JP2004074352A - Three-dimensionally assembling device for micro-object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To three-dimensionally assemble a micro-object using a single probe in the same place to do all the work necessary for three-dimensionally disposing or processing the micro-object for catching, moving, jointing, sputtering, etc., using the probe while monitoring a micro-work range in multiple directions by means of a monitoring device simultaneously. <P>SOLUTION: This three-dimensionally assembling device for a micro-object for assembling/processing the micro-object is composed of a probe comprising material of a high fusing point, a probe attitude control system, a pulse voltage control power source for controlling through 5V-20 kV between the probe and a substrate, a work table having freedom of translation and rotation, and an intensive monitoring system to three-dimensionally monitor a micro work range on the work table by simultaneously monitoring a point in multiple directions. The three-dimensionally assembling device is provided with a function of catching the micro-object of 5 μm-1 mm by an electric field at a tip of the probe for jointing/processing the micro-object by discharge between the probe and the substrate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The invention of the present application is a method for simultaneously monitoring a small work area from multiple directions with a monitoring device and using a probe to capture, move, join, sputter, etc. This is a device that can perform three-dimensional assembly of minute objects with high accuracy using the same probe at the same place.
[0002]
[Problems of the prior art and their solutions]
The miniaturization of various appliances typified by mobile phones is largely due to the mounting technology of these small components in addition to the miniaturization of components and their high-density integration. For this reason, in the manufacture of small devices, techniques such as high-precision processing, assembly, and integration of materials and parts on the order of micrometers are required. The present invention provides a device that captures and moves micrometer-order minute objects, precisely arranges, joins, and processes them in order to meet the demand in such fields.
[0003]
As a conventional manipulation device using a probe, a gripping type micro gripper and a suction type by vacuum suction have been developed. The devices based on these methods are specialized for the operation of capturing / moving and arranging minute objects, and cannot join the minute objects to the place where they are arranged. Further, monitoring of an object is limited to display of a monocular image or individual monitoring images by a centralized monitoring device, and a three-dimensional monitoring image from which a sense of distance can be obtained is not provided.
[0004]
On the other hand, with respect to micro bonding, the surface of the bonding target is etched by a high-speed charged beam or the like in a high vacuum vessel, and the bonding surface is activated to enable diffusion bonding at room temperature. However, the device according to this method is specialized only for bonding of minute objects, and is not a device that takes into account capture, operation, and assembly.
[0005]
In addition, lithography widely used for manufacturing semiconductors and micromachines and its applied technology are basically techniques combining film formation and etching. For this reason, there are drawbacks that there are certain restrictions on usable materials, that the process is complicated, and that resources and energy are wasted.
[0006]
[MEANS FOR SOLVING THE PROBLEMS]
The invention of this application solves the above-mentioned problems. First, a probe made of a high melting point material, a probe attitude control system, a pulse voltage control power supply capable of controlling the distance between the probe and the substrate over 5 V to 20 kV, A worktable with a degree of freedom of rotation and a small object assembling and processing device consisting of a centralized monitoring system that monitors a small work area of the worktable three-dimensionally by simultaneously monitoring one point from multiple directions. A small object three-dimensional assembling apparatus having a function of capturing a minute object by an electric field at the tip of a probe and joining and processing the object by discharge between the probe and the substrate is provided.
[0007]
Secondly, the invention of this application adds a work environment control system. As a specific means, it plays a role of preventing oxidation and improving workability at the time of joining and spattering. For the purpose of a blower function to prevent re-attachment of objects, a work environment gas control device that shields a part of the probe, the minute object to be processed, and the substrate with an inert gas or an environment control gas or the like ( Claim 2) In order to satisfactorily join the minute objects, the joining portion is preliminarily heated to a predetermined temperature of 200 ° C. or less by preheating the working environment gas, an electric heater, finely focused infrared rays, or a combination thereof. And a work environment temperature control device for controlling a temperature drop rate of the portion after bonding by discharge (claim 3). That.
[0008]
Third, the invention of the present application is to realize a centralized monitoring system and, when monitoring one point from multiple directions simultaneously, to prevent optical interference generated between a plurality of monitoring devices, A small object three-dimensional assembler (claim 4) comprising a light source that emits only a specific wavelength range that does not overlap and a monitoring device that monitors through a filter that transmits only that wavelength range is provided.
[0009]
Fourthly, the invention of this application is based on the pulse voltage control power supply, wherein the discharge start condition is glow discharge, and the pulse width, pulse pause width, pulse repetition frequency, The pulse height value can be controlled independently of each other (Claim 5). A storage capacitor of the pC order is stacked in multiple stages, and a voltage boosting circuit equipped with a plurality of rows of the capacitor multistage layers is provided. And a backup capacitor layer sequence of the capacitor layer sequence in the circuit, the output polarity of which is of a bipolar type (Claim 6), and an external electrical and electrodynamic In order to avoid disturbance, a device that can always make the probe and the minute object equipotential (immediately before the operation of capturing and arranging the minute object, etc.) is provided. And it provides a fine fragment 3 dimensional assembling device.
[0010]
Fifth, the invention of this application is characterized by, for example, W, WC, WSi, MoSi, TiB2, ZrB2, and CrB2 in which the probe material characteristics satisfy a high melting point, a high strength, and a low electric resistance from the form of the probe. Of the probe and the probe of the above material (claim 8) or inevitable wear of the probe due to prolonged use including electric discharge, resulting in obtuse angle of the tip, interruption of work due to replacement of the probe, etc. (3) assembling a micro object three-dimensionally assembling a probe feeder in which the same wire diameter is wound on a reel in order to prevent the problem and to perform the operation continuously and under the same electrical conditions for a long time. An apparatus is also provided.
[0011]
According to the invention of this application, the production of a three-dimensional device is basically a build-up process, and therefore, it is possible to assemble using only a necessary amount of material.
[0012]
In addition, since the accompanying work such as capture and desorption is performed by an electrostatic method, it is easy to control regardless of the material of the minute object, and in addition, bonding and processing are performed by discharging using a probe. Together with the unification of the energy source of the capturing, joining, and processing operations to electricity, it is possible to perform continuous integrated operations such as capturing, moving, joining, and processing using the same probe.
[0013]
In addition, by performing various operations with the same probe, the process and control are simplified, and as a secondary effect of the simplification, it is possible to improve the machining accuracy of the product.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the invention of this application, since the monitoring method adopts a monitoring method based on multi-directional and simultaneous one-point concentration and performs image synthesis processing to convert the monitored image into a three-dimensional image with reality, the operator feels a sense of distance and the like. This makes it possible to create a work environment with a sense of realism, which can further prevent erroneous recognition and erroneous operation in various operation tasks. In addition, optical interference caused by simultaneous centralized monitoring from multiple directions prevents the overlapping of the wavelength range of the illumination light provided in each monitoring device and the incident light using a filter such as a dichroic mirror. Can be prevented by, for example, controlling the wavelength range.
[0015]
Since the joining and processing are performed in the air, local atmosphere control by an air curtain method, and environmental control of the atmosphere and the temperature of the portion by electric heating and focused infrared rays can be performed. Disturbance of the surveillance image due to fluctuations of the heat haze or the like resulting from this can be minimized by local heating using a spot light with a narrowed infrared ray.
[0016]
The material of the probe can be selected from, for example, W, WC, WSi, MoSi, TiB2, ZrB2, and CrB2 as a high melting point material that satisfies the high melting point, high strength, and low electric resistance characteristics.
[0017]
The pulse voltage control power supply can be an independent power supply for the capture power supply and the bonding / processing power supply.
[0018]
The workbench may have translation and rotation degrees of freedom. In this case, the rotation stage (R-axis stage) for rotating the work surface of the work table is designed so that the direction perpendicular to the work surface is the direction of rotation, and the center of the work table is the center of rotation. Is preferred.
[0019]
As a centralized monitoring system, a plurality of monitoring devices can be provided to execute monitoring with different roles.
[0020]
As a work environment control system, a work environment gas control device and a work environment temperature control device can be appropriately combined and provided.
[0021]
As a centralized monitoring system, it shall consist of a light source that emits only a specific wavelength range that does not overlap each other, and a monitoring device that monitors through a filter that transmits only that wavelength range, and when monitoring one point simultaneously from multiple directions, It is possible to prevent optical interference generated between a plurality of monitoring devices.
The pulse voltage control power supply can be of a bipolar type that can apply a voltage that makes the discharge glow and that can select the positive or negative output polarity. It is also possible to avoid external electrical and electrodynamic disturbances.
[0022]
Equipped with a probe feeder with the same wire diameter wound on a reel, which inevitably causes probe wear due to prolonged use including discharge, obtuse obtuse angle of the tip, interruption of probe replacement work, etc. This operation can be performed continuously for a long time under the same electrical conditions.
[0023]
【Example】
(Example 1)
FIG. 1 shows a basic configuration of a conceptual design of a small object three-dimensional assembling apparatus according to the present invention. With reference to the drawings, the basic functions and roles of each system according to the basic configuration will be described in detail, and the basic specifications of a specific prototyped three-dimensional assembling apparatus will be exemplified as an example. .
[0024]
The present invention is an apparatus for performing a fine work under mirror image monitoring, as shown in FIG. 1, a probe (5) serving as a tool in charge of sample capturing, joining and processing, and a probe for absorbing a mismatch of a probe posture. A probe attitude control system (1), a centralized monitoring system (2) that monitors the tip of a probe performing fine work from multiple angles, and a working environment for controlling the gas atmosphere and temperature of a part that performs fine work around the probe and its tip. A control system (7), a pulse voltage control power supply (4) for applying a voltage between the probe substrates when performing processing such as capturing, joining, and processing of raw materials with a probe, and a centralized monitoring system (2) for each processing part. A workbench (6) having a degree of freedom of translation and rotation for guiding it into the field of view, a monitor mirror image display / recording system (3) for recording each work process, and centralized control for collectively managing the systems. Composed of system (8) That.
[0025]
The function and role of each system shown in the basic configuration will be described in detail.
[0026]
The set of the centralized monitoring system (2) will be described. In the present invention, as shown in FIG. 6, all operations are performed using the same probe, and the tip is used as a reference for position information. For this reason, the centralized monitoring system (2) sets the same point to the center of the arc so that the viewpoint position is kept constant even when adjusting the depression angle of the plurality of monitoring devices with the tip as the focal position. Mounted on an arched guide. By controlling the monitoring device of the centralized monitoring system (2) and the worktable (6) in combination, it is possible to always view the work position in multiple directions as described later.
[0027]
FIG. 2 shows an example of the arrangement of the monitoring devices of the centralized monitoring system (2). The monitoring device 1 (9) shown in the figure is required to monitor the reference position, that is, to monitor the distance between the probe and the raw material and the distance between the raw material and the work table. The monitoring device 2 (10) and the monitoring device 3 (11) have a main role of monitoring for placing raw materials on a workbench. Further, even when the attitude of the raw material is changed by using the translation and rotation axes of the worktable together, the monitoring angle between the monitor and the worktable can be kept constant by adjusting the depression angle of the monitor.
[0028]
An example of the probe attitude control system (1) is shown in FIG. Here, even if a complicated and complicated work situation arises and it is necessary to change the probe posture in accordance with the work progress, the probe posture mismatch absorption function is adopted so that the probe posture can be changed while the probe tip position is fixed. It is basically equipped with a probe attitude control table (12) provided. After capturing a workpiece such as a raw material by this function, even if the posture of the probe is changed, the center of the visual field in the centralized monitoring system, in other words, the position of the probe tip which is an initial condition does not change.
[0029]
FIG. 4 shows an example of the work environment control system (7). The basic functions here are environmental temperature control, which preheats the work object before joining and machining work, gradually cools after work to avoid rapid cooling from a high temperature state caused by electric discharge, and work object during joining and machining work. Environmental gas control to prevent oxidation and nitridation of the gas.
[0030]
A work environment gas control device (7a) for guiding an inert gas or a shield gas from a work environment adjustment gas inlet (13) to a substrate (16) through a work environment adjustment gas guide (15) for environmental gas control. Prepare.
[0031]
In addition, in order to control the environmental temperature, the gas temperature is adjusted through a gas temperature controller (14), and the environmental temperature is controlled by combining a worktable temperature controller (17) and a condensing infrared ray generator (18). An environmental temperature control device (7b) is provided.
[0032]
An example of a block diagram of the pulse voltage control power supply (4) is shown in FIG.
The power supply (4) is composed of two main circuits, one is a power supply for capturing (19) and the other is a power supply for joining and processing (20). The processing (20) is independent of each other, and its output can be set independently of its voltage, current and output polarity, and its output is a power distribution system from a single terminal. The joining and processing power supply (20) applies a high voltage to generate a glow discharge so as to minimize an arc discharge. The trapping power supply (19) is for applying a voltage of about several tens of volts so as not to cause a discharge when the probe comes close to the particles and to obtain a necessary electrostatic force. Electric current flows when touching metal particles on the substrate, but in fact the contact resistance between the metal particles and the substrate and between the probe and the metal particles is quite high, and the applied voltage of the probe hardly fluctuates and the applied voltage is maintained. can do. The capturing power supply (19) has a low voltage and a low current in order to minimize the influence of unnecessary discharge when the probe approaches the particles. In addition, the power supply for joining and processing consists of a circuit that modulates a 50 Hz AC input to 50 kHz and a circuit in which pC-order capacitors and diodes are stacked in series to shorten the charge / discharge time of the step-up / rectifier. Have been. For this reason, it has the characteristic that the degree of freedom of the condition setting parameters such as the pulse width, the pulse pause width, and the pulse repetition number during the discharge can be widened. "Control 1" can set the voltage and current at the time of capture, and "Control 2" can set the voltage, current, pulse width, ON / OFF time ratio of the pulse waveform, and the number of pulses during joining and processing.
[0033]
As described above, according to the pulse voltage control power supply (4) of the present invention, (1) the initial discharge condition is a glow discharge region, and (2) the voltage is rapidly reduced. Pause and then (3) return to the state in which glow discharge can be resumed promptly from the discharge pause state. (4) At that time, the pause time, pulse width, number of discharges, etc. can be controlled by the centralized control system. The feature is that the output can be set to the ground potential in order to make the particles the same potential.
[0034]
The tip of the probe is always fixed at the initial position regardless of the posture of the probe, and in the transporting, joining, and processing operations of the raw materials, the required area on the work table is moved by moving the work table to the probe (5). ), And make necessary movement relatively to the tip of the probe. Therefore, various operations can be performed while the tip of the probe and the monitoring device of the centralized monitoring system are fixed, and the center of the field of view of the centralized management system can always be the working area. As a result, a minute object of 5 μm to 1 mm is captured by the electric field at the tip of the probe, and is joined and processed by electric discharge between the probe and the substrate.
[0035]
FIG. 6 is a schematic diagram of the entire device prototyped based on the basic structure and basic functions described above. This device is a centralized monitoring system in which a monitoring device 1 (9), a monitoring device 2 (10), and a monitoring device 3 (11) are attached to an arch guide (24) having a probe tip at the center of an arc. Is building.
[0036]
FIG. 7 illustrates the axis specifications of the stage in each system of the prototype device. The (X) (Y) (Z) (R) and (T) axis stages shown here are the axis stages shown as three-dimensional directions as the probe attitude control directions in FIG. The illustrated R-axis stage and T-axis stage as an axis for tilting the work surface of the worktable are shown.
[0037]
The movement of the stage is related to the size of the raw material to be handled, and in the operation of the probe, it is necessary to control the position of the raw material just in contact with the tip of the probe but not so much as to pierce it. According to the method described above, the translation accuracy of the translation axis of the worktable is 0.1 μm, which is one hundredth of the lower limit particles for handling, so that the probe can be sufficiently operated. The shaft specifications of the exemplified stage enabled micromachining with a raw material size of 10 μm. Further, the monitoring device 4 (25) moves the work table at any time during the mounting operation so that the raw material and the work target can be monitored from vertically above, so that the position information of the raw material and the work accuracy can be confirmed.
[0038]
The operation of the minute object three-dimensional assembling apparatus of the present invention is as follows.
[0039]
Hereinafter, a procedure of a series of fine operations at the time of capturing, transporting, and processing the minute object by the minute object three-dimensional assembling apparatus of the present invention will be described according to the process shown in FIG.
First, attach the probe to the probe attitude control system as a preparatory work before starting the work of capturing, transporting, and processing minute objects, adjust the attitude control system so that this probe is vertical, and monitor the tip of the probe centrally. Is set as the focal position, and this position is used as a reference.
First, in the centralized monitoring system, the monitoring devices 1 (9), 2 (10), and 3 (11), which mainly play the role of monitoring the joining and processing operations, are focused on one point, and Confirm that the monitoring environment where the center is concentrated on one point is maintained, and prepare the multi-view condition of the working environment. In this case, the shift between the focus and the center of the visual field is adjusted while adjusting the depression angle of the monitoring device group, and each adjustment value is stored in the control device of the central control system. Next, the focus of the monitoring device 4 (25), which plays the role of acquiring the position information of the sample and confirming the work accuracy, is adjusted. The monitoring device 4 (25) adjusts the central axis of the visual field so as to be parallel to the probe axis, and stores the information in the control device of the central control system. The raw material (21) is placed on the raw material supply table (22), and is adjusted by the raw material supply table height adjuster (23) so that the top surface of the raw material (21) is adjusted to the previously determined reference position. Similarly, the substrate is placed at a predetermined position on the worktable, the upper surface of the substrate is aligned with the reference position, and the positions of the worktable and the raw material supply table are initialized. The position information such as capturing of the sample and joining / processing are acquired by using the monitoring device 4 (25), and the information is stored in the control device of the centralized control system, and all initialization such as position and orientation is completed.
[0040]
An operation procedure in actual operations such as capturing, joining, and processing will be described. A voltage that is a sample capturing condition obtained in advance is stored as a sample capturing set value in the pulse voltage control power supply. The monitoring device 1 checks whether or not the capturing operation has been performed stably, and if the conditions are not appropriate, the controller stores the correction value at this time. The voltage and current values, the power application time, the pause time, and the number of repetitions, which are the joining and processing conditions determined in the same manner, are stored in the apparatus as set values of the power supply. Whether the set value is appropriate or not is checked using the monitoring device 1, the monitoring device 2, and the monitoring device 3, and if the setting value is not appropriate, the correction value is stored. At the same time, set values such as the required gas type, gas temperature, gas flow rate, gas injection start time, and temperature of the work environment temperature controller for the work environment control system are concentrated as additional setting requirements for joining and processing work. It is stored in the control device of the control system. With this operation, all the condition settings are completed, and thereafter, the micromachining is started.
[0041]
In other words, when the monitoring device 1 confirms that the capturing operation has been performed stably by capturing the raw material particles, the predetermined voltage and current value, the power application time, the pause time, and the The raw material is arranged at a predetermined position on the substrate while the number of repetitions is set below the set value of the power supply and the operation is confirmed, and the particle bonding and processing are performed. Thus, the creation / work of the minute object starts, and the work is completed when the creation of the minute object is completed.
[0042]
FIG. 9 and FIG. 10 show two examples of microstructures prototyped by the prototype apparatus according to the above-described embodiment in accordance with the above-described operation procedure. FIG. 9 shows an example in which Au particles having a diameter of 38 to 43 μm are vertically stacked on the Au substrate surface to form a character. In this example, a prototype was manufactured to verify whether the basic operation in the vertical direction, horizontal direction, oblique direction, arc direction, etc., and the working environment such as joining, which are indispensable for the production of minute objects, were established. The NRIM in the prototype character includes all of the above-mentioned vertical, horizontal, diagonal, and arc direction elements, and it is clear that there is no restriction on the external shape of the prototype microstructure. It is. As a result, the prototype device shown in the first embodiment has the basic configuration and basic functions shown in FIG. 1, FIG. 2, FIG. 3, FIG. It has proven that it has an object gripping function, a visual field mismatch absorption function, and an object capturing / joining / processing function.
[0043]
FIG. 10 shows an example of a particle pyramid prototype in which a base is composed of 5 × 5 and a height of 5 layers using Au particles having a diameter of 38 to 43 μm and an Au substrate. In this case, verification was performed to determine whether or not a blind spot would occur with the progress of the work such as bonding, and whether or not the bonding work could be stably performed even in a state where a plurality of small objects were adjacent to each other. In this prototype example, a quadrangle consisting of the four samples of the nearest bottom layer is bonded and fixed to the substrate surface, and the upper layer sample is bonded to a hollow formed in the center thereof, and micromachining is performed using this as a basic unit. Therefore, unlike the case where the bonding area viewed from the upper surface direction does not change as in the bonding situation in FIG. 9, the bonding area is significantly increased in the bonding between the lowest surface layer and the next layer. Nevertheless, FIG. 10 shows that stable joining is possible. Also in the micromachining example in FIG. 10 which is more advanced than in FIG. 9, it was verified that all of the basic functions were mounted on the prototype device.
[0044]
9 and 10 prove that the prototype device has all of the basic configurations and basic functions exemplified in the first embodiment.
(Example 2)
In order to demonstrate the effectiveness of the working environment control system, nickel particles having a diameter of 90 to 106 μm were assembled using a prototype three-dimensional assembling apparatus for small objects.
[0045]
First, nickel particles captured on a metal plate are arranged and joined. Further, the nickel particles captured from the raw material supply table were arranged and joined on the previously joined nickel particles. The capture voltage is 50 V, and the applied voltage at the time of bonding is 10 kV.
[0046]
When the joining was performed without controlling the atmosphere in a room temperature atmosphere without using the working environment control system, the joining could not be performed because the nickel particles were oxidized.
[0047]
Next, using a working environment gas control device, a nitrogen gas at room temperature was flowed in synchronization with the discharge, and bonding was performed in a nitrogen atmosphere. FIG. 11 shows an SEM photograph of the joint between the nickel particles in this case. As can be seen from FIG. 11, although the joints have been made, cracks indicated by arrows are recognized at the joints.
[0048]
On the other hand, FIG. 12 shows the result of joining by heating the joint to 200 ° C. in a nitrogen gas atmosphere using the working environment temperature controller. In this case, no crack was observed at the joint.
[0049]
In FIG. 12, no cracks were observed because it was thought that rapid cooling was avoided by heating the joining target portion, confirming the effectiveness of using the working environment control system.
[0050]
【The invention's effect】
As described above, according to the invention of this application, a three-dimensional device can be fabricated by using only a necessary amount of material in a build-up process.
[0051]
In addition, since the capture and desorption are performed by an electrostatic method, the control is easy regardless of the material of the minute object, and the energy source of the capture, bonding and processing is performed by performing the bonding and processing by discharging using a probe. All operations such as capturing, moving, joining, and processing are performed by applying an electric field to the probe, in conjunction with the unification of electricity. It has become possible.
[0052]
By performing various operations with the same probe, it is possible to simplify the process and control and to improve the machining accuracy of the product.
[0053]
The monitoring method adopts a monitoring method based on multi-directional and simultaneous one-point concentration and combines the mirror image and the image synthesis processing to make the monitoring image of the work object a three-dimensional image with a reality, and the worker performs the monitoring between the object and the joint site. It is possible to create a working environment with a sense of realism, which captures the distance and the like as a sense of physicality, and it is possible to enhance prevention of erroneous recognition and erroneous operation in various operation tasks.
[0054]
Optical interference derived from simultaneous centralized monitoring from multiple directions by controlling illumination wavelength that does not overlap the wavelength range and the wavelength range of incident light to the monitoring device with a filter such as a dichroic mirror Can be prevented.
[0055]
Disturbance of the monitoring image due to fluctuations of the heat haze etc. that occurs when controlling the atmosphere and temperature of the site by controlling the local atmosphere by the air curtain method, electric heating, and condensed infrared rays because the joining and processing are performed in the atmosphere. Can be minimized by local heating using a spot light in which infrared rays are narrowed down.
[0056]
Further, since the apparatus of the invention of this application is performed in the atmosphere, a special environment such as a vacuum apparatus is not required, but since the working atmosphere gas can be easily changed to an inert gas, the material is easily oxidized. Can also be applied.
[0057]
In addition, environmental control of the part to facilitate joining and processing in the atmosphere is performed by using a coaxial air curtain system with the probe as the axis center for the atmosphere control gas injection, so that the probe and the part to be processed can be controlled. This prevents deterioration of the material, such as oxidation, and provides good bonding and processing results. In addition, it is possible to prevent the occurrence of bonding cracks or the like which are likely to occur at the bonding site by controlling the temperature drop of the site by using a worktable temperature controller or local heating using a narrowly focused infrared ray.
[0058]
For the first time, by combining these developed techniques and the like, it has become possible to create a three-dimensional microstructure by an integrated operation using the same probe. For this reason, there is a possibility to replace a part of the process conventionally performed using lithography. In addition, it has become possible to partially repair existing microstructures, such as repairing fine wiring.
[0059]
The device of the invention of this application is intended for producing and correcting a three-dimensional microstructure, and can be used for practical use of a micromachine. Further, since this device is used in the atmosphere, it does not require a special environment such as a vacuum device, so that it can be easily combined with an existing processing device, and its maintenance and installation costs are low.
[Brief description of the drawings]
FIG. 1 is a basic system configuration diagram of a small object three-dimensional assembling apparatus according to the present invention.
FIG. 2 is a centralized monitoring system of the small object three-dimensional assembling apparatus according to the present invention.
FIG. 3 is a probe attitude control system of the small object three-dimensional assembling apparatus according to the present invention.
FIG. 4 is a working environment control system of the small object three-dimensional assembling apparatus according to the present invention.
FIG. 5 is a pulse voltage control power supply of the minute object three-dimensional assembling apparatus according to the present invention.
FIG. 6 is a schematic external view of a small object three-dimensional assembling apparatus according to the present invention.
FIG. 7 shows specifications of each axis stage of the minute object three-dimensional assembling apparatus according to the present invention.
FIG. 8 is a flowchart of a working process of the small object three-dimensional assembling apparatus according to the present invention.
FIG. 9 is a prototype structure 1 of the three-dimensional assembling apparatus for a minute object according to the present invention.
FIG. 10 is a prototype structure 2 of the microscopic three-dimensional assembling apparatus according to the present invention.
FIG. 11 shows an SEM photograph of a joint where nickel particles are joined under a nitrogen gas atmosphere at room temperature.
FIG. 12 shows an SEM photograph of a joint where a joining object is heated to 200 ° C. to join nickel particles in a nitrogen gas atmosphere.
[Explanation of symbols]
1 Probe attitude control system
2 Centralized monitoring system
3 Surveillance mirror image display / recording system
4 Pulse voltage control power supply
5 Probe
6 Workbench
7 Work environment control system
8 Centralized control system
9 Monitoring device 1
10 Monitoring device 2
11 Monitoring device 3
12 Probe attitude control base
13 Work environment adjustment gas inlet
14 Gas temperature controller
15 Working environment adjustment gas guide
16 substrates
17 Workbench temperature controller
18 Condensed infrared ray generator
19 Power supply for capturing
20 Power supply for joining and processing
21 Raw materials
22 Raw material supply table
23 Raw material supply table height adjustment machine
24 Arch Guide
25 Monitoring device 4

Claims (9)

A probe (5) made of a high melting point material, a probe attitude control system (1), a pulse voltage control power supply (4) capable of controlling the distance between the probe and the substrate in a range of 5 V to 20 kV, and a worktable (6) having translation and rotation degrees of freedom ), Equipped with a device for assembling and processing a minute object consisting of a centralized monitoring system (2) for monitoring a minute work area of the worktable three-dimensionally by simultaneously monitoring one point from multiple directions, and probe a minute object of 5 μm to 1 mm. A small three-dimensional assembling device that combines the function of capturing by the electric field at the tip and joining and processing by the discharge between the probe and the substrate. The apparatus for assembling and processing a micro object according to claim 1, further comprising a work environment control system (7), wherein the work environment control system (7) plays a role of preventing oxidation and improving workability during bonding and sputtering. And a work environment gas control device (7a) for shielding a part to be processed and a part of the substrate with an inert gas or an environment control gas or the like. 3. The work environment control system (7) according to claim 1, wherein the work environment control system (7) is formed by preheating a work environment gas, an electric heater, a narrowly focused infrared ray, or a combination thereof in order to bond fine objects well. A minute object (3) comprising a work environment temperature control device (7b) for preliminarily heating a part to a predetermined temperature of 200 ° C. or lower and controlling a temperature drop rate of the part after joining by discharge. Dimensional assembly device. 3. An optical system according to claim 1, wherein the centralized monitoring system includes a plurality of monitoring devices, and monitors one point from multiple directions at the same time. Small objects characterized by including a centralized monitoring system consisting of a light source that emits only a specific wavelength range that does not overlap each other and a monitoring device that monitors through a filter that transmits only that wavelength range in order to prevent mechanical interference Three-dimensional assembly device. The discharge start condition is glow discharge in the pulse voltage control power supply (4), and the pulse width, pulse pause width, pulse repetition frequency and pulse peak value of the discharge waveform are set so that the condition can be quickly recovered. A three-dimensional assembling apparatus comprising: a minute object characterized in that it can be controlled independently of each other; or a minute object equipped with a pulse voltage control power supply for a substrate. The pulse voltage control power supply (4) according to claim 5, further comprising a step-up circuit comprising a plurality of pC-order storage capacitors stacked in multiple stages and a plurality of rows of the capacitor multi-layers, and accumulating discharge power during discharging. A micro object three-dimensional assembling apparatus comprising a capacitor layer array and a backup capacitor layer array of the capacitor layer array in the circuit, and a pulse voltage control power supply having a bipolar output polarity. 7. The power supply according to claim 5, wherein a probe and a minute object are always kept at the same potential until immediately before an operation such as capturing and arranging a minute object in order to avoid external electric and electrodynamic disturbances. A three-dimensional assembling apparatus for small objects, comprising: 3. The probe (5) according to claim 1, wherein the probe (5) is made of W, WC, WSi, MoSi, TiB ₂ , ZrB ₂ , CrB whose probe material properties satisfy a high melting point, a high strength and a low electric resistance. _A three-dimensional assembling apparatus for a minute object, which is mounted as a probe made of a material such as No. ₂ . 9. The method according to claim 8, wherein the probe (5) prevents inevitable wear of the probe due to long-time use including discharge, obtuse angle of the tip, interruption of the operation due to replacement of the probe, and the like, and continues the operation for a long time. A small object three-dimensional assembling apparatus, comprising: a probe feeding device in which the same wire diameter is wound around a reel so as to be able to perform under the same electrical conditions, and a probe to be fed.

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