JP2004119992A - Adhesive sheet for manufacturing chip body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip body in which a space between chips is expanded without a conventional expanded process in a process for manufacturing a chip body such as a semiconductor chip, and an adhesive sheet for manufacturing the chip body used properly in the manufacturing method. <P>SOLUTION: The adhesive sheet for manufacturing a chip body has an adhesive layer for sticking a material that is cut, a shrinkable film, and an extensible film stacked, in this order. Preferably, the extensible film has an elastic modulu of less than 1×10<SP>9</SP>N/m<SP>2</SP>, the adhesive layer comprises a radiation curing adhesive, and the heat-shrinkable film and the extensible film are stacked via an adhesive layer having an elastic modulus of not less than 1.0×10<SP>5</SP>N/m<SP>2</SP>. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a method for manufacturing a chip body and a pressure-sensitive adhesive sheet for manufacturing a chip body, and more specifically, in a process for manufacturing a small chip body such as a semiconductor chip, without performing a so-called expanding step, which has been conventionally performed, to reduce a chip interval. The present invention relates to a method for manufacturing a chip body, which can be expanded, and an adhesive sheet for manufacturing a chip body suitably used in the manufacturing method.

半導体 Semiconductor wafers such as silicon and gallium arsenide are manufactured in a large diameter state, and the wafer is cut and separated (diced) into element pieces and then transferred to the next step, a mounting step. At this time, dicing, expanding, picking up, and mounting steps are added in a state where the semiconductor wafer is attached to the adhesive sheet in advance.

The expanding step is a step of stretching the pressure-sensitive adhesive sheet and expanding the chip interval. The purpose of the expanding step for increasing the chip interval is to enhance chip recognition during die bonding, to prevent adjacent chips from contacting each other at the time of pickup, and to prevent device damage.

The current expanding process is performed by using an expanding device to stretch the sheet.

By the way, many expanding devices have a fixed amount of stretching and a fixed torque at the time of stretching, and are difficult to adjust depending on the type of the adhesive sheet and the size of the device.

For this reason, when the adhesive sheet is soft, the tensile stress is not transmitted to the wafer attachment portion, and a sufficient chip interval cannot be obtained. On the other hand, when the sheet is hard, the torque of the device becomes insufficient, or the adhesive sheet becomes insufficient. The sheet could tear.

(4) After the die bonding step is completed, the pressure-sensitive adhesive sheet is stored in the ring frame cassette while being adhered to the ring frame. In the conventional process, it is necessary to restore the shape of the pressure-sensitive adhesive sheet deformed by the expansion by hot air.If the restoration is insufficient, the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet adheres to the ring frame cassette, In some cases, storage became impossible, and automation was difficult.

The present invention solves the problems associated with the prior art as described above, and is suitable for a method of manufacturing a chip body capable of expanding the chip interval by a mechanism completely different from the conventional expanding method, and a method suitable for the manufacturing method. An object of the present invention is to provide a pressure-sensitive adhesive sheet for producing a chip body, which is used for the above.

The method for manufacturing a chip body according to the present invention includes:
At least one layer of a shrinkable film, an extensible film, and a step of attaching an object to be cut to an adhesive sheet for producing a chip body comprising an adhesive layer for attaching the object to be cut,
Fixing the end of the pressure-sensitive adhesive sheet for chip production,
Dicing the object to be cut into chips,
Shrinking the shrinkable film to extend the chip interval.

The pressure-sensitive adhesive sheet for producing a chip body according to the present invention is suitably used in the above-mentioned manufacturing method, and includes an extensible film and a to-be-cut object-attached portion including an object-to-be-cut object-attaching pressure-sensitive adhesive layer, at least. And a shrinkable part in which a one-layer shrinkable film is disposed outside the part to be cut.

As such an adhesive sheet for producing a chip body, for example, as shown in FIG. 1, a pressure-sensitive adhesive layer for attaching an object to be cut, a shrinkable film, and an extensible film are laminated in this order to produce a chip body. A pressure-sensitive adhesive sheet and a pressure-sensitive adhesive sheet for chip production in which a pressure-sensitive adhesive layer for sticking an object to be cut, an extensible film and a shrinkable film as shown in FIG.

The stretchable film preferably has an elastic modulus of less than 1 × 10 ⁹ N / m ² .

Further, the pressure-sensitive adhesive layer is preferably made of a radiation-curable pressure-sensitive adhesive.

Further, it is preferable that the shrinkable film and the extensible film are laminated via an adhesive layer having an elastic modulus of 1.0 × 10 ⁵ N / m ² or more.

According to the present invention, there is no problem such as tearing of the pressure-sensitive adhesive sheet for chip production and insufficient chip spacing, and a uniform and sufficient chip spacing can be obtained. Further, in the present invention, since the pressure-sensitive adhesive sheet for producing a chip body does not deform in the thickness direction, it is most suitable for automation of a production line. Also, the expansion rate of the chip interval can be freely controlled by appropriately setting the contraction conditions such as the temperature and time, and the productivity can be improved.

Hereinafter, the method for producing a chip body and the pressure-sensitive adhesive sheet for producing a chip body according to the present invention will be described more specifically.

チ ッ プ In the method for manufacturing a chip body according to the present invention, a pressure-sensitive adhesive sheet for manufacturing a chip body, comprising at least one layer of a shrinkable film, an extensible film, and a pressure-sensitive adhesive layer for attaching a cut object is used.

The shrinkable film is not particularly limited, but a heat shrinkable film is mainly used.

は The shrinkage ratio of the shrinkable film used in the present invention is preferably from 10 to 90%, more preferably from 20 to 80%. Here, the shrinkage rate is calculated from the dimension before shrinkage and the dimension after shrinkage based on the following formula.

In the case of a heat-shrinkable film, the shrinkage is calculated based on dimensions before and after the film is heated to 120 ° C.

As the shrinkable film as described above, various types are conventionally known, but in the present invention, generally, any material can be used as long as it does not adversely affect the object to be cut, such as ionic contamination. it can. Specific examples include uniaxially stretched films and biaxially stretched films such as polyethylene terephthalate, polyethylene, polystyrene, polypropylene, polyamide, polyurethane, polyvinylidene chloride, and polyvinyl chloride. Further, these shrinkable films can be used in combination of two or more kinds.

厚 The thickness of the above-mentioned shrinkable film is usually 5 to 300 µm, preferably 10 to 200 µm.

特 に As the shrinkable film, it is particularly preferable to use a heat-shrinkable film of polyethylene, polypropylene, polyethylene terephthalate or the like.

基材 The base material of the pressure-sensitive adhesive sheet for chip production used in the production method of the present invention is a combination of the above-described shrinkable film and an extensible film.

The stretchable film is not particularly limited, but a film having excellent water resistance and heat resistance is suitable, and a synthetic resin film is particularly suitable.

As such an extensible film, specifically,
Low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene / propylene copolymer, polypropylene, polybutene, polybutadiene, polymethylpentene, ethylene / vinyl acetate copolymer, ethylene / (meth) acrylic acid copolymer Copolymer, ethylene / methyl (meth) acrylate copolymer, ethylene / ethyl (meth) acrylate copolymer, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl chloride / vinyl acetate copolymer, Polyurethane films, polyamide films, films composed of ionomers, and the like are used. These stretchable films may be used in combination of two or more. Further, a polymer film containing a compound having a carboxyl group as a polymer constituent unit or a laminate of the polymer film and a general-purpose polymer film can also be used.

厚 The thickness of the stretchable film as described above is usually 5 to 500 µm, preferably 10 to 300 µm.

The elastic modulus at 23 ° C. of the stretchable film used in the present invention is usually 1 × 10 ⁹ N /.
It is desirably less than m ² , preferably in the range of 1 × 10 ⁷ to 1 × 10 ⁹ N / m ² .

面 Further, on the surface in contact with the other layer of the shrinkable film or the extensible film, a corona treatment or another layer such as a primer may be provided in order to improve the adhesion.

In the present invention, as described below, before or after shrinkage of the film, the ultraviolet light may be applied to the pressure-sensitive adhesive layer to be adhered to the object to be cut, but in this case, the film constituting the base material is transparent. There is a need.

The pressure-sensitive adhesive layer for sticking the object to be cut of the pressure-sensitive adhesive sheet for producing a chip body can be formed of various conventionally known pressure-sensitive pressure-sensitive adhesives. Such an adhesive is not particularly limited, and for example, an adhesive of a rubber type, an acrylic type, a silicone type, a polyvinyl ether type or the like is used. Further, a radiation-curable or heat-foamable pressure-sensitive adhesive can also be used. Furthermore, an adhesive that can be used for both dicing and dyning may be used.

粘着 The thickness of the pressure-sensitive adhesive layer for sticking the cut object is usually about 3 to 100 µm, and preferably about 10 to 50 µm, although it depends on the material.

粘着 As the above-mentioned pressure-sensitive adhesive, various pressure-sensitive adhesives are used without any particular limitation. Examples of the radiation-curable (light-curing, ultraviolet-curing, electron beam-curing) pressure-sensitive adhesives include those described in JP-B-1-56112, JP-A-7-135189, JP-B7-15087, and the like. It is preferably used but not limited to these. However, in the present invention, it is particularly preferable to use an ultraviolet curable pressure-sensitive adhesive.

The shrinkable film and the extensible film in the present invention are joined in various shapes as described later. For joining films, a pressure-sensitive adhesive layer for attaching an object to be cut can be used as shown in FIGS. 3 to 5. Further, as shown in FIGS. 1, 2, 6, and 7, another adhesive layer can be provided. As such an adhesive, a general-purpose adhesive is conventionally used without any particular limitation, and an acrylic, rubber, or silicone adhesive; polyester, polyamide, ethylene copolymer, or epoxy And urethane-based thermoplastic or thermosetting adhesives; and acrylic and urethane-based ultraviolet-curable adhesives and electron beam-curable adhesives. In particular, it is preferable to use an adhesive having an elastic modulus of 1.0 × 10 ⁵ N / m ² or more, preferably 1.0 × 10 ⁷ N / m ² or more. By using such an adhesive, the shrinkable film can be more uniformly shrunk, the exposure of the adhesive is prevented, and the chip can be picked up smoothly. When an adhesive layer is not used, a contractible film and an extensible film can be laminated by, for example, heat sealing.

場合 When the shrinkable film is arranged at a position for fixing the ring frame as shown in FIGS. 3 and 5, an adhesive layer for fixing the ring frame can be provided on the shrinkable film. As the pressure-sensitive adhesive layer for fixing the ring frame, various kinds of conventionally known pressure-sensitive adhesives can be used in the same manner as the pressure-sensitive adhesive layer for attaching the cut object.

The pressure-sensitive adhesive sheet for producing a chip body is used in a state in which an object to be cut is attached to the object to be cut on the pressure-sensitive adhesive layer for applying the object to be cut, and the end of the adhesive sheet is fixed with a ring frame or the like. . Dicing the attached cut object into chips, and then shrinking the shrinkable film, the shrinkable film (hereinafter, also referred to as “shrink portion”) disposed outside the cut object adhered portion. A tensile stress is generated, and the chip interval is expanded. In such a production method of the present invention, it is preferable that the shrinkable film in the pressure-sensitive adhesive sheet for producing a chip body is disposed at least outside the portion where the cut object is adhered.

FIGS. 1 to 7 show a preferred configuration of the pressure-sensitive adhesive sheet 10 for manufacturing a chip body used in the present invention, together with the positional relationship between the ring frame 5 and the object 6 to be cut. Specific examples and preferred embodiments of the pressure-sensitive adhesive layer 1, the shrinkable film 2, the adhesive layer 3, and the extensible film 4 to be attached to the cut object are as described above. Note that the adhesive layer 3 is not always essential as described above.

In the pressure-sensitive adhesive sheet 10 for manufacturing a chip body shown in FIG. 1, a shrinkable film 2 is laminated on an entire surface of an extensible film 4 via an adhesive layer 3, and an object to be cut is stuck on the entire surface of the shrinkable film 2. An adhesive layer 1 is provided. An end of the pressure-sensitive adhesive sheet 10 for manufacturing a chip body is fixed by a ring frame 5 at an upper peripheral portion of the pressure-sensitive adhesive layer 1 to be cut, and an inner peripheral portion of the pressure-sensitive adhesive layer 1 is applied to the cut object. 6 is affixed.

The adhesive sheet 10 for chip production shown in FIG. 2 has an adhesive layer 3 on the entire surface of the shrinkable film 2.
The extensible film 4 is laminated through the film, and the pressure-sensitive adhesive layer 1 for sticking an object to be cut is provided on the entire surface of the extensible film 4. An end of the pressure-sensitive adhesive sheet 10 for manufacturing a chip body is fixed by a ring frame 5 at an upper peripheral portion of the pressure-sensitive adhesive layer 1 to be cut, and an inner peripheral portion of the pressure-sensitive adhesive layer 1 is applied to the cut object. 6 is affixed.

The pressure-sensitive adhesive sheet 10 for manufacturing a chip body shown in FIG. 3 is provided with an adhesive layer 1 for sticking an object to be cut on an extensible film 4, and a shrinkable film 2 laminated on an outer peripheral portion of the adhesive layer 1. It becomes. The pressure-sensitive adhesive sheet 10 for chip production is fixed on the shrinkable film 2 by the ring frame 5, and the object 6 to be cut is adhered on the pressure-sensitive adhesive layer 1. In this case, it is preferable to provide an adhesive layer 9 for fixing the ring frame on the shrinkable film 2.

The adhesive sheet 10 for manufacturing a chip body shown in FIG. 4 is provided with an adhesive layer 1 for sticking an object to be cut on an extensible film 4, and the adhesive layer 1 is located outside the object to be cut on the upper surface of the adhesive layer 1. In addition, the shrinkable film 2 is laminated inside the pressure-sensitive adhesive sheet fixing portion for chip body production. The edge of the pressure-sensitive adhesive sheet 10 for manufacturing a chip body is fixed by a ring frame 5 at the upper peripheral portion of the pressure-sensitive adhesive layer 1 for attaching the object to be cut, and the object to be cut is disposed on the inner peripheral portion of the adhesive layer 1 for attaching the object to be cut. 6 is affixed.

The pressure-sensitive adhesive sheet 10 for manufacturing a chip body shown in FIG. 5 has a pressure-sensitive adhesive layer 1 for sticking an object to be cut on an extensible film 4, and a contractible film 2 on an outer peripheral portion of an upper surface of the pressure-sensitive adhesive layer 1. The parts are laminated in an extended form. The pressure-sensitive adhesive sheet 10 for manufacturing a chip body is fixed by a ring frame 5 at the extended outer edge of the shrinkable film 2, and an object 6 to be cut is stuck on the pressure-sensitive adhesive layer 1. In this case, it is preferable to provide the pressure-sensitive adhesive layer 9 for fixing the ring frame on the shrinkable film 2.

In the pressure-sensitive adhesive sheet 10 for manufacturing a chip body shown in FIG. 6, a contractible film 2 is laminated on an outer peripheral portion of a lower surface of an extensible film 4 via an adhesive layer 3, and an object to be cut is attached to an upper surface of the extensible film 4. A wearing pressure-sensitive adhesive layer 1 is provided. An end of the pressure-sensitive adhesive sheet 10 for manufacturing a chip body is fixed by a ring frame 5 at an upper peripheral portion of the pressure-sensitive adhesive layer 1 to be cut, and an inner peripheral portion of the pressure-sensitive adhesive layer 1 is applied to the cut object. 6 is affixed.

The adhesive sheet 10 for manufacturing a chip body shown in FIG. 7 has an adhesive layer 3 that is located outside the stretchable film 4 on the lower surface of the lower surface of the extensible film 4 and outside the fixing section of the adhesive sheet for manufacturing the chip body. The shrinkable film 2 is laminated via the film, and the pressure-sensitive adhesive layer 1 for sticking the object to be cut is provided on the extensible film 4. An end of the pressure-sensitive adhesive sheet 10 for manufacturing a chip body is fixed by a ring frame 5 at an upper peripheral portion of the pressure-sensitive adhesive layer 1 to be cut, and an inner peripheral portion of the pressure-sensitive adhesive layer 1 is applied to the cut object. 6 is affixed.

に お い て In the present invention, it is particularly preferable to use the pressure-sensitive adhesive sheet 10 for manufacturing a chip body having the configuration shown in FIG.

方法 The method for manufacturing a chip body of the present invention will be described using the pressure-sensitive adhesive sheet for manufacturing a chip body shown in FIG. An object 6 to be cut is stuck on the pressure-sensitive adhesive layer 1 of the pressure-sensitive adhesive sheet 10 for chip production, the pressure-sensitive adhesive sheet 10 for chip production is fixed with a ring frame 5, and the object 6 is cut (diced). 7 is assumed.

Here, as the object 6 to be cut, for example, a semiconductor wafer having a large number of circuits formed on its surface, specifically, a Si wafer, a Ge wafer, a GaAs wafer;
Ceramic plates of alumina, zirconia, silicon nitride, silicon carbide, etc., insulating substrates, various electronic devices;
Glass plate, quartz, etc. used as optical elements;
Wiring boards such as printed circuit boards;
Lead frame made of iron or copper;
TAB (Tape Automated Bonding) tape;
Various resin moldings;
And a composite of these, specifically, a semiconductor having been mounted on a lead frame, a resin-sealed product thereof, and a resin-sealed product of a semiconductor having been mounted on a TAB tape.

切断 It is preferable that the cutting depth at the time of dicing is set at a point in the stretchable film 4 where the shrinkable film 2 is completely cut (FIG. 8). By completely cutting the shrinkable film 2, the effect of restraining the shrinkage is reduced. Therefore, the portion indicated by “8” in the drawing (that is, outside the portion where the cut object is adhered and the chip body is manufactured) Of the shrinkable film 2 (inside the fixing portion of the pressure-sensitive adhesive sheet) can be sufficiently expressed.

Next, the shrinkable film 2 is shrunk by a required means. When a heat-shrinkable film is used, the shrinkable film 2 is shrunk by heating the laminate of the chip 7 and the pressure-sensitive adhesive sheet 10 for chip production to 60 to 150 ° C.

When the film 2 is shrunk in this manner, the pressure-sensitive adhesive layer 1 formed thereon is also deformed accompanying the shrinkage of the film 2, so that the bonding area between the chip 7 and the pressure-sensitive adhesive layer 1 decreases. As a result, the chip interval spreads vertically and horizontally uniformly (FIG. 9). As shown in FIG. 9, this is the contraction film 2 of the uncut portion 8 existing between the ring frame 5 for fixing the chip body manufacturing pressure-sensitive adhesive sheet 10 and the cut object attaching portion. This causes a contraction stress (indicated by an arrow in FIG. 9) to be generated, whereby tension is also applied to the extensible film 4, and the extensible film 4 is pulled in the direction of the ring frame 5. As a result, the same effect as when the pressure-sensitive adhesive sheet 10 for manufacturing a chip body is expanded can be obtained. For this reason, the chip interval is uniformly widened, so that the bonder can be satisfactorily recognized without performing the expanding step.

When applying the pressure-sensitive adhesive sheet for producing a chip body of the present invention to the production of a chip body such as an elongated line sensor, use a uniaxially stretched film for the shrinkable film, and extend the stretching direction of the shrinkable film in the short side direction of the chip body. When combined, the difference between the vertical and horizontal chip spacing is reduced, which is preferable. Further, it is preferable to use a biaxially stretched film for a chip body having the same or similar long side and short side, since the difference between the vertical and horizontal chip intervals is similarly reduced.

Further, in the present invention, the shrinkage rate of the shrinkable film 2 can be controlled by appropriately setting the shrinkage conditions (temperature, time, etc.) of the shrinkable film 2, so that the expansion rate of the chip interval can be easily changed. be able to.

When the pressure-sensitive adhesive layer 1 is made of a UV-curable pressure-sensitive adhesive, before or after the above-described shrinkage, ultraviolet irradiation is performed to cure the pressure-sensitive adhesive layer and reduce the adhesive force. It is particularly preferable because it is possible. By curing the pressure-sensitive adhesive layer, the vertical peeling force can be further reduced, and the chip 7 can be easily picked up.

The pressure-sensitive adhesive sheet for manufacturing a chip body according to the present invention is suitably used in the above-described method for manufacturing a chip body, and includes a stretchable film 4 and a pressure-sensitive adhesive layer 1 for attaching an object to be cut. It is characterized in that it comprises an object sticking part and a shrinking part in which at least one layer of the shrinkable film 2 is arranged outside the object to be cut.

Specific examples of the pressure-sensitive adhesive layer 1, the contractible film 2, the extensible film 4, and the like are the same as those described above, and the joining of the contractible film 2 and the extensible film 4 is performed as described above. Adhesive 3 may be used, or direct bonding may be performed by means such as heat sealing.

具体 The specific structure of the pressure-sensitive adhesive sheet for producing a chip body according to the present invention is shown in FIGS. 1 to 7, and among these, it is particularly preferable to adopt the structure shown in FIG. 1 or FIG. 2.

That is, as shown in FIG. 1, for example, as shown in FIG. 1, the pressure-sensitive adhesive sheet for producing a chip body is obtained by laminating a pressure-sensitive adhesive layer for attaching an object to be cut, a shrinkable film, and an extensible film in this order over the entire surface. Pressure-sensitive adhesive sheet for producing chip bodies, and
As shown in FIG. 2, a pressure-sensitive adhesive sheet for producing a chip body, in which a pressure-sensitive adhesive layer for attaching an object to be cut, an extensible film, and a shrinkable film are laminated on the entire surface in this order, is particularly preferable.

The stretchable film preferably has an elastic modulus of less than 1 × 10 ⁹ N / m ² .

Further, the pressure-sensitive adhesive layer is preferably made of a radiation-curable pressure-sensitive adhesive.

Furthermore, it is preferable that the shrinkable film and the extensible film are laminated via an adhesive layer having an elastic modulus of 1.0 × 10 ⁵ N / m ² or more.

The pressure-sensitive adhesive sheet for producing a chip body according to the present invention is suitably used for purposes such as surface protection and temporary fixing of electronic device products, in addition to the above-described method for producing a chip body.

〔Example〕
Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples. In the following examples and comparative examples, “chip spacing” and “chip alignment” were evaluated as follows.

Chip spacing An 8-inch silicon wafer is attached to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for chip production prepared in Examples and Comparative Examples, and the pressure-sensitive adhesive sheet is fixed to a ring frame. This is diced by a known method and divided into 10 mm × 10 mm IC chips.

Next, the pressure-sensitive adhesive sheet is heat-treated at 90 ° C. for 1 minute. The distance between the chips after the heat treatment (with respect to the orientation flat of the wafer: horizontal direction = X, vertical direction = Y) was measured using an optical microscope.

Using the data obtained by measuring the chip alignment “chip interval”, the chip alignment was evaluated by the following formula. The smaller the value, the better the alignment.
Chip alignment = (standard deviation of chip spacing) / (average value of chip spacing)
[Example 1]
1- (1) [Manufacture of adhesive 1 for sticking to cut objects]
100 parts by weight of an acrylic pressure-sensitive adhesive (copolymer of n-butyl acrylate and acrylic acid), 200 parts by weight of a urethane acrylate oligomer having a molecular weight of 7,000, 10 parts by weight of a crosslinking agent (isocyanate type), and an ultraviolet curing reaction The mixture was mixed with 10 parts by weight of an initiator (benzophenone-based) to prepare an ultraviolet-curable pressure-sensitive adhesive composition for attaching an object to be cut.

1- (2) [Adhesive 3 for film bonding]
As a film bonding adhesive, a polyurethane adhesive (elastic modulus = 3.0 × 10 ⁸ N / m ² ) was used.

1- (3) [Lamination of shrinkable film 2 and extensible film 4]
A 1- (2) adhesive is applied to an extensible ethylene-methacrylic acid copolymer film (100 μm thick).
It was applied to a thickness of 5 μm on an elastic modulus of 2.15 × 10 ⁸ N / m ² ) and heated at 100 ° C. for 30 seconds. Next, a heat-shrinkable polyethylene terephthalate film (thickness: 30 μm, shrinkage at 120 ° C .: 50%) is bonded to the adhesive layer on the ethylene-methacrylic acid copolymer film, and a shrinkable film and an extensible film are bonded. Was produced.

1- (4) [Production of pressure-sensitive adhesive sheet 10 for chip production]
The pressure-sensitive adhesive composition obtained in 1- (1) was applied to a release-treated 25 μm-thick polyethylene terephthalate film so as to have a thickness of 10 μm, and heated at 100 ° C. for 1 minute. Next, the laminated sheet obtained in 1- (3) was attached to the side of the shrinkable film, and was cut into a circular shape having a diameter of 270 mm. 10 was created. Table 1 shows the results.

[Example 2]
2- (1) [Manufacture of adhesive 1 for sticking to cut objects]
The same operation as 1- (1) in Example 1 was performed to prepare an ultraviolet-curable pressure-sensitive adhesive composition.

2- (2) [Lamination of adhesive layer 1 and shrinkable film 2]
The pressure-sensitive adhesive composition obtained in the above 2- (1) was applied to a release-treated 25 μm-thick polyethylene terephthalate film so as to have a thickness of 10 μm, and heated at 100 ° C. for 1 minute. Next, a heat-shrinkable polyethylene terephthalate film (thickness: 30 μm, shrinkage at 120 ° C .: 50%) was bonded to the pressure-sensitive adhesive layer side on the polyethylene terephthalate film to prepare a shrinkable film having a pressure-sensitive adhesive layer. .

2- (3) [Production of adhesive 3 for film bonding]
An adhesive composition for bonding a film was prepared by mixing 100 parts by weight of an acrylic pressure-sensitive adhesive (copolymer of n-butyl acrylate and acrylic acid) and 2 parts by weight of a crosslinking agent (isocyanate type). The elastic modulus of the obtained adhesive was 1.0 × 10 ⁵ N / m ² .

2- (4) [Lamination of film bonding adhesive 3 and extensible film 4]
The adhesive composition prepared in 2- (3) was applied on a 25 μm-thick polyethylene terephthalate film subjected to a release treatment so as to have a thickness of 25 μm, and heated at 100 ° C. for 1 minute. Next, an extensible ethylene-methacrylic acid copolymer film (thickness: 100 μm, elastic modulus: 2.15 × 10 ⁸ N / m ² ) was attached to the adhesive layer on the polyethylene terephthalate film and laminated.

2- (5) [Production of adhesive sheet 10 for producing chip body]
While peeling the peelable polyethylene terephthalate film of the extensible film having the adhesive layer created in the above 2- (4), the adhesive layer side of the extensible film, 2- (2)
1. A pressure-sensitive adhesive sheet for producing a UV-curable pressure-sensitive adhesive chip having the configuration shown in FIG. 10 was created. Table 1 shows the results.

[Example 3]
The pressure-sensitive adhesive composition for attaching an object to be cut is composed of 100 parts by weight of an acrylic pressure-sensitive adhesive (copolymer of n-butyl acrylate and 2-hydroxyethyl acrylate) and 10 parts by weight of a crosslinking agent (isocyanate). A peelable pressure-sensitive adhesive sheet for producing a chip body was prepared in the same manner as in Example 2 except that the peelable pressure-sensitive adhesive composition was used. Table 1 shows the results.

[Example 4]
4- (1) [Manufacture of adhesive 1 for sticking cut objects]
The same operation as in 1- (1) of Example 1 was performed to prepare an ultraviolet-curable pressure-sensitive adhesive composition.

4- (2) [Lamination of adhesive layer 1 and extensible film 4]
The pressure-sensitive adhesive composition prepared in 4- (1) was applied to a release-treated 25 μm-thick polyethylene terephthalate film so as to have a thickness of 10 μm, and heated at 100 ° C. for 1 minute. Next, an extensible ethylene-methacrylic acid copolymer film (thickness: 100 μm, elastic modulus: 2.15 × 10 ⁸ N / m ² ) was attached to the pressure-sensitive adhesive layer on the polyethylene terephthalate film and laminated.

4- (3) [Production of adhesive 3 for film bonding]
The same operation as in 2- (3) of Example 2 was performed to produce an adhesive composition for bonding a film.

4- (4) [Lamination of adhesive 3 for film bonding and shrinkable film 2]
The adhesive composition prepared in 4- (3) above was applied on a 25 μm-thick polyethylene terephthalate film subjected to a release treatment so as to have a thickness of 25 μm, and heated at 100 ° C. for 1 minute. Next, a shrinkable polyethylene terephthalate film (thickness: 30 μm, shrinkage at 120 ° C .: 50%) was bonded to the pressure-sensitive adhesive layer side of the polyethylene terephthalate film to obtain a shrinkable film having a pressure-sensitive adhesive layer.

4- (5) [Production of pressure-sensitive adhesive sheet 10 for chip production]
While peeling the peeled polyethylene terephthalate film of the shrinkable film having the adhesive layer created in 4- (4), the adhesive side of the shrinkable film, the adhesive layer produced in 4- (2) The extensible film was bonded to the side without the pressure-sensitive adhesive layer and was cut into a circular shape having a diameter of 270 mm to produce a pressure-sensitive adhesive sheet 10 for producing a UV-curable pressure-sensitive adhesive chip having the structure shown in FIG. Table 1 shows the results.

[Example 5]
A pressure-sensitive adhesive sheet for producing a peelable pressure-sensitive chip body by performing the same operation as in Example 4 except that the pressure-sensitive adhesive composition for attaching a cut object is the same peelable pressure-sensitive adhesive composition as that of Example 3. It was created. Table 1 shows the results.

[Example 6]
6- (1) [Manufacture of adhesive 1 for sticking to cut objects]
The same operation as 1- (1) in Example 1 was performed to prepare an ultraviolet-curable pressure-sensitive adhesive composition.

6- (2) [Lamination of adhesive layer 1 and extensible film 4]
By performing the same operation as in 4- (2) of Example 4, an extensible film having an adhesive layer comprising the adhesive composition of 6- (1) was prepared.

6- (3) [Manufacture of adhesive 3 for bonding film]
The same operation as in 2- (3) of Example 2 was performed to produce an adhesive composition.

6- (4) [Lamination of adhesive 3 for film bonding and shrinkable film 2]
The same operation as in 4- (4) of Example 4 was carried out, and after laminating the adhesive for film lamination and the shrinkable film in 6- (3), the film was die-cut into a circle, and an empty space having an inner diameter of 210 mm was obtained. A shrinkable film having holes and an adhesive layer was obtained.

6- (5) [Production of adhesive sheet 10 for producing chip body]
6- (4) While peeling the peeled polyethylene terephthalate film having the adhesive layer having the adhesive layer obtained in (4), the adhesive side of the shrinkable film, the adhesive layer obtained in 6- (2) Is bonded to the extensible film side having no pressure-sensitive adhesive layer, and cut into a circle having a diameter of 270 mm so as to be concentric with the pores. A pressure-sensitive adhesive sheet 10 for production was prepared. Table 1 shows the results.

[Example 7]
7- (1) [Manufacture of adhesive 1 for sticking to cut objects]
The same removable adhesive composition as in Example 3 was prepared.

7- (2) [Lamination of adhesive layer and extensible film 4]
By performing the same operation as 4- (2) in Example 4, an extensible film having an adhesive layer comprising the adhesive composition of 7- (1) was prepared.

7- (3) [Production of adhesive 9 for fixing ring frame]
An adhesive composition having the same composition as 2- (3) of Example 2 was produced.

7- (4) [Lamination of pressure-sensitive adhesive 9 for fixing ring frame and shrinkable film 2]
Except that the pressure-sensitive adhesive composition obtained in 7- (3) was applied to a thickness of 10 μm, the same operation as in 6- (4) of Example 6 was carried out to have an inner diameter of 210 mm and a diameter of 7 mm. -A shrinkable film having the pressure-sensitive adhesive layer of (3) was obtained.

7- (5) [Production of adhesive sheet 10 for producing chip body]
While peeling the peeled-treated polyethylene terephthalate film of the stretchable film having the removable pressure-sensitive adhesive layer obtained in 7- (2), the adhesive side of the stretchable film is manufactured in 7- (4) 3 is bonded to the side of the shrinkable film having the pressure-sensitive adhesive layer without the pressure-sensitive adhesive layer, and is cut into a circle having a diameter of 270 mm so as to be concentric with the pores. The adhesive sheet 10 for producing a chip body was obtained. Table 1 shows the results.

[Comparative Example 1]
Example 1 was repeated except that a non-stretchable substrate (polyethylene terephthalate film, 100 μm, elastic modulus 4.53 × 10 ⁹ N / m ² ) was used instead of the stretchable substrate of Example 2. A similar operation was performed. Table 1 shows the results.

1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 1 shows an example of an adhesive sheet for producing a chip body used in the present invention. 4 shows a part of the steps of the method for manufacturing a chip body according to the present invention. 4 shows a part of the steps of the method for manufacturing a chip body according to the present invention.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 ... Adhesive layer for sticking to cut object 2 ... Shrinkable film 3 ... Adhesive layer 4 ... Extensible film 5 ... Ring frame 6 ... Cut object 7 ... Chip 9 ... Adhesive layer for fixing ring frame 10 ... Adhesive sheet for chip production

Claims (4)

粘着 A pressure-sensitive adhesive sheet for producing a chip body, wherein a pressure-sensitive adhesive layer for attaching a cut object, a shrinkable film, and an extensible film are laminated in this order. ^{2. The} pressure-sensitive adhesive sheet according to claim 1, wherein the extensible film has an elastic modulus of less than 1 × 10 ⁹ N / m ² . The pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the pressure-sensitive adhesive layer is made of a radiation-curable pressure-sensitive adhesive. 4. The shrinkable film and the extensible film are laminated via an adhesive layer having an elastic modulus of 1.0 × 10 ⁵ N / m ² or more. 3. The pressure-sensitive adhesive sheet for producing a chip body according to 1.).

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