JP2004087694A - Electric connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric connector wherein a heat sink is unnecessary to be made large and the consumption power of an electronic device can be suppressed. <P>SOLUTION: The connector is provided with an insulation substrate 20 interposed between a circuit board 1 and a semiconductor package 10, and a plurality of conductive contacts 22 that are placed side by side on the insulation substrate 20 and are penetrated and held thereon and are in contact with the electrodes 11 of the circuit board 1 and the semiconductor package 10. Each of the conductive contacts 22 is made nearly hexagonal, octagonal or like a abacus-bead by using a conductive elastomer 30, and its thermal conductivity is set to 1.5-3.5W/m°C. The conductive contact 22 demonstrates electric connector function and heat radiation function, thereby conveying a heat of the semiconductor package 10 to the circuit board 1, so that it becomes unnecessary to make a heat sink large or increase the volume of feed air for the heat sink. <P>COPYRIGHT: (C)2004,JPO

Description

【００３６】
実施例１の電気コネクタと比較例１の電気コネクタに関し、ヒータ表面温度を測定して図１５のグラフにまとめた。このグラフからも明らかなように、実施例１の電気コネクタを使用した場合には、ヒータ表面温度の温度上昇が少なく、良好な放熱効果を得ることができた。
【００３７】
【発明の効果】
以上のように本発明によれば、ヒートシンクを大型化する必要がなく、しかも、電子機器の消費電力を抑制することができるという効果がある。
【図面の簡単な説明】
【図１】本発明に係る電気コネクタの実施形態を示す説明図である。
【図２】本発明に係る電気コネクタの実施形態を示す斜視説明図である。
【図３】本発明に係る電気コネクタの実施形態における導電接点素子を示す模式断面説明図である。
【図４】本発明に係る電気コネクタの実施形態における絶縁基板に貫通孔を設け、絶縁基板上に導電エラストマーを重ねて金型にセットした状態を示す模式断面説明図である。
【図５】図４の金型を型締めして成形する状態を示す模式断面説明図である。
【図６】図５の金型を型開きして電気コネクタを取り出す状態を示す模式断面説明図である。
【図７】本発明に係る電気コネクタの第２の実施形態を示す模式断面説明図である。
【図８】本発明に係る電気コネクタの第３の実施形態を示す模式断面説明図である。
【図９】本発明に係る電気コネクタの第４の実施形態を示す模式断面説明図である。
【図１０】本発明に係る電気コネクタの第５の実施形態を示す模式断面説明図である。
【図１１】本発明に係る電気コネクタの第６の実施形態を示す模式断面説明図である。
【図１２】本発明に係る電気コネクタの第７の実施形態を示す模式断面説明図である。
【図１３】本発明に係る電気コネクタの実施例を示す全体説明図である。
【図１４】図１３の電気コネクタの導電接点素子を示す模式断面説明図である。
【図１５】本発明に係る電気コネクタの実施例におけるヒータ表面温度と時間の関係を示すグラフである。
【符号の説明】
１　　　　　回路基板（電気接合物）
１０　　　　半導体パッケージ（電気接合物）
２０　　　　絶縁基板
２１　　　　貫通孔
２２　　　　導電接点素子
２３　　　　円錐台（錐台）
２３Ａ　　　円錐台の拡径部の径（錐台の拡幅部の幅）
２３Ｈ　　　一対の円錐台間の高さ（一対の錐台間の長さ）
２３Ｍ　　　円錐台の縮径部の径（錐台の縮幅部の幅）
２４　　　　貫通接続部
２４Ａ　　　貫通接続部の径（貫通接続部の幅）
３０　　　　導電性エラストマー[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrical connector for electrically connecting various electrical and electronic components such as a circuit board and a semiconductor package.
[0002]
[Prior art]
2. Description of the Related Art As disclosed in, for example, US Pat. No. 6,348,659B1, a conventional electrical connector includes an insulating substrate interposed between a circuit board and a semiconductor package, and a penetrating support provided side by side with the insulating substrate. And a plurality of conductive contact elements in contact with the electrodes. As disclosed in the above publication, each conductive contact element is formed into a truncated cone, barrel, column, substantially octagonal cross section, or the like using conductive rubber.
[0003]
[Problems to be solved by the invention]
By the way, when a semiconductor element having large power consumption and heat generation is used, the performance of the semiconductor element is adversely affected unless some heat radiation member is provided. In particular, when the semiconductor element of the semiconductor package generates heat and is used at a temperature exceeding 70 ° C., the semiconductor element may malfunction or break down.
Therefore, conventionally, a heat sink is directly attached to the semiconductor element, or air is blown to the heat sink to cool the semiconductor element.
[0004]
However, in recent years, the performance of semiconductor devices has been further improved, and the amount of heat generation has tended to increase further. Some types of semiconductor devices have a power consumption exceeding 10 W. To cope with this, the size of the heat sink must be increased, and a larger space must be secured. Also, increasing the amount of air blown to the heat sink often increases the power consumption of the electronic device.
[0005]
The present invention has been made in view of the above, and an object of the present invention is to provide an electrical connector that does not require a large heat sink and can suppress power consumption of an electronic device.
[0006]
[Means for Solving the Problems]
In the present invention, in order to achieve the above object, electrically connecting a plurality of electrical joints,
It is provided with a conductive contact element which is in contact with the electrode of the electric joint, and the conductive contact element is formed of a conductive elastomer and has a thermal conductivity of 1.5 to 3.5 W / m · ° C.
[0007]
Note that, between the plurality of electrical joints, an insulating substrate that penetrates and supports the conductive contact element is interposed, and the conductive contact element is connected between the pair of frustums respectively exposed from the insulating substrate and the pair of frustums. Integrally formed with a through connection portion penetrating the insulating substrate, the length between the pair of frustums is 0.5 to 2.2 mm, and the width of the widened portion of each frustum is 0.3 to 0.8 mm. At the same time, the width of the reduced width portion of each frustum is preferably set to 0.2 to 0.6 mm, and the width of the through connection portion is preferably set to 0.2 to 0.6 mm.
[0008]
Here, the electrical joint in the claims includes at least various types of circuit boards (eg, printed wiring boards, flexible boards, inspection boards, etc.), semiconductor packages (eg, BGA, LGA, etc.), electroacoustic components, and electronic components. Etc. are included. One or more conductive contact elements may be used depending on the number of electrical joints. The conductive contact element is appropriately formed into a truncated cone, a truncated pyramid, a polygonal truncated cone, a barrel, a cylinder, a substantially hexagonal cross section, a substantially octagonal cross section, a substantially oval cross section, or the like. Further, the insulating substrate does not particularly matter whether or not it has flexibility.
[0009]
According to the present invention, a plurality of electric joints can be formed by disposing an electric connector between the plurality of electric joints, electrically connecting the conductive contact elements to the electric joints, and compressing the conductive contact elements. It can be electrically connected via an electrical connector. Since the conductive contact element having good thermal conductivity exhibits a connector function and a heat radiation function, the heat of one electric joint can be transferred to the other electric joint.
[0010]
Further, according to the present invention, since one or more conductive contact elements are supported on the insulating substrate, it is possible to stabilize the posture of the conductive contact elements, facilitate positioning, and the like. Further, since the length between the pair of frustums constituting the conductive contact element is in the range of 0.5 to 2.2 mm, at least low resistance can be obtained. Further, since the width of the widened portion of the frustum is in the range of 0.3 to 0.8 mm, at least a narrow pitch can be obtained. Further, since the width of the reduced width portion is in the range of 0.2 to 0.6 mm, it is possible to stabilize the resistance at a minimum. Furthermore, since the width of the through connection portion 25 is in the range of 0.2 to 0.6 mm, a reduction in resistance can be expected.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, an electric connector according to the present embodiment includes an insulating substrate interposed between a circuit board 1 and a semiconductor package 10. 20; and a plurality of conductive contact elements 22 which are arranged side by side on the insulating substrate 20 and which are in contact with the circuit boards 1 and the electrodes 2 and 11 of the semiconductor package 10. The conductive contact elements 22 are formed of a conductive elastomer 30. Then, the thermal conductivity is set to 1.5 to 3.5 W / m · ° C.
[0012]
The circuit board 1 includes an insulating substrate made of, for example, a laminated plate, and a plurality of conductive wiring patterns and electrodes 2 are appropriately formed inside and outside the insulating substrate. As the semiconductor package 10, as shown in FIG. 1, for example, a surface mounting area array type LGA in which a plurality of electrodes 11 are arranged in a lattice pattern on the lower surface is used.
[0013]
As shown in FIG. 2, the insulating substrate 20 is formed in a flexible flat rectangular shape using a predetermined material, and a plurality of through holes 21 are regularly arranged at predetermined intervals in the XY thickness direction. Is done. Examples of the material of the insulating substrate 20 include polyimide, glass epoxy, PET, PEN, PEI, PPS, PEEK, and liquid crystal polymer. Among them, polyimide having a small coefficient of thermal expansion and excellent heat resistance is most suitable.
[0014]
As shown in FIGS. 2 and 3, each conductive contact element 22 is formed in a vertically long shape having a substantially octagonal cross section using a conductive elastomer 30, and the roundness of the upper and lower ends is removed. 20 are provided integrally with the through holes 21. The conductive elastomer 30 is made of a conductive composition in which conductive particles are mixed with a predetermined insulating elastomer. As the insulating elastomer, various elastomers having fluidity before curing and having a cross-linked structure by curing (general name of those having rubber-like elasticity at around normal temperature) are used.
[0015]
Specific examples include silicone rubber, fluorine rubber, polyurethane rubber, polybutadiene rubber, polyisopropylene rubber, chloroprene rubber, polyester rubber, styrene / butadiene copolymer rubber, and natural rubber. In addition, these closed-cell foams and the like also correspond. Among these, silicone rubber, which is excellent in electrical insulation, heat resistance, compression set, workability and the like, is most suitable.
[0016]
Examples of the conductive particles include a granular or flake type. Specifically, gold, silver, copper, platinum, palladium, nickel, aluminum and other simple metals or particles of these alloys, as well as phenolic resins, epoxy resins, silicone resins, thermoplastic resins such as urethane resins and Examples thereof include particles of a thermosetting resin, a baked product thereof, or an inorganic material such as carbon, ceramics, or silica as a nucleus and the surface of which is coated with the above metal by plating, vapor deposition, sputtering, or the like.
[0017]
As the conductive particles, granular or flake-like particles can be used alone or as a mixture. From the viewpoint of resistance and cost, the conductive particles preferably contain granular silver particles in a range of 410 to 590 parts by mass with respect to 100 parts by mass of the insulating elastomer material. In order to improve the thermal conductivity, alumina (aluminum oxide) powder or titanium oxide powder can be added in an auxiliary manner.
[0018]
As shown in FIG. 3, each conductive contact element 22 has a pair of truncated cones 23 protruding from the front and back surfaces of the insulating substrate 20, and connects between the pair of truncated cones 23 to form a through hole 21 of the insulating substrate 20. It is formed integrally with a cylindrical through connection portion 24 that penetrates. The height 23H, which is the length between the pair of upper and lower truncated cones 23, is preferably in the range of 0.5 to 2.2 mm, more preferably 0.8 to 1.2 mm. This is because, if it deviates from such a range, a low resistance may not be obtained, and the allowable compression range is taken into consideration.
[0019]
Each of the truncated cones 23 has a diameter 23A (width) of the enlarged diameter portion in the range of 0.3 to 0.8 mm, more preferably 0.7 mm, and a diameter 23M (width) of the flat reduced diameter portion. The range is 0.2 to 0.6 mm, preferably 0.5 mm. The reason why the diameter 23A of the enlarged diameter portion is in the range of 0.3 to 0.8 mm is that if it is out of this range, a narrow pitch cannot be obtained, and the bonding strength of the insulating substrate 20 and the conductive contact element 22 is taken into consideration. It is. Further, the reason why the diameter 23M of the reduced diameter portion is in the range of 0.2 to 0.6 mm is based on the reason that if the diameter is within this range, the resistance can be reduced and stabilized and a narrow pitch can be secured. Further, the diameter of the through hole 21, in other words, the diameter 24 A (width) of the through connection portion 24 is preferably 0.2 to 0.6 mm, more preferably 0.5 mm. This takes into account the reduction in resistance and the bonding strength between the insulating substrate 20 and the conductive contact element 22.
[0020]
Further, the thermal conductivity of each conductive contact element 22 is preferably in the range of 1.5 to 3.5 W / m · ° C. This is because when the thermal conductivity is less than 1.5 W / m · ° C., the thermal conductivity is not sufficient, and the semiconductor element may generate heat at 70 ° C. or more, causing the semiconductor element to malfunction or fail. This is because there is a risk of doing so. Conversely, when the thermal conductivity exceeds 3.5 W / m · ° C., there is no problem in the thermal conductivity, but the conductive particles must be highly filled, and the plasticity of the conductive composition increases. This is because workability deteriorates. In addition, the hardness of the cured product increases, the load increases, and the cost increases due to the high filling of the conductive particles.
[0021]
In the case of manufacturing such an electrical connector, first, a plurality of through holes 21 are formed in the insulating substrate 20, and a conductive elastomer 30 made of conductive silicone rubber is superimposed on the insulating substrate 20 to form a mold 31. Set (see FIG. 4). When the preparation is completed in this way, the mold 31 is clamped and pressurized and heated (see FIG. 5) to manufacture an electrical connector in which the insulating substrate 20 and the conductive contact element 22 are integrated. When the mold is opened, the electrical connector can be taken out and used (see FIG. 6).
[0022]
In the above-described configuration, the upper and lower ends of the plurality of conductive contact elements 22 are electrically connected to the circuit board 1 and the electrodes 2 and 11 of the semiconductor package 10 by interposing an electrical connector between the circuit board 1 and the semiconductor package 10. When the plurality of conductive contact elements 22 are compressed by pressing the semiconductor package 10 downwardly by elastic contact, the circuit board 1 and the semiconductor package 10 can be electrically conductively connected via an electrical connector (see FIG. 1). ).
[0023]
According to the above configuration, since the conductive contact element 22 exhibits an electric connector function and a heat dissipation function, the heat of the semiconductor package 10 can be transferred to the circuit board 1 side. Therefore, there is no need to increase the size of the heat sink or increase the amount of air blown to the heat sink. In particular, in the case of a semiconductor device consuming power of 2.5 W or more, it is extremely significant. Further, since the peripheral edges of the upper and lower ends of the conductive contact element 22 are angular as shown in FIG. 3, the electrode contact portion increases as the end face area of the conductive contact element 22 increases, and the semiconductor package 10 and the conductive contact element 22 are separated. The contact area is not reduced. Therefore, it is possible to stabilize the initial connection and suppress an increase in the resistance value. Furthermore, since it is not necessary to expand the contact area by compressing the conductive contact element 22, a large load is not required at the time of connection.
[0024]
Next, FIG. 7 shows a second embodiment of the present invention. In this case, each conductive contact element 22 is formed into a straight, large-diameter cylindrical shape. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those of the above embodiment can be expected, and that the shape of the conductive contact element 22 can be diversified.
[0025]
Next, FIG. 8 shows a third embodiment of the present invention. In this case, each conductive contact element 22 is formed into a straight, reduced-diameter cylindrical shape. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those of the above embodiment can be expected, and that the shape of the conductive contact element 22 can be diversified.
[0026]
Next, FIG. 9 shows a fourth embodiment of the present invention. In this case, each conductive contact element 22 is basically formed into a cylindrical shape, and the upper and lower ends thereof are each bent into a hemispherical shape. To form. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those in the above embodiment can be expected, and that the shape of the conductive contact element 22 can be diversified.
[0027]
Next, FIG. 10 shows a fifth embodiment of the present invention. In this case, each conductive contact element 22 is formed in a substantially spherical shape. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those of the above embodiment can be expected, and that the degree of freedom in designing the conductive contact element 22 can be greatly improved.
[0028]
Next, FIG. 11 shows a sixth embodiment of the present invention. In this case, each conductive contact element 22 is basically formed into a cylindrical shape, and the upper and lower ends thereof are each formed into a truncated cone. I am trying to do it. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, the same operation and effect as those in the above embodiment can be expected, and the degree of freedom in designing the conductive contact element 22 can be greatly improved.
[0029]
Next, FIG. 12 shows a seventh embodiment of the present invention. In this case, each conductive contact element 22 is basically formed into a truncated conical shape, and is curved while depressing its peripheral surface. I have to. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, the same operation and effect as those in the above embodiment can be expected, and the shape of the conductive contact element 22 can be diversified.
[0030]
【Example】
The electrical connectors shown in Example 1, Example 2, Comparative Example 1, and Comparative Example 2 were respectively manufactured, and these were interposed between a circuit board and a heater equipped with a measuring thermocouple as shown in FIG. The heater surface temperature was measured and evaluated.
The electrical connector of the first embodiment is composed of an insulating substrate made of polyimide having a thickness of 0.1 mm, and 1156 conductive contact elements (34 × 34) that are penetrated and supported on the insulating substrate at a pitch of 1 mm. Each conductive contact element was formed from a conductive silicone rubber composition having a thermal conductivity of 2.6 W / m · ° C. (see FIG. 2).
[0031]
The conductive silicone rubber composition was prepared by blending 100 parts by mass of methylvinylpolysiloxane, 500 parts by mass of granular silver powder, and 0.5 part by mass of dicumyl peroxide with 100 parts by mass of these mixtures. This conductive silicone rubber composition was processed into a thickness of 6 mm, a width of 50 mm, and a length of 100 mm, and the thermal conductivity was measured with a measuring device (trade name: QTM-D3) manufactured by Kyoto Electronics Industry Co., Ltd. Also, the height between the pair of truncated cones forming each conductive contact element is 1.0 mm, the diameter of the enlarged portion of the truncated cone is 0.7 mm, and the diameter of the reduced diameter portion is 0.5 mm, The diameter of the through hole was 0.5 mm (see FIG. 14).
[0032]
Electrical connector of Example 2 Basically the same as Example 1, except that 100 parts by mass of methylvinylpolysiloxane, 550 parts by mass of granular silver powder, and 100 parts by mass of the mixture thereof were mixed with 0.5 parts of dicumyl peroxide. A conductive silicone rubber composition having a thermal conductivity of 3.1 W / m · ° C. was prepared by blending parts by mass.
Although the electrical connector of the present embodiment was able to obtain a good thermal conductivity of 3.1 W / m · ° C., the hardness of the rubber was higher than that of the electrical connector of the first embodiment due to the increase of the granular silver powder. As a result, the workability was reduced.
[0033]
Electrical connector of Comparative Example 1 Basically the same as in Example 1, except that 100 parts by mass of methylvinylpolysiloxane, 400 parts by mass of granular silver powder, and 100 parts by mass of a mixture thereof were mixed with 0.5 parts of dicumyl peroxide. A conductive silicone rubber composition having a thermal conductivity of 1.4 W / m · ° C. was prepared by blending parts by mass.
The electrical connector of this example could only obtain an insufficient thermal conductivity of 1.4 W / m · ° C., and the semiconductor element of the semiconductor package malfunctioned.
[0034]
Electrical connector of Comparative Example 2 Basically the same as in Example 1, except that 100 parts by mass of methylvinylpolysiloxane, 600 parts by mass of granular silver powder, and 100 parts by mass of these mixtures were mixed with 0.5 parts of dicumyl peroxide. A conductive silicone rubber composition having a thermal conductivity of 3.6 W / m · ° C. was prepared by blending parts by mass.
In the electrical connector of this example, although a good thermal conductivity of 3.6 W / m · ° C. was obtained, the plasticity of the conductive silicone rubber composition was increased more than necessary, and the processability was deteriorated. . Further, the rubber hardness (JIS K6253: durometer hardness type A) exceeded 80, the compressive load increased, and the circuit board was damaged.
[0035]
[Table 1]

[0036]
With respect to the electrical connector of Example 1 and the electrical connector of Comparative Example 1, the surface temperatures of the heaters were measured and summarized in the graph of FIG. As is clear from this graph, when the electrical connector of Example 1 was used, the temperature rise of the heater surface temperature was small, and a good heat radiation effect could be obtained.
[0037]
【The invention's effect】
As described above, according to the present invention, there is an effect that it is not necessary to increase the size of the heat sink and the power consumption of the electronic device can be suppressed.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing an embodiment of an electric connector according to the present invention.
FIG. 2 is a perspective explanatory view showing an embodiment of the electric connector according to the present invention.
FIG. 3 is a schematic sectional view showing a conductive contact element in the embodiment of the electrical connector according to the present invention.
FIG. 4 is a schematic cross-sectional explanatory view showing a state in which a through hole is provided in an insulating substrate, a conductive elastomer is overlaid on the insulating substrate, and set in a mold in the embodiment of the electrical connector according to the present invention.
FIG. 5 is a schematic cross-sectional explanatory view showing a state in which the mold of FIG. 4 is clamped and molded.
FIG. 6 is a schematic cross-sectional explanatory view showing a state in which the mold shown in FIG. 5 is opened to take out an electrical connector.
FIG. 7 is a schematic sectional view showing a second embodiment of the electric connector according to the present invention.
FIG. 8 is a schematic sectional view showing a third embodiment of the electric connector according to the present invention.
FIG. 9 is a schematic sectional view showing a fourth embodiment of the electrical connector according to the present invention.
FIG. 10 is a schematic sectional explanatory view showing a fifth embodiment of the electrical connector according to the present invention.
FIG. 11 is a schematic cross-sectional explanatory view showing a sixth embodiment of the electrical connector according to the present invention.
FIG. 12 is a schematic sectional view showing a seventh embodiment of the electrical connector according to the present invention.
FIG. 13 is an overall explanatory view showing an embodiment of the electric connector according to the present invention.
FIG. 14 is a schematic sectional explanatory view showing a conductive contact element of the electrical connector of FIG.
FIG. 15 is a graph showing a relationship between a heater surface temperature and time in an embodiment of the electrical connector according to the present invention.
[Explanation of symbols]
1 circuit board (electrical joint)
10. Semiconductor package (electrical joint)
Reference Signs List 20 insulating substrate 21 through hole 22 conductive contact element 23 truncated cone (frustum)
23A Diameter of the widened part of the truncated cone (width of the widened part of the frustum)
23H Height between a pair of frustums (length between a pair of frustums)
23M Diameter of reduced diameter part of truncated cone (width of reduced diameter part of frustum)
24 Through connection portion 24A Diameter of through connection portion (width of through connection portion)
30 conductive elastomer

Claims (2)

An electrical connector for electrically connecting a plurality of electrical joints,
An electric contact element which is in contact with an electrode of the electric joint, wherein the electric contact element is formed of a conductive elastomer and has a thermal conductivity of 1.5 to 3.5 W / m · ° C. connector. An insulating substrate that penetrates and supports the conductive contact element is interposed between the plurality of electrical joints,
The conductive contact element is integrally formed from a pair of frustums exposed from the insulating substrate and a through connection portion that connects the pair of frustums and penetrates the insulating substrate, and reduces the length between the pair of frustums. 0.5 to 2.2 mm, the width of the widened portion of each frustum is 0.3 to 0.8 mm, and the width of the narrowed portion of each frustum is 0.2 to 0.6 mm. The electrical connector according to claim 1, wherein the width of the portion is 0.2 to 0.6 mm.

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