JP2004134142A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable to obtain enough spring force by decreasing a displacement volume of an elastic support part of a contact and an arm part to a positioning pedestal at mounting of an IC package and increasing the displacement volume of the contact for pushing up the positioning pedestal to augment spring reaction force at a free state. <P>SOLUTION: Of the IC socket equipped a socket main body and a contact on which the IC package is mounted, the contact is provided with an elastic support part extended from a terminal contact part at a tip, which gets engaged with an underside of the positioning pedestal to support it. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC socket in which a semiconductor device such as an IC package is used, and in particular, omits a coil spring for elastically supporting a positioning pedestal on which the IC package is mounted, and contacts and supports an IC lead of the IC package. The present invention relates to an IC socket in which a mechanism for elastically supporting a positioning pedestal is added to the tip of a contact to be made.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there has been known a cover-type IC socket with a positioning pedestal which is mounted on a socket body of an IC socket and is held by being pressed by a pressing mechanism.
[0003]
FIGS. 12 to 14 show an example of a conventional IC socket. FIG. 12 is a central vertical sectional view showing a state where a cover member of the conventional IC socket is closed. FIG. FIG. 14 is an enlarged partial view of the contact portion, and FIG. 14 is a central longitudinal sectional view of the conventional IC socket when the cover member is opened.
[0004]
As shown in the figure, a conventional IC socket 1000 includes a socket body 1002, a cover member 1003 pivotally supported on one side of the socket body 1002, and a pressing portion 1004 provided at the center of the cover member 1003. A plurality of contacts 1005 provided in the socket body 1002; a latch mechanism 1006 provided on the other side of the cover member 1003 so as to engage and disengage the cover member 1003 with the socket body 1002; And a positioning pedestal 1007 on which the package 1010 is placed.
[0005]
In such a conventional IC socket 1000, the positioning pedestal 1007 is elastically supported by a plurality of coil springs 1013. The socket body 1002, the cover member 1003, the pressing portion 1004, the latch mechanism 1006, the positioning pedestal 1007, and the like are made of, for example, a suitable electrically insulating synthetic resin material. Further, around the upper surface of the positioning pedestal 1007, there is provided a dam portion 1009 projecting upward so as to partition and form an IC package mounting portion 1008 for mounting the IC package 1010.
[0006]
In such a conventional IC socket 1000, the socket body 1002 has a box shape having a bottom portion 1012 forming a substrate portion. Also, a plurality of coil springs 1013 are arranged on a bottom portion 1012 which is a substrate of the socket body 1002 so as to support a positioning pedestal 1007 for placing and mounting the IC package 1010 at a central portion. . Further, a plurality of contacts 1005 are provided, for example, aligned in four directions, and the external terminals 1011 of the IC package 1010 are placed and supported on the terminal contact portions 1016 of the contacts 1005. Is configured.
[0007]
As described above, in the conventional IC socket 1000, the contacts 1005 arranged in the socket body 1002 are formed in a substantially U-shaped curved shape so as to elastically support the IC package 1100 together with the positioning pedestal 1007. Each of the contacts 1005 has a fixing portion 1014 attached to the bottom 1012 of the socket body 1002 of one of the U-shaped legs, an elastically deformable curved portion 1015 which is bent from the fixing portion 1014 into a U-shape, A terminal contact portion 1016 for mounting and supporting an external terminal 1011 such as an IC lead of an IC package 1010 formed at a tip portion of the other leg is formed. Further, the contact 1005 is fixed to a bottom portion 1012 which is a substrate portion of the socket body 1002 at a root portion of the terminal pin 1018 protruding downward from the fixing portion 1014. The contact 1005 is formed so that a terminal pin 1018 protruding downward can be inserted and mounted in a terminal hole of a printed circuit board or a test board. The contact 1005 is formed from a thin conductive metal sheet material by pressing or the like. Has been.
[0008]
On one side of the socket body 1002, a cover member 1003 is pivotably supported. A latch mechanism 1006 is provided on the other side of the cover member 1003 so that the cover member 1003 can be latched and stopped by the socket body 1002 (for example, see Patent Document 1).
[0009]
[Patent Document 1]
Utility Model Registration No. 2532718 (Page 1-2, FIG. 3)
[0010]
[Problems to be solved by the invention]
However, in such a conventional cover-type IC socket 1000 with a positioning base 1007 to which an IC package 1010 or the like as an electric component is mounted, a cover member 1003 is pivotally supported on one side of the socket body 1002. Have been. Further, the IC socket 1000 elastically supports the positioning pedestal 1007 to which the IC package 1010 is mounted by a plurality of coil springs 1013 and the like, and positions the IC package 1010 by the positioning pedestal 1007. Then, since the positioning pedestal 1007 needs to move when pressed thereafter, the bottom surface of the positioning pedestal 1007 is pushed up by the coil spring 1013 in the movable space.
[0011]
Therefore, in such a conventional IC socket 1000, when the number of contacts 1005 increases, the frictional force between the contacts 1005 and the partition of the positioning pedestal 1007 increases in proportion to the number of contacts 1005. Also need to be proportionally increased. As a result, there is a problem that the IC lead 1011 of the IC package 1010 is bent by the strong force of the coil spring 1013. In addition, the use of the coil spring 1013 increases the number of parts, and as a result, there are problems such as an increase in the number of assembly steps and an increase in product cost.
[0012]
Accordingly, an object of the present invention is to solve such problems in the related art, when the IC package is mounted, the amount of displacement of the contact to the positioning pedestal and the spring reaction force are small, and in the free state, the positioning pedestal is pushed. An object of the present invention is to provide an IC socket capable of obtaining a sufficient spring force by increasing the amount of displacement of a contact to be raised to increase a spring reaction force.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, an IC socket according to the present invention is an IC socket having a socket body, a positioning table on which an IC package is mounted, and a contact connected to the IC package. And an elastic supporting portion extending from the terminal contact portion and engaging with and supporting the lower surface of the positioning pedestal.
[0014]
Also, in the IC socket of the present invention, the contact may include, in addition to the terminal contact portion and the elastic support portion, a fixed portion attached to the socket body, and the terminal contact portion extending from the fixed portion and formed at a tip. And an arm portion extending from the terminal contact portion, wherein the elastic support portion is formed at a tip of the arm portion.
[0015]
Further, the IC socket according to the present invention is characterized in that the contact has a small displacement amount of the elastic support portion and the arm portion when the positioning pedestal is displaced, and a large displacement amount in a free state to increase the spring reaction force. And
[0016]
Still further, the IC socket of the present invention has a cover member rotatably supported on one side of the socket body, and a latch mechanism engaged with the socket body is provided on the other side of the cover member. In addition, a pressing portion is formed in a central portion.
[0017]
The IC socket according to the present invention is characterized in that the latch mechanism is provided on the other side of the socket body and is engaged with the cover member.
[0018]
Further, the IC socket according to the present invention is characterized in that a latch mechanism which is engaged with the socket body is provided on both sides of the cover member.
[0019]
Further, the IC socket according to the present invention is characterized in that a latch mechanism which is engaged with the cover member is provided on both sides of the socket body.
[0020]
Furthermore, the IC socket of the present invention has a socket main body, and a contact in which an elastic supporting portion extending from a terminal contact portion at the tip connected to the IC package engages with and supports the lower surface of the positioning pedestal. The IC package is mounted on the positioning pedestal without a cover member.
[0021]
Other objects, features and advantages of the present invention will be apparent from the following detailed description of embodiments of the present invention illustrated in the accompanying drawings.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
(Example 1)
1 to 7 are views showing an IC socket according to a first embodiment of the present invention. FIG. 1 is a central longitudinal sectional view showing the IC socket of the present invention when an IC package is mounted and a cover member is closed. FIG. 2 is an enlarged partial view of a tip portion of the contact of the IC socket of the present invention in FIG. 1, and FIG. 3 is a central longitudinal sectional view when the cover member of the IC socket of the present invention in FIG. 1 is opened. FIG. 3 is an enlarged partial view of the tip portion of the contact of the IC socket of the present invention in FIG. 3, and FIGS. 5 and 6 show the state in which the force of the tip portion of the contact acts when the cover member of the IC socket of the present invention is opened. FIG. 7 is a front view showing one of the contacts of the IC socket according to the present invention.
[0023]
As shown in FIG. 1, an IC socket 1 according to the present invention includes a fixed socket body 2, a cover member 3 pivotally supported on one side of the socket body 2, and a center of the cover member 3. The pressing portion 4 provided, the plurality of contacts 5 provided in the socket body 2, and the cover member 3 are provided on the other side of the cover member 3 so as to be detachably engaged with the socket body 2. It has a latch mechanism 6 and a positioning pedestal 7 on which the IC package 10 is placed. Further, it is preferable that the socket body 2, the cover member 3, the pressing portion 4, the latch mechanism 6, the positioning pedestal 7, and the like are made of, for example, a suitable electrically insulating synthetic resin material. Further, a dam portion 9 protruding upward is provided in a rectangular frame shape around the upper surface of the positioning pedestal 7 so as to partition and form an IC package mounting portion 8 on which the IC package 10 is mounted. I have.
[0024]
In such an IC socket 1 of the present invention, the socket body 2 has a box shape with a bottom portion 12 forming a substrate portion. Further, in the IC socket 1 of the present invention, a plurality of contacts 5 are arranged in the socket body 2 so as to support a positioning pedestal 7 for placing and mounting the IC package 10 at a central portion. ing. These contacts 5 are configured such that the terminal contact portions 16 are in contact with and support the external terminals 11 of the IC package 10. Further, the contacts 5 are arranged such that the positioning pedestal 7 is supported by an elastic support portion 17 formed at a tip end of an arm portion 19 provided to extend from the terminal contact portion 16. Therefore, the contact 5 is configured such that the positioning pedestal 7 is mounted on the elastic supporting portion 17, and the IC package 10 is mounted and supported on the positioning pedestal 7.
[0025]
The contacts 5 arranged in the socket body 2 as described above are formed in a substantially U-shaped curve so as to elastically support the IC package 10 together with the positioning pedestal 7. Each of the contacts 5 includes a fixing portion 14 attached to the bottom 12 of the socket body 2 of one of the U-shaped legs, an elastically deformable curved portion 15 that is bent from the fixing portion 14 into a U-shape, and a U-shaped curved portion. A terminal contact portion 16 for mounting and supporting an external terminal 11 such as an IC lead of the IC package 10 formed at the tip of the other leg of the portion 15, and an arm portion 19 extending from the terminal contact portion 16. An elastic support portion 17 formed at the tip portion and engaged with and supported by the lower surface of the positioning pedestal 7 to which the IC package 10 is mounted, and a terminal pin 18 protruding downward from the fixed portion 14 are provided. Therefore, the contact 5 is fixed to the bottom 12, which is the board portion of the socket body 2, at the base of the terminal pin 18 protruding from the fixing portion 14. Further, the contact 5 is formed so that the terminal pin 18 can be inserted into a terminal hole of a printed circuit board or a test board and can be mounted. The contact 5 is formed by punching or pressing a thin metal sheet having good conductivity. Are made.
[0026]
The elastic support portion 17 supporting the positioning pedestal 7 is formed at the tip end of an arm portion 19 extending from the terminal contact portion 16 of the contact 5, and is provided at the arm portion 19 so as to be elastically displaceable. In the illustrated contact 5, the terminal pins 18 extending from the fixing portion 14 with respect to the socket body 2 are formed such that the mounting positions where the terminal pins 18 of the adjacent contacts 5 protrude are shifted from each other. I have. When the mounting positions of the terminal pins 18 of the adjacent contacts 5 are shifted from each other, the strength of the mounting portion of the substrate portion of the socket body 2 with respect to the contacts 5 can be sufficiently maintained. It is more suitable for
[0027]
A bracket 20 for pivotally supporting the cover member 3 is provided on one side of the socket body 2 so that the cover member 3 can be pivoted to the socket body 2 by, for example, a pin 21. Supported. Further, a latch protrusion 22 for the latch mechanism 6 is provided on the other side of the socket body 3. Furthermore, the latch projection 22 for the latch mechanism 6 is formed so that the claw 24 of the latch lever 23 of the latch mechanism 6 is locked.
[0028]
Such a latch mechanism 6 has a latch lever 23 and an operation lever 25. The latch mechanism 6 is formed such that the claw portion 24 of the latch lever 23 is operated so as to be locked to the projection 22 of the socket body 2 by operating the operation lever portion 25. Furthermore, the latch lever 23 of such a latch mechanism 6 is formed integrally with the operation lever portion 25, and is rotatably attached to the bracket portion 26 of the cover member 3 by a pin 27. The latch lever 23 is elastically biased by a suitable spring member (not shown) such as a torsion spring in a direction in which the claw portion 24 is locked to the latching projection 22 of the socket body 2. It is suitable.
[0029]
In the thus configured IC socket 1 of the present invention, the IC package 10 is mounted on the positioning pedestal 7 of the socket body 2, the cover member 3 is closed, the latch mechanism 6 is locked, and the IC package 1 is The state where 10 is pressed is shown in FIGS. 1 and 2.
[0030]
Therefore, as shown in FIG. 1, the IC socket 1 of the present invention has the IC package 10 placed on the positioning pedestal 7, the cover member 3 is closed, the latch mechanism 6 is locked, and On the other hand, the cover member 3 is closed. In this state, the IC package 10 is mounted on the positioning pedestal 7, and the external terminals 11 are placed on the terminal contact portions 16 of the contacts 5 and are pressed by the pressing portions 4. Accordingly, the contact 5 has an upper end portion of the elastic support portion 17 abutting on the bottom surface of the positioning pedestal 7, and the arm portion 19 and the elastic support portion 17 are elastically displaced. It is small.
[0031]
Thus, in the IC socket 1 of the present invention, when the IC package 10 in which the cover member 3 is closed with respect to the socket body 2 is mounted, the reaction force of the spring at the tip of the contact 5 is small and weak. For this reason, the influence of the contact force on the external terminals 11 as the IC leads of the IC package 10 is reduced and reduced.
[0032]
FIG. 3 shows an open state of the cover member 3 when the IC package 10 is mounted on the IC socket 1 of the present invention configured as described above. Further, the state of the contact 5 at this time is enlarged and partially shown in FIG.
[0033]
As shown in FIGS. 3 and 4, in the illustrated IC socket 1 of the present invention, the cover member 3 is opened in a state where the cover member 3 is substantially perpendicular to the socket body 2. Then, the IC package 10 is mounted on the positioning pedestal 7, and the external terminals 11, which are the IC leads of the IC package 10, are positioned on the terminal contact portions 16 of the contacts 5. Thereby, the contact 5 has the upper end of the elastic support portion 17 in contact with the bottom surface of the positioning pedestal 7.
[0034]
In such a free state, the IC package 10 is placed on the positioning pedestal 7, and the terminal contact portions 16 of the contacts 5 are free. Therefore, the elastic support portion 17 of the contact 5 supports the positioning pedestal 7 with a large displacement amount as shown in FIG. As described above, the contact 5 elastically supports the positioning pedestal 7 via the elastic supporting portion 17 by the spring action of the arm 19 at the distal end portion, and pushes up the positioning pedestal 7. Accordingly, the amount of displacement of the elastic support portion 17 of the contact 5 is large as shown in FIG.
[0035]
FIGS. 5 and 6 are views showing the free state of the IC socket 1 according to the present invention before and after the contact 5 and the positioning pedestal 7 when the IC package 10 is removed. As shown in the figure, the reaction force of the contact 5 to the positioning pedestal 7 that has been weakened when the IC package is mounted can be reduced to a sufficient force to push up the positioning pedestal 7 by opening the cover member 3 and removing the IC package 10. The displacement amount is still small, as shown in FIG. However, at this time, since the terminal contact portion 16 of the contact 5 gradually returns to the free state, the displacement of the elastic support portion 17 and the arm portion 19 that push up the positioning pedestal 7 increases, and the reaction force increases. Gradually increases, and a sufficient reaction force can be obtained as shown in FIG.
[0036]
In the IC socket 1 of the present invention configured as described above, the elastic support portion 17 that engages with the lower surface of the positioning base 7 on which the IC package 10 is mounted extends from the terminal contact portion 16 of the contact 5. With the provision of the arm portion 19 to be provided, a function of pushing up the positioning pedestal 7 by giving a weak spring performance to the tip portion of the contact 5 can be added. Therefore, the spring mechanism configured by the elastic support portion 17 and the arm portion 19 of the contact 5 can replace the coil spring that elastically supports the positioning pedestal 7.
[0037]
Therefore, with the IC socket 1 of the present invention configured as described above, when the IC package 10 is mounted and pressed, the force for pushing up the positioning pedestal 7 by displacing the terminal contact portion 16 of the contact 5 is reduced. As a result, as shown in FIG. 2, the amount of displacement of the elastic support portion 17 in contact with the elastic support portion 17 is reduced, and the bending of the external terminal 11, which is the IC lead when the IC package 10 is mounted, is less likely to occur. Furthermore, in the IC socket 1 of the present invention, in the free state, the amount of displacement of the contact 5 that pushes up the positioning pedestal 7 increases, the spring reaction force increases, and a sufficient spring force can be obtained. Further, with such a configuration, a coil spring for elastically supporting the positioning pedestal 7 is not required, so that the number of parts can be reduced, and the product cost and the assembly process can be reduced.
[0038]
Moreover, with such a configuration, the elastic support portion 17 and the arm portion 19 can be achieved by only simple means of providing the contact 5 with only the simple structure, and can be manufactured with a simple structure and at low cost. Further, effects such as the number of parts can be reduced can be obtained.
[0039]
The IC package used in such an IC socket of the present invention is an IC package such as a quad flat package or a small outline package, but is not limited to such an IC package. It is needless to say that an IC package of the same type can be used.
[0040]
(Example 2)
FIG. 8 is a central longitudinal sectional view when the IC package is mounted on the IC socket and the cover member is closed according to the second embodiment of the present invention.
[0041]
As shown in the figure, the IC socket 30 according to the second embodiment of the present invention has a latch mechanism 36 provided on the fixed side socket body 32 and a latch claw 54 of the latch mechanism 36 on the socket body 32 side. Is different from that in the first embodiment in that it is configured to be engaged with or disengaged from the engaging projection 52 on the cover member 33 side. Is substantially the same as that in the first embodiment.
[0042]
As shown, the IC socket 30 of the present invention includes a fixed socket body 32, a cover member 33 pivotally supported on one side of the socket body 32 by a pin 51, and a cover member 33. In the center, a pressing portion 34 provided in a rectangular frame shape, a plurality of contacts 35 provided in the socket body 32, and a cover member 33 are detachably engaged with the socket body 32 so as to be engaged therewith. It has a latch mechanism 36 provided on the corresponding other side of the socket body 32 so as to be engaged with the other side of the cover member 33, and a positioning pedestal 37 on which the IC package 40 is mounted.
[0043]
A dam portion 39 projecting upward is provided in a rectangular frame shape around the upper surface of the positioning pedestal 37, and defines an IC package mounting portion 38 on which the IC package 40 is mounted. .
[0044]
In such an IC socket 30 of the present invention, the socket main body 32 has a box shape having a bottom portion 42 forming a substrate portion. Further, the socket body 32 has a plurality of contacts 35 aligned in four directions in the socket body 32 so as to support a positioning pedestal 37 for placing and mounting the IC package 40 at a central portion. Are located. Each contact 35 is formed such that the terminal contact portion 46 contacts and supports the external terminal 41 of the IC package 40. Further, the contact 35 is provided such that an arm portion 49 extends from the terminal contact portion 46, and an elastic support portion 47 is formed at a tip end of the arm portion 49. The contacts 35 are arranged so that the positioning pedestal 37 is elastically supported. Therefore, the contact 35 has the positioning pedestal 37 mounted on the elastic support portion 47, and the IC package 40 is configured to be mounted and supported on the positioning pedestal 37.
[0045]
As described above, the IC socket 30 according to the second embodiment of the present invention is substantially U-shaped so that the contacts 35 disposed in the socket body 32 can elastically support the IC package 40 together with the positioning pedestal 37 as shown in the figure. It is formed in a shape curved in a letter shape. That is, the contact 35 includes a substantially U-shaped fixing portion 44 of one leg attached to the bottom portion 42 of the socket body 32, a resiliently deformable curved portion 45 that curves from the fixing portion 44 into a U shape, and a U-shaped portion. A terminal contact portion 46 for mounting and supporting an external terminal 41 such as an IC lead of an IC package 40 formed at a tip portion of the other leg of the curved portion 45 of the other end, and an arm further extending from the terminal contact portion 46 An elastic support portion 47 formed at the distal end of the portion 49 and engaged with and supported by the lower surface of the positioning pedestal 37 on which the IC package 40 is mounted, and a terminal pin 48 protruding downward from the fixed portion 44 are provided. ing.
[0046]
Therefore, the contact 35 is fixed to the bottom 42, which is the board portion of the socket body 32, at the base of the terminal pin 48 protruding downward from the fixing portion 44. Further, the contact 35 is formed so that the terminal pin 48 can be inserted into a terminal hole of a printed circuit board or a test board, and can be mounted. And so on.
[0047]
The elastic support portion 47 for supporting the positioning pedestal 37 is formed at the tip end of an arm portion 49 extending from the terminal contact portion 46 of the contact 35, and is provided in the arm portion 49 so as to be elastically displaceable. In the illustrated contact 35, the terminal pins 48 extending from the fixing portion 44 with respect to the socket body 32 are attached such that the attachment positions where the terminal pins 48 of the adjacent contacts 35 project from the terminal pins 48 are displaced stepwise from each other. Is formed. In this way, by forming the mounting positions of the terminal pins 48 of the adjacent contacts 35 so as to be shifted stepwise from each other, it is possible to sufficiently maintain the strength of the mounting portion of the board portion of the socket body 32 with respect to the contacts 35. It is more suitable to be configured to be able to.
[0048]
A bracket 50 is provided on one side of the socket main body 32 for pivotally supporting the cover member 33 so that the cover member 33 can pivot on the socket main body 32 by, for example, a pin 51. Supported. Further, a latch projection 52 for the latch mechanism 36 is provided on the other side of the cover member 33. The latch projection 52 for the latch mechanism 36 is provided so that the claw 54 of the latch lever 53 of the latch mechanism 36 is locked.
[0049]
Such a latch mechanism 36 has a latch lever 53, and is formed so that the claw portion 54 of the latch lever 53 is operated so as to be able to be locked to the projection 52 of the cover member 33. . The latch lever 53 of the latch mechanism 36 is provided with an appropriate operation section, is rotatably attached to the bracket section 56 of the socket body 32 by a pin 57, and is provided with an appropriate operation section such as a torsion spring. The claw portion 54 is elastically biased by a simple spring member (not shown) in a direction in which the claw portion 54 is locked to the latching projection 52 of the cover member 33.
[0050]
As described above, in the second embodiment of the present invention, the latch lever 53 of the latch mechanism 36 is provided on the socket body 32 side, and the latch projection 52 is provided on the cover member 33 side. Different from 1. Therefore, when the cover member 33 is closed with respect to the socket body 32 at the time of closing, the latching projection 52 of the cover member 33 contacts the claw portion 54 of the latch lever 53 and pushes the latch lever 53 outward. The touch projection 52 is formed so as to be latched and locked with the claw 54.
[0051]
In the IC socket 30 of the present invention configured as described above, the IC package 40 is mounted on the positioning pedestal 37 of the socket body 32, the cover member 33 is closed, the latch mechanism 36 is locked, and the IC is pushed by the pressing portion 34. FIG. 8 shows a state where the package 40 is pressed.
[0052]
Therefore, as shown in FIG. 8, in the IC socket 30 of the present invention, the IC package 40 is placed on the positioning pedestal 37, and the cover member 33 is closed. At this time, by locking the latch mechanism 36, the cover member 33 is fixed to the socket body 32 in a closed state. In this state, the IC package 40 is mounted on the positioning pedestal 37, and the external terminals 41 are mounted on the terminal contact portions 46 of the contacts 35.
[0053]
Further, in the IC package 40, the external member terminals 41 are pressed against the terminal contact portions 46 by the pressing portions 34. Thus, the upper end of the elastic support portion 47 is in contact with the bottom surface of the positioning pedestal 37, and the arm portion 49 and the elastic support portion 47 are elastically displaced. Therefore, the amount of displacement between the arm portion 49 of the contact 35 and the elastic support portion 47 is small as is apparent from the drawing.
[0054]
Thus, in the IC socket 30 of the present invention, the reaction force of the spring at the tip of the contact 35 when mounting the IC package 40 in which the cover member 33 is closed with respect to the socket body 32 is small and weak. For this reason, the influence of the contact force on the external terminals 41 as the IC leads of the IC package 40 is reduced and reduced. Therefore, with such a configuration, a coil spring for elastically supporting the positioning pedestal 37 is not required, so that the number of components can be reduced, and the product cost and the assembly process can be reduced.
[0055]
(Example 3)
FIG. 9 is a central longitudinal sectional view when the IC package is mounted on the IC socket and the cover member is closed according to the third embodiment of the present invention.
[0056]
As shown, the IC socket 60 according to the third embodiment of the present invention has a latch mechanism 66 provided on both sides of the movable cover member 63, and a latch claw 82 of a latch engagement portion of the latch mechanism 66. Is configured to engage or disengage with the latching projection 82 of the socket body 62, and attach or remove the cover member 63. The second embodiment differs from the first and second embodiments, and other details are substantially the same as the first and second embodiments.
[0057]
As shown in FIG. 9, the IC socket 60 of the present invention includes a fixed socket body 62, a cover member 63 that can be detachably attached to the socket body 62 so as to be freely separated from the socket body 62, At the center of the cover member 63, a pressing portion 64 provided in a square frame shape, a plurality of contacts 65 provided in the socket body 62, and the cover member 63 are detachably engaged with the socket body 62. Thus, a pair of latch mechanisms 66 provided on both sides of the cover member 63 and a positioning pedestal 67 on which the IC package 70 is placed are provided.
[0058]
A dam portion 69 projecting upward is provided in a square frame shape around the upper surface of the positioning pedestal 67, and forms an IC package mounting portion 68 on which the IC package 70 is mounted.
[0059]
In such an IC socket 60 of the present invention, the socket body 62 has a box shape with a bottom 62 forming a substrate portion. A plurality of contacts 65 are aligned in the socket body 62 in four directions so as to support a positioning pedestal 67 for placing and mounting the IC package 70 on such a socket body 62 at a central portion. Are located. Each contact 65 is formed such that the terminal contact portion 76 is in contact with the external terminal 71 of the IC package 70 to elastically support it. Further, the contacts 65 are arranged such that the positioning pedestal 67 is supported by an elastic support portion 77 formed at the tip of an arm portion 79 provided to extend from the terminal contact portion 76. Therefore, the contact 65 is configured such that the positioning pedestal 67 is mounted on the elastic supporting portion 77, and the IC package 70 is mounted and supported on the positioning pedestal 67.
[0060]
As described above, the contacts 65 arranged in the socket main body 62 are formed in a substantially U-shaped curve so as to elastically support the IC package 70 together with the positioning pedestal 67. That is, the contact 65 includes a fixing portion 74 attached to the bottom 72 of the socket body 62 of one of the U-shaped legs, a resiliently deformable curved portion 75 bent from the fixing portion 74 into a U-shape, and a U-shaped A terminal contact portion 76 for mounting and supporting an external terminal 71 such as an IC lead of an IC package 70 formed at the tip of the other leg of the curved portion 75, and an arm portion 79 extending from the terminal contact portion 76. An elastic support portion 77 is formed at the distal end portion of the positioning support 67 for engaging and supporting the lower surface of the positioning pedestal 67 on which the IC package 70 is mounted, and a terminal pin 78 protruding downward from the fixing portion 74 is provided. . Therefore, the contact 65 is fixed to the bottom portion 72, which is the substrate portion of the socket body 62, at the base of the terminal pin 78 protruding from the fixing portion 74. Further, the contact 65 is formed so that the terminal pin 78 can be inserted into a terminal hole of a printed circuit board or a test board and can be mounted. The contact 65 is formed by punching or pressing a metal sheet having good conductivity. Are made.
[0061]
The elastic support portion 77 that supports the positioning pedestal 67 is formed at the tip of an arm portion 79 extending from the terminal contact portion 76 of the contact 65, and is provided at the arm portion 79 so as to be elastically displaceable. In the illustrated contact 65, the terminal pin 78 extending from the fixing portion 74 to the socket body 62 is formed such that the mounting position where the terminal pin 78 of the adjacent contact 65 protrudes is shifted from each other. I have. When the mounting positions of the terminal pins 78 of the adjacent contacts 65 are shifted from each other, the strength of the mounting portion of the board portion of the socket body 62 with respect to the contacts 65 can be sufficiently maintained. It is more suitable for
[0062]
On both sides of the cover member 63, a pair of latch mechanisms 66 for mounting and removing the cover member 63 on the socket body 62 are provided. The cover member 63 is provided with, for example, a pressing portion 64 for pressing the external terminal 71 of the IC package 70 mounted on the positioning pedestal 67 of the socket body 62. Further, latch projections 82 are provided on both sides of the socket main body 62 for latching the latch claws 84 of the latch lever 83 of the latch mechanism 66 provided on both sides of the cover member 63. Such a latch mechanism 66 has a latch lever 83 and an operation lever portion 85, and the operation of the operation lever portion 85 causes the claw portion 84 of the latch lever 83 to move with respect to the latch protrusion 82 of the socket body 62. It is formed so that it can be operated to be locked. Further, the latch lever 83 of the latch mechanism 66 is formed integrally with the operation lever portion 85, and is rotatably mounted on both sides of the cover member 63 by pins 87, respectively. It is preferable that the claw portion 84 is elastically urged by such a suitable spring member (not shown) in a direction in which the claw portion 84 is locked to the latching projection 82 of the socket body 62.
[0063]
As described above, in the third embodiment of the present invention, the latch lever 83 of the latch mechanism 66 is provided on both sides of the cover member 63, and the latch protrusions 82 are provided on both sides of the socket body 62. This is different from the first and second embodiments. Therefore, at the time of closing, if the cover member 63 is placed on the socket body 62 and the latch lever 83 is operated, the claw portion 84 of the latch lever 83 on the cover member 63 side is brought into contact with the latch protrusion 82 of the socket body 62 and the latch. It is formed to be latched by engaging and meshing with each other.
[0064]
In the IC socket 60 of the present invention configured as described above, the IC package 70 is mounted and mounted on the positioning pedestal 67 of the socket body 62, the cover member 63 is mounted and closed, and the latch mechanism 66 is locked. The state where the IC package 70 is pressed by the pressing portion 64 is illustrated.
[0065]
Therefore, as shown in FIG. 9, the IC socket 60 of the present invention has the IC package 70 mounted on the positioning pedestal 67, the cover member 63 is closed, the latch mechanism 66 is locked, and the The cover member 63 is closed. In this state, the IC package 70 is mounted on the positioning pedestal 67, the external terminal 71 is placed on the terminal contact portion 76 of the contact 65, and is pressed by the pressing portion 64, and The upper end is in contact with the bottom surface of the positioning pedestal 67, and the arm 79 and the elastic support 77 are elastically displaced. The amount of displacement is small as shown in the figure. As described above, in the IC socket 60 of the present invention, the reaction force of the spring at the tip of the contact 65 at the time of mounting the IC package 70 in which the cover member 63 is closed with respect to the socket body 62 is small and weak. The influence of the contact force on the external terminals 71 as the IC leads of the package 70 is reduced and reduced.
[0066]
Therefore, with this configuration, a coil spring for elastically supporting the positioning pedestal 67 is not required, so that the number of parts can be reduced, and the product cost and the assembly process can be reduced.
[0067]
(Example 4)
FIG. 10 is a central longitudinal sectional view when the IC package is mounted on the IC socket and the cover member is closed according to the fourth embodiment of the present invention.
[0068]
As shown, the IC socket 90 according to the fourth embodiment of the present invention has a latch mechanism 96 provided on both sides of a fixed socket body 92, and a latch claw 114 of a latch engagement portion of the latch mechanism 96. Are respectively engaged with or released from the latch projections 112 on both sides of the cover member 93, so that the cover member 93 is attached or detached. The third embodiment is different from the first, second, and third embodiments, and other details are substantially the same as the first, second, and third embodiments.
[0069]
As shown in FIG. 10, in the IC socket 90 of the present invention, latch mechanisms 96 are provided on both sides of a fixed socket body 92, respectively. Accordingly, the cover member 93 attached to the socket body 92 can be attached and fixed by the pair of latch mechanisms 96.
[0070]
As shown, the IC socket 90 according to the fourth embodiment of the present invention includes a fixed socket body 92, a cover member 93 mounted on the socket body 92, and a center of the cover member 93. A pressing portion 94 provided in a rectangular frame shape, a plurality of contacts 95 provided in the socket main body 92, and a socket main body 92 so that the cover member 93 is detachably engaged with the socket main body 92. It has a pair of latch mechanisms 96 provided on both sides, and a positioning pedestal 97 on which the IC package 100 is placed.
[0071]
A dam portion 99 projecting upward is provided in a square frame shape around the upper surface of the positioning pedestal 97 so as to partition and form an IC package mounting portion 98 on which the IC package 100 is mounted. .
[0072]
In such an IC socket 90 of the present invention, the socket body 92 has a box shape with a bottom 102 forming a substrate portion. Further, a plurality of contacts 95 are arranged in the socket body 92 in four directions in the socket body 92 so as to support a positioning pedestal 97 for placing and mounting the IC package 100 at a central portion. Are located. Each contact 95 is formed such that the terminal contact portion 106 is in contact with and supports the external terminal 101 of the IC package 100. Further, the contacts 95 are arranged such that the positioning pedestal 97 is supported by an elastic support portion 107 formed at a tip end of an arm portion 109 provided to extend from the terminal contact portion 106. Therefore, the contact 95 has a configuration in which the positioning pedestal 7 is mounted on the elastic supporting portion 107, and the IC package 100 is mounted and supported on the positioning pedestal 97.
[0073]
In this manner, the contacts 95 arranged in the socket body 92 are formed in a substantially U-shaped curved shape so as to elastically support the IC package 100 together with the positioning pedestal 97 as shown in the figure. That is, a fixing portion 104 attached to the bottom portion 102 of the socket body 92 of one of the U-shaped legs, a resiliently deformable curved portion 105 bent from the fixing portion 104 into a U-shape, and a U-shaped curved portion 105 A terminal contact portion 106 for mounting and supporting an external terminal 101 such as an IC lead of the IC package 100 formed at a tip portion of the other leg, and a tip portion of an arm portion 109 extending from the terminal contact portion 106. An elastic support portion 107 which is formed and engages with and supports the lower surface of the positioning pedestal 97 on which the IC package 100 is mounted is provided, and a terminal pin 108 which protrudes downward from the fixing portion 104 is provided. Accordingly, the contact 95 is fixed to the bottom portion 102 which is a substrate portion of the socket body 92 at the base portion of the terminal pin 108 protruding from the fixing portion 104, and the terminal pin 108 is connected to a terminal hole of a printed board or a test board. It is formed so that it can be inserted and mounted, and is made from a sheet metal material having good conductivity by punching or pressing.
[0074]
The elastic support portion 107 supporting the positioning pedestal 97 is formed at the tip of an arm portion 109 extending from the terminal contact portion 106 of the contact 95, and is provided in the arm portion 109 so as to be elastically displaceable. In the illustrated contact 95, the terminal pin 108 extending from the fixing portion 104 to the socket main body 92 is formed such that the mounting position where the terminal pin 108 of the adjacent contact 95 protrudes is shifted from each other. I have. In this manner, by forming the mounting positions of the terminal pins 108 of the adjacent contacts 95 so as to be shifted from each other, the strength of the mounting portion of the board portion of the socket body 92 with respect to the contacts 95 can be sufficiently maintained. It is more suitable to be configured.
[0075]
A bracket 116 for pivotally supporting the cover member 93 is provided on one side of the socket body 92, and the latch lever 113 of the latch mechanism 96 is connected to the socket body 92 by, for example, a pin 117. It is pivotally supported. Further, latch protrusions 112 for the latch mechanism 96 are provided on both sides of the cover member 93. Further, the latch protrusion 112 for the latch mechanism 96 is formed such that the claw 114 of the latch lever 113 of the latch mechanism 96 is locked. Such a latch mechanism 96 has a latch lever 113 and an operation lever portion 115, and the operation of the operation lever portion 115 causes the claw portion 114 of the latch lever 113 to move with respect to the projection 112 of the cover member 93. It is formed so that it can be operated to be locked. Furthermore, the latch lever 113 of such a latch mechanism 96 is formed integrally with the operation lever portion 115, and is rotatably attached to the bracket portion 116 of the socket main body 92 by a pin 117, and is provided with a torsion spring. It is preferable that the claw portion 114 is elastically urged in a direction in which the claw portion 114 is locked to the latch protrusion 112 of the cover member 93 by a suitable spring member (not shown) such as described above.
[0076]
In the IC socket 90 of the present invention thus configured, the IC package 100 is mounted on the positioning pedestal 97 of the socket main body 92, the cover member 93 is placed and closed, the latch mechanism 96 is locked, and the pressing portion 94 FIG. 10 shows a state in which the IC package 100 is pressed.
[0077]
Therefore, as shown in FIG. 10, the IC socket 90 of the present invention has the IC package 100 placed on the positioning pedestal 97, the cover member 93 is closed, the latch mechanism 96 is locked, and Cover member 93 is closed. In this state, the IC package 100 is mounted on the positioning pedestal 97, and the external terminals 101 are placed on the terminal contact portions 106 of the contacts 95 and pressed by the pressing portions 94. Therefore, the upper end of the elastic support 107 is in contact with the bottom surface of the positioning pedestal 97, and the arm 109 and the elastic support 107 are elastically displaced. The displacement in this case is small as shown.
[0078]
As described above, in the IC socket 90 of the present invention, since the cover member 93 is closed with respect to the socket body 92 and the reaction force of the spring at the tip of the contact 95 when the IC package 100 is mounted is small and weak. The effect of the contact force on the external terminals 101, which are the IC leads of the IC package 100, is reduced and reduced.
[0079]
Therefore, with this configuration, a coil spring for elastically supporting the positioning pedestal 67 is not required, so that the number of parts can be reduced, and the product cost and the assembly process can be reduced.
[0080]
(Example 5)
FIG. 11 is a central longitudinal sectional view when an IC package is mounted on an IC socket according to the fifth embodiment of the present invention.
[0081]
As shown, the IC socket 120 in the fifth embodiment of the present invention is omitted because it has no cover member and therefore does not require a latch mechanism. This differs from the first to fourth embodiments in that there is no cover member and no latch mechanism. The socket body 122, the plurality of contacts 125 provided on the socket body 122, and the IC package 130 Is substantially the same as in the first, second, third and fourth embodiments described above.
[0082]
As shown in FIG. 11, the IC socket 120 of the present invention includes a fixed socket body 122, a plurality of contacts 125 provided in the socket body 122, and a positioning pedestal 127 on which the IC package 130 is mounted. And It is preferable that the socket body 122, the positioning pedestal 127, and the like are made of, for example, an appropriate electrically insulating synthetic resin material. A dam portion 129 projecting upward is formed in a rectangular frame shape around the upper surface of the positioning pedestal 127 so as to partition and form an IC package mounting portion 128 on which the IC package 130 is mounted. .
[0083]
In such an IC socket 120 of the present invention, the socket body 122 has a box shape with a bottom 132 forming a substrate portion. Further, a plurality of contacts 125 are arranged in the socket body 122 in four directions so as to support a positioning pedestal 127 for placing and mounting the IC package 130 at a central portion. Each contact 125 is formed at the tip of an arm 139 provided so that the terminal contact portion 136 is in contact with and supports the external terminal 131 of the IC package 130 and extends from the terminal contact portion 136. The positioning pedestals 127 are arranged so as to be supported by the elastic supports 137 thus formed. Therefore, the contact 125 has the positioning pedestal 127 mounted on the elastic support portion 137, and the IC package 130 is configured to be mounted and supported on the positioning pedestal 127.
[0084]
The contact 125 thus arranged in the socket body 122 is formed in a substantially U-shaped curved shape so as to elastically support the IC package 130 together with the positioning pedestal 127, and the U-shaped socket on one leg is formed. A fixing portion 134 attached to the bottom 132 of the main body 122, an elastically deformable curved portion 135 bent in a U-shape from the fixing portion 134, and a tip portion of the other leg of the U-shaped curved portion 135 are formed. A terminal contact portion 136 for placing and supporting an external terminal 131 such as an IC lead of the IC package 130, and an arm portion 139 extending from the terminal contact portion 136 are formed at the distal end of the IC package 130, and the IC package 130 is mounted thereon. An elastic support portion 137 that engages with and supports the lower surface of the positioning pedestal 127, and a terminal pin 13 that projects downward from the fixing portion 134. Door is provided. Therefore, the contact 125 is fixed to the bottom 132 of the socket body 122 at the base of the terminal pin 138 projecting from the fixing part 134. Further, the contact 125 is formed so that the terminal pin 138 can be inserted and mounted in a terminal hole of a printed board or a test board or the like, and is formed by punching or pressing from a thin conductive metal sheet material. Has been.
[0085]
The elastic support portion 137 that supports the positioning pedestal 127 is formed at the tip of an arm portion 139 that extends from the terminal contact portion 136 of the contact 125, and is provided at the arm portion 139 so as to be elastically displaceable. In the illustrated contact 125, the terminal pin 138 extending from the fixing portion 134 with respect to the socket body 122 is formed such that the mounting position where the terminal pin 138 of the adjacent contact 125 protrudes is shifted from each other. I have. In this manner, when the mounting positions of the terminal pins 138 of the adjacent contacts 125 are formed so as to be shifted from each other, the strength of the mounting portion of the board portion of the socket body 122 with respect to the contacts 125 can be sufficiently maintained. It is more suitable for
[0086]
FIG. 11 shows a state where the IC package 130 is mounted on the positioning pedestal 127 of the socket main body 122 in the IC socket 120 of the present invention thus configured.
[0087]
Therefore, as shown in FIG. 11, the IC socket 120 of the present invention is mounted with the IC package 130 placed on the positioning pedestal 127. In this state, the IC package 130 is mounted on the positioning pedestal 127, the external terminal 121 is mounted on the terminal contact portion 136 of the contact 125, and the upper end of the elastic support 137 is located on the bottom surface of the positioning pedestal 127. The arm 139 and the elastic support 137 are slightly elastically displaced, and the amount of displacement is small as shown in the figure.
[0088]
As described above, in the IC socket 120 of the present invention, when the IC package 130 is mounted on the positioning pedestal 127 with respect to the socket main body 122, the reaction force of the spring at the tip of the contact 125 is small and weak. The influence of the contact force on the external terminals 131 as the IC leads of the IC package 130 is reduced and reduced.
[0089]
Therefore, with such a configuration, in the IC socket 120 of the present invention, a coil spring for elastically supporting the positioning pedestal 127 is not required, and the number of parts can be reduced. Can be reduced.
[0090]
【The invention's effect】
The IC socket according to claim 1 of the present invention is an IC socket having a socket main body, a positioning base on which an IC package is mounted, and a contact, wherein the contact extends from a terminal contact portion at a tip end of the positioning base. Since it has an elastic support that engages and supports the lower surface, the amount of contact displacement and spring reaction force when mounting the IC package is small, and the external terminals, which are IC leads, are not bent. The amount is large, a sufficiently strong spring reaction force can be obtained, the coil spring can be omitted, the number of parts can be reduced, and the product cost and the assembly process can be reduced together.
[0091]
3. The IC socket according to claim 2, wherein the contact includes a fixing portion attached to the socket body, in addition to the terminal contact portion and the elastic support portion, and the terminal contact portion extending from the fixing portion to a tip. And an arm portion extending from the terminal contact portion, and the elastic support portion is formed at the tip of the arm portion. When the contact is free, the amount of displacement of the contact that pushes up the positioning pedestal increases, and the spring reaction force increases, so that a sufficient spring force can be obtained.
[0092]
In the IC socket according to a third aspect of the present invention, when the contact is displaced by the positioning pedestal, the displacement of the elastic support portion and the arm portion is small, and in the free state, the displacement is large and the spring reaction force is increased. Therefore, the positioning pedestal can be sufficiently supported by the spring function of the contact, and the coil spring can be omitted.
[0093]
The IC socket according to claim 4 of the present invention has a cover member rotatably supported on one side of the socket body, and a latch mechanism engaged with the socket body on the other side of the cover member. Since the pressing portion is provided and the pressing portion is formed at the center portion, the IC package is mounted on the positioning pedestal, pressed by the cover member, and the cover member can be firmly fixed to the socket body by the latch mechanism, The positioning pedestal can be suitably elastically supported.
[0094]
In the IC socket according to the fifth aspect of the present invention, since the latch mechanism is provided on the other side of the socket main body and is engaged with the cover member, the IC package is favorably mounted and pressed by the cover member. The latch member can firmly hold the cover member to the socket body, and can favorably elastically support the positioning pedestal.
[0095]
In the IC socket according to the sixth aspect of the present invention, since a latch mechanism is provided on both sides of the cover member so as to be engaged with the socket body, the IC package is mounted on the positioning pedestal of the socket body and covered by the cover member. Thus, the latch mechanism can be firmly held, the positioning pedestal can be suitably elastically supported, and the cover member can be easily attached and detached.
[0096]
The IC socket according to claim 7 of the present invention is provided with a latch mechanism that is engaged with the cover member on both sides of the socket body, so that the IC package is mounted on the positioning pedestal of the socket body and covered with the cover member. As a result, the positioning pedestal can be suitably elastically supported by the latch mechanism, and the cover member can be easily attached and detached.
[0097]
An IC socket according to an eighth aspect of the present invention has a socket main body and a contact in which an elastic support portion extending from a terminal contact portion at a tip end connected to the IC package engages and supports the lower surface of the positioning pedestal. Since the IC package is mounted on the positioning pedestal without the cover member, the IC package can be mounted on the positioning pedestal of the socket body, and the positioning pedestal can be suitably elastically supported.
[Brief description of the drawings]
FIG. 1 is a central longitudinal sectional view when an IC package is mounted on an IC socket and a cover member is closed according to a first embodiment of the present invention.
FIG. 2 is an enlarged partial view of a tip portion of a contact of the IC socket of the present invention in FIG. 1;
FIG. 3 is a central longitudinal sectional view of the IC socket of FIG. 1 when the cover member is opened.
4 is an enlarged partial view of a tip portion of a contact of the IC socket of the present invention in FIG. 3;
FIG. 5 is an enlarged partial view for explaining a state in which a force acts on a tip portion of the contact when the cover member of the IC socket according to the first embodiment of the present invention is opened.
FIG. 6 is an enlarged partial view for explaining a state in which a force of a tip portion of the contact acts after the cover member of the IC socket according to the present invention is opened, following FIG. 5;
FIG. 7 is a front view showing one of the contacts of the IC socket of the present invention.
FIG. 8 is a central longitudinal sectional view when an IC package is mounted on an IC socket and a cover member is closed according to a second embodiment of the present invention.
FIG. 9 is a central longitudinal sectional view when an IC package is mounted on an IC socket and a cover member is closed according to a third embodiment of the present invention.
FIG. 10 is a central longitudinal sectional view when an IC package is mounted on an IC socket and a cover member is closed according to a fourth embodiment of the present invention.
FIG. 11 is a central longitudinal sectional view when an IC package is mounted on an IC socket according to a fifth embodiment of the present invention.
FIG. 12 is a central longitudinal sectional view of a conventional IC socket with a cover member closed.
FIG. 13 is an enlarged partial view of a contact portion of the conventional IC socket of FIG.
14 is a central longitudinal sectional view of the conventional IC socket of FIG. 12 when a cover member is opened.
[Explanation of symbols]
1 IC socket
2 Socket body
3 Cover member
4 Pressing part
5 contacts
6 Latch mechanism
7 Positioning pedestal
8 IC package mounting section
9 Dam part
10 IC package
11 External terminal (IC lead)
12 bottom
14 Fixed part
15 Curved part
16 Terminal contact area
17 Elastic support
18 terminal pins
19 Arm part
20 bracket
21 pin
22 protrusion
23 Latch lever
24 claws
25 Operation lever
26 Bracket
27 pin
30 IC socket
32 socket body
33 cover member
34 Pressing part
35 contacts
36 Latch mechanism
37 Positioning pedestal
38 IC package mounting section
39 Dam
40 IC package
41 External terminal (IC lead)
42 bottom
44 Fixed part
45 Curved part
46 Terminal contact area
47 elastic support
48 terminal pins
49 Arm
50 bracket
51 pin
52 protrusion
53 Latch lever
54 claw
56 Bracket
57 pin
60 IC socket
62 Socket body
63 cover member
64 pressing part
65 contacts
66 Latch mechanism
67 Positioning pedestal
68 IC package mounting part
69 Dam
70 IC package
71 External terminal (IC lead)
72 bottom
74 fixing part
75 Curved part
76 Terminal contact area
77 elastic support
78 terminal pin
79 Arm
82 protrusion
83 Latch lever
84 claws
85 Control lever
86 bracket
87 pin
90 IC socket
92 Socket body
93 Cover member
94 Pressing part
95 contacts
96 Latch mechanism
97 Positioning pedestal
98 IC package mounting part
99 Dam
100 IC package
101 External terminal (IC lead)
102 bottom
104 fixing part
105 curved part
106 Terminal contact area
107 elastic support
108 terminal pin
109 arm
112 protrusion
113 Latch lever
114 Claw
116 Bracket
117 pin
120 IC socket
122 Socket body
125 contacts
127 Positioning pedestal
128 IC package mounting part
129 Dam
130 IC package
131 External terminal (IC lead)
132 bottom
134 fixing part
135 curved part
136 Terminal contact part
137 elastic support
138 terminal pin
139 Arm

Claims (8)

In an IC socket having a socket body, a positioning table on which an IC package is mounted, and a contact connected to the IC package, the contact extends from a terminal contact portion at a tip and engages with a lower surface of the positioning pedestal. An IC socket having an elastic support portion for supporting the IC socket. The contact includes, in addition to the terminal contact portion and the elastic support portion, a fixed portion attached to the socket body, an elastically deformable curved portion extending from the fixed portion and having the terminal contact portion formed at a tip at a tip thereof, 2. The IC socket according to claim 1, further comprising an arm extending from the terminal contact portion, wherein the elastic support is formed at a tip of the arm. 3. The IC socket according to claim 2, wherein the contact has a small displacement amount of the elastic support portion and the arm portion when the positioning pedestal is displaced, and a large displacement amount in a free state to increase a spring reaction force. . A cover member rotatably supported on one side of the socket body, a latch mechanism engaged with the socket body is provided on the other side of the cover member, and a pressing portion is formed at a central portion. The IC socket according to claim 1, wherein: The IC socket according to claim 4, wherein the latch mechanism is provided on the other side of the socket body and is engaged with the cover member. 5. The IC socket according to claim 4, wherein a latch mechanism engaged with the socket body is provided on both sides of the cover member. 5. The IC socket according to claim 4, wherein a latch mechanism engaged with the cover member is provided on both sides of the socket body. A socket body, and a contact having an elastic supporting portion extending from a terminal contact portion at a leading end connected to the IC package engaged with and supported by a lower surface of the positioning pedestal; An IC socket on which an IC package is mounted.

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