JP2004131623A5 - - Google Patents

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Publication number
JP2004131623A5
JP2004131623A5 JP2002298465A JP2002298465A JP2004131623A5 JP 2004131623 A5 JP2004131623 A5 JP 2004131623A5 JP 2002298465 A JP2002298465 A JP 2002298465A JP 2002298465 A JP2002298465 A JP 2002298465A JP 2004131623 A5 JP2004131623 A5 JP 2004131623A5
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Japan
Prior art keywords
group
resin composition
substituted
compound
composition according
Prior art date
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Pending
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JP2002298465A
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Japanese (ja)
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JP2004131623A (en
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Priority to JP2002298465A priority Critical patent/JP2004131623A/en
Priority claimed from JP2002298465A external-priority patent/JP2004131623A/en
Publication of JP2004131623A publication Critical patent/JP2004131623A/en
Publication of JP2004131623A5 publication Critical patent/JP2004131623A5/ja
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Claims (10)

エポキシ基を有する化合物とアルキル置換グルタル酸無水物を含有する樹脂組成物。  A resin composition comprising a compound having an epoxy group and an alkyl-substituted glutaric anhydride. エポキシ基を有する化合物が下記Ａ群、Ｂ群またはＣ群から選ばれる化合物である請求項１記載の樹脂組成物。
Ａ群：レゾルシノール、ハイドロキノン、ピロカテコール、ビスフェノールＡ、ジヒドロキシジフェニルメタン（ビスフェノールＦ）、ビスフェノールＳ、テトラブロモビスフェノールＡ、１，３−ビス（４−ヒドロキシフェニル）シクロヘキサン、４，４’−ジヒドロキシ−３，３’−ジメチルジフェニルメタン、４，４’−ジヒドロキシベンゾフェノン、トリス（４−ヒドロキシフェニル）メタン、ビス（４−ヒドロキシフェニル）エーテル、ノボラックフェノール、ノボラッククレゾール、ビス（４−ヒドロキシフェニル）スルホン、ビス（３，５−ジメチル−４−ヒドロキシフェニル）スルホン、１，６−ナフタレンジオールおよびアミノフェノール類、ならびにこれらの化合物の水素化またはハロゲン化物とエピクロロヒドリンとを反応させて得られるグリシジルエーテルからなる群
Ｂ群：一般式（１）
・・・（１）
〔式中、ｐは０〜４０の整数を表し、Ｒ １ 、Ｒ ３ 、Ｒ ４ およびＲ ６ は、同一または異なってハロゲン置換もしくは非置換のフェニレン、またはハロゲン置換もしくは非置換のシクロヘキシレンを表し、Ｒ ２ およびＲ ５ は、同一または異なってメチレン、Ｃ（ＣＨ ３ ） ２ 、酸素原子、ＣＯ、硫黄原子またはＳＯ ２ を表す〕で表される化合物からなる群
Ｃ群：一般式（２）
・・・（２）
（式中、ｑは０〜４０の整数を表し、Ｒ ７ 、Ｒ ８ 、Ｒ ９ およびＲ １０ は、同一または異なってハロゲン置換もしくは非置換のフェニレン、またはハロゲン置換もしくは非置換のシクロヘキシレンを表す）で表される化合物からなる群 The resin composition according to claim 1, wherein the compound having an epoxy group is a compound selected from the following group A, group B or group C.
Group A : resorcinol, hydroquinone, pyrocatechol, bisphenol A, dihydroxydiphenylmethane (bisphenol F), bisphenol S, tetrabromobisphenol A, 1,3-bis (4-hydroxyphenyl) cyclohexane, 4,4′-dihydroxy-3, 3′-dimethyldiphenylmethane, 4,4′-dihydroxybenzophenone, tris (4-hydroxyphenyl) methane, bis (4-hydroxyphenyl) ether, novolac phenol, novolac cresol, bis (4-hydroxyphenyl) sulfone, bis (3 , 5-Dimethyl-4-hydroxyphenyl) sulfone, 1,6-naphthalenediol and aminophenols, and the hydrogenation or halides of these compounds to epichlorohydrin. The group consisting of glycidyl ether obtained by
Group B : General formula (1)
... (1)
[Wherein, p represents an integer of 0 to 40, and R 1 , R 3 , R 4 and R 6 are the same or different and each represents halogen-substituted or unsubstituted phenylene, or halogen-substituted or unsubstituted cyclohexylene. , R 2 and R 5 are the same or different and each represents a methylene, C (CH 3 ) 2 , oxygen atom, CO, sulfur atom or SO 2 group]
Group C : General formula (2)
... (2)
(In the formula, q represents an integer of 0 to 40, and R 7 , R 8 , R 9 and R 10 are the same or different and each represents halogen-substituted or unsubstituted phenylene, or halogen-substituted or unsubstituted cyclohexylene. The group consisting of compounds represented by エポキシ基を有する化合物がエポキシ基を有するビニル系単量体を単独で重合させることによって得られる単独重合体、またはエポキシ基を有するビニル系単量体と共重合可能な１種以上のその他のビニル系単量体とを共重合させることによって得られる共重合体である請求項１記載の樹脂組成物。A homopolymer obtained by polymerizing a vinyl monomer having an epoxy group with a compound having an epoxy group, or one or more other vinyls copolymerizable with a vinyl monomer having an epoxy group 2. The resin composition according to claim 1, which is a copolymer obtained by copolymerizing with a monomer. エポキシ基を有する化合物が分子中にイソシアネート基を有するビニル系共重合体を、分子内に少なくとも一個の水酸基を有するエポキシ化合物と反応させて得られる化合物である請求項１記載の樹脂組成物。2. The resin composition according to claim 1, wherein the compound having an epoxy group is a compound obtained by reacting a vinyl copolymer having an isocyanate group in the molecule with an epoxy compound having at least one hydroxyl group in the molecule. アルキル置換グルタル酸無水物が２，４−ジアルキルグルタル酸無水物、３−アルキルグルタル酸無水物、または２，３−ジアルキルグルタル酸無水物である請求項１〜４のいずれかに記載の樹脂組成物。The resin composition according to any one of claims 1 to 4, wherein the alkyl-substituted glutaric anhydride is 2,4-dialkyl glutaric anhydride, 3-alkyl glutaric anhydride, or 2,3-dialkyl glutaric anhydride. object. アルキル置換グルタル酸無水物が２，４−ジエチルグルタル酸無水物である請求項１〜４のいずれかに記載の樹脂組成物。The resin composition according to any one of claims 1 to 4, wherein the alkyl-substituted glutaric anhydride is 2,4-diethyl glutaric anhydride. アルキル置換グルタル酸無水物以外のジカルボン酸無水物を含有する請求項１〜６のいずれかに記載の樹脂組成物。The resin composition according to any one of claims 1 to 6, comprising a dicarboxylic anhydride other than the alkyl-substituted glutaric anhydride. アルキル置換グルタル酸無水物を含むジカルボン酸無水物の全使用量がエポキシ基を有する化合物中のエポキシ基に対して、モル比０．１〜１０である請求項１〜７のいずれかにのいずれかに記載の樹脂組成物。The epoxy group in the compound total usage having an epoxy group of a dicarboxylic acid anhydride comprising an alkyl-substituted glutaric acid anhydride, either to one of the claims 1-7 in a molar ratio of from 0.1 to 10 A resin composition according to claim 1. 請求項１〜８のいずれかに記載の樹脂組成物を含有する液状封止材。The liquid sealing material containing the resin composition in any one of Claims 1-8 . 請求項１〜８のいずれかに記載の樹脂組成物を硬化して得られる硬化物。Hardened | cured material obtained by hardening | curing the resin composition in any one of Claims 1-8 .
JP2002298465A 2002-10-11 2002-10-11 Resin composition Pending JP2004131623A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002298465A JP2004131623A (en) 2002-10-11 2002-10-11 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002298465A JP2004131623A (en) 2002-10-11 2002-10-11 Resin composition

Publications (2)

Publication Number Publication Date
JP2004131623A JP2004131623A (en) 2004-04-30
JP2004131623A5 true JP2004131623A5 (en) 2005-07-28

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Family Applications (1)

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JP2002298465A Pending JP2004131623A (en) 2002-10-11 2002-10-11 Resin composition

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206827A (en) * 2005-01-31 2006-08-10 Matsushita Electric Works Ltd Liquid sealing epoxy resin composition and semiconductor device
JP2007161878A (en) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd Polycarboxylic acid resin, photosensitive resin composition and its cured product
WO2007119763A1 (en) * 2006-04-13 2007-10-25 Ntn Corporation Sealer, members covered with sprayed coatings, and bearings
WO2014038446A1 (en) * 2012-09-07 2014-03-13 株式会社ダイセル Curable epoxy resin composition and cured product thereof, and optical semiconductor device
JP2014095051A (en) * 2012-11-12 2014-05-22 Shin Etsu Chem Co Ltd Thermosetting epoxy resin composition, reflector for led using the composition, and led device

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