JP2004129256A - 累積モードにおける電荷結合素子の暗電流の削減方法 - Google Patents
累積モードにおける電荷結合素子の暗電流の削減方法 Download PDFInfo
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- JP2004129256A JP2004129256A JP2003332759A JP2003332759A JP2004129256A JP 2004129256 A JP2004129256 A JP 2004129256A JP 2003332759 A JP2003332759 A JP 2003332759A JP 2003332759 A JP2003332759 A JP 2003332759A JP 2004129256 A JP2004129256 A JP 2004129256A
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- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000009825 accumulation Methods 0.000 title abstract description 7
- 230000008859 change Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000002800 charge carrier Substances 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims abstract description 5
- 230000001186 cumulative effect Effects 0.000 claims description 7
- 230000020169 heat generation Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 239000007943 implant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14825—Linear CCD imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/762—Charge transfer devices
- H01L29/765—Charge-coupled devices
- H01L29/768—Charge-coupled devices with field effect produced by an insulated gate
- H01L29/76833—Buried channel CCD
- H01L29/7685—Three-Phase CCD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/762—Charge transfer devices
- H01L29/765—Charge-coupled devices
- H01L29/768—Charge-coupled devices with field effect produced by an insulated gate
- H01L29/76833—Buried channel CCD
- H01L29/76858—Four-Phase CCD
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/63—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/713—Transfer or readout registers; Split readout registers or multiple readout registers
Abstract
【解決手段】電荷結合素子150は、絶縁層60によって、第2導電型のウェル170または基板180内の第1導電型の埋込みチャンネル160から分離された3相以上の相から成るゲート(V1,V2,V3,V4)と、電荷結合素子150から電荷を転送させるクロックドライバとを備える。累積状態にあるときに電荷パケット190を分離するための障壁を設け、第1期間において、暗電流削減電荷キャリアが第1導電型の表面に累積する十分な電圧をゲートのすべての相に印加し、第1期間の終了後、第2導電型の層に対する静電容量を持つ各ゲート相nにおいて、ゲート相nの電圧変化であって、静電容量と電圧変化の積の合計が実質的にゼロ、となる電圧変化を加え、電荷結合素子からの電荷の転送に必要な電圧変化の後で、第1導電型の表面に暗電流削減電荷キャリアが蓄積する十分な電圧にゲート全相の電圧を戻す。
【選択図】図3
Description
ΔQn=CnΔVn
Claims (2)
- 電荷結合素子内の暗電流を削減する方法であって、
絶縁層によって第2導電型のウェルまたは基板内の第1導電型の埋込みチャンネルから分離された、3相以上の相から成るゲートと、電荷結合素子から電荷を転送させるクロックドライバとを設けるステップと、
累積状態にあるときに電荷パケットを分離する障壁を設けるステップと、
第1期間において、暗電流削減電荷キャリアが第1導電型の表面に蓄積する十分な電圧を全相のゲートに印加するステップと、
前記第1期間の終了後、第2導電型の層に対して静電容量Cnを持つ各ゲート相nにおいて、ΔVnとして示すゲート相nの電圧変化であって、静電容量と電圧変化との積の合計が実質的にゼロ、すなわち
電荷結合素子からの電荷の転送に必要な電圧変化の後で、第1導電型の表面に暗電流削減電荷キャリアが蓄積する十分な電圧にゲート全相の電圧を戻すステップと、
を含むことを特徴とする暗電流の削減方法。 - カメラであって、
(イ)電荷結合素子内の暗電流が削減された電荷結合素子を含み、
前記電荷結合素子は、
(ロ)絶縁層によって第2導電型のウェルまたは基板内の第1導電型の埋込みチャンネルから分離された、3相以上の相から成るゲートと、電荷結合素子から電荷を転送させるクロックドライバと、
(ハ)累積状態にあるときに電荷パケットを分離する障壁と、を含み、
該電荷結合素子において、
第1期間の全相のゲートに対する電圧は、暗電流削減電荷キャリアが第1導電型の表面に蓄積する十分な電圧であり、
前記第1期間の終了後、第2導電型の層に対して静電容量Cnを持つ各ゲート相nにおいて、ΔVnとして示す相nの電圧変化は、静電容量と電圧変化の積の合計が実質的にゼロ、すなわち
電荷結合素子からの電荷の転送に必要な電圧変化の後、全相のゲートに対する電圧は、第1導電型の表面に暗電流削減電荷キャリアが蓄積する十分な電圧に戻る、ことを特徴とする電荷結合素子を含むカメラ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/263,169 US6586784B1 (en) | 2002-10-02 | 2002-10-02 | Accumulation mode clocking of a charge-coupled device |
Publications (1)
Publication Number | Publication Date |
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JP2004129256A true JP2004129256A (ja) | 2004-04-22 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2003332759A Pending JP2004129256A (ja) | 2002-10-02 | 2003-09-25 | 累積モードにおける電荷結合素子の暗電流の削減方法 |
Country Status (4)
Country | Link |
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US (1) | US6586784B1 (ja) |
EP (1) | EP1406305B1 (ja) |
JP (1) | JP2004129256A (ja) |
DE (1) | DE60328949D1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011522483A (ja) * | 2008-05-30 | 2011-07-28 | イーストマン コダック カンパニー | ウエルバウンスが減少したイメージセンサ |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7015520B1 (en) * | 2004-10-13 | 2006-03-21 | Eastman Kodak Company | Charge-coupled devices having efficient charge transfer rates |
US7952633B2 (en) * | 2004-11-18 | 2011-05-31 | Kla-Tencor Technologies Corporation | Apparatus for continuous clocking of TDI sensors |
US7880782B2 (en) * | 2008-05-30 | 2011-02-01 | Eastman Kodak Company | Image sensor clocking method |
US8830372B2 (en) | 2011-09-23 | 2014-09-09 | Semiconductor Components Industries, Llc | CCD image sensor having multiple clocking modes |
US8803058B2 (en) | 2011-09-23 | 2014-08-12 | Truesense Imaging, Inc. | Multiple clocking modes for a CCD imager |
WO2013043788A1 (en) | 2011-09-23 | 2013-03-28 | Truesense Imaging, Inc. | Multiple clocking modes for a ccd imager |
US8723098B2 (en) | 2011-09-23 | 2014-05-13 | Truesense Imaging, Inc. | Charge coupled image sensor and method of operating with transferring operation of charge packets from plural photodetectors to vertical CCD shift registers (as amended) |
US8735794B2 (en) | 2011-09-23 | 2014-05-27 | Truesense Imaging, Inc. | Multiple clocking modes for a CCD imager |
US9848142B2 (en) | 2015-07-10 | 2017-12-19 | Semiconductor Components Industries, Llc | Methods for clocking an image sensor |
FR3108784B1 (fr) * | 2020-03-30 | 2022-04-01 | St Microelectronics Crolles 2 Sas | Dispositif à couplage de charges |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58154269A (ja) * | 1982-03-09 | 1983-09-13 | Matsushita Electronics Corp | 電荷転送装置 |
US4963952C1 (en) | 1989-03-10 | 2001-07-31 | California Inst Of Techn | Multipinned phase charge-coupled device |
US5151380A (en) | 1991-08-19 | 1992-09-29 | Texas Instruments Incorporated | Method of making top buss virtual phase frame interline transfer CCD image sensor |
JPH06314706A (ja) * | 1993-04-30 | 1994-11-08 | Nec Corp | 電荷転送装置、その駆動方法およびその製造方法 |
US5703642A (en) * | 1994-09-30 | 1997-12-30 | Eastman Kodak Company | Full depletion mode clocking of solid-state image sensors for improved MTF performance |
JP2768311B2 (ja) * | 1995-05-31 | 1998-06-25 | 日本電気株式会社 | 電荷転送装置 |
FR2771217B1 (fr) | 1997-11-14 | 2000-02-04 | Thomson Csf | Dispositif semiconducteur a transfert de charges |
JP2001308313A (ja) * | 2000-04-21 | 2001-11-02 | Nec Corp | 電荷転送装置及びそれを用いた固体撮像装置 |
-
2002
- 2002-10-02 US US10/263,169 patent/US6586784B1/en not_active Expired - Lifetime
-
2003
- 2003-09-22 DE DE60328949T patent/DE60328949D1/de not_active Expired - Lifetime
- 2003-09-22 EP EP03077990A patent/EP1406305B1/en not_active Expired - Fee Related
- 2003-09-25 JP JP2003332759A patent/JP2004129256A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011522483A (ja) * | 2008-05-30 | 2011-07-28 | イーストマン コダック カンパニー | ウエルバウンスが減少したイメージセンサ |
KR101460585B1 (ko) | 2008-05-30 | 2014-11-13 | 옴니비전 테크놀러지즈 인코포레이티드 | 웰 바운스가 감소된 이미지 센서 |
Also Published As
Publication number | Publication date |
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EP1406305A3 (en) | 2008-04-30 |
EP1406305B1 (en) | 2009-08-26 |
DE60328949D1 (de) | 2009-10-08 |
EP1406305A2 (en) | 2004-04-07 |
US6586784B1 (en) | 2003-07-01 |
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