JP2004087693A - Method for manufacturing electrolytic capacitor, method for manufacturing solid electrolytic capacitor built-in wiring board, and device for manufacturing the solid electrolyte capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid electrolytic capacitor, a method for manufacturing a solid electrolytic capacitor built-in wiring board, and a device for manufacturing the solid electrolytic capacitor by which productivity can be greatly improved by enabling easily and simultaneously handling of a plurality of electrode foils. <P>SOLUTION: When manufacturing the solid electrolytic capacitor, a part 20 forming a capacitor is cut into a plural connecting shapes at an end 21 of one side of an electrode foil 2, and a holding hole 71 is formed along the end of one side thereof. Then, a projection 81 for holding a holder 8 is engaged with the holding hole 71, and a following step is conducted in a state where the electrode foil 2 is fitted in the holder 8. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a solid electrolytic capacitor, a method for manufacturing a wiring board with a built-in solid electrolytic capacitor, and an apparatus for manufacturing a solid electrolytic capacitor. More specifically, the present invention relates to a technique for handling an element for a solid electrolytic capacitor.
[0002]
[Prior art]
In order to manufacture an aluminum solid electrolytic capacitor, for example, as disclosed in Japanese Patent Application Laid-Open No. 9-36003, etching and anodic oxidation are performed on a predetermined region of an electrode foil cut out into individual capacitor element sizes. Then, a solid electrolyte layer is formed on the surface of the anodic oxide film, and thereafter, a cathode conductive layer is formed on the solid electrolyte layer.
[0003]
[Problems to be solved by the invention]
However, selectively performing etching or anodic oxidation on predetermined regions of the electrode foil cut into individual sizes is a very laborious operation. In particular, when a foil-like electrode body is used, it is difficult to maintain its shape and posture. For this reason, the conventional manufacturing method has a problem that productivity is low and cost cannot be reduced.
[0004]
Therefore, if it is possible to use an electrode foil that has been subjected to etching or anodic oxidation in a wide state, productivity can be improved. However, even in such a manufacturing method, anodic oxidation of a cut portion and formation of a solid electrolyte can be achieved. Steps such as above are performed after cutting into individual sizes, so that the effect of improving productivity is small.
[0005]
Therefore, an object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor capable of greatly improving productivity by enabling a plurality of electrode foils to be collectively and easily handled, and a solid electrolytic capacitor built-in type. An object of the present invention is to provide a method for manufacturing a wiring board and an apparatus for manufacturing a solid electrolytic capacitor.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, in the present invention, at least, a solid electrolyte layer forming step of forming a solid electrolyte layer on a predetermined region of the anodized electrode foil surface, a cathode conductive layer on the solid electrolyte layer Forming a conductive layer for a cathode, and forming a capacitor element on one end of the wide electrode foil before performing the solid electrolyte layer forming step. While a plurality of, while cutting into a connected shape, performing an electrode foil processing step of forming a plurality of holding holes along the one end, a holder having a plurality of holding projections fitted into the holding hole, After preparing and performing a holder mounting step of holding the electrode foil on the holder by fitting the holding projections of the holder into the holding holes, the electrode foil held in the holder is To, at least, and performs the electrode cut anodic oxidation for process of the foil and the solid electrolyte layer formation step.
[0007]
According to the present invention, a plurality of portions forming the capacitor element are cut into one end portion of the wide anodized electrode foil in a connected shape, and a holding hole is formed along the one end portion. Then, the holding projections of the holder are fitted into the holding holes, and the electrode foil is attached to the holder. Therefore, even with a thin electrode material such as an electrode foil, the anodic oxidation step and the solid electrolyte layer forming step for the cut can be performed while maintaining the predetermined shape and posture. Further, in the electrode foil held by the holder, a plurality of portions forming the capacitor element are connected to one end, and the electrode foil is capable of cutting out a large number of capacitor elements. Can be processed collectively. Therefore, the productivity of the solid electrolytic capacitor can be greatly improved.
[0008]
In the present invention, in the electrode foil processing step, after cutting the wide electrode foil to a predetermined width, a plurality of holes defining a portion to be left as a capacitor element in a longitudinal direction of the electrode foil when forming the holding hole are formed. Then, by cutting the end opposite to the one end where the holding hole is formed in the width direction of the electrode foil, a capacitor is formed with respect to the one end. It is characterized in that a plurality of portions forming elements are connected, and the electrode foil processed in this state is held by the holder in the holder mounting step. With this configuration, it is possible to easily and accurately manufacture an electrode foil having a shape in which a plurality of portions forming a capacitor element are connected to one end portion.
[0009]
In the present invention, in the electrode foil processing step, when forming the holding hole and the hole, a plurality of guide holes are formed along an end on the opposite side in the width direction of the electrode foil, and the holding hole is formed. In addition, it is preferable that the end opposite to the side where the holding hole is formed in the width direction of the electrode foil is cut while the electrode foil is driven and driven by the guide hole. With this configuration, it is possible to easily and accurately manufacture an electrode foil having a shape in which a plurality of portions forming a capacitor element are connected to one end portion.
[0010]
In the present invention, before performing the electrode foil processing step, a plurality of surfaces of the electrode foil along the longitudinal direction of the wide electrode foil, an oxide film removing step of shaving, and each of the oxide film removing steps cut in the oxide film removing step. And a step of forming an anode conductive layer in the region. With this configuration, the anode side of the solid electrolytic capacitor can be easily formed. Further, since the anode electrode layer is formed in the region where the oxide oxide film has been removed, the resistance component can be reduced as compared with the case where the anode oxide film remains.
[0011]
In the present invention, in the holder, at least the solid electrolyte layer forming step and the conductive layer forming step are performed in a state in which the holding projections are fitted in the holding holes, and a plurality of the electrode foils are stacked and held. Is preferred. With this configuration, it is possible to efficiently manufacture a solid electrolytic capacitor having a higher capacitance by laminating a plurality of electrode foils.
[0012]
In such a case, in the present invention, it is preferable that a plurality of the plurality of electrode foils are stacked and held on the holder with a gap between the electrode foils. With this configuration, even when a plurality of electrode foils are stacked, the solid electrolyte can be reliably formed on the entire surface of the electrode foil.
[0013]
In the present invention, the electrode foil is, for example, a foil made of aluminum, tantalum, niobium, zirconium, titanium, or an alloy thereof.
[0014]
Since the solid electrolytic capacitor manufactured by the method according to the present invention is extremely thin, a plurality of wiring patterns formed on a wiring board and the anode conductive layer and the cathode conductive layer of the solid electrolytic capacitor are directly connected to each other. Or by being electrically connected to each other via another conductive material, it is suitable for manufacturing a wiring board with a built-in capacitor. In addition, since the wiring board with a built-in capacitor can increase the integration of various electronic components, if it is used for small electronic devices such as mobile phones and mobile computers, the size and weight of the electronic devices can be reduced. it can.
[0015]
In the present invention, in a solid electrolytic capacitor manufacturing apparatus in which a solid electrolyte layer is formed on a predetermined region of an anodized electrode foil surface and a cathode conductive layer is formed on the solid electrolyte layer, And a slitter device for cutting the electrode foil into a predetermined width, along with one end in the width direction of the cut electrode foil, forming a holding hole into which the protrusion of the holder fits, and as a capacitor element in the longitudinal direction of the electrode foil. A punching device that forms a hole that defines a portion to be left, and a plurality of portions that cut the other end of the electrode foil and form a capacitor element with respect to the one end of the electrode foil are connected. And a cutting device for cutting into a shape.
[0016]
In the present invention, when forming the holding hole and the hole, the punching device forms a plurality of guide holes along an end on the other side in the width direction of the electrode foil. It is preferable that the electrode foil is fed and driven by the holes and the guide holes.
[0017]
In the present invention, in a solid electrolytic capacitor manufacturing apparatus in which a solid electrolyte layer is formed on a predetermined region of the anodized electrode foil surface and a cathode conductive layer is formed on the solid electrolyte layer, the wide electrode foil And a grinding device for shaving a plurality of surfaces of the electrode foil along the longitudinal direction of the electrode foil, and an anode conductive layer forming device for forming an anode conductive material in a region shaved by the grinding device.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiments of the present invention will be described in detail with reference to the drawings.
[0019]
[Basic structure of solid electrolytic capacitor]
1A and 1B are explanatory views schematically showing the basic structure of a solid electrolytic capacitor to which the present invention is applied, and the structure of a built-in capacitor type wiring board using this solid electrolytic capacitor element. It is sectional drawing which shows typically.
[0020]
1A, a solid electrolytic capacitor 1 of the present embodiment includes an anodized electrode foil 2 and an end portion of one side of the electrode foil 2 on an anodized film 9 formed on the electrode foil 2. A solid electrolyte layer 3 such as polypyrrole, ponyaniline, or polythiophene is formed on a region other than 21, and a cathode conductive layer 4 such as a silver paste is formed on the solid electrolyte layer 3. The end 21 on one side of the electrode foil 2 and the side on which the solid electrolyte layer 3 and the cathode conductive layer 4 are formed are insulated and separated by the insulating resin 6.
[0021]
The electrode foil 2 used here is an aluminum foil of about 80 μm to 200 μm that has been anodized after an etching treatment (roughening treatment). Surface treatment) and anodic oxidation are successively performed, then cut out as described later, and then the cut end is anodized. Anodization of this cut is performed except for the cut at one end 21.
[0022]
In this embodiment, at one end 21 of the electrode foil 2, after the anodic oxide film and the etching layer are removed, the anode conductive layer 5 made of copper paste or the like is formed.
[0023]
As the electrode foil 2, a foil made of tantalum, niobium, zirconium, titanium, or an alloy thereof can be used. When a tantalum foil or a niobium foil is used, the solid electrolyte layer 3 is made of a conductive polymer. The invention is not limited to this, and a solid electrolyte made of a metal oxide such as manganese dioxide or lead dioxide can be used.
[0024]
The solid electrolytic capacitor thus configured is used in the state shown in FIG. 1A as described later with reference to FIG. 1B, and further includes, for example, a cathode conductive layer 4 formed thereon. There is a case where a cathode is connected to both surfaces or one surface of a portion where the cathode is present, and an insulating resin is coated except for a connection region of the cathode. The selective coating of such an insulating resin is performed by a method of selectively applying the resin, and after the resin is applied to the entire surface of the target area, the resin is partially removed by machining such as polishing to form the cathode. Can be realized by a method of securing a connection area of As the cathode, a thin metal plate such as a copper-nickel alloy may be connected to the conductive layer with a silver paste or the like, but a metal film such as a copper-nickel alloy is formed on a predetermined region of the conductive layer via a metal mask or the like. It may be formed by sputtering.
[0025]
At one end 21 of the electrode foil 2, a thin anode is connected to both surfaces or one surface of the portion where the anode conductive layer 5 is formed, except for a connection region of the anode. Insulating resin may be coated. The selective coating of such an insulating resin is also performed by selectively applying the resin, and after applying the resin to the entire surface of the target area, partially removing the resin by machining such as polishing to form an anode. Can be realized by a method of securing a connection area of As the anode, similarly to the cathode, a thin metal plate such as a copper-nickel alloy may be connected to the conductive layer with a silver paste or the like. May be formed by sputtering.
[0026]
Since the solid electrolytic capacitor 1 configured as described above uses a foil as an electrode material, it can be manufactured to be thin. In addition, the solid electrolytic capacitor 1 of the present embodiment can be mounted in a state in which the capacitor is in close contact with a circuit board. Therefore, as shown in FIG. 1B, the wiring pattern 101 on the lower side (plus side) of the multilayer substrate is electrically connected to the anode conductive layer 5 directly or indirectly via another conductive material. If the upper (minus side) wiring pattern 102 constituting the multilayer substrate is electrically connected directly or indirectly to the cathode conductive layer 4 via another conductive material, the capacitor built-in type wiring substrate 100 can be formed. Can be manufactured.
[0027]
[Method of manufacturing solid electrolytic capacitor 1]
FIGS. 2A and 2B are an explanatory view schematically showing a state in which an oxide film removing step is performed using a grinding device in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied, and a wide view, respectively. FIG. 4 is a plan view after removing an oxide film from the electrode foil. 3 (A) and 3 (B) schematically show the state in which the anode conductive layer forming step is performed using the anode conductive layer forming apparatus in the manufacturing process of the solid electrolytic capacitor to which the present invention is applied. FIG. 3 is an explanatory view showing the above and a plan view after a conductive layer for an anode is formed on a wide electrode foil. FIGS. 4A and 4B are schematic views showing a state in which a slitter process of cutting a wide electrode foil into a predetermined width using a slitter device in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied. FIG. 3 is an explanatory diagram schematically showing a state and a plan view showing a state in which a wide electrode foil is cut into a predetermined width. 5A, 5B, and 5C are plan views of the electrode foil after being cut to a predetermined width in the manufacturing process of the solid electrolytic capacitor to which the present invention is applied, and holding holes using a punching device. FIG. 3 is a plan view of the electrode foil on which the electrodes are formed, and a plan view after cutting the side opposite to the side where the holding holes are formed in the width direction of the electrode foil. FIGS. 6A and 6B are explanatory views schematically showing a state in which the electrode foil after being cut into a predetermined shape is mounted on the holder in the manufacturing process of the solid electrolytic capacitor to which the present invention is applied, and It is explanatory drawing which shows a mode after attaching an electrode foil to a holder. FIG. 7 is an explanatory view schematically showing a state in which a plurality of holders on which electrode foils are mounted are mounted on a rack in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied.
[0028]
In manufacturing the solid electrolytic capacitor 1 of the present embodiment, as shown in FIGS. 2A and 2B, first, in the oxide film removing step, the wide width unwound from the roll by the disk-shaped file 211 of the grinding device 210. A plurality of surfaces of the electrode foil 2 are cut along the longitudinal direction of the electrode foil 2, and the anodic oxide film and the etching layer in this portion 25 are removed. At this time, shavings and the like are sucked by the suction device 212 in a region where the surface of the electrode foil 2 is shaved by a file, and the shavings are completely sucked and removed by the suction device 213 even after finishing the grinding.
[0029]
Next, as shown in FIGS. 3A and 3B, in the anode conductive layer forming step, each part 25 cut in the oxide film removing step is dispensed from the dispenser in the anode conductive layer forming apparatus 220. After the supplied copper paste or the like is applied by a roller 221, heat treatment is performed in a furnace 222 to form a conductive layer 5 for an anode, and thereafter, it is wound into a roll.
[0030]
Next, in the electrode foil processing step, as shown in FIG. 5C, the wide electrode foil 2 is cut into a shape in which a plurality of portions 20 forming capacitor elements are connected to one end 21 on one side. At the same time, a plurality of holding holes 71 are formed along one end 21.
[0031]
In performing such an electrode foil processing step, in the present embodiment, first, as shown in FIGS. 4A and 4B, the wide electrode foil 2 is cut into a predetermined width by the slitter device 230, and then the small width is cut. Take up on a winding roll. Next, as shown in FIG. 5A, the electrode foil 2 cut into a predetermined width as shown in FIG. 5A is punched by a punching device (not shown), as shown in FIG. A plurality of holding holes 71 are formed along the end 21 of the electrode foil 2, and a plurality of holes 72 defining the portion 20 to be left as a capacitor element in the longitudinal direction of the electrode foil 2 are formed. A plurality of guide holes 73 are formed on the opposite side. Here, it is assumed that the hole 72 partially covers the portion where the anode conductive layer 5 is formed. Next, as shown in FIG. 5C, an end portion opposite to the one end portion 21 where the holding hole 71 is formed in the width direction of the electrode foil 2 by a cutting device (not shown). By cutting 22, a plurality of portions 20 forming the capacitor element are connected to one end 21 on which the holding hole 71 is formed. At this time, the cutting device cuts the opposite end 22 of the electrode foil 2 while driving and driving the electrode foil 2 through the holding hole 71 and the guide hole 73.
[0032]
Next, in the holder mounting step, as shown in FIGS. 6A and 6B, a conductive bar made of a stainless steel bar or the like having a plurality of holding projections 81 fitted into holding holes 71 formed in the electrode foil 2. The holder 8 is prepared, and the holding projections 81 of the holder 8 are fitted into the holding holes 71 to hold the electrode foil 2 on the holder 8.
[0033]
Next, as shown in FIG. 7, a plurality of holders 8 holding the electrode foils 2 are mounted in the grooves of the frame-shaped rack 80.
[0034]
Then, in a state where the rack 80 is inverted, the capacitor element portion hanging down from the rack 80 is immersed in an anodic oxidation bath, and the cut end of this portion is subjected to an anodizing step.
[0035]
Next, a solid electrolyte layer forming step of forming the solid electrolyte layer 3 by a method such as electrolytic polymerization is performed on the surface of the anodic oxide film of the capacitor element portion hanging down from the rack 80. At this time, an insulating resin 6 (see FIG. 1) is applied to a boundary portion between the anode conductive layer 5 and a solid electrolyte layer forming step.
[0036]
Next, the capacitor element portion hanging from the rack 80 is immersed in a silver paste or the like, and then heated to form the cathode conductive layer 4 on the surface of the solid electrolyte (a cathode conductive layer forming step).
[0037]
Thereafter, the electrode foil 2 is removed from the holder 8 and the portion 20 forming the capacitor element is cut off to obtain the solid electrolytic capacitor 1 shown in FIG.
[0038]
As described above, in the present embodiment, the wide electrode foil 2 that has been anodized is cut into a shape in which a plurality of portions 20 forming the capacitor element are connected to the end 21 on one side and connected to one end. A holding hole 71 is formed along the end 21, and the holding projection 81 of the holder 8 is fitted in the holding hole 71, so that the electrode foil 2 is attached to the holder 8. Therefore, even with a thin electrode material such as the electrode foil 2, the anodic oxidation step and the solid electrolyte layer forming step for the cut can be performed while maintaining the predetermined shape and posture. Further, in the electrode foil 2 held by the holder 8, since a plurality of portions 20 forming capacitor elements are connected to one end 21 on one side, a large number of capacitor elements can be cut out. The electrode foil 2 can be processed collectively. Therefore, the productivity of the solid electrolytic capacitor 1 can be greatly improved.
[0039]
When the holding hole 71 is formed in the electrode foil processing step, a hole 72 that defines the portion 20 to be left as a capacitor element in the longitudinal direction of the electrode foil 2 is formed, and then the holding hole 71 is formed in the width direction of the electrode foil 2. By cutting the end 22 on the side opposite to the end 21 on one side, a plurality of portions 20 forming the capacitor element are connected to the end 21 on the one side. In forming the holding holes 71 and the holes 72, the capacitor element is formed in order to cut the opposite end 22 of the electrode foil 2 while feeding and driving the electrode foil 2 by the holding holes 71 and the guide holes 73. The electrode foil 2 having a plurality of connected portions 20 can be easily and accurately manufactured.
[0040]
In addition, since the surface of the wide electrode foil 2 is partially shaved and then the anode conductive layer 5 is formed thereon, the anode side of the solid electrolytic capacitor 1 can be easily formed. Further, since the anode conductive layer 5 is formed in the region where the oxide oxide film 7 has been removed, the resistance component can be reduced as compared with the case where the anode oxide film 7 remains.
[0041]
[Other embodiments]
FIGS. 8A and 8B are explanatory views schematically showing a state in which two electrode foils are mounted on a holder in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied, and manufactured by this method. It is explanatory drawing of a solid electrolytic capacitor. FIG. 9 is an explanatory view schematically showing a state in which four electrode foils are mounted on a holder in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied.
[0042]
In the above embodiment, one electrode foil 2 is attached to the holder 8. However, as shown in FIG. 8A, the holding projections 81 are provided on both the front and back of the holder 8. If the electrode foils 2 are mounted on both the front and back sides, two capacitor elements can be stacked as shown in FIG. 8B. Therefore, a solid electrolytic capacitor having a large capacitance can be manufactured only by electrically connecting the anode sides to each other by a method such as conductive paste or welding.
[0043]
Further, as shown in FIG. 9, if two or more electrode foils 2 are mounted on both the front and back of the holder 8, a solid electrolytic capacitor having a larger capacitance can be manufactured efficiently. Can be.
[0044]
Further, as shown in FIGS. 8A and 9, when a plurality of electrode foils 2 are mounted on the holder 8 in an overlapping manner, for example, a spacer is interposed between the electrode foils 2, and If a sufficient gap is secured, the solid electrolyte layer 3 can be reliably formed on the entire surface of the electrode foil 2. Here, the spacer may be removed after various processes, but when porous paper or nonwoven fabric is used as the spacer, the spacer may be left in the capacitor element without being removed.
[0045]
【The invention's effect】
As described above, in the present invention, a plurality of portions for forming the capacitor element with respect to one end of the anodized wide electrode foil are cut into a connected shape, and the one end is provided with an end. A holding hole is formed along the holding hole, and a holding projection of the holder is fitted into the holding hole, so that the electrode foil is attached to the holder. Therefore, even with a thin electrode material such as an electrode foil, the anodic oxidation step and the solid electrolyte layer forming step for the cut can be performed while maintaining the predetermined shape and posture. Further, in the electrode foil held by the holder, a plurality of portions forming the capacitor element are connected to one end, and the electrode foil is capable of cutting out a large number of capacitor elements. Can be processed collectively. Therefore, the productivity of the solid electrolytic capacitor can be greatly improved.
[Brief description of the drawings]
FIGS. 1A and 1B are explanatory views schematically showing a basic structure of a solid electrolytic capacitor to which the present invention is applied, and a capacitor-incorporated wiring board using the solid electrolytic capacitor element. It is sectional drawing which shows a structure typically.
FIGS. 2A and 2B are explanatory views schematically showing a state in which an oxide film removing step is performed using a grinding device in a solid electrolytic capacitor manufacturing process to which the present invention is applied; FIG. 4 is a plan view after removing an oxide film from a wide electrode foil.
FIGS. 3A and 3B are schematic diagrams showing a process of forming a conductive layer for an anode using a conductive layer forming device for an anode in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied. FIG. 2 is an explanatory view schematically showing the semiconductor device and a plan view after a conductive layer for an anode is formed on a wide electrode foil.
FIGS. 4A and 4B respectively show a state in which a slitter process of cutting a wide electrode foil into a predetermined width using a slitter device in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied. And a plan view showing how a wide electrode foil is cut into a predetermined width.
FIGS. 5A, 5B, and 5C are plan views of an electrode foil after being cut to a predetermined width in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied, and FIG. FIG. 3 is a plan view of an electrode foil having a holding hole and the like, and a plan view after cutting a side opposite to a side where the holding hole is formed in a width direction of the electrode foil.
FIGS. 6A and 6B are explanatory views schematically showing a state in which an electrode foil after being cut into a predetermined shape is mounted on a holder in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied. And FIG. 7 is an explanatory view showing a state after the electrode foil is mounted on the holder.
FIG. 7 is an explanatory view schematically showing a state in which a plurality of holders on which electrode foils are mounted are mounted on a rack in a process of manufacturing a solid electrolytic capacitor to which the present invention is applied.
FIGS. 8A and 8B are explanatory views schematically showing a state in which two electrode foils are mounted on a holder in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied, and FIGS. It is an explanatory view of a manufactured solid electrolytic capacitor.
FIG. 9 is an explanatory view schematically showing a state in which four electrode foils are mounted on a holder in a manufacturing process of a solid electrolytic capacitor to which the present invention is applied.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Solid electrolytic capacitor 2 Electrode foil 3 Solid electrolyte layer 4 Conductive layer for cathode 5 Conductive layer for anode 6 Insulating resin 8 Holder 9 Anodized film 20 Portion where capacitor element is formed in electrode foil 21 One side in width direction of electrode foil End portion 22 End portion 25 on the opposite side in the width direction of the electrode foil 25 Portion where anodized film and etching layer are removed 80 Rack 81 Holding projection 71 Holding hole 72 Hole 73 defining portion for forming capacitor element Guide hole

Claims (11)

A solid having at least a solid electrolyte layer forming step of forming a solid electrolyte layer on a predetermined region of the anodized electrode foil surface, and a cathode conductive layer forming step of forming a cathode conductive layer on the solid electrolyte layer In the method for manufacturing an electrolytic capacitor,
Before performing the solid electrolyte layer forming step, a plurality of portions forming the capacitor element with respect to one end of the wide electrode foil are cut into a connected shape, and along the one end. While performing the electrode foil processing step of forming a plurality of holding holes, while preparing a holder having a plurality of holding projections fitted into the holding hole,
After performing a holder mounting step of holding the electrode foil on the holder by fitting the holding projection of the holder into the holding hole,
A method for manufacturing a solid electrolytic capacitor, comprising: performing at least an anodic oxidation step and a solid electrolyte layer forming step on a cut end of the electrode foil on the electrode foil held by the holder. In claim 1, in the electrode foil processing step, after cutting the wide electrode foil to a predetermined width, a hole defining a portion to be left as a capacitor element in the longitudinal direction of the electrode foil when forming the holding hole is formed. Multiple, formed,
Next, a capacitor element is formed with respect to the one end by cutting an end opposite to the one end where the holding hole is formed in the width direction of the electrode foil. Multiple parts are connected,
A method for manufacturing a solid electrolytic capacitor, wherein the electrode foil processed in this state is held by the holder in the holder mounting step. In claim 2, in the electrode foil processing step, when forming the holding hole and the hole, a guide hole is formed on an opposite side in the width direction of the electrode foil, and the holding hole and the guide hole form the guide hole. A method for manufacturing a solid electrolytic capacitor, comprising cutting the opposite end in the width direction of the electrode foil while feeding and driving the electrode foil. 4. The oxide film removing step according to claim 2, wherein before the electrode foil processing step is performed, a plurality of surfaces of the electrode foil are cut along the longitudinal direction of the wide electrode foil, and the oxide film removing step is performed. Forming a conductive layer for an anode in each of the shaved regions. A method for manufacturing a solid electrolytic capacitor, comprising: 5. The holder according to claim 1, wherein the holding projection is fitted in the holding hole, and a plurality of the electrode foils are held in a stacked state. A method for manufacturing a solid electrolytic capacitor, comprising performing a layer forming step. 6. The method for manufacturing a solid electrolytic capacitor according to claim 5, wherein a plurality of the plurality of electrode foils are stacked and held by the holder with a gap between the electrode foils. 7. The method according to claim 1, wherein the electrode foil is a foil made of aluminum, tantalum, niobium, zirconium, titanium, or an alloy thereof. A method for manufacturing a solid electrolytic capacitor built-in type substrate incorporating a solid electrolytic capacitor manufactured by the method defined in any one of claims 1 to 7,
A plurality of wiring patterns formed on a wiring board, and the anode conductive layer and the cathode conductive layer of the solid electrolytic capacitor are electrically connected directly or through another conductive material, respectively. Of manufacturing a wiring board with a built-in solid electrolytic capacitor. A solid electrolyte layer is formed on a predetermined region of the anodized electrode foil surface, and in a solid electrolytic capacitor manufacturing apparatus in which a cathode conductive layer is formed on the solid electrolyte layer,
A slitter device for cutting the wide electrode foil into a predetermined width, and a holding hole into which a protrusion of a holder fits along one end in the width direction of the cut electrode foil; A punching device for forming a hole defining a portion to be left as a capacitor element in the direction, and a portion for cutting the other end of the electrode foil and forming the capacitor element with respect to the one end of the electrode foil. And a cutting device for cutting into a plurality of connected shapes. In claim 9, the punching device, when forming the holding hole and the hole, forms a plurality of guide holes along the other end in the width direction of the electrode foil, the cutting device, An apparatus for manufacturing a solid electrolytic capacitor, wherein the electrode foil is fed and driven by a holding hole and the guide hole. A solid electrolyte layer is formed on a predetermined region of the anodized electrode foil surface, and in a solid electrolytic capacitor manufacturing apparatus in which a cathode conductive layer is formed on the solid electrolyte layer,
A plurality of grinding surfaces for shaving the surface of the electrode foil along the longitudinal direction of the wide electrode foil, a grinding device, and an anode conductive layer forming device for forming an anode conductive material in a region shaved by the grinding device. An apparatus for manufacturing a solid electrolytic capacitor, comprising:

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