JP2004119897A5 - - Google Patents

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Publication number
JP2004119897A5
JP2004119897A5 JP2002284447A JP2002284447A JP2004119897A5 JP 2004119897 A5 JP2004119897 A5 JP 2004119897A5 JP 2002284447 A JP2002284447 A JP 2002284447A JP 2002284447 A JP2002284447 A JP 2002284447A JP 2004119897 A5 JP2004119897 A5 JP 2004119897A5
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JP
Japan
Prior art keywords
word line
line
power supply
memory cell
lines
Prior art date
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Pending
Application number
JP2002284447A
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Japanese (ja)
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JP2004119897A (en
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Priority to JP2002284447A priority Critical patent/JP2004119897A/en
Priority claimed from JP2002284447A external-priority patent/JP2004119897A/en
Publication of JP2004119897A publication Critical patent/JP2004119897A/en
Publication of JP2004119897A5 publication Critical patent/JP2004119897A5/ja
Pending legal-status Critical Current

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Claims (5)

少なくとも1個のセルアレイブロックを構成するように半導体基板上に形成された複数の磁気抵抗素子を含むメモリセルを含み、
ワード線と、
前記ワード線により少なくとも読み出し時に同時に選択される複数の前記メモリセルと、
前記選択された複数のメモリセルの一端に夫々接続された複数の電源線と、
前記メモリセルの他端に夫々接続され前記電源線と夫々平行に配置された複数のビット線とを具備し、
前記ワード線は、複数の前記ビット線及び複数の前記電源線にほぼ直角に配置されたことを特徴とする半導体記憶装置。
Including a memory cell including a plurality of magnetoresistive elements formed on a semiconductor substrate so as to constitute at least one cell array block;
A word line,
A plurality of the memory cells that are simultaneously selected at the time of reading by the word line; and
A plurality of power lines respectively connected to one end of the selected plurality of memory cells;
A plurality of bit lines each connected to the other end of the memory cell and arranged in parallel with the power line;
2. The semiconductor memory device according to claim 1, wherein the word line is disposed substantially perpendicular to the plurality of bit lines and the plurality of power supply lines.
前記メモリセルは夫々、
1個の磁気抵抗素子とこの磁気抵抗素子に直列接続された1個の選択素子とを含んで構成され、前記ワード線は書き込み用ワード線と読み出し用ワード線とを含み、
前記セルアレイブロックは、
複数の磁気抵抗素子と、
複数の前記磁気抵抗素子に夫々直列接続された複数の選択素子と、
前記書き込み用ワード線と、
前記読み出し用ワード線と、
複数のビット線と、
複数の電源線とを有し、
複数の前記磁気抵抗素子は前記読み出し用ワード線により同時に選択され、夫々の一端は前記ビット線に接続され他端は前記選択素子の一端に接続され、複数の前記選択素子の夫々は前記読み出し用ワード線により同時に選択され、複数の前記電源線は複数の前記選択素子の他端に夫々接続されることを特徴とする請求項1に記載の半導体記憶装置。
Each of the memory cells is
One magnetoresistive element and one select element connected in series to the magnetoresistive element, and the word line includes a write word line and a read word line;
The cell array block is:
A plurality of magnetoresistive elements;
A plurality of selection elements each connected in series to the plurality of magnetoresistive elements;
The write word line;
The read word line;
Multiple bit lines,
A plurality of power lines,
The plurality of magnetoresistive elements are simultaneously selected by the read word line, each one end is connected to the bit line, the other end is connected to one end of the selection element, and each of the plurality of selection elements is the read line. 2. The semiconductor memory device according to claim 1, wherein the plurality of power supply lines are simultaneously selected by a word line, and the plurality of power supply lines are respectively connected to the other ends of the plurality of selection elements.
複数の前記電源線の夫々は、複数の前記選択素子のうち互いに隣接する2個の選択素子に共通に接続されていること、を特徴とする請求項2に記載の半導体記憶装置。  3. The semiconductor memory device according to claim 2, wherein each of the plurality of power supply lines is connected in common to two selection elements adjacent to each other among the plurality of selection elements. 更に、複数の前記電源線に共通接続される共通電源線が配置され、前記共通電源線は前記セルアレイブロックに対応して設けられていること、を特徴とする請求項3に記載の半導体記憶装置。  4. The semiconductor memory device according to claim 3, further comprising a common power supply line commonly connected to the plurality of power supply lines, wherein the common power supply line is provided corresponding to the cell array block. . 前記ビット線に沿って隣接して配置されたNMOSトランジスタを含む第1、第2のメモリセルを含み、
前記第1のメモリセルに含まれる第1のNMOSトランジスタは前記読み出し用ワード線として用いられる第1のゲート電極を有し、前記第1のNMOSトランジスタと直列接続される第1の磁気抵抗素子および前記書込み用ワード線は前記第1のゲート電極の上方に配置され、前記第1のNMOSトランジスタのドレイン領域を前記第1の磁気抵抗素子に接続するための第1のコンタクトが、前記ビット線に沿って形成された前記第2のメモリセルとの間に形成されたスペース内に配置され、前記スペース内には前記第2のメモリセルに含まれる第2のNMOSトランジスタのドレイン領域を第2の磁気抵抗素子に接続するための第2のコンタクトが更に配置されていることを特徴とする請求項2に記載の半導体記憶装置。
First and second memory cells including NMOS transistors arranged adjacent to each other along the bit line;
The first NMOS transistor included in the first memory cell has a first gate electrode used as the read word line, and a first magnetoresistive element connected in series with the first NMOS transistor; The write word line is disposed above the first gate electrode, and a first contact for connecting a drain region of the first NMOS transistor to the first magnetoresistive element is connected to the bit line. The drain region of the second NMOS transistor included in the second memory cell is disposed in the space formed between the second memory cell and the second memory cell formed along the second memory cell. 3. The semiconductor memory device according to claim 2, further comprising a second contact for connecting to the magnetoresistive element.
JP2002284447A 2002-09-27 2002-09-27 Semiconductor memory Pending JP2004119897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002284447A JP2004119897A (en) 2002-09-27 2002-09-27 Semiconductor memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002284447A JP2004119897A (en) 2002-09-27 2002-09-27 Semiconductor memory

Publications (2)

Publication Number Publication Date
JP2004119897A JP2004119897A (en) 2004-04-15
JP2004119897A5 true JP2004119897A5 (en) 2005-09-29

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JP2002284447A Pending JP2004119897A (en) 2002-09-27 2002-09-27 Semiconductor memory

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100527536B1 (en) * 2003-12-24 2005-11-09 주식회사 하이닉스반도체 Magnetic random access memory
JP2007311488A (en) * 2006-05-17 2007-11-29 Toshiba Corp Magnetic storage
US8208290B2 (en) * 2009-08-26 2012-06-26 Qualcomm Incorporated System and method to manufacture magnetic random access memory
JP5870634B2 (en) * 2011-11-09 2016-03-01 凸版印刷株式会社 Non-volatile memory
US11093684B2 (en) * 2018-10-31 2021-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Power rail with non-linear edge
TWI811517B (en) 2020-01-16 2023-08-11 聯華電子股份有限公司 Layout pattern for magnetoresistive random access memory

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