JP2004128183A5 - - Google Patents
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- Publication number
- JP2004128183A5 JP2004128183A5 JP2002289642A JP2002289642A JP2004128183A5 JP 2004128183 A5 JP2004128183 A5 JP 2004128183A5 JP 2002289642 A JP2002289642 A JP 2002289642A JP 2002289642 A JP2002289642 A JP 2002289642A JP 2004128183 A5 JP2004128183 A5 JP 2004128183A5
- Authority
- JP
- Japan
- Prior art keywords
- bump electrode
- wiring
- electrode
- semiconductor device
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002289642A JP4025165B2 (ja) | 2002-10-02 | 2002-10-02 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002289642A JP4025165B2 (ja) | 2002-10-02 | 2002-10-02 | 半導体装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007210647A Division JP4585557B2 (ja) | 2007-08-13 | 2007-08-13 | 半導体装置の製造方法 |
| JP2007210644A Division JP4585556B2 (ja) | 2007-08-13 | 2007-08-13 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004128183A JP2004128183A (ja) | 2004-04-22 |
| JP2004128183A5 true JP2004128183A5 (https=) | 2005-11-04 |
| JP4025165B2 JP4025165B2 (ja) | 2007-12-19 |
Family
ID=32281747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002289642A Expired - Fee Related JP4025165B2 (ja) | 2002-10-02 | 2002-10-02 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4025165B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4990711B2 (ja) * | 2007-07-27 | 2012-08-01 | ソニーケミカル＆インフォメーションデバイス株式会社 | Ｉｃチップの製造方法及びｉｃチップの実装方法 |
-
2002
- 2002-10-02 JP JP2002289642A patent/JP4025165B2/ja not_active Expired - Fee Related
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