JP2004091196A - Plate-like material transport apparatus and clearance regulating member - Google Patents

Plate-like material transport apparatus and clearance regulating member Download PDF

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Publication number
JP2004091196A
JP2004091196A JP2002258720A JP2002258720A JP2004091196A JP 2004091196 A JP2004091196 A JP 2004091196A JP 2002258720 A JP2002258720 A JP 2002258720A JP 2002258720 A JP2002258720 A JP 2002258720A JP 2004091196 A JP2004091196 A JP 2004091196A
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Japan
Prior art keywords
bolt
plate
suction
inner peripheral
peripheral end
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Pending
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JP2002258720A
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Japanese (ja)
Inventor
Ichiro Yamahata
山端 一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2002258720A priority Critical patent/JP2004091196A/en
Priority to CNB03155797XA priority patent/CN100468682C/en
Publication of JP2004091196A publication Critical patent/JP2004091196A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To prevent damage to a plate-like material by securing smooth vertical motion of a bolt to exhibit primary function of a shock absorbing member even if the bolt and a screw hole are shifted in a plate-like material transport apparatus in which the tip of a bolt loosely fitted in a bolt loose fit hole to move up and down is engaged with the screw hole, a suction pad having the screw hole is supported in suspended state through the bolt and the shock absorbing member loosely fitted to the outer peripheral side of the bolt, and in the suction pad, the shock in holding and releasing the plate-like material is softened. <P>SOLUTION: A clearance regulating member 21 is composed of a sliding cylinder part 23 slidably surrounding the periphery of the bolt, a taper part 24 formed like a skirt from one inner peripheral end part 23a of the sliding cylinder part 23 toward the outer peripheral end part 24a with the inner peripheral end part 23a entering between a bolt loose fitting hole 10 and the bolt 18 to thereby restrain looseness of the bolt loose fit hole 10 and the bolt 18, and a pressed part 25 pressed in contact with the end of a compression spring 22 extending from the other inner peripheral end part 23b of the sliding cylinder part 23 to the skirt part of the tapered part 24. The constructed clearance regulating member 21 is interposed in the clearance between the bolt loose fit hole 19 and the bolt 18. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、板状物を保持して搬送する板状物搬送装置及び板状物搬送装置に配設される隙間規制部材に関する。
【0002】
【従来の技術】
板状物を加工する過程においては、ある工程から次の工程へと移る際、またはある工程の途中において、板状物を保持して搬送する必要がある。そして、例えば半導体ウェーハのような薄い板状物を搬送する板状物搬送装置においては、保持の際に板状物に与える衝撃を和らげて損傷を防止するために、緩衝材が用いられている(例えば特許文献1、特許文献2参照)。
【0003】
【特許文献1】
特開平8−55896号公報(第3頁、第2図)
【特許文献2】
特開2000−106390号公報(第5頁、第3図)
【0004】
例えば特許文献1においては、取付孔の内径よりも軸部の外径を小さく形成することにより、軸部が取付孔に遊嵌し、軸部の外周と取付孔の内周との間に隙間が形成されるように構成されている。このような構成とすることにより、緩衝材の伸縮を伴って軸部が上下動することが可能となり、半導体ウェーハに対する衝撃を緩和し、半導体ウェーハの損傷を防止している。
【0005】
【発明が解決しようとする課題】
しかしながら、通常は、特許文献1の吸着部を構成するポーラス部材は、ポーラスセラミックスにより形成され、ポーラス部材を覆う部分はセラミックスにより形成され、両者は焼結により一体成形されるため、セラミックスの熱収縮により軸部と吸着部とが所望の位置関係にならず、位置ずれが生じることがある。
【0006】
このような位置ずれが生じると、軸部の上下動が円滑に行われなくなり、緩衝材がその本来の機能を発揮することができなくなるため、半導体ウェーハを損傷させるおそれがあるという問題がある。
【0007】
一方、このような位置ずれに対応可能となるように、取付孔の内径を大きく形成することも可能ではあるが、この場合は軸部と取付孔との間にガタツキが生じるため、半導体ウェーハを吸着部の所定の位置において保持することができず、適正な位置に搬送することができないという問題が生じる。
【0008】
従って、たとえ軸部と吸着部との間に位置ずれが生じたとしても、軸部の円滑な上下動を確保し、緩衝材の本来の機能を発揮させることにより、板状物の損傷を防止することに課題を有している。
【0009】
【課題を解決するための手段】
上記課題を解決するための具体的手段として本発明は、板状物を吸引保持する吸着面を有する吸着プレート及び吸着プレートの吸着面以外の部位を覆うプレートカバーからなる吸着パッドと、吸着パッドを吊垂状態で支持する吸着パッド支持手段と、吸着パッド支持手段に連結される搬送アームとを少なくとも備えた板状物搬送装置であって、プレートカバーにはネジ穴が形成されており、吸着パッド支持手段は、ネジ穴に対応するボルト遊嵌孔が形成されたボルト支持部と、ボルト遊嵌穴に遊嵌して吊垂状態で支持されネジ穴に螺合するボルトと、ボルトの外周に遊嵌し、プレートカバーとボルト支持部とを離反させる方向に付勢する圧縮バネと、圧縮バネと該ボルト支持部との間に介在し、圧縮バネによって付勢されてボルト支持部に押しつけられることにより、ボルトとボルト遊嵌穴の内周面との間の隙間を規制する隙間規制部材とから構成され、隙間規制部材は、ボルトの外周を摺動可能に囲繞する摺動筒部と、摺動筒部一方の内周端部から外周端部に向けてスカート状に形成され、内周端部がボルト遊嵌穴とボルトとの間に入り込んでボルト遊嵌穴とボルトとのガタツキを抑制するテーパー部と、摺動筒部の他方の内周端部からテーパー部の裾部に至り圧縮バネの端部に接触して押圧される被押圧部とから構成される板状物搬送装置を提供する。
【0010】
そしてこの板状物搬送装置は、吸着プレートがポーラスセラミックスにより形成され、プレートカバーがセラミックスにより形成され、プレートカバーにはネジ穴が形成されたナットが嵌合する嵌合凹部が形成され、嵌合凹部にボンド剤を介してナットが固定されて吸着パッドが構成されること、隙間規制部材は四フッ化エチレン樹脂で形成されていることを付加的な要件とする。
【0011】
また本発明は、ボルトと、ボルトを遊嵌させるボルト遊嵌孔の内周面との間の隙間を規制する隙間規制部材であって、ボルトの外周を摺動可能に囲繞する摺動筒部と、摺動筒部の一方の内周端部から外周端部に向けてスカート状に形成されたテーパー部と、摺動筒部の他方の内周端部からテーパー部の裾部に至り圧縮バネの端部に接触して押圧される被押圧部とから構成される隙間規制部材を提供する。
【0012】
このように構成される板状物搬送装置及び隙間規制部材によれば、ネジ穴の位置がずれた場合でも、隙間規制部材の作用によりボルトとボルト遊嵌孔とのガタツキをなくすことができると共に、ボルトと隙間規制部材との摺動を確保し、吸着パッドとボルト支持部との間に介在している圧縮バネを緩衝部材として機能させることができる。
【0013】
【発明の実施の形態】
本発明の実施の形態の一例として、図1に示す板状物搬送装置10について説明する。なお、従来例と同様に構成される部位については同一の番号を付して説明する。
【0014】
図1及び図2に示すように、板状物搬送装置10は、吸着パッド11と搬送アーム13とがボルト18によって連結されて構成される。図1に示すように、ボルト18の外周側には、隙間規制部材21が摺接すると共に、圧縮バネ22が遊嵌する。
【0015】
搬送アーム13の先端部にはボルト支持部20が形成されており、ボルト支持部20には、垂直方向に貫通してボルト18を遊嵌させるボルト遊嵌孔19が少なくとも3個形成されている。
【0016】
吸着パッド11は、図3に示すように、多孔質のポーラスセラミックスにより形成され板状物を吸引保持する吸着面を有する吸着プレート14と、セラミックスにより形成され吸着プレート14の吸着面以外の部位を覆った状態で支持するプレートカバー15とから構成される。
【0017】
プレートカバー15の上面には3つの凹部16が形成されており、凹部16にはネジ穴17aが形成されたナット17が埋設され、ボンド剤によって固定される。また、プレートカバー15の中心部には吸引源に連通する吸引路15aが形成されており、図4に示すように、吸引路18は吸着プレート14に連通し、図2に示したチューブ15bを介して連通した吸引源から吸着プレート14に対して吸引力が供給される。
【0018】
図5に示すように、ボルト18の軸部18aがボルト遊嵌孔19に遊嵌し、ボルト支持部20によってボルト18が吊垂状態で支持される。また、ボルト18の先端部に形成された雄ネジ部18bは、凹部16に埋設されたナット17のネジ穴に螺合している。
【0019】
ボルト18の軸部18aとボルト遊嵌孔19の内周面との間には隙間が形成され、この隙間には、隙間規制部材21が介在している。また、ボルト支持部20と吸着パッド11との間においては、圧縮バネ22がボルト18の外周側に遊嵌して介在しており、この圧縮バネ22は、プレートカバー15とボルト支持部20とを離反させる方向に付勢されている。
【0020】
隙間規制部材21は、摩擦係数が低い部材、例えば四フッ化エチレン樹脂であるテフロン(登録商標)により構成され、図示の例では断面がほぼ三角形状に形成されており、図6に示すように、ボルト18の外周を摺動可能に囲繞する摺動筒部23と、一方の内周端部23aから外周端部24aに向けてスカート状に形成されたテーパー部24と、他方の内周端部23bからテーパー部24の裾部に至り圧縮バネ22の端部に接触して圧縮バネ22の付勢力によって上方に向けて押圧される被押圧部25とから構成されており、図5に示したように、テーパー部24は、内周端部23aがボルト遊嵌孔19の内周面とボルト18の軸部18aとの間に入り込んでボルト遊嵌孔19とボルト18とのガタツキを抑制する。
【0021】
このようにして、ボルト支持部20によって吊垂状態でボルト18が支持され、ボルト18の雄ネジ部18bがナット17のネジ穴に螺合することにより、吸着パッド11が支持され、ボルト18と、ボルト支持部20と、圧縮バネ22と、隙間規制部材21とで吸着パッド支持手段12を構成している。吸着パッド支持手段12は搬送アーム13に連結されている。
【0022】
吸着プレート14とプレートカバー15とが焼結により一体成形され、凹部16の水平方向の位置にずれが生じると、それに伴いナット17のネジ穴とボルト遊嵌孔19との垂直方向の位置にずれが生じるため、ボルト18は、ボルト遊嵌孔19の中心からずれた位置で吊垂された状態となる。
【0023】
しかし、仮にナット17のネジ穴とボルト遊嵌孔19との垂直方向の位置ずれに起因してボルト18が若干偏寄した場合でも、隙間規制部材21はテーパー部24においてボルト遊嵌孔19の内周面に接しているため、隙間規制部材21もそれに倣って偏寄し、ボルト18と摺動筒部23との円滑な摺動を確保することができる。
【0024】
また、被押圧部25は圧縮バネ22によって上方に押し上げられるため、上記のようにボルト18が偏寄した場合でも、被押圧部25と圧縮バネ22との接触は確保され、吸着パッド11とボルト支持部20との間には互いに離反する方向に力が働く。従って、この場合においても圧縮バネ22の緩衝部材としての機能が確保され、半導体ウェーハの損傷を防止することができる。
【0025】
更に、圧縮バネ22によって隙間規制部材21が押し上げられることにより、隙間規制部材21にはボルト遊嵌孔19の中心に向けて移動しようとする力が働くため、ボルト18と摺動筒部23とが摺動可能な状態を維持しつつ、ボルト18がボルト遊嵌孔19の中心に向かうようになると共に、吸着パッド11がボルト支持部20に対してガタつかない。
【0026】
以上のように構成される板状物搬送装置10は、例えば図7に示す研削装置30等に搭載されるか、または単独で用いられる。
【0027】
研削装置30は、半導体ウェーハ等の板状物の面を研削する装置であり、研削しようとする板状物、例えば半導体ウェーハWはカセット31に収容されており、搬出入手段32によって仮置きテーブル33に搬出された後、その近傍に配設された第一の板状物搬送装置10によって吸着され、ターンテーブル34に回転可能に支持されたチャックテーブル35に搬送される。
【0028】
仮置きテーブル33に載置された半導体ウェーハを吸着する際及び吸着した半導体ウェーハをチャックテーブル35に載置する際は、搬送アーム13の水平方向の回動及び吸着パッド11の下降によって、図1〜図5に示した吸着プレート14が半導体ウェーハと接触する。このとき、圧縮バネ22によって衝撃が緩和されると共に、ナット17のネジ穴とボルト18との位置がずれていたとしても、隙間規制部材21の作用によってボルト18と摺動筒部23との摺動が円滑に行われ、圧縮バネ22が緩衝部材として機能するため、半導体ウェーハの損傷を防止することができる。
【0029】
チャックテーブル35において保持された半導体ウェーハは、ターンテーブル34の回転によって第一の研削手段36及び第二の研削手段37の直下に順次位置付けられ、それぞれの研削手段を構成する回転する研削砥石38、39によって研削されて所望の厚さとなった後に、ターンテーブル34の回転によって第二の板状物搬送装置10の近傍に位置付けられる。
【0030】
そして、搬送アーム13の水平方向の回動及び吸着パッド11の下降によって図1〜図5に示した吸着プレート14がチャックテーブル35に保持された研削後の半導体ウェーハと接触して吸着するが、このときも圧縮バネ22によって衝撃が緩和されると共に、ナット17とボルト18との位置がずれていたとしても、隙間規制部材21の作用によってボルト18と摺動筒部23との摺動が円滑に行われ、圧縮バネ22が緩衝部材として機能するため、半導体ウェーハの損傷を防止することができる。
【0031】
次に、搬送アーム13が回動することにより半導体ウェーハWが洗浄手段40に搬送され、保持テーブル41に載置される。このときも、上記と同様にして圧縮バネ22によって衝撃が緩和されると共に、ナット17とボルト18との位置がずれていたとしても、隙間規制部材21の作用によってボルト18と摺動筒部23との摺動が円滑に行われ、圧縮バネ22が緩衝部材として機能するため、半導体ウェーハの損傷を防止することができる。
【0032】
最後に、洗浄手段40において洗浄された半導体ウェーハWは、搬出入手段21によってカセット42に収容される。
【0033】
【発明の効果】
以上説明したように、本発明に係る板状物搬送装置及び隙間規制部材においては、ネジ穴の位置がずれた場合でも、隙間規制部材の作用によりボルトとボルト遊嵌孔とのガタツキをなくすことができると共に、ボルトと隙間規制部材との摺動を確保し、吸着パッドとボルト支持部との間に介在している圧縮バネを緩衝部材として機能させることができるため、半導体ウェーハの損傷を防止することができる。
【図面の簡単な説明】
【図1】本発明に係る板状物搬送装置の一例を示す分解斜視図である。
【図2】同板状物搬送装置を示す斜視図である。
【図3】吸着パッドの構成を示す分解斜視図である。
【図4】同吸着パッドを示す断面図である。
【図5】吸着パッドの支持状態を示す断面図である。
【図6】本発明に係る隙間規制部材の一例を示す斜視図である。
【図7】本発明に係る板状物搬送装置が搭載される装置の一例である研削装置を示す斜視図である。
【符号の説明】
10…板状物搬送装置 11…吸着パッド
12…吸着パッド支持手段 13…搬送アーム
14…吸着プレート 15…プレートカバー
16…凹部 17…ナット 18…吸引路
18a…軸部 18b…雄ネジ部
19…ボルト遊嵌孔 20…ボルト支持部
21…隙間規制部材 22…圧縮バネ
23…摺動筒部 23a…内周端部
24…テーパー部 24a…外周端部
25…被押圧部 30…研削装置 31…カセット
32…搬出入手段 33…仮置きテーブル
34…ターンテーブル 35…チャックテーブル
36…第一の研削手段 37…第二の研削手段
38、39…研削砥石 40…洗浄手段
41…保持テーブル 42…カセット
[0001]
TECHNICAL FIELD OF THE INVENTION
1. Field of the Invention The present invention relates to a plate-shaped object transfer device that holds and transfers a plate-shaped object, and a gap regulating member provided in the plate-shaped object transfer device.
[0002]
[Prior art]
In the process of processing a plate-like material, it is necessary to hold and transport the plate-like material when moving from a certain process to the next process or in the middle of a certain process. For example, in a plate-like object transfer device that transfers a thin plate-like object such as a semiconductor wafer, a cushioning material is used to reduce an impact given to the plate-like object during holding and prevent damage. (For example, see Patent Documents 1 and 2).
[0003]
[Patent Document 1]
JP-A-8-55896 (page 3, FIG. 2)
[Patent Document 2]
JP-A-2000-106390 (page 5, FIG. 3)
[0004]
For example, in Patent Document 1, by forming the outer diameter of the shaft portion smaller than the inner diameter of the mounting hole, the shaft portion loosely fits into the mounting hole, and a gap is formed between the outer circumference of the shaft portion and the inner circumference of the mounting hole. Is formed. With such a configuration, the shaft portion can move up and down with the expansion and contraction of the cushioning material, thereby reducing the impact on the semiconductor wafer and preventing the semiconductor wafer from being damaged.
[0005]
[Problems to be solved by the invention]
However, usually, the porous member constituting the adsorption portion of Patent Document 1 is formed of porous ceramics, and the portion covering the porous member is formed of ceramics, and both are integrally formed by sintering, so that the heat shrinkage of the ceramics is caused. As a result, the shaft portion and the suction portion may not have a desired positional relationship, and a positional shift may occur.
[0006]
If such a positional shift occurs, the vertical movement of the shaft portion will not be performed smoothly, and the cushioning member will not be able to exhibit its original function, and there is a problem that the semiconductor wafer may be damaged.
[0007]
On the other hand, it is possible to increase the inner diameter of the mounting hole so as to be able to cope with such a displacement, but in this case, rattling occurs between the shaft portion and the mounting hole, so that the semiconductor wafer must be removed. There is a problem that the suction unit cannot be held at a predetermined position and cannot be transported to an appropriate position.
[0008]
Therefore, even if there is a displacement between the shaft part and the suction part, the smooth movement of the shaft part is ensured, and the original function of the cushioning material is prevented, thereby preventing damage to the plate-like material. There is a problem in doing.
[0009]
[Means for Solving the Problems]
As a specific means for solving the above-mentioned problems, the present invention provides a suction pad including a suction plate having a suction surface for sucking and holding a plate-like material, a plate cover covering a portion other than the suction surface of the suction plate, and a suction pad. What is claimed is: 1. A plate-like object transfer device comprising at least a suction pad support means for supporting in a suspended state and a transfer arm connected to the suction pad support means, wherein a screw hole is formed in a plate cover, and the suction pad The support means includes a bolt support portion having a bolt loose fitting hole corresponding to the screw hole, a bolt loosely fitted into the bolt loose fitting hole, supported in a suspended state and screwed into the screw hole, and an outer periphery of the bolt. A compression spring that loosely fits and biases the plate cover and the bolt support in a direction to separate the plate cover and the bolt support; and a compression spring that is interposed between the compression spring and the bolt support and is biased by the compression spring to push the bolt support. A gap regulating member that regulates a gap between the bolt and the inner peripheral surface of the bolt loose fitting hole by being attached, the gap regulating member slidably surrounds the outer periphery of the bolt. And a sliding skirt is formed in a skirt shape from one inner peripheral end to the outer peripheral end, and the inner peripheral end is inserted between the bolt loose fitting hole and the bolt to form the bolt loose fitting hole and the bolt. A plate-shaped object composed of a tapered portion that suppresses rattling, and a pressed portion that is pressed from the other inner peripheral end of the sliding cylindrical portion to the bottom of the tapered portion and in contact with the end of the compression spring. A transport device is provided.
[0010]
In this plate-like object transporting device, the suction plate is formed of porous ceramics, the plate cover is formed of ceramics, and the plate cover is formed with a fitting recess in which a nut having a screw hole is fitted. An additional requirement is that the nut is fixed to the concave portion via a bonding agent to form a suction pad, and that the gap regulating member is made of tetrafluoroethylene resin.
[0011]
The present invention is also a gap regulating member for regulating a gap between a bolt and an inner peripheral surface of a bolt loose fitting hole for loosely fitting the bolt, wherein the sliding cylinder portion slidably surrounds the outer periphery of the bolt. And a tapered portion formed in a skirt shape from one inner peripheral end to the outer peripheral end of the sliding cylindrical portion, and compressed from the other inner peripheral end of the sliding cylindrical portion to the skirt of the tapered portion. Provided is a gap regulating member including a pressed part which is pressed by contacting an end of a spring.
[0012]
According to the plate-shaped object conveyance device and the gap regulating member configured as described above, even if the position of the screw hole is shifted, the rattle between the bolt and the bolt loose fitting hole can be eliminated by the action of the gap regulating member. In addition, the sliding between the bolt and the gap regulating member can be ensured, and the compression spring interposed between the suction pad and the bolt supporting portion can function as a buffer member.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
As an example of an embodiment of the present invention, a plate-like object transfer device 10 shown in FIG. 1 will be described. Parts that are configured in the same manner as in the conventional example will be described with the same reference numerals.
[0014]
As shown in FIGS. 1 and 2, the plate-shaped object transfer device 10 is configured by connecting a suction pad 11 and a transfer arm 13 with bolts 18. As shown in FIG. 1, a gap regulating member 21 slides on the outer peripheral side of the bolt 18, and a compression spring 22 fits loosely.
[0015]
A bolt support portion 20 is formed at the distal end portion of the transfer arm 13, and the bolt support portion 20 has at least three bolt loose fitting holes 19 that penetrate vertically and loosely fit the bolt 18. .
[0016]
As shown in FIG. 3, the suction pad 11 has a suction plate 14 formed of porous porous ceramics and having a suction surface for sucking and holding a plate-like material, and a portion other than the suction surface of the suction plate 14 formed of ceramics. And a plate cover 15 supported in a covered state.
[0017]
Three concave portions 16 are formed on the upper surface of the plate cover 15, and a nut 17 having a screw hole 17 a is embedded in the concave portion 16 and fixed by a bonding agent. A suction path 15a communicating with a suction source is formed at the center of the plate cover 15. As shown in FIG. 4, the suction path 18 communicates with the suction plate 14, and the tube 15b shown in FIG. A suction force is supplied to the suction plate 14 from a suction source that communicates with the suction plate.
[0018]
As shown in FIG. 5, the shaft 18 a of the bolt 18 is loosely fitted in the bolt loose fitting hole 19, and the bolt 18 is supported by the bolt support 20 in a suspended state. A male screw portion 18 b formed at the tip of the bolt 18 is screwed into a screw hole of a nut 17 embedded in the recess 16.
[0019]
A gap is formed between the shaft portion 18a of the bolt 18 and the inner peripheral surface of the bolt loose fitting hole 19, and a gap regulating member 21 is interposed in this gap. A compression spring 22 is loosely fitted on the outer peripheral side of the bolt 18 between the bolt support 20 and the suction pad 11, and the compression spring 22 is connected to the plate cover 15 and the bolt support 20. Are urged in a direction to separate them.
[0020]
The gap regulating member 21 is made of a member having a low coefficient of friction, for example, Teflon (registered trademark) which is a tetrafluoroethylene resin, and has a substantially triangular cross section in the illustrated example, as shown in FIG. , A sliding cylindrical portion 23 slidably surrounding the outer periphery of the bolt 18, a tapered portion 24 formed in a skirt shape from one inner peripheral end 23a toward the outer peripheral end 24a, and the other inner peripheral end. A portion to be pressed 25 is formed from the portion 23b to the skirt of the tapered portion 24, contacts the end of the compression spring 22, and is pressed upward by the urging force of the compression spring 22, as shown in FIG. As described above, the tapered portion 24 suppresses the rattle between the bolt loose fitting hole 19 and the bolt 18 by the inner peripheral end portion 23a entering between the inner circumferential surface of the bolt loose fitting hole 19 and the shaft portion 18a of the bolt 18. I do.
[0021]
In this manner, the bolt 18 is supported in a suspended state by the bolt support portion 20, and the male screw portion 18 b of the bolt 18 is screwed into the screw hole of the nut 17, so that the suction pad 11 is supported. , The bolt support 20, the compression spring 22, and the gap regulating member 21 constitute the suction pad support 12. The suction pad supporting means 12 is connected to the transfer arm 13.
[0022]
When the suction plate 14 and the plate cover 15 are integrally formed by sintering, and the horizontal position of the recess 16 is shifted, the vertical position of the screw hole of the nut 17 and the bolt loose fitting hole 19 is shifted accordingly. Therefore, the bolt 18 is suspended at a position shifted from the center of the bolt loose fitting hole 19.
[0023]
However, even if the bolt 18 is slightly deviated due to a vertical displacement between the screw hole of the nut 17 and the bolt loose fitting hole 19, the gap restricting member 21 can prevent the bolt loose fitting hole 19 from forming at the tapered portion 24. Since it is in contact with the inner peripheral surface, the gap regulating member 21 also deviates accordingly, and smooth sliding between the bolt 18 and the sliding cylinder 23 can be secured.
[0024]
Further, since the pressed portion 25 is pushed upward by the compression spring 22, even when the bolt 18 is deviated as described above, the contact between the pressed portion 25 and the compression spring 22 is ensured, and the suction pad 11 and the bolt A force acts between the support portion 20 and the support portion 20 in a direction away from each other. Therefore, also in this case, the function of the compression spring 22 as a buffer member is secured, and damage to the semiconductor wafer can be prevented.
[0025]
Further, when the gap regulating member 21 is pushed up by the compression spring 22, a force to move the gap regulating member 21 toward the center of the bolt loose fitting hole 19 acts on the gap regulating member 21. While maintaining the slidable state, the bolt 18 moves toward the center of the bolt loose fitting hole 19, and the suction pad 11 does not rattle against the bolt support portion 20.
[0026]
The plate-like object transfer device 10 configured as described above is mounted on, for example, the grinding device 30 shown in FIG. 7 or used alone.
[0027]
The grinding device 30 is a device for grinding a surface of a plate-like object such as a semiconductor wafer. A plate-like object to be ground, for example, a semiconductor wafer W is housed in a cassette 31 and is temporarily stored by a loading / unloading means 32. After being carried out to 33, it is adsorbed by the first plate-like object transfer device 10 arranged in the vicinity thereof and transferred to the chuck table 35 rotatably supported by the turntable 34.
[0028]
When the semiconductor wafer placed on the temporary placing table 33 is sucked and the sucked semiconductor wafer is placed on the chuck table 35, the horizontal rotation of the transfer arm 13 and the lowering of the suction pad 11 cause the semiconductor wafer shown in FIG. 5 is in contact with the semiconductor wafer. At this time, the impact is alleviated by the compression spring 22 and even if the position of the screw hole of the nut 17 and the position of the bolt 18 are shifted, the sliding of the bolt 18 and the sliding cylinder portion 23 is performed by the action of the gap regulating member 21. Since the movement is performed smoothly and the compression spring 22 functions as a buffer member, damage to the semiconductor wafer can be prevented.
[0029]
The semiconductor wafer held on the chuck table 35 is sequentially positioned immediately below the first grinding means 36 and the second grinding means 37 by the rotation of the turntable 34, and a rotating grinding wheel 38 constituting each grinding means, After being ground to a desired thickness by 39, the turntable 34 is rotated to be positioned near the second plate-like material transfer device 10.
[0030]
Then, the suction plate 14 shown in FIGS. 1 to 5 comes into contact with the ground semiconductor wafer held by the chuck table 35 and is sucked by the rotation of the transfer arm 13 in the horizontal direction and the lowering of the suction pad 11. At this time as well, the impact is alleviated by the compression spring 22 and even if the position of the nut 17 and the position of the bolt 18 are shifted, the sliding of the bolt 18 and the sliding cylinder portion 23 is smoothly performed by the action of the gap regulating member 21. Since the compression spring 22 functions as a buffer member, damage to the semiconductor wafer can be prevented.
[0031]
Next, the semiconductor wafer W is transferred to the cleaning unit 40 by the rotation of the transfer arm 13, and is placed on the holding table 41. At this time, the impact is alleviated by the compression spring 22 in the same manner as described above, and even if the position of the nut 17 and the bolt 18 is shifted, the bolt 18 and the sliding cylinder 23 Is smoothly performed, and the compression spring 22 functions as a buffer member, so that damage to the semiconductor wafer can be prevented.
[0032]
Finally, the semiconductor wafer W cleaned by the cleaning unit 40 is stored in the cassette 42 by the loading / unloading unit 21.
[0033]
【The invention's effect】
As described above, in the plate-shaped object conveying device and the gap regulating member according to the present invention, even when the position of the screw hole is shifted, the rattle between the bolt and the bolt loose fitting hole is eliminated by the action of the gap regulating member. As well as securing the sliding between the bolt and the gap regulating member and allowing the compression spring interposed between the suction pad and the bolt support to function as a cushioning member, preventing damage to the semiconductor wafer. can do.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an example of a plate-like object transfer device according to the present invention.
FIG. 2 is a perspective view showing the plate-like object transfer device.
FIG. 3 is an exploded perspective view showing a configuration of a suction pad.
FIG. 4 is a sectional view showing the suction pad.
FIG. 5 is a sectional view showing a support state of the suction pad.
FIG. 6 is a perspective view showing an example of a gap regulating member according to the present invention.
FIG. 7 is a perspective view showing a grinding device which is an example of a device on which the plate-like object transfer device according to the present invention is mounted.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Plate-like object conveyance apparatus 11 ... Suction pad 12 ... Suction pad support means 13 ... Transfer arm 14 ... Suction plate 15 ... Plate cover 16 ... Depression 17 ... Nut 18 ... Suction path 18a ... Shaft part 18b ... Male screw part 19 ... Bolt loose fitting hole 20 Bolt support 21 Gap regulating member 22 Compression spring 23 Sliding cylinder 23a Inner peripheral end 24 Tapered part 24a Outer peripheral end 25 Pressed part 30 Grinding device 31 Cassette 32 ... Carry-in / out means 33 ... Temporary placing table 34 ... Turntable 35 ... Chuck table 36 ... First grinding means 37 ... Second grinding means 38, 39 ... Grinding wheel 40 ... Cleaning means 41 ... Holding table 42 ... Cassette

Claims (4)

板状物を吸引保持する吸着面を有する吸着プレート及び該吸着プレートの吸着面以外の部位を覆うプレートカバーからなる吸着パッドと、該吸着パッドを吊垂状態で支持する吸着パッド支持手段と、該吸着パッド支持手段に連結される搬送アームとを少なくとも備えた板状物搬送装置であって、
該プレートカバーにはネジ穴が形成されており、
該吸着パッド支持手段は、該ネジ穴に対応するボルト遊嵌孔が形成されたボルト支持部と、
該ボルト遊嵌穴に遊嵌して吊垂状態で支持され該ネジ穴に螺合するボルトと、該ボルトの外周に遊嵌し、該プレートカバーと該ボルト支持部とを離反させる方向に付勢する圧縮バネと、
該圧縮バネと該ボルト支持部との間に介在し、該圧縮バネによって付勢されて該ボルト支持部に押しつけられることにより、該ボルトと該ボルト遊嵌穴の内周面との間の隙間を規制する隙間規制部材とから構成され、
該隙間規制部材は、該ボルトの外周を摺動可能に囲繞する摺動筒部と、
該摺動筒部の一方の内周端部から外周端部に向けてスカート状に形成され、該内周端部が該ボルト遊嵌穴と該ボルトとの間に入り込んで該ボルト遊嵌穴と該ボルトとのガタツキを抑制するテーパー部と、
該摺動筒部の他方の内周端部から該テーパー部の裾部に至り、該圧縮バネの端部に接触して押圧される被押圧部と
から構成される板状物搬送装置。
A suction pad including a suction plate having a suction surface for suction holding the plate-like material and a plate cover covering a portion other than the suction surface of the suction plate; suction pad support means for supporting the suction pad in a suspended state; A plate-shaped object transfer device including at least a transfer arm connected to the suction pad support means,
Screw holes are formed in the plate cover,
The suction pad support means, a bolt support portion formed with a bolt loose fitting hole corresponding to the screw hole,
A bolt loosely fitted in the bolt loose fitting hole and supported in a suspended state and screwed into the screw hole; and a bolt loosely fitted on the outer periphery of the bolt to separate the plate cover from the bolt supporting portion. A compression spring that urges
The gap between the bolt and the inner peripheral surface of the bolt loose fitting hole is interposed between the compression spring and the bolt support, and is urged by the compression spring and pressed against the bolt support. And a gap regulating member that regulates
A sliding cylinder portion that slidably surrounds an outer periphery of the bolt;
The sliding cylindrical portion is formed in a skirt shape from one inner peripheral end to the outer peripheral end, and the inner peripheral end is inserted between the bolt loose fitting hole and the bolt to form the bolt loose fitting hole. And a tapered portion for suppressing backlash between the bolt and
A plate-like object conveying device comprising: a pressed portion which extends from the other inner peripheral end of the sliding cylinder portion to the skirt portion of the tapered portion and is pressed in contact with the end of the compression spring.
吸着プレートはポーラスセラミックスにより形成され、プレートカバーはセラミックスにより形成され、該プレートカバーにはネジ穴が形成されたナットが嵌合する嵌合凹部が形成され、該嵌合凹部にボンド剤を介してナットが固定されて吸着パッドが構成される請求項1に記載の板状物搬送装置。The suction plate is formed of porous ceramics, the plate cover is formed of ceramics, and the plate cover is formed with a fitting recess in which a nut having a screw hole is fitted, and the fitting recess is formed through a bonding agent. The plate-like object conveying device according to claim 1, wherein the suction pad is formed by fixing the nut. 隙間規制部材は四フッ化エチレン樹脂で形成されている請求項1または2に記載の板状物搬送装置。3. The plate-like object conveying device according to claim 1, wherein the gap regulating member is formed of a tetrafluoroethylene resin. ボルトと、該ボルトを遊嵌させるボルト遊嵌孔の内周面との間の隙間を規制する隙間規制部材であって、
ボルトの外周を摺動可能に囲繞する摺動筒部と、
該摺動筒部の一方の内周端部から外周端部に向けてスカート状に形成されたテーパー部と、
該摺動筒部の他方の内周端部から該テーパー部の裾部に至り圧縮バネの端部に接触して押圧される被押圧部と
から構成される隙間規制部材。
A gap regulating member that regulates a gap between a bolt and an inner peripheral surface of a bolt loose fitting hole for loosely fitting the bolt,
A sliding cylinder portion slidably surrounding the outer periphery of the bolt,
A tapered portion formed in a skirt shape from one inner peripheral end to the outer peripheral end of the sliding cylindrical portion,
And a pressed portion which is pressed from the other inner peripheral end of the sliding cylindrical portion to the skirt of the tapered portion so as to contact and press the end of the compression spring.
JP2002258720A 2002-09-04 2002-09-04 Plate-like material transport apparatus and clearance regulating member Pending JP2004091196A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158682A (en) * 2007-12-26 2009-07-16 Disco Abrasive Syst Ltd Carrying device of wafer
DE102010040221A1 (en) 2009-09-07 2011-03-10 Disco Corporation Grinding device for grinding e.g. silicon wafer, for producing e.g. mobile phone, has pressure pins equally spaced from each other in circumferential direction of pressure section, so that pressure pins surround holding portion
CN111874623A (en) * 2020-07-17 2020-11-03 苏州精濑光电有限公司 Adsorption device and carrying device
CN113003214A (en) * 2021-02-23 2021-06-22 杭州娃哈哈精密机械有限公司 Horizontal material receiving and transferring device for bottle blanks
TWI772128B (en) * 2020-12-30 2022-07-21 盟立自動化股份有限公司 Holding device

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CN102367107B (en) * 2011-10-08 2014-07-16 张家港市玉龙科技板材有限公司 Template rolling-taking device used for conveying template
CN105345830B (en) * 2015-12-15 2018-04-10 清华大学 Sucking disc type mechanical hand

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158682A (en) * 2007-12-26 2009-07-16 Disco Abrasive Syst Ltd Carrying device of wafer
DE102010040221A1 (en) 2009-09-07 2011-03-10 Disco Corporation Grinding device for grinding e.g. silicon wafer, for producing e.g. mobile phone, has pressure pins equally spaced from each other in circumferential direction of pressure section, so that pressure pins surround holding portion
CN111874623A (en) * 2020-07-17 2020-11-03 苏州精濑光电有限公司 Adsorption device and carrying device
TWI772128B (en) * 2020-12-30 2022-07-21 盟立自動化股份有限公司 Holding device
CN113003214A (en) * 2021-02-23 2021-06-22 杭州娃哈哈精密机械有限公司 Horizontal material receiving and transferring device for bottle blanks

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