JP2004104034A5 - - Google Patents

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Publication number
JP2004104034A5
JP2004104034A5 JP2002267288A JP2002267288A JP2004104034A5 JP 2004104034 A5 JP2004104034 A5 JP 2004104034A5 JP 2002267288 A JP2002267288 A JP 2002267288A JP 2002267288 A JP2002267288 A JP 2002267288A JP 2004104034 A5 JP2004104034 A5 JP 2004104034A5
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JP
Japan
Prior art keywords
buffer
cladding
pipe
exhaust pipe
manufacturing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002267288A
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Japanese (ja)
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JP3894865B2 (en
JP2004104034A (en
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Publication date
Application filed filed Critical
Priority to JP2002267288A priority Critical patent/JP3894865B2/en
Priority claimed from JP2002267288A external-priority patent/JP3894865B2/en
Publication of JP2004104034A publication Critical patent/JP2004104034A/en
Publication of JP2004104034A5 publication Critical patent/JP2004104034A5/ja
Application granted granted Critical
Publication of JP3894865B2 publication Critical patent/JP3894865B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Claims (2)

基板を処理する処理室に一端が接続され他端が排気装置に接続される排気管を備えており、前記排気管の内側には、被覆管が、該被覆管の上流端部と前記排気管との間に流出口を構成するようにバッファを介して挿入されており、前記バッファには付着防止ガスが導入されるように構成されていることを特徴とする半導体製造装置。An exhaust pipe having one end connected to a processing chamber for processing a substrate and the other end connected to an exhaust device is provided. Inside the exhaust pipe , a cladding pipe is connected to an upstream end of the cladding pipe and the exhaust pipe. The semiconductor manufacturing apparatus is configured so that an adhesion preventing gas is introduced into the buffer so as to form an outlet between the buffer and the buffer. 前記付着防止ガスの温度を前記被覆管への副生成物の付着防止可能な被覆管の温度まで加熱することを特徴とする請求項１に記載の半導体製造装置。  2. The semiconductor manufacturing apparatus according to claim 1, wherein the temperature of the adhesion preventing gas is heated to a temperature of a cladding tube capable of preventing by-products from adhering to the cladding tube.
JP2002267288A 2002-09-12 2002-09-12 Semiconductor manufacturing apparatus, cladding tube, and manufacturing method of semiconductor integrated circuit device Expired - Lifetime JP3894865B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002267288A JP3894865B2 (en) 2002-09-12 2002-09-12 Semiconductor manufacturing apparatus, cladding tube, and manufacturing method of semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002267288A JP3894865B2 (en) 2002-09-12 2002-09-12 Semiconductor manufacturing apparatus, cladding tube, and manufacturing method of semiconductor integrated circuit device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006308583A Division JP4465342B2 (en) 2006-11-15 2006-11-15 Semiconductor manufacturing apparatus, exhaust pipe system, and manufacturing method of semiconductor integrated circuit device

Publications (3)

Publication Number Publication Date
JP2004104034A JP2004104034A (en) 2004-04-02
JP2004104034A5 true JP2004104034A5 (en) 2005-10-13
JP3894865B2 JP3894865B2 (en) 2007-03-22

Family

ID=32265861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002267288A Expired - Lifetime JP3894865B2 (en) 2002-09-12 2002-09-12 Semiconductor manufacturing apparatus, cladding tube, and manufacturing method of semiconductor integrated circuit device

Country Status (1)

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JP (1) JP3894865B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4540059B2 (en) * 2005-07-05 2010-09-08 創研工業株式会社 By-product adhesion prevention method to exhaust system piping of CVD apparatus, and CVD apparatus provided with by-product adhesion prevention function
EP1994934A4 (en) 2006-12-05 2010-03-10 Glycoscience Lab Inc Therapeutic agent for degenerative arthritis
JP2024042227A (en) 2022-09-15 2024-03-28 株式会社Kokusai Electric Conversion piping, substrate processing equipment, and semiconductor device manufacturing method

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