JP2004128458A - Resistance-layer laminate and component using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistance-layer laminate in which a resistor having a required resistance value can be formed in a wiring pattern formed by etching, and to provide a component using the laminate. <P>SOLUTION: At the time of manufacturing the resistance-layer laminate 20 in which the resistor having the required resistance value can be formed in the wiring pattern, by laminating a conductive board 26 and a polymer board 24 upon another with a resistance layer 25 in between, the predetermined joint surfaces of the boards 26 and 24 are activated and the resistance layer 25 is laminated upon at least one of the boards 26 and 24. Thereafter, the conductive and polymer boards 26 and 24 are laminated upon another and joined to each other by bringing the boards 26 and 24 into contact with each other, so the resistance layer 25 may come to the inside. In addition, the component used for printed wiring boards, IC packages, etc., is manufactured by using the laminate 20. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a resistive layer having electrical resistance between a conductive plate having excellent conductivity and a polymer plate serving as a base material, or a resistive layer having electrical resistance and a conductive layer having excellent conductivity interposed therebetween. And a component using the resistance layer laminate.
[0002]
[Prior art]
In recent years, as electronic devices have become smaller and lighter, the density of mounting substrates has been increasing, and the number of mounted components has been reduced. In such a background, various methods for embedding the mounted components in the substrate itself have been proposed. As one example, JP-A-5-41573 discloses that a copper foil is plated with a Ni-Cr alloy layer serving as a resistance layer in a predetermined pattern, and the copper foil is adhered to a base material using an adhesive. A method of manufacturing a printed wiring board having a built-in resistor by etching is disclosed. However, the use of an adhesive causes a problem that heat resistance as a printed wiring board is deteriorated. In view of the above, the present invention has been made to realize a resistance-layer-inserted substrate without sacrificing heat resistance. Japanese Patent Application Laid-Open No. 1-2224184 discloses a method of joining metal plates without using plating or the like.
[0003]
[Problems to be solved by the invention]
The present invention provides a resistive layer having electrical resistance between a conductive plate having excellent conductivity and a polymer plate serving as a base material, or a resistive layer having electrical resistance and a conductive layer having excellent conductivity interposed therebetween. It is an object of the present invention to provide a resistance layer laminate formed by using a resistance layer laminate which can be applied to a printed wiring board, an IC package and the like.
[0004]
[Means for Solving the Problems]
As a first solution to the above-mentioned problem, a resistance layer laminate of the present invention is intended to join a conductive plate and a polymer plate in a resistance layer laminate in which a resistance layer is interposed between a conductive plate and a polymer plate. After activating the surface side and laminating a resistive layer on at least one of the conductive plate and the polymer plate, the conductive plate and the polymer plate are abutted and overlapped with the resistive layer being on the inner side and laminated and joined. Configuration. Alternatively, in a resistive layer laminate in which a conductive layer and a resistive layer are interposed between a conductive plate and a polymer plate, an activation treatment is performed on a surface to be joined between the conductive plate and the polymer plate, and the conductive plate or the polymer After laminating the resistive layer on at least one of the plates, further laminating the conductive layer on at least one of the conductive plate or the polymer plate, abutting the conductive plate and the polymer plate such that the resistive layer and the conductive layer are on the inside. And laminated and joined. Preferably, the activation treatment is such that glow discharge is performed in an inert gas atmosphere, and a surface to be joined between the conductive plate and the polymer plate is sputter-etched. More preferably, the activation processing, the resistance layer lamination processing, and / or the conductive layer lamination processing are performed in the vicinity.
[0005]
As a second solution to the above problem, a resistance layer laminate according to the present invention has a configuration in which the polymer plate is made of a liquid crystal polymer. Preferably, the conductive plate is made of a copper plate. More preferably, the resistance layer is made of any one of a Ni-Cr alloy, a Ni-Cr-Fe alloy, an Fe-Cr-Al alloy, and a Cu-Ni alloy.
[0006]
As a third solution to the above problem, the component of the present invention has a configuration using a resistance layer between a conductive plate and a polymer plate, or a resistance layer laminate in which the resistance layer and the conductive layer are interposed. . Further, it is preferable that a resistance portion is formed at least at one position. More preferably, the configuration is applied to one of a printed wiring board and an IC package.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing one embodiment of the resistance layer laminate of the present invention, and shows an example in which a resistance layer 25 is interposed between a polymer plate 24 and a conductive plate 26. FIG. 2 is a schematic cross-sectional view showing another embodiment of the resistance layer laminate of the present invention, and shows an example in which a resistance layer 25 and a conductive layer 27 are interposed between a polymer plate 24 and a conductive plate 26. Is shown.
[0008]
The type of the material of the polymer plate 24 is not particularly limited as long as the material can produce the resistance layer laminate, and can be appropriately selected and used depending on the use of the resistance layer laminate. For example, a mixture of an organic polymer substance such as plastic or a mixture of plastic and powder or fiber can be used. When the resistance layer laminate is applied to a flexible printed board or the like, a polyester such as polyimide, polyetherimide, or polyethylene terephthalate, an aromatic polyamide such as nylon, a liquid crystal polymer, or the like can be used.
[0009]
Examples of plastics include acrylic resins, amino resins (melamine resins, urea resins, benzoguanamine resins, etc.), allyl resins, alkyd resins, urethane resins, liquid crystal polymers, EEA resins (Ethylene Ethylacrylate resins), and AAS resins (Acrylonitrile Acrylate Styrene resins). ), ABS resin (Acrylonitrile Butadiene Styrene resin), ACS resin (Acrylnitrile Chlorinated polystyrene Styrene resin), AS resin (Acrylonitrile Styrene resin), silicon resin, styrene resin, ethylene resin, ethylene polymer , Feno Resin, fluoroethylene propylene, fluorine resin, polyacetal, polyarylate, polyamide (6 nylon, 11 nylon, 12 nylon, 66 nylon, 610 nylon, 612 nylon, etc.), polyamide imide, polyimide, polyether imide, polyether Ether ketone, polyether sulfone, polyester (polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycyclohexynedimer terephthalate, polytrimethylene terephthalate, polytrimethylene naphthalate, etc.), polyolefin (polyethylene, polypropylene, etc.), polycarbonate, Polychlorotrifluoroethylene, polysulfone, polystyrene, polyphenylene sulfide, polybutadiene, polybutene Such as polymethyl pentene may be used.
[0010]
The thickness of the polymer plate 24 is appropriately selected depending on the use of the resistance layer laminate. For example, it is 1 to 1000 μm. If it is less than 1 μm, it becomes difficult to produce a polymer plate, and if it exceeds 1000 μm, it becomes difficult to produce a resistance layer laminate. For example, if the application of the resistance layer laminate is a flexible printed circuit board, the thickness is preferably in the range of 3 to 300 μm. If it is less than 3 μm, the mechanical strength is poor, and if it exceeds 300 μm, the flexibility becomes poor. Preferably, it is 10 to 150 μm. More preferably, it is 20 to 75 μm.
[0011]
The material of the resistance layer 25 is not particularly limited as long as it has a required specific resistance as long as it is a material capable of manufacturing the resistance layer laminate, and can be appropriately selected and used depending on the use of the resistance layer laminate. .
The specific resistance of the resistance layer is preferably in the range of 30 to 300 μΩ · cm at 20 ° C. For example, an alloy that is solid at room temperature and has a required specific resistance (for example, an alloy specified in JIS) can be applied. If the application of the resistance layer laminate is a printed wiring board or the like, a resistance alloy having a required specific resistance capable of forming a resistance portion in a wiring pattern can be applied. As the resistance alloy, a copper-manganese alloy (for example, manganese 12 to 15%, nickel 2 to 4%, the balance of copper or the like), a copper-nickel alloy such as a Cu—Ni alloy (for example, copper 55 %, Nickel-chromium alloy composed of 45% nickel, etc.), nickel-chromium alloy (for example, Ni-Cr alloy composed of 80% nickel and 20% chromium, Ni-Cr-Fe alloy, etc.), nickel-phosphorus Alloys (for example, 1-20% phosphorus, the balance being nickel alloy), nickel-boron-phosphorus alloys (for example, 2% boron, 8-16% phosphorus, the balance being nickel alloy), iron / chromium Alloys (for example, Fe-Cr-Al alloy of 20% chromium, 3% aluminum, and the balance iron), iron-nickel alloys (Fe-Ni alloy, Fe-Ni-Cr alloy, etc.), iron Or the like can be used carbon-based alloy.
[0012]
The thickness of the resistance layer 25 is not particularly limited as long as the resistance layer laminate can be manufactured, and can be appropriately selected and used depending on the use of the resistance layer laminate. The resistance layer 25 preferably has a thickness of, for example, 0.01 to 10 μm. If the thickness is less than 0.01 μm, it is difficult to form a resistance layer, and it is difficult to realize a stable resistance value. If it exceeds 10 μm, the production time will be too long. More preferably, it is 0.1 to 5 μm. Note that the resistance layer can be appropriately selected from dry film formation means such as CVD (Chemical Vapor Deposition), sputtering, vacuum deposition, and ion plating depending on the use of the resistance layer stack.
[0013]
The material of the conductive plate 26 is not particularly limited as long as it is a material capable of producing the resistance layer laminate and has excellent conductivity, and can be appropriately selected and used depending on the use of the resistance layer laminate. . The specific resistance of the conductive plate is preferably in the range of 1 to 20 μΩ · cm at 20 ° C., and more preferably in the range of 1 to 10 μΩ · cm. For example, highly conductive metals that are solid at room temperature (eg, Al, Cu, Ag, Pt, Au, etc.), and highly conductive alloys containing at least one of these metals (eg, JIS Specified alloys) can be applied. If the application of the resistance layer laminate is a printed wiring board or the like, as the conductive plate 26, a metal having excellent conductivity, such as Cu or Al, or an excellent conductive material containing at least one of these metals is used. An alloy or the like can be applied. That is, a copper plate, an aluminum plate, or the like can be used as the conductive plate 26. As the copper plate, in addition to Cu, oxygen-free copper, tough pitch copper, phosphor bronze, brass, copper beryllium-based alloys (for example, beryllium 2%, the balance being copper alloy), copper-silver-based alloys (for example, , Silver 3-5%, the balance being copper alloy, etc.), aluminum alloys such as 1000 series and 3000 series specified in JIS can be applied in addition to Al.
[0014]
The thickness of the conductive plate 26 is not particularly limited as long as the resistance layer laminate can be manufactured, and can be appropriately selected and used depending on the use of the resistance layer laminate. The conductive plate 26 preferably has a thickness of, for example, 1 to 1000 μm. If it is less than 1 μm, it will be difficult to produce a conductive plate, and if it exceeds 1000 μm, it will be difficult to produce a resistance layer laminate. More preferably, it is 10 to 500 μm. The conductive plate 26 may be a plate material such as an electrolytic foil or a rolled foil, may be a plate material in which a film material formed by plating or vapor deposition is previously laminated, or may be a laminate such as a clad material. . For example, a clad material having a copper-aluminum structure is used.
[0015]
The material of the conductive layer 27 is not particularly limited as long as it is a material capable of manufacturing a resistance layer laminate and has excellent conductivity, and can be appropriately selected and used depending on the use of the resistance layer laminate. . For example, it is a material applicable to the conductive plate 26. The conductive layer 27 may be made of the same material as the conductive plate 26 or may be different. Further, a high melting point material such as Ta, Mo, or W may be used for the purpose of suppressing the adverse effect between the resistance layer 25 and the conductive plate 26.
[0016]
The thickness of the conductive layer 27 is not particularly limited as long as the resistance layer laminate can be manufactured, and can be appropriately selected and used depending on the use of the resistance layer laminate. The conductive layer 27 preferably has a thickness of, for example, 0.01 to 10 μm. If it is less than 0.01 μm, it is difficult to form a conductive layer, and if it exceeds 10 μm, the production time becomes too long. More preferably, it is 0.05 to 3 μm. The conductive layer can be appropriately selected and used from dry film forming means such as CVD (Chemical Vapor Deposition), sputtering, vacuum deposition, and ion plating depending on the use of the resistance layer laminate.
[0017]
A method for manufacturing the resistance layer stack 20 shown in FIG. 1 will be described. As shown in FIG. 4, in the vacuum chamber 52, the surface of the polymer plate 24, which is set on the rewind reel 62, is to be activated by the activation processing device 70. Similarly, the surface of the conductive plate 26 set on the rewind reel 64 to be joined is activated by the activation device 80.
[0018]
The activation process is performed as follows. That is, the polymer plate 24 and the conductive plate 26 loaded in the vacuum chamber 52 are each brought into contact with one of the electrodes A grounded to ground, and 10 to 1 × 10 ^{In a very} low pressure inert gas atmosphere of ⁻³ Pa, an alternating current of 1 to 50 MHz is applied to cause glow discharge, and the polymer plate 24 in contact with the electrode A exposed in the plasma generated by the glow discharge, The sputter etching process is performed so that the area of each of the plates 26 is effectively １ ／ or less of the area of the electrode B. As the inert gas, argon, neon, xenon, krypton, or the like or a mixture containing these can be used. Preferably it is argon. If the inert gas pressure is less than 1 × 10 ⁻³ Pa, stable glow discharge is difficult to perform, and high-speed etching is difficult. If the inert gas pressure exceeds 10 Pa, the activation treatment efficiency decreases. If the applied alternating current is less than 1 MHz, it is difficult to maintain a stable glow discharge, and it is difficult to perform continuous etching. If the applied alternating current exceeds 50 MHz, oscillation tends to occur and the power supply system becomes complicated, which is not preferable. In addition, for efficient etching, it is necessary that the area of each of the polymer plate 24 and the conductive plate 26 in contact with the electrode A is effectively smaller than the area of the electrode B. Thus, etching can be performed with sufficient efficiency.
[0019]
Next, the resistance layer 25 is formed on the surface of the polymer plate 24 by the film forming unit 90. A case where sputtering is used as a film formation method will be described. In the film forming unit 90, the sputtering process can be performed by effectively increasing the area on the polymer plate 24 side contrary to the activation processing device. That is, the polymer plate 24 loaded in the vacuum chamber 52 is brought into contact with one of the electrodes A grounded to ground, and an electrode of 10 to 1 × 10 ⁻³ Pa is placed between the polymer plate 24 and the other electrode C that is insulated and supported. In a low-pressure inert gas atmosphere, an alternating current of 1 to 50 MHz is applied to cause glow discharge, and the area of the polymer plate 24 in contact with the electrode A exposed in the plasma generated by the glow discharge is effectively reduced. The sputtering process is performed so that the area of the electrode C is three times or more. As the inert gas, argon, neon, xenon, krypton, or the like or a mixture containing these can be used. Preferably it is argon. If the inert gas pressure is less than 1 × 10 ⁻³ Pa, stable glow discharge is difficult to perform, and if it exceeds 10 Pa, the sputtering efficiency is reduced. If the applied alternating current is less than 1 MHz, it is difficult to maintain a stable glow discharge and continuous sputtering is difficult. If the applied alternating current exceeds 50 MHz, oscillation tends to occur and the power supply system becomes complicated, which is not preferable. In addition, in order to perform efficient sputtering, the area of the polymer plate 24 in contact with the electrode A needs to be effectively larger than the area of the electrode C. By making the area of the polymer plate 24 three times or more, a film can be formed with sufficient efficiency. It becomes.
[0020]
As shown in FIG. 7, for example, a film forming unit 90 using sputtering is composed of a combination of an electrically floating target electrode 94 and a grounded water-cooled electrode roll 72. A target 92 for forming the resistance layer 25 is provided on the target electrode 94, and a magnet 98 is provided to improve the efficiency of sputtering by a magnetic field. Further, in order to prevent abnormal heating of the target 92, the target electrode 94 can be water-cooled. By applying a high-frequency power source 96 between the target electrode 94 and the electrode roll 72, plasma is generated and ion bombardment is applied to the target 92, and the released target material is laminated on the polymer plate 24 to form a resistance layer. 25 is formed, and the film laminate 22 can be obtained.
[0021]
After that, the activated conductive plate 26 and the film laminate 22 having the resistance layer 25 formed on the polymer plate 24 are laminated and joined. The lamination bonding is achieved by cold-welding with the overlap-welding unit 60 by abutting the film stacking material 22 and the conductive plate 26 such that the surfaces to be bonded are opposed to each other. The lamination bonding at this time can be performed at a low temperature, and it is possible to reduce or eliminate adverse effects such as a structural change and formation of an alloy layer in the film lamination material 22, the conductive plate 26, and the bonding portion. When T is the temperature (° C.) of the film laminated material and the conductive plate, a good pressure contact state can be obtained at 0 ° C. <T <300 ° C. A temperature of 0 ° C. or lower requires a special cooling device, and a temperature of 300 ° C. or higher is not preferable because adverse effects such as structural changes occur. More preferably, 0 ° C <T <200 ° C. More preferably, 0 ° C <T <150 ° C. Further, the rolling reduction R (%) is preferably 0.01% ≦ R ≦ 30%. If it is less than 0.01%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, deformation becomes large, which is not preferable in terms of processing. More preferably, 0.1% ≦ R ≦ 3%. More preferably, 1% <R ≦ 3%.
[0022]
By thus laminating and joining, the resistance layer laminate 20 having a required layer thickness can be formed, and is wound up by the winding roll 66. Further, if necessary, the resistive layer laminate 20 as shown in FIG. 1 can be manufactured by cutting it into a predetermined size. Further, the resistance layer laminate 20 thus manufactured may be subjected to a heat treatment within a range that does not cause a problem for removal or reduction of residual stress, if necessary, or a conductive film material such as solder plating. And the like may be laminated.
[0023]
When the conductive layer 27 is formed by adding the film forming unit 91 as shown in FIG. 5, a film laminate having a structure of the polymer plate 24, the resistance layer 25, and the conductive layer 27 can be obtained. By laminating and joining with the conductive plate 26, the resistance layer laminate 21 as shown in FIG. 2 can be manufactured. Further, the film forming unit can be arranged not only on one activation processing device side but also on both activation processing device sides as shown in FIG.
[0024]
The film forming unit is preferably in the vicinity of the activation processing device. By arranging the film forming unit in the vicinity of the activation processing device, it is possible to reduce the size of the manufacturing apparatus. For example, as shown in FIGS. 4 to 7, the electrode roll of the activation processing device and the electrode roll of the film forming unit are shared, or the electrode roll of the activation processing device and the film forming unit are shared. , Etc. on the outer periphery of the device. By adopting such a form, integrated processing becomes possible. Note that the vicinity means a range or a state in which the activated conductive plate surface is inactivated again by adsorption, reaction, or the like, and does not adversely affect the film formation.
[0025]
Note that batch processing can be used for manufacturing the resistance layer laminate. That is, a plurality of conductive plates cut into a predetermined size in advance in a vacuum chamber are loaded and transported to an activation processing device, and the surfaces to be processed at appropriate positions such as vertical or horizontal are opposed or juxtaposed. When the device for holding or holding the conductive plate also serves as a pressure contact device, the device is placed or held and fixed to perform the activation process or the film forming process, and after the activation process, the device is pressed or contacted while holding or holding the conductive plate to hold the conductive plate. In the case where the device does not double as the pressure contact device, it is achieved by carrying to a pressure contact device such as a press device and performing pressure contact. Note that the activation process and the film formation process are preferably performed between the conductive plate as one electrode A that is insulated and supported and the other electrode B that is grounded.
[0026]
The component of the present invention is a resistive layer having electric resistance between a conductive plate having excellent conductivity and a polymer plate serving as a base material, or a resistive layer having electric resistance and a conductive layer having excellent conductivity. It uses a resistance layer laminate that is interposed, and is obtained by subjecting the resistance layer laminate to processing such as etching, and further covering or fixing it with a resin or the like, or bonding the resistance layer laminate to an adhesive Such materials include those laminated on a substrate or substrate made of a polymer, a metal, an alloy, or the like, and those subjected to interlayer conduction treatment of the substrate by via processing, through-hole processing, or the like. For example, it is a component such as a printed wiring board as shown in FIG.
[0027]
A component such as a printed wiring board as shown in FIG. 3 is, for example, a three-layer resistive layered body 20 of a polymer plate 24-a resistive layer 25-a conductive plate 26 as shown in FIG. It can be manufactured by performing etching or the like on the resistance layer 25 to form the conductive wiring portion 32, the resistance wiring portion 34, and the like. At this time, as the wiring portion, a two-layered good conductor portion (conductive wiring portion 32) in which the conductive plate portion remains and a one-layer resistor portion (resistance wiring portion 34) having only the resistance layer from which the conductive plate portion is removed are appropriately selected. Can be formed. Furthermore, by appropriately selecting the etchant and the material of the resistive layer 25, the resistive layer 25 can function as an etching stop layer, and can be etched accurately. It becomes easy to form the wiring part 34, and a resistance part having a required resistance value can be provided inside the wiring.
[0028]
The resistance layer laminate 20 having a three-layer structure has, for example, a liquid crystal polymer-NiCr alloy layer-copper foil structure. The liquid layer polymer is activated and a Ni-Cr alloy layer is laminated by sputtering. Can be achieved by performing an activation treatment and performing lamination bonding. The conductive wiring portion 32 can be formed by sequentially or collectively etching the copper foil and the Ni—Cr-based alloy layer, and the resistance wiring portion 34 can be formed by etching only the copper foil.
[0029]
By forming the wiring portion of only the resistance layer portion in the resistance layer laminate of the present invention, it is possible to function as a resistor such as a terminating resistor or a bleeder resistor. The present invention may be applied to a network, a collective resistance such as a resistance ladder, or the like. This resistance value can be manufactured by appropriately selecting the specific resistance and the film thickness determined by the material of the resistance layer, and the width and length of the wiring pattern. Conversely, if you do not want to function as a resistor, increase the width of the wiring portion of only the resistance layer portion to lower the actual resistance value, or perform an etching process that leaves a conductive plate on at least one side of the resistance layer Or by forming a conductive layer on the wiring portion of only the resistance layer portion by vapor deposition or the like. For this reason, it is possible to reduce or eliminate the resistors that have been mounted on the printed wiring board, which is effective in increasing the density of the printed wiring board.
[0030]
Further, the resistance layer of the resistance layer laminate of the present invention can function not only as a resistor but also as a heating element or a fuse. Since the resistance layer laminate of the present invention does not have an adhesive layer which is a factor inhibiting heat resistance, it can be used at higher temperatures than before. Therefore, it is suitable for printed wiring boards (rigid printed wiring boards, flexible printed wiring boards, etc.) and the like, and for IC cards, IC packages such as CSP (chip size package or chip scale package) and BGA (ball grid array). Can also be applied.
[0031]
【Example】
Hereinafter, embodiments will be described with reference to the drawings. A liquid crystal polymer having a thickness of 50 μm was used as the polymer plate 24, a rolled copper foil having a thickness of 35 μm was used as the conductive plate 26, and a Ni—Cr alloy layer was used as the resistance layer 25. The liquid crystal polymer and the rolled copper foil were set in the resistance layer laminate manufacturing apparatus 50, and the activation processing units 70 and 80 in the vacuum chamber 52 were activated (sputter etching method) by the sputter etching method (argon gas atmosphere, 1 Pa). An Ni-20% Cr alloy layer (thickness: 3 μm) is formed on the activated liquid crystal polymer by a film forming unit 90 using sputtering to form a film laminated material 22, and the activated rolled copper foil is rolled thereon. The resistance laminated material 20 was manufactured by press-contacting (rolling ratio: 1.5%) by the unit 60 and by laminating and joining.
[0032]
【The invention's effect】
As described above, the resistive layer laminate of the present invention is obtained by interposing a resistive layer or a resistive layer and a conductive layer between a conductive plate and a polymer plate. It uses the body. Therefore, the number of components forming a circuit can be reduced by forming a resistance portion in the resistance layer of the resistance layer stack, and the application to a printed wiring board or the like is also suitable.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing one embodiment of a resistance layer laminate according to the present invention.
FIG. 2 is a schematic sectional view showing another embodiment of the resistance layer laminate of the present invention.
FIG. 3 is a schematic sectional view showing an embodiment of the component of the present invention.
FIG. 4 is a schematic cross-sectional view showing one embodiment of an apparatus used for manufacturing a resistance layer laminate according to the present invention.
FIG. 5 is a schematic cross-sectional view showing another embodiment of an apparatus used for manufacturing a resistance layer laminate according to the present invention.
FIG. 6 is a schematic cross-sectional view showing still another embodiment of the apparatus used for manufacturing the resistance layer laminate of the present invention.
FIG. 7 is a schematic cross-sectional view showing one embodiment of a film forming unit used for manufacturing a resistance layer laminate according to the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 20 resistive layer laminate 21 resistive layer laminate 22 film laminate 24 polymer plate 25 resistive layer 26 conductive plate 27 conductive layer 30 component 32 conductive wiring section 34 resistance wiring section 50 resistance layer laminate manufacturing apparatus 52 vacuum chamber 54 vacuum pump Reference Signs List 60 Pressure contact unit 62 Rewind reel 64 Rewind reel 66 Take-up roll 70 Activation device 72 Electrode roll 74 Electrode 76 Electrode 78 Electrode 80 Activation device 82 Electrode roll 84 Electrode 86 Electrode 90 Film formation unit 91 Film formation unit 92 Target 94 Target electrode 95 Film forming unit 96 High frequency power supply 98 Magnet A Electrode A
B electrode B
C electrode C

Claims (10)

In a resistance layer laminate in which a resistance layer is interposed between a conductive plate and a polymer plate, the surface to be joined between the conductive plate and the polymer plate is activated, and at least one of the conductive plate and the polymer plate is treated. A resistance layer laminate, comprising: stacking a resistance layer, and abutting and stacking a conductive plate and a polymer plate such that the resistance layer is on the inner side, and a stacking connection. In a resistance layer laminate in which a conductive layer and a resistive layer are interposed between a conductive plate and a polymer plate, an activation treatment is performed on the surface to be joined between the conductive plate and the polymer plate, and After laminating the resistive layer on at least one side, further laminating the conductive layer on at least one of the conductive plate and the polymer plate, and overlapping the conductive plate and the polymer plate with the resistive layer and the conductive layer being inward. A resistance layer laminate characterized by being laminated and joined together. 3. The activation process according to claim 1, wherein a glow discharge is performed in an inert gas atmosphere to sputter-etch a surface to be joined between the conductive plate and the polymer plate. Resistance layer laminate. The resistance layer laminate according to any one of claims 1 to 3, wherein the activation processing, the resistance layer lamination processing, and / or the conductive layer lamination processing are performed in the vicinity. The resistance layer laminate according to any one of claims 1 to 4, wherein the polymer plate is made of a liquid crystal polymer. The resistance layer laminate according to any one of claims 1 to 5, wherein the conductive plate is made of a copper plate. The resistance layer according to any one of claims 1 to 6, wherein the resistance layer is made of any one of a Ni-Cr alloy, a Ni-Cr-Fe alloy, an Fe-Cr-Al alloy, and a Cu-Ni alloy. Laminate. A component characterized by using a resistance layer between a conductive plate and a polymer plate, or a resistance layer laminate obtained by interposing a resistance layer and a conductive layer. 9. The component according to claim 8, wherein a resistance portion is formed in at least one portion of the component. The component according to claim 8, wherein the component is applied to one of a printed wiring board and an IC package.

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