CN213880389U - Antistatic circuit board - Google Patents
Antistatic circuit board Download PDFInfo
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- CN213880389U CN213880389U CN202023138203.7U CN202023138203U CN213880389U CN 213880389 U CN213880389 U CN 213880389U CN 202023138203 U CN202023138203 U CN 202023138203U CN 213880389 U CN213880389 U CN 213880389U
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- circuit board
- ground connection
- antistatic
- grounding
- rigid
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Abstract
The utility model discloses an antistatic circuit board relates to circuit board technical field. Antistatic circuit board, including the circuit board body, run through the via hole of circuit board body, and set up components and parts on the circuit board body, the circuit board body is provided with the ground connection district, the ground connection district be provided with the ground connection heat-dissipating piece that the ground connection district switched on, the ground connection district passes through the via hole with components and parts switch on and be used for with static on the components and parts is introduced on the ground connection heat-dissipating piece. The utility model discloses antistatic circuit board has good antistatic performance and good heat dispersion, and the security performance is high.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to antistatic circuit board.
Background
The circuit board is applied to various aspects of people's life nowadays, and is an indispensable important component of present electronic products, therefore each performance of circuit board is vital to the influence of electronic products.
In the using process of the circuit board, the circuit board is easy to be damaged by factors such as static electricity, high temperature and the like to lose efficacy, the service life of the circuit board is seriously influenced, and electrostatic discharge (ESD) is the main cause of damage of all electronic components or an integrated circuit system over electrical stress (EOS); if the temperature of the circuit board is too high, the heat of the circuit board cannot be discharged in time, and faults, even fire disasters, are easily caused, so that the technical problem that the antistatic performance and the heat dissipation performance of the circuit board are improved is urgently needed to be solved at present.
SUMMERY OF THE UTILITY MODEL
To the above defect that prior art exists, the utility model provides an antistatic circuit board, this antistatic circuit board have good antistatic performance and good heat dispersion.
In order to solve the technical problem, the utility model discloses a technical scheme is:
antistatic circuit board, including the circuit board body, run through the via hole of circuit board body, and set up components and parts on the circuit board body, the circuit board body is provided with the ground connection district, the ground connection district be provided with the ground connection heat-dissipating piece that the ground connection district switched on, the ground connection district passes through the via hole with components and parts switch on and be used for with static on the components and parts is introduced on the ground connection heat-dissipating piece.
The grounding heat dissipation part is arranged on the grounding area through conductive heat-conducting glue.
The circuit board body is a rigid-flex printed circuit board, and the grounding area is arranged on a rigid portion of the rigid-flex printed circuit board.
The rigid part comprises a top layer rigid core board, a part of the flexible core board and a bottom layer rigid core board which are sequentially stacked through an insulating layer, the grounding area is arranged on the bottom layer rigid core board, and the components are arranged on the top layer rigid core board.
The flexible core board comprises two layers, and the insulating layer is arranged between the two layers of the flexible core boards.
The circuit board body is a flexible circuit board, the flexible circuit board comprises two layers of flexible core boards which are stacked through insulation layers, the grounding area is arranged on one layer of the flexible core boards, and the components are arranged on the other layer of the flexible core boards.
The flexible core board corresponding to the grounding area is provided with a conductive reinforcing sheet communicated with the grounding area, and the grounding heat dissipation piece is arranged on the conductive reinforcing sheet.
The conductive reinforcing sheet is connected with the flexible core board and the grounding heat dissipation member through conductive heat-conducting glue.
Wherein, the conductive reinforcing sheet is a steel sheet or an aluminum sheet.
Wherein the resistance of the conductive reinforcing sheet is less than or equal to 3 omega.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides an antistatic circuit board, because the circuit board body is provided with the ground connection district, the ground connection district is provided with the ground connection radiating piece that switches on with the ground connection district, and the ground connection district switches on through via hole and components and parts, and consequently, static on the components and parts can be through via hole, ground connection district and ground connection radiating piece and draw into the ground, reaches antistatic purpose, and the heat on the circuit board body can be in time distribute away through the ground connection radiating piece simultaneously, reaches radiating purpose, compares with prior art, the utility model discloses antistatic circuit board has good antistatic performance and good heat dispersion, and the security performance is high.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of an antistatic circuit board of the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of the antistatic circuit board of the present invention;
in the figure: a-a rigid part, b-a flexible part, 11-a top layer rigid core board, 12-a flexible core board, 13-a bottom layer rigid core board, 14-an insulating layer, 15-a via hole, 16-an electric conduction heat conduction adhesive, 17-a grounding heat sink, 18-a component, 21-a flexible core board, 22-an insulating layer, 23-a via hole, 24-an electric conduction heat conduction adhesive, 25-an electric conduction reinforcing sheet, 26-a grounding heat sink and 27-a component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
The first embodiment is as follows:
as shown in fig. 1, the antistatic circuit board includes a circuit board body, a via hole 15 penetrating through the circuit board body, and a component 18 disposed on the circuit board body, wherein the circuit board body is provided with a grounding area (printed by a copper foil on the circuit board body, not shown in the figure), the grounding area is provided with a grounding heat sink 17 conducted with the grounding area, and the grounding area is conducted with the component 18 through the via hole 15 and is used for introducing static electricity on the component 18 into the grounding heat sink 17.
The circuit board body in this embodiment is the rigid-flex printed circuit board, and the rigid-flex printed circuit board includes flexible portion b and sets up two rigidity portion a at flexible portion b both ends, and the ground connection district sets up on one of them rigidity portion a of rigid-flex printed circuit board.
Specifically, the rigid portion a includes a top rigid core 11, a portion of the flexible core 12, and a bottom rigid core 13 stacked in this order through an insulating layer 14, the ground region is disposed on the bottom rigid core 13, and the component 18 is disposed on the top rigid core 11.
In order to improve the electric and thermal conduction effects, the grounding heat sink 17 is preferably disposed on the bottom layer rigid core 13 through the conductive thermal paste 16 in this embodiment.
In order to improve the electric conduction and heat dissipation effects, the material of the ground heat sink 17 in the present embodiment is preferably aluminum or copper.
To increase the flexibility of design, the flexible core 12 in this embodiment is provided in two layers with an insulating layer 14 disposed between the two layers of flexible core 12.
During the use, static on the components and parts 18 can be through via hole 15, ground connection district and ground connection heat sink 17 drainage income ground, reaches antistatic purpose, and the heat on the circuit board body can be through the timely effluvium that distributes out of ground connection heat sink 17 simultaneously, reaches radiating purpose.
Example two:
as shown in fig. 2, the antistatic circuit board includes a circuit board body, a via hole 23 penetrating through the circuit board body, and a component 27 disposed on the circuit board body, wherein the circuit board body is provided with a grounding area (printed by a copper foil on the circuit board body, not shown in the figure), the grounding area is provided with a grounding heat sink 26 conducted with the grounding area, and the grounding area is conducted with the component 26 through the via hole 23 and is used for introducing static electricity on the component 27 into the grounding heat sink 26.
The circuit board body in this embodiment is a flexible circuit board, the flexible circuit board includes two layers of flexible core boards 21 stacked through an insulating layer 22, a ground region is disposed on one layer of the flexible core board 21, and a component 27 is disposed on the other layer of the flexible core board 21.
In order to enhance the strength of the flexible printed circuit board, in the present embodiment, a conductive reinforcing sheet 25 is disposed on the flexible core board 21 corresponding to the grounding region, and the grounding heat sink 26 is disposed on the conductive reinforcing sheet 25.
In order to enhance the electric and thermal conduction effects, the electric conduction reinforcing sheet 25 is preferably connected to the flexible core board 21 and the grounding heat sink 26 through the electric conduction heat-conduction glue 24 in this embodiment.
In order to further improve the conductive and heat-conducting effects, in the embodiment, the conductive reinforcing sheet 25 is preferably a steel sheet or an aluminum sheet, and the resistance of the conductive reinforcing sheet 25 is less than or equal to 3 Ω.
During the use, static on the components and parts 27 can be through via hole 23, ground connection district and grounding heat dissipation piece 26 drainage income ground, reaches antistatic purpose, and the heat on the circuit board body can be through timely the distributing away of grounding heat dissipation piece 26 simultaneously, reaches radiating purpose.
Known by embodiment one and embodiment two, the utility model discloses antistatic circuit board has good antistatic performance and heat dispersion, and the security performance is high, can ensure antistatic circuit board and use the electronic product safe operation of this antistatic circuit board.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without the labor of creation from the above conception, which falls within the protection scope of the present invention.
Claims (10)
1. Antistatic circuit board, including the circuit board body, run through the via hole of circuit board body, and set up components and parts on the circuit board body, its characterized in that, the circuit board body is provided with the ground connection district, the ground connection district be provided with the ground connection heat-sink that the ground connection district switched on, the ground connection district passes through the via hole with components and parts switch on and be used for with static on the components and parts is introduced on the ground connection heat-sink.
2. The antistatic circuit board of claim 1, wherein the grounding heat sink is disposed on the grounding area by an electrically conductive and thermally conductive adhesive.
3. The antistatic circuit board of claim 2 wherein the circuit board body is a flex-rigid board and the grounding region is disposed on a rigid portion of the flex-rigid board.
4. The antistatic circuit board of claim 3, wherein the rigid portion comprises a top rigid core board, a portion of a flexible core board and a bottom rigid core board sequentially stacked via an insulating layer, the grounding region is disposed on the bottom rigid core board, and the component is disposed on the top rigid core board.
5. The antistatic circuit board of claim 4, wherein the flexible core comprises two layers with the insulating layer disposed therebetween.
6. The antistatic circuit board of claim 1, wherein the circuit board body is a flexible circuit board comprising two layers of flexible core boards stacked by an insulating layer, the grounding region is provided on one of the flexible core boards, and the component is provided on the other layer of the flexible core boards.
7. The antistatic circuit board of claim 6, wherein the flexible core board corresponding to the grounding region is provided with a conductive reinforcing sheet communicated with the grounding region, and the grounding heat dissipation member is disposed on the conductive reinforcing sheet.
8. The antistatic circuit board of claim 7, wherein the conductive reinforcing sheet is connected to the flexible core board and the grounding heat sink by a conductive heat-conducting adhesive.
9. The antistatic circuit board of claim 7, wherein the conductive reinforcing sheet is a steel sheet or an aluminum sheet.
10. The antistatic circuit board of claim 7, wherein the resistance of the conductive reinforcing sheet is less than or equal to 3 Ω.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023138203.7U CN213880389U (en) | 2020-12-22 | 2020-12-22 | Antistatic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023138203.7U CN213880389U (en) | 2020-12-22 | 2020-12-22 | Antistatic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213880389U true CN213880389U (en) | 2021-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023138203.7U Active CN213880389U (en) | 2020-12-22 | 2020-12-22 | Antistatic circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN213880389U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115209717A (en) * | 2022-07-13 | 2022-10-18 | 深圳市韬略科技有限公司 | Combined static suppressor and application method |
-
2020
- 2020-12-22 CN CN202023138203.7U patent/CN213880389U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115209717A (en) * | 2022-07-13 | 2022-10-18 | 深圳市韬略科技有限公司 | Combined static suppressor and application method |
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