JP2004094144A - Method and apparatus for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that, when an SHG element is wholly irradiated with UV light at a time to cure a UV curing resin, the SHG element is heated to an extremely high temperature by the heat of reaction to generate stress due to expansion and shrinkage in the SHG element while the adhesive resin is cured, and this causes misalignment in the positional relation of the optical axes of a waveguide and a semiconductor laser in the SHG element which are preliminarily aligned. <P>SOLUTION: In the method to precisely position, adhere and fix an optical element, heating of the SHG element to extremely high temperature is prevented: by carrying out two-step irradiation of UV rays, that is, the irradiation in the entrance end side and another irradiation in the exit side after the SHG element is positioned with respect to the semiconductor laser element; or by condensing the UV rays to narrow down the irradiation range and gradually moving the light spot from the entrance end to the exit end. Thus, the SHG element and the semiconductor laser can be adhered and fixed while keeping the aligned state without generating stress or distortion in the SHG element. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, an SHG element that converts the wavelength of light having a specific wavelength of infrared light or red light into half is aligned with a wavelength-variable semiconductor laser element that emits infrared light or red light. The present invention relates to a manufacturing method and a manufacturing apparatus for bonding and fixing.
[0002]
[Prior art]
A conventional manufacturing method for positioning and bonding and fixing an SHG element to a wavelength-variable semiconductor laser element will be described with reference to the drawings. As shown in FIG. 5A, a substrate 22 on which a semiconductor laser element 21 is fixed in advance is gripped on a stage 23 by, for example, a method such as vacuum suction, and as shown in FIG. UV-curable adhesive resins 24 and 25 are applied to one or more locations where the SHG element is mounted, and the power supply probe needle 29 is brought into contact with the gain electrode 26 of the semiconductor laser element 21. The wavelength-tunable semiconductor laser element 21 has three electrodes: a gain electrode 26 for emitting laser light, a phase electrode 27 for controlling the emission wavelength, and a DBR electrode 28. Here, only the gain electrode 26 is used. Use. On the other hand, as shown in FIG. 5C, the collet 31 having a contact area smaller than the area of the upper surface of the SHG element 30 is brought into the vicinity of the substrate 22 while holding the SHG element 30 by vacuum suction. The collet 31 is connected to a mechanism that can change its position three-dimensionally. Next, as shown in FIG. 6D, power is supplied to the gain electrode 26 of the semiconductor laser device 21 to cause the semiconductor laser device 21 to emit a laser beam 32, and the laser beam 32 is emitted from the waveguide inside the SHG device 30. The position of the SHG element 30 is adjusted by moving the collet 31 so that the collet 31 enters the path of the light called "maximum". However, the wavelength of the laser light 32 emitted at this time is a wavelength at which the wavelength conversion operation of the SHG element 30 does not occur. When the positioning of the SHG element 30 is completed, as shown in FIG. 6 (e), the ultraviolet ray is irradiated from the outside by an ultraviolet irradiation unit 33 with an adhesive resin while maintaining the relative positional relationship between the semiconductor laser element 21 and the SHG element 30. Irradiate toward 24, 25. Since the SHG element 30 is transparent and transmits ultraviolet rays, the ultraviolet rays reach the adhesive resins 24 and 25 between the SHG element 30 and the substrate 22 even when the ultraviolet rays are irradiated from above the SHG element 30. The irradiation of the ultraviolet rays for a predetermined time cures the adhesive resins 24 and 25, fixes the SHG element 30 to the substrate, and completes the positioning and adhesive fixing of the SHG element 30 to the semiconductor laser element 21.
[0003]
[Problems to be solved by the invention]
However, when simultaneously irradiating the entire SHG element with ultraviolet light to cure the ultraviolet-curable resin, the heat causes the SHG element itself to become extremely hot, and expands and contracts inside the SHG element during the curing of the adhesive resin. As a result, there is a problem that the positional relationship between the optical axis of the semiconductor laser and the waveguide inside the SHG element that has been adjusted is misaligned.
[0004]
[Means for Solving the Problems]
In the manufacturing method for precisely positioning and fixing the optical element of the present invention, after aligning the SHG element with the semiconductor laser element, ultraviolet irradiation is divided into two parts, an incident end side and an outgoing end side, or ultraviolet rays are emitted. By condensing and narrowing the irradiation range and gradually moving from the input end to the output end, it is possible to prevent the SHG element from becoming extremely hot, so that stress and distortion do not occur inside the SHG element and SHG It is possible to bond and fix the element and the semiconductor laser while maintaining the adjusted position. In addition, the manufacturing apparatus for precisely positioning and fixing the optical element of the present invention includes two ultraviolet irradiation units to divide irradiation into an incident end side and an outgoing end side so that a time difference can be given to irradiation, or Since the irradiation is performed while one ultraviolet irradiation unit is gradually moved from the incident end side to the emission end side, the adhesive resin can be cured with a small amount of ultraviolet irradiation.
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0006]
1 and 2 show a first embodiment of a manufacturing method using an optical element positioning adhesive fixing manufacturing apparatus according to an embodiment of the present invention. As shown in FIG. 1A, a substrate 2 to which a semiconductor laser element 1 is fixed in advance is gripped on a stage 3 by, for example, a method such as vacuum suction, and then, as shown in FIG. In the portion where the SHG element is mounted, the UV-curable adhesive resin 4 is applied near the incident end of the SHG element and the UV-curable adhesive resin 5 is similarly applied near the output end of the SHG element. 6 is brought into contact with the power supply probe needle 9. The wavelength-tunable semiconductor laser device 1 has three electrodes, namely, a gain electrode 6 for emitting laser light, a phase electrode 7 for controlling the emission wavelength, and a DBR electrode 8. Here, only the gain electrode 6 is used. Use. On the other hand, as shown in FIG. 1C, the collet 11 having a contact area smaller than the area of the upper surface of the SHG element 10 is brought into the vicinity of the substrate 2 while holding the SHG element 10 by vacuum suction. The collet 11 is connected to a mechanism that can change its position three-dimensionally. Next, as shown in FIG. 2D, power is supplied to the gain electrode 6 of the semiconductor laser device 1 to cause the semiconductor laser device 1 to emit a laser beam 12, and the laser beam 12 is emitted from the waveguide inside the SHG device 10. The position of the SHG element 10 is adjusted by moving the collet 11 so as to enter the path of the light called “maximum”. However, the wavelength of the laser light 12 emitted at this time is a wavelength at which the wavelength conversion action of the SHG element 10 does not occur. When the alignment of the SHG element 10 is completed, as shown in FIG. 2E, ultraviolet rays are first adhered from the outside by the ultraviolet irradiation unit 13A while maintaining the relative positional relationship between the semiconductor laser element 1 and the SHG element 10. Irradiation is performed for a predetermined time only in the vicinity of the resin 4. At this time, since the ultraviolet ray SHG element 10 is transparent and transmits ultraviolet ray, the ultraviolet ray reaches the adhesive resin 4 between the SHG element 10 and the substrate 2 even if the ultraviolet ray is irradiated from above the SHG element 10. The adhesive resin 4 is cured by the irradiation of the ultraviolet light for a predetermined time, and the SHG element is fixed to the substrate, thereby completing the alignment bonding and fixing of the SHG element to the semiconductor laser element on the incident end side. Next, as shown in FIG. 2F, the collet 11 releases the vacuum suction of the SHG element 10 and separates from the SHG element, and then limits the ultraviolet rays to the vicinity of the adhesive resin 5 from outside using an ultraviolet irradiation unit 13B. By performing irradiation for a predetermined time, the adhesive resin 5 is cured and the SHG element is fixed to the substrate. By the above two irradiations of the ultraviolet rays, the positioning and bonding of the SHG element 10 to the semiconductor laser element 1 are completed.
[0007]
3 and 4 show a second embodiment of the manufacturing method using the optical element positioning adhesive fixing manufacturing apparatus according to the embodiment of the present invention. As shown in FIG. 3A, a substrate 2 on which a semiconductor laser element 1 is fixed in advance is held on a stage 3 by, for example, a method such as vacuum suction or the like, and as shown in FIG. The UV curable adhesive resin 4 is applied to the portion where the SHG element is mounted, and the power supply probe needle 9 is brought into contact with the gain electrode 6 of the semiconductor laser element 1. Regarding the method of applying the UV-curable adhesive, a method of sequentially applying a plurality of portions from the incident end side to the emission end side or a method of applying in a line is also the opposite direction, that is, from the emission end side to the incidence end side. A method in which a plurality of portions are sequentially applied or a method in which application is performed in a line may be employed. The wavelength-tunable semiconductor laser device 1 has three electrodes: a gain electrode 6 for emitting laser light, a phase electrode 7 for controlling the emission wavelength, and a DBR electrode 8. Use On the other hand, as shown in FIG. 3C, the collet 11 having a contact area smaller than the area of the upper surface of the SHG element 10 is brought near the substrate 2 while holding the SHG element 10 by vacuum suction. The collet 11 is connected to a mechanism that can change its position three-dimensionally. Next, as shown in FIG. 4D, power is supplied to the gain electrode 6 of the semiconductor laser device 1 to cause the semiconductor laser device 1 to emit a laser beam 12, and the laser beam 12 is emitted from the waveguide inside the SHG device 10. The position of the SHG element 10 is adjusted by moving the collet 11 so as to enter the path of the light called “maximum”. However, the wavelength of the laser light 12 emitted at this time is a wavelength at which the wavelength conversion action of the SHG element 10 does not occur. When the alignment of the SHG element 10 is completed, as shown in FIG. 4 (e), ultraviolet rays are applied from the outside by the ultraviolet irradiation unit 13 while maintaining the relative positional relationship between the semiconductor laser element 1 and the SHG element 10. Irradiate toward 4. The ultraviolet irradiation unit 13 has a mechanism capable of moving along the longitudinal direction of the SHG element, and the moving speed and the moving distance can be set and programmed in advance. That is, the ultraviolet irradiation unit 13 cures the adhesive resin 4 while irradiating ultraviolet rays at a preset speed and distance along the longitudinal direction of the SHG element 10, and the SHG element 10 is fixed to the substrate 2. Thus, the positioning and bonding of the SHG element 10 to the semiconductor laser element 1 are completed.
[0008]
【The invention's effect】
According to the first embodiment of the present invention, the irradiation range can be narrowed and the adhesive resin on the incident side of the SHG element is cured by intentionally changing the ultraviolet irradiation timing of the two ultraviolet irradiation units. After that, it is possible to provide a time difference in curing such as curing the adhesive resin on the emission side. Therefore, a remarkable rise in temperature of the SHG element can be suppressed, and as a result, the SHG element can be bonded and fixed without generating stress and without distortion.
[0009]
According to the second embodiment of the present invention, the irradiation range can be narrowed, and the irradiation is performed while moving one ultraviolet irradiation unit from the input end to the output end along the SHG element, whereby the SHG element It can be cured sequentially from the adhesive resin on the incident side. Therefore, a sharp rise in temperature of the SHG element can be suppressed, and as a result, the SHG element can be bonded and fixed without generating stress and without distortion.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an optical element bonding and fixing method according to a first embodiment of the present invention; FIG. 2 is a diagram illustrating an optical element bonding and fixing method according to a first embodiment of the present invention; FIG. 4 is a view showing an optical element bonding and fixing method according to a second embodiment of the present invention. FIG. 4 is a view showing an optical element bonding and fixing method according to a second embodiment of the present invention. FIG. 6 shows a conventional method for bonding and fixing an optical element.
DESCRIPTION OF SYMBOLS 1 Semiconductor laser element 2 Substrate 3 Stage 4 Adhesive resin 5 Adhesive resin 6 Gain electrode 7 Phase electrode 8 DBR electrode 9 Power supply probe needle 10 SHG element 11 Collet 12 Laser beam 13 Ultraviolet irradiation unit 21 Semiconductor laser element 22 Substrate 23 Stage 24 Adhesion Resin 25 Adhesive resin 26 Gain electrode 27 Phase electrode 28 DBR electrode 29 Power supply probe needle 30 SHG element 31 Collet 32 Laser beam 33 Ultraviolet irradiation unit

Claims (4)

In a manufacturing process in which an optical element (hereinafter, referred to as an SHG element) for converting a laser wavelength to a half is aligned and fixed with respect to a semiconductor laser element that emits infrared light or red light, a bonding process is performed. An ultraviolet-curable resin is used as an adhesive, and after the semiconductor laser element and the SHG element are aligned, the adhesive resin applied to the incident end side of the SHG element is cured and the adhesive resin applied to the output end side A method of manufacturing a semiconductor device, characterized in that an SHG element is bonded and fixed with a time difference in curing of the semiconductor device. A mechanism capable of holding the semiconductor laser element and the SHG element, a mechanism capable of minutely changing the three-dimensional relative position between the semiconductor laser element and the SHG element, and an electrical mechanism for generating laser light from the semiconductor laser element. A circuit, an apparatus for applying an ultraviolet curing resin, and an ultraviolet irradiation unit for curing the adhesive resin applied to the incident end side of the SHG element and an ultraviolet irradiation unit for curing the adhesive resin applied to the emission end side of the SHG element. 2. An apparatus for manufacturing a semiconductor device, comprising the irradiation unit, wherein the optical element alignment bonding according to claim 1 can be performed. In the manufacturing process of aligning and fixing the optical element for converting the laser wavelength in half to the semiconductor laser element that emits infrared light or red light, an ultraviolet-curable adhesive is used as an adhesive for bonding and fixing. After aligning the semiconductor laser element and SHG element using resin, the SHG element is bonded and fixed by curing the applied adhesive resin while moving ultraviolet rays with a narrower irradiation range from the input end to the output end. A method of manufacturing a semiconductor device. A mechanism capable of holding the semiconductor laser element and the SHG element, a mechanism capable of minutely changing the three-dimensional relative position between the semiconductor laser element and the SHG element, and an electrical mechanism for generating laser light from the semiconductor laser element. 4. The circuit according to claim 3, further comprising a circuit, an apparatus for applying an ultraviolet curing resin, and an ultraviolet irradiation unit having a narrow irradiation range, wherein the ultraviolet irradiation unit is a mechanism movable along the SHG element. An apparatus for manufacturing a semiconductor device, capable of performing optical element alignment bonding.

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