JP2004067369A - Method of controlling separation charge of plate-like member and separation charge control device - Google Patents

Method of controlling separation charge of plate-like member and separation charge control device Download PDF

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Publication number
JP2004067369A
JP2004067369A JP2002232976A JP2002232976A JP2004067369A JP 2004067369 A JP2004067369 A JP 2004067369A JP 2002232976 A JP2002232976 A JP 2002232976A JP 2002232976 A JP2002232976 A JP 2002232976A JP 2004067369 A JP2004067369 A JP 2004067369A
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Japan
Prior art keywords
plate
diaphragm
glass substrate
diaphragms
mounting portion
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JP2002232976A
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Japanese (ja)
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JP4359028B2 (en
Inventor
Masami Takasabu
高三 正己
Kazuhiro Suzuki
鈴木 和宏
Yoshikazu Koike
小池 義和
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Toyota Industries Corp
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Toyota Industries Corp
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Priority to JP2002232976A priority Critical patent/JP4359028B2/en
Priority to TW092121316A priority patent/TWI226867B/en
Priority to KR1020030054281A priority patent/KR100619370B1/en
Priority to CNB031580890A priority patent/CN1310810C/en
Publication of JP2004067369A publication Critical patent/JP2004067369A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a separation charge upon moving a plate-like member from a placing part. <P>SOLUTION: A plurality of conductive diaphragms 17 are provided in parallel. Each of the diaphragms 17 is formed to be a long rectangular flat plate-like shape narrower than the width of a glass substrate 12. The glass substrate 12 is jointly supportable or levitatingly maintainable by the diaphragms 17. Each of the diaphragms 17 are earthed. Upon moving the glass substrate 12 placed in a temporarily state from the diaphragms 17, the diaphragms 17 are excited to cause ultrasonic waves, and the glass substrate 12 is levitated over the diaphragms 17 with a predetermined space in between using radiation pressure of sound waves. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、板状部材の剥離帯電抑制方法及び剥離帯電抑制装置に係り、詳しくは液晶パネルのガラス基板や半導体ウエハー等の板状部材を載置台から移動させる際等において、板状部材に剥離帯電により静電気が帯電するのを抑制する板状部材の剥離帯電抑制方法及び剥離帯電抑制装置に関するものである。
【0002】
【従来の技術】
接触した2物体が離れるとき、接触界面では一度移動した電荷担体の一部はもとに戻り、表面に残留した部分が静電気となる。接触時の電荷移動は絶縁体だけでなく、導体である金属同士でも起こる普遍的現象である。従って、金属でも絶縁体で保持して接触、分離させれば帯電する。
【0003】
液晶パネルの製造工程や半導体装置の製造工程においては、ガラス基板や半導体ウエハー等の板状部材を複数の工程間で搬送する必要があり、板状部材を一時載置した載置部から移動させる際、剥離帯電が発生する。板状部材を載置部に載置しただけで移動させる場合は剥離帯電による静電気の帯電量は少ない。しかし、液晶パネルの製造工程の一工程であるラビング工程や貼り合わせ工程のように静電気の発生し易い工程では、板状部材を載置部から移動させる際、剥離帯電による帯電量が多くなり、イオナイザー等の除電装置を設ける必要があった。
【0004】
【発明が解決しようとする課題】
ところが、剥離帯電で帯電した静電気をイオナイザー等の除電装置により除去する静電気防止対策では、剥離帯電で帯電した静電気を除去あるいは中和するものであり、剥離帯電を防止あるいは抑制するものではない。剥離帯電の帯電量は、剥離速度が速くなると増加する。従って、帯電量を少なくするため、剥離速度即ち板状部材を載置部から持ち上げる速度を遅くする必要があり、タクトタイムが長くなり、生産性が低下する。
【0005】
本発明は前記従来の問題に鑑みてなされたものであって、その第1の目的は板状部材を載置部から移動させる際に剥離帯電を抑制することができる板状部材の剥離帯電抑制方法を提供することにあり、第2の目的は剥離帯電抑制装置を提供することにある。
【0006】
【課題を解決するための手段】
前記第1の目的を達成するため、請求項1に記載の発明では、一時的に載置された状態の板状部材を導体製の載置部から移動させる際に、前記載置部を励振させることによって生じる音波の放射圧を利用して前記板状部材を前記載置部から浮揚させる。
【0007】
この発明では、導体製の載置部上に一時的に載置された状態の板状部材を載置部から移動させる際、載置部が励振されることによって音波が生じ、板状部材は音波の放射圧により載置部から浮揚する。載置部からは音波が均一に発生し、板状部材が導体製の載置部から一定のギャップを保つ状態となる。その結果、剥離帯電が抑制される。また、載置部が導体製のため、アースすることが容易で、静電気防止が容易になる。
【0008】
請求項2に記載の発明では、板状部材を一時的に載置可能な載置部を、導体製の振動板を励振手段で励振させて振動板からの音波の放射圧により前記板状部材を前記振動板の表面から浮揚させる物体浮揚装置で構成するとともに、前記振動板をアースした。
【0009】
この発明では、載置部から板状部材を移動させる際は、物体浮揚装置が作動され、導体製の振動板が励振される。そして、振動板からの音波の放射圧により板状部材が振動板の表面から一定のギャップを保つ状態で浮揚する。その結果、剥離帯電が抑制される。また、載置部が導体製でアースされているため、静電気の発生の抑制が容易になる。
【0010】
請求項3に記載の発明では、請求項2に記載の発明において、前記振動板は複数設けられ、各振動板は振動板上に載置された前記板状部材を該振動板の表面から浮揚させる際、前記板状部材の撓みに対応して各振動板と板状部材との距離を一定に保つように移動可能に構成されている。
【0011】
板状部材が薄くて面積の大きなガラス基板のように撓み易い場合は、一つの振動板で板状部材を振動板から一定のギャップとなる状態で浮揚させるのは難しい。この発明では、複数設けられた各振動板がそれぞれ浮揚状態の板状部材との距離を一定に保つように移動可能に構成されているため、板状部材が撓み易い部材でも、板状部材と振動板とのギャップが一定に保持され、剥離帯電が抑制される。
【0012】
【発明の実施の形態】
(第1の実施形態)
以下、本発明を液晶パネルの製造工程に具体化した一実施の形態を図1〜図4に従って説明する。図1(a)は剥離帯電防止装置の一部省略模式斜視図を示し、(b)は一部省略模式側面図でを示す。
【0013】
図1(a)に示すように、剥離帯電防止装置11は板状部材としてのガラス基板12(鎖線で図示)を一時的に載置可能な載置部として機能する物体浮揚装置13を備えている。物体浮揚装置13は、水平に配置された支持プレート14上に設けられている。
【0014】
支持プレート14には、物体浮揚装置13を構成する振動子15が固定され、振動子15はホーン16を介して導体製の振動板17に連結されている。振動板17は複数(この実施の形態では2個)平行に配設され、各振動板17はガラス基板12の幅より狭い長尺の矩形平板状に形成され、ガラス基板12を共同で支持あるいは浮揚保持可能になっている。各振動板17はそれぞれアースされている。
【0015】
振動板17は両端部側において、振動子15により励振されるホーン16に固定されている。ホーン16は、その先端においてねじ18により振動板17に締結されている。ホーン16は扁平なほぼ直方体状に形成されるとともに、その下面に円錐台状のコーン16aが一体に固定され、振動板17に対してその長手方向端部近傍において長手方向と直交する状態で取付けられている。コーン16aはホーン16に固定される面の反対側の面において振動子15に固定されている。ホーン16の先端面は振動子15の軸方向と直交する平面に形成され、ホーン16及び振動子15の中心軸が鉛直方向に延びる状態で配置されている。なお、図1(a)と図1(b)とでは、ホーン16、コーン16aと振動子15とは大きさの比を無視して描いている。
【0016】
振動子15には所謂ランジュバン形振動子が使用され、図1(b)に示すように、一対のリング状のピエゾ素子19a,19bを備えている。両ピエゾ素子19a,19b間にリング状の電極板20が配置され、ピエゾ素子19a,19bの電極板20と当接する側と反対側の面に当接する金属ブロック21a,21bを、図示しないボルトによって締め付け固定することにより振動子15が構成されている。ボルトは金属ブロック21aに形成された図示しないねじ穴に、金属ブロック21b側から螺合されている。両金属ブロック21a,21bはボルトを介して互いに導通された状態となっている。金属ブロック21aにはフランジ22が形成され、金属ブロック21aは支持プレート14に形成された孔(図示せず)に嵌合された状態で図示しないボルトによりフランジ22において支持プレート14に固定されている。
【0017】
振動子15は発振器23に接続されている。電極板20は配線24aを介して発振器23と接続され、発振器23の接地端子が配線24bを介して金属ブロック21bに接続されている。ホーン16、コーン16a、振動子15及び発振器23により振動板17を励振させる励振手段が構成されている。なお、図1(a)では一方の振動子15に接続されている発振器23の図示を省略している。
【0018】
次に前記のように構成された装置の作用を説明する。
剥離帯電防止装置11は、ラビング工程や貼り合わせ工程等、静電気の発生し易い工程に、載置部として配設される。そして、ラビング処理や貼り合わせ処理が行われる際には、励振手段の駆動が停止され、ガラス基板12が振動板17に接触した状態で支持される。
【0019】
ガラス基板12を載置部即ち振動板17上から移動させる際には、励振手段が駆動される。即ち、発振器23が駆動されて振動子15が所定の共振周波数(例えば、20kHz前後)で励振され、ホーン16が縦振動してホーン16を介して振動板17が励振されて撓み振動を行い、定在波が発生する。そして、図2(a)に示すように、振動板17に接触状態で支持(保持)されていたガラス基板12は、振動板17から放射される音波の放射圧によって、図2(b)に示すように、振動板17の表面から浮揚する。浮揚距離は例えば100〜300μmであり、図2(b)ではガラス基板12と振動板17との距離を誇張して図示している。
【0020】
接触状態にある二つの物体を離すとき、一般に剥離帯電が発生する。ガラス基板12の場合も、手作業でガラス基板12の一端を持って振動板17から離そうとする(剥離させる)と、ガラス基板12に大きな電荷が帯電する。一方、物体浮揚装置13を作動させて振動板17からガラス基板12を剥離させた場合は、若干電位が上昇するが、その上昇量は前記手作業でガラス基板12の一端を持って振動板17から離そうとした場合の1/10近くに減少する。その状態を図3のグラフに示す。
【0021】
図3に示すように、ガラス基板12を単純に振動板17から離そうとした場合(破線で図示)は、短時間で400V近くまで電位が上昇した後、低下した。一方、超音波浮揚で剥離させた場合(実線で図示)は、若干電位は上がるが、低い電位で飽和した。この理由は明確ではないが、音波浮揚ではガラス基板12と振動板17とのギャップが一定に保持され、しかもそのギャップが小さいため、図4に示すように、ガラス基板12と振動板17とがコンデンサのように機能し、バランスするためと考えられる。
【0022】
この実施の形態では以下の効果を有する。
(1) 一時的に載置された状態の板状部材(ガラス基板12)を導体製の載置部(振動板17)から移動させる際に、振動板17を励振させて超音波を発生させ、音波の放射圧を利用してガラス基板12を振動板17から浮揚させる。従って、ガラス基板12は振動板17からの音波の作用で、振動板17から一定のギャップを保つ状態となり、剥離帯電が抑制される。
【0023】
(2) 振動板17が導体製のため、アースすることが容易で、静電気防止が容易になる。
(3) ガラス基板12は超音波の作用により、瞬時に振動板17から浮揚されるため、タクトタイムが短くなり、生産性が向上する。
【0024】
(4) 振動板17として長尺の振動板17を使用しているため、短い振動板を多数使用する構成に比較して、振動板17の数が少なくてすみ、各振動板17をアースする作業が容易となる。
【0025】
(5) 剥離帯電防止装置11を液晶パネルの製造工程のラビング工程において載置部として使用することにより、ラビング処理後にガラス基板12を載置部から移動させる際に、剥離帯電を抑制できる。
【0026】
(第2の実施形態)
次に第2の実施の形態を図5及び図6に従って説明する。この実施の形態は振動板上に載置された板状部材を該振動板の表面から浮揚させる際、板状部材の撓みに対応して各振動板と板状部材との距離を一定に保つように板状部材が移動可能に構成されている点が前記実施の形態と大きく異なっている。前記実施の形態と同様の部分については同じ符号を付してその詳細な説明を省略する。
【0027】
図5(a)は振動子15の支持状態を示す模式側面図であり、図5(b)は同じく振動板17の図示を省略した模式平面図である。また、図6(a)〜(c)は作用を説明する模式図である。
【0028】
図6(a)〜(c)に示すように、この実施の形態では、振動板17は3組設けられ、中央の振動板17は所定位置で振動され、中央の振動板17を挟んで両側に設けられた振動板17は、中央の振動板17との距離及び成す角度を調整可能とするため移動可能に設けられている。各振動板17はアースされている。
【0029】
図5(a),(b)に示すように、移動可能な振動板17を支持する振動子15は、支持プレート14上に固定された一対のガイドレール25に沿って移動可能な移動体26に固定されている。ガイドレール25は振動板17の長手方向(図5(a),(b)の紙面と垂直方向)と直交する方向に延びるように配設され、その上面がガラス基板12が浮揚状態で保持される際に撓んだ状態における曲率とほぼ同じ曲率で湾曲するように形成されている。支持プレート14のガイドレール25に挟まれた部分には、振動子15が移動体26と共に移動するのを許容する孔14aが形成されている。移動体26はガイドレール25上を転動する車輪26aを備えている。そして、移動体26は支持プレート14上に固定されたリニアアクチュエータ27のプランジャ28に連結され、リニアアクチュエータ27の駆動によりガイドレール25に沿って移動される。移動体26とプランジャ28との連結部には、移動体26のプランジャ28に対する上下方向の相対移動を許容可能な構成(例えば、ピンと長孔の組み合わせ)が採用されている。
【0030】
この実施の形態では、図6(a)に示す、ガラス基板12が振動板17と接触した状態からガラス基板12を浮揚させる際、先ず、各振動板17を励振させて図6(b)に示すようにガラス基板12を振動板17の表面から浮揚させる。ガラス基板12が大型で薄い場合は、その自重によりガラス基板12が撓んでガラス基板12と振動板17との距離が一定とならなくなる。それを回避するため、図6(b)の状態から、直ちに各リニアアクチュエータ27が駆動され、移動体26が所定の位置まで移動される。そして、図6(c)に示すように、振動子15が振動板17と共にガラス基板12の撓みに合わせてガラス基板12との距離が一定となる所定位置まで移動された状態となる。その結果、ガラス基板12に撓みが生じる場合も、ガラス基板12と振動板17との距離(ギャップ)を一定に保持でき、剥離帯電を抑制することができる。なお、図6(a)〜(c)では、支持プレート14、ガイドレール25等の図示を省略している。
【0031】
この実施の形態では前記実施の形態の(1)〜(5)と同様な効果を有する他に次の効果を有する。
(6) 一部の振動板17がガラス基板12の撓みに対応して、ガラス基板12とのギャップを一定に保つように、振動子15とともに移動可能に構成されている。従って、大型で薄く撓みが生じ易いガラス基板12に対しても、剥離帯電の抑制が良好に行われる。
【0032】
実施の形態は前記に限定されるものではなく、例えば次のように構成してもよい。
○ 物体浮揚装置13を構成する振動板17は長尺に限らず、短い振動板を使用してもよい。しかし、同じ面積のガラス基板12を支持する場合、長尺の振動板17の方が数が少なくてよく、振動板17をアースする手間が簡単になる。
【0033】
○ 振動板17の面積が大きく、板状部材が小さな場合は、必ずしも振動板17をアースしなくても、振動板17自身がアースの役割を果たす。
○ 第2の実施の形態のようにガラス基板12が薄くて大型で撓み易い場合、ガラス基板12を下に凸の状態で撓むように浮揚保持する代わりに、上に凸の状態で撓むように浮揚保持する構成としてもよい。
【0034】
○ ガラス基板12の撓みに対応してガラス基板12と振動板17とのギャップを一定に保持する構成として、移動体26をガイドレール25に沿って移動させる構成に代えて、振動子15を支持する支持部材を昇降手段で昇降可能とし、支持部材に振動子15を傾動可能に設けてもよい。この場合も、昇降と傾動とを組み合わせることにより、ガラス基板12と振動板17とのギャップを所定の値に調整できる。
【0035】
○ 振動板17をアースする際、地面に直接配線を介して接続する方法に限らず、支持プレート14あるいは剥離帯電防止装置11のフレームを導体製とし、それらを介して接地してもよい。
【0036】
○ 板状部材はガラス基板12に限らず、他の物体、例えば半導体ウエハーであってもよい。
○ 長尺の振動板17を支持するホーン16の幅は振動板17の幅と同じでなくてもよく、振動板17の幅より広くても、狭くてもよいが、振動板17の幅以上が好ましい。また、短い振動板あるいは正方形等の振動板を支持する場合、ホーンを円柱状あるいは円錐台状としてもよい。
【0037】
○ 振動板17のホーン16への固定はねじによる締結に限らず、接着剤を使用したり、ロウ付けや溶接で固着してもよい。
○ 振動子15はランジュバン形振動子に限らず他の振動子を使用してもよい。
【0038】
前記実施の形態から把握される発明(技術的思想)について以下に記載する。
(1) 請求項1に記載の発明において、前記載置部はアースされている。
(2) 請求項1〜請求項3及び前記技術的思想(1)のいずれかに記載の発明において、前記振動板は長尺に形成されている。
【0039】
(3) 請求項1〜請求項3及び前記技術的思想(1),(2)のいずれかに記載の発明において、前記板状部材はガラス基板である。
(4) 請求項3に記載の発明において、前記振動板を支持する振動子が、昇降手段で昇降可能な支持部材に傾動可能に支持され、支持部材の昇降と振動子の傾動とを組み合わせることにより、板状部材と振動板とのギャップを所定の値に調整可能に構成されている。
【0040】
(5) 請求項1〜請求項3のいずれかに記載の発明の剥離帯電抑制装置を載置部として使用し、ガラス基板にラビング処理を行った後、ガラス基板を音波で浮揚させて載置部から移動させるラビング処理方法。
【0041】
【発明の効果】
以上、詳述したように、請求項1〜請求項3に記載の発明によれば、板状部材を載置部から移動させる際に剥離帯電を抑制することができる。
【図面の簡単な説明】
【図1】(a)は第1の実施の形態の剥離帯電抑制装置の模式斜視図、(b)は一部省略模式側面図。
【図2】(a)はガラス基板が振動板上に載置された状態の模式図、(b)はガラス基板が浮揚した状態の模式図。
【図3】ガラス基板を剥離する際の時間と電位の関係を示すグラフ。
【図4】作用を説明する模式図。
【図5】(a)は第2の実施の形態の要部模式側面図、(b)は要部模式平面図。
【図6】(a)〜(c)は同じく作用を説明する模式側面図。
【符号の説明】
12…板状部材としてのガラス基板、13…物体浮揚装置、15…励振手段を構成する振動子、16…同じくホーン、16a…同じくコーン、23…同じく発振器、17…載置部としての振動板。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for suppressing peeling charge of a plate-like member, and more particularly, to a method of removing a plate-like member such as a glass substrate of a liquid crystal panel or a semiconductor wafer from a mounting table. The present invention relates to a method and a device for suppressing peeling charge of a plate-like member, which suppresses electrostatic charging due to charging.
[0002]
[Prior art]
When the two objects come into contact with each other, at the contact interface, a part of the charge carrier that has moved once returns to its original position, and the part remaining on the surface becomes static electricity. Charge transfer at the time of contact is a universal phenomenon that occurs not only in insulators but also in metals that are conductors. Therefore, even if a metal is held by an insulator and contacted or separated, it is charged.
[0003]
In a liquid crystal panel manufacturing process or a semiconductor device manufacturing process, it is necessary to transport a plate-shaped member such as a glass substrate or a semiconductor wafer between a plurality of processes, and move the plate-shaped member from a mounting portion on which the plate-shaped member is temporarily mounted. In this case, peeling charging occurs. When the plate member is moved simply by being placed on the placement portion, the amount of electrostatic charge due to peeling charge is small. However, in a process in which static electricity is likely to be generated, such as a rubbing process or a bonding process, which is one of the liquid crystal panel manufacturing processes, when the plate member is moved from the mounting portion, the amount of charge due to peeling charging increases, It was necessary to provide a static eliminator such as an ionizer.
[0004]
[Problems to be solved by the invention]
However, in the antistatic measures for removing static electricity charged by the peeling charge using a static eliminator such as an ionizer, the static electricity charged by the peeling charge is removed or neutralized, but the peeling charge is not prevented or suppressed. The charge amount of the peeling charge increases as the peeling speed increases. Therefore, in order to reduce the charge amount, it is necessary to reduce the peeling speed, that is, the speed at which the plate-like member is lifted from the mounting portion, so that the tact time is lengthened and the productivity is reduced.
[0005]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and a first object of the present invention is to suppress peeling charge of a plate-like member when the plate-like member is moved from a mounting portion. It is an object of the present invention to provide a method, and a second object of the present invention is to provide an apparatus for suppressing peeling charge.
[0006]
[Means for Solving the Problems]
In order to achieve the first object, according to the first aspect of the present invention, when the plate member temporarily placed is moved from the conductor-made placing portion, the placing portion is excited. The plate-like member is levitated from the placement section by utilizing the radiation pressure of the sound wave generated by this.
[0007]
In the present invention, when the plate-shaped member temporarily placed on the conductor-made mounting portion is moved from the mounting portion, sound waves are generated by exciting the mounting portion, and the plate-shaped member is It floats from the receiver due to the radiation pressure of the sound waves. Sound waves are uniformly generated from the mounting portion, and the plate-like member is in a state of maintaining a constant gap from the mounting portion made of a conductor. As a result, peeling charging is suppressed. In addition, since the mounting portion is made of a conductor, grounding is easy, and static electricity is easily prevented.
[0008]
According to the second aspect of the present invention, the mounting portion on which the plate-shaped member can be temporarily mounted is excited by a vibrating plate made of a conductor by exciting means, and the plate-shaped member is radiated by a sound pressure from the vibration plate. Was constituted by an object levitation device for floating from the surface of the diaphragm, and the diaphragm was grounded.
[0009]
According to the present invention, when the plate-shaped member is moved from the mounting portion, the object levitation device is operated, and the diaphragm made of a conductor is excited. Then, the plate-like member floats while maintaining a constant gap from the surface of the diaphragm by the radiation pressure of the sound wave from the diaphragm. As a result, peeling charging is suppressed. Further, since the mounting portion is made of a conductor and grounded, it is easy to suppress the generation of static electricity.
[0010]
According to a third aspect of the present invention, in the second aspect of the invention, a plurality of the diaphragms are provided, and each diaphragm lifts the plate-like member placed on the diaphragm from the surface of the diaphragm. At this time, it is configured to be movable so as to keep the distance between each diaphragm and the plate member constant in accordance with the bending of the plate member.
[0011]
When the plate-like member is easily bent like a thin glass substrate having a large area, it is difficult to levitate the plate-like member with a certain gap from the diaphragm with one diaphragm. In the present invention, since each of the plurality of diaphragms is configured to be movable so as to maintain a constant distance from the plate member in the floating state, even a member in which the plate member is easily bent, The gap with the diaphragm is kept constant, and peeling charging is suppressed.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
An embodiment in which the present invention is embodied in a manufacturing process of a liquid crystal panel will be described below with reference to FIGS. FIG. 1A is a schematic perspective view of a partly omitted antistatic device, and FIG. 1B is a schematic side view of a partly omitted antistatic device.
[0013]
As shown in FIG. 1A, the peeling and charging prevention device 11 includes an object levitation device 13 functioning as a mounting portion on which a glass substrate 12 (shown by a chain line) as a plate-like member can be temporarily mounted. I have. The object levitation device 13 is provided on a horizontally disposed support plate 14.
[0014]
A vibrator 15 constituting the object levitation device 13 is fixed to the support plate 14, and the vibrator 15 is connected to a conductive diaphragm 17 via a horn 16. A plurality of (two in this embodiment) diaphragms 17 are arranged in parallel, and each of the diaphragms 17 is formed in a long rectangular flat plate shape narrower than the width of the glass substrate 12 and supports or supports the glass substrate 12 together. It can be levitated and held. Each diaphragm 17 is grounded.
[0015]
The vibrating plate 17 is fixed to the horn 16 excited by the vibrator 15 at both ends. Horn 16 is fastened to diaphragm 17 by screws 18 at its tip. The horn 16 is formed in a flat, substantially rectangular parallelepiped shape, and a frusto-conical cone 16a is integrally fixed to the lower surface thereof, and is attached to the diaphragm 17 in the vicinity of its longitudinal end in a state orthogonal to the longitudinal direction. Have been. The cone 16 a is fixed to the vibrator 15 on the surface opposite to the surface fixed to the horn 16. The tip surface of the horn 16 is formed in a plane orthogonal to the axial direction of the vibrator 15, and the horn 16 and the central axis of the vibrator 15 are arranged in a state of extending in the vertical direction. 1 (a) and 1 (b), the horn 16, the cone 16a and the vibrator 15 are drawn ignoring the size ratio.
[0016]
As the vibrator 15, a so-called Langevin type vibrator is used, and includes a pair of ring-shaped piezo elements 19a and 19b as shown in FIG. A ring-shaped electrode plate 20 is disposed between the piezo elements 19a and 19b, and the metal blocks 21a and 21b that are in contact with the surfaces of the piezo elements 19a and 19b that are opposite to the side that contacts the electrode plate 20 are bolted by bolts (not shown). The vibrator 15 is configured by tightening and fixing. The bolt is screwed into a screw hole (not shown) formed in the metal block 21a from the metal block 21b side. Both metal blocks 21a and 21b are in a state where they are electrically connected to each other via bolts. A flange 22 is formed in the metal block 21a, and the metal block 21a is fixed to the support plate 14 at the flange 22 by bolts (not shown) in a state fitted in holes (not shown) formed in the support plate 14. .
[0017]
The vibrator 15 is connected to the oscillator 23. The electrode plate 20 is connected to the oscillator 23 via the wiring 24a, and the ground terminal of the oscillator 23 is connected to the metal block 21b via the wiring 24b. The horn 16, the cone 16a, the vibrator 15, and the oscillator 23 constitute an exciting unit for exciting the diaphragm 17. In FIG. 1A, the illustration of the oscillator 23 connected to the one vibrator 15 is omitted.
[0018]
Next, the operation of the device configured as described above will be described.
The anti-peeling antistatic device 11 is provided as a mounting part in a process where static electricity is easily generated, such as a rubbing process or a bonding process. When the rubbing process or the bonding process is performed, the driving of the excitation unit is stopped, and the glass substrate 12 is supported in a state of being in contact with the vibration plate 17.
[0019]
When the glass substrate 12 is moved from the mounting portion, that is, above the vibration plate 17, the excitation means is driven. That is, the oscillator 23 is driven, the vibrator 15 is excited at a predetermined resonance frequency (for example, about 20 kHz), the horn 16 is longitudinally vibrated, and the diaphragm 17 is excited via the horn 16 to perform bending vibration. A standing wave is generated. Then, as shown in FIG. 2A, the glass substrate 12 supported (held) in contact with the vibration plate 17 is moved to the state shown in FIG. As shown, it floats from the surface of the diaphragm 17. The levitation distance is, for example, 100 to 300 μm, and the distance between the glass substrate 12 and the diaphragm 17 is exaggerated in FIG. 2B.
[0020]
When two objects in contact are separated from each other, peeling charging generally occurs. In the case of the glass substrate 12 as well, when one end of the glass substrate 12 is manually separated from the diaphragm 17 (peeled), a large charge is charged on the glass substrate 12. On the other hand, when the glass substrate 12 is separated from the diaphragm 17 by operating the object levitation device 13, the potential slightly increases, but the amount of the rise is manually adjusted by holding one end of the glass substrate 12 and It decreases to nearly 1/10 of the case where it is attempted to move away from the camera. The state is shown in the graph of FIG.
[0021]
As shown in FIG. 3, when the glass substrate 12 was simply separated from the diaphragm 17 (shown by a broken line), the potential rose to near 400 V in a short time and then dropped. On the other hand, when peeled off by ultrasonic levitation (shown by a solid line), the potential slightly increased, but was saturated at a low potential. Although the reason for this is not clear, the gap between the glass substrate 12 and the diaphragm 17 is kept constant in the sound wave levitation, and the gap is small, so that the glass substrate 12 and the diaphragm 17 are separated as shown in FIG. It is considered to function like a capacitor and balance.
[0022]
This embodiment has the following effects.
(1) When the plate-like member (glass substrate 12) temporarily placed is moved from the mounting portion (diaphragm 17) made of a conductor, the diaphragm 17 is excited to generate ultrasonic waves. Then, the glass substrate 12 is levitated from the vibration plate 17 using the radiation pressure of a sound wave. Therefore, the glass substrate 12 is kept in a state where a certain gap is maintained from the vibration plate 17 by the action of the sound wave from the vibration plate 17, and peeling charging is suppressed.
[0023]
(2) Since the diaphragm 17 is made of a conductor, it is easy to ground and the static electricity is easily prevented.
(3) The glass substrate 12 is instantly levitated from the diaphragm 17 by the action of ultrasonic waves, so that the tact time is shortened and the productivity is improved.
[0024]
(4) Since a long diaphragm 17 is used as the diaphragm 17, the number of the diaphragms 17 can be reduced as compared with a configuration using a large number of short diaphragms, and each diaphragm 17 is grounded. Work becomes easy.
[0025]
(5) When the glass substrate 12 is moved from the mounting portion after the rubbing process, the separation and charging can be suppressed by using the anti-peeling device 11 as the mounting portion in the rubbing step of the liquid crystal panel manufacturing process.
[0026]
(Second embodiment)
Next, a second embodiment will be described with reference to FIGS. In this embodiment, when a plate-like member placed on a diaphragm is levitated from the surface of the diaphragm, the distance between each diaphragm and the plate-like member is kept constant corresponding to the bending of the plate-like member. The point that the plate-shaped member is configured to be movable as described above is greatly different from the above-described embodiment. The same parts as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0027]
FIG. 5A is a schematic side view showing a state where the vibrator 15 is supported, and FIG. 5B is a schematic plan view in which the diaphragm 17 is not shown. FIGS. 6A to 6C are schematic diagrams illustrating the operation.
[0028]
As shown in FIGS. 6A to 6C, in this embodiment, three sets of diaphragms 17 are provided, the center diaphragm 17 is vibrated at a predetermined position, and both sides of the center diaphragm 17 are sandwiched. Is provided movably in order to make it possible to adjust the distance and the angle formed with the central diaphragm 17. Each diaphragm 17 is grounded.
[0029]
As shown in FIGS. 5A and 5B, a vibrator 15 supporting a movable diaphragm 17 is a movable body 26 movable along a pair of guide rails 25 fixed on the support plate 14. Fixed to. The guide rail 25 is disposed so as to extend in a direction orthogonal to the longitudinal direction of the diaphragm 17 (perpendicular to the plane of FIGS. 5A and 5B), and the upper surface thereof is held in a state where the glass substrate 12 floats. At the time of bending. A hole 14 a is formed in a portion of the support plate 14 sandwiched between the guide rails 25 to allow the vibrator 15 to move together with the moving body 26. The moving body 26 includes wheels 26 a that roll on the guide rail 25. The moving body 26 is connected to a plunger 28 of a linear actuator 27 fixed on the support plate 14, and is moved along the guide rail 25 by driving the linear actuator 27. The connection between the moving body 26 and the plunger 28 employs a configuration (for example, a combination of a pin and a long hole) that allows the moving body 26 to move vertically relative to the plunger 28.
[0030]
In this embodiment, when the glass substrate 12 is levitated from the state in which the glass substrate 12 is in contact with the vibration plate 17 as shown in FIG. 6A, first, each vibration plate 17 is excited and FIG. As shown, the glass substrate 12 is levitated from the surface of the diaphragm 17. When the glass substrate 12 is large and thin, the glass substrate 12 bends due to its own weight, and the distance between the glass substrate 12 and the diaphragm 17 becomes inconsistent. To avoid this, each linear actuator 27 is immediately driven from the state of FIG. 6B, and the moving body 26 is moved to a predetermined position. Then, as shown in FIG. 6C, the vibrator 15 is moved together with the vibration plate 17 to a predetermined position where the distance from the glass substrate 12 is constant in accordance with the bending of the glass substrate 12. As a result, even when the glass substrate 12 bends, the distance (gap) between the glass substrate 12 and the diaphragm 17 can be kept constant, and peeling charging can be suppressed. 6A to 6C, illustration of the support plate 14, the guide rail 25, and the like is omitted.
[0031]
This embodiment has the following effects in addition to the same effects as (1) to (5) of the above embodiment.
(6) A part of the vibrating plate 17 is configured to be movable together with the vibrator 15 so as to keep the gap with the glass substrate 12 constant in response to the bending of the glass substrate 12. Accordingly, even in the case of the glass substrate 12 which is large and thin and is likely to bend, peeling charge is effectively suppressed.
[0032]
The embodiment is not limited to the above, and may be configured as follows, for example.
The diaphragm 17 constituting the object levitation device 13 is not limited to a long one, and a short diaphragm may be used. However, when supporting the glass substrate 12 having the same area, the number of the long diaphragms 17 may be smaller, and the trouble of grounding the diaphragm 17 is simplified.
[0033]
In the case where the area of the diaphragm 17 is large and the plate-like member is small, the diaphragm 17 itself plays a role of grounding without necessarily grounding the diaphragm 17.
In the case where the glass substrate 12 is thin and large and easily bendable as in the second embodiment, the glass substrate 12 is levitated and held in an upwardly convex state instead of being levitated and held in a downwardly convex state. It is good also as a structure which performs.
[0034]
In order to keep the gap between the glass substrate 12 and the vibration plate 17 constant according to the bending of the glass substrate 12, the vibrator 15 is supported instead of moving the moving body 26 along the guide rail 25. The supporting member to be moved may be moved up and down by elevating means, and the vibrator 15 may be provided on the supporting member so as to be tiltable. Also in this case, the gap between the glass substrate 12 and the diaphragm 17 can be adjusted to a predetermined value by combining the elevation and the tilt.
[0035]
When the diaphragm 17 is grounded, it is not limited to a method in which the diaphragm 17 is directly connected to the ground via a wiring, but the support plate 14 or the frame of the antistatic device 11 may be made of a conductor and grounded through these.
[0036]
The plate member is not limited to the glass substrate 12, but may be another object, for example, a semiconductor wafer.
The width of the horn 16 supporting the long diaphragm 17 may not be the same as the width of the diaphragm 17 and may be wider or narrower than the width of the diaphragm 17, but is not less than the width of the diaphragm 17. Is preferred. When supporting a short diaphragm or a diaphragm such as a square, the horn may have a columnar or truncated cone shape.
[0037]
The fixing of the diaphragm 17 to the horn 16 is not limited to the fastening with screws, but may be performed by using an adhesive, or by using brazing or welding.
The vibrator 15 is not limited to the Langevin type vibrator, and another vibrator may be used.
[0038]
The invention (technical idea) grasped from the embodiment will be described below.
(1) In the first aspect of the invention, the mounting portion is grounded.
(2) In the invention according to any one of claims 1 to 3 and the technical idea (1), the diaphragm is formed to be long.
[0039]
(3) In the invention described in any one of claims 1 to 3 and the technical ideas (1) and (2), the plate member is a glass substrate.
(4) In the invention according to claim 3, the vibrator supporting the vibration plate is tiltably supported by a vertically movable supporting member by a lifting / lowering means, and a combination of the lifting and lowering of the supporting member and the tilting of the vibrator is combined. Thereby, the gap between the plate member and the diaphragm can be adjusted to a predetermined value.
[0040]
(5) The rubbing treatment is performed on the glass substrate using the peeling and charging suppressing device according to any one of claims 1 to 3 as a mounting portion, and then the glass substrate is levitated by a sound wave and mounted. Rubbing treatment method to move from the part.
[0041]
【The invention's effect】
As described above in detail, according to the first to third aspects of the present invention, peeling charging can be suppressed when the plate member is moved from the mounting portion.
[Brief description of the drawings]
FIG. 1A is a schematic perspective view of a peeling electrification suppressing device according to a first embodiment, and FIG. 1B is a schematic side view partially omitted.
FIG. 2A is a schematic diagram illustrating a state in which a glass substrate is placed on a diaphragm, and FIG. 2B is a schematic diagram illustrating a state in which the glass substrate floats.
FIG. 3 is a graph showing the relationship between time and potential when a glass substrate is separated.
FIG. 4 is a schematic diagram illustrating an operation.
FIG. 5A is a schematic side view of a main part of the second embodiment, and FIG. 5B is a schematic plan view of a main part.
6 (a) to 6 (c) are schematic side views for explaining the operation.
[Explanation of symbols]
12: a glass substrate as a plate-like member, 13: an object levitation device, 15: a vibrator constituting excitation means, 16: a horn, 16a: a cone, 23: an oscillator, 17: a diaphragm as a mounting portion .

Claims (3)

一時的に載置された状態の板状部材を導体製の載置部から移動させる際に、前記載置部を励振させることによって生じる音波の放射圧を利用して前記板状部材を前記載置部から浮揚させる板状部材の剥離帯電抑制方法。When moving the plate member temporarily placed from the mounting portion made of a conductor, the plate member is moved by utilizing a radiation pressure of a sound wave generated by exciting the mounting portion. A method for suppressing peeling electrification of a plate-like member floated from a mounting portion. 板状部材を一時的に載置可能な載置部を、導体製の振動板を励振手段で励振させて振動板からの音波の放射圧により前記板状部材を前記振動板の表面から浮揚させる物体浮揚装置で構成するとともに、前記振動板をアースした剥離帯電抑制装置。A mounting portion on which the plate-like member can be temporarily placed is excited by a vibration plate made of a conductor by an exciting unit, and the plate-like member is levitated from the surface of the vibration plate by radiation pressure of sound waves from the vibration plate. A peeling electrification suppressing device which comprises an object levitation device and grounds the diaphragm. 前記振動板は複数設けられ、各振動板は振動板上に載置された前記板状部材を該振動板の表面から浮揚させる際、前記板状部材の撓みに対応して各振動板と板状部材との距離を一定に保つように移動可能に構成されている請求項2に記載の剥離帯電抑制装置。A plurality of the diaphragms are provided, and each of the diaphragms corresponds to a deflection of the plate-like member when the plate-like member placed on the diaphragm floats from the surface of the diaphragm. The peeling electrification suppressing device according to claim 2, wherein the device is configured to be movable so as to keep a distance from the shape member constant.
JP2002232976A 2002-08-09 2002-08-09 Peeling suppression device Expired - Fee Related JP4359028B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002232976A JP4359028B2 (en) 2002-08-09 2002-08-09 Peeling suppression device
TW092121316A TWI226867B (en) 2002-08-09 2003-08-05 Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member
KR1020030054281A KR100619370B1 (en) 2002-08-09 2003-08-06 Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member
CNB031580890A CN1310810C (en) 2002-08-09 2003-08-07 Electricity discharge and goods taking, stripping charge suppressing method and device, goods taking and receiving device

Applications Claiming Priority (1)

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JP2002232976A JP4359028B2 (en) 2002-08-09 2002-08-09 Peeling suppression device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102946725A (en) * 2010-04-14 2013-02-27 艾利丹尼森公司 Methods for increasing effectiveness of antimicrobial agents in polymeric films

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102946725A (en) * 2010-04-14 2013-02-27 艾利丹尼森公司 Methods for increasing effectiveness of antimicrobial agents in polymeric films

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