JP2004136275A - Processing object transfer method in vacuum processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing object transfer method realizing a high cycle time in vacuum processing devices such as a sputtering device, a dry etching device, a CVD device and a vapor deposition device. <P>SOLUTION: Of a plurality of vacuum chambers, a vacuum chamber 2 closest to the atmospheric pressure side is vented to the atmospheric pressure, and a vacuum chamber 3 on the vacuum processing device side adjacent to the chamber 2 is roughly exhausted. Then, the chamber 2 is communicated with the chamber 3, the chamber 2 is exhausted and the chamber 3 is vented. The chamber 2 is vented to the atmospheric pressure, and the chamber 3 is roughly exhausted so as to become the same pressure as a vacuum chamber 4 on the vacuum processing device in the next stage side adjacent thereto. Thus, the vacuum chamber in which an object to be processed is transferred exhausts air so that the pressure moves to a higher vacuum side, and the vacuum chamber out of which the object to be processed is transferred transmits the object to be processed while venting air to move the pressure to the atmospheric side. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
[Industrial applications]
The present invention relates to a load lock device for carrying a processing object into or out of a vacuum processing apparatus and a method of transporting the processing object.
[0002]
[Prior art]
Conventionally, in order to load or unload semiconductor wafers or other processing objects into or from a vacuum processing apparatus such as a sputtering apparatus, a dry etching apparatus, a CVD apparatus, or a vapor deposition apparatus, a vacuum chamber capable of accommodating the processing object is provided by the vacuum processing apparatus. There are known load lock devices configured to be connected to the same (for example, JP-A-57-63677, JP-A-60-221572, JP-A-63-157870, etc.).
[0003]
The vacuum chamber is connected to a rotary pump or other rough evacuation system. After the object to be processed is accommodated in the vacuum chamber at atmospheric pressure, rough evacuation is performed. To communicate the object to be processed in the vacuum chamber to the vacuum processing apparatus side, or after roughly exhausting the vacuum chamber, to transfer the object to be processed to the vacuum chamber side in communication with the vacuum processing apparatus. This eliminates the need to set the vacuum processing apparatus to atmospheric pressure every time a processing object is carried into or out of the vacuum processing apparatus, thereby improving productivity and the like.
[0004]
Another vacuum chamber is interposed between the vacuum chamber constituting the load lock device and the vacuum processing device, and the vacuum chamber includes an oil diffusion pump, a cryopump, a molecular pump, a rotary pump, and other backup pumps. In some cases, a buffer chamber is constructed by connecting a high-vacuum exhaust system configured as described above (Japanese Patent Laid-Open No. 63-157870).
[0005]
[Patent Document 1] JP-A-57-63677
[Patent Document 2] JP-A-60-221572
[Patent Document 3] JP-A-63-157870
[Patent Document 4] JP-A-63-157870
[Patent Document 5] JP-A-3-183767
[Patent Document 6] Japanese Utility Model Publication No. 43-233686
[Patent Document 7] JP-A-1-108373
[Problems to be solved by the invention]
Since the conventional load lock device as described above includes one vacuum chamber and a rough evacuation system, there is a limit in improving the productivity. That is, the tact time of the processing by the vacuum processing apparatus is limited to the time required for exhausting the vacuum chamber of the load lock device to a pressure at which the vacuum chamber can communicate with the vacuum processing apparatus by the rough exhaust system.
[0013]
Since the evacuation time of the rough evacuation system is determined by the evacuation speed of the evacuation system and the volume of the vacuum chamber, there has been a means for setting the rough evacuation system pump to a high evacuation speed. Was rapid and dust was thrown up, causing particles harmful to the object to be treated, and was not effective.
[0014]
[Means for Solving the Problems]
The present invention has been made in view of the above-described problems, and has a load lock device and a processing object capable of realizing a high-speed tact of a vacuum processing device such as a sputtering device, a dry etching device, a CVD device, and a vapor deposition device. The purpose of the present invention is to provide a method of transporting the same.
[0015]
A load lock device according to the present invention that achieves the above object is a load lock device that is connected to a processing object carry-in portion or a discharge portion of a vacuum processing device, wherein at least three vacuum chambers are located between adjacent chambers. Through the gate valve, when the gate valve is opened, it is connected so that the object to be processed can be transported from one adjacent chamber to the other chamber, and is connected to the at least three vacuum chambers. The vacuum chamber closest to the atmospheric pressure side is connected to a vent pipe via a vent valve so that vent gas can be introduced, and the vacuum chamber closest to the atmospheric pressure side among the at least three vacuum chambers. And a vacuum chamber disposed in the middle of the at least three vacuum chambers, comprising: a pressure exchange valve; and a valve for adjusting a flow rate. The other end is common to the vacuum chamber arranged in the middle of the at least three vacuum chambers and the vacuum chamber closest to the vacuum processing device side. One end of each of the roughing pipes connected to the roughing pump is connected to each other, and a roughing valve is interposed between the two roughing pipes.
[0016]
In the above description, the processing object carrying-in section of the vacuum processing apparatus refers to the left side in FIG. 1 of the sputtering chamber 12 as the vacuum processing apparatus in the embodiment shown in FIG. In the embodiment shown in FIG. 1, the target carrying-out section refers to the right side in FIG. 1 of the sputtering chamber 12 as a vacuum processing apparatus.
[0017]
In order to achieve the above object, the method of transferring an object to be processed according to the present invention is such that a plurality of vacuum chambers are separated from one adjacent chamber when the gate valve is opened via a gate valve between the adjacent chambers. A load lock device connected to the other chamber so as to be able to transport the processing object is connected to the processing object loading portion of the vacuum processing device, and the processing object is connected to the vacuum processing device via the load lock device. A method for transporting an article, comprising the following steps.
[0018]
Venting the vacuum chamber closest to the atmospheric pressure side to atmospheric pressure among the plurality of vacuum chambers, and roughly exhausting the vacuum chamber of the vacuum processing apparatus adjacent to the vacuum chamber closest to the atmospheric pressure side.
[0019]
A step of opening a partition on the atmospheric pressure side of the vacuum chamber closest to the atmospheric pressure side and carrying the object to be processed, and then closing the partition to make the vacuum chamber airtight.
[0020]
The vacuum chamber closest to the atmospheric pressure side is connected to the vacuum chamber closest to the atmospheric pressure side and the vacuum chamber on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side through a communication pipe. Evacuating the chamber and venting the vacuum chamber on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side.
[0021]
After the pressures of the two vacuum chambers (the vacuum chamber closest to the atmospheric pressure side and the vacuum chamber on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side) became the same, the pressure was passed through the communication pipe. Shutting off the communication between the two vacuum chambers, opening the partition between the two vacuum chambers, transporting the object to be processed into the adjacent vacuum processing apparatus-side vacuum chamber, and closing the partition.
[0022]
Subsequently, the vacuum chamber closest to the atmospheric pressure side is vented to atmospheric pressure, and the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side is connected to the next vacuum processing apparatus side. Rough evacuation to the same pressure as the vacuum chamber.
[0023]
After the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side and the adjacent vacuum chamber on the next vacuum processing apparatus side have the same pressure, the vacuum closest to the atmospheric pressure side The roughing from the vacuum chamber on the vacuum processing apparatus side adjacent to the chamber is stopped, and the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side and the next vacuum processing apparatus side adjacent to the vacuum processing apparatus side are stopped. A step of opening a partition between the vacuum chamber and the processing object, transferring the object to be processed into the vacuum chamber on the side of the next next vacuum processing apparatus, and closing the partition;
[0024]
[Action]
According to the load lock device and the transfer method of the present invention, the vacuum chamber (the vacuum chamber denoted by reference numeral 3 in FIG. 1) on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side is roughened. While evacuating, the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber denoted by reference numeral 2 in FIG. 1) can be vented to the atmospheric pressure.
[0025]
As a result, the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber indicated by reference numeral 3 in FIG. 1) and the vacuum chamber on the next vacuum processing apparatus side adjacent thereto While the vacuum chamber (vacuum chamber shown by reference numeral 4 in FIG. 1) is roughly evacuated to the same pressure, the vacuum chamber closest to the atmospheric pressure side (shown by reference numeral 2 in FIG. 1). (A vacuum chamber) can be vented to the atmospheric pressure, so that the tact time in transporting the processing object can be reduced.
[0026]
In addition, the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber indicated by reference numeral 2 in FIG. 1) is kept vented to the atmospheric pressure, and the vacuum chamber adjacent to the vacuum chamber closest to the atmospheric pressure side is kept. A vacuum chamber on the processing apparatus side (a vacuum chamber indicated by reference numeral 3 in FIG. 1) is in a state where rough evacuation by a rough evacuation pump is completed, and is interposed between them. By opening the pressure exchange valve and communicating the two, the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber indicated by reference numeral 2 in FIG. 1) and the vacuum chamber adjacent to the vacuum chamber closest to the atmospheric pressure side Until the pressure in the vacuum chamber on the processing apparatus side (the vacuum chamber indicated by reference numeral 3 in FIG. 1) is equilibrated, the vacuum chamber closest to the atmospheric pressure side (true indicated by reference numeral 2 in FIG. 1). Evacuating the chamber), in a vacuum chamber (Fig. 1 of the vacuum processing apparatus adjacent to the closest vacuum chamber to the atmospheric pressure side, it is possible to vent the vacuum chamber) shown by reference numeral 3. That is, by this, the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber denoted by reference numeral 2 in FIG. 1) and the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side (FIG. 1) 1, a communication pipe communicating with a vacuum chamber indicated by reference numeral 3; and a vacuum chamber (shown by reference numeral 3 in FIG. 1) adjacent to a vacuum chamber closest to the atmospheric pressure side. ) Constitutes a rough evacuation system for the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber indicated by reference numeral 2 in FIG. 1).
[0027]
Then, a vacuum chamber closest to the atmospheric pressure side (a vacuum chamber indicated by reference numeral 2 in FIG. 1) and a vacuum processing apparatus side vacuum chamber adjacent to the vacuum chamber closest to the atmospheric pressure side (reference numeral in FIG. 1) After the pressure in the vacuum chamber indicated by 3 is equilibrated, the communication between the two is stopped, and as described above, the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side (as described above). In FIG. 1, the vacuum chamber indicated by reference numeral 3) and the adjacent vacuum chamber on the side of the next vacuum processing apparatus (vacuum chamber indicated by reference numeral 4 in FIG. 1) have the same pressure. While vacuum exhaust is performed to the extent possible, the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber denoted by reference numeral 2 in FIG. 1) can be vented to the atmospheric pressure.
[0028]
Here, as described above, the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber denoted by reference numeral 2 in FIG. 1) and the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side (A vacuum chamber denoted by reference numeral 3 in FIG. 1) and a vacuum chamber (reference numeral 3 in FIG. 1) adjacent to the vacuum chamber closest to the atmospheric pressure side. ) Constitutes a rough evacuation system for a vacuum chamber closest to the atmospheric pressure side (a vacuum chamber denoted by reference numeral 2 in FIG. 1), and a vacuum closest to the atmospheric pressure side. A vacuum chamber indicated by reference numeral 3 in FIG. 1 (a vacuum chamber indicated by reference numeral 2 in FIG. 1) and a vacuum chamber on a vacuum processing apparatus side adjacent to a vacuum chamber closest to the atmospheric pressure side. After the pressure of the bar is equilibrated, the vacuum chamber on the vacuum processing apparatus side (the vacuum chamber indicated by reference numeral 3 in FIG. 1) adjacent to the vacuum chamber closest to the atmospheric pressure side and the next adjacent vacuum chamber Rough evacuation with the vacuum chamber (vacuum chamber indicated by reference numeral 4 in FIG. 1) on the vacuum processing apparatus side, the vacuum chamber closest to the atmospheric pressure side (vacuum chamber indicated by reference numeral 2 in FIG. 1) ), The time required to vent the vacuum chamber closest to the atmospheric pressure side (the vacuum chamber denoted by reference numeral 2 in FIG. 1) to the atmospheric pressure again is prolonged. On the other hand, the vacuum chamber on the vacuum processing apparatus side (the vacuum chamber indicated by reference numeral 3 in FIG. 1) adjacent to the vacuum chamber closest to the atmospheric pressure side and the next true vacuum chamber (In Figure 1, a vacuum chamber indicated by reference numeral 4) a vacuum chamber of the processing apparatus can be prevented take long time to roughing evacuated to a same pressure.
[0029]
As a result, the time required for evacuation or venting in each vacuum chamber can be reduced, and the tact time in transporting the processing target can be reduced.
[0030]
Further, from the above, since the pressure fluctuation in each vacuum chamber is reduced, as described above, the time required for exhausting or venting in each vacuum chamber can be shortened, and not only can the tact time in transporting the processing object be reduced, but also the dust can be reduced. Can be prevented, and the processing quality can be maintained high.
[0031]
【Example】
Hereinafter, the present invention will be described based on examples.
[0032]
FIG. 1 shows a load lock device 1 implemented in an in-line sputtering device, which has vacuum chambers 2, 3, and 4 connected in series. A gate valve that can form a transfer path for an object to be processed (for example, a semiconductor wafer) between the vacuum chambers, between the platforms 5 installed in the atmosphere, and between the loading chambers 6 serving as buffer chambers. 7, 8, 9, and 10 are interposed. A sputtering chamber 12 is connected to the loading chamber 6 via a similar gate valve 11, and a similar load lock device (not shown) is connected to the sputtering chamber 12 to perform in-line sputtering. The device is configured.
[0033]
The vacuum chambers 2 and 3 can communicate with each other through a communication pipe 13, and a pressure exchange valve 14 and an orifice variable valve 15 as a flow rate adjusting member are provided in the communication pipe 13. The vacuum chamber 2 is further connected to a vent pipe 17 provided with a vent valve 16 interposed therebetween, so that a vent gas (for example, nitrogen gas) can be introduced to replace the atmosphere with the atmospheric pressure.
[0034]
The vacuum chambers 3 and 4 are connected to one ends of roughing pipes 20 and 21 provided with roughing valves 18 and 19, respectively. The other ends of the roughing pipes 20 and 21 are connected to a common roughing pump ( (Rotary pump) 22.
[0035]
The loading chamber 6 is connected to a high-vacuum evacuation pump 24 constituted by a cryopump via a main valve 23 so that the inside of the loading chamber 6 can be evacuated to a high-vacuum region.
[0036]
In the above, the volumes of the vacuum chambers 2, 3, and 4 were set to 80 l, 120 l, and 100 l, respectively, including the operation area of the gate valve.
[0037]
In the load lock device 1 of the above embodiment, the semiconductor wafer and other objects to be processed are transported by the support jig 25, and at the time of loading, from the platform 5 under the atmospheric pressure atmosphere through the vacuum chambers 2, 3, and 4, the loading chamber 6 and then into the sputtering chamber 12. Contrary to the above, unloading is carried out through an unloading chamber and a load lock device which can be evacuated to a high vacuum similarly to the loading chamber 6, and is carried out to a platform in an atmospheric pressure atmosphere.
[0038]
Hereinafter, the loading operation will be described in detail with reference to FIG.
[0039]
In operation, as initial conditions, the vacuum chamber 2 is vented to the atmospheric pressure, and the vacuum chambers 3 and 4 complete the rough evacuation by the rough evacuation pipes 20 and 21 and the rough evacuation pump 22. Is operated continuously. The loading chamber 6 is assumed to be maintained in a high vacuum pressure region.
[0040]
First, the gate valve 7 is opened to transfer the support jig 25a from the platform 5 to the vacuum chamber 2, and then the gate valve 7 is closed to make the vacuum chamber 2 airtight (FIG. 2A). In the following description, it is assumed that each gate valve is opened immediately before the passage of the support jig and closed immediately after the passage of the support jig, and this operation is simply described as “opening / closing”.
[0041]
Next, the pressure exchange valve 14 of the communication pipe 13 connecting the vacuum chambers 2 and 3 is opened. When the pressure exchange valve 14 is opened, the vacuum chambers 2 and 3 are evacuated and the vacuum chamber 3 is vented until the pressures are equilibrated. That is, the vacuum chamber 3 and the communication pipe 13 constitute a rough exhaust system for the vacuum chamber 2. Assuming that the pressure in the vacuum chamber 2 is 760 Torr, the volume is 80 l, and the pressure in the vacuum chamber 3 is 10 Torr and the volume is 120 l, P = (760 × 80 + 10 × 120) / (80 + 120), which is 310 Torr.
[0042]
In this case, by setting the orifice of the orifice variable valve 15, the speed of the pressure fluctuation in each of the vacuum chambers 2 and 3 can be adjusted.
[0043]
After the vacuum chambers 2 and 3 have the same pressure, the support jig 25a is transferred to the vacuum chamber 3 by opening and closing the gate valve 8 (FIG. 2B). After the transfer is completed, the vacuum chamber 2 opens the vent valve 16 to atmospheric pressure, and allows the transfer to receive the next support jig 25b. On the other hand, the vacuum chamber 3 is evacuated to a predetermined pressure by the roughing pump 22 by opening the roughing valve 18. The predetermined pressure is a pressure determined by a required tact time or the like.
[0044]
When the vacuum evacuation of the vacuum chamber 3 is completed to a predetermined pressure, the gate valve 9 is opened and closed, and the support jig 25a is transferred to the vacuum chamber 4 (FIG. 2C). When the gate valve 9 is opened and closed, the vacuum chambers 3 and 4 are in the same pressure equilibrium state.
[0045]
After the transfer is completed, the vacuum chamber 3 closes the roughing valve 18 so that the next support jig 25b can be received. On the other hand, in the vacuum chamber 4, the roughing valve 19 is opened to further evacuate by the roughing pump 22, and the pressure determined by the volume of the vacuum chamber 4 and the exhausting capacity of the high vacuum exhaust pump 24 on the loading chamber 5 side (in the embodiment). In this case, rough evacuation is performed up to several hundred mTorr.
[0046]
After closing the roughing valve 19, the next support jig 25b is transported between the platform 5 and the vacuum chamber 2 by the same operation as described above, and the vacuum chamber 2 is roughed.
[0047]
On the other hand, after the roughing of the vacuum chamber 4 is performed to a predetermined pressure, the roughing valve 19 is closed, the gate valve 10 is opened and closed, and the support jig 25a is transferred to the loading chamber 6 (FIG. a)). At the same time, the support jig 25b in the vacuum chamber 2 opens and closes the sluice valve 8 to convey it to the vacuum chamber 3, and opens the roughing valve 18 to open the vacuum chamber 3 in the same manner as described above. Roughing. The vacuum chamber 2 performs a venting operation, and shifts to a receiving operation of the next support jig 25c.
[0048]
As described above, the vacuum chamber into which the support jig was carried out was evacuated so that the pressure moved to the high vacuum side, and the vacuum chamber from which the support jig was carried out was vented so that the pressure moved to the atmospheric pressure side. The supporting jig can be sequentially conveyed. Since the width of fluctuation of the pressure of each vacuum chamber can be made smaller than that of a load lock device using one vacuum chamber, the time required for exhausting or venting can be shortened accordingly, and the tact time in transporting the processing object through the support jig can be reduced. Time can be reduced.
[0049]
FIG. 3 shows the exhaust characteristics of the load lock device 1 according to the embodiment. In the figure, squares indicate the pressure in the vacuum chamber 2, circles indicate the pressure in the vacuum chamber 3, and triangles indicate the pressure in the vacuum chamber 4, respectively.
[0050]
The pressure in the vacuum chamber 2 ranges from atmospheric pressure to several hundred Torr, the pressure in the vacuum chamber 3 ranges from several hundred Torr to about 10 Torr, and the pressure in the vacuum chamber 4 ranges from about 10 Torr to several hundred mTorr. . Despite the volume of the vacuum chamber 2 being as large as 80 liters, a tact time of 37 seconds can be realized, and the time can be reduced to about 1/3 of that of a conventional load lock device using one vacuum chamber.
[0051]
4 to 6 show a load lock device according to another embodiment of the present invention. FIG. 4 shows an embodiment constituted by the vacuum chambers 2 and 3, FIG. 5 shows an embodiment constituted by the vacuum chambers 3 and 4, FIG. 6 shows an embodiment in which one more vacuum chamber 4 is added. Further addition of a vacuum chamber is effective in shortening the tact time, but it is considered that the actually required tact time can be dealt with by two to four vacuum chambers.
[0052]
In each embodiment, the load lock device is simplified by using one roughing pump 22, but an independent roughing pump may be connected to each vacuum chamber.
[0053]
Since the pressure fluctuation width in each vacuum chamber is small, it is possible to prevent soaring dust that causes harmful particles and protect the processing target from dust.
[0054]
When the vacuum chamber 2 is vented to atmospheric pressure, the flow rate of the vent gas is adjusted by an orifice variable valve (not shown) provided in the middle of the vent gas line to control the time and speed of the pressure change. is there.
[0055]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the load lock apparatus of this invention and the conveyance method, the tact time in conveyance of a processing target object can be shortened.
[0056]
Then, the time required for exhausting or venting in each vacuum chamber can be reduced, and the tact time in transporting the processing object can be reduced.
[0057]
Furthermore, since the pressure fluctuation in each vacuum chamber is reduced, as described above, the time required for exhausting or venting in each vacuum chamber can be shortened, and not only can the tact time in transporting the processing target be reduced, but also the dust rises. Prevention and high processing quality.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an example of a load lock device in which a method of the present invention is used.
FIGS. 2A to 2D are diagrams illustrating each step of the method of the present invention.
FIG. 3 is a graph of exhaust characteristics according to the embodiment of the present invention.
FIG. 4 is a configuration diagram of a load lock device.
FIG. 5 is a configuration diagram of another load lock device.
FIG. 6 is a configuration diagram of still another load lock device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Load lock device 2, 3, 4 Vacuum chamber 5 Platform 6 Loading chamber 7, 8, 9, 10, 11 Gate valve 12 Sputtering chamber 13 Communication pipe 14 Pressure exchange valve 15 Orifice variable valve 16 Vent valve 17 Vent piping 18, 19 Roughing valves 20, 21 Roughing pipes 22 Roughing pumps 23 Main valves 24 High vacuum pumps 25, 25a, 25b, 25c Support jigs

Claims (1)

A plurality of vacuum chambers are provided in series so that the processing object can be transferred from one adjacent chamber to the other chamber when the gate valve is opened via a gate valve between the adjacent chambers. A load lock device is connected to a processing object loading portion of a vacuum processing device, and the method for transporting the processing object to the vacuum processing device via the load lock device,
Among the plurality of vacuum chambers, the vacuum chamber closest to the atmospheric pressure side is vented to the atmospheric pressure, and the vacuum chamber on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side is roughly exhausted,
After opening the partition on the atmospheric pressure side of the vacuum chamber closest to the atmospheric pressure side and carrying the object to be processed, the partition is closed to make the vacuum chamber airtight,
The vacuum chamber closest to the atmospheric pressure side is connected to the vacuum chamber closest to the atmospheric pressure side and the vacuum chamber on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side through a communication pipe. While evacuating the chamber, venting the vacuum chamber on the vacuum processing device side adjacent to the vacuum chamber closest to the atmospheric pressure side,
After the pressures of the two vacuum chambers become the same, the communication between the two vacuum chambers via the communication pipe is cut off, and the partition between the two vacuum chambers is opened, so that the object to be processed is adjacent to the adjacent one. Conveyed into the vacuum chamber on the vacuum processing device side, close the partition,
Subsequently, the vacuum chamber closest to the atmospheric pressure side is vented to atmospheric pressure, and the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side is connected to the next vacuum processing apparatus side. Rough exhaust to the same pressure as the vacuum chamber of
After the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side and the adjacent vacuum chamber on the next vacuum processing apparatus side have the same pressure, the vacuum closest to the atmospheric pressure side The roughing from the vacuum chamber on the vacuum processing apparatus side adjacent to the chamber is stopped, and the vacuum chamber on the vacuum processing apparatus side adjacent to the vacuum chamber closest to the atmospheric pressure side and the next vacuum processing apparatus side adjacent to the vacuum processing apparatus side are stopped. A partition between the vacuum chamber is opened, the object to be processed is transported into the vacuum chamber on the side of the next vacuum processing apparatus adjacent to the vacuum chamber, and the partition is closed. Method.

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