each of the detection devices 50A to 50H is for detecting whether or not a substrate (object to be processed), which is a body to be transported, is present at the installation location. Here, since all of the detection devices 50A to 50H have the same configuration, the detection device 50A provided corresponding to the processing chamber 4A will be described as an example here.
[0023]
As shown in FIG. 2, the detection device 50A includes a light emitting unit 54 that emits the inspection light La in a direction substantially orthogonal to the transport direction (transport surface) of the substrate W as a transported object, A light receiving unit 56 that receives the reflected light Lb from the W, and is positioned in the emission direction of the inspection light La, and reflects the inspection light La as reflected light Lr in a direction different from the direction in which the light receiving unit 56 is located. It mainly comprises a reflection member 58 having a reflection surface 60. The processing of the detection result here is performed by the control means 40 (see FIG. 1).
[0024]
Specifically, the light emitting section 54 and the light receiving section 56 are provided on the bottom plate 6A side of the common transfer chamber 6, whereas the reflecting member 58 is provided on the ceiling plate 6B of the common transfer chamber 6, The presence or absence of the substrate W transferred into the common transfer chamber 6, which is a space, is checked as necessary. A viewing hole 62 having a diameter of about 20 mm is formed in the bottom plate 6A, and a transparent quartz plate 66 is hermetically attached to an outer surface of the bottom plate 6A via a sealing member 64 such as an O-ring.
The light emitting unit 54 and the light receiving unit 56 are provided outside the quartz plate 66 so as to be arranged at the same position.
[0025]
The light emitting section 54 is composed of, for example, a light emitting diode element or a laser light emitting element. The light emitting section 54 emits inspection light La to the ceiling plate 6B directly above the light emitting section 54. The reflection member 58 is provided at a position of the ceiling plate 6B where the emitted inspection light La will hit. The reflecting member 58 is made of, for example, a metal such as stainless steel or aluminum, and is formed into a conical shape. Is the reflection surface 60. The cone-shaped reflecting member 58 is attached and fixed to the ceiling plate 6B with the apex of the reflecting member 58 facing downward.
[0026]
When the inspection light La hits the conical reflecting surface 60, the light can be reflected as reflected light Lr in a direction other than the direction in which the light receiving unit 56 is attached. At this time, the diameter D1 of the reflecting member 56 is about 20 mm, and the magnitude of the apex angle θ is about 120 degrees, for example. The diameter D1 of the reflection member 56 is set to a size such that the spot diameter of the inspection light La is sufficiently contained. The height H1 of the transport space is about 100 to 300 mm. Further, the depth of the viewing hole 62 (the thickness of the bottom plate 6A) is about 87 mm, so that light diffusely reflected in the transport space is not incident on the light receiving portion 56 as much as possible.
[0027]
The positions where the light emitting unit 54 and the light receiving unit 56 are mounted may be set in a state where the multi-joint arm of the transport mechanism 14 is folded, and the corresponding processing chambers 4A to 4D and the first and second load lock chambers 8A and 8B. Is provided corresponding to the location where the substrate W is located.
[0028]
Next, a case where the substrate W is transported in the processing system configured as described above will be described.
Generally, when transporting the substrate W, one of the picks is left empty in the transport mechanisms 14 and 22, and an unprocessed substrate to be transported is held in the other pick. When the transfer mechanism 14 is directed to a processing chamber to be transferred, for example, the gate valve of the processing chamber is opened, and first, an empty pick is advanced and retracted to receive the processed substrate in the processing chamber, and the common transfer chamber is received. 6, the transport mechanism 14 is turned, and a pick for holding the unprocessed substrate W is directed to the processing chamber, and the pick is advanced to load the unprocessed wafer into the processing chamber. I do. When the wafer is placed on the mounting table and the delivery is completed, the pick is retracted by folding the articulated arm. At this time, the pick is empty.
[0029]
In the above-described series of operations, for example, the picks B1 and B2 of the transport mechanism 14 are directed to the corresponding processing chambers 4A to 4D and the first and second load lock chambers 8A and 8B to perform the forward and backward operations. When the device is raised or when the gate valve is opened and closed, the presence or absence (presence or absence) of the substrate W on the pick is confirmed.
For example, as shown in FIG. 2A, when the substrate W is not held on the pick B1 (B2), the inspection light La emitted from the light emitting unit 54 is shaped like a cone of the reflecting member 58 provided on the ceiling plate 6B. And is reflected so as to be diffused to the side as reflected light Lr, and is not detected by the light receiving unit 56. At this time, the control unit 40 determines that there is no board.
[0030]
On the other hand, as shown in FIG. 2B, when the substrate W is held on the pick B1 (B2), the inspection light La is applied to the substrate W held on the pick B1 (B2). The light is substantially perpendicularly reflected and is reflected back as the reflected light Lb in the original direction. The reflected light Lb is detected by the light receiving unit 56. As a result, the control unit 40 determines that "there is a board".
The opening / closing operation of the gate valve is controlled by the above-described determination. For example, in a case where an empty pick is used to pick up a substrate in the processing chambers 4A to 4D or the first and second load lock chambers 8A and 8B, the pick which is supposed to be empty is picked up by the substrate. When the determination of “exist” is made, it means that some error has occurred, and the operation is temporarily stopped.
[0031]
Similarly, when the substrate is held and taken out from the processing chambers 4A to 4D or the first and second load lock chambers 8A and 8B, the substrate should be originally held. If a decision of "no board" is made for the pick, it means that some error has occurred, and the operation is temporarily stopped. In addition, since various kinds of films and fine irregularities are present on the surface of the substrate W, the light is likely to be irregularly reflected, but in the present invention, the inspection light La is radiated to the rear surface of the substrate, which is less likely to have such light. The irregular reflection of the inspection light La is small, and the reliability of the determination of the presence or absence of the substrate can be further improved.
[0032]
Even when the object to be transported is a transparent substrate such as a glass substrate, when light is incident from a medium having a low refractive index to a medium having a large refractive index, reflection always occurs at the boundary surface. Since La is reflected by the glass substrate, the presence or absence of the glass substrate can be accurately detected.
The above operation is also performed for the transfer mechanism 22 provided in the introduction-side transfer chamber 10, and for example, as described above when opening and closing the gate valves G7 and G8 with respect to the first and second load lock chambers 8A and 8B. The judgment of "presence / absence of substrate" is made.
In addition, when the reflecting member 56 is attached, it is only necessary to set the inspection light La so as to hit the reflecting member 56, and it is not necessary to adjust the reflected light to be accurately reflected toward the light receiving unit unlike the conventional device. The mounting adjustment work can be greatly simplified.
[0033]
Here, the substrate W may be warped or deformed due to heat treatment or the like, and the inspection light La may not be directed perpendicularly to the wafer surface. Was evaluated, and the results of the evaluation will be described.
FIG. 3 is an explanatory diagram when the allowable inclination angle of the inspection light with respect to the substrate is evaluated. 3, the inclination angle of the substrate W with respect to the transport direction 50 is represented by α. The substrates to be evaluated were a silicon substrate, a quartz transparent substrate, and a substrate having a predetermined amount of a thin film formed on each of these substrates. First, when the substrate is “absent”, the amount of light received by the light receiving unit 56 is about “370” due to the influence of irregular reflection inside the transport space, sensor error, and the like. On the other hand, when the inclination angle α of the substrate W is ± 0.6 degrees, the amount of light received by the transparent quartz substrate is “2110”, and the amount of light received by other substrates is “4000 or more”. Sufficient detection was possible.
[0034]
When the inclination angle α is ± 1 degree, the amount of light received by the transparent quartz substrate is considerably low at “600”, which is slightly difficult to detect. On the other hand, the amount of light received by other substrates is “ It was about 1000 to 3000 ″, and was sufficiently detectable. Therefore, it has been found that even if the inclination angle is about ± 1 degree, the presence or absence of the substrate (transported object) can be determined sufficiently reliably.
In the above embodiment, the reflection member 58 has a conical shape, but the present invention is not limited to this. For example, a polygonal pyramid having more than a triangular pyramid or a prism having an inclined surface can be used. FIG. 4 is a diagram showing an example of another modification of the above-described reflecting member.
[0035]
FIG. 4A shows a reflecting member 58 made of a quadrangular pyramid. The bottom surface of the reflecting member 58 is attached to a ceiling plate 6 </ b> B, and the four surfaces are reflecting surfaces 60. FIG. 4B shows a reflecting member 58 formed of a triangular pyramid. The bottom surface of the reflecting member 58 is attached to a ceiling plate 6 </ b> B, and three surfaces are reflecting surfaces 60. FIG. 4C shows a reflecting member 58 formed of a triangular prism. The bottom of the reflecting member 58 is attached to a ceiling plate 6 </ b> B, and two inclined surfaces are reflecting surfaces 60. FIG. 4D shows a reflecting member 58 formed of a right triangular prism. The bottom of the reflecting member 58 is attached to the ceiling plate 6 </ b> B, and one surface of the slope is a reflecting surface 60.
In the above embodiment, the case where the reflecting member 58 is attached to the ceiling 6B of the common transfer chamber 6 has been described. However, the corresponding portion of the ceiling plate 6B may be processed into the shape of the reflecting member 56.
[0036]
Further, the configuration of the processing system is merely an example, and the present invention is not limited to this configuration. Further, here, a substrate made of a semiconductor wafer or the like is described as an example of the object to be transferred and the object to be processed, but the present invention is not limited to this, and the present invention can be applied to a glass substrate, an LCD substrate, and the like. is there.
[0037]
【The invention's effect】
As described above, according to the transported object detecting device and the processing system of the present invention, the following excellent operational effects can be exhibited.
According to the present invention, the inspection light is emitted in a direction substantially orthogonal to the transport direction of the object to be transported, and the reflection direction of the inspection light is reflected in a direction different from the direction in which the light receiving unit is located. Since the reflection member having the surface is provided, when the transported object is present, the inspection light is reflected by the transported object, and the reflected light is received by the light receiving unit. When the inspection light does not exist, the inspection light is reflected by the reflection member in another direction unrelated to the inspection light, so that the reflected light does not enter the light receiving portion, whereby the presence or absence of the transported object can be reliably recognized.
In addition, since the light reflected by the reflecting member is not made to enter the light receiving portion, it is possible to suppress the necessity of finely adjusting the mounting position when mounting these components.
[Brief description of the drawings]
FIG. 1 is a configuration diagram illustrating an example of a processing system provided with a transported object detection device of the present invention.
FIG. 2 is an enlarged sectional view showing an attached state of a device for detecting an object to be conveyed;
FIG. 3 is an explanatory diagram when an allowable inclination angle of inspection light with respect to a substrate is evaluated.
FIG. 4 is a diagram showing an example of another modification of the reflection member.
FIG. 5 is a configuration diagram illustrating an example of a conventional transported object detection device.
[Explanation of symbols]
2 Processing systems 4A to 4D Processing chamber 6 Common transfer chamber (transfer chamber)
8A, 8B Load lock chamber 10 Introducing transfer chamber (transfer chamber)
14 Second transport mechanism 22 First transport mechanism 40 Control units 50A to 50H Conveyed object detecting device 54 Light emitting unit 56 Light receiving unit 58 Reflecting member 60 Reflecting surface A1, A2, B1, B2 Pick La Inspection light Lb, Lr Reflected light W Substrate (Conveyed object: object)

Claims (7)

In a device for detecting a transferred object transferred in the transfer space,
A light emitting unit that emits inspection light in a direction substantially orthogonal to the transport direction of the transported object,
A light receiving unit that receives reflected light from the transferred object,
A reflection member that is located in the emission direction of the inspection light and has a reflection surface that reflects the inspection light in a direction different from the direction in which the light receiving unit is located,
A device for detecting an object to be transported, comprising: The transported object detecting device according to claim 1, wherein the light emitting unit and the light receiving unit are installed at the same place. The apparatus according to claim 1, wherein the reflection member is formed of a cone. A processing chamber for performing a predetermined process on the object to be transferred, a transfer chamber connected to the processing chamber via a gate valve that can be opened and closed, and a transfer chamber for transferring the object to be processed. In a processing system having a transfer mechanism provided in the transfer chamber,
4. A processing system, wherein the transport chamber is provided with the transported object detecting device according to claim 1. 5. The processing system according to claim 4, wherein a plurality of the processing chambers are provided and commonly connected to the transfer chamber, and the transported object detection device is provided corresponding to each of the processing chambers. 6. . The processing system according to claim 4, wherein the transfer chamber is configured to be able to be evacuated. The light-emitting unit and the light-receiving unit of the device for detecting a transferred object are provided on a bottom plate of the transfer chamber, and the reflection member is provided on a ceiling plate of the transfer chamber. The processing system as described.

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