JP2004104456A - High-frequency transmitting/receiving device - Google Patents

High-frequency transmitting/receiving device Download PDF

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Publication number
JP2004104456A
JP2004104456A JP2002263564A JP2002263564A JP2004104456A JP 2004104456 A JP2004104456 A JP 2004104456A JP 2002263564 A JP2002263564 A JP 2002263564A JP 2002263564 A JP2002263564 A JP 2002263564A JP 2004104456 A JP2004104456 A JP 2004104456A
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JP
Japan
Prior art keywords
base plate
frequency transmitting
receiving device
lid
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002263564A
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Japanese (ja)
Inventor
Shiro Ouchi
大内 四郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2002263564A priority Critical patent/JP2004104456A/en
Publication of JP2004104456A publication Critical patent/JP2004104456A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency transmitting/receiving device which can eliminate a strain of an antenna substrate. <P>SOLUTION: The high-frequency transmitting/receiving device includes an outside base plate having an opening penetrated from one surface to the other surface, an inside base plate contained in the opening of the outer peripheral side base plate as one base plate, the antennal substrate provided on one surface, a high-frequency transmitting/receiving circuit substrate provided on the other surface, and a cover disposed so as to surround the circuit substrate. In the device, a conductor passage forming part for passing a lead wire for connecting the substrate to an external circuit is formed at the part of the cover without providing a lead wire passage for passing the lead wire for connecting the substrate to the external circuit. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、マイクロ波信号の送受信装置に係り、特に車両用のレーダ計測装置に好適な高周波送受信装置に関する。
【0002】
【従来の技術】
近年、車両用、特に自動車用として、その車間距離の計測や障害物の検出にマイクロ波レーダを利用した高周波送受信装置が多く見られるようになっている。
【0003】
従来、この高周波送受信装置としては、例えば、特開2000−209026号広報に記載されているものがある。
【0004】
この高周波送受信装置は、一方の面から他方の面へ貫通した開口が形成されている外側ベースプレートと、この外周側ベースプレートの開口内に収まる内側ベースプレートと、外側ベースプレート及び内側ベースプレートの一方の面に取り付けられるアンテナ基板と、内側ベースプレートの他方の面に取り付けられる高周波送受信回路基板と、この回路基板を覆う蓋と、高周波送受信回路を外部回路と接続するための導線とをそなえている。
【0005】
内側ベースプレートの一方の面側、つまり、アンテナ基板が設けられる面には、切欠き部が形成されている。
【0006】
この内側ベースプレートの切欠き部と、アンテナ基板の裏面と外側ベースプレートの開口の内周壁とで囲まれた空間は、前述の導線を通すための導線通路を形成している。
【0007】
内側ベースプレートの切欠き部には、高周波送受信回路から伸びる導電性ピンが導線通路内に突出しており、このピンの先端に導線の一方の端部が接続されている。
【0008】
【発明が解決しようとする課題】
上記従来技術は、高周波送受信回路の気密性を確保しつつ、高周波送受信装置の組み立て作業性を向上させることができるという点で、優れているものの、導線を通すための切欠きが内部ベースプレートに形成されているため、この切欠き部分におけるアンテナ基板の支えが無く、この部分でアンテナ基板が僅かに歪んでしまうことがある。
【0009】
このため、従来技術では、アンテナ基板上に形成されている薄膜導体が断線してしまう恐れがあると共に、レーダの送受信方向が微妙に目的の方向からズレる等で、対象物の正確な位置を計測できないという問題がある。
【0010】
本発明は、以上のような従来技術の問題点を考慮してなされたもので、アンテナ基板の歪みを無くすることができる高周波送受信装置を提供することを目的とする。
【0011】
【課題を解決するための手段】
上記目的は請求項に記載の発明により達成される。例えば、一方の面から他方の面へ貫通した開口が形成されている外側ベースプレートと、この外周側ベースプレートの開口内に収まる内側ベースプレートを一つのベースプレートとして、一方の面にアンテナ基板、もう一方の面に高周波送受信回路基板を備え、前記高周波送受信回路基板を囲うように蓋が配置された高周波送受信装置において、前記ベースプレートには、前記高周波送受信回路基板と外部回路とを接続するための導線が通る導線通路を設けずに、前記蓋の一部に前記高周波送受信回路基板と外部回路とを接続するための導線が通る導線通路形成部が形成されたことにより、ベースプレートのアンテナ基板側に切欠き部が無くなったことにより、アンテナ基板が僅かに歪むことで、アンテナ基板上に形成されている薄膜導体が断線してしまう恐れが無くなる共に、レーダの送受信方向が微妙に目的の方向からズレる等で、対象物の正確な位置を計測できないという問題を無くすことができる。
【0012】
【発明の実施の形態】
以下、本発明に係る各種実施形態としての高周波送受信装置およびその製造方法について、図面を用いて説明する。
【0013】
図1は、本発明のシステム適用例を示し、高周波送受信装置1が装着された自車両2で先行車3との車間距離および相対速度を測るものである。
【0014】
図2は、本発明による高周波送受信装置の一実施例形態であるマイクロ波またはミリ波送受信装置の断面図である。
【0015】
送受信用MMICなどの半導体IC10とこれらを接続する高周波送受信回路基板9は筐体底部である金属製ベースプレート7の表面に実装されて高周波送受信回路を構成し、上記高周波送受信回路への入出力信号はハーメチックシールによる同軸線11a及び11bを介してアンテナ8に接続される。
【0016】
金属製の蓋5は筐体の天井部を構成するもので、前記蓋5には、外部回路とを接続するハーメチックシールされた導体通路部12a及び12bが形成され、一方は外部回路とをフレキシブルリード線14a及び14bにより接続され、もう一方は高周波送受信回路基板9とを、リード線13a及び13bにより接続されている。
【0017】
また、高周波送受信回路基板9の天井部には直方体の突起が周期的に設けられたフィルタ6が前記蓋5に接着,溶接,加締等により固定されている。
【0018】
前記半導体IC10は、水分等が付着すると動作不良となることから、気密性を確保するため前記ベースプレート7と前記蓋5は溶接,ロー付け等を行う必要がある。
【0019】
図3は、図2の上面から見た平面図で、図4は、図2の下面から見た平面図である。
【0020】
図5は、前記蓋5の側面に導体通路部12a及び12bを設けた断面図である。
【0021】
図6は、前記蓋5の側面部をフレーム15にした断面図である。
【0022】
図7は、前記蓋5の側面部をフレーム15にして、そのフレーム15にハーメチックシールにより導体通路部12a及び12bを設けた断面図である。
【0023】
図8は、導体通路部をハーメチックシールにて別部材に形成した断面図で、蓋5又は、フレーム15に溶接,ロー付け,加締等により形成してなる。
【0024】
以上、本発明の実施形態について説明したが、本発明は、上記実施形態に限定されるものではない。
【0025】
たとえば、蓋5は四角のキャップ状になっているが、円形キャップでも良く導体通路部は、どの位置に配置されても良い。
【0026】
また、側壁を別に設けても良く、材料は金属製でなくても気密性を確保できれば良い。
【0027】
【発明の効果】
本発明によれば、前記ベースプレートには、前記高周波送受信回路基板と外部回路とを接続するための導線が通る導線通路を設けずに、前記蓋の一部に前記高周波送受信回路基板と外部回路とを接続するための導線が通る導線通路形成部が形成されたことにより、ベースプレートのアンテナ基板側に切欠き部が無くなったことにより、アンテナ基板が僅かに歪むことで、アンテナ基板上に形成されている薄膜導体が断線してしまう恐れが無くなる共に、レーダの送受信方向が微妙に目的の方向からズレる等で、対象物の正確な位置を計測できないという問題を無くすことができる。
【図面の簡単な説明】
【図1】本発明のシステム適用例。
【図2】本発明による高周波送受信装置の一実施形態を示す断面図。
【図3】本発明による高周波送受信装置の一実施形態を示す上部平面図。
【図4】本発明による高周波送受信装置の一実施形態を示す下部平面図。
【図5】本発明による高周波送受信装置の第二の一実施形態を示す断面図。
【図6】本発明による高周波送受信装置の第三の一実施形態を示す断面図。
【図7】本発明による高周波送受信装置の第一から第三における導体通路部を別部品とした断面図。
【図8】図7の導体通路部を蓋に設置した断面図。
【符号の説明】
1…高周波送受信装置、2…自車両、3…先行車、5…蓋、6…フィルタ、7…ベースプレート、8…アンテナ、9…高周波送受信回路基板、10…半導体
IC、11…同軸線、12…導体通路部、13…リード線、14…フレキシブルリード線、15…フレーム。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a microwave signal transmitting / receiving device, and particularly to a high-frequency transmitting / receiving device suitable for a radar measuring device for a vehicle.
[0002]
[Prior art]
2. Description of the Related Art In recent years, for a vehicle, particularly an automobile, a high-frequency transmitting / receiving apparatus using a microwave radar for measuring an inter-vehicle distance and detecting an obstacle has been widely used.
[0003]
Conventionally, as this high-frequency transmitting / receiving apparatus, there is one disclosed in, for example, Japanese Patent Application Laid-Open Publication No. 2000-2009026.
[0004]
This high-frequency transmitting / receiving device has an outer base plate formed with an opening penetrating from one surface to the other surface, an inner base plate that fits in the opening of the outer peripheral base plate, and one of the outer base plate and the inner base plate. Antenna board, a high-frequency transmitting / receiving circuit board attached to the other surface of the inner base plate, a cover for covering the circuit board, and a conductor for connecting the high-frequency transmitting / receiving circuit to an external circuit.
[0005]
A cutout portion is formed on one surface side of the inner base plate, that is, a surface on which the antenna substrate is provided.
[0006]
A space surrounded by the cutout portion of the inner base plate, the back surface of the antenna substrate, and the inner peripheral wall of the opening of the outer base plate forms a conductor passage for passing the above-described conductor.
[0007]
A conductive pin extending from the high-frequency transmission / reception circuit protrudes into the wire passage at the cutout of the inner base plate, and one end of the wire is connected to the tip of the pin.
[0008]
[Problems to be solved by the invention]
The above prior art is excellent in that the workability of assembling the high frequency transmission / reception device can be improved while ensuring the airtightness of the high frequency transmission / reception circuit, but the notch for passing the conductor is formed in the internal base plate. Therefore, there is no support of the antenna substrate in the notch portion, and the antenna substrate may be slightly distorted in this portion.
[0009]
For this reason, in the conventional technique, the thin film conductor formed on the antenna substrate may be disconnected, and the radar transmitting / receiving direction may be slightly deviated from a desired direction, and the accurate position of the target object may be measured. There is a problem that can not be.
[0010]
The present invention has been made in consideration of the above-described problems of the related art, and has as its object to provide a high-frequency transmitting / receiving apparatus that can eliminate distortion of an antenna substrate.
[0011]
[Means for Solving the Problems]
The above object is achieved by the invention described in the claims. For example, an outer base plate in which an opening penetrating from one surface to the other surface is formed, and an inner base plate that fits in the opening of the outer peripheral side base plate as one base plate, an antenna substrate on one surface and the other surface A high-frequency transmitting / receiving circuit board, and a lid disposed so as to surround the high-frequency transmitting / receiving circuit board, wherein the base plate has a conducting wire through which a conducting wire for connecting the high-frequency transmitting / receiving circuit board and an external circuit passes. Without providing a passage, a notch is formed on a part of the lid on the antenna substrate side of the base plate by forming a lead wire passage forming portion through which a lead for connecting the high-frequency transmitting / receiving circuit board and an external circuit passes. Due to the disappearance, the antenna substrate is slightly distorted, and the thin film conductor formed on the antenna substrate is Both risk is eliminated that results in a line, in such deviated from the direction of transmission and reception direction slightly purpose of the radar, it is possible to eliminate the problem that can not be measured the exact position of the object.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a high-frequency transmitting and receiving apparatus and a method of manufacturing the same according to various embodiments of the present invention will be described with reference to the drawings.
[0013]
FIG. 1 shows an example of application of the system of the present invention, in which an inter-vehicle distance and a relative speed with respect to a preceding vehicle 3 in a host vehicle 2 equipped with a high-frequency transmitting / receiving device 1 are measured.
[0014]
FIG. 2 is a sectional view of a microwave or millimeter wave transmitting / receiving apparatus which is an embodiment of the high-frequency transmitting / receiving apparatus according to the present invention.
[0015]
A semiconductor IC 10 such as a transmission / reception MMIC and a high-frequency transmission / reception circuit board 9 for connecting the semiconductor ICs are mounted on a surface of a metal base plate 7 which is a bottom of the housing to constitute a high-frequency transmission / reception circuit. The antenna 8 is connected to the antenna 8 via coaxial wires 11a and 11b formed by a hermetic seal.
[0016]
The metal lid 5 constitutes the ceiling of the housing, and the lid 5 is formed with hermetically sealed conductor passages 12a and 12b for connecting to an external circuit. The other is connected to the high-frequency transmission / reception circuit board 9 by the leads 13a and 13b.
[0017]
A filter 6 having a rectangular parallelepiped projection periodically provided on the ceiling of the high-frequency transmitting / receiving circuit board 9 is fixed to the lid 5 by bonding, welding, caulking or the like.
[0018]
The operation of the semiconductor IC 10 becomes defective if moisture or the like adheres thereto. Therefore, the base plate 7 and the lid 5 need to be welded, brazed, or the like to ensure airtightness.
[0019]
FIG. 3 is a plan view as seen from above in FIG. 2, and FIG. 4 is a plan view as seen from below in FIG.
[0020]
FIG. 5 is a cross-sectional view in which conductor passage portions 12a and 12b are provided on the side surface of the lid 5.
[0021]
FIG. 6 is a cross-sectional view in which the side surface of the lid 5 is a frame 15.
[0022]
FIG. 7 is a cross-sectional view in which the side surface of the lid 5 is a frame 15, and the frame 15 is provided with conductor passages 12a and 12b by hermetic sealing.
[0023]
FIG. 8 is a sectional view in which the conductor passage portion is formed as a separate member by a hermetic seal, and is formed by welding, brazing, caulking, or the like to the lid 5 or the frame 15.
[0024]
The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments.
[0025]
For example, although the lid 5 is in the shape of a square cap, a circular cap may be used, and the conductor passage may be arranged at any position.
[0026]
Further, the side wall may be provided separately, and the material is not limited to metal, as long as airtightness can be ensured.
[0027]
【The invention's effect】
According to the present invention, the base plate does not have a wire passage through which a wire for connecting the high-frequency transmission / reception circuit board and an external circuit is provided, and the high-frequency transmission / reception circuit board and the external circuit are partially provided on the lid. By forming a conductor path forming part through which a conductor for connecting the antenna plate is formed, the notch is eliminated on the antenna substrate side of the base plate, and the antenna substrate is slightly distorted, so that it is formed on the antenna substrate. In addition to eliminating the risk of the thin film conductor being disconnected, the problem that the accurate position of the target object cannot be measured due to, for example, a slight shift in the transmission / reception direction of the radar from a target direction can be eliminated.
[Brief description of the drawings]
FIG. 1 is a system application example of the present invention.
FIG. 2 is a sectional view showing an embodiment of the high-frequency transmitting / receiving device according to the present invention.
FIG. 3 is a top plan view showing one embodiment of the high-frequency transmitting / receiving device according to the present invention.
FIG. 4 is a bottom plan view showing one embodiment of the high-frequency transmitting / receiving device according to the present invention.
FIG. 5 is a sectional view showing a second embodiment of the high-frequency transmitting / receiving device according to the present invention.
FIG. 6 is a sectional view showing a third embodiment of the high-frequency transmitting / receiving apparatus according to the present invention.
FIG. 7 is a cross-sectional view in which the first to third conductor passage portions of the high-frequency transmitting / receiving device according to the present invention are separate components.
FIG. 8 is a sectional view in which the conductor passage portion of FIG. 7 is installed on a lid.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... High frequency transmission / reception apparatus, 2 ... own vehicle, 3 ... preceding vehicle, 5 ... lid, 6 ... filter, 7 ... base plate, 8 ... antenna, 9 ... high frequency transmission / reception circuit board, 10 ... semiconductor IC, 11 ... coaxial line, 12 ... conductor passage portion, 13 ... lead wire, 14 ... flexible lead wire, 15 ... frame.

Claims (3)

高周波回路及びアンテナを有し、少なくても前記高周波回路を筐体の内部に実装した通信装置であって、前記筐体の蓋又は、側壁の一部に外部回路と接続する接続端子を設けたことを特徴とする高周波送受信装置。A communication device having a high-frequency circuit and an antenna, and at least the high-frequency circuit mounted inside a housing, wherein a connection terminal for connecting to an external circuit is provided on a part of a lid or a side wall of the housing. A high-frequency transmitting / receiving device characterized by the above-mentioned. 前記接続端子は蓋又は、側壁にハーメチックシールにより形成されたことを特徴とする請求項1記載の高周波送受信装置。The high-frequency transmitting / receiving device according to claim 1, wherein the connection terminal is formed by a hermetic seal on a lid or a side wall. 前記接続端子は、別部材にハーメチックシールした後に、前記蓋又は、前記側壁に溶接,加締接着等により固定したことを特徴とする請求項1記載の高周波送受信装置。The high-frequency transmitting / receiving device according to claim 1, wherein the connection terminal is hermetically sealed to another member, and then fixed to the lid or the side wall by welding, caulking, or the like.
JP2002263564A 2002-09-10 2002-09-10 High-frequency transmitting/receiving device Pending JP2004104456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002263564A JP2004104456A (en) 2002-09-10 2002-09-10 High-frequency transmitting/receiving device

Publications (1)

Publication Number Publication Date
JP2004104456A true JP2004104456A (en) 2004-04-02

Family

ID=32263255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002263564A Pending JP2004104456A (en) 2002-09-10 2002-09-10 High-frequency transmitting/receiving device

Country Status (1)

Country Link
JP (1) JP2004104456A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005083971A (en) * 2003-09-10 2005-03-31 Osaka Gas Co Ltd Search system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005083971A (en) * 2003-09-10 2005-03-31 Osaka Gas Co Ltd Search system

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