JP2004088088A - Electronic parts apparatus and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an excellent shock-proof electronic parts apparatus capable of making the height thereof lower without causing short-circuitting between a metal cover member and a circuit parts component. <P>SOLUTION: The electronic parts apparatus is one including a metal cover member 6 for coating circuit parts components 2 and 3 mounted on a wiring board 1. An insulating resin layer 8 is interposed between the circuit parts components 2, 3 and the metal cover member 6, and the metal cover member 6 is held with a column member 9 provided vertically on the wiring board 1. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component device such as a crystal oscillator used for a portable communication device and a method for manufacturing the same.
[0002]
[Prior art]
BACKGROUND ART Conventionally, a metal lid member has been used as a shield case connected to a ground potential in electronic component devices such as high-frequency components and oscillation components used in portable communication devices and network devices.
[0003]
As shown in FIG. 5, the structure is such that circuit component elements 12 and 13 are mounted on a wiring board 11 on which a wiring pattern of a ground potential and a surface wiring pattern are formed, and thereafter, the circuit component elements 12 and 13 are covered. In addition, the metal lid member 16 is joined so as to be joined to the wiring pattern of the ground potential of the wiring board 11.
[0004]
Terminal electrodes 14 and 15 are provided on the end surface of the wiring board 11, and the joining leg 17, which is a part of the metal lid member 16, is connected to, for example, the terminal electrode 15 of the ground potential among the terminal electrodes 14 and 15. Was. In addition, a part of the metal lid member 16, for example, a part 18 of the side wall surface comes into contact with the surface of the wiring board 11.
[0005]
The metal cover member 16 has a ground potential as a whole, blocks electromagnetic noise coming from the outside, and prevents superposition of electromagnetic wave noise generated from the electronic component elements 12 and 13 on the wiring board 11. Functions as a shield case.
[0006]
Although not shown in the figure, a wiring pattern for forming a predetermined circuit network and electrode pads on which various individual electronic component elements 12 and 13 are attached are formed on the surface of the wiring board 11.
[0007]
The terminal electrodes on the end face of the wiring board 11 include a terminal electrode 15 having a ground potential and an input / output terminal electrode 14 for inputting and outputting signals. Each of the terminal electrodes 14 and 15 has a recess formed on the end surface of the wiring board 11, and is formed of an electrode conductor film inside the recess.
[0008]
Further, the wiring board 11 is configured by laminating a plurality of insulating layers, for example, and an internal wiring conductor having a ground potential and an internal wiring pattern for forming a predetermined circuit are formed between the respective insulating layers. The input / output terminal electrode 14 is connected to a surface wiring pattern or an internal wiring pattern, and the ground potential terminal electrode 15 is connected to a surface ground potential wiring pattern or an internal ground potential conductor film. .
[0009]
When the metal cover member 16 is joined to the wiring board 11, the lower end of the side wall surface 18 is attached to the metal cover member 16 in order to prevent the metal cover member 16 from tilting. And the joining leg 17 is joined to the terminal electrode 15 at the ground potential using solder.
[0010]
[Problems to be solved by the invention]
In the conventional method, when the metal lid member and circuit component elements such as an active element and a passive element come into contact with each other, a short circuit occurs, the characteristics of the predetermined circuit component element cannot be obtained, and the operation of the predetermined circuit is not performed. Impossible.
[0011]
For this reason, it is necessary to leave a certain distance or more between the circuit component element and the ceiling flat part of the metal lid member so that the metal lid member does not contact the circuit component element. The same applies to the side surface of the metal lid member. As a result, it has been very difficult to reduce the size and height of the entire electronic component device.
[0012]
A structure has also been proposed in which the metal lid member 16 is brought into direct contact with, for example, the surface of the circuit component element 12. However, when the metal cover member 6 is directly attached to the circuit component element 2, when an external impact or the like is applied to the electronic component device, the circuit component element 12 is directly connected to the metal cover member 16. The impact is transmitted to the metal lid member 16 and the junction between the circuit component element 12 and the wiring board 11, particularly at the joint surface between the metal lid member 16 and the circuit component element 12. There have been problems such as detachment and separation of the circuit component element 12 from the substrate 11. In particular, in the case of a structure in which the metal lid member 16 is connected to the ground potential via the circuit component element 2, the shielding effect of the metal lid member 16 is also lost.
[0013]
The present invention has been devised in view of the above-described problems, and an object thereof is to minimize the distance between a circuit component element and a metal lid member to achieve a reduction in height, and to provide an external device. It is an object of the present invention to provide an electronic component device capable of maintaining characteristics stably even when there is an impact.
[0014]
[Means for Solving the Problems]
The present invention is an electronic component device comprising a wiring board on which a surface wiring pattern is formed and a circuit component element forming a predetermined circuit network is mounted, and a metal lid member covering the circuit component element. An insulating resin layer is disposed on the inner surface of the ceiling flat portion of the metal lid member, and the metal lid member is held by the support member erected on the wiring board via the insulating resin layer. An electronic component device characterized by the following.
[0015]
Further, the support member is mounted at a substantially central portion on the wiring board.
[0016]
Further, a plurality of the support members are placed at symmetrical positions on the wiring board.
[0017]
Further, one of the plurality of support members is a circuit component element forming a predetermined circuit.
[0018]
[Action]
In the present invention, although the circuit component element is covered with the metal lid member, since the insulating resin layer is arranged on the inner surface of the ceiling flat portion of the metal lid member, the circuit component element and the metal lid are provided. There is no contact of the metal part of the body member. Therefore, for example, a short circuit between the external electrode of the circuit component element and the metal lid member can be completely prevented. Further, since the minimum distance between the metal part (the ceiling flat part) of the metal lid member and the circuit component element can be reduced to the thickness of the insulating resin layer, the overall height of the electronic component device can be easily reduced. Can be achieved.
[0019]
Further, the metal lid member is held by a support member erected on the wiring board via the insulating resin layer. That is, since the metal cover member is held at least by a member unrelated to the predetermined circuit, the handling of the metal cover member becomes very easy.
[0020]
In addition, since the support member is provided upright at a substantially central portion on the wiring board, the holding of the metal lid member and the insulating resin layer is stabilized. Further, since the plurality of support members are erected at symmetrical positions on the wiring board, the holding of the metal lid member and the insulating resin layer is stabilized even in this case. In the case of plural holding, one can be replaced with a circuit component element.
[0021]
Even in this case, since the circuit component element is in contact with the insulating resin layer, no short circuit occurs between the circuit component element and the metal lid member.
[0022]
Further, even if an external impact is applied via the metal lid member, the impact is improved because the insulating resin layer serves as a cushioning material, so that the impact resistance of the entire electronic component device is improved.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an electronic component device of the present invention will be described with reference to the drawings.
[0024]
FIG. 1 is an exploded perspective view of an electronic component device according to the present invention, and FIG. 2 is a side view thereof.
[0025]
A temperature-compensated crystal oscillator will be described as an example of the electronic component device.
[0026]
In the electronic component device, circuit component elements 2 and 3 such as passive elements such as an inductance, a capacitor, and a resistor, and active elements such as a crystal oscillator, a thermistor, a transistor, a varicap diode, and an IC chip are mounted on a wiring board 1. ing.
[0027]
The wiring board 1 is made of glass epoxy resin, ceramic or the like, and is omitted in FIG. 1. However, a wiring pattern for forming a predetermined circuit on the surface of the wiring board 1 or mounting each of the circuit component elements 2 and 3 is used. Is formed. As a part of this wiring pattern, a wiring pattern of the ground potential is also formed.
[0028]
Further, terminal electrodes 4 and 5 connected to wiring patterns forming a predetermined circuit are formed on the end surface and the back surface of the wiring board 1. Specifically, in order to avoid an increase in the external shape of the circuit board 1 and to form the terminal electrodes 4 and 5 in the state of the large board, a recess is formed on the end surface of the wiring board 1. Terminal electrodes 4 and 5 are formed on the entire inner wall surface or a part of the inner wall surface. In FIG. 1, the terminal electrodes 4 and 5 are formed on the entire surface of the concave portion. In addition, the terminal electrode includes a terminal electrode 4 serving as a signal-side input / output terminal and a terminal electrode 5 which is at a ground potential and is joined to the metal lid member 6.
[0029]
The metal lid member 6 has a ceiling flat portion 6a that covers the circuit component elements 2 and 3, and a joining leg 7 extending downward from the ceiling flat portion 6a toward the wiring board 1 is formed. . An insulating resin 8 is coated on the inner surface side of the ceiling flat portion of the metal lid member 6. For example, the insulating resin layer 8 is made of a high heat-resistant resin such as an epoxy resin or a polyimide resin that does not deteriorate even at 230 to 260 ° C. The thickness of the insulating resin layer 8 can be set to 10 μm or less.
[0030]
A support member 9 is mounted at the center of the surface of the wiring board 1. The support member 9 is a structure made of ceramic or resin. Then, a bonding electrode may be formed on the lower surface side of the support member 9. Then, a dummy wiring pattern is formed on the surface of the wiring board 1, and can be erected on the wiring board 1 by solder bonding when mounting the various circuit component elements 2 and 3. Further, the support member 9 can be simply stood on the wiring board by being bonded with an insulating adhesive or a conductive adhesive. The height of the support member 9 is set to be equal to or slightly higher than the mounting height of the tallest circuit component element. Further, it has a shape that can be stably erected on the wiring board 1. For example, a rectangular parallelepiped shape, a columnar shape, a trapezoidal column shape, and the like can be exemplified.
[0031]
Next, a method of assembling an electronic component device using the wiring board 1, the circuit component elements 2, 3, the support members 9, and the metal lid member 6 will be described.
[0032]
A cream solder is applied to a predetermined position of the surface wiring pattern of the wiring board 1, that is, a portion where the circuit component elements 2, 3 and the support member 9 are attached.
[0033]
Next, the circuit component elements 2, 3 and the support member 9 are mounted on the portion where the cream solder has been applied, and joined by reflow processing. The reflow temperature at this time is about 230 to 260 ° C.
[0034]
Next, the metal lid member 6 is joined with the insulating resin layer 8 interposed therebetween so as to cover the circuit component elements 2 and 3 from the upper surface side of the wiring board 1. At this time, if the insulating resin layer 8 is integrally attached to the inner surface of the metal lid member 6 in advance, the insulating resin layer 8 can be handled as a part of the metal lid member 6, which is preferable. It is.
[0035]
Then, the joining leg 7 of the metal lid member 6 is joined to the terminal electrode 5 at the ground potential by soldering or the like. In the figure, the terminal is connected to the ground potential terminal electrode 5 formed on the end surface of the wiring board. However, the connection with the ground potential is arbitrary. It does not matter.
[0036]
Specifically, the metal cover member 6 is brought into contact with the upper part of the support member 9 so as to cover the circuit component elements 2 and 3 with the insulating resin layer 8 interposed therebetween. Thereby, before the metal lid member 6 is completely soldered, the metal lid member 6 can be stably arranged on the wiring board 1. The trouble that the metal lid member 6 is inclined does not occur.
[0037]
3 and 4 are an exploded perspective view and a side view showing another embodiment of the present invention.
[0038]
In this embodiment, the insulating resin layer 8 is substantially contacted by at least two or more support members 9, 9, thereby holding the metal lid member 6.
[0039]
In this case, at least two support members 9, 9 are arranged on the wiring board 1 so as to be symmetric with respect to a position substantially symmetrical with respect to a center line or a diagonal line or a center point. Thereby, the same metal lid member 6 as described above can be held on the wiring board 1 with improved stability. At this time, one of the supporting pillar members 9 may be the tallest electronic component.
[0040]
As described above, in the electronic component device of the present invention, the circuit component elements 2 and 3 and the metal lid member 6 do not short-circuit. Conventionally, a gap is provided between the circuit component element and the metal lid member, and it is necessary that the gap be at least 100 μm. However, in the present invention, the insulating resin layer 8 is substantially disposed. Therefore, the thickness of the insulating resin layer 8 can be reduced to about 10 μm or less, and the height can be reduced to 90 μm or more.
[0041]
Further, in comparison with the conventional structure in which the metal lid member is directly joined to the circuit component element, the present invention allows the metal lid member 6 to be in contact with the support member 9 via the insulating resin layer 8. It is only held, or external impact is less likely to be applied to the circuit component elements 2 and 3, and a very stable operation can be achieved.
[0042]
Further, even if one of the support members 9 is used in place of the circuit component elements 2 and 3, the support members 9 are merely in contact with each other, are extremely stable against external impact, and have improved impact resistance.
[0043]
In the above-described embodiment, the insulating resin layer 8 is integrally attached to the inner surface of the metal lid member 6, but, for example, the insulating resin layer 8 is independent of the metal lid member 6. A sheet body may be used. Further, as the insulating resin layer 8, a material having thermal softening property, that is, a material that softens and adheres to the upper end portion of the support member 9 when held by the support component 9 may be used. At this time, support may be used instead of holding by the support member 9.
[0044]
Also, the temperature compensation type crystal oscillator has been described as an example, but it can be widely used in electronic component devices in which circuit component elements are mounted on a wiring board and further covered with a metal lid member, for example, a high-frequency module and the like. .
[0045]
【The invention's effect】
As described above, according to the present invention, the insulating resin layer is disposed between the flat surface portion of the metal lid member and the circuit component element, and the metal lid is disposed on the upper surface of the support member via the insulating resin layer. The member is held and joined to the wiring board.
[0046]
As a result, a problem that the shield case is inclined during joining does not occur. Further, since it becomes possible to approach the electronic component as much as possible, it is possible to further reduce the height. Further, since the external impact applied to the metal lid member is difficult to apply to the circuit component element, the bonding state of the circuit component element is stable, and the electronic component device as a whole has excellent impact resistance.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an electronic component device according to the present invention.
FIG. 2 is a side view of the electronic component device of the present invention.
FIG. 3 is an exploded perspective view of another electronic component device of the present invention.
FIG. 4 is a side view of another electronic component device of the present invention.
FIG. 5 is a side view of a conventional electronic component device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Wiring board 2, 3 ... Circuit component element 4, 5 ... Ground electrode 6 ... Metal cover member 7 ... Joint leg part 8 ... Insulating resin layer 9 ..Support members

Claims (6)

A wiring board on which a surface wiring pattern is formed, and on which a circuit component element forming a predetermined circuit network is mounted;
An electronic component device comprising: a metal lid member joined to the wiring board so as to cover the circuit component element;
An insulating resin layer is disposed on the inner surface of the ceiling flat portion of the metal lid member, and the metal lid member is held by the support member erected on the wiring board via the insulating resin layer. Electronic component device characterized by the above-mentioned. 2. The electronic component device according to claim 1, wherein the support member is mounted at a substantially central portion on the wiring board. 2. The electronic component device according to claim 1, wherein a plurality of the support members are mounted at symmetrical positions on the wiring board. 4. The electronic component device according to claim 3, wherein one of the plurality of support members is a circuit component element forming a predetermined circuit. A joining leg extending from the peripheral portion of the metal lid member toward the wiring board is joined via solder to a terminal electrode of a ground electrode attached to the surface of the wiring board. The electronic component device according to claim 1, wherein: 6. The method of manufacturing an electronic component device according to claim 5, wherein the metal cover member is attached to the wiring board through the following steps 1 to 3.
Step 1: Prepare a metal lid member having an uncured insulating resin applied to the inner surface of the ceiling flat portion, and a wiring board on which circuit component elements and support members are attached and mounted on the upper surface. Process.
Step 2: applying cream solder on a terminal electrode of a ground electrode provided on the wiring board, attaching the cream solder to a joining leg of the metal lid member, and applying the cream solder to the uncured state. A step of placing the metal lid member on the column member such that the insulating resin is in contact with the upper surface of the column member.
Step 3: applying heat to the cream solder and the uncured insulating resin to fix the metal lid member and the support member via the insulating resin, Attaching the metal lid member to the wiring board by soldering the terminal electrode of the ground electrode to the terminal electrode.

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