JP2004089946A - Cleaning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning device reduced in size without increasing the amount of deionized water or a chemical used. <P>SOLUTION: The cleaning device 1 cleans a substrate 17 with a gas or a cleaning fluid, is provided with a stage 5 on the main surface of which the substrate 17 is capable of being mounted; a large cup 7 having an opening and is capable of forming a sealed cleaning tub 6 in the inside by stopping the opening with the main surface; a small cup 9 having an opening and being capable of forming an entrance 31 of a gas discharge/water discharge space 15 between the margin of the opening and the main surface of the stage 5; and a cleaning unit 3 capable of feeding the gas and the cleaning fluid into the small cup 9, and is constructed so that the gas and the cleaning fluid fed into the tub 6 may be discharged from the tub 6 through the space 15 between the large cup 7 and the small cup 9. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a cleaning apparatus, and more particularly to a cleaning apparatus for cleaning an object to be cleaned with a gas and a cleaning liquid.
[0002]
[Prior art]
As a conventional plate-like substrate cleaning apparatus, there are mainly three types.
[0003]
The first is a batch cleaning device. FIG. 10 is a schematic view of a batch cleaning apparatus disclosed in Japanese Patent Application Laid-Open No. 9-313277.
[0004]
Referring to FIG. 10, a batch cleaning apparatus 100 includes a wafer chuck 102, a current plate 104, a cleaning tank 105, a pump 106, and a drain tank 108.
[0005]
The semiconductor wafer 101 is generally placed on a wafer chuck 102 in a cleaning bath 105 in a set of two batches (ie, 50 wafers). The cleaning liquid 103 is supplied to the cleaning tank 105 through a liquid supply port 107 by a pump 106 connected to the cleaning tank 105. The supplied cleaning liquid 103 passes through the current plate 104 so that the flow thereof becomes substantially uniform. Thereafter, the cleaning liquid 103 passes through the gap between the wafer chucks 102, reaches the semiconductor wafers 101, and rises between the semiconductor wafers 101. At this time, the cleaning liquid 103 peels off foreign substances adhering to the semiconductor wafer 101 due to its chemical effect, and carries the foreign substance as it is carried away. Then, the cleaning liquid 103 and the foreign matter are finally discharged from the cleaning tank 105 in such a manner as to overflow. The discharged cleaning liquid 103 is received by the drain tank 108 and discharged from the drain port 109 to the pump 106. Thereafter, the cleaning is completed through a cleaning tank or a drying tank in which the same operation is performed.
[0006]
The second is a roller transport cleaning device. FIG. 11 is a schematic front view of the roller transport cleaning device disclosed in Japanese Patent Application Laid-Open No. 7-28315.
[0007]
Referring to FIG. 11, roller transport / cleaning apparatus 200 includes cleaning water jet nozzle 202, roller rotating shaft driving unit 204, roller rotating bearing 205, roller rotating shaft 206, and transport rollers 207, 208, and 209. It is composed of substrate end surface support plates 210 and 211.
[0008]
In the roller transport / cleaning apparatus 200, the roller rotating shaft 206 is horizontally disposed between the roller rotating shaft driving unit 204 and the roller rotating bearing 205, and the transport rollers 207, 208, and 209 are mounted on the roller rotating shaft 206 at predetermined intervals. At the same time, the substrate end surface support plates 210 and 211 that support both end surfaces of the wafer 212 are mounted.
[0009]
Then, when the roller rotation shaft drive unit 204 rotates the roller rotation shaft 206 in the direction of arrow A, the wafer 212 is guided by the substrate end surface support plates 210 and 211 and is conveyed by the conveyance rollers 207, 208 and 209 in the forward direction of FIG. Transported to Then, the wafer 212 is washed with pure water 203 sprayed from a washing water spray nozzle 202 disposed above the wafer 212 to be conveyed to remove foreign matter.
[0010]
The third is a spin cleaning device. FIG. 12 is a sectional view of a main part of a spin cleaning apparatus disclosed in Japanese Patent Application Laid-Open No. 9-32012.
[0011]
Referring to FIG. 12, the spin cleaning device 300 includes a fixed shaft 311, a rotating shaft 312, a rotating table 314, a clamp mechanism 316, and a nozzle 319.
[0012]
A rotary table 314 is attached to the upper end of the hollow cylindrical rotary shaft 312, and a clamp mechanism 316 is provided near the outer periphery of the rotary table 314. The wafer 310 to be cleaned is held at its periphery by the clamp mechanism 316. A fixed shaft 311 is accommodated in a hollow portion provided inside the rotating shaft 312, and a nozzle 319 for jetting pure water (cleaning liquid) is attached to an upper end of the fixed shaft 311. The nozzle 319 penetrates an opening formed at the center of the turntable 314, and its tip protrudes above the turntable 314. The tip of the nozzle 319 faces the lower surface of the wafer 310.
[0013]
In a state where the rotating shaft 312 is driven to rotate the wafer 310, pure water is sprayed from the nozzle 319 toward the lower surface of the wafer 310, thereby performing spin cleaning of the lower surface of the wafer 310 and, at the same time, spinning the lower surface of the wafer 310. On the side, spin cleaning by jetting pure water or brush cleaning using a brush is also performed. Thereafter, the wafer 310 is dried by rotating the wafer 310 while the supply of the pure water is stopped.
[0014]
[Problems to be solved by the invention]
Among the above three cleaning apparatuses, the batch cleaning apparatus requires a drying tank separately from the cleaning tank. Further, a means for transporting the wafer between the cleaning tank and the drying tank is required. Therefore, there is a problem that the device becomes large.
[0015]
Further, in the roller transport cleaning device, a drying device is required separately from the cleaning device. Further, a transport unit for transporting the wafer to the drying device is required. Therefore, there is a problem that the device becomes large.
[0016]
In the spin cleaning apparatus, since cleaning and drying are performed using the centrifugal force of the rotating wafer, a driving system for rotating the wafer is indispensable. Therefore, there is a problem that the device becomes large.
[0017]
Therefore, an object of the present invention is to provide a cleaning apparatus that can reduce the size of the apparatus.
[0018]
[Means for Solving the Problems]
The cleaning device of the present invention is a cleaning device that cleans an object to be cleaned with a gas and a cleaning liquid, and has a stage on which a main surface can be mounted with the object to be cleaned, and an opening for an external container. An external container capable of forming a sealed space inside by closing the main surface of the stage, and disposed in the external container, and having an opening for the internal container, and an edge of the opening for the internal container and the main surface of the stage. An internal container capable of forming a gap for exhaust and drainage, and a supply unit capable of supplying a gas and a cleaning liquid into the internal container, and exhaust and drain the gas and the cleaning liquid supplied into the closed space. From the closed space through the space between the inner container and the outer container.
[0019]
According to the drying device of the present invention, the gas and the cleaning liquid can be supplied by the supply unit into the closed space formed between the stage on which the object to be cleaned is placed and the external container. Thus, the object to be cleaned can be cleaned with the gas and the cleaning liquid. Further, the gas and the cleaning liquid after the cleaning can be discharged to the outside via the space between the outer container and the inner container. Further, the object to be cleaned can be dried by discharging only the gas from the supply unit. Therefore, it is possible to perform all of the cleaning process and the drying process in the closed space formed by the external container and the stage. Therefore, there is no need for a separate drying tank such as a batch cleaning apparatus, and no means for transporting wafers between the cleaning tank and the drying tank is required. In addition, a drying device other than a cleaning device such as a roller transport cleaning device is not required, and a transport means for transporting the wafer to the drying device is also unnecessary. Furthermore, since cleaning is not performed by spraying water or cleaning with a brush as in a spin cleaning device, but by using a mist mixed with a gas and a cleaning liquid, there is no need to rotate the object to be cleaned at the time of cleaning. Since the object is dried, the object to be cleaned does not need to be rotated at the time of drying, and a drive system for rotating the object to be cleaned is unnecessary. For the above reasons, the size of the device can be reduced.
[0020]
Preferably, in the cleaning device of the present invention, both the outer container and the inner container are formed by hemispherical containers.
[0021]
With this configuration, generation of turbulence in the gas and the cleaning liquid discharged from the supply unit in the closed space is reduced, and the flows of the gas and the cleaning liquid are in a certain direction. Therefore, the object to be cleaned is preferably uniformly cleaned and dried. Further, the load on the double container due to the decompression becomes uniform, and the durability of the double container in the decompressed state is improved.
[0022]
Preferably, in the cleaning apparatus of the present invention, the stage has a recess for allowing the cleaning liquid to flow into the main surface.
[0023]
With this configuration, the cleaning liquid after the cleaning flows into the concave portion provided on the stage due to the exhaust device and the gravity of the cleaning liquid, so that the cleaning liquid after the cleaning is prevented from re-adhering to the object to be cleaned.
[0024]
Preferably, in the cleaning device of the present invention, the supply unit further includes a gas nozzle capable of discharging gas toward the inner surface of the inner container, and the inner surface of the inner container is water-repellent.
[0025]
According to this configuration, the gas is constantly or intermittently discharged from the gas nozzle to the inner surface of the inner container, whereby water droplets of the cleaning liquid attached to the inner surface of the water-repellent inner container are removed. Therefore, the water droplets of the cleaning liquid adhering to the inner surface of the inner container are prevented from falling and adhering to the dried object to be cleaned.
[0026]
Preferably, in the cleaning device of the present invention, a partition is provided in a space between the inner container and the outer container.
[0027]
The space between the inner container and the outer container is a space for exhausting and draining water. If a partition is not provided in this space, if a large amount of cleaning liquid is drained at once, the cleaning liquid will be drained from the entire periphery of the space between the inner container and the outer container. In such a case, the exhaust path of the cleaning device is in a state of being clogged with water, and the gas exhaust efficiency is reduced. Therefore, by providing the partition, even if a large amount of the cleaning liquid is drained at one time, the film of the cleaning liquid is divided by the partition, whereby a gap is generated between the cleaning liquid and the partition. Since this gap serves as a gas exhaust space, a decrease in gas exhaust efficiency is suppressed.
[0028]
Preferably, in the cleaning device of the present invention, the supply unit has a plurality of holes for discharging gas and cleaning liquid to the object to be cleaned, the plurality of holes are arranged in a circle, and a plurality of holes. Each of the plurality of holes is configured such that the cleaning liquid discharged from the nozzle has a vortex flow.
[0029]
With this configuration, the cleaning liquid discharged from the holes forms a vortex flow, and the cleaning liquid is uniformly applied to the entire object to be cleaned, so that the object to be cleaned can be uniformly cleaned. Further, since the cleaning liquid is vortexed, the cleaning liquid after cleaning can easily flow into the gap for exhaust and drainage due to the centrifugal force of the vortex, thereby facilitating exhaustion and drainage.
[0030]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a sectional view of the cleaning apparatus according to Embodiment 1 of the present invention. FIG. 2 is a bottom view of the double cup of the cleaning device according to Embodiment 1 of the present invention. FIG. 3 is a cross-sectional view when the cleaning device according to Embodiment 1 of the present invention forms a closed cleaning tank.
[0031]
With reference to FIGS. 1 to 3, the cleaning device 1 mainly includes a cleaning unit 3, a double cup 4, and a stage 5.
[0032]
The stage 5 is capable of mounting an object 17 to be cleaned on its surface.
The double cup 4 includes a large cup 7 and a small cup 9 each having an open hemispherical shape, and a packing 16 provided at an edge of the opening of the large cup 7. The small cup 9 is arranged in the large cup 7, and the opening surface of the small cup 9 is retreated to the inside of the large cup 7 from the opening surface of the large cup 7. By closing the opening surface of the large cup 7 with the surface of the stage 5, a closed space can be formed inside the large cup 7, and the closed washing tank 6 (FIG. 3) can be formed inside the small cup 9. is there. At this time, there is a gap 31 for exhaust and drainage between the edge of the small cup 9 and the surface of the stage 5, and the gap 31 is used as an entrance and a space between the large cup 7 and the small cup 9 for exhaust / drainage. 15 are formed. Each of the gas and the cleaning liquid after the cleaning moves from the gap 31 to the exhaust / drain pipe 14 through the exhaust / drain space 15 and is exhausted and drained. The large cup 7 and the small cup 9 are connected to the washing unit 3 at the upper portions thereof.
[0033]
The cleaning unit 3 is, for example, cylindrical, and has a gas / cleaning liquid supply pipe 13 and an exhaust / drain pipe 14 inside the cylindrical shape. One end of the gas / cleaning liquid supply pipe 13 is connected to a cleaning nozzle (supply unit) 12 for discharging gas and cleaning liquid, and the other end is connected to a gas / cleaning liquid supply device (not shown). One end of the exhaust / drain pipe 14 is connected to the exhaust / drain space 15 of the double cup 4, and the other end is connected to an exhaust device (not shown).
[0034]
The cleaning unit 3 can discharge only the gas or the cleaning liquid from the hole 12a of the cleaning nozzle 12, or can discharge the mist-like cleaning liquid by mixing the gas and the cleaning liquid. The flow rate of the gas can be adjusted, for example, in the range of 5 to 100 liters per minute, and the flow rate of the cleaning liquid can be adjusted, for example, in the range of 0.3 to 2 liters per minute. As the object 17 to be cleaned, for example, plate-like glass, silicon, quartz, resin, metal and the like can be cleaned. The inner wall of the small cup 9 is made of, for example, a metal whose surface is roughened or a fluororesin. As the gas, for example, air or nitrogen gas is used, and as the cleaning water, for example, pure water is used.
[0035]
Next, the operation of the cleaning device according to the present embodiment will be described. FIG. 4 shows an example of the washing process of the drying device of the present invention.
[0036]
Referring to FIG. 4, first, as shown in FIG. 1, an object 17 to be cleaned is arranged on the surface of the stage 5 (step S1). Next, as shown in FIG. 3, the cleaning unit 3 and the double cup 4 are lowered, whereby the closed cleaning tank 6 is formed inside the small cup 9 (Step S2). Next, the pressure in the closed cleaning tank 6 is reduced through the exhaust / drain space 15 and the exhaust / drain pipe 14 connected to the exhaust device (step S3). After the inside of the closed cleaning tank 6 is depressurized to a certain pressure, the cleaning liquid is discharged from the cleaning nozzle 12, and the object 17 is cleaned (step S4). The cleaning nozzle 12 can independently control the amount of the gas to be discharged or the amount of the cleaning liquid, and can also discharge a mist-like cleaning liquid in which the cleaning liquid and the gas are mixed, and can freely change the discharge state of the cleaning liquid and the gas. Can be done. The gas and the cleaning liquid after cleaning the object 17 are exhausted to the outside through the exhaust / drain space 15 and the exhaust / drain pipe 14. After cleaning the cleaning target 17 for a certain period of time, only the gas is discharged from the cleaning nozzle 12 to dry the cleaning target 17 (step S5). After the object 17 is dried, the pressure in the closed cleaning tank 6 is released (step S6), and the cleaning unit 3 and the double cup 4 are raised as shown in FIG. 1, and the closed cleaning tank 6 is opened (FIG. 1). Step S7). Then, the article 17 to be cleaned is separated from the stage (step S8).
[0037]
In the present embodiment, gas and cleaning liquid can be supplied into the closed cleaning tank 6. Thus, the object 17 to be cleaned can be cleaned with the gas and the cleaning liquid. Further, the gas and the cleaning liquid after the cleaning can be discharged to the outside via the exhaust / drain space 15 and the exhaust / drain pipe 14. Further, by discharging only the gas from the cleaning unit 3, the object 17 to be cleaned can be dried. Therefore, it is possible to perform all of the cleaning process and the drying process with this cleaning device. Therefore, unlike a batch cleaning apparatus, there is no need to provide a drying tank separately from the cleaning tank, and no transfer means for transferring wafers from the cleaning tank to the drying tank is required. Further, there is no need to provide a drying device separately from the cleaning device as in the roller transport cleaning device, and no transport means for transporting the wafer from the cleaning device to the drying device is required. Furthermore, since cleaning is not performed by spraying water or cleaning with a brush as in a spin cleaning device, but by using a mist mixed with a gas and a cleaning liquid, there is no need to rotate the object to be cleaned at the time of cleaning. Since the object is dried, the object to be cleaned does not need to be rotated at the time of drying, and a drive system for rotating the object to be cleaned is unnecessary. For the above reasons, the size of the device can be reduced.
[0038]
In the present embodiment, the large cup 7 and the small cup 9 constituting the double cup 4 are both constituted by hemispherical containers. Therefore, turbulence does not easily occur in the gas and the cleaning liquid discharged from the cleaning unit 3 in the closed cleaning tank 6, and the flows of the gas and the cleaning liquid are in a certain direction. As a result, the object 17 to be cleaned is uniformly cleaned and easily dried. In addition, the load on the double cup 4 due to the decompression becomes uniform, and the durability of the double cup 4 in the decompressed state is improved.
(Embodiment 2)
FIG. 5 is a cross-sectional view when one cleaning device according to Embodiment 2 of the present invention forms a closed cleaning tank.
[0039]
Referring to FIG. 5, a portion around the object to be cleaned 17 on the surface of the stage 5 is inclined from the vicinity of the object to be cleaned 17 toward the entrance of the exhaust / drain space 15.
[0040]
The remaining structure is substantially the same as that of the first embodiment shown in FIGS. 1 to 3, and thus the same members are denoted by the same reference characters and description thereof will be omitted.
[0041]
With this configuration, the cleaning liquid after the cleaning easily flows into the exhaust / drain space 15 due to the gravity of the cleaning liquid without staying near the object 17 to be cleaned. Therefore, in addition to the effects of the first embodiment, the exhaust / drainage efficiency is increased, and the cleaning liquid after cleaning is prevented from re-adhering to the cleaning target 17.
[0042]
FIG. 6 is a cross-sectional view when another cleaning apparatus according to Embodiment 2 of the present invention forms a closed cleaning tank.
[0043]
Referring to FIG. 6, a groove is provided on the surface of stage 5 at a portion around cleaning target 17.
[0044]
The remaining structure is substantially the same as that of the first embodiment shown in FIGS. 1 to 3, and thus the same members are denoted by the same reference characters and description thereof will be omitted.
[0045]
Even in such a configuration, the cleaning liquid after cleaning is more likely to flow into the grooves due to the gravity of the cleaning liquid, so that the cleaning liquid after cleaning is prevented from re-adhering to the object 17 to be cleaned.
(Embodiment 3)
FIG. 7 is a bottom view of the double cup of the cleaning device according to Embodiment 3 of the present invention.
[0046]
Referring to FIG. 7, the cleaning nozzle 12 connected to the double cup 4 has a plurality of holes 12a for discharging gas and cleaning liquid to the object 17 to be cleaned. They are arranged in a circle. The cleaning liquid falls from each hole 12a in the direction shown by the arrow in the figure. As a result, the cleaning liquid has a vortex flow. Further, a gas nozzle 19 capable of discharging gas toward the inner surface of the small cup 9 is provided around the cleaning nozzle 12 as shown by an arrow in the figure. Further, the exhaust / drain space 15 of the double cup 4 is provided with a partition 21 perpendicular to the surface of the small cup 9.
[0047]
The remaining structure is substantially the same as that of the first embodiment shown in FIGS. 1 to 3, and thus the same members are denoted by the same reference characters and description thereof will be omitted.
[0048]
This configuration has the following three effects in addition to the effects of the first embodiment.
[0049]
The first effect is that the cleaning liquid discharged from the holes 12a forms a vortex flow, and the cleaning liquid is uniformly applied to the entire cleaning target 17, so that the cleaning target 17 can be uniformly cleaned. In addition, since the cleaning liquid is swirled, exhaust / drainage is facilitated.
[0050]
The second effect is that gas is constantly or intermittently discharged from the gas nozzle 19 to the inner surface of the small cup 9, thereby removing water droplets of the cleaning liquid attached to the inner surface of the water-repellent small cup 9. Is done. As a result, the water droplets of the cleaning liquid adhering to the inner surface of the small cup 9 are prevented from dropping and adhering to the dried object 17 to be cleaned.
[0051]
As a third effect, a decrease in gas exhaust efficiency is suppressed. The reason will be described below.
[0052]
FIG. 8 is a schematic plan view showing a state of drainage of an exhaust / drainage space in the cleaning device according to Embodiment 3 of the present invention.
[0053]
If a large amount of cleaning liquid is drained at one time in a state where the partition 21 is not provided in the exhaust / drain space 15, the cleaning liquid is drained from the entire circumference of the exhaust / drain space 15. In such a case, the exhaust path of the cleaning device 1 is in a state of being clogged with water, and the gas exhaust efficiency is deteriorated. On the other hand, when the partition wall 21 is provided as in the present embodiment shown in FIG. 8, even if a large amount of the cleaning liquid 23 is drained at once, the cleaning liquid 23 is divided by the partition wall 21, whereby the cleaning liquid 23 and the partition wall 21 are separated. There is a gap between the gap 21 and the gap. Since this gap serves as a space for gas exhaust to the exhaust / drain space 15, a reduction in gas exhaust efficiency is suppressed.
(Embodiment 4)
FIG. 9 is a cross-sectional view when the cleaning device according to Embodiment 4 of the present invention forms a closed cleaning tank.
[0054]
Referring to FIG. 9, the double cup 4 is provided with a partition wall 21 that covers the outer surface of the small cup 9. The partition 21 divides the exhaust / drain space 15 into an exhaust space 15 b between the partition 21 and the small cup 9 and a drain space 15 a between the partition 21 and the large cup 7. The entrance 31b of the exhaust space 15b is provided at a position higher than the entrance 31a of the drainage space 15a.
[0055]
The remaining structure is substantially the same as that of the first embodiment shown in FIGS. 1 to 3, and thus the same members are denoted by the same reference characters and description thereof will be omitted.
[0056]
With this configuration, due to the density difference between the gas and the cleaning liquid, the cleaning liquid is drained from the drainage space 15a having the inlet 31a at the lower position, and the gas is exhausted from the exhaust space 15b having the inlet 31b at the higher position. Therefore, the exhaust and drain paths can be separated, and even when a large amount of cleaning liquid is drained at one time, the cleaning liquid does not flow into the exhaust space 15b, so that a space for exhausting gas is secured. As a result, a decrease in gas exhaust efficiency is suppressed.
[0057]
In the first to fourth embodiments, the case where hemispherical containers are used as the outer container (large cup 7) and the inner container (small cup 9) has been described. However, the present invention is not limited to this. The container and the internal container may be containers having an opening.
[0058]
Embodiments 1 to 4 show cases in which air or nitrogen gas is used as a gas. However, the present invention is not limited to these, and the gas is mixed with a cleaning liquid and discharged, and the object to be cleaned is removed. It only needs to be suitable for drying.
[0059]
In the second embodiment, the case where the main surface of the stage is inclined and the case where a groove is provided on the stage surface are described. However, the present invention is not limited to these, and the cleaning liquid flows into the main surface of the stage. It is sufficient that the concave portion is provided.
[0060]
The embodiments disclosed above are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the embodiments described above, and is intended to include any modifications or variations within the meaning and range equivalent to the terms of the claims.
[0061]
【The invention's effect】
As described above, according to the drying apparatus of the present invention, the gas and the cleaning liquid can be supplied by the supply unit into the closed space formed between the stage on which the object to be cleaned is placed and the external container. Thus, the object to be cleaned can be cleaned with the gas and the cleaning liquid. Further, the gas and the cleaning liquid after the cleaning can be discharged to the outside via the space between the outer container and the inner container. Further, the object to be cleaned can be dried by discharging only the gas from the supply unit. Therefore, it is possible to perform all of the cleaning process and the drying process in the closed space formed by the external container and the stage. Therefore, there is no need for a separate drying tank such as a batch cleaning apparatus, and no means for transporting wafers between the cleaning tank and the drying tank is required. In addition, a drying device other than a cleaning device such as a roller transport cleaning device is not required, and a transport means for transporting the wafer to the drying device is also unnecessary. Furthermore, since cleaning is not performed by spraying water or cleaning with a brush as in a spin cleaning device, but by using a mist mixed with a gas and a cleaning liquid, there is no need to rotate the object to be cleaned at the time of cleaning. Since the object is dried, the object to be cleaned does not need to be rotated at the time of drying, and a drive system for rotating the object to be cleaned is unnecessary. For the above reasons, the size of the device can be reduced.
[Brief description of the drawings]
FIG. 1 is a sectional view of a cleaning apparatus according to Embodiment 1 of the present invention.
FIG. 2 is a bottom view of a double cup of the cleaning device according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional view of the case where the cleaning apparatus according to Embodiment 1 of the present invention forms a closed cleaning tank.
FIG. 4 is an example of a washing step of the drying device of the present invention.
FIG. 5 is a cross-sectional view in the case where one cleaning apparatus according to Embodiment 2 of the present invention forms a closed cleaning tank.
FIG. 6 is a cross-sectional view when another cleaning apparatus according to Embodiment 2 of the present invention forms a closed cleaning tank.
FIG. 7 is a bottom view of a double cup of the cleaning device according to the third embodiment of the present invention.
FIG. 8 is a schematic plan view showing a state of drainage of an exhaust / drain space in a cleaning device according to Embodiment 3 of the present invention.
FIG. 9 is a cross-sectional view of a case where a cleaning apparatus according to Embodiment 4 of the present invention forms a closed cleaning tank.
FIG. 10 is a schematic view of a batch cleaning apparatus disclosed in Japanese Patent Application Laid-Open No. 9-313277.
FIG. 11 is a schematic front view of a roller transport cleaning device disclosed in Japanese Patent Application Laid-Open No. 7-28315.
FIG. 12 is a sectional view of a principal part of a spin cleaning device disclosed in Japanese Patent Application Laid-Open No. 9-32012.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cleaning apparatus, 3 cleaning units, 4 double cups, 5 stages, 6 closed cleaning tanks, 7 large cups, 9 small cups, 12 cleaning nozzles, 12a holes, 13 gas / cleaning liquid supply pipes, 14 exhaust / drain pipes, 15 Exhaust / drain space, 15a drain space, 15b exhaust space, 16 packing, 17 object to be cleaned, 19 gas nozzle, 21 partition, 23 cleaning liquid, 31 gap, 31a drain space entrance, 31b exhaust space entrance, 100b batch cleaning device, 101 semiconductor Wafer, 102 Wafer chuck, 103 Cleaning liquid, 104 Rectifying plate, 105 Cleaning tank, 106 Pump, 107 Supply port, 108 Drain tank, 109 Drain port, 200 Roller transport cleaning device, 202 Cleaning water injection nozzle, 203 Pure water , 204 Roller rotating shaft drive unit, 205 Roller rotating bearing, 206 Roller rotating shaft, 207, 208, 2 09 transport roller, 210, 211 substrate end surface support plate, 212, 310 wafer, 300 spin cleaning device, 311 fixed shaft, 312 rotary shaft, 314 rotary table, 316 clamp mechanism, 319 nozzle.

Claims (6)

A cleaning device for cleaning an object to be cleaned with a gas and a cleaning liquid,
A stage on which the object to be cleaned can be placed on a main surface;
An external container having an external container opening, and capable of forming a closed space inside by closing the external container opening with the main surface of the stage,
An internal container arranged in the external container, having an internal container opening, and between the edge of the internal container opening and the main surface of the stage, capable of forming a gap for exhaust and drainage,
A supply unit capable of supplying a gas and a cleaning liquid into the internal container,
Cleaning configured to discharge the gas and the cleaning liquid supplied into the closed space from the closed space through the space between the internal container and the external container from the gap for exhaust and drainage. apparatus. The cleaning device according to claim 1, wherein both the outer container and the inner container are configured by hemispherical containers. The cleaning device according to claim 1, wherein the stage has a concave portion for allowing the cleaning liquid to flow into a main surface. 4. The supply unit according to claim 1, wherein the supply unit further includes a gas nozzle capable of discharging gas toward an inner surface of the inner container, and the inner surface of the inner container is water-repellent. 5. Cleaning equipment. The cleaning device according to claim 1, wherein a partition is provided in a space between the inner container and the outer container. The supply unit has a plurality of holes for discharging a gas and a cleaning liquid to the object to be cleaned, the plurality of holes are arranged in a circular shape, and the plurality of holes are discharged from the plurality of holes. The cleaning device according to any one of claims 1 to 5, wherein each of the plurality of holes is configured such that the cleaning liquid has a vortex flow.

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