JP2004115838A - Production method for electroformed pipe, electroformed pipe, and fine wire rod for producing electroformed pipe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily remove a fine wire rod from an electroformed part or an surrounded part formed by electroforming. <P>SOLUTION: The electroformed pipe is produced by forming an electroformed part around a fine wire rod 30 by electrodeposition, and removing the fine wire rod 30 from the electrodeposited part. The fine wire rod 30 is removed by heating the electrodeposited part and thermally expanding the same, or cooling the fine wire rod 30 and shrinking the same to form a gap between the electrodeposited part and the fine wire rod 30, and using a method of holding and pulling the fine wire rod 30, or sucking the fine wire rod 30, or physically pushing the same away, or jetting a gas or a liquid and pushing the same away. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing an electroformed (hereinafter referred to as “electroformed”) pipe, an electroformed pipe, and a thin wire material for producing the electroformed pipe, and more particularly, an electroformed pipe having a fine inner diameter. The present invention relates to a pipe manufacturing method and an electroformed pipe. The present invention also relates to a fine wire for producing an electroformed pipe having a fine inner diameter.
[0002]
[Prior art and its problems]
Conventionally, when an integrated circuit such as an LSI is manufactured, a semiconductor pattern is completed as designed, and it is inspected whether the electrical continuity is good. This inspection is performed by using a device having a large number of contact probes (referred to as “probe device” in this specification) and contacting each electrode on which the pins of the contact probe are formed. The contact probe has a structure in which a spring is provided inside an extremely fine tube having a required length, and a pin is provided so as to be able to advance and retract in the tube.
[0003]
By the way, recent advances in semiconductor manufacturing technology are remarkable, and the degree of integration tends to be higher and higher. Along with this, the number of contact probes is increased (multiple pins), the wire diameter is reduced (thinning), and the contact probes are connected so that the probe device for inspecting the electrical continuity of the electrodes can support the latest integrated circuits. It is also demanded that the interval of (n) be narrower (narrow pitch). The current contact probe tube is the smallest in the world with an outer diameter of 110 μm and an inner diameter of 88 μm (see, for example, Non-Patent Document 1).
However, as described above, since the semiconductor manufacturing technology is further evolving, it is necessary to further reduce the size of the contact probe.
[0004]
The need for a tube having a fine inner diameter is also increasing in fields other than the semiconductor industry, such as biotechnology and medicine.
In other words, the development of a tube having such a fine inner diameter is strongly demanded by the entire industry.
[0005]
The inventor has conducted research on electroforming, and has succeeded in manufacturing a small-diameter tube by electroforming previously. The electroformed pipe at this time has a hollow portion having a circular cross section and an inner diameter of 126 μm (see, for example, Patent Document 1). Therefore, the present inventor has come up with the idea that if an electroforming technique is used, a tube having a fine inner diameter (hollow part) for a contact probe can be obtained.
[0006]
As a result of further research, we succeeded in attaching a metal film having a minimum thickness of 5 μm to the outer surface of the fine wire using a fine wire having a diameter of 10 μm to 85 μm. Thus, it has been found that if the fine wire can be removed from the metal, a tube having a fine inner diameter (hollow part) can be produced.
However, removing the fine wire from the electrodeposited (deposited) metal is not easy because the electrodeposited metal is in close contact with the outer surface of the fine wire.
[0007]
[Patent Document 1]
JP 2002-48947 A
[Non-Patent Document 1]
Nikkei Mechanical ON LINE, April 2001 issue, Nikkei BP, Internet <URL: http: // dm. nikkeibp. co. jp / free / nmc / kiji / h559 / t559g. html>
[0008]
(Object of the present invention)
The purpose of the present invention is to
(1) To provide a method for producing an electroformed pipe having a fine inner diameter, an electroformed pipe, and a fine wire for producing the electroformed pipe.
(2) A method of manufacturing an electroformed tube that makes it easy to remove a thin wire by allowing a jig or tool to be hooked on the electrodeposit or the surrounding when removing the thin wire from the electrodeposit or the surrounding. It is to provide.
(3) An electroformed pipe manufacturing method and electroformed pipe, in which a conductive layer such as gold plating is provided on the inner surface so that the electric conductivity is better than that of an electrodeposit or an enclosed object, and the electroformed pipe It is to provide a fine wire rod.
(4) A method for producing an electroformed tube, an electroformed tube, and an electroformed tube, which are provided with at least two conductive layers of different materials on the inner surface so that the conductive layers and the electrodeposit or the enclosure have good adhesion. The object is to provide a thin wire for manufacturing.
(5) An object of the present invention is to provide an electroformed tube manufacturing method and an electroformed tube having a plurality of hollow portions.
(6) An object is to provide an electroformed tube manufacturing method and an electroformed tube which are provided with a plurality of hollow portions and can conduct electricity independently for each portion forming around each hollow portion.
(7) When removing the fine wire, it is difficult to apply a tensile force to the conductive layer provided on the inner surface, making it easy to separate the conductive layer from the base wire, and the adhesion between the conductive layer and the electrodeposit or the surrounding object An object of the present invention is to provide a method for manufacturing an electroformed tube that makes it difficult to damage.
[0009]
[Means for Solving the Problems]
The means of the present invention taken to achieve the above object are as follows.
In the first invention,
A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The thin wire rod is formed by forming a gap between the electrodeposit or the surrounding wire and the fine wire material by heating and thermally expanding the electrodeposit or the surrounding material, or by cooling and shrinking the thin wire material, thereby grasping the thin wire material. It is removed by using any of the method of pulling, sucking, physically pushing, or ejecting gas or liquid by pushing,
It is a manufacturing method of an electroformed pipe.
[0010]
In the second invention,
A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
Fine wire rods can be slipped by dipping in liquid or applying liquid to make the area where the fine wire rod and electrodeposit or enclosure are in contact with each other. Or by using a method of either pushing gas or a liquid and ejecting it,
It is a manufacturing method of an electroformed pipe.
[0011]
In the third invention,
A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The fine wire is pulled from one or both to be deformed so that the cross-sectional area is reduced, and a gap is formed between the fine wire and the electrodeposit or the enclosure, and the fine wire is grasped and pulled or sucked, Characterized in that it is removed using either a physical push or a jet of gas or liquid.
It is a manufacturing method of an electroformed pipe.
[0012]
In the fourth invention,
It is characterized by increasing the amount of electrodeposits or surrounding objects on the end side formed in the thin wire,
It is the manufacturing method of the electroformed pipe which concerns on 1st, 2nd or 3rd invention.
[0013]
In the fifth invention,
The amount of deformation of lateral strain when the fine wire is pulled and stretched outward is 5% or more of the cross-sectional area,
It is a manufacturing method of the electroformed pipe concerning the 3rd invention.
[0014]
In the sixth invention,
A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The fine wire is removed by melting with heat or a solvent,
It is a manufacturing method of an electroformed pipe.
[0015]
In the seventh invention,
Using a thin wire material provided with a conductive layer on the outer surface, the fine wire material is removed so that the conductive layer remains on the inner surface of the electroformed tube,
It is the manufacturing method of the electroformed pipe which concerns on 1st, 2nd, 3rd, 4th, 5th or 6th invention.
[0016]
In the eighth invention,
Using a thin wire material in which at least two conductive layers of different materials are formed on the outer surface side, the electrodeposit or enclosure and the outer conductive layer of the fine wire material are brought into close contact with each other, and the inner conductive layer is the inner surface of the electroformed tube It is characterized by removing the thin wire material so that it remains in
It is the manufacturing method of the electroformed pipe which concerns on 1st, 2nd, 3rd, 4th, 5th or 6th invention.
[0017]
In the ninth invention,
The inner shape of the hollow portion formed by removing the thin wire from the electrodeposit or the surrounding object has a circular cross section or a polygonal cross section,
It is the manufacturing method of the electroformed pipe | tube which concerns on 1st, 2nd, 3rd, 4th, 5th, 6th, 7th or 8th invention.
[0018]
In the tenth invention,
It is characterized by comprising a plurality of hollow parts formed by removing the fine wire material,
It is the manufacturing method of the electroformed pipe | tube which concerns on 1st, 2nd, 3rd, 4th, 5th, 6th, 7th, 8th or 9th invention.
[0019]
In the eleventh invention,
By interposing a partition body formed by providing a conductive layer on the outer surface of the insulator between the hollow portions, it is possible to conduct electric conduction independently for each portion forming around each hollow portion. Features
It is a manufacturing method of the electroformed pipe concerning the 10th invention.
[0020]
In the twelfth invention,
An electroformed pipe manufactured by forming an electrodeposit or a surrounding object around a thin wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The hollow part formed by removing the thin wire from the electrodeposit or the surrounding object has an inner shape of a circular cross section, the inner diameter of the hollow part is 10 μm or more and 85 μm or less, and the inner shape of the hollow part is a polygonal cross section The diameter of the inscribed circle of the hollow portion is 10 μm or more and 85 μm or less,
It is an electroformed pipe.
[0021]
In the thirteenth invention,
The wall thickness is 5 μm or more and 50 μm or less,
It is an electroformed pipe concerning the 12th invention.
[0022]
In the fourteenth invention,
The inner surface is provided with a conductive layer made of a material different from the electrodeposit or the surrounding object,
An electroformed tube according to the twelfth or thirteenth invention.
[0023]
In the fifteenth invention,
A conductive layer made of a material different from the electrodeposit or the surrounding object is provided on the inner surface, and a conductive layer made of a material different from the conductive layer is provided between the electrodeposit or the surrounding object and the conductive layer. It is characterized by
An electroformed tube according to the twelfth or thirteenth invention.
[0024]
In the sixteenth invention,
There are a plurality of hollow parts formed by removing the fine wire material,
The electroformed pipe according to the twelfth, thirteenth, fourteenth or fifteenth invention.
[0025]
In the seventeenth invention,
By interposing a partition body formed by providing a conductive layer on the outer surface of the insulator between the hollow portions, it is configured so that electric conduction can be performed independently for each portion forming around each hollow portion. It is characterized by being,
It is an electroformed pipe concerning the 16th invention.
[0026]
In the eighteenth invention,
The conductive layer provided on the outer surface of the partition wall is configured to form a part of the hollow part,
An electroformed pipe according to a seventeenth aspect of the invention.
[0027]
In the nineteenth invention,
The partition wall is characterized in that the thickness of the portion provided between the adjacent hollow portions is 5 μm or more and 50 μm or less,
An electroformed pipe according to the seventeenth or eighteenth invention.
[0028]
In the twentieth invention,
A thin wire material for producing an electroformed tube by forming an electrodeposit or a surrounding object by electroforming and removing from the electrodeposit or the surrounding object,
When the outer shape has a circular cross section, the outer diameter is 10 μm or more and 85 μm or less, and when the outer shape has a polygonal cross section, the diameter of the inscribed circle is 10 μm or more and 85 μm or less. The amount of deformation of lateral strain when stretched is 5% or more of the cross-sectional area,
It is a thin wire for producing an electroformed pipe.
[0029]
In the twenty-first invention,
The outer surface is provided with a conductive layer made of a material different from that of the electrodeposit or the surrounding object,
A thin wire for producing an electroformed pipe according to a twentieth invention.
[0030]
In the twenty-second invention,
A conductive layer made of a material different from that of the electrodeposit or the surrounding object is provided on the outer surface, and a conductive layer made of a material different from the conductive layer is provided between the thin wire base member and the conductive layer. It is characterized by
A thin wire for producing an electroformed pipe according to a twentieth invention.
[0031]
In the 23rd invention,
It is characterized in that there is a portion where the conductive layer is not provided on both end sides,
A thin wire rod for manufacturing an electroformed pipe according to the twentieth, twenty-first or twenty-second invention.
[0032]
In the 24th invention,
The outer shape is formed in a circular cross section or a polygonal cross section,
A thin wire for producing an electroformed pipe according to the twentieth, twenty-first, twenty-second or twenty-third invention.
[0033]
As the fine wire, for example, a metal wire or the like formed entirely of a conductive material can be used, and a conductive layer (for example, metal such as plating, carbon, etc.) is provided around the conductive material. It is also possible to use one provided with In addition, a thin wire made of an insulating material such as a synthetic resin wire and a conductive layer (for example, a metal such as electroless plating, carbon, etc.) provided therearound can be used.
Furthermore, in the case where a separate conductor is provided in the vicinity of the fine wire, and the metal is electrodeposited (deposited) on this conductor, in addition to the above-mentioned fine wire, the whole is further made like a synthetic resin wire. The one formed of an insulating material (one not provided with a conductive material) can also be used.
[0034]
The material at which the metal is electrodeposited by electroforming is not particularly limited as long as it has conductivity, but a material having good electrical conductivity is used in order to facilitate metal electrodeposition. It is preferable. For example, iron, stainless steel, copper, gold, silver, brass, nickel, aluminum, carbon, etc. can be used.
[0035]
In addition, as the insulating material constituting the thin wire and the insulator of the partition wall, a nonconductor (insulator) in which electricity hardly flows, or a semiconductor that becomes both a conductor and a nonconductor due to temperature or the like can be used. As the insulating material, for example, a thermosetting resin, a thermoplastic resin, an engineer plastic, a chemical fiber (synthetic fiber, semi-synthetic fiber, regenerated fiber, inorganic fiber) or the like can be used. For example, phenol resin, urea resin, melamine resin, diallyl phthalate resin, unsaturated polyester resin, silicone resin, epoxy resin, polyethylene, crosslinked polyethylene, chlorinated polyethylene, ethylene / vinyl acetate copolymer, polypropylene, polyisobutylene, polychlorinated Vinyl, polyvinylidene chloride, polyvinyl alcohol, polyvinyl acetal, acrylic resin, polyvinyl acetate, polyacrylonitrile, modacrylic, polystyrene, styrene / acrylonitrile copolymer, acrylonitrile / butadiene / styrene terpolymer, acetate, triacetate, fluororesin , Polytetrafluoroethylene, polybutylene terephthalate, polyarylate, polyacetal, polycarbonate, polyphenylene sulfide, poly Ruhon, wholly aromatic polyimide, polyamideimide, polyetherimide, polyetheretherketone, polybenzimidazole, polyester, polyethylene terephthalate, polyamide, nylon, aramid, polyurethane, spandex, polyalkylene paraoxybenzoate, benzoate, polyfluoroethylene, Promix, rayon, cupra, glass fiber, etc. can be mentioned.
Further, as the insulating material, a so-called filament yarn that is not twisted or spun can be used, or a spun yarn can be used.
[0036]
The term “cross-sectional circular shape” shown by the inner shape of the electroformed pipe or the outer shape of the thin wire does not mean that the cross-sectional shape is strictly circular, but is substantially circular or elliptical. It is used as a concept including shapes.
[0037]
The term “cross-sectional polygonal shape” shown by the inner shape of the electroformed tube or the outer shape of the thin wire does not mean that the sectional shape is strictly a polygonal shape. For example, the corners are rounded. Such a concept is used as a concept including a substantially polygonal shape. Further, although not particularly limited, specifically, the polygonal shape includes a substantially triangular shape, a substantially rectangular shape (including a rectangular shape, a square shape, a rhombus shape, and a parallelogram shape), a substantially pentagonal shape, a substantially hexagonal shape, and the like. Can be mentioned.
[0038]
Examples of the solvent that dissolves and removes the fine wire include an alkaline solution and an acidic solution.
[0039]
The use of the electroformed tube is not particularly limited, and examples thereof include a contact probe tube (a casing that houses a spring).
[0040]
The “part forming the periphery of the hollow portion” may be an electrodeposit or an enclosure formed by electroforming, or a conductive layer provided on the inner surface of the hollow portion with a material different from that of the electrodeposit or the enclosure. (Including the conductive layer of the partition wall).
[0041]
(Work)
According to the present invention, a thin wire can be removed from an electrodeposit or an enclosure formed by electroforming. The fine wire material can be formed by (1) heating the electrodeposit or the surrounding object to thermally expand, or cooling and contracting the fine wire material to form a gap between the electrodeposited object or the surrounding object and the fine wire material, 2) By soaking or pouring in the liquid, the portion where the thin wire and the electrodeposit or the surrounding object are in contact with each other becomes slippery, or (3) the cross-sectional area is reduced by pulling from one or both By deforming, forming a gap between the thin wire rod and the electrodeposited object or surrounding object, whether it is grasped and pulled, sucked, physically pushed, or gas or liquid is ejected and pushed It is removed using either method. (4) It can also be removed by melting with heat or a solvent.
[0042]
When such a method is used for removing the fine wire, for example, an electrodeposit formed using a fine wire having a diameter of 10 μm to 85 μm and having a thickness of 5 μm to 50 μm on the outer surface of the fine wire. Alternatively, the thin wire can be removed from the surrounding object. Therefore, by using this method for removing a thin wire, for example, an electroformed tube having a fine inner diameter that can be used as a contact probe tube or the like can be manufactured.
[0043]
According to the method of manufacturing an electroformed pipe by increasing the amount of electrodeposits or surroundings on the end side formed on the thin wire, for example, by pulling or pushing the thin wire from the electrodeposit or surroundings At the time of removal, a jig, a tool, or the like can be hooked on an end face or the like of a portion where the amount of electrodeposits or surrounding objects is increased. Therefore, in this case, since the fine wire can be removed while the electrodeposit or the surrounding object is fixed, the thin wire is easy to remove.
[0044]
According to the method of manufacturing an electroformed pipe in which the amount of deformation of the lateral strain when the fine wire is pulled outward and stretched is 5% or more of the cross-sectional area, between the fine wire and the electrodeposit or the enclosure, Since a gap sufficient to remove the fine wire can be formed, there is a high possibility that the fine wire can be removed from the electrodeposit or the surrounding object without any trouble. If the deformation amount of the lateral strain is less than 5% of the cross-sectional area, the gap may not be sufficient, and trouble may occur during removal.
[0045]
According to the method for producing an electroformed tube, which uses a fine wire having an outer surface provided with a conductive layer and removes the fine wire so that the conductive layer remains on the inner surface of the electroformed tube, the electroformed tube provided with gold plating or the like on the inner surface Can be manufactured. Such an electroformed pipe can be used as a component suitable for conducting electricity in this case because, for example, the electrical conductivity can be improved by the material of the conductive layer provided on the inner surface, which is better than that of an electrodeposit or an enclosure. it can.
The same applies to an electroformed tube having a conductive layer made of a material different from that of an electrodeposit or an enclosure on the inner surface, and a thin wire material having a conductive layer made of a material different from the electrodeposit or the enclosure on the outer surface. In addition, a better electroformed tube can be formed when the electrical conductivity is only an electrodeposit or an enclosure.
[0046]
According to the method for producing an electroformed tube using a thin wire material in which at least two conductive layers of different materials are formed on the outer surface side, for example, the outer conductive layer is made of copper and the inner conductive layer in contact with copper is used. The layer can be composed of gold so that nickel can be formed as an electrodeposit or an enclosure by electroforming. In this case, since nickel has better adhesion to copper than gold and copper has better adhesion to gold, an electroformed tube with good adhesion can be formed.
In addition, a conductive layer made of a material different from the electrodeposit or the surrounding object is provided on the inner surface, and a conductive layer made of a material different from the conductive layer is provided between the electrodeposited object or the surrounding object and the conductive layer. A conductive layer made of a material different from the electrodeposit or the surrounding object is provided on the outer surface of the electroformed pipe or the outer surface, and a material different from the conductive layer is provided between the thin wire base member and the conductive layer. Similarly, an electroformed tube having good adhesion between the electrodeposit or the surrounding material and the conductive layer can be formed with the thin wire provided with the conductive layer.
[0047]
A device provided with a plurality of hollow portions formed by removing a thin wire can be used, for example, by replacing a plurality of tubes having only one hollow portion with a plurality of tubes. According to this electroformed pipe, it is possible to eliminate the trouble of arranging the individual pipes side by side. Moreover, since the space | interval between hollow parts is being fixed with the electrodeposit or the enclosure, it does not shift | deviate.
[0048]
A partition wall formed by providing a conductive layer on the outer surface of the insulator is interposed between the hollow portions, so that each portion that forms the periphery of each hollow portion can conduct electricity independently. Can conduct electricity independently for each hollow part.
[0049]
A thin wire having a portion where no conductive layer is provided on both end sides makes it difficult for tensile force to be directly applied to the conductive layer by pulling the portion where the conductive layer is not provided outward. Are easily separated from each other, and the adhesion between the conductive layer and the electrodeposit or the surrounding object is not easily lost.
[0050]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a cross-sectional explanatory view showing an example of an electroforming apparatus for producing an electroformed pipe according to the present invention.
First, an electroforming apparatus for producing an electroformed pipe will be described.
[0051]
The electroforming apparatus 100 includes an electroforming tank 10 and an outer tank 11 that accommodates the electroforming tank 10 inside. The upper part of the electroforming tank 10 and the outer tank 11 is open, and an electrolytic solution (electroforming solution) 20 is always supplied into the electroforming tank 10 during operation. Thus, the electrolytic solution 20 overflows from the upper part of the electroforming tank 10 and flows into the outer tank 11. As the electrolytic solution 20 in the present embodiment, for example, a nickel sulfamate solution added with a brightener or a bit preventing agent is used.
[0052]
The electrolytic solution 20 overflowing from the electroforming tank 10 and flowing into the outer tank 11 is filtered by a filtration device (not shown) and supplied again into the electroforming tank 10. That is, the electrolytic solution 20 circulates continuously between the electroforming tank 10 and the outer tank 11 during operation. In addition, a well-known means can be used for the supply means which supplies the electrolyte solution 20 to the electroforming tank 10 (illustration omitted).
[0053]
In the present embodiment, the portion of the electrolytic solution 20 overflowing from the upper part of the electroforming tank 10 is referred to as an overflow portion 12 for convenience. In the electroforming apparatus 100, electroforming is performed in the overflow portion 12. The electroforming procedure will be described later.
[0054]
A horizontal adjuster device 13 is provided at the lower part of the electroforming tank 10. The horizontal adjuster 13 keeps the electroforming tank 10 substantially horizontal, whereby a substantially horizontal overflow portion 12 is formed over the entire upper portion of the electroforming bath 10, and the electrolytic solution 20 is uniformly distributed at various locations within the overflow portion 12. Can be distributed.
[0055]
Reference numeral 4 denotes a holding jig for holding a thin wire 30 which is a mold member (base material) for electroforming. The holding jig 4 includes a horizontal member 40 having a required length and a pair of hanging members 41 and 41 suspended from both ends of the horizontal member 40. The holding jig 4 is provided such that the hanging members 41 and 41 are located on the side of the electroforming tank 10.
[0056]
The hanging members 41 and 41 are provided with rod-like wire rod fixing members 42 and 43 each having a required length extending in a substantially horizontal direction. The wire fixing members 42 and 43 are rotatably provided on the hanging members 41 and 41. An electrode 44 is provided at the end of the one wire fixing member 42 on the electroforming tank 10 side. A tension device 45 for pulling the fine wire 30 and an electrode 44 are provided at the end of the other wire fixing member 43 on the electroforming tank 10 side. One end and the other end of the thin wire rod 30 are fixed to the wire rod fixing members 42 and 43, respectively, and are provided in a tensioned state by the tension device 45.
[0057]
A rotating shaft 46 is rotatably installed between the hanging members 41 and 41. Reference numeral 47 indicates a drive motor for driving the rotary shaft 46. The rotating shaft 46 passes through the hanging members 41 and 41, and gears 480 and 481 are fixed to both ends.
[0058]
The wire fixing members 42 and 43 described above are provided so as to penetrate the hanging members 41 and 41. A gear 482 is fixed to the wire fixing member 42 penetrating the hanging member 41. Similarly, a gear 483 is fixed to the wire rod fixing member 43 penetrating the hanging member 41. In this way, the gear 480 and the gear 482 and the gear 481 and the gear 483 are engaged with each other. Therefore, by operating the drive motor 47 and rotating the gears 480 and 481 together with the rotating shaft 46, the gears 482 and 483 and the wire rod fixing members 42 and 43 can be rotated, and as a result, the fine wire rod 30 can be rotated. The rotational speed of the thin wire 30 is not particularly limited. For example, 15r. p. m. Controlled to:
[0059]
Conductive electrode contact members 49 and 49 are provided on the outer ends of the wire rod fixing members 42 and 43, respectively. The electrode contact member 49.49 comes into contact with the electrode portions 14 and 14 provided between the electroforming tank 10 and the outer tank 11 when the holding jig 4 is disposed above the electroforming tank 10. The electrode portions 14 are connected to the negative pole of the power source. Therefore, the electrode contact members 49 and 49 are in a state of being electrically connected to the negative pole of the power supply while being in contact with the electrode portions 14 and 14.
[0060]
Reference numeral 15 denotes an electrode portion electrically connected to the positive electrode of the power source. The electrode unit 15 is provided at the bottom of the electroforming tank 10. For example, the electrode portion 15 may be configured by accommodating metal pellets (for example, nickel pellets) for electroforming in a mesh-shaped or perforated case made of titanium steel.
[0061]
A method for manufacturing an electroformed pipe using the electroforming apparatus 100 will be described.
First, one end portion and the other end portion of the thin wire rod 30 are fixed to the wire rod fixing members 42 and 43, respectively, so that the thin wire rod 30 is in a tensioned state between the wire rod fixing members 42 and 43. At this time, the electrolytic solution 20 is supplied to the electroforming tank 10, overflows from the upper part of the electroforming tank 10 (forms an overflow portion 12), and flows into the outer tank 11. Moreover, the overflow part 12 is adjusted so that the electroforming tank 10 may be made substantially horizontal by the horizontal adjuster device 13 and the electrolytic solution 20 may be uniformly distributed in various places.
[0062]
In the present embodiment, the thin wire rod 30 is made of stainless steel having a substantially circular cross section with a diameter of 50 μm, and is pulled approximately 1500 N / mm outward. ² When the tensile force was applied, the deformation amount of the lateral strain was 10% of the cross-sectional area.
[0063]
Next, the drive motor 47 is operated to rotate the gears 480 and 481 together with the rotating shaft 46. As a result, the gears 482 and 483 and the wire fixing members 42 and 43 rotate, and the fine wire 30 rotates.
[0064]
The electrode contact members 49, 49 are brought into contact with the electrode portions 14, 14, the hanging members 41, 41 are positioned on the side of the electroforming tank 10, and only the thin wire 30 is immersed in the overflow portion 12. Since the electrode contact members 49 and 49 are in contact with the electrode portions 14 and 14, the electrode portion 15 is electrically connected to the positive pole of the power source, so that the thin wire 30 is electrically connected to the negative pole of the power source. The electroforming starts in the state. In this way, metal (nickel according to the electrolytic solution 20 shown in the present embodiment) is electrodeposited (deposited) around the fine wire 30. The metal electrodeposited around the thin wire 30 is an electrodeposit (or an enclosure).
[0065]
The thin wire 30 is immersed in the overflow portion 12 for a required time, and electroformed until the outer diameter of the electrodeposited metal is approximately 70 μm over the entire length. When the target outer diameter is reached, the thin wire 30 is taken out from the overflow portion 12 to stop electroforming. The amount of metal electrodeposition (deposition amount), that is, the thickness of the metal electrodeposited on the thin wire can be controlled in advance by the current, voltage, electroforming time, and the like.
[0066]
In the electroforming apparatus 100, the overflow portion 12 is adjusted so that the electrolytic solution 20 is uniformly distributed at various places, and the fine wire 30 is rotated, so that the current density in the electrolytic solution 20 is not expected. Even when uniform portions are generated, it is difficult for the metal electrodeposition state (deposition state) in the thin wire 30 to vary. Accordingly, the metal is electrodeposited around the fine wire 30 so as to have a substantially uniform thickness over the entire length. As a result, the electroformed pipe can be manufactured with high accuracy by simply removing the thin wire 30.
[0067]
Further, the electroforming apparatus 100 is electroformed at the overflow portion 12, and the overflowing electrolytic solution 20 is returned to the electroforming tank 10 and circulated again. That is, it is sufficient that the overflow portion 12 can be formed in electroforming, and therefore electroforming can be performed with a small amount of the electrolytic solution 20.
[0068]
In the electroforming apparatus 100, the wire fixing members 42 and 43 that fix the fine wire 30 are disposed outside the overflow portion 12, so that the wire fixing members 42 and 43 are not immersed in the electrolytic solution 20. Therefore, the wire fixing members 42, 43 and the like do not react with the electrolytic solution 20 to generate impurities. Further, the electrolytic solution 20 does not adhere to the wire fixing members 42 and 43 and is not taken out, and the electrolytic solution 20 is not wasted from the electroforming tank 10.
[0069]
Then, the thin wire rod 30 around which the metal is electrodeposited is removed from the wire rod fixing members 42 and 43, and the thin wire rod 30 is removed from the electrodeposit (fence) formed last.
[0070]
Since the electrodeposits are in close contact with the outer surface of the fine wire 30, the fine wire 30 is simply grasped and pulled, sucked, physically pushed, or ejected by ejecting gas or liquid. Then, removal is difficult. Therefore, the fine wire 30 is removed using any one of the following methods (1) to (4).
[0071]
(1) The electrodeposit is heated and thermally expanded, or the fine wire 30 is cooled and contracted to form a gap between the electrodeposit and the fine wire 30, and the fine wire 30 is gripped and pulled or sucked. They are removed using either a physical push or a jet of gas or liquid.
[0072]
(2) The part where the fine wire 30 and the electrodeposit are in contact with each other is made slippery by immersing in a liquid in which the cleaning agent is dissolved or by applying this liquid. Then, the fine wire 30 is removed by using any one of the methods of grasping and pulling, sucking, physically pushing, or ejecting gas or liquid.
[0073]
(3) The fine wire 30 is pulled from one or both to be deformed so that the cross-sectional area becomes small. Then, a gap is formed between the electrodeposit and the thin wire rod 30, and the thin wire rod 30 is either grabbed and pulled, sucked, physically pushed, or ejected by ejecting gas or liquid. Remove using method.
[0074]
(4) The fine wire 30 is removed by being dissolved by heat or by being dissolved by a solvent such as an alkaline solution or an acidic solution.
[0075]
By removing the thin wire 30 in this manner, an electroformed tube having a fine inner diameter (hollow portion) is produced by the remaining electrodeposit. This electroformed tube can be used as a tube for a contact probe.
[0076]
In the present embodiment, the thin wire material is removed from the electrodeposit having a substantially uniform thickness over the entire length, but this is not a limitation. For example, as shown in FIG. 2, a large diameter portion 500 having a large outer diameter is formed on one end side of the electrodeposit 50, and the fine wire 30 is pulled, sucked, physically pushed, gas or liquid It can also be removed using any method of jetting and pushing. By forming the large-diameter portion 500 in this way, a jig or tool can be hooked on the end surface of the large-diameter portion 500 when pulling out or pushing. Therefore, in this case, the thin wire rod 30 can be removed while the electrodeposit is fixed, so that the thin wire rod is easily removed. In addition, the operation | work which increases the amount of electrodeposition of a part in this way may be transferred and transferred to another electroforming apparatus.
[0077]
Further, in the above-described embodiment, the thin wire rod 30 has a substantially circular cross section with a diameter of 50 μm. However, the thickness and cross-sectional shape of the thin wire are not limited to this. For example, as shown in FIG. 3, it is also possible to use a polygonal thin wire material 31 (including a substantially polygonal material with rounded corners) having a cross-sectional shape as shown in FIG. Reference numeral 51 denotes an electrodeposit.
[0078]
The above-mentioned thin wire material has a substantially circular cross-sectional shape and has an outer diameter of 10 μm or more and 85 μm or less, and if the outer shape has a cross-sectional polygonal shape, the diameter of the inscribed circle is 10 μm or more and 85 μm. It has been found by experiments of the present inventors that the following can be used in the production of an electroformed pipe having a fine inner diameter.
[0079]
Further, the thin wire 30 shown in the present embodiment is approximately 1500 N / mm that is pulled outward. ² When the tensile force was applied, the deformation amount of the lateral strain was 10% of the cross-sectional area. However, the deformation amount of the lateral strain of the fine wire is not particularly limited. According to the experiment conducted by the present inventor, it is sufficient that the amount of deformation is at least 5% of the cross-sectional area.
[0080]
In the present embodiment, a metal is electrodeposited with a thickness of approximately 10 μm around the thin wire rod 30 having a substantially circular cross section with a diameter of 50 μm, and the entire outer diameter is approximately 70 μm. The thickness of the metal to be deposited is not particularly limited. According to the experiments conducted by the present inventors, it is found that if the electrodeposition can be performed around the fine wire rod 30 so as to have a thickness of at least about 5 μm, an electroformed tube can be formed even after the fine wire rod 30 is removed. ing.
[0081]
In the present embodiment, the thin wire rod 30 is made of stainless steel, and a metal is directly electrodeposited around the thin wire rod 30. However, the thin wire material that can be used in the electroforming apparatus 100 is not particularly limited as long as it has conductivity. For example, the core portion is made of metal or synthetic resin, and a conductive layer (plating) is formed on the outer surface thereof. Those provided with (metal layer (film)) or carbon) can also be used. By using such a thin wire rod, for example, as shown in FIG. 4, when the electrodeposit 52 is formed on the thin wire rod 32 provided with the gold plating 321 on the outer peripheral surface, the gold plating 321 is attached to the inner periphery of the electrodeposit 52. It is also possible to remove only the base material 320 while leaving it on the surface. In this case, an electroformed tube having a gold plating 321 on the inner peripheral surface can be formed.
[0082]
An electroformed tube having a gold plating 321 on the inner peripheral surface can improve electric conductivity as compared with the case where the gold plating 321 is not provided, and is suitable for conducting electricity such as a contact probe tube, for example. Can be used as a spare part.
[0083]
Further, for example, the thin wire material can be used in which another conductive layer of a different material is provided on the outer peripheral side of the conductive layer by plating or the like. For example, in the case where the metal electrodeposited by electroforming is nickel and the electrodeposit 53 is formed around the fine wire 33 in which the copper plating 332 is provided on the outer peripheral side of the gold plating 331 (see FIG. 5), the nickel is gold Since the adhesiveness with copper is better, and the adhesiveness with copper is also better with gold, it is possible to form an electroformed tube in which only the base material 330 is removed and nickel, copper and gold are adhered in a good adhesive state. . Gold plating 331 is exposed on the inner peripheral surface of the electroformed pipe.
[0084]
In the case where the thin wire having the conductive layer (for example, gold plating) provided on the outer peripheral portion in this way is removed from the deposited metal after being deformed so that the cross-sectional area is small, the fine wire rod 34 is formed as shown in FIG. It is preferable to form portions (masking portions 341, 341) where the conductive layer (for example, gold plating 340) is not provided on both ends, and pull the portions where the conductive layer is not provided. By doing so, it becomes difficult for tensile force to be directly applied to the conductive layer, the conductive layer and the base wire are easily separated, and the adhesion between the conductive layer and the electrodeposit 54 is not easily impaired.
[0085]
FIG. 7 is a sectional explanatory view showing another example of an electroforming apparatus for producing an electroformed pipe according to the present invention,
8 is an exploded perspective view showing a manufacturing jig used in the electroforming apparatus shown in FIG.
FIG. 9 is an enlarged cross-sectional explanatory view showing an electroformed pipe manufactured using the manufacturing jig shown in FIG.
The electroforming apparatus 101 is of a type in which a thin wire is provided in a tensioned state in the vertical direction (vertical direction in FIG. 7).
[0086]
The electroforming apparatus 101 includes an electroforming tank 60. The electroforming tank 60 has a tank portion 61 inside, and is formed in a box shape having an open top. At the upper edge of the electroforming tank 60, a cover mounting portion 62 that extends outward is provided over the entire circumference, and a lid 64 covers the opening of the electroforming tank 60 on the cover mounting portion 62. It is covered.
[0087]
A retaining portion 63 is provided above the tank portion 61. Attached to the latch 63 is an anode 66 electrically connected to the positive pole of the power source. A container 660 is attached to the anode 66, and the container 660 is packed with a large number of nickel balls. Reference numeral 65 denotes a cathode portion electrically connected to the negative pole of the power source. The cathode portion 65 is provided with a cathode line 650 that hangs downward to connect to a manufacturing jig 8 to be described later.
[0088]
In this embodiment, the container 660 is filled with nickel spheres, but what is packed in the container 660 is not limited to this, and is selected according to the type of metal to be deposited. For example, nickel, iron, copper, cobalt and the like can be used. Further, the shape and structure are not particularly limited.
[0089]
A jig fixing frame 7 is accommodated inside the tank portion 61. The jig fixing frame 7 is provided with manufacturing jigs 8 stacked in five stages.
[0090]
The tank portion 61 of the electroforming tank 60 is filled with the electrolytic solution 21. The electrolytic solution 21 is placed so that the anode part 66 and the jig fixing frame 7 are completely immersed. In the present embodiment, the electrolytic solution 21 uses a nickel sulfamate as a main component.
[0091]
Please refer to FIG. The production jig 8 is for producing an electroformed pipe having a plurality of hollow portions on which a plurality of thin wire members 35 can be stretched. In addition, since the thin wire | line material 35 shown by this Embodiment used the same thing as what was used with the electroforming apparatus 100, description is abbreviate | omitted.
[0092]
The manufacturing jig 8 includes a plate-shaped jig body 80 having a required length. A penetrating opening 81 is formed at a substantially central portion of the jig body 80. In FIG. 8, a plurality of fixing members 82 and 83 for fixing the thin wire 35 are disposed at both ends (short sides) of the jig main body 80 on the upper and lower ends side (specifically, 8 in a width direction). Is provided). In the present embodiment, the fixing members 82 and 83 are screw-shaped, but this is not particularly limited.
[0093]
In addition, a plurality of guide pins 84 (specifically, eight locations) are provided in the inner portions of the fixing members 82 and 83 so that the intervals are further narrower than the intervals at which the fixing members 82 and 83 are provided. ) Is provided.
[0094]
Further, positioning members 85 for determining the position where the thin wire 35 is stretched are provided in the vicinity of the opening 81 which is an inner portion of the guide pin 84. The positioning members 85 and 85 are belt-like plate-like bodies having substantially the same length as the width of the jig body 80, and a V-shaped groove (not shown in the figure) for fitting the thin wire 35 into the substantially central portion. A prevention member 850 (described later) is formed and is not visible. A plurality of grooves (specifically, eight positions) are formed continuously over the entire width of the positioning member 85 (vertical direction in FIG. 8) and in the length direction (horizontal direction in FIG. 8).
[0095]
On the upper surface side of each positioning member 85, there is provided a disengagement prevention member 850 having a width substantially the same as that of the positioning member 85, but formed of a plate member having a short length so that the fitted thin wire member 35 comes off the groove. There is no way. In this embodiment, the groove of the positioning member 85 is formed so that a gap of 10 μm is provided between the adjacent thin wire members 35, but this is not limited, and the interval between the thin wire members 35 can be set as appropriate. It is.
[0096]
A plurality (specifically, eight) of fine wire members 35 are attached to the manufacturing jig 8. Each thin wire 35 is attached as follows.
First, the tension spring 86 is attached to the other end (lower side in FIG. 8) of the thin wire 35. Then, one end (the upper side in FIG. 8) of the thin wire 35 is stopped by the fixing member 82. The thin wire member 35 fixed by the fixing member 82 passes between the adjacent guide pins 84, 84, fits into a groove formed in each positioning member 85, and is bridged between the positioning members 85, 85.
[0097]
The other end side of the thin wire member 35 fitted in the groove passes between the adjacent guide pins 84 and 84 in the same manner as the upper end side, and the tension spring 86 is stopped by the fixing member 83. The thin wire member 35 is attached in a state where the portion corresponding to the opening 81 of the thin wire member 35 is in tension due to the tensile force of the tension spring 86.
[0098]
In the manufacturing jig 8, the thin wire 35 is attached with a gap of 10 μm between adjacent ones. In FIG. 8, the above interval is exaggerated for easy understanding. ing.
[0099]
Reference numeral 87 denotes a holding member for attaching the partition wall member 88. The holding member 87 is formed of a rectangular plate having substantially the same size as the opening shape of the opening 81.
[0100]
The partition member 88 has substantially the same length as the length of the holding member 87 in the vertical direction in FIG. 8 and has a thin strip shape. Specifically, the partition member 88 includes an insulating base member 880 having a thickness of about 8 μm, and a structure in which a conductive layer (film) 881 made of plating or the like having a thickness of about 2 to 3 μm is provided on the front and back surfaces of the insulating base member 880. have. The material for forming the conductive layer 881 is not particularly limited as long as it has conductivity. However, an electrodeposit by electroforming and a material having good adhesion (adhesiveness) are preferable.
[0101]
A plurality of (specifically, seven) partition members 88 are arranged at a necessary interval so that the conductive layers 881 face each other, and extend substantially at the center of the surface of the holding member 87 to the entire length in the vertical direction of FIG. And is detachably attached. In the present embodiment, the partition member 88 is attached to the jig main body 80 with the above-described thin wire material 35 formed with a gap of about 10 μm. is there.
[0102]
The holding member 87 provided with the partition wall member 88 is inserted between the thin wire members 35 extending vertically through the opening portion 81 by inserting the partition wall member 88 from the side (in the arrow direction). As a result, the partition wall member 88 is clamped to be attached to the jig body 80. That is, the thin wire 35 and the partition member 88 (specifically, the conductive layer 881) are in contact with each other.
[0103]
The manufacturing jig 8 has the holding member 87 attached to the jig main body 80 as described above, and the cathode wire 650 is connected so that electricity flows to the thin wire 35 (not shown in FIG. 8). It is accommodated in the jig fixing frame 7 and immersed in the electrolytic solution 21 for electroforming. Although a specific description is omitted, a masking process is performed on portions of the manufacturing jig 8 other than the opening 81 so that the electrolytic solution 21 is not immersed.
[0104]
According to the electroforming apparatus 101, an electrodeposit is formed around the fine wire 35 and on the surface of the conductive layer 881 by energization. Then, the electroforming is stopped when the thin wire 35 and the partition member 88 are surrounded by the electrodeposit 55 to a required extent. The electrodeposition amount (deposition amount) of the electrodeposit 55 can be controlled in advance by current, voltage, electroforming time, and the like.
[0105]
The production jig 8 that has stopped electroforming is taken out of the electrolytic solution 21 and again disassembled into a jig body 80 and a holding member 87. At this time, the partition member 88 is separated from the holding member 87 because it is fixed between the thin wire members 35 by the deposited electrodeposit 55. Thereafter, the fine wire 35 and the partition member 88 integrated by the electrodeposit 55 are removed from the jig body 80.
[0106]
Then, the electrodeposit 55 and the partition member 88 are machined to adjust the shape (see FIG. 9), and the fine wire 35 is removed from the electrodeposit 55. The removal of the thin wire 35 is performed by the same method as that manufactured by the electroforming apparatus 100, and thus the description thereof is omitted.
Thus, an electroformed tube having a plurality of hollow portions (specifically, 8 pieces) is produced.
[0107]
In this electroformed tube, since the partition wall member 88 is interposed between the hollow portions formed by removing the thin wire material 35 so as to partition, the electric parts can be electrically separated for each portion forming the periphery of each hollow portion. Conduction is possible.
[0108]
Note that the electroforming apparatus 101 can also use a thin wire having a core made of metal, synthetic resin, or the like and provided with a conductive layer (plating (metal layer (film)), carbon, or the like) on its outer surface. Further, the cross-sectional shape and the like of the fine wire material are not particularly limited as in the case of the fine wire material shown by the electroforming apparatus 101.
[0109]
In the present embodiment, the partition member 88 is provided between the thin wire members 35 for electroforming. However, this is not limited, and for example, it is possible to perform electroforming only with the thin wire member without providing the partition member. It is.
[0110]
The electroformed pipe can also be manufactured by using an electroforming apparatus of another form other than the electroforming apparatuses 100 and 101 shown in the above embodiment. Moreover, the kind of manufacturing jig used in the electroforming apparatus is not particularly limited.
[0111]
Numerical values representing specific dimensions (size, length) shown in the present embodiment are described for easy understanding, and are not intended to limit the dimensions. For example, the diameter of the fine wire, the thickness of the electrodeposit, the deformation amount and tensile force of the fine wire, the thickness of the conductive layer (film) (plating, etc.), the thickness of the partition member, and the like. These dimensions can be arbitrarily set within the range of the range.
[0112]
In the present embodiment, the thin wire was covered with the electrode by depositing a metal by electroforming on the outer surface of the thin wire, but this is not a limitation, for example, it is possible to energize near the thin wire An electroformed tube can be formed by providing a thin conductor (metal or the like) and electrodepositing a metal by electroforming on this conductor so that the thin wire material is also covered by the electrodeposited metal.
[0113]
In the above-described embodiment, an electrolytic solution containing nickel sulfamate as a main component is used. However, the electrolytic solution is not limited to this, and is selected according to the type of metal to be deposited. Examples of the metal to be electrodeposited (deposited) include metals such as nickel or an alloy thereof, iron or an alloy thereof, copper or an alloy thereof, cobalt or an alloy thereof, a tungsten alloy, and a fine particle dispersed metal. Examples of the electrolytic solution for depositing the metal include nickel chloride, nickel sulfate, ferrous sulfamate, ferrous borofluoride, copper pyrophosphate, copper sulfate, copper borofluoride, copper silicofluoride, copper copper fluoride, Liquids mainly composed of aqueous solutions of copper alkanol sulfonate, cobalt sulfate, sodium tungstate, etc., or fine powders such as silicon carbide, tungsten carbide, boron carbide, zirconium oxide, silicon nitride, alumina, diamond, etc. in these liquids A liquid in which is dispersed is used.
[0114]
Further, stirring means for stirring the electrolyte solution can be provided in the electroforming tank. As the agitation means, for example, one that blows out air, one that sucks in an electrolytic solution, and discharges it again into the electrolytic cell, a rotatable stirring blade (propeller), ultrasonic waves, vibration, or the like can be used. However, the stirring means is not limited to these.
[0115]
The terms and expressions used in this specification are merely explanatory and are not limiting at all, and exclude terms and expressions equivalent to the features described in this specification and parts thereof. There is no intention to do. It goes without saying that various modifications are possible within the scope of the technical idea of the present invention.
[0116]
【The invention's effect】
The present invention has the above-described configuration and has the following effects.
(A) According to the present invention, a thin wire can be removed from an electrodeposit or an enclosure formed by electroforming. The fine wire material can be formed by (1) heating the electrodeposit or the surrounding object to thermally expand, or cooling and contracting the fine wire material to form a gap between the electrodeposited object or the surrounding object and the fine wire material, 2) By soaking or pouring in the liquid, the portion where the thin wire and the electrodeposit or the surrounding object are in contact with each other becomes slippery, or (3) the cross-sectional area is reduced by pulling from one or both By deforming, forming a gap between the thin wire rod and the electrodeposited object or surrounding object, whether it is grasped and pulled, sucked, physically pushed, or gas or liquid is ejected and pushed It is removed using either method. (4) It can also be removed by melting with heat or a solvent.
When such a method is used for removing the fine wire, for example, an electrodeposit formed using a fine wire having a diameter of 10 μm to 85 μm and having a thickness of 5 μm to 50 μm on the outer surface of the fine wire. Alternatively, the thin wire can be removed from the surrounding object. Therefore, by using this method for removing a thin wire, for example, an electroformed tube having a fine inner diameter that can be used as a contact probe tube or the like can be manufactured.
[0117]
(B) According to the method of manufacturing an electroformed tube by increasing the amount of electrodeposits or enclosures on the end side formed on the thin wire rod, for example, the thin wire rod is pulled out or pushed away from the electrodeposit or envelope. For example, a jig, a tool, or the like can be hooked on an end face or the like of a portion where the amount of electrodeposits or surrounding objects is increased. Therefore, in this case, since the fine wire can be removed while the electrodeposit or the surrounding object is fixed, the thin wire is easy to remove.
[0118]
(C) According to the method for manufacturing an electroformed pipe in which the deformation amount of the lateral strain when the fine wire is pulled outward is extended to 5% or more of the cross-sectional area, the fine wire and the electrodeposit or the enclosure In the meantime, since a gap sufficient to remove the fine wire can be formed, it is highly possible that the fine wire can be removed from the electrodeposit or the surrounding object without any trouble. If the deformation amount of the lateral strain is less than 5% of the cross-sectional area, the gap may not be sufficient, and trouble may occur during removal.
[0119]
(D) According to the method for manufacturing an electroformed tube in which the fine wire material is removed so that the conductive layer remains on the inner surface of the electroformed tube, the inner surface is provided with gold plating or the like. An electroformed pipe can be manufactured. Such an electroformed pipe can be used as a component suitable for conducting electricity in this case because, for example, the electrical conductivity can be improved by the material of the conductive layer provided on the inner surface, which is better than that of an electrodeposit or an enclosure. it can.
The same applies to an electroformed tube having a conductive layer made of a material different from that of an electrodeposit or an enclosure on the inner surface, and a thin wire material having a conductive layer made of a material different from the electrodeposit or the enclosure on the outer surface. In addition, a better electroformed tube can be formed when the electrical conductivity is only an electrodeposit or an enclosure.
[0120]
(E) According to the method for producing an electroformed tube using a thin wire material in which at least two conductive layers of different materials are formed on the outer surface side, for example, the outer conductive layer is made of copper and is in contact with copper. The inner conductive layer can be made of gold, and nickel can be formed as an electrodeposit or an enclosure by electroforming. In this case, since nickel has better adhesion to copper than gold and copper has better adhesion to gold, an electroformed tube with good adhesion can be formed.
In addition, a conductive layer made of a material different from the electrodeposit or the surrounding object is provided on the inner surface, and a conductive layer made of a material different from the conductive layer is provided between the electrodeposited object or the surrounding object and the conductive layer. A conductive layer made of a material different from the electrodeposit or the surrounding object is provided on the outer surface of the electroformed pipe or the outer surface, and a material different from the conductive layer is provided between the thin wire base member and the conductive layer. Similarly, an electroformed tube having good adhesion between the electrodeposit or the surrounding material and the conductive layer can be formed with the thin wire provided with the conductive layer.
[0121]
(F) The one provided with a plurality of hollow portions formed by removing the fine wire material may be used, for example, by replacing a plurality of pipes each provided with only one hollow portion with a plurality of manufactured parts. it can. According to this electroformed pipe, it is possible to eliminate the trouble of arranging the individual pipes side by side. Moreover, since the space | interval between hollow parts is being fixed with the electrodeposit or the enclosure, it does not shift | deviate.
[0122]
(G) A partition body formed by providing a conductive layer on the outer surface of the insulator is interposed between the hollow portions so that electric conduction can be performed independently for each portion forming around each hollow portion. Are electrically conductive independently for each hollow part.
[0123]
(H) A thin wire having a portion where no conductive layer is provided on both end sides makes it difficult for tensile force to be directly applied to the conductive layer by pulling the portion where the conductive layer is not provided outward. In addition, the conductive layer and the base line material are easily separated, and the adhesion between the conductive layer and the electrodeposit or the surrounding object is hardly impaired.
[Brief description of the drawings]
FIG. 1 is an explanatory cross-sectional view showing an example of an electroforming apparatus for producing an electroformed pipe according to the present invention.
FIG. 2 is an explanatory view showing a state in which a large diameter portion is formed on one end side of an electrodeposit.
FIG. 3 is an explanatory cross-sectional view showing a state in which an electrodeposit is formed around a thin wire having a substantially rectangular cross section.
FIG. 4 is an explanatory cross-sectional view showing a state in which an electrodeposit is formed around a fine wire having a conductive layer on the outer peripheral surface.
FIG. 5 is an explanatory cross-sectional view showing a state in which an electrodeposit is formed around a fine wire having two conductive layers made of different materials on the outer peripheral surface.
FIG. 6 is an explanatory view showing a state in which an electrodeposit is formed around a thin wire material in which a conductive layer is not provided on both ends.
FIG. 7 is a cross-sectional explanatory view showing another example of an electroforming apparatus for producing an electroformed pipe according to the present invention.
8 is an exploded perspective view showing a manufacturing jig used in the electroforming apparatus shown in FIG. 7. FIG.
FIG. 9 is an enlarged cross-sectional explanatory view showing an electroformed pipe manufactured using the manufacturing jig shown in FIG. 8;
[Explanation of symbols]
100, 101 Electroforming equipment
10 Electroforming tank
11 Outer tank
12 Overflow part
13 Horizontal adjuster
14 Electrode section
15 Electrode section
20 Electrolyte
21 Electrolytic solution
30, 31, 32, 33, 34, 35 Fine wire
320 Baseline material
321 gold plating
330 Baseline material
331 gold plating
332 copper plating
340 gold plating
341 Masking part
4 Holding jig
40 Horizontal members
41 Hanging member
42 Wire fixing member
43 Wire fixing member
44 electrodes
45 Tension device
46 Rotating shaft
47 Drive motor
480, 481 gears
482, 483 gears
49 Electrode contact member
50, 51, 52, 53, 54, 55 Electrodeposit
500 large diameter
60 Electroforming tank
61 tank
62 Lid Placement
63 Hook
64 lid
65 Cathode
650 cathode ray
66 Anode
660 container
7 Jig fixing frame
8 Manufacturing jig
80 Jig body
81 opening
82 Fixing member
83 Fixing member
84 Guide pin
85 Positioning member
850 Prevention member
86 Tension spring
87 Holding member
88 Bulkhead member
880 Insulation base member
881 Conductive layer

Claims (24)

A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The thin wire rod is formed by forming a gap between the electrodeposit or the surrounding wire and the fine wire material by heating and thermally expanding the electrodeposit or the surrounding material, or by cooling and shrinking the thin wire material, thereby grasping the thin wire material. It is removed by using any of the method of pulling, sucking, physically pushing, or ejecting gas or liquid by pushing,
Manufacturing method of electroformed pipe. A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
Fine wire rods can be slipped by dipping in liquid or applying liquid to make the area where the fine wire rod and electrodeposit or enclosure are in contact with each other. Or by using a method of either pushing gas or a liquid and ejecting it,
Manufacturing method of electroformed pipe. A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The fine wire is pulled from one or both to be deformed so that the cross-sectional area is reduced, and a gap is formed between the fine wire and the electrodeposit or the enclosure, and the fine wire is grasped and pulled or sucked, Characterized in that it is removed using either a physical push or a jet of gas or liquid.
Manufacturing method of electroformed pipe. It is characterized by increasing the amount of electrodeposits or surrounding objects on the end side formed in the thin wire,
The method for producing an electroformed pipe according to claim 1, 2 or 3. The amount of deformation of lateral strain when the fine wire is pulled and stretched outward is 5% or more of the cross-sectional area,
The method for producing an electroformed pipe according to claim 3. A method for producing an electroformed tube by forming an electrodeposit or a surrounding object around a fine wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The fine wire is removed by melting with heat or a solvent,
Manufacturing method of electroformed pipe. Using a thin wire material provided with a conductive layer on the outer surface, the fine wire material is removed so that the conductive layer remains on the inner surface of the electroformed tube,
The manufacturing method of the electroformed pipe of Claim 1, 2, 3, 4, 5 or 6. Using a thin wire material in which at least two conductive layers of different materials are formed on the outer surface side, the electrodeposit or enclosure and the outer conductive layer of the fine wire material are brought into close contact with each other, and the inner conductive layer is the inner surface of the electroformed tube It is characterized by removing the thin wire material so that it remains in
The manufacturing method of the electroformed pipe of Claim 1, 2, 3, 4, 5 or 6. The inner shape of the hollow portion formed by removing the thin wire from the electrodeposit or the surrounding object has a circular cross section or a polygonal cross section,
The method for producing an electroformed pipe according to claim 1, 2, 3, 4, 5, 6, 7 or 8. It is characterized by comprising a plurality of hollow parts formed by removing the fine wire material,
The method for producing an electroformed pipe according to claim 1, 2, 3, 4, 5, 6, 7, 8, or 9. By interposing a partition body formed by providing a conductive layer on the outer surface of the insulator between the hollow portions, it is possible to conduct electric conduction independently for each portion forming around each hollow portion. Features
The method for producing an electroformed pipe according to claim 10. An electroformed pipe manufactured by forming an electrodeposit or a surrounding object around a thin wire by electroforming, and removing the thin wire from the electrodeposit or the surrounding object,
The hollow part formed by removing the thin wire from the electrodeposit or the surrounding object has an inner shape of a circular cross section, the inner diameter of the hollow part is 10 μm or more and 85 μm or less, and the inner shape of the hollow part is a polygonal cross section The diameter of the inscribed circle of the hollow portion is 10 μm or more and 85 μm or less,
Electroformed pipe. The wall thickness is 5 μm or more and 50 μm or less,
The electroformed pipe according to claim 12. The inner surface is provided with a conductive layer made of a material different from the electrodeposit or the surrounding object,
The electroformed pipe according to claim 12 or 13. A conductive layer made of a material different from the electrodeposit or the surrounding object is provided on the inner surface, and a conductive layer made of a material different from the conductive layer is provided between the electrodeposit or the surrounding object and the conductive layer. It is characterized by
The electroformed pipe according to claim 12 or 13. There are a plurality of hollow parts formed by removing the fine wire material,
The electroformed pipe according to claim 12, 13, 14 or 15. By interposing a partition body formed by providing a conductive layer on the outer surface of the insulator between the hollow portions, it is configured so that electric conduction can be performed independently for each portion forming around each hollow portion. It is characterized by being,
The electroformed pipe according to claim 16. The conductive layer provided on the outer surface of the partition wall is configured to form a part of the hollow part,
The electroformed pipe according to claim 17. The partition wall is characterized in that the thickness of the portion provided between the adjacent hollow portions is 5 μm or more and 50 μm or less,
The electroformed pipe according to claim 17 or 18. A thin wire material for producing an electroformed tube by forming an electrodeposit or a surrounding object by electroforming and removing from the electrodeposit or the surrounding object,
When the outer shape has a circular cross section, the outer diameter is 10 μm or more and 85 μm or less, and when the outer shape has a polygonal cross section, the diameter of the inscribed circle is 10 μm or more and 85 μm or less. The amount of deformation of lateral strain when stretched is 5% or more of the cross-sectional area,
Fine wire for manufacturing electroformed pipes. The outer surface is provided with a conductive layer made of a material different from that of the electrodeposit or the surrounding object,
A thin wire for producing the electroformed pipe according to claim 20. A conductive layer made of a material different from that of the electrodeposit or the surrounding object is provided on the outer surface, and a conductive layer made of a material different from the conductive layer is provided between the thin wire base member and the conductive layer. It is characterized by
A thin wire for producing the electroformed pipe according to claim 20. It is characterized in that there is a portion where the conductive layer is not provided on both end sides,
A thin wire for producing the electroformed pipe according to claim 20, 21 or 22. The outer shape is formed in a circular cross section or a polygonal cross section,
A thin wire for producing the electroformed pipe according to claim 20, 21, 22, or 23.

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