JP2004104088A5 - - Google Patents

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Publication number
JP2004104088A5
JP2004104088A5 JP2003184397A JP2003184397A JP2004104088A5 JP 2004104088 A5 JP2004104088 A5 JP 2004104088A5 JP 2003184397 A JP2003184397 A JP 2003184397A JP 2003184397 A JP2003184397 A JP 2003184397A JP 2004104088 A5 JP2004104088 A5 JP 2004104088A5
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Japan
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layer
nitride semiconductor
semiconductor device
well
barrier layer
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JP2003184397A
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Japanese (ja)
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JP2004104088A (en
JP3951973B2 (en
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Priority to JP2003184397A priority Critical patent/JP3951973B2/en
Priority claimed from JP2003184397A external-priority patent/JP3951973B2/en
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Publication of JP2004104088A5 publication Critical patent/JP2004104088A5/ja
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Claims (6)

n型不純物を含む窒化物半導体層と、p型不純物を含む窒化物半導体層との間に、少なくともInを含む第1窒化物半導体からなる井戸層と少なくともInを含む第3窒化物半導体からなる障壁層とを有する活性層を備えた窒化物半導体素子において、
前記活性層が、前記井戸層と障壁層との間に該障壁層とバンドギャップエネルギーが同一か、それよりも大きい第2窒化物半導体層を備えることを特徴とする窒化物半導体素子。
Between the nitride semiconductor layer containing an n-type impurity and the nitride semiconductor layer containing a p-type impurity, a well layer made of a first nitride semiconductor containing at least In and a third nitride semiconductor containing at least In In a nitride semiconductor device including an active layer having a barrier layer,
The active layer includes a second nitride semiconductor layer having a bandgap energy equal to or greater than that of the barrier layer between the well layer and the barrier layer.
障壁層は、井戸層よりもバンドギャップエネルギーが大きいか、前記井戸層よりも厚膜である請求項1に記載の窒化物半導体素子。  2. The nitride semiconductor device according to claim 1, wherein the barrier layer has a band gap energy larger than that of the well layer or is thicker than that of the well layer. 障壁層は、井戸層のIn量よりも少ないIn量である請求項1又は2に記載の窒化物半導体素子。  The nitride semiconductor device according to claim 1, wherein the barrier layer has an In amount that is smaller than an In amount of the well layer. 第2の窒化物半導体層が、井戸層よりも分解温度が高い請求項1〜3のいずれか1つに記載の窒化物半導体素子。  The nitride semiconductor device according to claim 1, wherein the second nitride semiconductor layer has a decomposition temperature higher than that of the well layer. 第2の窒化物半導体層が、AlGaN又はGaN(AlXGa1-XN、0≦X<1)である請求項1〜4のいずれか1つに記載の窒化物半導体素子。5. The nitride semiconductor device according to claim 1, wherein the second nitride semiconductor layer is AlGaN or GaN (Al X Ga 1-X N, 0 ≦ X <1). 活性層が、少なくとも障壁層+井戸層+第2窒化物半導体層+障壁層からなる請求項1〜4のいずれか1つに記載の窒化物半導体素子。  5. The nitride semiconductor device according to claim 1, wherein the active layer includes at least a barrier layer + a well layer + a second nitride semiconductor layer + a barrier layer.
JP2003184397A 2003-06-27 2003-06-27 Nitride semiconductor device Expired - Fee Related JP3951973B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003184397A JP3951973B2 (en) 2003-06-27 2003-06-27 Nitride semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003184397A JP3951973B2 (en) 2003-06-27 2003-06-27 Nitride semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12981098A Division JP3857417B2 (en) 1998-05-13 1998-05-13 Nitride semiconductor device

Publications (3)

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JP2004104088A JP2004104088A (en) 2004-04-02
JP2004104088A5 true JP2004104088A5 (en) 2005-10-06
JP3951973B2 JP3951973B2 (en) 2007-08-01

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JP2003184397A Expired - Fee Related JP3951973B2 (en) 2003-06-27 2003-06-27 Nitride semiconductor device

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5149093B2 (en) * 2003-06-26 2013-02-20 住友電気工業株式会社 GaN substrate and manufacturing method thereof, nitride semiconductor device and manufacturing method thereof
US7709284B2 (en) * 2006-08-16 2010-05-04 The Regents Of The University Of California Method for deposition of magnesium doped (Al, In, Ga, B)N layers
KR100674862B1 (en) * 2005-08-25 2007-01-29 삼성전기주식회사 Nitride semiconductor light emitting device
TWI533351B (en) 2006-12-11 2016-05-11 美國加利福尼亞大學董事會 Metalorganic chemical vapor deposition (mocvd) growth of high performance non-polar iii-nitride optical devices
JP2008244360A (en) * 2007-03-28 2008-10-09 Furukawa Electric Co Ltd:The Semiconductor light-emitting element
JP5181885B2 (en) * 2007-10-05 2013-04-10 住友電気工業株式会社 GaN substrate manufacturing method, epi-wafer manufacturing method, semiconductor device manufacturing method, and epi-wafer
EP2045374A3 (en) 2007-10-05 2011-02-16 Sumitomo Electric Industries, Ltd. Method of manufacturing a GaN substrate and a GaN epitaxial wafer
JP4912386B2 (en) 2008-11-26 2012-04-11 シャープ株式会社 InGaN layer manufacturing method
JP5504618B2 (en) * 2008-12-03 2014-05-28 豊田合成株式会社 Group III nitride semiconductor light-emitting device and method for manufacturing the same
JP5143076B2 (en) * 2009-04-09 2013-02-13 シャープ株式会社 Manufacturing method of nitride semiconductor light emitting device
US8218595B2 (en) * 2010-05-28 2012-07-10 Corning Incorporated Enhanced planarity in GaN edge emitting lasers

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